TW201133668A - Semiconductor cell, solar cell module, lead wire connection device and connection method - Google Patents

Abstract

To provide a solar cell module in which semiconductor cells connected by lead wires through adhesive conductive tapes can be easily connected at a low cost. The solar cell module has a plurality of semiconductor cells connected in array by lead wires, and each of the semiconductor cells has a plurality of finger electrodes formed on one surface as a light reception surface in parallel at predetermined intervals in a predetermined direction and also has a conductive metal film provided on the other surface, except an exposed part, at one end part and the other end part in a direction crossing the plurality of finger electrodes. One end part of each lead wire is connected to one surface of one of a pair of adjacent semiconductor cells in the direction crossing the plurality of finger electrodes, and the other end part of the lead wire is connected to the other surface of the other semiconductor cell through the adhesive conductive tape, at positions corresponding to removal parts formed at one end part and the other end part of the other surface.

Description

201133668 VI. INSTRUCTIONS: C TECHNICAL FIELD OF THE INVENTION FIELD OF THE INVENTION The present invention relates to a structure of a semiconductor element, a solar cell module in which the semiconductor element is connected in a row by wires, and a plurality of semiconductors for guiding the plurality of semiconductors The components are connected in a row of lead connecting devices and connection methods. c Prior Art 3 Background of the Invention Solar cells are available in crystalline and thin film types. In the crystalline solar cell, a plurality of semiconductor elements such as a single crystal germanium or a polycrystalline germanium are connected in a row as a row, and the group is formed by laminating a resin on a glass substrate. Such a solar cell module is disclosed in Patent Document 1. On the surface of the semiconductor element as the light-receiving surface, a plurality of finger electrodes are provided in a predetermined direction at a predetermined interval. Further, on the light receiving surface, a plurality of light receiving surface side bus bar electrodes are provided in a direction crossing the arrangement direction of the plurality of finger electrodes. A conductive metal film made of aluminum or the like is provided on the back surface of the semiconductor element, and the conductive metal film has the same number of back side bus bar electrodes in the same direction as the surface side of the semiconductor element. Then, one of the adjacent pairs of semiconductor elements is fixed to the end of the light-receiving surface side bus bar electrode provided on the surface of one of the semiconductor elements by solder connection, and the other end of the lead is fixed by solder connection at the other end. An end portion of the back side bus bar electrode on the back surface of the semiconductor element forms a plurality of semiconductor elements connected in a row. 201133668 The use of low-cost copper for each of the above-mentioned bus bar electrodes has been studied, and in order to improve the bonding property with the leads, silver is often used. CITATION LIST Patent Literature Patent Literature 1 Patent Publication No. 2008-205137 No. 3 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION As described above, the light-receiving side bus bar electrode and the back surface of the adjacent semiconductor element surface are In the case where the back side bus bar electrode is connected by solder to the lead wire, a bus step is required in order to provide the bus bar electrode to the semiconductor element. Therefore, the manufacture of a semiconductor element takes a lot of work and becomes a major factor leading to an increase in cost. Further, in order to improve the bonding property between the bus bar electrode and the lead wire and to make the bus bar electrode silver, the silver is expensive, and the cost is increased. The present invention is to provide a lead connecting device and a connecting method which can perform soldering of a plurality of semiconductor elements without causing damage to the semiconductor elements or deformation or strain. SUMMARY OF THE INVENTION The present invention provides a semiconductor element which can form a group without soldering of a lead, and a solar cell module using the same. Means for Solving the Problem The present invention is a wire connecting device for connecting a plurality of semiconductor elements of a semiconductor semiconductor element in a row by a lead wire, characterized by comprising: a supply portion of the semiconductor element; a tape attaching mechanism The adhesive conductive tape cut into a predetermined length is simultaneously attached to the upper surface and the lower surface of the semiconductor element supplied from the supply unit; and the transport mechanism supplies the conductive tape by the tape attaching mechanism. The semiconductor element is pitched to the semiconductor element above and below; the lead processing mechanism is formed by forming a shape in which the lead is bent in the vertical direction by dividing the intermediate portion in the longitudinal direction; The pre-compression mechanism is provided at a portion facing the semiconductor element fed by the distance of the transfer mechanism, and holds a lead formed by the lead processing mechanism, and is provided on the upper surface and the lower surface of the semiconductor element which is provided at a pitch feed. The conductive tape repeatedly performs pre-compression of the aforementioned leads, and the adjacent semiconductors are adjacent The upper and lower cross-connecting electrical connectors; and the final press-fit mechanism are disposed at a position opposite to the semiconductor element on the downstream side in the feed direction from the semiconductor element closer to the transfer mechanism than the pre-compression mechanism The pre-compression bonding mechanism is pre-compressed on the upper and lower surfaces of the semiconductor element, and the pair of the leads are simultaneously positively pressed; and the semiconductor element forms a plurality of fingers at predetermined intervals in a predetermined direction on one side of the light receiving surface. On the other surface, an exposed portion is left at one end and the other end of the direction intersecting the plurality of finger electrodes, and a conductive metal film is provided, and adjacent to the plurality of semiconductor elements connected in a row One of the semiconductor elements of one of the semiconductor elements of the pair of 201133668 conductors is connected to one end of the lead wire in a direction crossing the plurality of finger electrodes through the conductive tape, and on the other side of the other semiconductor element Transmissive conductivity at a position corresponding to the removal portion formed at one end and the other end of the other surface The tape is connected to the other end of the aforementioned lead. The invention is a method for wire bonding a semiconductor element, wherein a plurality of semiconductor elements are connected in a row by a lead, and the method comprises the steps of: simultaneously attaching an adhesive conductive tape to a top surface and a lower surface of a plurality of semiconductor elements; One end of one of the two lead wires and the other end portion of the other lead are simultaneously pre-compressed to the conductive tape provided on the upper surface and the lower surface of the semiconductor element, and the adjacent semiconductor element is The upper and lower sides are electrically connected to each other; and a pair of the leads are pre-compressed on the upper surface and the lower surface of the semiconductor element, and the pair of the leads are simultaneously press-fitted; and the semiconductor element is predetermined as a side of the light receiving surface in a predetermined direction. A plurality of finger electrodes are formed at intervals, and on the other surface, an exposed portion is left at one end portion and the other end portion in a direction intersecting the plurality of finger electrodes, and a plurality of semiconductor elements are connected in a row. One of the adjacent ones of the semiconductor elements of one of the adjacent semiconductor elements transmits the conductive The tape is connected to one end of the lead in a direction crossing the plurality of finger electrodes, and the other side of the other semiconductor element corresponds to the removed portion formed at one end and the other end of the other side of 201133668 Position the other end of the lead wire through a conductive tape. The present invention is a semiconductor element in which a plurality of finger electrodes are formed at predetermined intervals in a predetermined direction on one side of a light receiving surface by connecting wires in a row to form a solar cell module, and the other surface is provided on the other side. A conductive metal film is provided, and a removed portion from which the conductive metal film is removed is formed at one end and the other end of the other surface in a direction intersecting the predetermined direction. The invention is a solar cell module in which a plurality of semiconductor elements are connected in a row by wires, wherein the semiconductor element forms a plurality of finger electrodes at predetermined intervals in a predetermined direction on one side of the light receiving surface. On the other hand, a conductive metal film is provided at one end and the other end of the direction intersecting the plurality of finger electrodes, and one of the plurality of semiconductor elements connected in a row is adjacent to the semiconductor element. One of the semiconductor elements is connected to one end of the lead in a direction crossing the plurality of finger electrodes through an adhesive conductive tape, and the conductive is removed on the other side of the other semiconductor element The metal film is formed at a position corresponding to the removed portion of the other end portion and the other end portion, and the other end portion of the lead wire is connected through the adhesive conductive tape. Advantageous Effects of Invention According to the present invention, a conductive tape is attached to both the upper surface and the lower surface of the semiconductor element, and the pre-compression and final pressing of the conductive tape attached to the semiconductor element of 201133668 are performed on the upper surface and the lower surface in the same manner. . Therefore, it is difficult to apply uneven pressure or heat to the semiconductor element due to adhesion of the conductive tape or pre-compression and positive pressing of the leads, so that damage to the semiconductor or deformation or strain due to heat can be prevented. According to the invention, in a plurality of semiconductor elements connected in a row, one side and the other side of the adjacent pair of semiconductor elements are connected by wires by means of a conductive tape, so that the lead wires can be used without soldering. A plurality of semiconductor elements are connected in a row. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a schematic configuration of a lead connecting device according to an embodiment of the present invention. Fig. 2 is a side view showing the gantry of the attaching table provided with the tape attaching mechanism. Figure 3 is a plan view of the gantry shown in Figure 2. Fig. 4 is a side view showing the tape attaching portion in which the conductive tape is attached to the upper and lower surfaces of the semiconductor element supplied to the attaching stage. Fig. 5(a) is an explanatory view showing a state in which the adhesive tape attached to the separation tape is divided into a predetermined length, and Fig. 5(b) shows a state in which the adhesive tape divided into a predetermined length is removed from the separation tape. Illustrating. Fig. 6 is a view for explaining the procedure of transporting the semiconductor element from the supply unit to the transport unit by the first and second transfer devices. Fig. 7 is a side view showing a part of the endless belt of the conveying mechanism being cut off. Fig. 8 is a plan showing the arrangement state of the first and second upper blocks of the transfer mechanism and the pre-compression mechanism disposed above the lead processing mechanism on the side thereof. Fig. 9 is a plan for pre-compression of the leads. A side view showing a portion of the lower block and the upper block cut off from one of the upper and lower sides of the semiconductor component. Fig. 10A is a view showing a state before the lead forming processing mechanism takes the lead forming process. Fig. 10B is a view showing a state in which the lead forming processing mechanism shapes the lead. Fig. 11A is a view showing a first step of forming a group by connecting leads to a semiconductor element. Fig. 11B is a view showing a second step of forming a group by connecting leads to a semiconductor element. Fig. 11C is a view showing a third step of forming a group by connecting leads to a semiconductor element. Fig. 11D is a view showing a fourth step of forming a group by connecting leads to a semiconductor element. Fig. 11E is a view showing a fifth step of forming a group by connecting leads to a semiconductor element. Fig. 11F is a view showing a sixth step of forming a group by connecting leads to a semiconductor element. Figure 12 is a side view showing the structure of the formal press mechanism. Fig. 13 is a plan view showing a discharge mechanism for discharging a group in which a semiconductor element is transported by a transport mechanism from a transport mechanism. Figure 14 is a side view of the discharge mechanism shown in Figure 13. Fig. 15A is a plan view showing a group in which semiconductor elements are connected by leads. Figure 15B is a side elevational view of a portion of the group. 201133668 Fig. 16A is a plan view showing the surface of the semiconductor element as a light receiving surface. Fig. 16B is a plan view showing the back surface of the semiconductor element. Fig. 17 is a plan view showing the back surface of the semiconductor device of the second embodiment of the invention. Fig. 18 is a plan view showing the back surface of the semiconductor device of the third embodiment of the invention. Fig. 19 is a plan view showing the back surface of the semiconductor device of the fourth embodiment of the invention. C. Embodiment 3 Mode for Carrying Out the Invention Hereinafter, a first embodiment of the present invention will be described with reference to Figs. 1 to 16 . First, the schematic structure of the entire apparatus will be described. Fig. 1 is a plan view showing a schematic configuration of a lead connecting device having a rectangular plate-like base member 11. A supply portion 12 of the semiconductor element 1 is disposed on the upper surface of the base member 11 from the long end toward the other end, and the tape attaching mechanism 13 for attaching the conductive tape 3 to the upper and lower sides of the semiconductor element 1 is provided. In the upper and lower sides, the semiconductor element 1 to which the conductive tape 3 is attached by the tape attaching mechanism 13 is intermittently transported at a pitch. Three lead processing mechanisms 15a to 15c for forming a crank shape in which a plurality of semiconductor elements 1 sequentially supplied to the transport mechanism 14 are connected in a row are disposed on the side of one end of the transport mechanism 14 . The lead wire processing mechanism 15a to 15c is formed into a crank-shaped lead wire 2 to be disposed on the side of one end portion of the transport mechanism 14 . The 201110668 press mechanism 15 is pre-compressed to be transported by the transport mechanism 14 . Semiconductor element 1. As will be described later, by pre-compression bonding of the leads 2, a plurality of semiconductor elements are sequentially connected in a row, and are transported by the transfer mechanism 14. The transfer mechanism 14 is closer to the downstream side of the transport direction than the pre-compression mechanism 15, and is used to simultaneously press-fit the lead 2 pre-compressed by the pre-compression mechanism 15 to the upper surface of the semiconductor element 1 at the same time. A plurality of the main press-fit mechanisms 16 (shown only in the first line in the first embodiment) of the three embodiments are arranged at predetermined intervals. When the number of the semiconductor elements 1 connected in one row is 12 in the interval between the three main press-fit mechanisms 16, they are arranged at intervals of four times the integral pitch P of the semiconductor elements 1. Further, when the twelve semiconductor elements 1 are connected in a row, the three main press-fit mechanisms 16 face the first, fifth, and ninth semiconductor elements 1 in the transport direction so as to be pre-compressed. The leads 2 of the three semiconductor elements 1 are simultaneously positively pressed. Next, when 12 semiconductor elements 1 connected in a row are fed at a pitch of P, the three main press-fit mechanisms 16 are pre-compressed to the second, sixth, and tenth semiconductors. The lead 2 of the component 1 is formally pressed. By repeating this formal press-fitting four times, the three lead wires 2 that have been pre-compressed to the twelve semiconductor elements 1 can be formally pressed by the three main press-fit mechanisms 16. On the other side of the other end portion of the transport mechanism 14, 12 semiconductor elements 1 are formed which are connected in a row by the main press-fitting mechanism 16 and the lead wires 2 are integrally pressed together (the semiconductor elements 1 connected in a row are called The discharge mechanism 17 (as shown later in FIGS. 13 and 14) which is adsorbed and discharged from the transport mechanism 14 in the group 1A). 11 201133668 . The group 丨A carried out by the discharge mechanism 17 from the transport mechanism 丨4 is inspected by the inspection unit 18 of the i-th image, and the connection state of the bow line 2 is checked by image recognition, and then stored in the storage 19 to be carried out. Next, explain the structure of each department.

As shown in Fig. 1, the supply unit 12 has a first reservoir 2i and a second reservoir > The conveyance direction of the conveyance mechanism 14 (this direction is referred to as the X direction) and the direction (this direction is referred to as the Y direction) are separated. In addition, the X direction and the ¥ direction are indicated by arrows in Fig. 1 . Each of the reservoirs 21, 22 has a cassette 23, and the cassettes 23 provided with the respective reservoirs 21, 22 of the above-mentioned half-pieces 1 are spaced apart in the +? direction. . . At the end of each of the reservoirs 21, 22, a reservoir 21 and a cartridge 23 of another storage benefit 22 can be fed in the -γ direction and the +γ direction, respectively, and positioned in the direction of each reservoir 2 The center of the transfer position De - the semiconductor component positioned at the transfer position D of the box 23 can be adsorbed to the calibration platform 25 after being adsorbed by the first transfer device 24 shown in FIG. The semiconductor element 1 supplied to the target platform 25 is photographed by the camera 26 disposed above it to check the appearance and the recognized position in accordance with the photographing. When the appearance of the semiconductor element 1 is defective and it is determined to be defective, the semiconductor element 1 is discharged by the above-described first transfer device 24 in accordance with an instruction of a control device not shown in the drawing, and when it is judged to be a good product, The first delivery device 24 alternately supplies the first attachment stage 35 and the second attachment stage 36 (described later) placed on the tape attachment mechanism 13. At the transfer position D, the cassette 23 that has been removed by the first transfer device 24 and removed from the semiconductor element is moved in the -X direction, and is discharged from the end thereof, and then supplied to the semiconductor element 1 of 12 201133668, and returned to the first or second. The reservoirs 21 and 22 repeatedly perform the above operations. As shown in Fig. 6, the first transfer device 24 has a movable body 28 that can drive the X · Y . Z drive source 27 in the horizontal direction and the vertical direction. The movable body 28 is provided with four suction pads 29 (only two are shown) for sucking the four corner portions of the upper surface of the semiconductor element 1. Thereby, the first transfer device 24 can transfer the semiconductor element 1 by transferring the four corners on the upper surface of the semiconductor element 1 of the cassette 23 by the four adsorption pads 29 at the transfer position D. The semiconductor element 1 in which the appearance and the identification position are inspected by the above-described calibration platform is supplied to the tape attaching mechanism 13 by the first transfer device 24 described above. Further, the transfer from the calibration platform 25 to the semiconductor element 1 of the tape attaching mechanism 13 may be performed using another transfer device without using the first transfer device 24, and this is not limited. As shown in Fig. 1, the tape attaching mechanism 13 has a first tape attaching portion 31 and a second tape attaching portion 32 having the same configuration and arranged symmetrically in the Y direction, centering on the transport mechanism 14. The first and second tape attaching portions 31 and 32 are configured as shown in Figs. 2 to 5 . That is, the tape attaching mechanism 13 described above has the gantry 33 provided along the Y direction. As shown by the arrows in Fig. 3, a pair of Y rails 34 are laid on both ends of the gantry 33 in the width direction of the X direction. The first attaching table 35 and the second attaching table 36 are provided on the Y rail 34 in a state of being movable along the Y rail 34. As shown in Figs. 2 and 3, a connecting piece 37 is provided on the lower surface of one end portion 13 201133668 of each of the attaching stages 35. An endless belt 41 that is stretched over the driving pulley 38 and the driven pulley 39 is connected to each of the connecting pieces 37. A pair of drive pulleys % can be driven to rotate by the motor 42 respectively. Thereby, the first attaching table 35 can drive back and forth between the one end portion of the gantry 33 along the Y direction and the central portion. The second attaching table 36 can be along the other end and the central portion of the gantry 33 along the Y direction. Drive back and forth. Each of the attaching stages 35 and 36 that is driven to the central portion of the gantry 33 in the Y direction is shown by a chain line in Fig. i. As shown in Fig. 3, three through holes 43 penetrating the lower surface are formed in the first and second attaching stages 35 and 36. The through holes 43 extend in the X direction and are formed at predetermined intervals along the Y direction. As shown in Fig. 1, the first tape attaching portion 31 is provided at one end of the gantry in the Y direction, and the second tape attaching portion 32 is provided at the other end. As shown in Fig. 4, each of the tape attaching portions 31, 32 has a supply reel 44 disposed above and below one end portion of each of the attaching stages 35, 36 in the X direction. As shown in Figs. 5(a) and 5(b), the conductive tape 3 attached to the separation tape 4 is wound around the supply reel 44. The conductive tape 3 which is pulled out from the supply reel 44 together with the separation tape 4 forms a pair of cutting lines 3a shown in Fig. 5(a) by a cutting mechanism 4a formed of a cutter. The pair of cutting wires 3a are formed on the conductive tape at a predetermined interval, that is, at intervals corresponding to the width dimension of the semiconductor element 1. The portion of the conductive tape 3 which is cut by the pair of cutting lines 3 & is removed by the excavation apparatus 4 to form the gap c shown in Fig. 5(b). Thereby, the conductive tape 3 is divided into lengths corresponding to the width dimension of the semiconductor element 丨. In addition, since the excavation equipment 40 is a well-known technique, detailed description is omitted here at 201133668. In this manner, the conductive tape 3 divided into a predetermined length is guided together with the separation tape 4 by the pair of guide rollers 4a, and is moved in parallel to the upper surface and the lower surface of the first and second attachment stages 35, 36. The upper pressing tool 46a and the lower pressing tool 46b are driven in the vertical direction by upper and lower driving sources 45 such as cylinders, respectively, above and below the portion in which the conductive tape 3 is moved in parallel. The semiconductor element 1 supplied to the calibration platform 25 and having the inspection appearance and the identification position is supplied by the first transfer device 24 from the calibration platform 25 to the first or the first portion placed in the central portion of the gantry in the Y direction. 2 Attachment table 3 5, 3 6 When the first attaching stage 35 or the second attaching stage 36 on which the semiconductor element 1 is placed is driven from the central portion of the gantry in the Y direction to the one end portion or the other end portion, the upper pressing tool 46a and the lower portion are provided. The pressurizing tool 46b is simultaneously driven in the ascending direction and the descending direction. Thereby, the pressing tools 46a and 46b divide the conductive tape 3 into a predetermined length by the separation tape 4 while contacting the upper surface and the lower surface of the semiconductor element 1 and then pressing and attaching. Thereafter, the separation tape 4 is peeled off from the conductive tape 3 attached to the semiconductor element 1 by a separation roller or the like (not shown), and is wound around the winding reel 47. In other words, the semiconductor element 1 that has been inspected for the appearance and the identification position by the calibration platform is alternately supplied to the first attaching stage 35 and the second attaching stage 36, and the first tape attaching portion 31 and the second tape attaching portion 32 are provided. Attach a conductive tape 3 to it. The first and second tape attaching portions 31 and 32 have three sets of supply reels 44, a winding reel 47, and upper and lower portions which are disposed above and below the first and second 15 201133668 attaching stages 35 and 36. The tools 46a, 46b are pressed. Thereby, each of the three conductive tapes 3 can be simultaneously brought into contact with the upper and lower pressing tools 46a and 46b of the conductive tapes 3 while being pressure-bonded to the upper and lower surfaces of the semiconductor element 1. By attaching the conductive tape 3 to the lower surface of the semiconductor element 1 at the same time, the semiconductor element 1 is temporarily positioned, and the conductive tape 3 can be precisely positioned on the upper and lower sides thereof and attached. That is, in order to attach the conductive tape 3 to the upper surface and the lower surface of the semiconductor element 1, the conductive tape 3 is attached to one surface of the semiconductor element 1, and then the semiconductor element 1 is vertically inverted, and the conductive tape 3 is attached. When the other surface is attached, when the semiconductor element 1 is reversed upside down, a positional shift occurs, and the conductive tape 3 cannot be accurately positioned on the upper and lower sides thereof for attachment, or the erroneous equipment is complicated or reversed. The required time' leads to a decrease in productivity. However, as described above, by attaching the conductive tape 3 to the upper and lower sides of the semiconductor element, it is possible to improve the attaching accuracy and productivity, and to simplify the equipment. Further, the number of the conductive tapes 3 attached to the upper and lower sides of the semiconductor element 1 is not limited to three, and may be two or four, and the number thereof may be set in accordance with the configuration of the semiconductor device.

Further, when the number of the conductive tapes 3 attached to the upper and lower sides of the semiconductor element 1 is plural, the conductive tape 3 may be pre-compressed one by one on the upper and lower sides of the semiconductor element 1. In this case, one set of supply reels 44, a winding reel 47, and upper and lower pressurizing tools 46a and 46b are provided in each of the first and second tape attaching portions 31 and 32, and one conductive tape 3' is attached to each of them. The first 'second attachment stations 35 and 36 are moved by a predetermined distance in the direction of Y 201133668, and the next conductive tape 3 is attached. In other words, by providing only one set of the supply reel 44, the winding reel 47, and the upper and lower pressing tools 46a and 46b in each of the tape attaching portions 31 and 32, the tape attaching portion 31 can be obtained. The structure of 32 is simplified and miniaturized. When three conductive tapes 3 are attached to the upper surface and the lower surface of the semiconductor element 1 supplied to the first tape attaching portion 31 and the second tape attaching portion 32, the first attach of the semiconductor device 1 is placed. The stage 32 and the second attaching stage 36 are alternately driven from one end and the other end of the gantry 33 in the Y direction, and are positioned at the center. As shown in FIG. 6, the semiconductor element 1 positioned on the first attaching stage 35 or the second attaching stage 36 at the central portion of the gantry 33 is a second transfer device 48 that can be driven in the horizontal direction and the vertical direction. The adsorption holding is supplied to the attaching inspection platform 49 provided between the tape applying mechanism 13 and the conveying mechanism 14. In addition, since the second delivery device 48 has the same configuration as the above-described first delivery device 24, the same reference numerals will be given to the same portions, and description thereof will be omitted. In the above-described attaching inspection platform 49, the upper and lower surfaces are simultaneously imaged by the imaging camera 51 disposed in the upper and lower directions to inspect the attached state of the conductive tape 3 attached to the upper and lower surfaces of the semiconductor element 1, for example, whether or not there is curling or the like. . As a result of the photographing by the photographing camera 51, if it is defective, it is discharged in accordance with a command from a control device not shown in the drawing, and if it is a good product, it is supplied to the transporting mechanism 14 by the second transfer device 48. As shown in Fig. 7 or Fig. 13, the transfer mechanism 14 has a pair of endless belts 53 separated in the Y direction at intervals smaller than the width dimension of the semiconductor element 1. As shown in Fig. 7, the endless belt 53 is stretched over the drive pulley 54 and the driven pulley 55. The drive pulley 54 is rotated by the motor 56 shown in Fig. 8, and the upper end side of the endless belt 53 is moved from the -X direction to the +X direction. The direction of movement of the endless belt 53 is shown in Fig. 8 by the + arrow. The endless belts 53 are intermittently driven at a predetermined interval. This pitch PS is shown by P in Fig. 13 and is the same distance as the interval between the adjacent semiconductor elements 1 which are connected in a row by the leads 2. As shown in Figs. 7 and 8, in the endless belt 53, a plurality of suction holes 53a penetrating in the thickness direction are bored at predetermined intervals in the X direction. Between the lower inner faces of the endless belt 53, the block body 57 is provided with its upper and lower faces contacting the portion of the endless belt 53 which is located below the inner peripheral surface. The block 57 is formed with a suction path 58 along the long direction. The plurality of minute holes 58a opened from the suction path 58 on the upper surface of the block 57 are formed to be spaced apart from each other by the suction holes 53a penetrating the endless belt 53. Further, the branch hole 58a may be formed to open under the block 57. One end of the suction path 58 is closed, and the suction pump 59 is connected to the other end. Thereby, when the suction pump 59 is actuated, the suction port 53 and the branch hole 58a generate an attractive force in the suction hole 53a of the endless belt 53. Further, the interval between the above-mentioned suction holes 53a is set to be one-half of the distance P between the intermittent driving of the endless belt 53, or the same as the pitch P. Thereby, the suction hole 53a of the endless belt 53 is aligned with the branch hole 58a of the block 57 before the endless belt 53 is driven, and even if the endless belt 53 is intermittently driven, it is always opposed. By doing so, when the semiconductor element 1 is pre-compressed or the lead 2 is formally pressed, the positioned semiconductor element 1 can be positioned and held without being displaced on the endless belt 53. 18 201133668 As shown in Fig. 8, the pre-compression mechanism 15 is disposed between the pair of endless belts 53 and the outer side at one end of the direction of the endless belt 53 constituting the conveying mechanism 14, for a total of three groups. Lower portion pressing member 60. Each of the three sets of pressurizing members 60 is composed of a first lower block 61 and a second lower block 62 which are disposed at predetermined intervals in the X direction, and each block, that is, a total of six blocks 61 and 62 are respectively fixed and fixed. The upper and lower drive mechanisms 63 (shown in Fig. 9), such as an air cylinder, can be integrally driven on the upper surface of the mounting plate 63a. The upper end surface of the first lower block 61 has a flat first receiving surface 61a, and the upper end surface of the second lower block 62 has a second receiving surface 62a located slightly lower than the second receiving surface 61a. The suction holes 61b and 62b' are formed in the first receiving surface 61a and the second receiving surface 62a, and the suction holes 61a and 62b are formed in the openings, so that the suction pump (not shown) generates an attractive force. The lead wires 2 formed into a crank shape by the first to third lead processing mechanisms 15a to 15c on the side of the end portion of the transfer mechanism 14 can be simultaneously supplied to the three sets of the lower blocks 61 and 62. Above. As shown in Fig. 10A and the brain diagram, each of the lead processing mechanisms i5a to ...... has a supply reel 65 in which the above-described lead 2 is wound. This supply reel lead 2 is pulled by the pull-out claw 66 and pulled out. Further, the lead 2 is in the form of a strip. ★ The above-mentioned pull-out claw 66 may be a cylinder which is not shown in the figure or a metal wire which is cyclically moved, and is equal to the first GA map which is swung back and forth in the direction indicated by the arrow. Thereby, the lead wire 2 can be pulled out from the supply reel 65 in the -X direction. The above-mentioned lead 2 which is pulled out in the -X direction by the above-described pull-out claw 66 can pass through the holder 68, the first! The cutter 69 is divided into the upper block 7ia and the ith lower block plus the first holding portion 71 of 201133668, the forming module 72 composed of the upper and lower molds 723 and 72b, and the second upper block 73a and the second The second holding portion 73 of the lower block m and the second cutter 74. A discard cassette 75 is disposed on the downstream side of the second cutter 74 in the pull-out direction. The upper first block of the first to third lead processing units 15a to 15c and the second upper block of the second holding portion 73 =: = the lower surface of the mounting plate 77 shown in Figs. 8 and 9 . - As shown in Fig. 9, the lower end surface of the first upper block 第 of the i-th holding portion 71 is set to be slightly higher than the lower end surface of the second upper block 第 of the second holding portion 73. Further, the upper blocks 71a and 73a are formed with suction holes 82 which are open at the lower end faces. The upper end surface of the first lower block 71b of the holding portion 71 is set to be slightly back, and the upper end surface of the second lower block 73b of the second holding portion 73 is provided. The mounting plate 77 is mounted on the lower surface of the plate-like movable member 79 shown in Figs. 8 and 9 in a plurality of up and down air (four) in the vertical direction. The movable member 79 can be driven in the gamma direction by the horizontal cylinder 78.卜" The upper block 71a, 7 is the upper pressing member of the pre-compression mechanism 15 described above. "From the state shown in Fig. 10A, as shown in Fig. ia, pull out the above-mentioned bow U(10)~ from the first]. Reel & the supply of the lead 2 when the twist line 2 of the claw is pulled out as described above. The base end portion of the reel (6) can be held by the above-described disengagement device 68. At the same time, as shown in Fig. 8, the first holding portion 71 that is in standby of the third to third lead processing means 5C and The second holding portion 73 20 201133668 The first and second upper blocks 71a and 73a can be driven in the descending direction by the upper and lower cylinders 81, and can be sucked and held by the suction holes 82 which are open at the lower end faces of the upper blocks 71a and 73a. The lead wire 2 pulled out by the pull-out claw 66 before the processing. Next, the molding die 72 is actuated in the closing direction to form the inclined portion 2s at the center portion of the lead wire 2. At the same time, the pair of cutters 69, 74 are actuated. The lead wire 2 pulled out from the supply reel 65 is cut to a length corresponding to the size between the pair of cutters 6 9 and 7 4. The lead 2 is closer to the downstream side than the second cutter 74 The portion is discharged to the discard cassette 75. Further, one end portion and the other end portion of the lead wire 2 are formed at different heights due to the inclined portion 2s. The difference in height corresponds to the size of the thickness of the semiconductor element 1, for example, a very small size of about 1 mm. When the formation and cutting of the lead 2 of the first to third lead processing mechanisms 15a to 15c are completed, the above After the molding die 72 is driven in the opening direction, it is driven in the horizontal direction perpendicularly intersecting the lead wires 2, and is retracted from the upper and lower directions of the lead wires 2. Then, the upper blocks 71a of the first and second holding portions 71 and 73 are respectively The lower end surface of the 73a is sucked and held by the formed lead wire 2. Then, the mounting plate 77 to which the upper block bodies 71a and 73a are attached is driven in the ascending direction, and the movable member 79 to which the mounting plate 77 is attached can be horizontally 78 is driven in the -Y direction, and the lead 2 adsorbed and held by the lower end faces of the upper blocks 71a and 73a is positioned at the first and second blocks 61 and 62 of the lower pressing member 60 provided at one end of the conveying mechanism 14. When the formed lead 2 is positioned above the first and second blocks 61 and 62 of the lower pressing member 60, the upper blocks 71a and 73a can be driven in the descending direction, as shown in FIG. 11A. Formed processing lead 2 (2a) handover 21 201133668 The first and second receiving faces 61a and 62a of the upper end faces of the first and second blocks 61 and 62 are sucked and held. Thus, after the lead wires 2 are adsorbed and held by the second and second receiving faces 61a and 62a, The lead wire 2 is located on the second receiving surface 62& of the second lower block 62, and the other end portion of the fourth curved portion to the lower side is as shown in FIG. 11B, and is placed on the upper and lower surfaces by the second transfer device 4. The semiconductor element 1 of the three conductive tapes 3 is attached. When the semiconductor element 1 is placed on the other end of the lead 2, the first and second blocks 61 and 62 are driven in the lowering direction. After the drive is transferred to the transport mechanism 14, the transport mechanism 14 attaches the semiconductor element 丨 intermittent transport pitch to the end of one of the leads 2 (2a). The distance. This state is shown in Figure 11C. When the semiconductor element 1 is fed at a pitch, as shown in Fig. 11D, the first lower block 61 and the second lower block 62 are driven in the ascending direction. Thereby, the semiconductor element 1 to which the other end portion of the lead 2 is attached is raised from the endless belt 53 of the transport mechanism 14 by the first receiving surface 61a of the first lower block 61. Thereafter, the formed lower lead 2 (2b) is adsorbed and held by the upper holding portions 71 and the second holding portions 73 above the blocks 71a and 73a. One end of the lead 2 (2b) is supplied to the upper surface of the semiconductor element 1 which is held by the lead 2 (2a) and held on the second receiving surface 61a of the first lower block 61 of the lower pressing member 60, corresponding to the conductive tape. At the position of 3, the other end is supplied to the receiving surface 62a of the second lower block 62 of the lower pressing member 60. Thereby, the semiconductor element j held by the receiving surface 61a of the first lower block 61 can be pressed and attached to the receiving surface 61a of the first lower block 61 and the lower end surface of the first upper block 71a at the same time as 22 201133668. The other end of the lead 2 (23) below it and one end of the lead 2 (2b) attached thereto. Namely, the other end portion of the lead 2 (2a) which is first supplied to the upper and lower sides of the semiconductor element 1 and the one end portion of the next supplied lead 2 (213) can be simultaneously pre-compressed. Further, when the lead wires 2 formed by the first to third lead processing mechanisms 15a to 15c are taken out from the first upper block 71a and the second upper block 73', the upper and lower cylinders 81 are opposed to the upper blocks 7ia and ^. The applied pressure is set to be higher than the pressure at which the lead 2 is pre-compressed to the semiconductor element 1. Thus, when the lead wires 2 can be detached from the lead wire processing mechanisms 15a to 15c and pre-compressed, the pressure is lower than that at the time of taking out, and the lead wires 2 can be prevented from being displaced from the conductive tape 3 attached to the semiconductor. Further, the first holding portion 71 and the second holding portion 73 are attached to the one-piece mounting plate 77, and each of the holding portions (7) can be attached to a different mounting plate, and the upper and lower cylinders 1 can be individually driven up and down. When this is done, 'when the lead 2 is adsorbed', the (four)® force that is supplied to the upper and lower cylinders 81 is controlled so that the holding portions 71 and 73 can abut the lead at the same pressure to pre-compress the semiconductor element 1 to the lead 2. The pressure of the gas supplied to the pair of upper and lower cylinders 81 can be controlled as described later, so that the reading force of each of the holding portions 71 and 73 (10) of the half navigation member 1 is optimal, and damage of the semiconductor element 1 can be prevented. In this way, when the lead wires 2 (2a, 2b) are pre-compressed to the upper and lower sides of the second semiconductor element 1 supplied, the first holding portion 71 and the second holding portion 73 are provided. The block body 7la, 71 a γι ^ l is moved in the +γ direction indicated by the arrow in Fig. 8 (the latter is shown in the figure, the next semiconductor device 23 is supplied to the next semiconductor device 23 201133668 To the other end of the lead 2 (2b), the lower conductive tape 3 is attached to the lead 2 (2b). Next, the first and second blocks 61 and 62 are driven in the descending direction, and the lead is used. After the two (2b) electrically connected two semiconductor elements 1 are transferred to the endless belt 53, as shown in Fig. 11F, the semiconductor elements 1 are intermittently fed by the endless belt 53 at a distance P. Thereafter, The lower end surface is sucked and held, and the upper bodies 71a and 73a of the lead wire 2 are driven in the -Y direction, and are positioned above the endless belt 53 of the conveying mechanism 14, and then driven in the descending direction, as in the 11F chain. As shown, the lead 2 (2c) can be supplied. The lead 2 (2c) is supplied to the semiconductor element 1 positioned on the receiving surface 61a of the first lower block 61. The other end portion is supplied to the second receiving surface 62a of the second lower block 62. Thereby, the first lower block is formed on the lower surface and the upper surface of the semiconductor element 1 on the receiving surface 61a of the first lower block 61. The receiving surface 61a of the body 61 and the lower end surface of the first upper block 71a are pressed to pre-compress the other end of the lead 2 (2b) and one end of the lead 2 (2c). By performing such pre-compression, A plurality of, for example, 12 semiconductor elements 1 are formed as shown in FIG. 15A, and the arrays 1A of the solar cell modules are connected in a row by the leads 2a to 2n. That is, the other end and the one end of the lead 2 are formed. The group 1A of the pre-compression state of the lower surface and the upper surface of the semiconductor element 1 is preliminarily pressed.

In this manner, when the other end portion and the one end portion of the lead 2 are sequentially pre-compressed on the lower surface and the upper surface of the semiconductor element 1 to form the group 1A 24 201133668 in the pre-compression state, the semiconductor element 1 constituting the group 1A is formed. The number can be not only 12 but also any number. Further, when the semiconductor element 1 provided only in one of the first block body 61 and the second block body 62 is pre-compressed with the lead wire 2 as in the case of the 11th, 11th, and 11th, as described above, When the first holding portion 71 and the second holding portion 73 are coupled to the upper and lower cylinders 81 by different mounting plates, the pressure applied to the one of the holding portions 71 or 73 for pre-compression bonding the semiconductor element 1 to the lead wires 2 can be applied. Set to be smaller than the other holding portion. Thereby, it is possible to prevent the semiconductor element 1 from being excessively pressed and damaged. The transport unit 14 transports the array 1 of the pre-compression state of the twelve semiconductors 1 , and the semiconductor element 1 at the tip end is transferred to the final press mechanism 16 at the foremost end in the +Χ direction of the three main press mechanisms 16 . At the relative position, the lead wires 2 pre-compressed to the first, fifth, and ninth semiconductor elements 1 are simultaneously positively pressed by the three main press-fit mechanisms 16. As shown in Fig. 12, the main pressing mechanism 16 has a plate-shaped upper movable member 86 disposed above the endless belt 53 of the conveying mechanism 14, and can be vertically driven by the upper cylinder 85, and can be disposed below, and the lower cylinder 87 can be disposed. The plate-shaped lower movable member 88 is driven up and down. The upper movable member 86 is provided with three upper pressing tools 91 heated by the heater 91a at a predetermined interval below. On the upper surface of the lower movable member 88, three lower pressing tools 92 heated by a heater 92a are provided at positions corresponding to the upper pressing tool 91. Further, the driving of the upper and lower pressing tools 91 and the lower pressing tool 92 of the respective cylinders 85 and 87 can be performed in two stages of the stroke. 25 201133668 Each of the pressurizing tools 91 and 92 is provided at an interval corresponding to each of the three leads 2 pre-compressed to the upper and lower sides of the semiconductor element 1. An upper buffer belt 94 is interposed between the upper pressing tool 91 and the upper surface of the semiconductor element 1, and a lower buffer belt 95 is interposed between the lower pressing tool 92 and the lower surface of the semiconductor element 1. Each of the buffer belts 94, 95 is wound from the supply reel 96, guided by a pair of bow guides 97, and moved in parallel on the upper surface and the lower surface of the semiconductor element 1, and wound around the winding reel 98. Further, although not shown in the detail view, the supply reel 96, the guide roller 97, and the winding reel 98 on the upper side and the lower side may be combined with the pressing tools 91, 92 on the upper side and the lower side of the above-described main pressing mechanism 16. Move up and down in one body. When the first, fifth, and ninth semiconductor elements 1 are positioned on the three main pressing mechanisms 16 when the above-described group 1A' is transported, the upper pressing tool 91 of each of the main pressing mechanisms 16 is driven in the descending direction. The lower pressing tool 92 is driven in the ascending direction. Thereby, each of the three lead wires 2, which are pre-compressed to the upper, lower, and lower surfaces of the first, fifth, and ninth semiconductor elements 1 of the group 1A, are pressurized by the pressurizing tools 91 and 92. heating. As a result, the conductive tape 3 to which the lead 2 is attached to the semiconductor element 1 is thermally melt-hardened by the upper and lower pressing tools 91 and 92, so that the lead 2 is integrally pressed against the upper surface and the lower surface of the semiconductor element 1. That is, the leads 2 are formally pressed together at the same time, that is, at the same time, above and below the semiconductor element. Further, the driving of the upper pressurizing tool 91 and the lower pressurizing tool 92 by the respective cylinders 85, 87 at the time of the final press-fitting are performed in the rising and descending directions of the two-stage stroke. This reduces the tact time required for formal press fit. 26 201133668 In this manner, when the first, fifth, and ninth semiconductor elements 1 of the group 1A are formally pressed together with the lead 2, the group 1A can intermittently transport the pitch p. Thereby, the second, sixth, and first semiconductor elements can be positioned opposite each other to the three main press mechanisms 16. After that, the three main press-fit mechanisms 16 are actuated, and the semiconductor elements 1 are finally press-fitted to the lead wires 2, and then the group 1A is intermittently moved at a pitch p to perform the final press-fitting operation for a total of four times. The lead wires 2 pre-compressed to the 12 semiconductor elements 1 can be formally pressed. In this manner, the array 1A of all the leads 2 connected to the two semiconductor elements 正式 is press-fitted, and the discharge mechanism 17 is carried out from the transport mechanism 14 and stored in the storage 19 . When the discharge mechanism 17 is moved out of the group, the upper pressing device 91 and the lower holding device 92 of each of the main pressing mechanisms 16 can be driven by a large stroke of each of the air and π. Therefore, since the interval between the upper pressurizing tool 91 and the lower pressurizing tool can be made relatively large, the adsorption enthalpy (9) of the discharge mechanism 17 can be surely inserted between the upper pressurizing tool 91 and the lower pressurizing tool%. .

As shown in Fig. 13, the discharge mechanism 17 has a long water __丨 corresponding to the above _A. The horizontal movable member (8) may be plural, the yarn 2 is equal to the position of the yarn, and the position in the Y direction is driven to retreat from the position in the Y direction, and the material is placed in the standby position above the storage 19 as in the time line and in the chain line. The upper and lower movable members 104 are provided below the horizontal movable member ιοί in a state in which the upper and lower movable members 104 are driven in the upper and lower directions by a plurality of 27, 2011,668,668 upper and lower air cylinders, as shown in FIGS. 13 and 14 . . Here, the movable member 1〇4 is moved up and down to hold a plurality of tanks of the semiconductor elements of the group 1A, and 12 sets of adsorption pads 1〇5 (only two are shown in FIG. 14). Make the axis vertical. Each of the adsorption pads 105 is connected to a suction pump (not shown) to generate an attractive force. When the lead wires 2 of the twelve semiconductor elements of the above-mentioned group 1A are finally pressed, the horizontal movable member (8) can be driven by the horizontal cylinder 102 to be positioned above the group 1A above the transport mechanism 14. Next, the upper and lower cylinders 103 are actuated, and the upper and lower movable members 1 to 4 are driven in the descending direction. Thereby, each of the four adsorption pads 105 provided in the upper and lower movable members 104 can adsorb the upper four corners of the twelve semiconductor elements. When the adsorption 塾1G5 adsorbs the semiconductor element 1, the upper and lower movable members 104 rise, and the horizontal movable member 1〇1 is driven in the backward direction in the +γ direction.

The crucible is located above the inspection unit 18. The group is supplied to the inspection unit H. Here, the connection state of the lead 2 connected to the upper and lower sides is checked. After the judgment is made, the storage unit 19 stored in the +Y direction in the backward direction is stored in the setting inspection unit. The 12 semiconductor components 1 are connected in an inline group 1A and are finally required to generate power. On the other hand, the power generation of each semiconductor element is deviated. Therefore, it is the first in the supply department 12! The memory 21 and the second memory are different semiconductor elements i for generating electric power. Then, the group constituting the predetermined generated power is supplied to the supply unit by the power generation unit 1A of the required group 1A. (4) Attachment mechanism (10) Number of semiconductor elements 1 of the first memory 21 and second storage The semiconductor of the device 22, 201133668, is the number of the components 1 and can constitute the group 1A of the generated power generation. In other words, the supply unit 12 is provided with the first storage unit and the second storage unit 2, and even if the output power of each semiconductor element is different, the power generation power of the group can be set to the required generated power. As described above, according to the lead wire connecting device of the above configuration, when the conductive tape 3 cut to a predetermined length is attached to the upper surface and the lower surface of the semiconductor element, the upper and lower surfaces of the semiconductor element 1 can be simultaneously performed. Therefore, when the conductive tape 3 is attached to the semiconductor element 1, the semiconductor element is not required to be used! The bending is performed above or below, so that cracking of the +conductor element 1 can be prevented. Further, since the conductive tape 3 can be simultaneously applied to the upper and lower surfaces of the +conductor element 1, the productivity can be improved as compared with the case of the individual, or the device structure can be miniaturized. In the case of the lead 2 of the predetermined shape, the pre-compression is performed simultaneously on the upper and lower sides of the above-mentioned semiconductor element 1. Therefore, the semiconductor element 1 can be prevented from being broken by the semiconductor element 1 without being bent in the upper direction or the lower direction. Further, since the lead wires 2 can be pre-compressed simultaneously on the upper and lower sides of the semiconductor element 1, the productivity can be improved or the structure of the device can be simplified as compared with the case of individual. Further, when the lead wires 2 which have been pre-compressed to the upper and lower sides of the semiconductor element 1 are formally pressed together, the above-mentioned semiconductor device i can be simultaneously and indirectly formed. Therefore, the semiconductor element 1 can be prevented from being broken by the semiconductor element 1 without being bent in the upper or lower direction. And 29 201133668

Therefore, compared with the side (4), it is possible to improve productivity or to simplify the structure of the device. Since the semiconductor element 1 is provided in the upper press

The conditions are uniformly heated. Therefore, in the case of the final press-fitting, the 91 and the lower pressurizing tool 92 are simultaneously and identically. Therefore, even if the semiconductor element 1 is heated by the pressurizing tools 91 and 92, thermal deformation or thermal strain is less likely to occur. Further, when a plurality of semiconductor elements are connected in a row by the interval 2 of the lead wires 2 to form a column 1A, a plurality of the main press-fit mechanisms 16 arranged at intervals of an integral multiple of p between the semiconductor elements 丨 are formed. At the same time, the lead wires 2 connected to the plurality of semiconductor elements are formally pressed together. Then, after the final press-fitting, the group 1A is intermittently conveyed at a pitch P, and the main press-fitting by a plurality of the main press-fit mechanisms 16 can be repeated repeatedly. Therefore, the main press-fit mechanism 16 can simultaneously perform the final press-fitting of the lead wires 2 which have been pre-compressed with the plurality of semiconductor elements 1 at a good efficiency. On the other hand, the semiconductor element 构成 constituting the above-described group 歹彳1A is formed into a structure shown in Figs. 16A and 16B. Fig. 16A shows the surface of the semiconductor element j on the light-receiving surface side, and Fig. 16B shows the back surface. An anti-reflection film 111 is provided on the surface of the above-mentioned semiconductor element 1, and a surface of the anti-reflection film is used. A sintered-type conductive paste is used, and a plurality of finger electrodes 112 are formed in parallel at predetermined intervals with respect to a predetermined direction. 30 201133668 The surface of the semiconductor is described in the figure. In the figure, the significant conductivity of the chain is "3" in the direction of the above-mentioned tape_machine phase//, the direction of the upper object, and the direction is parallel and parallel to each other in the predetermined direction. It is attached to almost the entire length. The surface of the above-mentioned semiconductor parts is connected by one of the three conductive tapes 3, the above-mentioned f-coupling mechanism 15 and the main pressing mechanism 16 to one end of the lead 2 and the buckle. In other words, the semiconductor element and the end portion of the connection lead 2 are not conventionally provided, and a bus electrode is provided. The conductive metal film m is provided on the inside of the semiconductor element i by deposition or the like. The conductive metal film μ is removed from the peripheral portion of the semiconductor element 1 at the entire circumference of the semiconductor, and the wire portion is bonded to the surface of the conductive metal film m and the surface of the half (four) device. The portion corresponding to the portion is the surface of the surface, and the end portion and the other end portion of the pre-twisting direction are overlapped by the same width as the width of the conductive tape 3 The second removal of the part 115 The second removing portion 116 is opened on the outer periphery of the semiconductor element 1 by the first removing portion 115. On the back surface of the semiconductor element k, three conductive tapes 3 on the surface side of the semiconductor element 1 The three conductive tapes 3 are attached to the tape attaching mechanism 13 at the same position. Thereby, both end portions of the conductive tape 3 on the back side are attached to the second removal formed on the back surface of the semiconductor device. The other portion of the portion 116 is attached to the conductive metal film 114. As shown in Fig. 15B, the three conductive layers 31 on the back surface of the semiconductor device 31 are in the form of the pre-compression mechanism 15 and the final press-fit. The mechanism 16 is connected to the other end of the lead 2. That is, since the other end of the lead 2 is connected to the back surface of the semiconductor element 1, the bus bar electrode is not provided as is conventional. The conductive tape 3 on the surface of the adjacent one of the plurality of semiconductor elements i in a row and the conductive tape 3 provided on the back side are connected to one end and the other end of the lead 2 to form the 15A Above The group ία. Thus, the bus bar electrodes are not disposed on the surface and the back surface of the semiconductor device, and the adjacent ones of the semiconductor elements 1 are connected by the conductive tape 3 by the leads 2, and the leads 2 can be connected with solder. In the conventional bus bar electrode, the bonding property of the lead wire 2 is improved. The conductive tape 3 for connecting the lead wire 2 to the semiconductor device is cheaper than the silver bus bar electrode, and can be easily formed in a simple step. In the back surface of the semiconductor element 1, the both ends of the conductive tape 3 are attached to the second removal portion 116 from which the conductive metal film 114 formed on the back surface is removed. Both ends of the conductive tape 3 are directly connected to the back surface of the semiconductor element 1. Therefore, even if the force of the wire 2 from the back surface of the semiconductor element is applied to the conductive tape 3 by the lead 2, the end portion of the lead 2 is less likely to peel off from the back surface of the semiconductor element together with the conductive metal film 114. That is, the conductive metal film 114 is easily accessible from the semiconductor element! The back side of the conductive tape 3 is peeled off, but the end portion of the conductive tape 3 is directly connected to the back surface of the semiconductor element 1, so that it is not easily peeled off. 32 201133668 Thus, the connection state of the semiconductor component of the lead 2 can be surely maintained for a long period of time. Further, since the solder is not used as in the conventional case, and the lead wire is connected to the semiconductor element 1, the thermal influence on the semiconductor element 丨 can be alleviated. Further, the solder does not melt as a filler and flows in the width direction of the conductive metal crucible 114. Therefore, since the light-receiving surface of the sunlight is not reduced by the solder, the power generation efficiency is not reduced. Figs. 17 to 19 show the second to fourth embodiments of the present invention for explaining a modification of the back surface structure of the semiconductor element i. In the seventeenth aspect, not only the second removed portion 6 is provided at both end portions of the back surface of the semiconductor element, but also at the center portion. That is, one conductive adhesive tape 3 can be directly connected to the semiconductor element 1 at both end portions and the central portion 3.

surface. Thereby, the connection strength of the conductive tape to the back surface of the semiconductor element can be improved. Further, the second removing portion 116 may be provided not only in the center portion but also in the central portion. When this is done, the connection strength between the conductive tape 3 and the semiconductor element 1 can be further improved. Fig. 18 is formed such that the width of the second removal portion 116 formed at one end of the semiconductor element 沿着 along the predetermined direction and the other end portion is formed to be much longer than the width dimension of the conductive tape 3. For example, it is formed to have a length of 10 times or more the width dimension of the conductive tape 3. Thereby, the number of the conductive tapes 3 provided by directly connecting the both end portions to the second removal portion 116A on the back surface of the semiconductor element m can be freely set. Therefore, when the surface of the semiconductor device is increased in current collection efficiency, when more than four leads 2 are provided from the conductive tape 3 by 33 201133668, the conductive current provided on the back surface can be increased by the number of the leads 2 provided on the surface. The number of tapes 3. Further, since the lead 2 is often used in a width 丨5_ and a thickness 〇"~〇2 mm, it is very flexible, and even if the lead 2 is connected in a bent state, the width of the second removing portion 116A is still much larger than that of the conductive tape 3. The width dimension does not require high precision in the connection accuracy of the leads 2, and does not cause poor connection. In the structure of Fig. 18, the second removal portion 116A having the same width as that of the second removal portion 116A provided at both end portions is formed in the intermediate portion between the both end portions. According to this configuration, since the conductive tape 3 is directly connected to the back surface of the semiconductor element 2 at both end portions and the center portion 3, the connection strength of the conductive tape 3 to the back surface of the semiconductor element 1 can be improved. In each of the embodiments, the j-th removal portion 115 is formed on the periphery of the back surface of the semiconductor device ,, and the second removal portions 116A and 116A are transmitted through the first removal portion 115 to be opened to the outer periphery of the semiconductor element 1, and the second removal portion 115 may be removed. The second removing portions 116 and 1116A are opened directly to the outer periphery of the semiconductor element 1. In this configuration, since the second removal portions 116 and 116A are opened at the outer periphery of the semiconductor element 1, the connection strength of the conductive tape 3 at the outer peripheral end of the semiconductor element can be improved. Further, in the structure of Fig. 19, the second removal portion U6A may be provided not only at one central portion but also at a central portion. When this is done, the connection strength between the conductive tape 3 and the semiconductor element 1 can be further improved. Further, since the upper and lower sides of the adjacent semiconductor elements which are connected by the three lead wires in the respective groups are connected by two or four or more of the 2011, 2011,668 leads depending on the type of the semiconductor element, the present invention can be applied at this time. [Fig. *Simplified and Illustrated] Fig. 1 is a plan view showing a schematic configuration of a lead connecting device according to an embodiment of the present invention. Fig. 2 is a side view showing the gantry of the attaching table provided with the tape attaching mechanism. Figure 3 is a plan view of the gantry shown in Figure 2. Fig. 4 is a side view showing the tape attaching portion in which the conductive tape is attached to the upper and lower surfaces of the semiconductor element supplied to the attaching stage. Fig. 5(a) is an explanatory view showing a state in which the adhesive tape attached to the separation tape is divided into a predetermined length, and Fig. 5(b) shows a state in which the adhesive tape divided into a predetermined length is removed from the separation tape. Illustrating. Fig. 6 is a view for explaining the procedure for transporting a semiconductor element from a supply unit to a transport unit by a second transfer device. Fig. 7 is a side view showing a part of the endless belt of the conveying mechanism. Fig. 8 is a plan view showing an arrangement state of the first and second upper blocks of the transfer mechanism and the pre-nip mechanism disposed above the lead processing mechanism disposed on the side. Figure 9 is a side elevational view showing a portion of the lower and upper blocks that are pre-compressed to the underside of the semiconductor component. Fig. 10A is a view showing a state before the lead forming process by the lead forming processing mechanism. Fig. 10B is a view showing a state in which the lead forming processing mechanism shapes the lead. Fig. 11A is a view showing a first step of forming a column 35 201133668 by connecting a lead to a semiconductor element. The Fig. 11B is a diagram showing the second step of the group arrangement in which the NMOS line is connected to the semiconductor element. Fig. 11C is a diagram showing the third step of forming a group by connecting the leads to the semiconductor elements. Fig. 11D is a view showing a fourth step of forming a group by connecting leads to a semiconductor element. Fig. 11E is a view showing a fifth step of forming a group by connecting leads to a semiconductor element. Fig. 11F is a view showing a sixth step of forming a group by connecting leads to a semiconductor element. Figure 12 is a side view showing the structure of the formal press mechanism. Fig. 13 is a plan view showing a discharge mechanism for discharging a stack of semiconductor elements from a transport mechanism by a transport mechanism. Figure 14 is a side view of the discharge mechanism shown in Figure 13. Fig. 15A is a plan view showing a group in which semiconductor elements are connected by leads. Figure 15B is a side elevational view of a portion of the group. Fig. 16A is a plan view showing the surface of the semiconductor element as a light receiving surface. Fig. 16B is a plan view showing the back surface of the semiconductor element. Fig. 17 is a plan view showing the back surface of the semiconductor device of the second embodiment of the invention. Fig. 18 is a plan view showing the back surface of the semiconductor device of the third embodiment of the invention. Fig. 19 is a plan view showing the back surface of the semiconductor element of the fourth embodiment of the present invention. [Description of main component symbols] 1.. Semiconductor component 1A.·. Group 2, 2a-2n.·. Lead 3.. Conductive tape 3a... Cutting wire 4.. Separating tape 11.. Base member 12:. Supply portion 13.. Tape attachment mechanism 14.. Transfer mechanism 15. Pre-pressure-bonding mechanism 15a-15c···Lead processing mechanism 16.. Formal press-fit mechanism 17. .. Discharge mechanism 18.. Inspection unit 19.. Storage 21.. 1st reservoir 22.. 2nd reservoir 23.. 匣 box 24,.. 1st delivery device 25.. Calibration platform 26: Camera 27...X · Y · Z drive source 28.. movable body 29, 105... suction pad 31.. first tape attaching portion 32... second tape attaching portion 33 .. . Stand 34.. .Y Guide 35...1st Attachment Table 36.··2nd Attachment Table 37.. Connection piece 38, 54... Drive pulley 39, 55... Follower pulley 40. . Excavation equipment 40a··. Cutting equipment 41, 53... Endless belt 42.. Motor 43.. Through-holes 44, 65, 96... Supply reel 44a... Guide roller 45. . Up and down drive source 46a, 91... upper pressurizing tool 46b, 92... lower pressurizing tool 37 201133668 47, 98... winding reel 48.. 2nd handover device 49.. Attachment check Table 51.. Shooting camera 53.. belt 53a... suction hole 57.. block 58.. suction path 58a... branch hole 59.. suction pump 60.. lower pressing member 61.. .1st lower block body 61a...1st receiving surface 61b,62b,82.....the suction hole 62...the second lower block 62a...the second receiving surface 63a...the mounting plate 63... Upper and lower drive mechanism 65... Reel 66.. Pull-out claw 68.. Holder 69.. . 1st cutter 71.. 1st holding portion 71a··. 1st upper block 71b.. The first lower block 72.. The forming mold 72a, 72b, the mold 73.. the second holding portion 73a, the second upper block 73b, the second lower block 74.. 2 cutter 75.. .Discard box 77.. Mounting plate 79.. movable member 81, 103... upper and lower cylinder 85-L cylinder 89.. upper movable member 87.. lower cylinder 88. . Lower movable member 91a, 92a... Heater 91... Upper pressing tool 92... Lower pressing tool 94.. Upper buffering belt 95.. Lower buffering belt 97.. Guide roller 101.. Horizontal movable member 102.. Horizontal cylinder 104.. Upper and lower movable member 38 201133668 111.. Reflection preventing film 112.. Finger electrode 114.. Conductive metal film 115.. 1st removing portion 1 16,116A... 2nd removal C. .. clearance D. .. handover position X, Y... direction P... spacing 39

Claims (1)

201133668 VII. Patent application scope: 1. A lead connecting device for a semiconductor component, wherein a plurality of semiconductor components are connected in a row by a lead wire, characterized in that: a supply portion of the semiconductor component; a tape attaching mechanism; The adhesive conductive tape cut into a predetermined length is attached to the upper surface and the lower surface of the semiconductor element supplied from the supply unit, and the transfer mechanism supplies the conductive tape to the conductive tape by the tape attaching mechanism. The semiconductor element above and below, the pitch of the semiconductor element is pitched; the lead processing mechanism is formed by forming a shape in which the lead is bent in the vertical direction by dividing the intermediate portion in the longitudinal direction; The pressing mechanism is provided at a portion opposed to the semiconductor element fed by the distance of the conveying mechanism, and holds a lead formed by the lead processing mechanism, and conducts electricity on the upper surface and the lower surface of the semiconductor element which is fed at a pitch. The tape is repeatedly pre-embossed by the aforementioned leads, and will be adjacent The upper and lower sides of the semiconductor element are electrically connected to each other; and the main press-fit mechanism is disposed at a position facing the semiconductor element on the downstream side of the feed direction from the semiconductor element closer to the transfer mechanism than the pre-compression mechanism, The pre-compression bonding mechanism is pre-compressed on the upper surface of the upper surface of the semiconductor element, and the pair of the leads are simultaneously positively pressed; and the semiconductor element is formed on the one side of the light receiving surface at a predetermined interval in a predetermined direction of 40 201133668 a plurality of finger electrodes, on the other side, an exposed portion is left at one end and the other end of the direction intersecting the plurality of finger electrodes, and a conductive metal film is provided in the plurality of semiconductor elements connected in a row One of the adjacent ones of the pair of semiconductor elements is passed through the conductive tape, and one end of the lead is connected in a direction crossing the plurality of finger electrodes, and the other side of the other semiconductor element is connected Corresponding to the aforementioned removal portion formed at one end and the other end of the other surface Position the other end of the lead wire through a conductive tape. 2. The lead bonding device for a semiconductor device according to claim 1, further comprising a first tape attaching portion and a second tape attaching portion that can supply the semiconductor element alternately from the supply portion. 3. The lead connecting device for a semiconductor device according to any one of claims 1 to 2, wherein an inspection mechanism is provided between the tape attaching mechanism and the transport mechanism, and the inspection mechanism checks the tape attaching mechanism. The pros and cons of the attached state of the conductive tape attached to the semiconductor element. 4. The lead bonding device for a semiconductor device according to claim 1, wherein the pre-compression mechanism comprises a lower pressing member and an upper pressing member, and the lower pressing member is disposed to be conveyed by the conveying mechanism. a position opposite to the lower surface of the semiconductor element, and a receiving surface at the upper end for adsorbing and holding the lead formed by the lead processing mechanism, and being driven in an up and down direction, the upper pressing member being disposed above the semiconductor element 41 201133668 driving in the lower direction, the suction surface formed on the lower end of the holding surface is supplied to the receiving surface of the lower pressing member, and the member is provided with the distance between the semiconductor element by the supply of the lead wire and the carrier The above-mentioned lead wire attached to the former semiconductor pre-compressor and the conductive tape underneath is simultaneously pressurized. 5. The splicing line connecting device of the semiconductor element according to claim 1 wherein the above-mentioned formal pressing mechanism is The part is formed by a formal pressing head and a cutting and pressing head, and the lower formal pressing head is driven upwards and downwards. The state is set at a position opposite to the driving _# η driving, and the +-conductor reading system is connected by a pre-compression lead wire to the conveying mechanism carrier, and the 玄 玄 玄 玄 玄 玄 玄The sealing head is provided on the upper surface of the semiconductor element so as to be movable in the up-and-down direction at a portion facing the lower final pressing head, and the lower portion of the lower pressing portion 1 will be the upper surface and the lower surface of the semiconductor element. The conductive tape is simultaneously pressurized and is officially pressed. 6. The lead connecting device for a semiconductor device according to the scope of the invention, wherein a plurality of formal pressures are arranged at an integral multiple of an interval of the semiconductor elements connected in a row in a transport direction of the semiconductor element of the W-feeding mechanism a mechanism, wherein the transport mechanism feeds the connected semiconductor elements at the same distance from the connection distance of the semiconductor elements, a 42 201133668. The plurality of formal press mechanisms feed a plurality of pitches at a pitch In the case of a semiconductor element, the leads which have been pre-compressed to the upper and lower sides of the plurality of semiconductor elements are simultaneously press-fitted. 7. The lead connecting device for a semiconductor device according to claim 1, wherein the discharge mechanism is configured to simultaneously adsorb a plurality of semiconductor elements that have been officially pressed by the aforementioned positive pressing mechanism, and the plurality of semiconductor elements are plural. The semiconductor elements are discharged to the side of the transport mechanism. 8. A method of wire bonding a semiconductor device, wherein a plurality of semiconductor elements are connected in a row by a lead, characterized in that: the adhesive conductive tape is simultaneously attached to the upper surface and the lower surface of the plurality of semiconductor elements; One end of one of the two lead wires and the other end portion of the other lead are simultaneously pre-compressed to the conductive tape provided on the upper surface and the lower surface of the semiconductor element, and the adjacent semiconductor element is The upper and lower sides are electrically connected to each other; and a pair of the leads are pre-compressed on the upper surface and the lower surface of the semiconductor element, and the pair of the leads are simultaneously press-fitted; and the semiconductor element is predetermined as a side of the light receiving surface in a predetermined direction. A plurality of finger electrodes are formed at intervals, and on the other surface, an exposed portion is left at one end portion and the other end portion in a direction intersecting the plurality of finger electrodes, and a plurality of semiconductor elements are connected in a row. One of the adjacent one of the semiconductor elements of one of the semiconductor elements transmits the conductivity The tape is connected to one end of the lead wire in a direction intersecting the plurality of finger electrodes, and the other end of the other semiconductor element is connected to the removed portion formed at one end and the other end of the other surface. The position of the other end of the lead wire is connected through a conductive tape. 9. A semiconductor device comprising a plurality of finger electrodes formed on a one side of a light receiving surface at a predetermined interval in a predetermined direction, and a semiconductor element is connected in a row by a lead wire, and is provided on the other surface. The conductive metal film is formed with a removed portion from which the conductive metal film is removed, at one end and the other end of the other surface in a direction intersecting the predetermined direction. 10. A solar cell module in which a plurality of semiconductor elements are connected in a row by a lead wire, wherein: the semiconductor element forms a plurality of finger electrodes at predetermined intervals in a predetermined direction on one side of the light receiving surface, On the other hand, a conductive metal film is provided at one end and the other end of the direction intersecting the plurality of finger electrodes, and one of the plurality of semiconductor elements connected in a row is adjacent to the semiconductor element. One of the semiconductor elements is connected to one end of the lead in a direction crossing the plurality of finger electrodes through an adhesive conductive tape, and the conductive is removed on the other side of the other semiconductor element The metal film is formed at a position corresponding to the removed portion of the other end portion and the other end portion, and the other end portion of the lead wire is connected through the adhesive conductive tape. 44