JP2013012678A - Semiconductor cell lead wire connection device, connection method thereof, and solar cell module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead wire connection device for manufacturing a solar cell module by electrically connecting a lead wire on surface electrodes of a semiconductor cell using non-conductive tape.SOLUTION: A semiconductor cell lead wire connection device includes: tape bonding means for bonding adhesive non-conductive tape 3A onto bus bar electrodes 6a and 6b on upper and lower surfaces of a semiconductor cell 1 fed from a feeding part 12; conveying means for pitch-feeding the semiconductor cell with conductive tape bonded on its surface electrodes; lead wire processing means for processing a lead wire 2 so as to be bent upward and downward in the middle portion in its longitudinal direction, the lead wire 2 having surfaces to be connected to the surface electrodes formed on rough surfaces 2s of an uneven shape; temporal press-bonding means for press-bonding the rough surfaces of the lead wire onto the non-conductive tape provided on the upper and lower surfaces of the pitch-fed semiconductor cell, while retaining the lead wire having been mold-processed by the lead wire processing means; and regular press-bonding means for electrically connecting the lead wire and the bus bar electrodes via convex portions 2x on the rough surfaces of the lead wire, by performing a regular press-bonding simultaneously for a pair of upper and lower lead wires temporarily press-bonded on the upper and lower surfaces of the semiconductor cell.

Description

  The present invention relates to a lead wire connecting device, a connecting method, and a solar cell module manufactured by a lead wire connecting device for manufacturing a solar cell module by connecting a plurality of semiconductor cells in a row with lead wires.

  Solar cell modules include crystal types and thin film types. Crystal type solar cell modules have multiple rows of semiconductor cells such as single crystal silicon and polycrystalline silicon, and the upper and lower electrodes formed on the upper and lower surfaces of adjacent semiconductor cells are connected in a row with lead wires The semiconductor cell is integrally laminated with a resin on a glass substrate.

  17 (a) and 17 (b) show a general crystal type solar cell module, and FIG. 17 (a) shows a number of semiconductor cells 1 (1a to 1n) as lead wires 2 (2a to 2n). ), And FIG. 17B is an enlarged side view.

  As shown in FIG. 17B, a large number of grid electrodes (finger electrodes) 5 are formed at equal intervals on the upper surface, which is a light receiving surface that receives sunlight of each of the semiconductor cells 1a to 1n. The central portion and both end portions in the width direction intersecting the direction are connected by three bus bar electrodes 6a. On the back surface of each of the semiconductor cells 1a to 1n, a back electrode 7 is formed over almost the entire back surface, and three bus bar electrodes 6b are formed on the back electrode 7 so as to correspond to the bus bar electrodes 6a on the upper surface side. .

  The bus bar electrode 6a on the upper surface side and the bus bar electrode 6b on the lower surface side are each adhered with the conductive tape 3 made of a thermosetting resin having adhesiveness, and the bus bars on the upper surface side of a pair of adjacent semiconductor cells 1 are bonded. One end portion and the other end portion of the lead wires 2a to 2n bent in a crank shape are temporarily press-bonded to the conductive tape 3 attached to the electrode 6a and the bus bar electrode 6b on the back surface side.

  Next, the lead wires 2a to 2n are heated while being pressed with a larger pressing force than that at the time of temporary press bonding. Thereby, since the conductive tape 3 is melt-cured, the lead wires 2a to 2n are finally crimped, that is, connected and fixed to the upper and lower surfaces of the semiconductor cells 1a to 1n.

JP 2011-469612 A

  As described above, when the bus bar electrodes 6a and 6b of the plurality of semiconductor cells 1a to 1n are connected by the lead wires 2a to 2n, the conductive tape 3 is used. As is well known, the conductive tape 3 is made by mixing conductive particles having a diameter of several tens of μm with a thermosetting resin having adhesiveness.

  Then, after connecting the bus bar electrodes 6a and 6b and the lead wire 2 of the semiconductor cell 1, the bus bar electrodes 6a and 6b are connected to the lead wire by the conductive particles by being pressurized and heated through the bus bar electrodes 6a and 6b. 2 are electrically connected.

  However, the conductive tape 3 containing conductive particles is very expensive. For this reason, it is a factor that causes an increase in the cost of the solar cell module, and there has been a strong demand for cost reduction.

  The present invention provides a lead connection device for a semiconductor cell, a connection method, and a solar cell module capable of connecting a lead wire to an electrode of a semiconductor cell without using a conductive tape containing conductive particles. There is to do.

The present invention is a lead wire connecting device in which a plurality of semiconductor cells arranged in a row are electrically connected via front surface electrodes formed on the upper surface and the back surface thereof to form a solar cell module,
A supply part of the semiconductor cell;
Tape adhering means for adhering an adhesive non-conductive tape cut to a predetermined length on the surface electrodes formed on the upper and lower surfaces of the semiconductor cell supplied from the supply unit;
Transport means for supplying the semiconductor cells with the conductive tape attached to the upper and lower surface electrodes by the tape attaching means and pitch-feeding the semiconductor cells;
A lead wire processing means for forming and processing a lead wire, which is formed into a rough surface having an uneven surface, connected to the surface electrode of at least an adjacent semiconductor cell, into a shape that bends in a vertical direction with a middle portion in the longitudinal direction as a boundary; ,
A lead wire provided at a portion facing the semiconductor cell pitch-fed by the transport means is held on the surface electrodes on the upper and lower surfaces of the semiconductor cell that is pitch-fed while holding the lead wire formed by the lead wire processing means. Temporary crimping means for alternately electrically connecting to the upper and lower surface electrodes of the adjacent semiconductor cells by repeating temporary crimping of the rough surface of the lead wire to the non-conductive tape attached;
A pair of upper and lower surfaces disposed at a position opposite to the semiconductor cell on the downstream side of the transport direction of the semiconductor cell by the transport means than the temporary pressure bonding means and temporarily pressure-bonded to the upper and lower surface electrodes of the semiconductor cell by the temporary pressure bonding means. And a main press-bonding means for electrically connecting the lead wire and the surface electrode through a convex portion of the rough surface of the lead wire by simultaneously press-bonding the lead wire at the same time. In the cell lead wire connection device.

The present invention is a lead wire connection method in which a plurality of semiconductor cells arranged in a row are electrically connected via front surface electrodes formed on the upper surface and the back surface thereof to form a solar cell module,
Adhering an adhesive non-conductive tape cut to a predetermined length on the upper and lower surface electrodes of the semiconductor cell; and
One of the two lead wires in which at least the surface to be bonded to the nonconductive tape is formed into an uneven rough surface on the nonconductive tape adhered to the upper and lower surface electrodes of the semiconductor cell. And temporarily connecting the other end of the other end of the other through the rough surface and alternately connecting the upper and lower surfaces of the adjacent semiconductor cells,
The pair of upper and lower lead wires temporarily bonded to the upper surface and the lower surface of the semiconductor cell are subjected to main pressure bonding so that the lead wire and the surface electrode are electrically connected to each other through the convex portion of the rough surface of the lead wire. And a connecting step of connecting the lead wires of the semiconductor cell.

The present invention is a solar cell module configured by electrically connecting a plurality of semiconductor cells arranged in a row via front surface electrodes formed on the upper surface and the back surface thereof,
Adhesive non-conductive tape that is attached to the upper and lower surface electrodes of the semiconductor cell,
At least the surface to be attached to the non-conductive tape is formed as a rough surface with irregularities, and one end in the longitudinal direction is temporarily pressure-bonded to the upper and lower surface electrodes of a pair of adjacent semiconductor cells, and the other end is By temporarily pressing the upper and lower surface electrodes of the other semiconductor cell and then pressing both ends of the semiconductor cell, one end and the other end are electrically connected to the surface electrode via the rough surface convex portion, respectively. A solar cell module comprising: a connected lead wire.

  According to this invention, when the surface electrodes of a pair of adjacent semiconductor cells are connected by the lead wires, the adhesive non-conductive tape is used, and at least the surface of the lead wire that is attached to the non-conductive tape Since the lead wire is finally pressure-bonded to the surface electrode via the non-conductive tape, the lead wire and the surface electrode are electrically connected by the convex portion of the rough surface. Connected to.

  That is, since the surface electrodes of a pair of adjacent semiconductor cells can be connected by the lead wires using a non-conductive tape without using an expensive conductive tape, the manufacturing cost of the solar cell module can be reduced.

The top view which shows schematic structure of the lead wire connection apparatus of 1st Embodiment of this invention. The side view of the mount frame in which the sticking table of the tape sticking means was provided. The top view of the mount frame shown in FIG. The side view which shows the tape sticking part which sticks a conductive tape on the upper and lower surfaces of the semiconductor cell supplied to the sticking table. (A), (b) is explanatory drawing when dividing the adhesive tape stuck on the release tape into predetermined length. The figure for demonstrating the order which conveys a semiconductor cell from a supply part to a conveyance means by the 1st, 2nd delivery apparatus. The side view which carried out the partial cross section of the endless belt of a conveyance means. The top view which shows the arrangement | positioning state of the 1st, 2nd upper block which comprises the temporary crimping | compression-bonding means arrange | positioned above a conveyance means and the lead wire processing means of the side. The side view which shows a cross section partially of a pair of lower block and upper block which temporarily crimps | bonds a lead wire to upper and lower surfaces of a semiconductor cell of this invention. (A) is a figure which shows the state before a lead wire shaping | molding means shape | molds a lead wire, (b) is a figure which shows the state which the lead wire shaping | molding means shape | molds a lead wire. (A)-(f) is the figure which showed sequentially the process of forming a string by connecting a lead wire to a semiconductor cell sequentially. The side view which shows the structure of this crimping | compression-bonding means. The top view which shows the discharge | emission means for discharging | emitting the string made while the semiconductor cell is conveyed by the conveyance means from a conveyance means. The side view of the said discharge means. The enlarged view which shows a part of semiconductor cell by which the lead wire was connected to the bus-bar electrode of upper and lower surfaces using a nonelectroconductive tape. The side view which shows the lead wire by which the one surface by the side of one end part and the other surface by the side of the other end part were formed in the rough surface. 1 shows a general string structure, (a) is a plan view of a string in which semiconductor cells are connected by lead wires, and (b) is an enlarged side view of a part of the string.

  Embodiments of the present invention will be described below with reference to the drawings. 1 to 15 show an embodiment of the present invention. First, a schematic configuration of the entire apparatus will be described. FIG. 1 is a plan view showing a schematic configuration of a lead wire connecting device, and this connecting device includes a rectangular plate-like base member 11. On the upper surface of the base member 11, the supply portion 12 of the semiconductor cell 1 from one end to the other end in the longitudinal direction, and a film-like non-stick formed on the upper and lower surfaces of the semiconductor cell 1 with an adhesive thermosetting resin. A tape adhering means 13 for adhering a conductive tape (NCF: Non Conductive Film) 3A (shown in FIG. 15), and a semiconductor cell 1 in which non-conductive tape 3A is adhering to the upper and lower surfaces by means of this tape adhering means 13. Are sequentially arranged.

  Three lead wire processing means for forming a lead wire 2 for connecting a plurality of semiconductor cells 1 sequentially supplied to the transport means 14 in a row on the side of one end of the transport means 14 in a crank shape. 15a to 15c are arranged.

The lead wire 2 is made of a thin strip-like conductive metal, such as copper or aluminum, and will be described later on the non-conductive tape 3A attached to the semiconductor cell 1 as shown in FIGS. The one surface of the one end part and the other surface of the other end part to be bonded as described above are uneven parts having a convex part 2x and a concave part 2y by, for example, etching that is chemical means or shot blasting that is mechanical means or roll pressurization. It is formed on the rough surface 2s.
In FIG. 15, the same parts as those in FIG.

Here, the surface roughness Ra of the rough surface 2s is set to 2 μm or more. Thus, as described later, the lead wire 2 is temporarily press-bonded to the bus bar electrodes 6a and 6b, which are front surface electrodes formed on the upper surface and the back surface of the semiconductor cell 1, via the non-conductive tape 3A. When the crimping is performed, as shown in FIG. 15, the protrusion 2x of the rough surface 2s of the lead wire 2 pushes away the non-conductive tape 3A and can make electrical contact with the bus bar electrodes 6a and 6b. Can have a height.
In addition, although one surface of the one end portion of the lead wire 2 and the other surface of the other end portion are formed on the rough surface 2s, the total length of one surface and the other surface of the lead wire 2 is the rough surface 2s. It can be formed.

  The lead wire 2 formed into a crank shape by the lead wire processing means 15a to 15c is a semiconductor cell 1 that is transported by the transport means 14 by a temporary crimping means 15 disposed above one end of the transport means 14. Is temporarily pressure-bonded. As will be described later, the plurality of semiconductor cells 1 are transported by the transport means 14 while being sequentially connected in a row by repeating the temporary crimping of the lead wires 2.

  A plurality of lead wires 2 temporarily crimped by the temporary crimping means 15 are simultaneously crimped onto the upper and lower surfaces of the semiconductor cell 1 at the downstream side of the temporary crimping means 15 of the transport means 14 in the transport direction. In the embodiment, three main crimping means 16 (shown only by chain lines in FIG. 1) are arranged at a predetermined interval. When the number of semiconductor cells 1 connected in a row is 12, for example, the three main crimping means 16 are arranged at intervals of 3 times, which is an integral multiple of the connection pitch P of the semiconductor cells 1. Yes.

  Then, when 12 semiconductor cells 1 are connected in a row, the three main crimping means 16 face the first, fifth and ninth semiconductor cells 1 in the transport direction, and temporarily connect these three semiconductor cells 1 to each other. The crimped lead wire 2 is finally crimped simultaneously.

  Next, when the twelve semiconductor cells 1 connected in a row are pitch-fed at a distance of P, the three main crimping means 16 are temporarily crimped to the second, sixth and tenth semiconductor cells 1. Wire 2 is crimped. By repeating such main press-bonding four times, each lead wire 2 temporarily press-bonded to twelve semiconductor cells 1 by three main press-bonding means 16 is finally press-bonded.

  Discharge for adsorbing and discharging twelve semiconductor cells 1 connected in a row by the main crimping means 16 to the side of the other end of the transport means 14 and connected in a row. Means 17 (shown in FIGS. 13 and 14 as will be described later) is provided. In addition, it becomes the string 1A which comprises a solar cell module by connecting the semiconductor cell 1 in a row.

  The string 1A unloaded from the conveying means 14 by the discharge means 17 is stored in the stocker 19 and unloaded after the connection state of the lead wire 2 is inspected by image recognition by the inspection unit 18 shown in FIG. It has become.

Next, the configuration of each unit will be described.
As shown in FIG. 1, the supply unit 12 has a direction in which the first storage 21 and the second storage 22 intersect the transport direction of the transport means 14 (this direction is the X direction) (this direction is the Y direction). To be separated from each other. The X direction and the Y direction are indicated by arrows in FIG.

  Each storage 21, 22 has a cassette 23, and each cassette 23 is provided with the semiconductor cell 1. The cassettes 23 of the storages 21 and 22 are pitched in the + X direction, and the cassettes 23 of the one storage 21 and the other storage 22 are alternately sent in the −Y direction and the + Y direction at the ends of the storages 21 and 22, respectively. The storages 21 and 22 are positioned at the delivery position D at the center in the Y direction.

  The semiconductor cell 1 of the cassette 23 positioned at the delivery position D is sucked and delivered to the alignment stage 25 by the first delivery device 24 shown in FIG. The semiconductor cell 1 supplied and mounted on the alignment stage 25 is imaged by the camera 26 disposed above it, and the appearance inspection and position recognition are performed based on the imaging.

  If the appearance of the semiconductor cell 1 is determined to be defective, for example, due to chipping, the semiconductor cell 1 is discharged by the first delivery device 24 based on a command from a control device (not shown) and determined to be a non-defective product. Then, the first delivery device 24 alternately supplies and places the first and second sticking tables 35 and 36 (to be described later) on the tape sticking means 13. Yes.

  The cassette 23 emptied when the semiconductor cell 1 is taken out by the first delivery device 24 at the delivery position D moves in the −X direction and is ejected from its end, and then the semiconductor cell 1 is supplied to the first cassette 23. Alternatively, the operation is returned to the second storages 21 and 22, and the above-described operation is repeated.

  As shown in FIG. 6, the first delivery device 24 has a movable body 28 that is driven in the horizontal and vertical directions by an X, Y, and Z drive source 27. The movable body 28 is provided with four suction pads 29 (only two are shown) for sucking the four corners of the upper surface of the semiconductor cell 1.

  As a result, the first delivery device 24 is capable of attracting the four corners of the upper surface of the semiconductor cell 1 of the cassette 23 by the four suction pads 29 at the delivery position D and transferring and transporting the semiconductor cell 1. It can be done.

The semiconductor cell 1 whose appearance has been inspected and whose position has been recognized by the alignment stage 25 is supplied to the tape adhering means 13 by the first delivery device 24.
Note that the transfer of the semiconductor cell 1 from the alignment stage 25 to the tape adhering means 13 may be performed by using another delivery device instead of the first delivery device 24, and this is limited. It is not what is done.

  As shown in FIG. 1, the tape adhering means 13 includes a first tape adhering portion 31 and a second tape adhering having the same configuration arranged symmetrically apart from each other in the Y direction around the conveying means 14. It has a wearing part 32. The 1st, 2nd tape sticking parts 31 and 32 are comprised as shown in FIG. 2 thru | or FIG.

  That is, the tape sticking means 13 has a gantry 33 installed along the Y direction. As shown by arrows in FIG. 3, a pair of Y guide rails 34 are laid at both ends in the width direction along the X direction of the upper surface of the gantry 33. The Y guide rail 34 is provided with the first sticking table 35 and the second sticking table 36 described above so as to be movable along the Y guide rail 34.

  As shown in FIG. 2 and FIG. 3, a connecting piece 37 is provided on the lower surface of one end in the width direction of each sticking table 35, 36. Each connecting piece 37 is connected to an endless belt 41 stretched around a driving pulley 38 and a driven pulley 39. Each of the pair of drive pulleys 38 is rotationally driven by a motor 42.

  As a result, the first sticking table 35 can be driven back and forth between the one end portion and the central portion along the Y direction of the gantry 33, and the second sticking table 36 can be driven in the Y direction of the gantry 33. Can be driven back and forth between the other end along the center and the center. The sticking tables 35 and 36 driven in the center in the Y direction of the gantry 33 are shown by chain lines in FIG.

  As shown in FIG. 3, the first and second sticking tables 35, 36 are formed with three through holes 43 penetrating the upper and lower surfaces. These through-holes 43 are long along the X direction and are formed at predetermined intervals along the Y direction.

  As shown in FIG. 1, the said 1st tape sticking part 31 is provided in the one end part of the Y direction of the said mount 33, and the said 2nd tape sticking part 32 is provided in the other end part. . As shown in FIG. 4, each tape sticking part 31 and 32 has the supply reel 44 arrange | positioned below the one end part along the X direction of each said sticking table 35 and 36. As shown in FIG. As shown in FIGS. 5A and 5B, the supply reel 44 is wound with the non-conductive tape 3 </ b> A attached to the release tape 4.

  The non-conductive tape 3A pulled out from the supply reel 44 together with the release tape 4 forms a pair of cutting lines 3a shown in FIG. 5A by a cutting mechanism 40a made of a cutter. The pair of cutting lines 3a is formed on the non-conductive tape 3A at a predetermined interval, that is, an interval corresponding to the width dimension intersecting the arrangement direction of the grid electrode 5 of the semiconductor cell 1.

  The portion cut by the pair of cutting lines 3a of the non-conductive tape 3A is removed by the hollowing mechanism 40, whereby a gap C shown in FIG. 5B is formed. Thereby, the non-conductive tape 3A is divided into lengths corresponding to the width dimension of the semiconductor cell 1. Since the hollow mechanism 40 is a known technique, a detailed description thereof is omitted here.

  The nonconductive tape 3A divided into a predetermined length in this way is guided by the pair of guide rollers 44a together with the release tape 4 and is parallel to the upper and lower surfaces of the first and second sticking tables 35 and 36. Drive to.

  An upper pressurizing tool 46a and a lower pressurizing tool 46b, which are driven in the vertical direction by a vertical driving source 45 such as a cylinder, are disposed above and below the portion where the non-conductive tape 3A runs in parallel.

  The semiconductor cell 1 supplied on the alignment stage 25 and visually inspected and position-recognized is positioned from the alignment stage 25 to the center of the gantry in the Y direction by the first delivery device 24. 2 is supplied and placed on the two sticking tables 35 and 36.

  When the first adhering table 35 or the second adhering table 36 on which the semiconductor cell 1 is supplied and mounted is driven from the central portion in the Y direction of the gantry to one end or the other end, the upper pressure is applied. The tool 46a and the lower pressing tool 46b are simultaneously driven in the upward direction and the downward direction.

  As a result, the pressure tools 46a and 46b are divided into a predetermined length of the non-conductive tape 3A via the release tape 4 into the bus bar electrode 6a on the upper surface of the semiconductor cell 1 and the bus bar electrode 6b on the lower surface. At the same time, touch and stick. Thereafter, the release tape 4 is peeled off from the non-conductive tape 3A attached to the semiconductor cell 1 by a release roller (not shown) or the like, and taken up on the take-up reel 47.

  In other words, the semiconductor cells 1 whose appearance has been inspected and recognized by the alignment stage 25 are alternately supplied to the first sticking table 35 and the second sticking table 36, and the first tape sticking part 31 and the second tape sticking part 31. The non-conductive tape 3 </ b> A is stuck at the tape sticking part 32.

  The first and second tape adhering portions 31 and 32 have three sets of supply reels 44, take-up reels 47, and upper and lower portions arranged above and below the first and second adhering tables 35 and 36, respectively. Part pressing tools 46a and 46b. As a result, three non-conductive tapes 3A are respectively applied to the upper and lower surfaces of the semiconductor cell 1 by the upper and lower pressure tools 46a and 46b that are in contact with the non-conductive tape 3A at the same time. Yes.

  Since the non-conductive tape 3A is simultaneously pressed and applied to the bus bar electrodes 6a and 6b on the upper and lower surfaces of the semiconductor cell 1, once the semiconductor cell 1 is positioned, the non-conductive tape is applied to the upper and lower surfaces thereof. 3A can be precisely positioned and pasted.

  That is, in order to attach the nonconductive tape 3A to the upper and lower surfaces of the semiconductor cell 1 at the same time, the semiconductor cell 1 is turned upside down after the nonconductive tape 3A is attached to one surface of the semiconductor cell 1. Compared to the case where the non-conductive tape 3A is attached to the other surface by reversing the position, the semiconductor cell 1 is inverted in the upside down position, and the non-conductive tape 3 is precisely placed on the upper and lower surfaces. It is possible to prevent the productivity from being lowered due to the complexity of the mechanism for reversing or the time required for reversing, which cannot be positioned and adhered.

  The number of non-conductive tapes 3A attached to the upper and lower surfaces of the semiconductor cell 1 is not limited to three, and may be two or four, and the number depends on the structure of the semiconductor cell 1 and the like. Is set.

  Further, the plurality of nonconductive tapes 3A attached to the upper and lower surfaces of the semiconductor cell 1 may be temporarily pressure-bonded to the upper and lower surfaces of the semiconductor cell 1 one by one. In that case, a set of supply reel 44, take-up reel 47, and upper and lower pressure tools 46a, 46b are provided in the first and second tape adhering portions 31, 32, respectively, and one non-conductive tape 3A. The first non-conductive tape 3A may be attached by moving the first and second attachment tables 35, 36 by a predetermined distance in the Y direction each time.

  In other words, each tape sticking portion 31, 32 is provided with only one set of supply reel 44, take-up reel 47, and upper and lower pressure tools 46 a, 46 b. The configuration can be simplified and downsized.

  When three non-conductive tapes 3A are attached to the upper and lower surfaces of the semiconductor cell 1 supplied to the first tape attaching part 31 and the second tape attaching part 32, the semiconductor cell 1 The first sticking table 35 and the second sticking table 36 mounted thereon are alternately driven and positioned from one end and the other end in the Y direction of the gantry 33 to the center.

The semiconductor cell 1 on the first sticking table 35 or the second sticking table 36 positioned at the center of the gantry 33 is driven in the horizontal and vertical directions as shown in FIG. It is sucked and held by the delivery device 48 and supplied to the sticking inspection stage 49 provided between the tape sticking means 13 and the transport means 14.
Since the second delivery device 48 has the same configuration as the first delivery device 24, the same parts are denoted by the same reference numerals and description thereof is omitted.

  At the sticking inspection stage 49, the sticking state of the non-conductive tape 3A stuck on the upper and lower surfaces of the semiconductor cell 1, for example, whether or not there is a turn, is detected simultaneously by the imaging camera 51 arranged in both the upper and lower directions. Imaged and inspected. If the result of imaging by the imaging camera 51 is defective, it is discharged based on a command from a control device (not shown), and if it is non-defective, it is supplied to the conveying means 14 by the second delivery device 48.

  As shown in FIG. 7 or FIG. 13, the transport means 14 has a pair of endless belts 53 spaced in the Y direction at intervals smaller than the width dimension of the semiconductor cell 1. The endless belt 53 is stretched around a driving pulley 54 and a driven pulley 55 as shown in FIG. The drive pulley 54 is rotationally driven by the motor 56 shown in FIG. 8 so that the upper surface side of the endless belt 53 travels from the −X direction toward the + X direction. The traveling direction of the endless belt 53 is indicated by an arrow + X in FIG.

  The endless belt 53 is intermittently driven at a predetermined pitch P. This pitch P is indicated by P in FIG. 13 and is the same distance as the interval between the adjacent semiconductor cells 1 connected in a row by the lead wires 2.

  As shown in FIGS. 7 and 8, the endless belt 53 has a plurality of suction holes 53a penetrating in the thickness direction at predetermined intervals along the X direction. A block 57 is provided between the upper and lower inner surfaces of the endless belt 53 such that the upper and lower surfaces thereof are in contact with the upper and lower portions of the inner peripheral surface of the endless belt 53. A suction path 58 is formed in the block 57 along the longitudinal direction.

  A plurality of branch holes 58 a opened on the upper surface of the block 57 are branched from the suction path 58 at intervals corresponding to the suction holes 53 a formed in the endless belt 53. The branch hole 58a may be formed in the lower surface of the block 57.

  One end of the suction path 58 is closed, and a suction pump 59 is connected to the other end. Accordingly, when the suction pump 59 is operated, a suction force is generated in the suction hole 53a of the endless belt 53 via the suction path 58 and the branch hole 58a.

  The interval between the suction holes 53a is set to be equal to 1 / integer of the pitch P at which the endless belt 53 is intermittently driven or the pitch P. Accordingly, the suction hole 53a of the endless belt 53 and the branch hole 58a of the block 57 are made to coincide with each other before the endless belt 53 is driven, so that the endless belt 53 always faces each other even if the endless belt 53 is intermittently driven. ing.

  In this way, when the lead wire 2 is temporarily pressure-bonded to the semiconductor cell 1 or when the lead-wire 2 is pressure-bonded, the positioned semiconductor cell 1 can be positioned and held so as not to move on the endless belt 53.

  As shown in FIG. 8, at one end portion of the endless belt 53 constituting the conveying means 14 located in the −X direction, the total constituting the temporary crimping means 15 is provided between and outside the pair of endless belts 53. Three sets of lower pressure members 60 are arranged.

  The three sets of lower pressure members 60 each include a first lower block 61 and a second lower block 62 that are spaced apart from each other at a predetermined interval in the X direction, and each block, that is, a total of six blocks 61 and 62. Are integrally attached and fixed to the upper surface of a mounting plate 63a which is driven up and down by a vertical driving means 63 (shown in FIG. 9) such as a cylinder.

  The upper end surface of the first lower block 61 is formed on a flat first receiving surface 61a, and the upper end surface of the second lower block 62 is a flat first surface located slightly lower than the first receiving surface 61a. 2 on the receiving surface 62a.

  Suction holes 61b and 62b are formed in the first receiving surface 61a and the second receiving surface 62a, and suction force can be generated in the suction holes 61b and 62b by a suction pump (not shown). It is like that.

  The upper surface of each of the three lower blocks 61 and 62 is formed into a crank shape by the first to third lead wire processing means 15a to 15c disposed on the side of one end of the conveying means 14. The lead wires 2 are supplied simultaneously.

  Each lead wire processing means 15a-15c has a supply reel 65 around which the lead wire 2 is wound as shown in FIGS. 10 (a) and 10 (b). The lead wire 2 of the supply reel 65 is pinched by the pull-out claw 66 and pulled out. The lead wire 2 has a strip shape.

  The drawer pawl 66 is driven to reciprocate in the X direction indicated by an arrow in FIG. 10A by a cylinder (not shown) or a wire that runs endlessly. Accordingly, the lead wire 2 is drawn from the supply reel 65 in the −X direction.

  The lead wire 2 drawn out in the −X direction by the drawing claw 66 is a first holding portion 71 divided into a clamper 68, a first cutter 69, a first upper block 71a and a first lower block 71b. Then, a molding die 72 composed of a pair of upper and lower dies 72a and 72b, a second holding portion 73 and a second cutter 74 divided into a second upper block 73a and a second lower block 73b are passed through. A disposal box 75 is disposed downstream of the second cutter 74 in the pulling direction.

  The upper block 71a of the first holding part 71 and the second upper block 73a of the second holding part 73 of the first to third lead wire processing means 15a to 15c are attached as shown in FIGS. It is attached to the lower surface of the plate 77.

  As shown in FIG. 9, the lower end surface of the first upper block 71 a of the first holding unit 71 is set to be slightly higher than the lower end surface of the second upper block 73 a of the second holding unit 73. ing. Furthermore, the pair of upper blocks 71a and 73a are formed with suction holes 82 that open to the lower end surfaces thereof.

  The upper end surface of the first lower block 71 b of the first holding unit 71 is set to be slightly higher than the upper end surface of the second lower block 73 b of the second holding unit 73.

The mounting plate 77 is provided on the lower surface of the plate-like movable member 79 shown in FIGS. 8 and 9 so that it can be driven in the vertical direction by a plurality of vertical cylinders 81. The movable member 79 is driven in the Y direction by a horizontal cylinder 78.
The pair of upper blocks 71a and 73a also serve as an upper pressure member of the temporary pressure bonding means 15. That is, the upper block 71a mainly functions to transport the lead wire 2 with the upper block 73a, and the upper block 73a functions to temporarily press the lead wire 2 to the upper and lower surfaces of the semiconductor cell 1.

  From the state shown in FIG. 10A, as shown in FIG. 10B, the lead wire 2 is drawn out from the supply reels 65 of the first to third lead wire processing means 15a to 15c by the drawing pawl 66. The proximal end of the lead wire 2 on the supply reel 65 side is held by the clamper 68.

  At the same time, as shown in FIG. 8, the first and second upper blocks of the first holding part 71 and the second holding part 73 that stand by above the first to third lead wire processing means 15a to 15c. 71a, 73a is driven in the downward direction by the upper and lower cylinders 81, and the lead wire 2 drawn out by the drawing claw 66 before being formed by the suction hole 82 opened in the lower end surface of the upper blocks 71a, 73a is adsorbed. Retained.

  Next, the molding die 72 operates in the closing direction to form the inclined portion 2t in the middle portion of the lead wire 2. At the same time, the pair of cutters 69 and 74 are operated to cut the lead wire 2 drawn from the supply reel 65 by a length corresponding to the dimension between the pair of cutters 69 and 74. A portion of the lead wire 2 on the downstream side of the second cutter 74 is discharged to the waste box 75.

  The one end portion and the other end portion of the lead wire 2 have different heights depending on the inclined portion 2t. The difference in height is a dimension corresponding to the thickness of the semiconductor cell 1, for example, about 1 mm. The dimensions are very small.

  When the forming and cutting of the lead wire 2 in the first to third lead wire processing means 15a to 15c is completed, the forming die 72 is driven in the opening direction, and then in the horizontal direction orthogonal to the lead wire 2. Driven and retracts from the vertical direction of the lead wire 2. Next, the lead wire 2 formed and processed by the lower end surfaces of the upper blocks 71a and 73a of the first and second holding portions 71 and 73 is sucked and held.

  Next, after the mounting plate 77 to which the upper blocks 71a and 73a are mounted is driven in the upward direction by the upper and lower cylinders 81, the movable member 79 to which the mounting plate 77 is mounted is driven in the -Y direction by the horizontal cylinder 78. The lead wire 2 sucked and held on the lower end surfaces of the upper blocks 71a and 73a is positioned above the first and second blocks 61 and 62 of the lower pressurizing member 60 provided at one end of the conveying means 14. The

  When the formed lead wire 2 is positioned above the first and second blocks 61 and 62 of the lower pressure member 60, the upper blocks 71a and 73a are driven in the downward direction, and FIG. The lead wire 2 (2a) molded as shown in FIG. 3 is transferred to the first and second receiving surfaces 61a and 62a, which are the upper end surfaces of the first and second blocks 61 and 62, and held by suction. .

  Thus, after the lead wire 2 is sucked and held on the first and second receiving surfaces 61a and 62a, the lead wire 2 is positioned on the second receiving surface 62a of the second lower block 62 of the lead wire 2. At the other end bent downward, as shown in FIG. 11B, the semiconductor cell 1 having the three non-conductive tapes 3A attached to the upper and lower surfaces by the second delivery device 48 is supplied and mounted. Placed.

  That is, in the semiconductor cell 1, the three bus bar electrodes 6a connected to the grid 5 formed on the upper surface and the three bus bar electrodes 6b formed on the back surface electrode 7 on the lower surface of the semiconductor cell 1 are each non-conductive. 3A is attached.

  When the semiconductor cell 1 is supplied and placed on the other end of the lead wire 2, the first and second blocks 61 and 62 are driven in the downward direction by the vertical drive means 63 and delivered to the transport means 14. The semiconductor cell 1 having one end of the lead wire 2 (2a) adhered to the lower surface thereof by the transport means 14 is intermittently transported by a distance of the pitch P. This state is shown in FIG.

  When the semiconductor cell 1 is pitch-fed, the first lower block 61 and the second lower block 62 are driven in the upward direction by the vertical driving means 63 as shown in FIG. As a result, the semiconductor cell 1 with the other end of the lead wire 2 attached to the lower surface is raised from the endless belt 53 of the conveying means 14 by the first receiving surface 61 a of the first lower block 61. Thereafter, the next lead wire 2 (2 b) that has been molded is sucked and held by the upper blocks 71 a and 73 a of the first holding portion 71 and the second holding portion 73 and supplied.

  One end of the lead wire 2 (2b) is an upper surface of the semiconductor cell 1 that is sucked and held on the first receiving surface 61a of the first lower block 61 of the lower pressure member 60 via the lead wire 2 (2a). The other end portion is supplied to the receiving surface 62 a of the second lower block 62 of the lower pressure member 60.

  Thereby, the semiconductor cell 1 held on the receiving surface 61a of the first lower block 61 has the other end of the lead wire 2 (2a) attached to the lower surface thereof and the lead wire 2 attached to the upper surface thereof. One end of (2b) is simultaneously pressed by the receiving surface 61a of the first lower block 61 and the lower end surface of the first upper block 71a. That is, the other end portion of the lead wire 2 (2a) first supplied to the upper and lower surfaces of the semiconductor cell 1 and the one end portion of the lead wire 2 (2b) supplied next are temporarily crimped simultaneously.

  When the first upper block 71a and the second upper block 73a take out the lead wire 2 formed by the first to third lead wire processing means 15a to 15c, the upper block 71a uses the upper block 71a. , 73a is set so as to be higher than the pressure when the lead wire 2 is temporarily pressure-bonded to the semiconductor cell 1.

  As a result, the lead wire 2 can be reliably taken out from each of the lead wire processing means 15a to 15c, and the pressure is lower than that at the time of take-off at the time of provisional pressure bonding, so that the lead wire 2 is adhered to the semiconductor cell 1. Can be prevented from deviating from the conductive tape 3A.

  In addition, the first holding part 71 and the second holding part 73 are attached to one mounting plate 77, but each holding part 71, 73 is attached to a separate mounting plate, and each is moved by the upper and lower cylinders 81. You may make it drive up and down.

  By doing so, the gas pressure supplied to each of the upper and lower cylinders 81 is controlled so that the holding portions 71 and 73 contact the lead wire 2 with the same pressure when adsorbing the lead wire 2, and the semiconductor cell 1 is placed on the lead wire 2 later. When temporarily press-fitting, the pressure of the gas supplied to the pair of upper and lower cylinders 81 is controlled so that the pressure at which the holding portions 71 and 73 pressurize the semiconductor cell 1 is optimized according to the state at that time. The damage of the semiconductor cell 1 can be prevented.

  In this way, when the lead wires 2 (2a, 2b) are temporarily pressure-bonded to the upper surface and the lower surface of the semiconductor cell 1 supplied first, the upper blocks of the first holding unit 71 and the second holding unit 73 After 71a and 73a are raised and moved (retracted) in the + Y direction indicated by an arrow in FIG. 8, the second delivery device 48 is connected to the other end of the lead wire 2 (2b) as shown in FIG. 11 (e). The next semiconductor cell 1 is supplied, and the non-conductive tape 3A on the lower surface is attached to the lead wire 2 (2b).

  Next, after the first and second blocks 61 and 62 are driven in the downward direction and the two semiconductor cells 1 electrically connected by the lead wire 2 (2b) are transferred to the endless belt 53, FIG. As shown in (f), these semiconductor cells 1 are intermittently fed by a pitch P distance by an endless belt 53.

  Thereafter, the upper blocks 71a and 73a holding the molded lead wire 2 on the lower end surface are driven in the -Y direction and positioned above the endless belt 53 of the conveying means 14, and then driven in the downward direction. The lead wire 2 (2c) is supplied as shown by the chain line in FIG.

  One end of the lead wire 2 (2c) is supplied and positioned on the upper surface of the semiconductor cell 1 on the receiving surface 61a of the first lower block 61, and the other end is the second receiving surface of the second lower block 62. Supply positioning to 62a.

  Thereby, the other end of the lead wire 2 (2b) and one end of the lead wire 2 (2c) are connected to the lower surface and the upper surface of the semiconductor cell 1 on the receiving surface 61a of the first lower block 61. The receiving surface 61a of the first lower block 61 and the lower end surface of the first upper block 71a are pressurized and temporarily pressed.

  By repeatedly performing such temporary pressure bonding, a plurality of, for example, twelve semiconductor cells 1 become a string 1A connected in a row by lead wires 2a to 2n as shown in FIG. That is, the string 1A in a temporarily press-bonded state is obtained in which the other end portion and one end portion of the lead wire 2 are temporarily press-bonded sequentially to the lower surface and the upper surface of the semiconductor cell 1.

  When the lead wire 2 is temporarily press-bonded to the semiconductor cell 1 with the non-conductive tape 3A, the fine particles contained in the non-conductive tape 3A may not be crushed. At that time, the semiconductor cell 1 and the lead wire 2 are not pressed. And may not be electrically connected.

  Thus, if the other end portion and one end portion of the lead wire 2 are sequentially temporarily crimped to the lower surface and the upper surface of the semiconductor cell 1 to form the string 1A in a temporarily crimped state, the semiconductor cells constituting the string 1A The number of 1s can be any number, not just twelve.

  Further, as shown in FIGS. 11B, 11D and 11F, the lead wire 2 is temporarily pressure-bonded to the semiconductor cell 1 provided only in one of the first block 61 and the second block 62. In this case, as described above, if the first holding portion 71 and the second holding portion 73 are connected to the upper and lower cylinders 81 by separate mounting plates, one holding portion 71 for temporarily pressing the semiconductor cell 1 to the lead wire 2 or The pressure applied to 73 can be made smaller than the other holding part. Thereby, it is possible to prevent the semiconductor cell 1 from being excessively pressurized and damaged.

  The temporarily crimped string 1A composed of twelve semiconductor cells 1 is transported by the transport means 14, and the semiconductor cell 1 at the tip is opposed to the main crimping means 16 located at the forefront of the three final crimping means 16 in the + X direction. When the lead wire 2 is temporarily crimped to the first, fifth and ninth semiconductor cells 1, it is finally crimped simultaneously by the three permanent crimping means 16.

  As shown in FIG. 12, the main crimping means 16 includes a plate-like upper movable member 86 that is disposed above the endless belt 53 of the conveying means 14 and is driven up and down by an upper cylinder 85, and a lower cylinder 87 that is disposed below. Has a plate-like lower movable member 88 that is driven up and down.

  On the lower surface of the upper movable member 86, three upper pressurizing tools 91 heated by a heater 91a are provided at predetermined intervals which will be described later. On the upper surface of the lower movable member 88, three lower pressure tools 92 heated by a heater 92a are provided at positions corresponding to the upper pressure tool 91.

  The upper pressure tool 91 and the lower pressure tool 92 can be driven in the upward and downward directions by the cylinders 85 and 87 in two strokes.

  The pressurizing tools 91 and 92 are provided at intervals corresponding to the three lead wires 2 temporarily bonded to the upper and lower surfaces of the semiconductor cell 1. An upper cushion tape 94 is interposed between the upper pressure tool 91 and the upper surface of the semiconductor cell 1, and a lower cushion tape 95 is interposed between the lower pressure tool 92 and the lower surface of the semiconductor cell 1. .

  The cushion tapes 94 and 95 are fed out from the supply reel 96, guided by a pair of guide rollers 97, travel parallel to the upper and lower surfaces of the semiconductor cell 1, and are taken up by the take-up reel 98. .

  Although not shown in detail, the upper and lower supply reels 96, guide rollers 97, and take-up reels 98 move up and down integrally with the upper and lower pressurizing tools 91 and 92 of the main crimping means 16. It is supposed to be.

  When the string 1A is transported and the first, fifth and ninth semiconductor cells 1 are positioned with respect to the three main crimping means 16, the upper pressurizing tool 91 of each final crimping means 16 is lowered. The lower pressure tool 92 is driven in the upward direction. As a result, each of the three lead wires 2 temporarily bonded to the upper and lower surfaces of the first, fifth and ninth semiconductor cells 1 of the string 1A is heated while being pressed by the pressing tools 91 and 92. Is done.

  As a result, the non-conductive tape 3A having the lead wire 2 attached to the semiconductor cell 1 is melted and cured by the heat of the upper and lower pressurizing tools 91 and 92. Is done. That is, the lead wires 2 are finally crimped to the upper and lower surfaces of the semiconductor cell 1 simultaneously, that is, at the same timing.

  The upper and lower pressure tools 91 and 92 are driven in the upward and downward directions by the cylinders 85 and 87 at the time of the main press-bonding, and the smaller one of the two strokes is performed. Thereby, the tact time required for the main pressure bonding can be shortened.

  In this way, when the lead wire 2 is finally crimped to the first, fifth and ninth semiconductor cells 1 of the string 1A, the string 1A is intermittently conveyed by 1 pitch P. Thereby, the second, sixth and tenth semiconductor cells 1 are positioned opposite to the three main crimping means 16.

  Thereafter, the three main crimping means 16 are actuated and the lead wires 2 are finally crimped to the semiconductor cells 1, and then the string 1A is intermittently transported at a pitch P and the final crimping is performed four times in total. If it repeats, all the lead wires 2 temporarily press-bonded to the twelve semiconductor cells 1 can be finally pressure-bonded.

  At least the surface of each lead wire 2a to 2n attached to the non-conductive tape 3A is formed into a rough surface 2s having a convex portion 2x and a concave portion 2y.

  Therefore, when the lead wires 2a to 2n temporarily bonded to the bus bar electrode 6a on the upper surface and the bus bar electrode 6b on the lower surface of the semiconductor cell 1 by the non-conductive tape 3A are finally bonded, the lead wires 2a to 2n are the upper pressurizing tool. Before the non-conductive tape 3A is melted and hardened by being pressurized and heated by 91 and the lower pressure tool 92, as shown in FIG. 15, the convex portions 2x of the lead wires 2a to 2n are non-conductive. The tape 3A is pushed away to contact the upper bus bar electrode 6a and the lower bus bar electrode 6b to be electrically connected.

  At the same time, the nonconductive tape 3A pushed away by the convex portion 2x enters the concave portion 2y of the lead wires 2a to 2n. Therefore, since the non-conductive tape 3A is cured while the flow of the portion pushed away by the convex portion 2x is smoothly performed at the time of the final press bonding, the lead wires 2a to 2n are connected to the bus bar electrode 6 and the back electrode 7. Smooth and reliable electrical connection can be achieved.

  In this way, the string 1A, to which all the lead wires 2 connected to the twelve semiconductor cells 1 are finally pressure-bonded, is unloaded from the transfer means 14 by the discharge means 17 and stored in the stocker 19.

  When carrying out the string 1 </ b> A by the discharge means 17, the upper pressurizing tool 91 and the lower pressurizing tool 92 of each main crimping means 16 are driven by a large stroke of each cylinder 85, 87.

  As a result, the distance between the upper pressure tool 91 and the lower pressure tool 92 can be made sufficiently large, so that the suction pad 105 of the discharge means 17 is placed between the upper pressure tool 91 and the lower pressure tool 92. It can surely get in.

  The discharging means 17 has a horizontal movable member 101 formed in a length corresponding to the string 1A as shown in FIG. The horizontal movable member 101 has a plurality of, for example, two horizontal cylinders 102 retracted from above the conveying means 14, that is, a position waiting above the stocker 19 indicated by a solid line in FIG. 13, and a conveying means 14 indicated by a chain line. It is driven in the Y direction between positions facing upward.

  As shown in FIGS. 13 and 14, a vertically movable member 104 is provided on the lower surface of the horizontal movable member 101 so as to be driven in the vertical direction by a plurality of vertical cylinders 103. In this vertically movable member 104, a plurality of pairs of 12 pieces of suction pads 105 (only two shown in FIG. 14) perpendicular to the axis are arranged in groups of four that hold the four corners of each semiconductor cell 1 of the string 1A. Is provided. Each suction pad 105 is connected to a suction pump (not shown) so as to generate a suction force.

  When the lead wires 2 of the twelve semiconductor cells 1 of the string 1A are finally crimped, the horizontal movable member 101 is driven and positioned above the string 1A above the conveying means 14 by the horizontal cylinder 102.

  Next, the upper and lower cylinders 103 are operated to drive the vertical movable member 104 in the downward direction. As a result, the upper four corners of the twelve semiconductor cells 1 are sucked by the four suction pads 105 of each set provided on the vertically movable member 104.

  When the suction pad 105 sucks the semiconductor cell 1, the up and down movable member 104 is raised, and the horizontal movable member 101 is driven in the backward direction that is the + Y direction, and is positioned above the inspection unit 18. The string 1A is supplied to the inspection unit 18, where the connection state of the lead wires 2 connected to the upper and lower surfaces is inspected. After the pass / fail judgment is made by the inspection, it is stored in the stocker 19 provided in the + Y direction, which is the backward direction from the inspection unit 8.

  A string 1A in which twelve semiconductor cells 1 are connected in series is ultimately required to have a preset generated power. On the other hand, the generated power of each semiconductor cell 1 varies. Therefore, the first storage 21 and the second storage 22 of the supply unit 12 are provided with the semiconductor cells 1 having different generated power.

  Then, when configuring the string 1A of predetermined generated power, the number of semiconductor cells 1 from the first storage 21 and the semiconductor cells from the second storage 22 supplied to the tape adhering means 13 of the supply unit 12 By setting the number of 1 according to the required generated power of the string 1A, it is possible to configure the desired generated power string 1A.

  That is, by providing the first and second storages 21 and 22 in the supply unit 12, even if the output power of each semiconductor cell 1 is different, the power generated by the solar cell module, which is the string 1A, is required. The generated power can be set.

  As described above, according to the lead wire connecting device having the above configuration, the non-conductive tape 3A cut to a predetermined length is attached to the bus bar electrode 6 and the back electrode 7 formed on the upper and lower surfaces of the semiconductor cell 1. In doing so, it was performed simultaneously on the upper and lower surfaces of the semiconductor cell 1.

  Therefore, when the non-conductive tape 3A is adhered to the semiconductor cell 1, it can be performed without bending the semiconductor cell 1 upward or downward, thereby preventing the semiconductor cell 1 from cracking. Can do. In addition, since the non-conductive tape 3A can be attached to the upper and lower surfaces of the semiconductor cell 1 at the same time, productivity can be improved and the apparatus configuration can be made compact as compared with the case where the non-conductive tape 3A is separately performed.

  When the lead wire 2 molded into a predetermined shape is temporarily press-bonded to the semiconductor cell 1 to which the non-conductive tape 3A is attached, the temporary press-bonding is simultaneously performed on the upper and lower surfaces of the semiconductor cell 1. I made it.

  For this reason, the semiconductor cell 1 can be formed without being bent upward or downward, thereby preventing the semiconductor cell 1 from being cracked. Moreover, since the lead wires 2 can be temporarily bonded to the upper and lower surfaces of the semiconductor cell 1, productivity can be improved and the apparatus configuration can be simplified as compared with the case where the lead wires 2 are separately performed.

  When the lead wires 2 temporarily bonded to the upper and lower surfaces of the semiconductor cell 1 are finally bonded, the main bonding is simultaneously performed on the upper and lower surfaces of the semiconductor cell 1.

  For this reason, the semiconductor cell 1 can be formed without being bent upward or downward, thereby preventing the semiconductor cell 1 from being cracked. In addition, since the lead wires 2 can be main-bonded simultaneously to the upper and lower surfaces of the semiconductor cell 1, productivity can be improved and the apparatus configuration can be simplified as compared with the case where they are separately performed.

  At least each of the electrodes of the lead wire 2 that is finally pressure-bonded to the bus bar electrode 6a formed on the upper surface of the semiconductor cell 1 and the bus bar electrode 6b formed on the back electrode 7 on the lower surface via a non-conductive tape 3A. The surfaces facing 6a and 6b were formed on the rough surface 2s.

  Therefore, when the lead wire 2 is pressurized and heated by the upper pressurizing tool 91 and the lower pressurizing tool 92 and finally press-bonded, the convex portion 2x of the rough surface 2s is pushed away from the melted non-conductive tape 3A. Since the electrodes 6a and 6b are contacted, the lead wire 2 can be reliably electrically connected to the electrodes 6a and 6b. That is, the lead wire 2 can be electrically and reliably connected to the bus bar electrodes 6a and 6b on the upper and lower surfaces of the semiconductor cell 1 without using an expensive conductive tape 3 as in the prior art.

  When a part of the melted non-conductive tape 3A is pushed away by the convex portion 2x of the lead wire 2, the pushed-out portion flows into the concave portion 2y of the lead wire 2. Therefore, since the non-conductive tape 3A melted at the time of the main press is smoothly flowed without greatly protruding to the periphery, the main press can be smoothly performed by using the lead wire 2 on which the rough surface 2s is formed. .

  That is, the lead wire 2 can be electrically connected to the bus bar electrodes 6a and 6b using the non-conductive tape 3A, which is cheaper than the conventional conductive adhesive tape, so that the string as a solar cell module can be obtained. The manufacturing cost of 1A can be reduced.

  In the above-described embodiment, bus bar electrodes formed on the upper and rear surfaces of the semiconductor cell are cited as the front electrode, and the lead wire 2 is connected to each bus bar electrode via a non-conductive tape. In such a case, the lead wire is connected to the grid electrode via a non-conductive tape, and the lead wire is connected to the bottom surface on the back surface. You may make it connect to an electrode via a nonelectroconductive tape. In such a case, the grid electrode and the back electrode are front electrodes.

  According to a semiconductor cell having a structure in which a bus bar electrode as a surface electrode is not provided, the above-described bus bar electrode formed of a relatively expensive metal such as silver is not necessary, thereby reducing costs and simplifying manufacturing. Can do.

  Further, when bus bar electrodes are provided on both the front and back surfaces of the semiconductor cell, the width dimension of the bus bar electrodes must be larger than the width dimension of the lead wires. In that case, the conversion efficiency of the surface of the semiconductor cell is reduced by covering the surface of the semiconductor cell with the bus bar electrode having a width dimension larger than that of the lead wire, but if the bus bar electrode is not provided, it is provided. Compared with the case, the conversion efficiency of the semiconductor cell can be improved.

  In addition, you may make it provide a bus-bar electrode only in one surface of the upper surface and back surface of a semiconductor cell.

  The lead wire has an uneven rough surface, which can be formed at a place other than the connection device. For this reason, the connecting device is not contaminated by dust generated by forming the rough surface on the lead wire. In addition, since the lead wire is formed of a relatively soft metal such as copper, the rough surface can be easily formed at a low cost.

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor cell, 2, 2a-2n ... Lead wire, 2x ... Convex part, 2y ... Concave surface, 2s ... Rough surface, 3 ... Conductive tape, 6a, 6b ... Bus-bar electrode (surface electrode), 12 ... Supply part, DESCRIPTION OF SYMBOLS 13 ... Tape sticking means, 14 ... Conveyance means, 15 ... Temporary pressure bonding means, 15a-15c ... 1st thru | or 3rd lead wire processing means, 16 ... Main pressure bonding means, 17 ... Discharge means, 18 ... Inspection part, 24 DESCRIPTION OF SYMBOLS 1st delivery apparatus, 25 ... Alignment stage, 31 ... 1st tape sticking part, 32 ... 2nd tape sticking part, 35 ... 1st sticking table, 36 ... 2nd sticking table, 48 ... second delivery device, 65 ... supply reel, 91 ... upper pressure tool, 92 ... lower pressure tool.

Claims (3)

A lead wire connecting device in which a plurality of semiconductor cells arranged in a row are electrically connected via surface electrodes formed on the upper surface and the back surface thereof to form a solar cell module,
A supply part of the semiconductor cell;
Tape adhering means for adhering an adhesive non-conductive tape cut to a predetermined length on the surface electrodes formed on the upper and lower surfaces of the semiconductor cell supplied from the supply unit;
Transport means for supplying the semiconductor cells with the conductive tape attached to the upper and lower surface electrodes by the tape attaching means and pitch-feeding the semiconductor cells;
A lead wire processing means for forming and processing a lead wire, which is formed into a rough surface having an uneven surface, connected to the surface electrode of at least an adjacent semiconductor cell, into a shape that bends in a vertical direction with a middle portion in the longitudinal direction as a boundary; ,
A lead wire provided at a portion facing the semiconductor cell pitch-fed by the transport means is held on the surface electrodes on the upper and lower surfaces of the semiconductor cell that is pitch-fed while holding the lead wire formed by the lead wire processing means. Temporary crimping means for alternately electrically connecting to the upper and lower surface electrodes of the adjacent semiconductor cells by repeating temporary crimping of the rough surface of the lead wire to the non-conductive tape attached;
A pair of upper and lower surfaces disposed at a position opposite to the semiconductor cell on the downstream side of the transport direction of the semiconductor cell by the transport means than the temporary pressure bonding means and temporarily pressure-bonded to the upper and lower surface electrodes of the semiconductor cell by the temporary pressure bonding means. And a main press-bonding means for electrically connecting the lead wire and the surface electrode through a convex portion of the rough surface of the lead wire by simultaneously press-bonding the lead wire at the same time. Cell lead wire connection device. A lead wire connection method in which a plurality of semiconductor cells arranged in a row are electrically connected via surface electrodes formed on the upper surface and the back surface thereof to form a solar cell module,
Adhering an adhesive non-conductive tape cut to a predetermined length on the upper and lower surface electrodes of the semiconductor cell; and
One of the two lead wires in which at least the surface to be bonded to the nonconductive tape is formed into an uneven rough surface on the nonconductive tape adhered to the upper and lower surface electrodes of the semiconductor cell. And temporarily connecting the other end of the other end of the other through the rough surface and alternately connecting the upper and lower surfaces of the adjacent semiconductor cells,
The pair of upper and lower lead wires temporarily bonded to the upper surface and the lower surface of the semiconductor cell are subjected to main pressure bonding so that the lead wire and the surface electrode are electrically connected to each other through the convex portion of the rough surface of the lead wire. A method for connecting lead wires of a semiconductor cell, comprising: a connecting step. A solar cell module configured by electrically connecting a plurality of semiconductor cells arranged in a row through front surface electrodes formed on the upper surface and the back surface thereof,
Adhesive non-conductive tape that is attached to the upper and lower surface electrodes of the semiconductor cell,
At least the surface to be attached to the non-conductive tape is formed as a rough surface with irregularities, and one end in the longitudinal direction is temporarily pressure-bonded to the upper and lower surface electrodes of a pair of adjacent semiconductor cells, and the other end is By temporarily pressing the upper and lower surface electrodes of the other semiconductor cell and then pressing both ends of the semiconductor cell, one end and the other end are electrically connected to the surface electrode via the rough surface convex portion, respectively. A solar cell module comprising: a connected lead wire.

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