TW201128124A - LED light source - Google Patents

Abstract

The invention discloses a LED light source, comprising a control circuit module, a shell, an energy conversion component, a heat pipe, and a cooling component. The shell comprises a dome and a side wall, and the shell contains the control circuit module. The energy conversion component comprises a substrate, a substrate holder, and at least a LED, wherein the LED is disposed on the substrate, the substrate is connected to the substrate holder, and the substrate holder is coupled to the control circuit module to drive the energy conversion component. The heat pipe comprises a flat part, an extension part, and a contact part, wherein the substrate and the substrate holder of the energy conversion component are disposed on the flat part; the extension part, disposed inside the shell, extends toward a direction. The cooling component, comprises a plurality of fins, wherein the fins contacts the contact part respectively. The control circuit module is disposed between the energy conversion component and the cooling component.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting diode light source, and more particularly to a light-emitting diode light source having an appearance similar to a light bulb and accommodating a control module circuit. [Prior Art] With the increasing popularity of semiconductor light-emitting elements, light-emitting diodes have become a new type of wire because of their power saving, shock resistance, fast response, and suitable mass production. In general, a light-emitting diode with a light-emitting diode as a light source is more powerful than a light-emitting diode. However, a high-power light-emitting diode can provide sufficient light. Lighting, but also j to heat the problem. For example, if the trajectory generated by the LED in operation fails to escape in time, the LED will be affected by the luminous efficiency and reduce the service life. In addition, the solution of the traditional light-emitting diodes is 'the heat-dissipating members usually have a few Koreans> for heat dissipation' and the above-mentioned plurality of fins often need to be close to the light-emitting diodes. The load-carrying high-efficiency heat-dissipation efficiency of the power-emitting diodes of the power-emitting diodes occupies a large space, and if a plurality of crane pieces are required to be closely attached to the stage of the light-receiving diodes Space utilization creates limits. j...'a In addition, the right control circuit should be placed in the heating problem of the lighting device, and it is not easy to make the size of the carrier that can not be matched with the lamp socket or the device bulb, and even = 201128124 Replace the traditional light bulb. Lai Ya Zhi Lang, so that a fin can be placed in the appropriate position, not limited to the close to the light-emitting diode. Moreover, how to reduce the heating of the control circuit so that it can be placed in the Xia Xia set, and now the design of the Zhaoxian set with the light-emitting diode of the still power as the light source [Invention]

The invention is a kind of illuminating two-pole bribe source, which can reduce the heating of the circuit, so that the control module circuit can be placed in the illuminating two "^ original = and the material diode source can be made into an approximate bulb. The appearance is such that it can arbitrarily replace the conventional light bulb. According to the embodiment of the present invention, the light-emitting diode lamp source of the present invention includes a control module circuit, a casing, an energy conversion member, a pipe and a heat dissipating member. The outer casing includes a top surface and a side wall for accommodating the control module circuit. The energy conversion member includes a substrate, a substrate fixing member and at least one 'light emitting diode, the light emitting diode is located on the substrate, and the substrate is fixedly connected to the substrate, and The substrate fixing member and the control group circuit are electrically connected to the dynamic energy conversion member. The heat pipe comprises a flat portion, an extending portion and a contact portion, wherein the substrate and the substrate fixing member of the energy conversion member are located above the flat portion, and the extending portion is located in the outer casing And extending in the - direction. The heat dissipating member includes a plurality of fins, wherein the fins respectively contact the contact portion. The control module circuit is located between the energy exchange member and the heat dissipating member 'Shall be the actual financial' heat radiating member having a receiving space, the contact portion housed 201128124

And: =:: two and: the catheter runs through the control module ^π, has the younger month of the hot section and the second I敎. And the first - the heat sink is adjacent to the second divergence, point well; 7^ from the sigh Two heat dissipation parts:: accommodation space. Further, the first heat dissipating portion and the portion of the hook are engaged with each other to fix the contact portion to the accommodating space. τ is at least in addition to the actual application, wherein the outer casing further comprises a bottom and the heat dissipating member may comprise at least one locking hole, with == holding the other 'heat dissipating member and the circuit receiving member=====heat: The heat energy generated by the heat pipe changing member. Handle diffusion energy transfer

In addition, in practical applications, the housing is more suitable for connecting the p-module circuit to provide the (4) fishing circuit and the electrical energy required for the operation of the device. Here, the light source of the light emitting diode is more sturdy, the connection H is electrically connected to the lamp holder, and the lamp holder is adapted to be wired to the socket of the lamp holder and used for coupling to an external power source. Further, the light source of the light emitting diode can have an appearance shape and an appearance shape similar to that of the light bulb. In summary, the light-emitting diode lamp source of the present invention has a fixed structure appearance and can include different numbers and different luminous efficiency of the light-emitting diodes, and can be used to fill the space of the light-emitting one-pole light source. In particular, the control circuit can be placed between the energy conversion member and the heat dissipating member, and the light source diode lamp can be used in a conventional lamp socket sleeve to replace the conventional bulb. The advantages and spirit of the present invention can be further understood by the following detailed description of the invention and the drawings of 201128124. [Embodiment] Referring to FIG. 1 and FIG. 2 together, FIG. 1 is a perspective view showing a light source of a light-emitting diode according to an embodiment of the present invention. Figure 2 is a cross-sectional view showing the light-emitting diode lamp of a specific embodiment of the present invention. 2 is a cross-sectional view of the line Α-Α' along the 发光-direction of the light source of the light-emitting diode in the perspective view of FIG. As shown in the figure, the light-emitting diode lamp source 1 has a structural appearance including the energy conversion member 10, the circuit housing member U, the heat pipe Η, the heat radiating member 16, the averaging device 18, and the socket 19. Among them, the circuit housing member 12 includes an upper surface 124a and a lower surface intestine. The heat pipe 14 includes a flat portion 140 and a contact portion 142. The heat dissipating member I6 includes a plurality of tabs 160. The other aspect of the structure may include an outer casing having a top surface and a side wall, wherein the top surface of the outer casing may correspond to the homogenizer 18, and the side walls of the outer casing may conform to the side walls of the circuit receiving member 12. The outer casing may further include a bottom surface corresponding to the lower surface 12 of the circuit receiving member 12. The energy conversion member 10 sees through the upper surface 124a, and the energy conversion member packs s at least one light emitting diode for generating light energy. In practice, the energy conversion member 1G is intended to provide a light-emitting diode to emit light, but is not limited to the manner in which the plurality of light-emitting diodes are mounted. For example, the energy conversion member 1G may include a substrate and a substrate holder, and the light emitting body may be located on the substrate. The substrate is connected to the substrate fixing member to expose the light emitting diode. In the middle of the ' 户 户 发光 发光 发光 发光 可 可 ; ; ; ; ; ; ; ; ; ; ; ; 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 The soil anti-solid material of 10 may include a first recessed portion and a first recessed portion communicating with the first recessed portion, the substrate contacting the flat portion 14G of the heat pipe 14 and connected to the second recessed portion, the light emitting diode being exposed In the first - depression.

The accommodating space of the road accommodating member 12 between the first plane 124a and the second plane (10) has a accommodating space for accommodating the control module circuit 120. Further, the circuit accommodating member 12 further houses the connector 122. The connector 122 is electrically connected to the f-module circuit 12G and provides power required for the control module circuit 12A and the energy conversion member 1G to operate. In addition, the control module circuit 120 and the connector 122 can be mounted on the circuit board 126. Moreover, the light source diode 1 includes a socket 19, the connector 122 is electrically connected to the socket 19, and the socket I9 is adapted to be placed in the socket sleeve 2 and used to connect an external power source. In practice, the lamp holder 19 has an insulating layer 19, and the lamp holder 19 is divided into two conductive regions, respectively, which are connected to the positive and negative terminals of the external power source. For example, the L1 and the L2 can be electrically connected to the positive and negative terminals of the external power supply. The control module circuit 120 may have a through hole in the center for the heat pipe 14 to pass therethrough. On the other hand, the control module circuit 12 may also be a distributed circuit disposed around the heat pipe 14. The heat pipe 14 includes a flat portion 14 , an extension portion 142 , and a contact portion 144 , wherein the flat portion contacts the energy conversion member 10 , and the extension portion 142 is located in the circuit receiving member 12 and extends toward one of the outer sides of the energy conversion member 1 . The contact portion 144 penetrates the lower surface. In practice, the heat pipe 14 is a hollow structure that can be cylindrical in shape and has a capillary structure' in which a high thermal conductivity material can be filled in order to accelerate thermal conductivity. In addition, since the extension portion 142 is located in the circuit receiving member 12, and the circuit housing member 12 can include a plurality of circuits inside the 201128124, in order to prevent the extension portion 142 from dissipating heat in the circuit valley member 12, the extension portion can be packaged. A layer of insulating sleeve (not shown) is applied to reduce the heat release of the heat pipe 14 in the capacitor member 12. The heat dissipating member 16 includes a plurality of fins 160, wherein each of the fins 16A contacts the contact portion 144 of the heat pipe 14, respectively. In practice, the heat dissipating member 16 may have a cylindrical shape, wherein each of the fins 16A may be parallel to the direction in which the contact portion 144 extends and radiate outwardly, extending outward from the center of the cylinder. In addition, the heat dissipating member 16 may have an accommodating space 162 therein, and each of the fins 160 respectively contacts the accommodating space 162 and extends outward. The contact portion 144 of the heat pipe 14 can be received in the accommodating space 162 to be in contact with the plurality of fins 160. It should be noted that the appearance of the heat dissipating member 16 is not limited to the cylindrical body, and the plurality of fins 16 in the heat dissipating member 16 can further extend the direction of the vertical contact portion 144, and the plurality of fins 16 can be Stacked on each other to form a rectangular cube. In addition, each of the fins 16A may have a through hole 'contact portion 144 passing through the through hole to contact each of the fins 〇6〇. In response to the above, the heat dissipating member 16 can include at least one locking hole for engaging at least one of the screw-locking heat dissipating members 16 on the lower surface 124b of the circuit receiving member 12. In practice, the heat dissipating member 16 is not limited to being locked to the lower surface 124b by screws, and the heat dissipating member 16 and the lower surface 12 of the circuit receiving member 12 can be held by at least one hook. The optical device 18 is disposed on the outer surface 12 of the circuit receiving member 12, and the energy conversion member 10 is located between the homogenizer 18 and the upper surface 124a. The homogenizer 18 is used to diffuse the light energy generated by the energy conversion member 1 . In practice, the 201128124 optical unit 18 can be attached to the upper surface 12乜 with screws or hooks. In addition, the homogenizer 18 may be in the shape of a flat plate or a curved surface, which is not limited herein. In the present embodiment, the uniform light H 18 is in the shape of a curved surface, so that the light emitted by the energy conversion member 10 can be less than the total reflection angle when penetrating the medium of the homogenizer 18, which can be reduced. The total reflection effect of the light energy generated by the energy conversion member 1 进而 further increases the face of the flow that can pass through the touch.

, the overall J said that 'the light-emitting diode lamp source 1 has an appearance similar to the bulb = in the direction of the direction, the circuit receiving member u is located between the energy conversion structure 1 and the heat-dissipating member 16' and thus the control module The circuit 12 can be accommodated in the light source 2 of the light-emitting diode, so that it can replace the traditional lamp on the other hand, and the tube 14^ heat-fills the heat guide, the valley is placed in the second room 162, and the heat is dissipated. The member 16 has a knives of two + portions 'the two halves and the two halves are connected to each other to secure the knuckle H4. For example, /Jit is placed in the accommodating space 162, and the second flute, the horn 16 can be divided into the first heat dissipating portion and the second portion of the heat dissipating member 16 - purely Set the space. In addition to the Ministry of Health, with the description of the drawings. Please refer to Figure 2 and Figure 2 for a part of the invention. (6) A plurality of fins 16 are included. As shown in the figure, the first heat dissipation has a recess 162a. In practice, the first hot-spot (the recess 162a of the M6a is matched with the disc-shaped T-die, and the receiving * door, t heat-dissipating portion can be formed. (not shown) the groove inter-working chamber 162 for accommodating the heat pipe 14. This 201128124 y yy month is underheated. The p 10a and the second heat dissipating portion may include a plurality of screw holes and screws to lock each other. In this way, the heat pipe is treated, and then == can also include the card-A heat. For example, please refer to FIG. 3B, FIG. 3 - the embodiment of the first embodiment of the heat dissipating member - the hot part And the second heat dissipating portion may respectively include a 1 = 168 link to a hook 169, so that the first 埼舳, 咚丨 and the boss is held by the hook 169 'by clamping the heat pipe to n: one The hooks and the hooks can be closely attached to each other. It is worthy of note two: two heat sinks can be requested - a possible example is shown in the figure ~=; the raised portion 168 and the place to be used for the first heat sink The portion (6) and the second heat sink are disposed in the other suitable holes 166, and the second heat dissipating portion may respectively include a locking screw to be locked on the lower surface 124b, "°°^::, the portion is not limited to the use of the circuit housing structure (4) The lower surface ===_;=; and the energy conversion member of the diode lamp source can be matched with: the light-emitting: pole, the flat portion of the device conduit of the energy conversion member _ to strengthen the conversion member can contact the heat exchange member and the load The concrete details of the table are engraved with a number of energy transfer examples, which illustrate the structure and relative relationship between the energy conversion member and the 201128124 stage.

Please refer to Figure 4A and Figure 4B. Fig. 4A is a plan view showing the energy conversion member and the stage of the light emitting diode lamp source. Figure 4B is a cross-sectional view of the energy conversion member, the stage and a portion of the heat pipe taken along line z_z of Figure 4A. According to a preferred embodiment, the energy conversion member 1A includes a light emitting semiconductor structure 102, a substrate 1〇4, and a substrate holder 1〇6. The light-emitting semiconductor structure 1 is the aforementioned light-emitting diode. The energy conversion member 1 is located on the substrate 104. The substrate fixing member 106 includes a first recessed portion 1 and a second recessed portion communicating with the first recessed portion 106a. The substrate 1〇4 contacts the flat portion _ and is connected to the second recessed portion 106b, and the light emitting semiconductor structure 1 The crucible 2 is exposed to the first recessed portion 106a. The stage 22 is also formed with a through hole 222 through which a power supply line is passed, which can be used to supply the energy of the energy conversion member 1 .曰 In the above, the light-emitting semiconductor structure 102 is an independent wafer and is fixed. Although the vocabulary is constructed (10) and the time of the lining 24 pulls the wire on the (fourth) pole, and then through the base _ fixed member 106, the electrode is welded to the electrode 1G6e and the control module circuit hole _ lock =]: === via the pass energy, the example of the coffin 108 also has an optical modulation work ^ ^ mm a good embodiment, energy (four) member 1G and contains the effect of light, on the invention 06. This lens 26 also has a core that does not emit material. By appropriately designing the lens 12 201128124, the effect of collecting or dispersing light is not limited to the lens structure of the member of the optical modulation member. Xingxian::The system & has a depression in the middle, so the lens structure can be roughly focused into a ring

Please continue to participate in 4A and Figure 4B. In addition, the lead frame of the material is manufactured in the mold, and is manufactured by means of Llqmd CryStal Plastic (Lcp), so that the inner electrode is exposed in the first recess 106a and is on the substrate. The outer electrode 106c is exposed on the piece 〇6. Further, the light-emitting semiconductor structure 1〇2 is also connected in series by the drawing line ' as shown by the broken line in Fig. 4B. At this time, in the light-emitting half of Fig. 4B, ι 2 only retains the --metal line μ electrically connected to the substrate holder ι. If the substrate 104 has a semiconductor substrate such as a county towel-shaped secret circuit or a circuit board having a metal-clad circuit, the light-emitting semiconductor structure 1〇2 can be drawn onto the substrate 104 first, and then the substrate 1() 4 It is electrically connected to the substrate fixing member 1〇6. If the substrate 104 is not designed to be electrically connected, the substrate 104 may be metal or other material having a high thermal conductivity to increase the heat transfer efficiency of the heat generated by the light-emitting semiconductor structure 102 to the flat portion 14A. Referring to FIG. 5, FIG. 5 is a cross-sectional view showing an energy conversion member, a stage, and a portion of a heat pipe according to an embodiment. Different from FIG. 4A and FIG. 4B, the substrate 1〇4 of FIG. 5 is completely accommodated in the second recess 106b′. Therefore, the bottom surface l〇6e of the substrate fixing member 1〇6 protrudes slightly from the bottom surface l〇4a of the substrate 104. (to be in contact with the flat portion 14〇). Correspondingly, the flat portion tSl 13 201128124 portion 140 protrudes from the stage 22 . The height at which the flat portion 140 protrudes is slightly larger than the depth at which the bottom surface 104a of the substrate 104 is recessed to ensure that the substrate 1〇4 abuts the flat portion 140. For the same design reason, the flat portion 14A can only protrude slightly from the stage 22, and the bottom surface i〇6e of the substrate holder 1〇6 is substantially coplanar with the bottom surface 104a of the substrate 1〇4, and the above-mentioned securing is also achieved. The purpose of the post. In the structure shown in FIG. 4B, if there is a gap between the substrate fixing member 1〇6 and the flat portion 140, the thermal conductive adhesive may be applied to the bottom surface or the flat portion 140 of the substrate fixing member 106 in advance to make the thermal conductive adhesive. Can fill the gap. Of course, in the structure shown in FIG. 5, the thermal conductive adhesive may be applied to the bottom surface l〇6e or the flat portion 140 of the substrate fixing member 106 in advance to fill the surface roughness of the bottom surface 1〇6e or the flat portion 140. Void. Please refer to Figure 4B and Figure 6. 6 is a cross-sectional view showing an energy conversion member, a stage, and a part of a heat pipe according to another embodiment. FIG. 4B is different in that the semiconductor structure 1〇2 of the FIG. 6 is directly formed on the substrate. On 1〇4, for example, the substrate 1〇4 itself is a semiconductor substrate (for example, a stone substrate). Therefore, the light emitting semiconductor structure 102 can be integrally formed on the substrate 1?4 in an integrated semiconductor process. Moreover, the electrodes of the light-emitting semiconductor structure 102 formed directly on the semiconductor substrate 104 can be integrated into the substrate in advance, so that the entire energy conversion member 10 requires only two wires for the stability of the lifting process. ' Please refer to Figure 4B and Figure 7. Figure 7 is a green diagram showing the energy conversion member, the stage and a part of the heat pipe according to another embodiment. The disk diagram 4B differs in that the light-emitting semiconductor structure 1〇2 of Fig. 7 is not disposed on the substrate 104 as shown in Fig. 4B but is directly disposed on the substrate holder 106' having a recess 106f. In addition, in practical use, the substrate fixing member 106' may directly be a flat plate, and the light emitting semiconductor structure 1〇2 is directly disposed thereon. Other descriptions of the energy conversion member 1 of Fig. 4B are also applicable here and will not be described again. Please refer to Figure 7 and Figure 8. Figure 8 is a cross-sectional view showing an energy conversion member, a stage, and a portion of a heat pipe according to still another embodiment. The difference from Fig. 4B is that the light-emitting semiconductor structure 1〇2 of Fig. 8 is directly formed on the substrate holder 106'. Of course, in practical use, the substrate fixing member 106' can also be directly a flat plate. The foregoing description of the energy conversion member 1A of FIG. 6 is also applicable here and will not be described again. It is added that the carrier of each LED light source may also be formed with a through hole for the said wires to pass. In addition, the control module circuit is further electrically connected to the connector through a wire electrically connected to the connector. Next, the connector is connected to the - external power supply to obtain the control module circuit for controlling the electrical energy required for the operation of the energy conversion member, and the energy conversion member is provided to convert the electrical energy into light energy (for example, energy conversion of the light-emitting diode) The power needed. In summary, the light-emitting diode lamp source of the present invention has a space similar to the appearance of the light bulb and can include a light-emitting diode and can fully illuminate the space of the diode light source, and the control group circuit is accommodated therein. And through the design of the heat pipe, the heat energy emitted by the light-emitting diode is transmitted to a plurality of pieces to dissipate heat. In particular, if the insulating sleeve is coated on the extension of the heat guide f, the cost of controlling the winding circuit in the circuit housing member can be effectively reduced. On the other hand, this month can be used with the heat-dissipating components of the eve, so that the efficiency of the lighting device can be greatly improved. That is to say, through the design of the heat pipe of the present invention, the heat energy generated by the light-emitting diode in operation can be dissipated in time, and the light-emitting diode is subjected to the impact, thereby improving the luminous efficiency and increasing the use of the life. The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments described herein. Rather, the purpose is to have a variety of changes and equal arrangements within the scope of the patent application to which the present invention is intended. [Simple description of the map]

Figure - is a perspective view of a light emitting diode lamp of the present invention. J^2 shows a different embodiment of the light-emitting diode lamp of the present invention. Stereo = ^ scale forest invention - the specific real butterfly - the heat dissipation member. The scale of the other embodiment of the present invention - the heat dissipating member top view = four A scale light emitting diode lamp-like energy conversion member and the transfer of the stage '❹ 分 分 热 heat pipe: 201128124 n picture five series A cross-sectional view of an energy conversion member, a stage, and a portion of a heat pipe according to an embodiment is shown. Figure 6 is a cross-sectional view showing an energy conversion member, a stage, and a portion of a heat pipe according to another embodiment. Figure 7 is a cross-sectional view showing an energy conversion member, a stage, and a portion of a heat pipe according to still another embodiment. Figure 8 is a cross-sectional view showing an energy conversion member, a stage, and a portion of a heat pipe according to still another embodiment. [Description of main component symbols] 1: Light-emitting diode lamp source 10: Energy conversion member 102: Light-emitting semiconductor structure 104. Substrate 104a: Base surface 106, 106' of substrate: Substrate fixing member 106a: First recessed portion 106b: Second The recessed portion 106c: the outer electrode 106d: the through hole 106e: the bottom surface 106f of the substrate fixing member: the recess 1〇8: the encapsulating material 12: the circuit receiving member 120: the control module circuit 122: the connector 124a. the upper surface 17 201128124

124b: lower surface 126: circuit board 14: heat pipe 140: flat portion 142: extension portion 144: contact portion 16: heat dissipation member 16a: first heat dissipation portion 160: fin 162: accommodation space 162a: groove 164: screw Hole 166: locking hole 168: boss 169: hook 18: averaging device 19: lamp holder 190: insulating layer 22: stage 222: through hole 24 of the stage: metal wire 26: lens L1, L2: power cable

Claims (1)

201128124 VII. Patent application scope: 1. A light-emitting diode light source, comprising: a control module circuit; the outer casing is for accommodating the control shell, comprising a top surface and a side wall, a module circuit; In the case of a member, the substrate is fixed on the substrate, and the substrate is fixed to the substrate. And the "the substrate fixing member is electrically connected to the control module circuit to drive the energy conversion member; the electric [5] includes a flat portion, an extension portion and a contact portion, wherein the μ conversion member is a job board And the base oil member is located above the flat portion f, the extending portion is located in the outer casing and extends in a direction; and, wherein the fins are respectively connected to a heat dissipating member, the plurality of fins are in contact with the contact portion; The quantity conversion member and the heat dissipation, wherein the control module circuit is located between the energy components. 2. For example, the scope of the application for patents! The illuminating diode lamp source, wherein the illuminating diode lamp source further comprises a circuit accommodating member for accommodating the control module, wherein the circuit accommodating member has an upper surface and a lower surface. And the tamper-converting member penetrates the circuit accommodating member from the upper surface, and the 埶 conduit penetrates the lower surface. The light-emitting diode lamp source of claim 1, wherein the heat-dissipating member has an accommodating space, and the contact portion is received in the accommodating space and is in contact with the fins. And the heat pipe runs through the control module circuit. 201128124 4, 5, 6, 7, 8, 9, The light-emitting diode lamp source of claim 3, wherein the heat dissipation portion is a heat dissipation portion and a second heat dissipation portion, and the first heat dissipation portion of the first heat dissipation portion forms the accommodation space. The light-emitting diode lamp source according to Item 4, wherein the first-to-the-heat-dissipating portion is mutually adhered to each other by at least a lion or at least one _^ hook, so that the contact portion is in the Accommodate space. The light-emitting diode lamp source of claim 1, wherein the outer casing further comprises a bottom surface, and the heat dissipating member comprises at least a hole for locking the heat dissipating member to the bottom surface with at least one screw. The illuminating diode lamp source of claim 1, wherein the outer casing further comprises a bottom surface, and the heat dissipating member and the bottom surface are latched by at least one hook. For example, in the light source of the above-mentioned patent range, the extension portion is covered with a heat insulating sleeve for reducing the heat release of the heat pipe in the outer casing. The light-emitting diode lamp source of claim 1, wherein the top surface is a homogenizer for diffusing light energy generated by the energy conversion member. 10. The light-emitting diode light source of claim i, wherein the outer casing further has a connector, and the connector is electrically connected to the control module circuit to provide the control module circuit and the energy. Converts the electrical energy required to operate the component. 11. The light-emitting diode lamp source of claim 10, further comprising a lamp holder, the connector being electrically connected to the lamp holder, and the lamp holder being adapted to be mounted on a lamp holder sleeve and used To couple an external power source. 12. The light-emitting diode lamp source according to claim n, wherein the lamp 20 201128124 is at least a screw lock m or a heat-receiving member with at least a __ hook. The light-emitting diode lamp source of claim 1, wherein the fixing member comprises a first recessed portion and a second recessed portion communicating with the first recessed portion The portion of the substrate contacts the flat portion and is connected to the second recess portion, and the light emitting diode is exposed to the first recess portion. The light emitting diode lamp source according to claim 1, further comprising a stage connected to the heat pipe, the energy conversion member being fixed on the stage to make the energy conversion member and the flat Contact. The light-emitting diode lamp source as described in claim 14 of the patent application scope further comprises an optical modulation member connected to the service station and using the light energy generated by the __ energy conversion member. The light-emitting diode according to claim 1, wherein the control module circuit has a through hole, and the heat pipe extends through the control module circuit from the through hole. The light-emitting diode light source of claim 1, wherein the control module circuit is disposed on a plurality of circuit substrates, and the circuit substrates are electrically connected. IS1 21