TW201139510A - Polyester resin, and optical materials, films and image display devices using the same - Google Patents

Abstract

A polyester resin containing a structure represented by Formula (1) and a structure represented by Formula (2): wherein R11 to R14 and R21 to R26 represent a hydrogen atom or a substituent; R15 to R18 represent a substituent; and at least one of R21 to R26 represents a substituent.

Description

201139510 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a resin excellent in hot melt forming properties and excellent in transparency. In addition, it also relates to an optical material using a polyester resin and a film which has a suitable glass transition temperature, is easy to be cast and has a small expansion coefficient, and relates to the use of the film to display a shadow. [Prior Art] Since the inorganic glass material is transparent and They are widely used as heat-resistant phases and have small optical anisotropy. However, they have the disadvantage that they are difficult to mold, and their specific gravity is brittle, and therefore, the molded glass product is quite heavy and broken. In recent years, due to these shortcomings, there have been many studies on the development of resin materials for replacing inorganic glass materials. In terms of resin materials used to replace inorganic glass materials, such as polymethyl methacrylate, polycarbonate, and poly(p-butyl phthalate), these resins have recently been used in various kinds due to their light weight, excellent mechanical properties, and processability. Applications, such as lenses and films Over the years, display substrates have attempted to convert from glass to a resin substrate that is capable of loading ITO (indium tin oxide). Resin provides various advantages such as weight reduction, shock resistance and the like. In order to replace the glass with a resin substrate, it is necessary to have heat resistance (about 150 ° C to 25 ° C). In addition, when the base heat-sensitive resin is simultaneously produced, particularly when the resin is loaded with an IT0-like polyester film, the device of the special linear thermal image is excellent, and the transparent material has a large and easy-progressively known case of the diester. Wait. Excellent, because of the resin, especially because the plate is reduced and thickened. It is removed after the addition. 201139510 Fire When it is expected, the resin has a low linear thermal expansion coefficient from the viewpoint of dimensional stability. On the other hand, when a resin material is used for a film application, it is desirable that the production mode of the melt casting can be very fat-filled. The heat resistance is improved too much, and it is necessary for melting. In addition, even the production cost of heating when the temperature is within the range of melting can be suppressed. Therefore, there is a strong resin which has a suitable glass transition temperature (hereinafter Tg) so that it can be melted at an actual temperature to require a high production cost required for heating. In addition, the resin material must be high when it is used for optical materials. In order to satisfy both heat resistance and low linear thermal expansion coefficient, a film having a low linear thermal expansion coefficient and a polyallyl ester structural resin of an aromatic diol (especially especially biphenol) can be obtained (refer to JP-A 2007-254663) . This document also contains biphenol (which has a phenyl group) and is used as an aromatic diol for polyallyl ester. This document also shows the different properties of phenol and bisphenol in the [〇 〇 〇 6 ] paragraph, and the nature of biphenol. However, JP-A No. 2007-254663 discloses only a solution casting method using a film in which a resin is dissolved in a solvent and liquid-cast. Further, this document discloses only one embodiment which uses a film formed at the 2-position and 2'-position of biphenol to be formed by a process. If the tree has a high temperature, there is a desire to use it, and it will be referred to as casting, and no, transparency is also required. Various bisphenols have been described using the dicarboxylic acid, which has a description and its manifestation. It is hard to produce polyester and performs a dissipative function, the substituent of the double 201139510 phenol and a biphenyl hydrazine as an aromatic diol component. That is to say, there is no resin which is obtained by two or more biphenyl hydrazine methods having substituents at different positions. · On the other hand, documents other than JP-A 2007-254663 disclose resins with polyallyl ester structure of biphenol and dicarboxylic acid, but they have not checked the linear thermal expansion coefficient and the properties of casting (see, ' JP-A 10-017658 and JP-A 58-180525). JP-A 10-0 discloses a resin having improved electrical properties and solubility stability in a solvent obtained by combining a biphenol and an aromatic bisphenol. Specifically, it discloses an example of a resin which will have, for example, 3,3,-dimethyl, 3,3,5,5,-tetramethyl 2,2',3,3',5, respectively. A substituted form of 4'-hexamethyl, 4,4'-biphenol is obtained by combining. JP-A 58-180525 discloses a resin having improved heat resistance and hydrolysis resistance which is obtained by combining a biphenol and a bisphenol of one or two aromatic diols. Specifically, it discloses an example in which the resin is obtained by combining 4,4 biphenol having a formula such as 3,3,5,5,-tetramethyl group with bisphenol. However, the same manner as in JP-A 2007-254663, JP-A 10-017658, and 58·1 8 05 2 5 does not involve the use of two or different biphenols having different substituent positions. The inventors examined whether the tree disclosed in the above three patent documents can satisfy the required function. However, the resin described in JP-A 20〇7-2 54663, from the viewpoint of production cost, cannot be sufficiently documented to have a specific base such as 7 6 5 8 and a diol and a bisphenol degree and It is the meaning of the resin on the JP-A resin. 201139510 That is to say, the resin described in JP-Α 2〇〇7_254663, the film obtained by using the resin can satisfy the heat resistance and the reduced linear thermal expansion coefficient to some extent, but is implemented in the document. The polyester resin described in the examples has a high Tg and is unsatisfactory from the viewpoint of performing casting. As a result of examination by the inventors of the resin containing a biphenyl having a specific structure as described in JP-A 10-017658, it is known that a resin does have a good solubility in a solvent, but its linear thermal expansion coefficient is too high, so that In the method of laminating and annealing it with ITO or the like, the dimensional stability of the polyester resin film is broken, and thus the function of the obtained image display device is deteriorated. The inventors of the present invention have examined the results of the resin containing a biphenyl having a specific structure as described in JP-A 58-180525, and it is known that the resin has a coefficient of linear thermal expansion that is too high, so that it is laminated and annealed with ITO or the like. Among them, the dimensional stability of the polyester resin film is broken, and thus the function of the obtained image display device is deteriorated. SUMMARY OF THE INVENTION The present inventors have studied how to obtain a resin that satisfies all of the above-mentioned required characteristics. That is, it is an object of the present invention to provide a polyester resin which has a suitable glass transition temperature for effective melt casting, has a low coefficient of linear thermal expansion, and has good transparency; and an optical component and film using the resin. Further, there is an item for providing an image display device using the film. 201139510 DETAILED DESCRIPTION OF THE INVENTION The inventors have worked hard to focus on the synthesis of 4,4'-bisphenol having a substituent at least at the 3,3',5,5'-position and the introduction of a plurality of bisphenol units. As a result, it was found that the linear thermal expansion coefficient can be lowered and the Tg falls near the upper limit at which the casting can be performed. The inventors examined the combined use of 4,4'-bisphenol having a substituent at least at the 3,3',5,5'-position and 4,4'-bisphenol having a substituent at another position. At the same time, we assume that the combination of two or more copolymerized components having different structures results in a decrease in the interaction between molecules and an increase in the coefficient of linear thermal expansion. However, 'surprisingly, it has been found that the coefficient of linear thermal expansion is lowered. Namely, as compared with the case where each bisphenol was used alone, we found that the above combination drastically lowered the linear thermal expansion coefficient while adjusting the Tg within a range capable of melt casting, thus completing the present invention. That is, the inventors have found that the above object can be attained by the following means. [1] A polyester resin comprising a structure represented by the following formula (1) and a structure represented by the following formula (2):

R*I6 ^12 Rl4 Rl8 wherein R11 to R14 each independently represent a hydrogen atom or a substituent, and R15 to R18 each independently represent a substituent; 201139510

〇— (2) wherein R21 to R26 each independently represent a hydrogen atom or a substituent at least one of R21 to R26 represents a substituent. [2] A polyester resin according to the formula, wherein Ris to Ris in the formula (1) are each independently a halogen atom, an alkyl group, an aryl group or an alkoxy group. [3] A polyester resin such as [], wherein each of Ris to Ris in the formula (1) has 1 to 4 carbon atoms independently of a fluorine atom, a chlorine atom, a bromine atom, a phenyl group or a phenyl group. Oxygen. [4] The polyester resin of any one of [!] to m, wherein each of R21 to R26 in the formula (2) is independently a hydrogen atom, a halogen atom, an alkyl group, an aryl group or an alkoxy group. [5] The polyester resin according to any one of [3], wherein R21 to R in the formula (2) are each independently a hydrogen atom, a fluorine atom, a bromine atom, a chlorine atom, and have 1 to 4 An alkyl group, a phenyl group or a methoxy group of a carbon atom. [6] The polyester resin according to any one of [1] to [5], which comprises the structure represented by the following formula (3):

Wherein R to R3 8 each independently represent a hydrogen atom or a substituent, and X generation 201139510 represents a linker 'which may have a substituent or a part of a ring structure' and in this case may be combined with R31 to R 3 4 At least one bond to form a ring structure. [7] The polyester resin according to [6], which satisfies the following formula (A): 0.2 < (a + b) / (a + b + c) < 0.9 (A) wherein a represents a formula (1) The content ratio of the structure in the polyester resin (unit: mol%); b represents the content ratio of the structure in the polyester resin (unit: mol%); and c represents the formula (3) ) The ratio of the structure of the representative in the polyester resin (unit: mol. /.). [8] The polyester resin of any one of [~] to [7], which contains a structure represented by the following formula (4)' (4)

Wherein R41 each independently represents a substituent; and m represents an integer from 〇 to 3. [9] The polyester resin according to any one of [1] to [8], which has a structure represented by the following formula (5): Formula (5) (R51)n

n and k each wherein R51 and R·52 each independently represent a substituent; and -10-201139510 represents an integer from 〇 to 3. [10] The polyester resin according to any one of [1] to [9], wherein 270 〇C. [11] An optical material produced by any one of [1] to [l〇]. [12] A film of the film [10] to [1], wherein the film has a linear thermal expansion coefficient of 4 Å or less. [14] A film such as [12] or [13], in which a gas barrier layer is provided. [15] A film such as [I2] to Π4] which provides a transparent conductive [16] image display device using [12] to [15] to a film. According to the present invention, it is possible to provide a polyester resin which has an effective melt-casting glass transition temperature, a low linear thermal expansion and a good transparency, and a film display device using the film and optical member. Further, the thin layer of the present invention has sufficient heat resistance when the substrate is heated to be heated (especially when ITO is loaded). Further, the polyester resin of the present invention is quite excellent in terms of modulus' and can be advantageously used for an optical element, such as a display device. [Embodiment] Mode for carrying out the invention The following is a production of a ppm/K or layer of the polyester resin, the film, and the polyester resin of the present invention from 1 to 70 °C. A lesser one is suitable for the coefficient and the transparent film and shadow display device made of the same ester resin. -11- 201139510 For further details. The constituent elements described below will be explained on the basis of representative embodiments of the present invention, but the present invention is not limited to these examples. Meanwhile, in the present patent application, the numerical ranges expressed by ''to'' represent the numbers before (to the lower limit) and after (the upper limit 値) respectively. Polyester Resin The polyester resin of the present invention (hereinafter also referred to as "the resin of the present invention") is characterized by comprising a structure represented by the following formula (1) and a structure represented by the formula (2).

Wherein R11 to R14 each independently represent a hydrogen atom or a substituent, and R15 to R18 each independently represent a substituent,

Wherein R21 to R26 each independently represent a hydrogen atom or a substituent; and at least one of R21 to R26 represents a substituent. The structure represented by the above formula (1) and the structure represented by the above formula (2) can simultaneously satisfy the melt casting characteristics, the low linear thermal expansion coefficient and the transparency of the resin of the present invention. The resin of the present invention is a polyester resin and, in the resin of the present invention, -12-

201139510, the main chain contains a polyester bond. That is, in addition to the structure derived from the aromatic (that is, the structure represented by the above formula (1) and the above formula (2)), the resin has a derivative derived from a polyvalent carboxylic acid (preferably a dicarboxylic acid). Structure, and such a structure is linked by an ester bond. The relationship between the structure and work of the resin of the present invention will be described starting from the formula (1), and other structures preferably contained in the present invention will be described in order. Structure of the aromatic diol (structure represented by the formula (1)) Formula (1) (1) In the formula (1), R11 to R14 each independently represent a hydrogen proguanyl group; and R15 to R1 8 each independently represent a substituent. In the above formula (1), the preferred substituent represented by 'R15 to R18' includes an alkyl group (preferably having 1 to 1 unit carbon atoms such as methyl group, ethionyl group and tertiary butyl group), a halogen atom (e.g., a chlorine atom, a bromine atom, and an iodine 'aryl group (preferably having 6 to 20 carbon atoms such as a phenyl group, a 3-naphthyl group), an alkoxy group (preferably having 1 to 10 carbon atoms) , such as bow, ethoxy and isopropoxy), fluorenyl (preferably having 2 to 10 {[sub, such as ethyl, propyl and butyl) a guanamine group (preferably, | to 1 碳, such as a carbamide group and an acetamino group), a nitro group, a group, and a group formed by combining these groups. - or: take: package; heteroatoms) ί and 1 oxime carbogen: 1 L group, -13- 201139510 R15 to R18 is more preferably an alkyl group, a halogen atom, an aryl group, an alkoxy group , cyano or nitro is particularly preferably a halogen atom, an alkyl group, an aryl group or an alkoxy group, more preferably a fluorine atom, a chlorine atom, a bromine atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group or Methoxy, and most preferably a fluorine atom, a chlorine atom, a methyl group, an ethyl group, a phenyl group or a methoxy group. A methyl group is a preferable choice from the viewpoints of satisfying the solubility in an organic solvent, adjusting the Tg to a range in which equilibrium casting characteristics and heat resistance can be produced, a linear thermal expansion coefficient, and transparency. R15 to R18 may be different substituents each independently of each other, or all of them are the same substituent, and all of R15 to R18 are preferably the same substituent from the viewpoint of enhancing Tg. In the above formula (1), R11 to Ri4 each independently represent a hydrogen atom or a substituent. Preferred examples of the substituent represented by R11 to Rl4 are the same as the preferred substituent of R1S to Rif!. R11 to R14 are more preferably a hydrogen atom, an alkyl group, a halogen atom, an aryl group, an alkoxy group, a cyano group or a nitro group, particularly preferably a hydrogen atom, a halogen atom or an alkyl group, more preferably a hydrogen atom 'a fluorine atom, Chlorine atom or methyl group. R11 is preferably a hydrogen atom or a methyl group from the viewpoints of satisfying the solubility in the organic solvent and adjusting the Tg to all conditions such as the linear thermal expansion coefficient and the transparency in a range in which equilibrium casting characteristics and heat resistance can be produced. In the above formula (1), when! When at least one of ^1 to Rl4 is an alkyl group, preferably two of them are an alkane group (preferably a methyl group) and the remaining two are hydrogen atoms. In this case, the positions of the two substituents Preferred are R11 and R14, or R12 and R13. On the other hand, when at least one of Rii to R!4 is a -14-201139510 halogen atom, it is preferred that all of the halogen atoms are the same (preferably a fluorine atom or a chlorine atom). The specific examples of the formula (1) are shown below, but the structure of the formula (1) which can be used in the present invention is not limited thereto.

(Structure represented by the formula (2)) The polyester resin of the present invention contains a structure represented by the formula (2).

(2) wherein R21 to R26 each independently represent a hydrogen atom or a substituent ', and at least one of R21 to R26 represents a substituent. -15-201139510 Preferred examples of the substituent represented by R21 to R26 are the same as those of the preferred substituent represented by R1 to R18 in the above formula (1). R21 to R26 are more preferably a hydrogen atom, an alkyl group, a halogen atom, an aryl group, a decyloxy group, a cyano group or a nitro group, particularly preferably a hydrogen atom, a crypto atom, a aryl group, an aryl group or an alkoxy group. Preferred is a hydrogen atom, a fluorine atom, a bromine atom, a chlorine atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group or a methoxy group, and most preferably a hydrogen atom 'methyl group or a phenyl group. In the above formula (2), at least two substituents are preferred in the scales 2! to R26, and the remaining four are hydrogen atoms. In this case, the positions of the two substituents are preferably R2] and R24, or r25 and r26. The following shows a specific example of the structure represented by the formula (2), and the structure of the formula (2) which can be used in the present invention is not limited thereto. -16 - 201139510

2-10 2-11

2-13

2-14

One

(Structure represented by the formula (3)) The resin of the present invention may be contained in addition to the bisphenol derived from the structure represented by the above formula (1) and the structure represented by the above formula (2) in terms of the structure derived from the aromatic diol. A structure derived from another aromatic diol. In the resin which can be contained in the resin of the present invention and derived from other aromatic-furnace structures, a structure derived from bisphenol can be used, and the resin of the present invention preferably contains a structure represented by the following formula (3). Polyester -17- 201139510

In the formula (3), 'R31 to R3' each independently represent a hydrogen atom or a substituent. X represents a linking group which may have a substituent or a part of the ring structure' and in this case may be bonded to at least one of R3 1 to R34 to form a ring structure. The polyester resin of the present invention has a linear structure represented by the above formulas (1) and (2) from the viewpoint of satisfying both the casting property and the low linear thermal expansion coefficient, and the improvement of the tensile property (especially the elongation at break). In addition to the components, a structure represented by the above formula (3) is preferred. In the formula (3), preferred examples of R31 to R38 include a hydrogen atom, an alkyl group (preferably having 1 to 10 carbon atoms such as a methyl group, an ethyl group, an isopropyl group and a tertiary butyl group), a halogen atom (such as a chlorine atom, a bromine atom, and an iodine atom), an aryl group (preferably having 6 to 2 carbon atoms such as a phenyl group, a biphenyl group, and a naphthyl group), an alkoxy group (preferably having 1) Up to 10 carbon atoms, such as methoxy, ethoxy and isopropoxy), fluorenyl (preferably having 2 to 10 carbon atoms, such as ethyl, propyl and butyl), decyl (preferably having 1 to 10 carbon atoms such as formamidine and ethenyl), a nitro group, a cyano group and the like. More preferably, it is a hydrogen atom, an alkyl group, a halogen atom, an aryl group, an alkoxy group and a nitro group, and particularly preferably a hydrogen atom, a hospital group and a halogen atom. • In formula (3), X represents a divalent linking group. Examples of X include -18 - 201139510, a subfamily, a subfamily, a perfluoroadenyl group, an oxygen atom 'sulfur atom, a ketone group, a fluorenyl group, -NR'- (R' is a hydrogen atom or has 1 to 6 a carbon atom of the hospital base) and -CO-NH-. Further, X may be a part of a ring structure, which represents that X itself is a linker containing a ring or X or one or two benzenes in a benzene ring which may be bonded to both sides of X via at least one of R31 to R34 The ring forms a fused ring. Examples of the ring contained in the linker X itself include an anthracene ring, a dihydroindoledione ring, a dihydrohexadecanone ring, a pitch ring, a ring of a ring, a tetralone ring, an anthrone ring, a cyclohexane ring, and a cyclopentane. An alkane ring, an anthracene ring, a 2,3-dihydrobenzofuran ring, a porphyrin ring, a tetrahydropyran ring, a tetrahydrofuran ring, a dioxane ring or the like. Wherein X is preferably an alkylene group, an oxygen atom, a sulfur atom 'keto group, an amine group or a sulfonyl group, and particularly preferably an isopropylidene group or an oxygen atom. Further, from the viewpoint of satisfying both the casting property and the low linear thermal expansion coefficient, and the improvement of the tensile property (especially the elongation at break), the structure represented by the above formula (3) is more preferably a relatively curved structure (bendable component). That is, in the structure of the benzene ring-X-benzene ring, X itself does not contain a ring, and, in particular, the structure represented by the above formula (3) does not form a linear component (tri-phenylene linear structure) . In the formula (3), the bonding position of the two oxygen atom linking groups may be at any position in the benzene ring. Among them, the linkage position of the two oxygen atom linkages is preferably the 4-position and the 4' position of the benzene ring. Specific examples of the structure represented by the formula (3) will be shown below, but the structure of the formula (3) which can be used in the present invention is not limited thereto. -19- 201139510

20- 201139510

-21 - 201139510

(3-23) (3-25) CH3 (3-24)

(3-27) (3-29)

Ph

(3-26) (3-28) (3-30)

(3-31) (3-33)

(3^32) (3^34)

(3-35)

(3-36) Structure derived from divalent carboxylic acid (Structure represented by the formula (4)) In the polyester resin of the present invention, the aromatic di- and divalent carboxylic acids are preferably linked by one ester bond. The specific limitation is not set in the case of the divalent carboxylic acid. However, from the viewpoint of lowering the coefficient of linear thermal expansion, the resin of the present invention is preferably one having at least one structure represented by the following formula (4). -22- 201139510 Equation (4)

〇 - ο

Wherein R41 each independently represents a substituted S integer. The preferred substituents for the range of R41 represent the same preferred substituents. m represents an integer of 〇 to 3, preferably, particularly preferably 0. The structure derived from the other divalent carboxylic acid, in addition to the structure represented by the above formula (4), represents the structure represented by the structure and/or the following formula (6), and the structure represented by the following formula (6) (Structure represented by the formula (5)) From the viewpoint of finely adjusting the rise and the progress of the Tg, the polyester resin of the present invention is preferably contained. Formula (5) j; and m represents a lanthanide of 0 to 3 and the above R 1 1 to R 18 are 0 to 2, more preferably 0 or 1 ,, and the polyester resin of the present invention further has the following formula (5) Representing and preferably having any one of the following formula (5). - Step to improve the properties of the casting property The structure represented by the following formula (5) is

-23- 201139510 wherein R51 and R52 each independently represent a substituent; and η and k each represent an integer from 0 to 3. In the formula (5), preferred examples of R51 and R52 include an alkyl group (preferably having 1 to 1 carbon atom such as a methyl group, an ethyl group, an isopropyl group and a tertiary butyl group). For example, a chlorine atom, a bromine atom and an iodine atom), an aryl group (preferably having a fluorene to 20 carbon atoms such as a phenyl 'biphenyl group and a naphthyl group), an alkoxy group (preferably having 1 to 10 carbons) Atoms such as methoxy, ethoxy and isopropoxy), fluorenyl (preferably having 2 to 10 carbon atoms such as ethyl, propyl and butyl), decylamine (preferably It has 1 to 10 carbon atoms such as formamidine and ethenyl), nitro, cyano and the like. More preferred are an alkyl group, a halogen atom, an aryl group, an alkoxy group and a nitro group, and particularly preferred are a hospital base and a halogen atom. In the formula (5), the carbonyl group may be bonded to any carbon in the naphthalene ring, and the two fluorenyl groups may be bonded to one ring. Preferably, the connection position of the parent group is one with a 2-position or a 3-position linkage and has a linkage with the 6_position or the 7_ position, and more preferably each of the 2-positions and The 6-position bonds 〇n and k each independently represent an integer of 〇3, wherein η is preferably an integer of 〇2, and k is preferably an integer of 0-2. Specific examples of the structure represented by the formula (5) will be shown below, but the structure of the formula (5) which can be used in the present invention is not limited thereto. -24- 201139510

Cl (5-9)

(5-10) (Structure represented by the formula (6)) The polyester resin of the present invention is preferably a structure represented by the following formula (6). Formula (6)

R63 In the above formula (6), R61 and R64 each independently represent a hydrogen atom or a substituent. Preferred substituents represented by R61 to R64 are the same as those preferred for Rn to rIS -25-201139510. R61 to R64 are preferably a hydrogen atom. (Other Structures) The polyacetal resin of the present invention may have a structure other than the structure represented by the above formulas 〇) to (6) in terms of a structure derived from an aromatic diol or a divalent carboxylic acid, as long as it does not violate the present invention. gist. Meanwhile, in the specification of the present invention, the structure derived from the aromatic diol includes, for example, the structure represented by the above formula (1), the structure represented by the above formula (2), the structure represented by the above formula (3), and the like. In the specification of the present invention, the structure derived from a divalent carboxylic acid includes, for example, a structure represented by the above formula (4), a structure represented by the above formula (5), a structure represented by the above formula (6), etc., in addition to an ester bond. Further, the resin of the present invention may contain one or more kinds of ether bonds, carbonate bonds, sinter bonds, ketone bonds, oxime imine bonds, guanamine bonds, urethane bonds or urea bonds. In terms of other structures forming these bonds, a structure known to be incorporated into a polyester resin may be included as long as it does not violate the gist of the present invention. (Ratio of the respective structures in the resin) In the polyester resin of the present invention, the aromatic diol component preferably satisfies the following formula (A) from the viewpoint of lowering the linear thermal expansion coefficient. 0.2 < (a + b) / (a + b + c) < 0.9 (A) wherein a represents the content ratio of the structure represented by the formula (1) in the polyester resin (unit: mol %); b represents The ratio of the structure represented by the formula (2) in the polyester resin (unit: mol%); and c represents the content ratio (unit: mol%) of the structure represented by the formula (3) in the polyester resin. In particular, when X is a dimethyl substituted carbon atom, the range of '-26-201139510 (a + b) / (a + b + c) is preferably 0.2, which is easy to make it reduce the linear thermal expansion coefficient. . The lower limit ( of (a + b) / (a + b + c) is preferably 0.4 or more, and particularly preferably 0.5 or more. From the viewpoints of transparency and tensile properties, the upper limit of (a + b) / (a + b + c) is preferably 0.9 or less, more preferably 0.8 or less, and particularly preferably 〇. 7 5 Or smaller. On the other hand, from the knowledge obtained by experiments, it is known that the polyester resin of the present invention is derived from a structure of a biphenol and a structure represented by the formula (4) or (5) from the viewpoint of lowering the coefficient of linear thermal expansion ( Preferably, the structure derived from citric acid is capable of satisfying the relationship of the following formula (B). A + B + 0.5xD + 0.5xE > 80 (B) wherein A represents the content ratio of the structure derived from the aromatic diol represented by the above formula (1) to all the structures derived from the aromatic diol contained in the polyester resin (Unit: mol%), B represents the content ratio of the structure derived from the aromatic diol represented by the above formula (2) to all the structures derived from the aromatic diol contained in the polyester resin (unit: mol%) , C represents a content ratio (unit: mole %) derived from the structure of the dicarboxylic acid represented by the above formula (4) with respect to all structures derived from the dicarboxylic acid contained in the polyester resin, and D represents derived from the above The structure of the dicarboxylic acid represented by the formula (5), which has a linking position at the 2-position and the 6-position in the structure, relative to the content ratio of all the structures derived from the dicarboxylic acid contained in the polyester resin (unit: Moer%). Hereinafter, the number 左侧 on the left side of the above formula (B), that is, A + B + 0.5xD + 0.5xE, is also regarded as the number of linear components. The number of linear components represented by the formula (B) represented by the number 値 is related to the linear thermal expansion coefficient of the film obtained by uniaxial stretching of -27-201139510. The number of linear components is, that is, the left side of the above formula (B) is preferably from 80 to 120' and particularly preferably from 9 to 12 Å. In the polyester resin of the present invention, the structure represented by the above formula (4) (preferably derived from a structure of p-citric acid) is preferably more than the structure represented by the above formula (6) (preferably derived from The weight of the structure of tannic acid). The weight ratio of the structure represented by the above formula (4) and the structure represented by the above formula (6) is preferably from 55:45 to 85:15, more preferably from 55:45 to 75:25, and particularly preferably from 60:40 to 75:25. When the weight ratio of the structure represented by the above formula (4) and the structure represented by the above formula (6) is 5 5 : 4 5 to 8 5 : 15 5 , the linear thermal expansion coefficient becomes low. In particular, when the weight ratio of the structure represented by the above formula (4) and the structure represented by the above formula (6) is 5 5 : 4 5 or more, the linear thermal expansion coefficient becomes small; At 85:15 or less, the melting point does not become too high to allow the melting to proceed easily, and the film obtained after the melting hardly becomes turbid. On the other hand, in the polyester resin of the present invention, when the weight of the structure represented by the above formula (4) is less than or equal to the weight of the structure represented by the above formula (6), the content ratio of the structure represented by the above formula (1) The sum of the content ratios of the structures represented by the above formula (2) is also preferred. In the resin of the present invention, the content ratio of the structure represented by the formula (1) is preferably relative to all the structures derived from the aromatic diol! 0 to 99 mol %, more preferably 2 to 90 mol % ' and particularly preferably 30 to 85 mol %. In the resin of the present invention, the content ratio of the structure represented by the formula (2) is preferably from 10 to 99 mol%, more preferably from 10 to 80 mol, relative to all the knots derived from the aromatic diol, -28-201139510. Ear %, and particularly preferably 10 to 60 mol%. In the resin of the present invention, the content ratio of the structure represented by the formula (3) derived from all the aromatic diols is preferably from 1 to 80 mol%, more preferably from 10 to 70 mol%, and Very good is 15 to 65 mol%. In the resin of the present invention, the content ratio of the structure represented by the formula (4) derived from all the dicarboxylic acids is preferably from 20 to 99 mol%, more preferably from 30 to 95 mol%. And especially good is 40 to 95% of the mole. In the resin of the present invention, the content ratio of the structure represented by the formula (5) derived from all the structures derived from the dicarboxylic acid is preferably from 〇 to 90% by mole%, more preferably from 0 to 70% by mole. And particularly preferably from 1 to 50% by mole. In the resin of the present invention, the content ratio of the structure represented by the formula (6) derived from all the structures derived from the dicarboxylic acid is preferably from 0 to 90 mol%, more preferably from 0 to 70 mol%, and particularly Good is 1 to 50% by mole. (Method for Producing Resin) The resin of the present invention can be generally synthesized into a monomer using a biphenol derivative, a dicarboxylic acid, and/or a derivative thereof. Further, it may be synthesized into a copolymer by using a preferred bisphenol derivative or the like. In the general method for synthesizing a biphenol derivative having a substituent, it can be considered in Macromolecules, 1996, 29, pp. 3727-3735, or Sen-I Kagaku Zassi, Journal of Fiber Chemistry, Vol. 84, Vol. (1963) Methods described on pages 143-145. The dicarboxylic acid derivative can be synthesized by a method similar to introducing a substituent into a dialkylnaphthalene and oxidizing the alkyl group. Examples of the general method of introducing a substituent into a dialkylnaphthalene -29-201139510 include the methods described in the following documents: Journal of Organic Chemistry, 2003, 68(22) > page 8373-8378;

Heteroatom Chemistry, 2 0 0 1, 1 2(4), 2 8 7-292;

Journal of the Chemical Society, Perkin Transactions 1 : Organic and Bio-Organic Chemistry, 1981, (3) pp. 7 4 6-750; or Journal of the Chemical Society [Section] D: Chemical Communications, (24) > 1 48 7 pages, 1 969. A general method for oxidizing an alkyl group as a substituent in naphthalene can be referred to in Journal of Organic Chemistry, 50 (22), pp. 42 1 1 - 42 1 8 (1 98 5). In the general method of synthesizing polyallyl ester using the above monomers, consider Shin Kobunshi Jikken Gaku 3, Kobunshi no Gosei/Hanno (2) (New Course 3 of Polymer Experiments, Polymer Synthesis / Reaction (2) ), KYORITSU SHUPPAN, (paragraphs 87 to 95 do not have special restrictions on the order of addition of individual monomers during synthesis) and all monomer components can be added simultaneously, or only biphenol and double The phenol is first synthesized, and then the dicarboxylic acid derivative is synthesized. Further, the synthesis can be carried out by solution polymerization in which a divalent carboxylic acid halide and a divalent phenol are reacted in an organic solvent; The synthesis is carried out in a condensation manner in which a divalent carboxylic acid halide and a divalent phenol are reacted in the presence of allyl carbonate or acetic anhydride. (Special Example of Resin) Hereinafter, the polyester of the present invention will be shown A specific example of the resin, but -30-201139510 The polyester resin which can be used in the present invention is not limited thereto. Meanwhile, in the lower right line labeled Ρ-1 to P-9, the parentheses represent the respective莫的%. 十·b<^Tc〇_^ (^'OfOyCO^ P2+<^X^〇y〇^ +〇b<5-0yO^9 {oO+OyO^ ^^°Τ〇 ΐ);3 fbd-ojOr^ |K>H>〇TCrj^

Ή^χο^. |<>Η>-τ〇γϊ^ fX-οχοα^^ -{oh-6-ojxx^^ f〇^jx^5 Ten V^yoo^ f〇+〇. !^ ^(φ-φτ0·^; •f0 copies. T°^2 f^-ojtxg. -31 - 201139510 Ή^ΊΓΟί);. ^OlOoyQ·^

"f o^^OjO^. fcH^p-oyO^ (oOhQ^yO^ Ή^ΗτΟΟ^.K^TOO^ t"<>K>〇T^i}1. Ή=κ=Ηγ〇τ);〇·Η>η^ τ^τ15 Ή>Φτ〇ι);t^Hror);

fΦ^ι^>ι); 5 fb-d-〇T〇i); 5 (Characteristics of Resin) The weight average molecular weight of the resin of the present invention is preferably from 10,000 to 5,000,000, more preferably from 15,000 to 1, 000,000, and especially good 20,000 to 500,000. The resin of the present invention is formed into a copolymer, and its copolymerization system may be a random copolymerization '• block copolymerization or other polymerization system. The glass transition temperature (Tg) of the resin of the present invention preferably falls within the range suitable for melt casting. Specifically, it is preferably from 170 to 270 volts, more preferably from 180 to 260 ° C, and particularly preferably from 19 (TC to 260 to C. The Tg of the resin of the present invention is in this range Further, the transparency of the obtained film can be further improved. Further, when the resin of the present invention is used as an optical film, 丨7 (r or higher Tg can be used for the method of laminating ITO (with heating) Method-32·201139510) improves dimensional stability and enhances the performance of the image display device of the present invention. (Solubility) The resin of the present invention can accept a solution cast film, and, in this case, it is preferably soluble in Particularly preferred among solvents such as dichloromethane, chloroform or tetracyanurethane are dissolved in a dichlorohydrazine having a low boiling point. The resin of the present invention can be used, for example, in the optical material of the present invention described below, In the film, preferred examples of the optical material include optical films such as a polarizing plate protective film, a phase retardation film, an antireflection film and an electromagnetic wave shielding film, a pickup objective lens, a microlens array, a light guiding plate, an optical fiber, an optical waveguide, and the like. Film (method of manufacturing film) The resin of the present invention can be used as a film. In the method of producing the film of the present invention, a solution casting method or an extrusion molding (melt molding) method is preferably used, and from the viewpoint of equipment convenience, use Extrusion is preferred. The casting and drying methods in solution casting films are described in U.S. Patent Nos. 2,323,310, 2,367,603, 2,492,078, 2,492,977, 2,492,978, 2,607,704, 2,739,069 and 2,739,070; British Patent Nos. 64,731 and 736,892. No.; JP-B 45-4554, JP-B 49-5614, JP-A 60-176834, JP-A 60-203430, and JP-A 62-115035° In terms of the press forming method, it is known in the art. The method is not particularly limited. -33- 201139510 In terms of manufacturing equipment, equipment known in the art can be used, and the manufacturing apparatus usable in the present invention is not limited thereto. In the extrusion molding method, although In particular, the resin composition of the resin is preferably one by nine in shape before the film is formed. When it is molded into a shape of nine, first, the material is preferably melted and given by a kneading machine. When it is taken out, it is cut and cut to form a resin composition into a ninth granular shape. In addition to the resin of the present invention, the resin composition may contain, for example, a coloring inhibitor and other temperatures which do not violate the gist of the present invention. It is preferably from 250 ° C to 350 ° C 260 ° C to 350 ° C, and particularly preferably from 270 ° C to 340 ° C. Next, it is preferred to form a film by: resin composition The material is fed to a melt extruder, and the resin composition is fed into a die at the exit of the melt extruder, and the resin composition is pressed out by a die, pressed onto a casting roll, and then cast. There is no particular limitation on the melt extruder, and known melt extruders include, for example, melt extruders. Jia is a twin-screw extruder. The shape of the die is also not particularly limited. A known die can be used, including a T-die, a coat die, and the like. It is preferred to use a hanger die. The temperature of the resin composition in the melt extruder is preferably 350 ° C, more preferably 260 ° C to 350 ° C, and particularly preferably 3 40 ° C. Ready. However, it contains a resin composition of the present invention and is a needle-shaped stabilizer. More preferably, it is a nine-grained material placed on the material of the melt-extruded film and can be used therein, and is made, and the head (hanger 25 0 ° C to 270 ° C to -34 - 201139510 for the melt kneading time) There is no particular limitation imposed on the casting rolls, and a known casting roll can be used. The temperature of the casting rolls is not particularly limited. The film of the present invention can also be stretched. For the stretching method, a known method can be used. The stretching can be carried out by roll uniaxial stretching, tenter uniaxial stretching, simultaneous biaxial stretching, continuous biaxial stretching, aeration or rolling. These methods have been described, for example, in JP-A 62-115035, A 4-152125, JP-A 4-284211, JP-A 4-298310 or JP-A ^ 48 27 1. The stretching method will be explained below. At the same time, the tenter is used as an example of the stretching side. The stretching of the film is carried out at a normal temperature or under heating. q The film is stretched by uniaxial stretching or biaxial stretching, but It is preferred to stretch by _ _. The film can be stretched during the drying process, which is It is particularly effective when the solution is retained. For example, by adjusting the __ of the transport roller of the film, the winding speed of the film becomes larger than the peeling speed of the film, and the thinness is stretched. It is also possible to use a tenter while conveying the film. Fix the thin end of the -3⁄4. degree direction and gradually increase the spacing of the tenter to perform the pulling process. In addition, after stretching, the stretching machine can be used to stretch the film (_ The stretching machine is used for uniaxial stretching. The pulling rate of the film (increasing the ratio of the length to the original length) is preferably 0.5 to 3 〇 q%, more preferably 1 to 200%, particularly preferably 1 Up to 1 〇 0%. The stretching rate is preferably from 5%/min to 1 000%/min, and 窜 & 10°/./min to 500%/min. Stretching is preferably by hot rolls or / and % of the heat source (such as IR heater) or warm air to carry out. In addition, 贽 Γ Γ - -35 - 201139510 into the temperature uniformity, can also be installed in a constant temperature bath. The glass transition temperature of the resin of the present invention is Basically, the stretching temperature is preferably (Tg - 100 ° C) to (Tg + 25 ° C), more preferably (Tg - 80 ° c) to (Tg + 20 ° c), And particularly preferably (Tg-70 ° C) to (Tg + Ht:). Based on the glass transition temperature T g , the heat treatment temperature is preferably (τ g_丨〇〇〇c ) to (Tg + 25 ° C), More preferably (Tg-80 ° C) to (Tg + 20 ° C), and particularly good (Tg-7 〇 ° C) to (Tg + 15 ° C) heat treatment can relax the shrinkage caused by stretching Stress and reduce the shrinkage of heating. (Physical Properties of Film) At a glass transition temperature (Tg) or higher, the film of the present invention exhibits a maximum change in length measured by thermomechanical analysis. At this time, the thermomechanical analysis refers to the analytical method defined in JIS K7197. And "presenting the maximum point of change in length measured by thermomechanical analysis" means the behavior if the length shrinks and then expands and contracts again. The film of the present invention preferably has a transmittance of 5% or more at 400 nm under conditions of a thickness of 100 μm. The transmittance in this range allows the material in close contact with the film to visually penetrate the film. The light transmittance is preferably from 70 to 100%, more preferably from 75% to 100%, particularly preferably from 80 to 1% by weight. In the film of the present invention, the coefficient of linear thermal expansion (CTE) in any portion of the plane is preferably 40 ppm/K: or less, more preferably 3 〇ρρ η / Κ or less, still more preferably 20 ppm / KL or less, and particularly good at 15 ppm/K or less. The CTE of 40 ppm/K or less has the advantage that when the inorganic thin film is laminated on the film, the generation of cracks and the distortion of the film due to the difference in the expansion rate can be suppressed in heating" - 36 - 201139510 The linear thermal expansion coefficient of the present invention is defined as a number in the range of 25 ° C to (Tg - 30 ° C). The linear thermal expansion coefficient of the present invention is preferably a number in the simultaneous heating and cooling methods. Further, the difference between the CET in the temperature raising method and the CET in the temperature lowering method is preferably 20 ppm/K or less, more preferably 10 ppm/K or less, and particularly preferably 5 ppm/K or less. . When the difference between the CET in the temperature rising method and the CET in the temperature lowering method is 20 ppm/K or less, the advantage is that the amount of deformation before and after the heat treatment of the temperature rising method or the temperature lowering method is small. (Elongation at break) The film of the present invention preferably has an elongation at break of 1 〇 % or more from the viewpoint of tensile properties. The elongation at break is more preferably 15% or more, and particularly preferably 20% or more. (Functional Layer) The film of the present invention may have another thin layer on the surface to which it is applied. Alternatively, the film surface may be subjected to, for example, saponification, corona treatment, flame treatment or glow discharge treatment in order to enhance adhesion to other portions. In addition, a layer of anchoring layer can be provided on the surface of the film. A gas barrier layer - In order to suppress gas permeation, the film of the present invention may also have a gas barrier layer laminated on at least one side. Examples of preferred gas barrier layers include films formed from metal oxides of one or two or more metals selected from the group consisting of ruthenium, aluminum, magnesium 'zinc, zirconium, titanium, niobium and giants as main components. ; a metal nitride of aluminum, and boron; or a mixture thereof. Among them, from the viewpoints of gas barrier properties -37-201139510, transparency, surface flatness, bending properties, film stress, cost, etc., it is preferable to form a film formed of a metal oxide containing cerium oxide as a main component. The ratio of the number of oxygen atoms in the cerium oxide to the number of germanium atoms is from 1.5 to 2.0. These gas barrier layers composed of inorganic compounds can be produced by vapor deposition, wherein the materials are vapor deposited to form a thin film, including, for example, sputtering, vacuum evaporation, ion plating, plasma CVD method, Cat-CVD method, and the like. Among them, a sputtering method and a Cat-CVD method are preferable, which are capable of providing particularly excellent gas barrier properties. When the barrier layer is provided, the temperature can be increased to 50 °C to 250 °C. The thickness of the gas barrier layer is preferably from 10 to 300 nm, and more preferably from 30 to 200 nm. The gas barrier layer can be placed on the same side or the opposite side of the transparent conductive layer as will be discussed below. In the gas barrier function of the film of the present invention, the water vapor permeability measured at 40 ° C and a relative humidity of 90% is preferably 0 to 5 g / m ^ 2 • day, more preferably 0 to 3 g / m ^ 2 . day, and more preferably 〇 to 2 g / m ^ 2 • day. The oxygen permeability measured at 40 ° C and a relative humidity of 90% is preferably 〇 to 1 ml / m ^ 2 · day · atmospheric pressure (〇 to 1 x lO5 ml / m ^ 2 • day • Pascal), More preferably 0 to 0.7 ml/m2. Day·atmospheric pressure (0 to 0.7 χ 105 cc/m2·day·Pascal), and even more preferably 0 to 0.5 cc/m ^ 2 • day · atmospheric pressure (0 To 0.5χ105 ml/m2•day·Pascal). For example, when the film is used in an organic EL display device or a liquid crystal display device, the gas barrier property within the above range can be substantially eliminated from the destruction of the EL element due to water vapor and oxygen. In order to improve the gas barrier properties, it is preferred to be adjacent to the defect compensation layer of the gas barrier layer. In the aspect of the defect compensation layer, {the use of a sol-gel method such as US Pat. No. 6,671,663 or JP-A 2003-94572 to produce an inorganic oxide layer, (2) as described in the U.S. Patent No. Material layer. These defect compensation layers may be formed by evaporating the raw materials and then hardening them by ultraviolet rays or electron beams; or by first coating the raw materials and then hardening them by heating, ultraviolet rays or the like. When the defect compensation layer system is formed, conventional various coating methods, 'spray coating method, spin coating method, rod coating method, and the like, can be used. In order to provide chemical resistance, the film of the present invention may be provided with a barrier layer, an organic barrier layer, an organic-inorganic hybrid layer or the like. A transparent conductive layer - The film of the present invention can be laminated on at least one side. As the transparent conductive layer, a known metal film film or the like can be applied. Among them, a metal oxide film having excellent transparency and organic properties is preferably used as the transparent conductive layer. Examples of the gold film include thin films such as indium oxide, cadmium oxide, and tin oxide, which are doped with tin, antimony, cadmium, molybdenum, tungsten, fluorine, and impurities; and metals such as zinc oxide and titanium oxide are oxidized therein. It is doped with aluminum as an impurity. Among them, an indium oxide film mainly composed of tin oxide and having 2 to 15% by mass of zinc oxide is excellent in transparency and surface, and is a preferred choice for use. The formation of 6413645 as described in (1) by electron beam in a vacuum method, by coating, for example, a layer of inorganic transparent conductive, metal oxide conductive and oxidized metal oxyzinc or bismuth film, And the conductive method can be used to form a transparent conductive layer as long as the desired film is formed. For example, a suitable method includes forming a film by depositing a material of a vapor phase, a vacuum evaporation method, an ion plating method, a plasma CVD method, or Ca. This film can be preferably obtained by the viewpoint of obtaining superior conductivity and transparency by the method described in Japanese Patent No. 3,400,324, 322,561, or JP-A No. 2002-361774. The degree of vacuum of the sputtering method, the vacuum evaporation method, the ion plating method or the plasma is preferably from 0.133 mPa to 6.65 Pa, from 0.665 mPa to 1.33 Pa. Prior to the formation of the transparent conductive layer, such as electric paddle treatment (reverse sputtering) or corona treatment. In the method of providing a transparent conductive layer, the thickness of the transparent conductive layer obtained by a temperature of 20 ° C 0 is preferably from 20 to more preferably from 50 to 300 nm. The surface resistance measured at 25 ° C and a relative humidity of 60% is preferably from 0.1 to 200 Ω / □, more preferably from 0.1 to more preferably from 0.5 to 60 Ω / ο. The transparency of the transparent conductive layer is more preferably 83% or more, still more preferably 85%, or the image display device as described above is not particularly useful for the type of image display device Restrictions, and include pass. The film of the present invention can be used as a method for producing a deposition method which is excellent in the deposition method, such as a sputtering method, a t-CVD method, or the like, in JP-A 2002-meth. It should be noted that in the sputtering CVD method, and preferably, the base film is preferably surface-treated at a temperature of from 1 to 50 ° C to 500 nm, and the conductive layer of the conductive layer is: 10 0 Ω. / port, preferably 80% higher. . Set. The image quality is known as the flatness of the display device -40- 201139510. Examples of the flat panel display device include devices using liquid crystal, electric prize, organic electroluminescence (EL), inorganic electroluminescence, fluorescent display tube, light emitting diode, field emission type, and the like. In addition, films can be used as substrates in place of glass substrates, which are used in conventional display systems. Further, in addition to the flat panel display device, the film of the present invention can be applied to solar cells and touch panels. It can be applied to, for example, a touch panel as described in JP-A 5- 1 27822, JP-A 2002-489 13 or the like. A thin film transistor (TFT) can be formed on the film of the present invention. τ F T can be formed by a known method as disclosed in JP-A 11-102867, JP-T 10-512104 *JP-A2001-6 8 6 8 1 . In addition, these substrates may have color filters for color displays. These color filters can be formed by any method and are preferably formed by photolithography. The TFT formed in the present invention may be an amorphous germanium TFT or a poly germanium TFT. In the case of polycrystallization of polycrystalline germanium, an annealing method by laser exposure is preferably used. In the method of forming a tantalum film of a TFT semiconductor layer, a sputtering method, a plasma CVD method, an ICP-CVD method, and a Cat-CVD method can be used, and a sputtering method is preferred. Formation by sputtering can reduce the concentration of hydrogen in the tantalum film and avoid the delamination of the thin layer caused by the laser exposure used for the polycrystallization. On the film of the present invention, a pure tantalum film, an impurity-containing tantalum film, a tantalum nitride film, a tantalum oxide film, or the like can be formed by plasma CVD. The substrate temperature in this case -41 - 201139510 is preferably 2 50. (: or lower. The heat treatment temperature in which the sputtering electrode can be formed by sputtering to reduce the electric resistance is preferably 25 (rc or lower). The TFT formed in the present invention may have any structural shape, Etch-blocking type, upper gate type or lower gate type. When the film of the present invention is used as a substrate such as a liquid crystal display, in order to achieve optical uniformity, a film is preferably an amorphous polymer state. In addition, in order to control the retardation of long dispersion, a resin having a large (or smaller) wavelength dispersion can be combined with a resin having different intrinsic birefringence symbols. The present invention is controlled by control retardation (Re) or improved gas permeability or mechanical. The film is preferably a different type of resin and laminated. There is no limitation on different kinds of resin compositions, and any of the foregoing resin compositions can be used. A reflective mode liquid crystal display device generally has such a portion to start its The substrate is the lower substrate, the reflective electrode, the lower layer, the upper alignment film, the transparent electrode, the upper substrate, and λ/4. The film of the present invention can be used as a transparent electrode. And 'or if it is a color display' between the reflective electrode and the underlying alignment film between the upper alignment film and the transparent electrode, preferably a re-shaping filter layer. The transmissive mode liquid crystal display device generally has a structure in sequence , backlight, polarizer, λ/4, underlying transparent alignment film, liquid crystal layer, upper alignment film, upper transparent electrode or germanium. For use, such as channel etching, resin composition (Re) and its wave, or The structure of the junction property is combined with a special structure, which is composed of a bottom film, a liquid crystal film, and a polarizing film upper substrate. The electrode, the lower layer, and the upper substrate are separated from each other by a layer of color-42-201139510, λ/4 a film and a polarizing film, wherein the film of the present invention can be used as an upper transparent electrode and/or an upper substrate. If it is a color display, between the lower transparent electrode and the lower alignment film or in the upper alignment and transparent electrodes Preferably, a color filter layer can be further formed. There is no particular limitation on the type of liquid crystal layer (liquid crystal cell), and various types are not provided. Display modes are proposed, such as ΤΝ (twisted nematic), IPS (planar conversion), FLC (ferroelectric liquid crystal), AFLC (antiferroelectric liquid crystal), Ο CB (optical compensation bending), STN (super twisted direction) Column), VA (vertical alignment) and HAN (mixed alignment). In addition, it is recommended to display the display mode obtained by aligning the above display mode. The film of the present invention can also be effectively used for a liquid crystal display device of such a display mode. Any of various liquid crystal display devices that are used in a transmissive mode, a reflective mode, or a semi-transmissive mode.

In JP - A 2 - 1 7 6 6 2 5, J p - B 7 - 6 9 5 3 6 , Μ VA (S ID 9 7, Digest of tech. Papers (preprint) 28 (1 997) 845), SID99, Digest of tech. Papers (1999) 206), JP-A 1 1 -25 8605, SURVAIV AL (Monthly DIS PLAY, Volume 6, Volume 3 (1999) 14), PVA (Asia Display 98, Proceedings of the 18th International Conference on Display Resolution (Preprint) (1998) 383), Para-A (LCD/PDP International 99), DDVA (SID98, Digest of tech. Papers) 29 (1 998) 8 3 8), EOC (SID98, Digest of tech. Papers 29 (1998) 319), PSHA (SID98, Digest of tech. Papers (preprint) 29 (1998) 1081), RFFMH (Asia) Display 98, Proceedings of the 18th International Conference on Display Resolution (Preprint) (1998) 375), HMD (SiD98, Digest of tech. Papers -43-201139510 (preprint) 29 (1998) 702), JP-A Liquid crystal cells and liquid crystal display devices have been described in 10-123478, WO 98/48320, Japanese Patent No. 3022477, and WO 00/65384. The film of the present invention is advantageous for use in organic EL display applications. The special layer structure of the organic EL display device includes anode/light emitting layer/transparent cathode, anode/light emitting layer/electron transport layer/transparent cathode, anode/hole transport layer/light emitting layer/electron transport layer/transparent cathode, anode/hole Transport layer / luminescent layer / 'transparent cathode, anode / luminescent layer / electron transport layer / electron injection layer / transparent cathode, anode / hole injection layer / hole transport layer / luminescent layer / electron transport layer / electron injection layer / transparent Cathode, etc. The organic EL display device capable of using the film of the present invention can generate light by applying a direct current (which may contain an alternating current component if necessary) voltage (generally 2 to V) or a direct current between the anode and the cathode. In order to drive these light-emitting elements, for example, JP-A 2- 1 48687, JP-A 6-301355, JP-A 5-29080, JP-A 7-134558, JP-A 8-234685, JP-A 8 can be used. The method described in U.S. Patent No. 5,828,429 and U.S. Patent No. 2,784, 308, the disclosure of which is incorporated herein. For a full color display, the organic EL display device can use any one of a color burner system, a three-color independent illumination system, a color conversion system, and the like. The liquid crystal display device and the organic EL display device can be driven by a passive matrix system or an active matrix system. The film of the present invention can be used as an optical film, a phase retardation film, a polarizer protective film, a transparent conductive film, a substrate for a display device, a flexible display-44-201139510 substrate, a flat display substrate, and a solar cell substrate. , a touch panel substrate, a flexible circuit substrate, a disc protective film, and the like. EXAMPLES Hereinafter, the features of the present invention will be explained in more detail by way of the cited examples. The materials, amounts, percentages, processing contents, processing procedures, and the like presented in the following examples may be appropriately changed as long as such changes do not cause deviations from the gist of the present invention. Therefore, the scope of the invention should not be construed as being limited by the following specific embodiments. (Synthesis of Polymer) - Synthesis of Exemplary Compound P-1 - In a 300 ml three-necked flask equipped with a stirrer, 10.56 g of 3,3'5,5'-tetramethyl-4,4'-double was charged. Hydroxybiphenyl, 4.68 g of 3,3'-dimethyl-4,4'-bishydroxybiphenyl, 9.96 g of bisphenol A, 360 mg of sodium hydrogen sulfite, 1600 mg of tetra-n-butylammonium chloride, 390 ml Dichloromethane and 450 ml of distilled water were stirred and dissolved under a stream of nitrogen. To this solution, a solution obtained by dissolving 17.8 g of hydrazine chloride and 5.36 g of 2,6-naphthalenedicarboxylic acid chloride in 180 ml of dichloromethane was added. Further, 114 ml of a 2 mol/liter sodium hydroxide solution and 30 ml of water were added dropwise over a period of 1 hour at a temperature of from 15 ° C to 20 ° C. After the dropwise addition, the solution was stirred for 3 hours, and then the reaction liquid was transferred to a 3-liter three-necked flask, and 1.8 ml of acetic acid and 1 800 ml of ethyl acetate were slowly added. After filtration, the obtained polymer powder was washed successively with 1 liter of ethyl acetate, 1 liter of water and 1 liter of methanol, and dried, thereby producing 3 6.4 g of the exemplified compound p -1. -45-201139510 GPC (THF solvent; HLC-8120GPC based on polystyrene, manufactured by Tosoh Corporation) showed a weight average molecular weight of 105,000. The obtained polymer was dissolved in methylene chloride' and cast on a glass plate, followed by drying, thereby producing a film having a thickness of 100 μm. For this film, the glass transition temperature was measured using TMA83 10 (Thermo Plus series, manufactured by Rigaku Co., Ltd.), which was 25 7 〇C 〇-exemplified compounds P-2 to P-9, and the synthesis of Comparative Polymer 2 In addition to changing the composition and/or its weight, the synthetic procedure of the exemplified compound P-1 was repeated, thereby producing the aforementioned exemplified compound having a structure described later and a comparative polymer. The glass transition temperatures of the various obtained polyester resins are shown in Table 1 below. At the same time, the structure derived from isodecanoic acid is introduced using isodecyl chloride. -Comparative Synthesis of Polymer 1 - In comparison with Polymer 1, a polymer having the following structure was synthesized' which was described in Example 8 of JP-A 58-180525. -Comparative Synthesis of Polymers 3 to 7 - In terms of comparing polymers 3 to 7, polymers each having the following structure were synthesized, which were described in Examples 5, 8, and 6 of JP_A 1〇_ 1 76 5 8 , 1 or 3 in. At the same time, 'in the comparative examples of polymers 3, 4, 6 and 7', in the formula (2) of the present application

The structure represented by several is a structure derived from a bisphenol C skeleton. -46- 19 201139510 Comparative Polymer 1

-(〇〇

Comparative polymer 2

Comparative polymer 3 25

Ο

Or 25

Ό - 25

25 °^-Η!^ίγ〇γ 25 25 -47- 201139510 Comparative Polymer 4

-〇τ〇· 'Ίγ^ι

Y〇^. ^W>^rxyi Comparative Polymer 6

-σ

〇τ 40 Ο

ΓΛ-ΓΎ

4^-°ίπ 〇! Formation of Film Example 1 (Formation, Stretching and Heat Treatment of Film) A small kneading machine (trade name: MiniLab, manufactured by Haake) with a preset temperature of 305 °C was used for kneading The compound P-1 was used for 10 minutes, which was taken out as a needle, and cut with a forceps, thereby making the resin composition into a nine-grain shape. -48- 201139510 Using a twin-screw melt extruder with a temperature of 280 ° C (inlet temperature) adjusted to 3 30 ° C (outlet temperature), the obtained nine-part resin composition was melted by a hanger die. Pressed out, it was extruded onto a casting roll having a preset temperature of 120 ° C, and then peeled off, thereby forming a film. The film was cut into a size of 120 mm χ 120 mm, which was stretched by a simultaneous biaxial stretching machine. The stretching conditions in the first stage are as follows: the spacing between the chucks is 100 mm (longitudinal and transverse), the resin temperature is 25 ° C, the stretching rate is 100 mm / min, and the stretching length is 40 mm (longitudinal and transverse pull) The elongation rate is 40%). After stretching, the film was heated to 240 ° C and maintained in a state of being clamped by the biaxial stretching machine until the stress became approximately fixed. Thereafter, the film was cooled to a temperature of 100 ° C or lower, which was taken out from the biaxial stretching machine. The stretched film was placed in a metal square frame having an inner side length of 120 mm, which was heat-treated at 23 ° C for 24 hours in a nitrogen atmosphere, thereby producing the stretched film of Example 1. Examples 2 to 9, Comparative Examples 1 to 7 The operation of Example 1 was repeated except that the exemplified compounds P-2 to P-9 and the comparative polymers 1 to 7 were respectively used, thereby forming a biaxially oriented film. . Meanwhile, Comparative Example 1 has a high Tg, making casting difficult, and therefore, a film is obtained by melt-pressing a film. However, such a film exhibits a poor elongation at break and does not form a stretched film. <Glass Transfer Temperature (Tg)> The Tg of each film sample was measured in nitrogen at a rate of temperature increase of 10 t / min, which was measured by a differential scanning calorimeter (DSC6200, manufactured by Seiko) . -49-201139510 <Linear 'Coefficient of Thermal Expansion> A film sample (19 mm X 5 mm) was formed and measured using TMA (TMA8310, manufactured by Rigaku Corporation). The measurement rate is set to 3 °C / min. Three samples were measured and their average 値 was used. The measurement system was carried out at a temperature ranging from 25 ° C to 300 ° C, and the linear thermal expansion coefficient was calculated in the range of a temperature rise of 25 ° C to 200 ° C. However, for samples having a glass transition temperature of 200 ° C or less, it is calculated at a temperature ranging from 25 ° C to 150 ° C. <Evaluation of Transparency> The obtained film was visually observed, and the following judgment was made to evaluate transparency. 〇: good transparency, and transmittance of 70% or higher at 400 nm at a thickness of 1 μm X: white turbidity is remarkable and uneven <weight average molecular weight> Using Tosoh The manufactured "HLC-8120GPC" was measured by GP C using N-methylpyrrolidone as a solvent, and was compared with a polystyrene molecular weight standard product to obtain a weight average molecular weight. <Evaluation of Solubility> The obtained film was dissolved in dichloromethane so that the concentration was 5% by mass, and the following judgment was made to evaluate the solubility. 〇: completely dissolved and transparent X: insoluble or turbid. The results obtained are shown in Table 1. -50- 201139510 1 Properties of film 1 Transparency Ο 〇〇〇X 〇Ο 〇〇〇〇S SK 箓m% Tooth 1 sharp — mm 〇二V~> OJ cannot stretch 1_____ - \〇〇 〇S ο its cs ro CO \ns cs TO CS cs 〇cn CN § 〇〇〇〇〇〇cn CN CS 1 S1 ί Structure derived from dicarboxylic acid [mole%] 1 naphthalene dicarboxylic acid ο m < NRR s 〇ο Ο 〇Ο 〇〇Ο 〇1 isophthalic acid 〇w-ί <Ν O ο o <NI for decanoic acid νη Another ggg 1 derived from the structure of aromatic diol [mole%] | {( 1)+(2))/{(1>+(2)+(3)} vq νη ο CX3 o; <5 vp \q ρ o VO οι CS CN CN 1 (3) ο Wi (Ν S Ο Ο O Ο cs S g S 1 (2) 8 CN o Ο s another o 〇〇Ο 丨 (1) ο o ? o vn 〇〇〇 SS SS? MS bisphenol A bisphenol A bisphenol A bisphenol A bisphenol A i diacid AI double Phenol A Bisphenol c • Bisphenol A 1 Bisphenol C Bisphenol C Bisphenol C Bisphenol A Bisphenol c Bisphenol C 1 Structure of formula (1) | R15 to R1S Methyl (4) Methyl (4) Methyl (4) Methyl (4) A Base (4) methyl-1 methyl (4) methyl 4) ι methyl (4) Base (4) Methyl (4) Methyl (4) ' Methyl (4) | RU to R · ' 堞 « « mm Methyl (2) Methyl (2) m Destruction of the pond * Methyl (2) • Structure 2 CN dr〇Ο, 2 d S; 〇ol, CTs a. 1 Comparative Polymer 1 Comparative Polymer 2 Comparative Polymer 3 Comparative Polymer 4 Comparative Polymer 5 Comparative Polymer 6 Comparative Polymer 7 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 1 1 Example 7 Example 8 Example 9 Comparative Example 1 ΟΪ 匡 urn ΛΑ Β Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 201139510 As shown in Table 1 It is known that the films of Examples 1 to 9 have a Tg system falling within a range suitable for melt casting, and when ITO is laminated, dimensional stability is within a range that does not impair the heating method, and it exhibits small linearity. Thermal expansion coefficient, high transparency, and good solubility in methylene chloride. Comparative Example 1 In contrast to Example 2, the resin used in the film of Example 1 contained only the structure derived from the aromatic diol represented by the above formula (1), and it had a high Tg and could not be cast, and The solubility in dichloromethane is not good. On the contrary, the film of the known example 2 is a resin containing a structure represented by the above formula (1) (such as Comparative Example 1) and a structure represented by the above formula (2) (a structure derived from an aromatic diol), It can reduce the Tg to a range suitable for casting, and can also improve the solubility in dichloromethane. Comparative Examples 2 and 3 are in contrast to Example 8 and each have a structure of 50:50 (mole ratio) derived from p-citric acid and isodecanoic acid as a structure derived from a dicarboxylic acid. Further, each has a structure of 50 mol% as shown in the above formula (3), which is a structure derived from an aromatic diol. As for the remaining 50 mole % derived from the structural aspect of the aromatic diol 'Comparative Example 2 is a single-system using a structure of 5 〇 mol % of the above formula (1) which exhibits a relatively high linear thermal expansion coefficient' 42 ppm/K ° to the remaining 50 mol% derived from the structural aspect of the aromatic diol 'Comparative Example 3 uses a single system of 50 mol% of the structure shown in the above formula (2)' which is compared with Comparative Example 2 The same is true, showing a fairly high coefficient of linear thermal expansion ' 4 1 ppm /κ. Conversely, -52-201139510, Embodiment 8 uses an integrated system of 30 mol% of the structure shown by the above formula (1) and 20 mol% of the structure shown by the above formula (2), which can reduce the linear thermal expansion coefficient. To 32 ppm/K, it drastically dropped below the average enthalpy of Comparative Examples 2 and 3. Further, the film of the known embodiment is compared with the films of Comparative Examples 3 to 7 which respectively use the polymers described in Examples 5', 8, 10 and 3 of JP-A 1 0- 1 7 65 8 It has improved properties. More specifically, it can greatly reduce the number of linear thermal expansion coefficients and increase the glass transition temperature, thus providing high heat resistance. Examples 101 to 109, Comparative Examples 102 to 107 1. Formation of gas barrier layer Both sides of the films of Examples 1 to 9 and Comparative Examples 2 to 7 were simultaneously sputtered by DC magnetron sputtering. Using SiCh as a target, in an Ar environment, under a vacuum condition of 500 Pa, 'at 5 kW of output power, thus producing Examples 1 01 to 1 09 and Comparative Example 10, respectively. 2 to 107 films having a gas barrier layer. The thickness of the gas barrier layer obtained was 60 nm. The water vapor permeability at a temperature of 40 ° C and a relative humidity of 90% is 0.1 g / m ^ 2 • day or less. Examples 201 to 209, Comparative Examples 202 to 207 2. Formation of a transparent conductive layer having a gas barrier layer by the DC magnetron sputtering method for Examples 101 to 109 and Comparative Examples 1 0 2 to 107 A transparent conductive layer is provided on one side of the film, and is composed of an ITO film having a thickness of 140 nm, which is made of -53-201139510 ΙΤ0 (95% by mass of In2〇3'5 mass% of Sn〇2). The target was heated in an environment of Ar at a vacuum of 0.665 Pa at an output of 5 kW to 1 〇〇 ° C, thereby producing Examples 20 1 to 209 and Comparative Example 202, respectively. Film of 207. Each of the films of Examples 201 to 209 and Comparative Examples 202 to 207 had a water vapor permeability of 0.1 g/m ^ 2 • day or less at 40 ° C and a relative humidity of 90%, and was 40 °. The oxygen permeability under conditions of C and relative humidity of 90% is 0.1 ml/m 2 • day • atmospheric pressure or less. Each of the ITO thin layers has a surface resistance of 30 Ω / □ at 25 ° C and a relative humidity of 60%. <Evaluation of gas barrier properties and surface resistance change obtained by heating test> Films having gas barrier layers for Examples 1 01 to 1 09 and Comparative Examples 102 to 07 07 and Examples 201 to 209 and comparative implementation Examples 202 to 2 07 have a film of a gas barrier layer and a transparent conductive layer, and measure the gas barrier properties before or after the heat treatment, or the gas barrier properties and surface resistance to obtain the amount of change. The heat treatment was carried out under the following conditions: in a nitrogen atmosphere, the temperature was raised from room temperature to 160 ° C, maintained at 16 (TC for 2 hours, and cooled to room temperature. Before and after the heat treatment, Example 101 to The film of the present invention of 109 and 201 to 209 showed no change in gas barrier properties and surface resistance, but the films of Comparative Examples 102 to 107 and 202 to 207 showed deterioration in both properties. Between the inorganic layers, the difference in expansion of the inventive film is due to the small linear thermal expansion coefficient. Examples 301 to 309 and Comparative Examples 302 to 307 <Formation and Evaluation of Organic EL Elements> The film of the present invention of Examples 201 to 209 having a transparent conductive layer and the films of Comparative Examples 202 to 207 were respectively used to form an organic EL element sample. The lead wires of aluminum were connected to Examples 201 to 209 and Comparative Example 202. a transparent electrode layer of a film of 207 (where a transparent conductive layer has been formed in the foregoing manner), thereby forming a laminated structure. On the surface of the transparent electrode, spin coating An aqueous dispersion of poly'ethylene dioxythiophene/polystyrene sulfonic acid (Baytron P: solid content: 1.3% by mass, manufactured by BAYER), which was dried under vacuum at 150 ° C for 2 hours, thereby forming A 100 nm thick hole transports an organic thin layer. This product is labeled X. On the other hand, it consists of a polyether oxime (SUMILITE FS-1300, manufactured by Sumitomo Bakelite) having a thickness of 188 μm. On top of the temporary substrate, a coating liquid for emitting an organic thin layer was applied by a spin coater and dried at room temperature, thereby forming a light-emitting organic thin layer having a thickness of 13 nm on the temporary substrate. The product was labeled as transfer material Y. (Composition) • Polyvinylcarbazole (Mw = 63 000, manufactured by Aldrich): 40 parts by mass - 55 - 201139510 • Tris(2-phenylpyridine) ruthenium complex ( Ortho-metallized complex): 1 part by mass • Dichloroethane: 32 〇〇 parts by mass _ @材·料 γ The luminescent organic thin layer side is superposed on the upper surface of the thin layer of the substrate χ Above, let it heat up and take a pair of i6 (rc 0.3 The heating rolls of MPa and 〇·05 m/min were pressed, and the time-sensitive substrate was peeled off, and an organic thin layer was formed on the upper surface of the substrate X. This product was marked as XY. A pattern mask for evaporation (for producing a 5 mm χ 5 mm light area) on a surface of a 25 mm square and 50 μm thick polythene film (UPILEX-50S, manufactured by Ube Industries, Ltd.) Photomask) and evaporation under reduced pressure of about 0.1 mPa' thus forming an electrode having a thickness of 0.3 microns. A12 ◦ 3 was used as a target by DC magnetron sputtering, and A12 0 3 was deposited in the same pattern as the A1 layer to a thickness of 3 nm. The lead wire is connected to the A1 electrode to form a laminated structure. On top of the obtained laminated structure, a spin coater was applied to coat a coating liquid having the following composition for electrotransporting an organic thin layer, which was vacuum dried at 80 ° C for 2 hours, thereby forming a thickness of 15 nm. The electron transports an organic thin layer. This product is referred to as Z. (composition) • Polyvinyl butyral 2000L (Mw = 2000 'manufactured by Electrochemical Industry Co., Ltd.): 1 〇 by mass, and the photo-amine A1 tube case is based on -56- 201139510 • 1-butanol: 3500 parts by mass • Electron transport compound having the structure shown below: 20 parts by mass

The electron transport compound superimposes the substrate XY and the substrate Z such that the electrodes are opposed to each other, and the light-emitting organic layer is placed between the electrodes, which is heated and is paired at 160 ° C, 0.3 MPa, and 0.05 m. The heating roller of /min was pressed to laminate it, thereby producing a sample of the organic EL element. A direct current was applied to the obtained sample of the organic EL element, which was a power measuring unit of Model 2400 (manufactured by Toyo Tec Co., Ltd.). It was confirmed by experiments that the samples formed using the inventive films of Examples 201 to 209 were able to emit light. On the other hand, the samples formed using the films of Comparative Examples 202 to 2 07 were only able to emit light for a while, but immediately stopped emitting light. This is because the films of the present invention of Examples 201 to 209 have a small linear thermal expansion coefficient, and do not cause cracks in the inorganic layer due to heat in the method of forming a sample, but the films of Comparative Examples 202 to 207 have large linearity. The coefficient of thermal expansion is such that cracks are generated in the inorganic layer upon heating. -57- 201139510 The resin of the present invention has a glass transition temperature suitable for effective casting, a low linear thermal expansion coefficient, high transparency, and good solubility in a gas hospital. Further, the film using the resin exhibits a small linear thermal expansion coefficient, and therefore, it can be used as a gas barrier film, a transparent electrode, and a substrate for an image display device. [Simple description of the diagram] None. [Main component symbol description] None. -58-

Claims (1)

201139510 VII. Patent application scope: 1. A polyester resin containing the structure represented by the following formula (1) and the structure represented by the following formula (2): Wherein each of Rh to RM independently represents a hydrogen atom or a substituent, and R>5 to R18 each independently represent a substituent; Wherein R21 to R26 each independently represent a hydrogen atom or a substituent, and at least one of R21 to R26 represents a substituent. 2. The rejuvenating resin as claimed in claim 1 wherein each of R15 to R18 in the formula (1) is independently a halogen atom, an alkyl group, an aryl group or an anthracene group. The polyester resin of the formula wherein R15 to R18 in the formula (1) are each independently a fluorine atom, a chlorine atom, a bromine atom, an alkyl group having from 1 to 4 carbon atoms, a phenyl group or a methoxy group. 4. The polyester resin according to any one of claims 1 to 3, wherein R21 to R26 in the formula are each independently a hydrogen atom, a halogen atom, a -59-201139510 alkyl group, an aryl group or an alkoxy group. . The polyester resin according to any one of claims 1 to 3, wherein each of the formulas (2) to R26 is independently a hydrogen atom, a fluorine atom, a bromine atom, a chlorine atom, and has 1 to 4 An alkyl group, a phenyl group or a methoxy group of one carbon atom. 6. The polyester resin according to any one of claims 1 to 3, which comprises the structure represented by the following formula (3): Wherein R31 to R38 each independently represent a hydrogen atom oxime substituent; X represents a linking group which may have a substituent or a portion of the ring structure 'and in this case' may be bonded to at least one of R31 to R34 Form a ring structure. 7. The polyester resin as claimed in claim 6 which satisfies the following formula (A): 0.2 < (a + b) / (a + b + c) ^ 0.9 wherein a represents the structure represented by the formula (1) The content ratio in the polyester resin (unit: mole / 〇); b represents the content ratio of the structure represented by the formula (2) in the polyester resin (unit: mol%); and c represents the formula (3) The ratio of the content of the structure in the polyester resin (unit: mol%. 8) The polyester resin according to any one of claims 1 to 3, which contains -60-201139510 has the following formula (4) Representative structure: (4) Wherein R41 each independently represents a substituent; and m represents an integer from 0 to 3. 9. The polyester resin according to any one of claims 1 to 3, which has the structure represented by the following formula (5): (5) (R51)n Wherein R51 and R52 each independently represent a substituent; and η and k each represent an integer of 〇 to 3. The polyester resin according to any one of claims 1 to 3, wherein the Tg is from 170 ° C to 270 ° C. 1 1 _ An optical material produced by the polyester resin of any one of claims 1 to 1. 1 2 . A film produced by a polyester resin of any one of claims 1 to 10 - 61 - 201139510. 1 3 . The film of claim 12, wherein the coefficient of linear thermal expansion is 40 ppm/K or less. 1 4. A film according to claim 12 or 13 wherein a gas barrier layer is provided. 1 5 A film according to claim 12 or 13 wherein a transparent conductive layer is provided. An image display device using at least one film according to any one of claims 12 to 15. -62- 201139510 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A simple description of the symbol of the symbol of this representative figure: te. 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 201139510 Revision page invention patent specification PD1117381 (11) (This specification format ※ application number: Bu: Λ W ※ application period: order, please Any change ※Do not fill in the mark; only already (2 (※工卩匚分类: Side Yusuo - please fill in / 11 rate 1 corner lunar body), invention name: (Chinese / English) Polyester resin And optical materials, films and image display devices using the same, POLYESTER RESIN, AND OPTICAL MATERIALS, FILMS AND IMAGE DISPLAY DEVICES USING THE SAME 2. Abstract: A structure containing the formula (1) and a formula (2) Structural polyester resin: Wherein R11 to R14 and R21 to R26 represent a hydrogen atom or a substituent; R15 to R18 represent a substituent; and at least one of R21 to R26 represents a substituent. 201139510 Revision page invention patent specification PD1117381 (11) (This specification format ※ application case number: Bu: Λ W ※ Application deadline: Order, please do not change anything ※ Do not fill in the mark part; only already (2 (※工卩匚Classification: Side Yusuo-number please fill in / 11 rate 1 corner lunar body), invention name: (Chinese / English) Polyester resin, and its optical materials, film and image display device POLYESTER RESIN, AND OPTICAL MATERIALS, FILMS AND IMAGE DISPLAY DEVICES USING THE SAME 2. Abstract: A polyester resin containing the structure represented by formula (1) and the structure represented by formula (2): Wherein R11 to R14 and R21 to R26 represent a hydrogen atom or a substituent; R15 to R18 represent a substituent; and at least one of R21 to R26 represents a substituent.