201123869 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種相機模組及其製作方法，特別涉及一種 小型化的相機模組及快速生產該相機模組的方法。 [先前技術] [0002] 隨著光學成像技術的發展’相機模組在各種成像裝置如 數位相機、攝像機中得到廣泛應用，而整合有相機模組 的移動電話、筆記本電腦等電子裝置’更是得到眾多消 費者的青睞。 〇 [0003] 現有的相機模組一碰包括一用於成像的鏡頭棋組及設置 於該鏡頭模組内的影像感測器。該鏡頭模組包括_個用 於收容鏡片的鏡筒及一個與所述鏡筒通過螺紋連接的鏡 座。然而，這種相機模組不但體積較大，而且組裝時也 需要將相機模組的各元件一個一個的按順序進行組裝， 導致生產過程中步驟多、操作繁瑣，生產效率低下。 【發明内容】 τ ; 4 :, 〇 [0004] 有鑒於此，有必要提供一種體_小.、便於快捷生產的相 機模組。 [0005] 一種相機模組，其包括一個影像感測器、一個第一基板 、一個鏡片、一個第二基板及一個遮光罩，所述第一基 板開設有第一通光孔，所述第一基板包括相對設置的第 一表面及第二表面，所述影像感測器貼靠於所述第一表 面上，所述鏡片貼靠於所述第二表面’所述第二基板貼 靠於所述鏡片遠離所述第一基板的一面，所述第二基板 開設有第二通光孔，所述遮光罩包括第三通光孔，所述 098145028 表單編號 Α0101 第 5 頁/共 20 頁 0982076972-0 201123869 遮光罩套設於所述相機模組的外部，所述第三通光孔 所述第二通光孔、第一通光孔的中心均位於所述相機模 組的光軸上。 [0006] 一種相機模組製作方法，其包括以下步驟：提供〆個開 設有複數個第一通光孔的第一板材，所述第一板材包括 相對設置的板材第一表面及板材第二表面；提供一個具 有複數個鏡片的第二板材，將所述第二板材粘結於所述 第一板材的板材第二表面上，所述複數個鏡片與所述複 數個第一通光孔 對應；提姆--個具有複數個第二通 光孔的第三板材，將所述第三板材粘結於所述第二板材 遠離所述第一板材一面’所述，複·數個第二通光孔與所述 複數個第一通光孔一一對應；提供複數個影像感測器’ 將複數個影像感測器一一粘結到所述板材第一表面上’ 所述複數個影像感測器與所述複數個第一通光孔 對 應；將三個板材進行切割，得到複數個相;^模組；提供 複數個具有第三通光孔的遮光罩，將所述遮光罩分別套 設於上一步驟得到的择機模組的外部，且所述第三通光 孔對準所述相機模,組的第一通光孔。 [0007] 相對傳統的相機模組，由於本發明提供的相機模組元件 較少、採用多片元件叠加組裝，所以體積較小。而且利 用本發明提供的相機模組的製作方法可以將複數個相機 模組同時進行成型、組裝，由此可以節省大量的時間， 提南生產的效率。 【實施方式】 [0008]下面將結合附圖，對本發明作進一步的詳細說明。 098145028 表單編號Α0101 第6頁/共20頁 201123869 [0009] Ο [0010] 請參閱圖1，為本發明提供的相機模組100，所述相機模 組1 0 0包括一個影像感測器1 〇、一個第一基板2 〇、各向.異 性導電膠3 0、一個鏡片40、一個第二基板50、一個遮光 罩60及紅外濾光片70。所述第二基板50、鏡片4〇、紅外 濾光片70、第一基板20及影像感測器10從物側到像側方 向依次設置。當然，所述相機模組100還可以包括複數個 鏡片40及複數個第二基板50。當所述相機模組1〇〇存在複 數個鏡片40及複數個第二基板50時’所述複數個鏡片4〇 及複數個第二基板50在所述紅外濾光片70靠近物體的一 側交替設置。 所述影像感測器10包括感測涵11和複數個晶片焊墊12， 所述複數個晶片焊墊12圍繞所述感測區11設置β本實施 方式中，所述感測區11位於所述影像感測器1 〇的中心， 所述感測區11是一矩形區域。 [0011] ο 所述第一基板20包括第一表，面2::丨ν.:氣二表面22、複數個 底座焊墊23及複數個引腳24。所述濘一基板2〇上開設第 一通光孔25。所述第一通光祀25貫通所述第一表面21及 第二表面22。本實施方式中，所述第—通光孔25位於所 述第一基板20的中心。所述第一基板2〇可以採用不透明 的耐高溫有機材料或半導體基片製成。本實施方式中， 所述第一基板20採用不透明的耐高溫有機材料製成。所 述第一表面21靠近所述影像感測器1〇 ^所述第二表面22 與所述第一表面21相對。本實施方式中，由所述第_表 面21的邊緣向影像感測器10方向突起形成有環狀凸緣21& 。當然，在其他實施方式中，也可去除所述環狀凸緣2ia 098145028 表單編號A0101 第7頁/共20頁 0982076972-0 201123869 。所述底座焊墊23的個數與所 。所述複數個底座焊墊23形成於曰曰片焊墊12的個數相同 與所述晶片焊墊12—一對應。7所述第一表面21上，且 與所述底座焊塾23的個數^所述複數個引腳24的個數 數個引腳24形成於所述第 本實施方式中，所述複 笙、*处山面22上，所述引腳24包括 第一連接端240及第二連接 心41。所述第-連接端240 财所述底座焊塾23連接。所述第二連接端241固定於所封 壤狀凸緣21a上，用於與外界實現電連接。當然，所述第 土板20也可以不包括引腳24，由外界物體通過導線與 所述底座焊墊2 3實現電連接。 ... . ... ... ：·：-" V， [0012] [0013]201123869 VI. Description of the Invention: [Technical Field] The present invention relates to a camera module and a method of fabricating the same, and more particularly to a miniaturized camera module and a method for rapidly producing the same. [Prior Art] [0002] With the development of optical imaging technology, the camera module is widely used in various imaging devices such as digital cameras and video cameras, and electronic devices such as mobile phones and notebook computers integrated with camera modules are It is favored by many consumers. [0003] A conventional camera module includes a lens set for imaging and an image sensor disposed in the lens module. The lens module includes a lens barrel for housing the lens and a lens holder threadedly coupled to the lens barrel. However, the camera module is not only bulky, but also requires assembly of the components of the camera module one by one in sequence, resulting in many steps in the production process, cumbersome operation, and low production efficiency. SUMMARY OF THE INVENTION τ ; 4 :, 〇 [0004] In view of this, it is necessary to provide a camera module that is small in size and convenient for quick production. [0005] A camera module includes an image sensor, a first substrate, a lens, a second substrate, and a hood, the first substrate is provided with a first light through hole, the first The substrate includes opposite first and second surfaces, the image sensor abuts the first surface, and the lens abuts the second surface The lens is away from one side of the first substrate, the second substrate is provided with a second light-passing hole, and the light-shielding cover comprises a third light-passing hole, the 098145028 form number Α0101 5th page, total 20 page 0982076972- 0 201123869 The hood is sleeved on the outside of the camera module, and the centers of the second light-passing holes and the first light-passing holes are located on the optical axis of the camera module. [0006] A method for fabricating a camera module, comprising the steps of: providing a first plate having a plurality of first light passing holes, wherein the first plate comprises a first surface of the oppositely disposed plate and a second surface of the plate Providing a second plate having a plurality of lenses, the second plate being bonded to the second surface of the plate of the first plate, the plurality of lenses corresponding to the plurality of first light-passing holes; Tim--a third plate having a plurality of second light-passing holes, the third plate is bonded to the second plate, away from the side of the first plate, and a plurality of second passes The optical aperture is in one-to-one correspondence with the plurality of first light-passing apertures; providing a plurality of image sensors 'bonding a plurality of image sensors to the first surface of the sheet one by one' The detector corresponds to the plurality of first light-passing holes; the three plates are cut to obtain a plurality of phases; the module is provided; and a plurality of hoods having the third light-passing holes are provided, and the hoods are respectively sleeved Set on the outside of the selected module obtained in the previous step, And the third light passing hole is aligned with the camera mold, the first light passing hole of the group. Compared with the conventional camera module, since the camera module provided by the present invention has few components and is assembled by using multiple pieces of components, the volume is small. Moreover, the camera module manufacturing method provided by the present invention can simultaneously form and assemble a plurality of camera modules, thereby saving a lot of time and improving the efficiency of the production. [Embodiment] The present invention will be further described in detail below with reference to the accompanying drawings. 098145028 Form No. 1010101 Page 6 of 20 201123869 [0009] Please refer to FIG. 1 , which is a camera module 100 according to the present invention. The camera module 100 includes an image sensor 1 〇 A first substrate 2, an anisotropic conductive paste 30, a lens 40, a second substrate 50, a hood 60 and an infrared filter 70. The second substrate 50, the lens 4, the infrared filter 70, the first substrate 20, and the image sensor 10 are sequentially disposed from the object side to the image side. Of course, the camera module 100 can also include a plurality of lenses 40 and a plurality of second substrates 50. When the camera module 1 has a plurality of lenses 40 and a plurality of second substrates 50, the plurality of lenses 4 and the plurality of second substrates 50 are on the side of the infrared filter 70 close to the object. Alternate settings. The image sensor 10 includes a sensing culvert 11 and a plurality of wafer pads 12, and the plurality of wafer pads 12 are disposed around the sensing region 11 in the embodiment. The sensing region 11 is located at the The center of the image sensor 1 is, and the sensing area 11 is a rectangular area. [0011] The first substrate 20 includes a first surface, a surface 2:: 丨ν.: a gas two surface 22, a plurality of base pads 23, and a plurality of pins 24. A first light-passing aperture 25 is defined in the first substrate 2 . The first light passage 25 penetrates the first surface 21 and the second surface 22. In the embodiment, the first light-passing aperture 25 is located at the center of the first substrate 20. The first substrate 2 can be made of an opaque high temperature resistant organic material or a semiconductor substrate. In this embodiment, the first substrate 20 is made of an opaque high temperature resistant organic material. The first surface 21 is adjacent to the image sensor 1 and the second surface 22 is opposite to the first surface 21. In the present embodiment, an annular flange 21 & is formed by the edge of the first surface 21 protruding toward the image sensor 10 . Of course, in other embodiments, the annular flange 2ia 098145028 can also be removed. Form number A0101 page 7 / total 20 pages 0982076972-0 201123869 . The number of the base pads 23 is the same. The plurality of base pads 23 are formed in the same number of the die pads 12 as the wafer pads 12 -1. 7 on the first surface 21, and the number of the base pads 23, the number of pins 24 of the plurality of pins 24 are formed in the first embodiment, the reclamation On the mountain surface 22, the pin 24 includes a first connection end 240 and a second connection core 41. The base connector 23 is connected to the base terminal 240. The second connecting end 241 is fixed to the flanged flange 21a for electrical connection with the outside. Of course, the earth plate 20 may not include the pins 24, and the external objects are electrically connected to the base pads 23 through wires. ... . . . :::-" V, [0012] [0013]
所述各底座焊1*23及各晶片焊n2之間電連接 。本實施 方式中’所述底座焊墊23及晶片焊墊12之間塗布各向異 性導電膠30。本實施方式中，所述各向異性導電膠3〇包 圍所述感測區丨1，一併實現對感測區11的密封。 所述鏡片40上可以鍍紅外濾光膜或在所述鏡片4〇及影像 感測器10之間加紅外濾光片7〇。本實施方式中，在所述 鏡片40及影像感測器Ϊ0之間加紅外濾光片70。所述紅外 濾光片70包括相對的第三表面71及第四表面72。所述第 三表面71抵靠於所述第二表面22。所述紅外濾光片70可 以通過粘結劑固定於所述第二表面22上，或採用熱壓工 藝粘結到所述第二表面22上。本實施方式中，所述紅外 濾光片70通過粃結劑2〇〇固定於所述第二表面22上。 所述鏡片40固定於所述第一基板2〇的第二表面2^—側。 本實施方式中，所述鏡片40包括光學部41及非光學部42 。所述光學部41位於所述鏡片40的中心，所述非光學部 098145028 表單編號A0101 第8頁/共20頁 0982076972-0 [0014] 201123869 42圍繞所述光學部41設置，所述#光學部42包括相對設 置的第一非光學表面42a及第二#光學表面42b »所述第 一非光學表面42a抵靠於所述第四表面72，所述光學部41 正對所述第一通光孔25。所述鎳片40可以通過粘結劑固 定於所述第四表面72上，或採用熱壓工藝粘結到所述第 四表面72上。本實施方式中，户斤述鏡片40通過粘結劑2〇〇 固定於所述第四表面72上。 [0015] Ο 所述第二基板50固定於所述鏡片4〇遠離所述第一基板2〇 的一側。本實施方式中，所述第二基板5〇抵靠於所述鏡 片40的第二非光學表面42b。所述第二基板50可以採用不 透明的耐高溫有機材料、金屬或半導體基片。本實施方 式中，所述第二基板50採用不透明的耐高溫有機材料製 成。所述第二基板50開設第二通光孔51 ’所述第二通光 孔51與所述鏡片40的米學部41相對。所述第二基板50可 以通過粘結劑固定於所述第二非光學表面42b上，或採用The base solder 1*23 and each wafer solder n2 are electrically connected. In the present embodiment, the anisotropic conductive paste 30 is applied between the base pad 23 and the wafer pad 12. In the embodiment, the anisotropic conductive paste 3 〇 surrounds the sensing region 丨1, and the sealing of the sensing region 11 is achieved. An infrared filter film may be plated on the lens 40 or an infrared filter 7 is applied between the lens 4 and the image sensor 10. In the present embodiment, an infrared filter 70 is applied between the lens 40 and the image sensor Ϊ0. The infrared filter 70 includes opposing third and fourth surfaces 71, 72. The third surface 71 abuts against the second surface 22. The infrared filter 70 may be attached to the second surface 22 by an adhesive or bonded to the second surface 22 by a thermocompression process. In the present embodiment, the infrared filter 70 is fixed to the second surface 22 by a chelating agent 2 。. The lens 40 is fixed to the second surface 2 - side of the first substrate 2 . In the present embodiment, the lens 40 includes an optical portion 41 and a non-optical portion 42. The optical portion 41 is located at the center of the lens 40, and the non-optical portion 098145028 Form No. A0101 Page 8 / Total 20 pages 0 927 072 972 - [0014] 201123869 42 is disposed around the optical portion 41, the #optical portion 42 includes a first non-optical surface 42a and a second #optical surface 42b disposed oppositely. The first non-optical surface 42a abuts the fourth surface 72, and the optical portion 41 faces the first light Hole 25. The nickel sheet 40 may be fixed to the fourth surface 72 by an adhesive or bonded to the fourth surface 72 by a hot pressing process. In the present embodiment, the lens 40 is fixed to the fourth surface 72 by an adhesive 2〇〇. [0015] The second substrate 50 is fixed to a side of the lens 4 away from the first substrate 2〇. In this embodiment, the second substrate 5A abuts against the second non-optical surface 42b of the mirror 40. The second substrate 50 may be made of an opaque high temperature resistant organic material, a metal or a semiconductor substrate. In this embodiment, the second substrate 50 is made of an opaque high temperature resistant organic material. The second substrate 50 defines a second light passing hole 51'. The second light passing hole 51 is opposite to the rice portion 41 of the lens 40. The second substrate 50 may be fixed to the second non-optical surface 42b by an adhesive, or may be
•% * | E ❹ [0016] 熱壓工藝粘結到所述第二非光學表面42b上。本實施方式 中，所述第二基板50通過粘結劑200固定於所述第二非光 學表面42b上。 所述遮光罩60包括第三通光孔61，所述第三通光孔61位 於所述遮光罩60的中心。所述遮光罩60套設於所述相機 模組100外部，且所述第三通光孔61正對所述第二通光孔 51。本實施方式中，所述第一通光孔25、所述第二通光 孔51、第三通光孔61及所述感測區11的中心均位於所述 相機模組100的光轴上。所述遮光罩60用於防止鏡片40及 紅外濾光片70的邊緣透光。所述遮光罩6〇<以是不透明 098145028 表單編號A0101 第9頁/共20頁 0982076972-0 201123869 的塑膠蓋或不透明的遮光膜。本實施方式中，所述遮光 罩60是不透明的塑膠蓋。 [0017] [0018] [0019] [0020] 請參閱圖2及圖3，為本實施方式中提供的所述相機模組 !〇〇的製作方法。該方法包括以下步驟： (〇提供一個開設有複數個第一通光孔25的第一板材 300 ’所述第一板材300包括相對設置的板材第一表面 31〇及板材第二表面320，所述板材第一表面310上設置 有多組繞所述第一通光孔25排布的底座焊墊2 3。本實施 方式中，該步驟包括以下子步_:通過將耐高溫樹脂或 玻璃模壓成型具有複k個第一通光孔25的所述第一板材 30〇 ’或採用蝕刻半導體基片成塑具有複數個第一通光孔 25的所述第一板材3〇〇。本實施方式中，通過將耐高溫樹 脂模壓成型所述第一板材300。利用粘结或熱壓方式將複 數個底座焊墊23貼到所述板材第一表面310上。本實施方 式中，所述板材第一表面310上還粘結有複數個與所述底 ： :丨丨：；::::丨β 1.. 座焊墊23電連接的引腳24。本實施方式中，利用粘結方 式將複數個底座煤基23及對應的引腳24貼到所述板材第 一表面310上。 (2)提供一個具有複數個紅外濾光片70的第四板材600 ，將所述第四板材6〇〇枯結於所述第一板材300上。本實 施方式中，所述第四板材600是一個鍍有濾光膜的玻璃板 ，利用粘結劑200將所述第四板材600粘結於第一板材 300 上0 (3)提供一個具有複數個鏡片40的第二板材400,將所 098145028 表單編號Α0101 第10頁/共20頁 0982076972-0 201123869 [0021] Ο [0022] [0023] 098145028 述第二板材400枯結於所述第一板材300的板材第二表面 320—側，所述複數個鏡片40與所述複數個第一通光孔25 對應。所述第二板材400可以通過將耐高溫樹脂或玻 璃模壓成型。本實施方式中，所述第二板材400通過將耐 高溫樹脂模壓成型，利用粘結劑200將所述第二板材4〇〇 粘結於所述第四板材600上，且所述各鏡片40與所述各第 —通光孔25對應。 (4) 提供一個具有複數個第二通光孔51的第三板材5〇〇 ’將所述第三板材500粘結於所述第二板材400遠離所述 第一板材300 —侧’所述複數個第二通光孔51與所述複數 個第一通光孔25——對應。減述第三棒材'5〇0可以通過將 樹脂或玻璃模壓成型，也可jk使:用機:械加工或化學蝕刻 工藝成型。本實施方式中，所述第三板材500通過將樹脂 模壓成型。 (5) 將所述第三板材500粘結於斤选第二板材400上，且 所述各第二通光孔51與所述各錄片40—一對應。本實施 % -- ' 1 方式中，利用枯結劑200將ϋ第三板材500粘結於所述 第二板材400上。 (6) 提供複數個影像感測器10，每一影像感測器10包括 一個感測區11和複數個繞所述感測區11排布的晶片焊墊 12，將複數個影像感測器10— 一粘結到所述第一板材300 上，且所述晶片焊墊12與所述底座焊墊23 — 一對應。本 實施方式中，所述感測區11位於所述影像感測器10的中 心，所述感測區11是矩形區域。將複數個影像感測器10 一一粘結到所述第一板材300的板材第一表面310上，且 表單編號Α0101 第11頁/共20頁 0982076972-0 201123869 所述晶片焊墊11與所述底座焊墊23 ——斜庙 對愿，所述晶片 焊墊11與所述底座焊墊23之間塗布各向異性導電膠3〇。 本實施方式中’所述各向異性導電_包___ ' 11 ’ 一併實現感測區11的密封。 °° [0024] [0025] [0026] [0027] [0028] [0029] [0030] 098145028 (7) 將四個板材300、400、500、600進行切割，得到 複數個具有第一基板20、紅外濾光片7〇、鏡片第一 基板20的相機模組100。 (8) 提供複數個具有第三通光孔61的遮光罩本實施 方式中’所述通光孔61位於所述遮光罩6〇 、j甲心。所述 遮光罩60可以是不透明的塑膠蓋或不透明的遮光膜。本 實施方式中，所述遮光罩60是不透明的塑膠蓋。‘ (9) 將所述遮光罩60的第三通光孔61對準所述第二通光 孔51套設於得到的相機模組1 〇〇的外部。 相對傳統的相機模組，由於本發明提供的，機模組元件 較少、採用多片元件疊加組裝，所以體積丄小。而且利 用本發明提供的相機模組的製作方法可以將複數個相機 模組同時進行成型、組裝，由此可以節省大量的時間， 〇 提高生產的效率。 另外，本領域技術人員可在本發明精神内做其他變化， 但是，凡依據本發明精神實質所做的變化，都應包含在 本發明所要求保護的範圍之内。 【圖式簡單說明】 圖1為本發明提供的相機模組的示意圖； 圖2及圖3為圖1的鏡頭模組的製作方法的示意圖。 表單編號A010I 第12頁/共20頁 0982076972-0 201123869 ❹ [0031] 【主要元件符號說明】 相機模組100 [0032] 影像感測器10 [0033] 感測區11 [0034] 晶片焊墊1 2 [0035] 基板20 [0036] 第一表面21 [0037] 環狀凸緣21a [0038] 第二表面22 [0039] 底座焊墊23 [0040] 引腳24 [0041] 第一連接端240 [0042] 第二連接端241 [0043] 第一通光孔2 5 [0044] 各向異性導電膠 [0045] 鏡片40 [0046] 光學部41 [0047] 非光學部42 [0048] 第一非光學表面 [0049] 第二非光學表面 表單編號A0101• % * | E ❹ [0016] A hot pressing process is bonded to the second non-optical surface 42b. In the present embodiment, the second substrate 50 is fixed to the second non-optical surface 42b by an adhesive 200. The hood 60 includes a third light passing hole 61, and the third light passing hole 61 is located at the center of the hood 60. The hood 60 is sleeved on the outside of the camera module 100, and the third light-passing aperture 61 faces the second light-passing aperture 51. In the embodiment, the centers of the first light-passing holes 25, the second light-passing holes 51, the third light-passing holes 61, and the sensing region 11 are all located on the optical axis of the camera module 100. . The hood 60 serves to prevent light transmission from the edges of the lens 40 and the infrared filter 70. The hood 6 〇 < opaque 098145028 Form No. A0101 Page 9 / Total 20 pages 0982076972-0 201123869 Plastic cover or opaque mask. In the embodiment, the hood 60 is an opaque plastic cover. [0020] [0020] Please refer to FIG. 2 and FIG. 3, which are the manufacturing methods of the camera module provided in the embodiment. The method comprises the following steps: (a first plate 300 is provided with a plurality of first light-passing holes 25). The first plate 300 comprises a first plate surface 31 and a second surface 320 of the plate. The first surface 310 of the plate is provided with a plurality of sets of base pads 23 arranged around the first light-passing holes 25. In this embodiment, the step includes the following sub-steps: by molding the high temperature resistant resin or glass Forming the first plate member 30' having the k first light passing holes 25 or molding the first plate member 3 having a plurality of first light passing holes 25 by etching the semiconductor substrate. The first plate 300 is molded by molding the high temperature resistant resin. A plurality of base pads 23 are attached to the first surface 310 of the plate by bonding or hot pressing. In the embodiment, the plate is A surface 310 is further bonded with a plurality of the bottom: :丨丨:;::::丨β 1. The solder pad 23 is electrically connected to the pin 24. In this embodiment, the bonding method is adopted. A plurality of base coal bases 23 and corresponding pins 24 are attached to the first surface 31 of the sheet 0. (2) providing a fourth plate 600 having a plurality of infrared filters 70, and drying the fourth plate 6 on the first plate 300. In the embodiment, the The four sheets 600 are a glass plate coated with a filter film, and the fourth sheet 600 is bonded to the first sheet 300 by means of an adhesive 200. (3) A second sheet 400 having a plurality of lenses 40 is provided. No. 098145028 Form No. 1010101 Page 10/Total 20 Page 0982076972-0 201123869 [0021] [0023] 098145028 The second sheet 400 is dried on the second surface 320 of the sheet of the first sheet 300. On the side, the plurality of lenses 40 correspond to the plurality of first light-passing holes 25. The second plate material 400 may be molded by molding a high-temperature resistant resin or glass. In this embodiment, the second plate material 400 passes. The high temperature resistant resin is molded, and the second plate member 4 is bonded to the fourth plate member 600 by an adhesive 200, and each of the lenses 40 corresponds to each of the first through holes 25 . (4) providing a third plate 5' having a plurality of second light passing holes 51 The three plates 500 are bonded to the second plate 400 away from the first plate 300 - the side of the plurality of second light-passing holes 51 corresponding to the plurality of first light-passing holes 25 - the description The three-bar material '5〇0 can be molded by molding the resin or the glass, or can be formed by a mechanical processing or a chemical etching process. In the present embodiment, the third plate material 500 is molded by molding the resin. 5) The third plate member 500 is bonded to the second plate member 400, and each of the second light-passing holes 51 corresponds to the respective recording sheets 40. In the present embodiment, the first plate member 500 is bonded to the second plate member 400 by the dry agent 200. (6) providing a plurality of image sensors 10, each image sensor 10 includes a sensing region 11 and a plurality of wafer pads 12 arranged around the sensing region 11, and a plurality of image sensors 10—bonding to the first plate 300, and the die pad 12 is in one-to-one correspondence with the base pad 23. In this embodiment, the sensing area 11 is located at a center of the image sensor 10, and the sensing area 11 is a rectangular area. The plurality of image sensors 10 are bonded to the first surface 310 of the first plate 300 one by one, and the wafer pad 11 and the surface are described in Form No. 1010101, page 11 of 20,098,076,972,0. The base pad 23 - oblique temple, the anisotropic conductive paste 3 is coated between the wafer pad 11 and the base pad 23 . In the present embodiment, the anisotropic conductive package ___ ' 11 ' together achieves the sealing of the sensing region 11. [0025] [0028] [0028] [0028] [0030] [0030] 098145028 (7) The four sheets 300, 400, 500, 600 are cut to obtain a plurality of first substrates 20, The infrared filter 7 is a camera module 100 of the first substrate 20 of the lens. (8) A plurality of hoods having the third light-passing apertures 61 are provided. In the embodiment, the light-passing apertures 61 are located in the hoods 〇, j. The hood 60 may be an opaque plastic cover or an opaque light-shielding film. In the embodiment, the hood 60 is an opaque plastic cover. ‘ (9) Aligning the third light-passing aperture 61 of the hood 60 with the second light-passing aperture 51 is disposed outside the obtained camera module 1 〇〇. Compared with the conventional camera module, since the invention provides fewer components of the machine module and is assembled by stacking multiple components, the volume is small. Moreover, the camera module of the present invention can be used to simultaneously form and assemble a plurality of camera modules, thereby saving a lot of time and improving production efficiency. In addition, those skilled in the art can make other changes within the spirit of the invention, and all changes which are made according to the spirit of the invention are included in the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a camera module provided by the present invention; FIG. 2 and FIG. 3 are schematic diagrams showing a method of fabricating the lens module of FIG. Form No. A010I Page 12 of 20 0982076972-0 201123869 ❹ [0031] [Description of Main Component Symbols] Camera Module 100 [0032] Image Sensor 10 [0033] Sensing Zone 11 [0034] Wafer Pad 1 2 [0035] substrate 20 [0036] first surface 21 [0037] annular flange 21a [0038] second surface 22 [0039] base pad 23 [0040] pin 24 [0041] first connection end 240 [ 0042] Second connection end 241 [0043] First light transmission hole 2 5 [0044] Anisotropic conductive adhesive [0045] Lens 40 [0046] Optical portion 41 [0047] Non-optical portion 42 [0048] First non-optical Surface [0049] Second Non-Optical Surface Form No. A0101
098145028 第13頁/共20頁 0982076972-0 201123869 [0050] 第二基板50 [0051] 第二通光孔51 [0052] 遮光罩6 0 [0053] 第三通光孔61 [0054] 紅外濾光片70 [0055] 第三表面71 [0056] 第四表面7 2 [0057] 粘結劑200 [0058] 第一板材300 [0059] 板材第一表面310 [0060] 板材第二表面320 [0061] 第二板材400 [0062] 第三板材500 [0063] 第四板材600 098145028 表單編號A0101 第14頁/共20頁 0982076972-0098145028 Page 13 of 20 0982076972-0 201123869 [0050] Second substrate 50 [0051] Second light-passing aperture 51 [0052] Shield 6 0 [0053] Third light-passing aperture 61 [0054] Infrared filtering Sheet 70 [0055] Third Surface 71 [0056] Fourth Surface 7 2 [0057] First Sheet 300 [0059] Sheet First Surface 310 [0060] Sheet Second Surface 320 [0061] Second plate 400 [0062] Third plate 500 [0063] Fourth plate 600 098145028 Form number A0101 Page 14 / Total 20 pages 0982076972-0