201122500 六、發明說明.： f發明所屬之技術領域】 關於本=有關於一種_裝置及檢測方法，且特別曰右 方法。 個接腳誶接狀況的檢測裝置及檢測 【先前技術】 於現有技術中，為檢測 對連接器的多個接聊逐點量測=二妾狀::通常需要 三用電表逐點制旦$社八肢而吕，刼作者需使用 '、里連接态的各個接腳與對；s 與焊接點之μ 3 ^ 接腳疋否短路或接腳 广I、占之間疋否開路等)。然而 力，而且容易使操作者疲勞。如此，容易產生誤判11 【發明内容】 本發明的目的在於提供-種檢測裝置及檢測方法，以 改善現有技術的缺失。 、本發明提出-種檢測裝置’用於檢測多個接腳的焊接 狀況。該些接腳包括第—組接腳與第二組接腳。第一組接 卿與電路板的第-組焊接點——對應焊接，第二組接腳^ 電路板的第二組焊接點一一對應焊接。第一組接腳具有第 〜公共節點5第二組焊接點具有第二公共節點。檢測裝置 包括檢測單元、第一開關電路以及第二開關電路。檢測單 元耦接第-公共節‘|績第二公共節點。第—開關電路分別 201122500 將第一組接腳與第二組焊接點——耦接至檢測單元。第二 開關電路分別耦接第一組焊接點與第二組接腳以及第二 組焊接點與第一組接腳，以使第一組焊接點、第二組接 腳、第二組焊接點及第一組接腳依次——對應申聯連接至 檢測單元。當第一開關電路導通且該第二開關電路斷開 時，檢測該些接腳之間是否短路。當第一開關電路斷開且 第二開關電路導通時，檢測該些接腳與對應的第一組焊接 點或第二組焊接點之間是否開路。 ® 本發明還提出一種檢測方法，用於檢測多個接腳的焊 接狀況。該些接腳包括第一組接腳與第二組接腳。第一組 接腳與電路板的第一組焊接點—對應焊接，第二組接腳 與電路板的第二組焊接點——對應焊接。第一組接腳具有 第一公共節點，第二組烊接點具有第二公共節點。檢測方 法包括下列步驟。提供檢測裝置，檢測裝置包括檢測單 元、第一開關電路以及第二開關電路。檢測單元耦接第一 Φ 公共節點與第二公共節點。第一開關電路分別將第一組接 腳與第二組焊接點一一耦接至檢測單元。第二開關電路分 別耦接第一組焊接點與第二組接腳以及第二組焊接點與 第一組接腳，以使第一組焊接點、第二組接腳、第二組焊 接點及第一組接腳依次——對應串聯連接至檢測單元。當 第一開關電路導通且第二開關電路斷開時，檢測該些接腳 之間是否短路。當第一開關電路斷開且第二開關電路導通 時，檢測該些接腳與對應的第一組焊接點或第二組焊接點 是否開路。 201122500 於本發明中，譜由檢測裝置的第一開關電路與第二開 關電路，檢測裝置可檢測該些接腳之間是否短路或該些^ 腳與對應的焊接點之間是否開路。藉由本發明提供的檢測 裝置，操作者無需逐點量測即可快速方便地判斷多個接腳 的焊接狀況。此外，操作省時省力，並提高了工作效率。 為讓本發明的上述和其它目的、特徵和優點能更^顯 易懂，下文特舉較佳實施例，並配合附圖，作詳細說明如 下。 … 。 【實施方式】 圖1所示為根據本發明之第一較佳實施例之檢測裝置 的電路圖。如圖1所示，本實施例所提供之檢測裝置（包 括檢測單元10、第一開關電路11及第二開關電路12。匕 於本實施例中’檢測裝置1用於檢測光碟機中連接電 路板與讀寫頭之間的軟排線（圖未示）的焊接狀況。然而' 本發明並不限定於此。於其它實施例中，檢測裝置i亦可 用於檢測CD-ROM，CD-RW的連接器的焊接狀況以及^二 轉接板的焊接狀況。 ^ 於本實施例中，軟排線包括12個接腳，且該些接腳 P1〜P12包括第一組接腳131與第二組接腳132。第一组 接腳131與電路板（於此，即為光碟機的電路板）的第一 組焊接點141 --對應焊接。第二組接腳132肖 第二組焊接點142 ——對應焊接。換言之，該些接腳ρι 〜P12與電路板上的焊接點S1〜S12 一一對應烊接。 201122500 於本實施例中，第一組接腳131的數目與第二組接腳 132的數目一致。即，第一組接腳131包括六個接腳P1， P3，P5，P7，P9，P1卜第二組接腳132亦包括六個接腳 P2，P4，P6，P8，P10，P12。對應地，第一組焊接點 141 包括六個焊接點S1，S3，S5，S7，S9，S11。第二組焊接 點142包括六個焊接點S2，S4，S6，S8，S10，S12。然 而，本發明並不限定於此。 於本實施例中，第一組接腳131具有第一公共節點 ® A1。第二組焊接點142具有第二公共節點A2。檢測單元 10耦接第一公共節點A1與第二公共節點A2。 於本實施例中，第一開關電路11分別將第一組接腳 131與第二組焊接點142 —一耦接至檢測單元10。第二開 關電路12分別耦接第一組焊接點141與第一組接腳132 以及第二組焊接點142與第一組接腳131，以使第一組焊 接點141、第二組接腳132、第二組焊接點142及第一組 φ 接腳131依次一 一對應串聯連接至檢測單元10。 具體而言，於本實施例中，第一開關電路11包括第 一組開關K1〜K5與第二組開關K6〜K10。第一組開關 K1〜K5分別耦接第一公共節點A1與第一組接腳131的接 腳P3，P5，P7，P9，P11。第二組開關K6〜K10分別耦接 第二公共節點A2與第二組焊接點142的焊接點S2，S4， S6，S8，S10。其中，第一組接腳131的接腳P1直接耦接 至第一公共節點A1。第二組焊接點142的焊接點S12直 接耦接至第二公共節點A2。然而，本發明並不限定於此。 201122500 於其它實施例中’第一組接腳131的接腳pi與第二組焊 接點142的焊接點S12亦可通過開關分別執接第一公共節 點A1與第二公共節點A2。如此，第一組接腳13ι與第二 組焊接點142——耦接至檢測單元1〇。 於本實施例中’第二開關電路12包括第三組開關（即 開關kl’k3’k5，k7，k9’kll)與第四組開關（即開關 k2 ’ k4，k6，k8 ’ klO )。第三組開關一—對應耦接第一組 焊接點141與第二组接腳132。第四組開關將第二組焊接 點M2的焊接點S2，S4，S6，S8，sl〇分別—對應_ 至第一組接腳131的接腳P3，P5，P7，P9，P11。如此， 第一組焊接點141、第二組接腳132、第二组焊接點μ) 以及第一組接腳131依次一一對應串聯連接至檢測單元 10 ° 於本實施例中，第一開關電路Η與第二開關電路12 分別包括多個開關u然而，本發明並不限定於此。於其它 實施例中，第一開關電路丨丨與第二開關電路12可用二個 總開關控制。或者，第―開關電路u與第二開關電路Η 可為繼電器。 t ，外，於本實施例中，檢測單元10包括電源100與 指不單元102。指示單元102耦接電源1〇〇。其中，指示 单凡102可包括指讀L1與蜂鳴器B卜然而，本發明並201122500 VI. INSTRUCTIONS.: TECHNICAL FIELD OF THE INVENTION The invention relates to a device and a detection method, and particularly to the right method. Detection device and detection of the pinch connection condition [Prior Art] In the prior art, in order to detect the multiple point-by-point measurement of the connector to the point-by-point measurement=2:: usually requires a three-meter electric meter to be made point by point. $社八肢和吕,刼 authors need to use ', the internal connection of the pin and the pair; s and the solder joint μ 3 ^ pin 疋 no short circuit or pin wide I, accounted for between open circuit, etc.) . However, it is easy and it is easy for the operator to fatigue. Thus, it is easy to cause erroneous judgments. 11 SUMMARY OF THE INVENTION An object of the present invention is to provide a detection apparatus and a detection method to improve the deficiencies of the prior art. The present invention proposes a detecting device 'for detecting the welding condition of a plurality of pins. The pins include a first set of pins and a second set of pins. The first set of contacts and the first set of solder joints of the board - corresponding to the soldering, the second set of pins ^ the second set of solder joints of the board are soldered one by one. The first set of pins has a first to the common node 5 and the second set of solder joints has a second common node. The detecting device includes a detecting unit, a first switching circuit, and a second switching circuit. The detection unit is coupled to the first common node of the first public node. The first-switch circuit respectively connects the first set of pins and the second set of solder joints to the detection unit. The second switch circuit is respectively coupled to the first set of soldering points and the second set of pins and the second set of soldering points and the first set of pins, so that the first set of soldering points, the second set of soldering pins, and the second set of soldering points And the first set of pins are sequentially connected - the corresponding Shenlian is connected to the detecting unit. When the first switch circuit is turned on and the second switch circuit is turned off, it is detected whether there is a short circuit between the pins. When the first switch circuit is turned off and the second switch circuit is turned on, it is detected whether an open circuit is formed between the pins and the corresponding first set of solder joints or the second set of solder joints. ® The present invention also provides a detection method for detecting the welding condition of a plurality of pins. The pins include a first set of pins and a second set of pins. The first set of pins and the first set of solder joints of the board - corresponding soldering, the second set of pins and the second set of solder joints of the board - correspond to soldering. The first set of pins has a first common node and the second set of spliced contacts has a second common node. The detection method includes the following steps. A detecting device is provided, the detecting device comprising a detecting unit, a first switching circuit and a second switching circuit. The detecting unit is coupled to the first Φ common node and the second common node. The first switch circuit couples the first set of pins and the second set of solder joints to the detecting unit one by one. The second switch circuit is respectively coupled to the first set of soldering points and the second set of pins and the second set of soldering points and the first set of pins, so that the first set of soldering points, the second set of soldering pins, and the second set of soldering points And the first set of pins are sequentially connected to the detection unit in series. When the first switch circuit is turned on and the second switch circuit is turned off, it is detected whether there is a short circuit between the pins. When the first switch circuit is turned off and the second switch circuit is turned on, detecting whether the pins are open to the corresponding first set of solder joints or the second set of solder joints. In the present invention, the spectrum is detected by the first switching circuit and the second switching circuit of the detecting device, and the detecting device can detect whether there is a short circuit between the pins or whether there is an open circuit between the pins and the corresponding soldering points. With the detecting device provided by the present invention, the operator can quickly and conveniently judge the welding condition of the plurality of pins without the point-by-point measurement. In addition, the operation saves time and effort and improves work efficiency. The above and other objects, features and advantages of the present invention will become more <RTIgt; ... . [Embodiment] FIG. 1 is a circuit diagram of a detecting apparatus according to a first preferred embodiment of the present invention. As shown in FIG. 1 , the detecting device provided by the embodiment includes a detecting unit 10, a first switching circuit 11 and a second switching circuit 12. In the present embodiment, the detecting device 1 is used for detecting a connecting circuit in the optical disk drive. The welding condition of the flexible cable (not shown) between the board and the head. However, the present invention is not limited thereto. In other embodiments, the detecting device i can also be used for detecting CD-ROM, CD-RW. The soldering condition of the connector and the soldering condition of the second adapter board. ^ In this embodiment, the flexible cable includes 12 pins, and the pins P1 PP12 include the first group of pins 131 and the second The set of pins 132. The first set of pins 131 are soldered to the first set of solder joints 141 of the circuit board (here, the circuit board of the optical disc drive). The second set of pins 132 are the second set of solder joints. 142 —— Corresponding to soldering. In other words, the pins ρι to P12 are connected to the solder joints S1 S S12 on the circuit board one by one. 201122500 In this embodiment, the number of the first set of pins 131 and the second group The number of pins 132 is the same. That is, the first set of pins 131 includes six pins P1, P3, P5, P7, P. 9, P1, the second set of pins 132 also includes six pins P2, P4, P6, P8, P10, P12. Correspondingly, the first set of solder joints 141 includes six solder joints S1, S3, S5, S7, S9, S11. The second set of solder joints 142 includes six solder joints S2, S4, S6, S8, S10, S12. However, the present invention is not limited thereto. In this embodiment, the first set of pins 131 have The first common node A1. The second group of soldering points 142 has a second common node A2. The detecting unit 10 is coupled to the first common node A1 and the second common node A2. In this embodiment, the first switching circuit 11 respectively The first set of pins 131 and the second set of soldering points 142 are coupled to the detecting unit 10. The second switching circuit 12 is coupled to the first set of soldering points 141 and the first set of pins 132 and the second set of soldering points 142, respectively. And the first set of pins 131, so that the first set of solder joints 141, the second set of pins 132, the second set of solder joints 142, and the first set of φ pins 131 are sequentially connected in series to the detecting unit 10 in a one-to-one correspondence. In this embodiment, the first switch circuit 11 includes a first group of switches K1 K K5 and a second group of switches K6 K K10. The switches K1 to K5 are respectively coupled to the pins P3, P5, P7, P9, and P11 of the first common node A1 and the first group of pins 131. The second group of switches K6 to K10 are coupled to the second common node A2 and the second, respectively. The solder joints S2, S4, S6, S8, S10 of the solder joints 142. The pins P1 of the first set of pins 131 are directly coupled to the first common node A1. The solder joints S12 of the second set of solder joints 142 are directly It is coupled to the second common node A2. However, the present invention is not limited thereto. In other embodiments, the solder joint S12 of the pin pi of the first set of pins 131 and the second set of solder joints 142 may also be respectively connected to the first common node A1 and the second common node A2 through switches. Thus, the first set of pins 13i and the second set of solder joints 142 are coupled to the detecting unit 1A. In the present embodiment, the second switching circuit 12 includes a third group of switches (i.e., switches k1'k3'k5, k7, k9'kll) and a fourth group of switches (i.e., switches k2' k4, k6, k8' klO). The third set of switches 1 - correspondingly couples the first set of solder joints 141 and the second set of pins 132. The fourth set of switches respectively connects the solder joints S2, S4, S6, S8, sl1 of the second set of solder joints M2 to the pins P3, P5, P7, P9, P11 of the first set of pins 131, respectively. Thus, the first set of soldering points 141, the second set of pins 132, the second set of soldering points μ), and the first set of pins 131 are sequentially connected in series to the detecting unit 10° in one embodiment, in the embodiment, the first switch The circuit Η and the second switching circuit 12 respectively include a plurality of switches u. However, the present invention is not limited thereto. In other embodiments, the first switching circuit 丨丨 and the second switching circuit 12 can be controlled by two main switches. Alternatively, the first-switch circuit u and the second switch circuit Η may be relays. In addition, in the present embodiment, the detecting unit 10 includes a power source 100 and a finger unit 102. The indicating unit 102 is coupled to the power source 1〇〇. Wherein, the instruction single 102 may include a finger reading L1 and a buzzer B. However, the present invention
不限疋於此。於其施例中，指示單元㈣可為具有其 它指不效果的元件U 以下詳述本實施例提供的檢測裝置1的檢測原理。 201122500 於本實施例中，第一組接腳131--對應焊接至第一. 組焊接點141 ’第二組接腳132--對應焊接至第二組焊 接點142。如此，若該些接腳P1〜pi2與該些焊接點S1〜 S12之間焊接正常’則第一組接腳131與第一組焊接點 一一對應導通，第二組接腳132與第二組焊接點142 一一 對應導通。 曾於本實施例中，於檢測過程中，當第一開關電路U ¥通且第二開關電路12斷開時，檢測接腳pi〜m =豆路。此時:若指示單元102發出指示，則接腳； 2之間存在短路。於此，#千留—彳^ 指示Γ 〇2的指示效果為 足L1發先，蜂鳴器B1發出蜂 102未笋中浐干，目丨丨吐 久·<•右‘不早元 ^不’則接腳ρι〜ρΐ2之間不存在短路。Not limited to this. In the embodiment thereof, the indicating unit (4) may be an element U having other ineffective effects. The detection principle of the detecting device 1 provided in the present embodiment will be described in detail below. 201122500 In the present embodiment, the first set of pins 131--corresponding to the first set of solder joints 141' and the second set of pins 132--corresponding to the second set of solder joints 142. Thus, if the pins P1 pi2 and the solder joints S1 S S12 are soldered normally, the first set of pins 131 are turned on in one-to-one correspondence with the first set of solder joints, and the second set of pins 132 and second. The set of solder joints 142 are turned on one-to-one. In the present embodiment, during the detecting process, when the first switching circuit U is turned on and the second switching circuit 12 is turned off, the detecting pin pi~m = the bean path. At this time: if the indication unit 102 gives an indication, the pin; there is a short circuit between the two. Here, #千留—彳^ indicates that the indication effect of Γ 〇2 is that the foot L1 is sent first, and the buzzer B1 emits the bee 102, which is not dried in the bamboo shoots, and the sputum is sputum for a long time. No, there is no short circuit between the pins ρι~ρΐ2.
:、體而言’於本實施财，第—開關電路U 丘二I K1〜K10均閉合。此時，開關Κ1〜Κ5導通第=八 八即點A1與第一組接腳131的接腳p 公 二，第-—的接腳 接點幻，與第二組焊接點142的焊 焊接點sH 。此外’第二組焊接點⑷的 .θ 直接耦接至第二公共節點Α2。籍此， 火干接點U2連接至檢測單元1〇。 弟二組 …第二_路12斷開’即開關心 S5，h 守，第—組焊接點141(即焊接點S1，S3 SU)與第二組接腳132 (即接腳p2 ,料， 201122500 P6，P8，P10，P12 )——對應斷開。正常情況下，整個檢 測電路未被導通，指示單元102不會發出指示。然而，當 該些接腳P1〜P12之間存在短路時，檢測電路會被導通， 指示單元102會發出指示。 舉例而言，若笫一組接腳131的接腳P3與第二組接 腳132的接腳P4之間存在短路（即接腳P3與接腳P4導 通），則檢測單元10、第一開關電路11、第一組接腳131 的接腳P3、第二組接腳132的接腳P4以及第二組焊接點 142的焊接點S4構成一導通迴路。如此，指示單元102會 發出指示。 此外，於本實施例中，當第一開關電路11斷開且第 二開關電路12導通時，檢測接腳P1〜P12與焊接點S1〜 S12之間是否開路。此時，若指示單元102發出指示，即 指示燈L1發光，蜂鳴器B1發出蜂鳴，則接腳P1〜P12 與對應的焊接點S1〜S12之間焊接正常。反之，若指示單 元102無指示，則接腳P1〜P12與對應的焊接點S1〜S12 之間存在開路。如此，操作者可快速方便地判斷接腳P1 〜P12的焊接狀況。 具體而言，於本實施例中，第一開關電路11斷開， 即開關K1〜K10均打開。此時，第一組接腳131的接腳 P3，P5，P7 , P9，P11未連接至第一公共節點A卜第二組 焊接點142的焊接點S2，S4，S6，S8，S10亦未連接至第 二公共節點A2。此時，只有第一組接腳131的接腳P1連 接第一公共節點A〗，第二組焊接點142的焊接點S12連 10 201122500 接第二公共節點A2。 於本實施例中，第二開關電路12導通，即開關kl〜 kll均閉合。此時，第一組焊接點141 (即焊接點S卜S3， S5，S7，S9，S11)與第二組接腳132 (即接腳P2，P4， P6，P8，P10，P12)——對應導通。正常情況下，整個檢 測電路為串聯連接，指示單元102會發出指示。然而，當 該些接腳P1〜P12與對應的焊接點S1〜S12之間存在開路 時，檢測電路斷開，指示單元102不會發出指示。 舉例而言，若第一組接腳131的接腳P3與第一組焊 接點141的焊接點S3之間存在開路（即接腳P3未焊接至 焊接點S3)，由於整個檢測電路為串聯連接，因此，檢測 電路於接腳P3與焊接點S3處斷開。如此，指示單元102 不會發出指示。 圖2所示為根據本發明之第二較佳實施例之檢測裝置 的電路圖。如圖2所示，本實施例所提供之檢測裝置1亦 包括檢測單元10、第一開關電路11以及第二開關電路12。 本實施例所提供之檢測裝置1與第一實施例所提供之 檢測裝置1的區別在於本實施例所提供之檢測裝置1的檢 測單元10為三用電表，而第一實施例中的檢測單元10包 括電源100與指示單元102 (如圖1所示）。 此外，本實施例中的檢測裝置1的其它元件的結構與 連接關係與第一實施例中的檢測裝置1 一致。故在此不再 贅述。 於本實施例中，檢測單元10為三用電表。於檢測過 11 201122500 !，二百先，將檢測單元10撥到歐姆檔。然後，將檢測 早凡的兩個檢測端分別輕接至第一公共節點A1盘第、 公共節點A2。 ，、米― +於本實施例中，當第一開關祕U導通且第二開關 包路12斷開時’檢測電路未被導通。此時，若檢測單元 1°不能測量到結果（即三用電表的指針不發生偏轉），則 表明遠些接腳Pi〜P12之間不存在短路。反之，若檢· 兀10可測量到結果（即三用電表的指針發生偏轉），則表 明檢測電㈣導通’即該些接腳P1〜P12之間存在短路。 此外，於本實施例中，當第一開關電路11斷開且第 二開關電路12導糾，檢測電路為串聯連接。此時，若 檢測單元可以测量到結果，則表明該些接腳P1〜m 與^應的焊接點S1〜S12之間烊接正常。反之，若檢測單 70不能測量到結果，則表明檢測電路斷開，即該此接 腳P1〜m與對應的谭接點S1〜S12之間存在開路。二 本實施例中第-開關電路u與第二開關電路12的檢 測肩理同第—實施觸述。故在此不再贅述。 圖3所示為根據本發明之第三較佳實施例之檢測裝罝 :電路圖。如圖3所示，本實施例所提供之檢測裝置2包 括檢測單元20、第-開關電路21以及第二開關電路M。 ^本貫施例令，檢測裝置2用於檢測j33連接器（圆 的19個接腳的洋接狀況。然而，本發明並不限定: In terms of the implementation, the first switching circuit U 丘二 I K1~K10 are closed. At this time, the switches Κ1 to Κ5 are turned on by the =8-8, that is, the point A1 and the pin p of the first group of pins 131, the pin of the first - is connected, and the solder joint of the second group of soldering points 142 sH. Further, the .θ of the second set of solder joints (4) is directly coupled to the second common node Α2. Thereby, the fire dry contact U2 is connected to the detecting unit 1〇. The second group...the second_road 12 is disconnected', that is, the switch heart S5, h shou, the first set of solder joints 141 (ie, the solder joints S1, S3 SU) and the second set of pins 132 (ie, the pin p2, material, 201122500 P6, P8, P10, P12) - Corresponding to disconnection. Normally, the entire detection circuit is not turned on, and the indication unit 102 does not give an indication. However, when there is a short circuit between the pins P1 P P12, the detecting circuit is turned on, and the indicating unit 102 gives an indication. For example, if there is a short circuit between the pin P3 of the set of pins 131 and the pin P4 of the second set of pins 132 (ie, the pin P3 and the pin P4 are turned on), the detecting unit 10 and the first switch The circuit 11, the pin P3 of the first set of pins 131, the pin P4 of the second set of pins 132, and the solder joint S4 of the second set of solder joints 142 constitute a conduction loop. As such, the indication unit 102 will issue an indication. Further, in the present embodiment, when the first switch circuit 11 is turned off and the second switch circuit 12 is turned on, it is detected whether or not an open circuit is formed between the pins P1 to P12 and the pads S1 to S12. At this time, if the instruction unit 102 gives an instruction, that is, the indicator lamp L1 emits light and the buzzer B1 emits a buzzer, the welding between the pins P1 to P12 and the corresponding pads S1 to S12 is normal. On the other hand, if the pointing unit 102 has no indication, there is an open circuit between the pins P1 to P12 and the corresponding pads S1 to S12. In this way, the operator can quickly and easily determine the welding condition of the pins P1 to P12. Specifically, in the present embodiment, the first switching circuit 11 is turned off, that is, the switches K1 to K10 are both turned on. At this time, the pins P3, P5, P7, P9, and P11 of the first set of pins 131 are not connected to the solder joints S2, S4, S6, S8, and S10 of the first common node A and the second set of solder joints 142. Connected to the second common node A2. At this time, only the pin P1 of the first set of pins 131 is connected to the first common node A, and the soldering point S12 of the second set of soldering points 142 is connected to the second common node A2. In this embodiment, the second switch circuit 12 is turned on, that is, the switches k1 to k11 are all closed. At this time, the first set of solder joints 141 (ie, solder joints Sb, S3, S5, S7, S9, S11) and the second set of pins 132 (ie, pins P2, P4, P6, P8, P10, P12) - Corresponding to conduction. Normally, the entire detection circuit is connected in series and the indication unit 102 will give an indication. However, when there is an open circuit between the pins P1 to P12 and the corresponding pads S1 to S12, the detection circuit is turned off, and the instruction unit 102 does not give an instruction. For example, if there is an open circuit between the pin P3 of the first set of pins 131 and the solder joint S3 of the first set of solder joints 141 (ie, the pin P3 is not soldered to the solder joint S3), since the entire detection circuit is connected in series Therefore, the detecting circuit is disconnected from the pin P3 and the soldering point S3. As such, the indication unit 102 does not issue an indication. Fig. 2 is a circuit diagram of a detecting device in accordance with a second preferred embodiment of the present invention. As shown in FIG. 2, the detecting device 1 provided in this embodiment also includes a detecting unit 10, a first switching circuit 11, and a second switching circuit 12. The detecting device 1 provided in this embodiment is different from the detecting device 1 provided in the first embodiment in that the detecting unit 10 of the detecting device 1 provided in the embodiment is a three-charging meter, and the detecting in the first embodiment Unit 10 includes a power source 100 and an indication unit 102 (shown in Figure 1). Further, the structure and connection relationship of the other elements of the detecting device 1 in the present embodiment are identical to those of the detecting device 1 in the first embodiment. Therefore, it will not be repeated here. In this embodiment, the detecting unit 10 is a three-meter electric meter. After testing 11 201122500 !, two hundred first, the detection unit 10 is dialed to the ohm file. Then, the two detected detection terminals are lightly connected to the first common node A1 disk and the common node A2, respectively. In the present embodiment, when the first switch U is turned on and the second switch packet 12 is turned off, the detection circuit is not turned on. At this time, if the detection unit cannot measure the result at 1° (that is, the pointer of the three-meter is not deflected), it indicates that there is no short circuit between the far pins Pi to P12. On the other hand, if the detection 兀10 can measure the result (i.e., the pointer of the three-meter is deflected), it indicates that the detection (four) is turned on, that is, there is a short circuit between the pins P1 to P12. Further, in the present embodiment, when the first switching circuit 11 is turned off and the second switching circuit 12 is turned on, the detecting circuits are connected in series. At this time, if the detection unit can measure the result, it indicates that the connection between the pins P1 to m and the welding points S1 to S12 of the pin are normal. On the other hand, if the detection unit 70 cannot measure the result, it indicates that the detection circuit is disconnected, that is, there is an open circuit between the pins P1 to m and the corresponding tan contacts S1 to S12. In the present embodiment, the detection of the first-switching circuit u and the second switching circuit 12 is the same as the first implementation. Therefore, it will not be repeated here. Figure 3 is a circuit diagram showing a mounting device in accordance with a third preferred embodiment of the present invention. As shown in Fig. 3, the detecting device 2 provided in this embodiment includes a detecting unit 20, a first-switch circuit 21, and a second switch circuit M. In the present embodiment, the detecting device 2 is used to detect the j33 connector (the state of the 19 pins of the circle). However, the present invention is not limited thereto.
方、1於其匕貫知例中，檢測襄置2亦可檢測具有其它接 腳數目的連接器。 U 201122500 於本貫施例中，連接哭47 Λ 〜P1Q44 〃 連接σσ匕括19個接腳。該些接腳Pl 〜 9匕括第一組接腳23〗 腳Ρ 1，、第二組接腳232。第一組接 腳231與電路板（於 941 丨马運接态電路板）的第一組焊 接點241〜一對應焊接。 弟一組接腳232與電路板的第二 對應焊接。換言之，該些接腳P1〜pi9 ”電路板^的焊接點S1H-對應焊接。 於本實施例中，第一组垃胳 腳ί腳231的數目大於第二組接 Ώ〇 、體而5，弟一組接腳231包括十個接腳 Ρ1，Ρ3，Ρ5’Ρ7，’Ρ—，Ρ15，ΡΠ，Ρ191: 組接腳232包括九個接腳Ρ2，Ρ4，Ρ6，Ρ8，Ρ10，Ρ12， Ρ14 ’ Ρ16，Ρ18。對廊妯，笙 ^ l 卞應地第—組焊接點241包括十個焊 :點 sl’s3，S5’S7，S9’su，sl3，sl5，si7，si9。 第二組焊接點242包括士 L括九個知接點S2，S4，S6，S8，S10, 〜S16 ’ S18 °然而’本發明並不限定於此。 於本貫施例中’第—組接聊231具有第一公共節點 =第二紅焊接點242具有第二公共節點A2。檢測單元 耦接第-公共節點A1與第二公共節點A2。 =實施例中，第—開關電路21分別將第—組接腳 ”—叫接點242 ——㈣至檢測單元20。第-開 關電路22分爾第-組焊接點241與第二組接:一2 以及第二組焊接點242盘帛M J、且接腳232 接點24彳宜,,，、苐一組接腳231，以使第—組焊 =⑷攻、第二組焊接點2 接腳231依次一一對應串聯連接至檢測單元2〇 4組 具體而言，於本實施例中，第-開關電路21包括第 13 201122500 一組開關K1〜K9與第二組開關K1〇〜Κ1δ。第一組開關 Κ1〜Κ 9分別耦接第一公共節點Α丨與第一組接腳2 31的接 腳 P3 ’ P5 ’ P7 ’ P9，Pll，P13 ’ P15，pi7，pi9。第二組 開關K10〜K18分職接第二公共節點A2與第二組焊接 點=42。其中，第一組接腳231的接腳ρι.直接麵接第一公 共節點A1。然而，本發明並不限定於此。於其它實施例中， 第-組接腳231的接腳P1亦可通過開關祕第一公共節 點A卜如此，第一組接腳231與第二組焊接點242 一一耦 接至檢測單元20。 於本只鉍例中，第二開關電路22包括第三組開關（即 組開關（即開關 k2，k4，k6，k8，klO，kl2，kl4，kl6， kl8)以及第-開關kl9。第三組開關——對應祕第一組 焊接點241 (焊接點S19除外）與第二組接腳232。第四 、且開關將第_組焊接腳242分別--對應輕接至第一組接 腳 231 的接腳 P3，P5，P7，P9，p11，pi3 pi5 pi7, P19此外’第一開關k19麵接第一組焊接點241的焊接 …’占S19與第一公共谛點A2。然而，本發明並不限定於此。 ;本g施例中，第一開關電路2丨與第二開關電路D 分別包括多_關‘，然而’本發明並不限定於此，於其它 實施例中，第-開關電路21與第二開關電路22可用一個 總開關控制。或者’第-開關電路21與第二開關電路22 可為繼電器。 此外於本员施例中，檢測單元2〇包括電源、指 14 201122500 示單元202以及開關K。指示單元202耦接電源200。指 示單元202包括指示燈L1與指示燈L2。開關Κ耦接電源 200與指示燈L1。於本實施例中，指示燈L1可為紅色的 指示燈，指示燈L2可為綠色的指示燈。然而，本發明並 不限定於此。於其它實施例中，指示單元202可包括具有 其它指示效果的元件。於此，指示燈L1為電源200的指 示燈。此外，於其它實施例中，檢測單元20可為三用電 表。此時，可將三用電表撥到歐姆檔，並將其兩端分別耦 鲁 接至第一公共節點Α1與第二公共節點Α2。 於本實施例中，於檢測過程中，閉合開關Κ。當指示 燈L1發光時，表明電源200正常工作。 於本實施例中，當第一開關電路21導通且第二開關 電路22斷開時，檢測接腳Ρ1〜Ρ19之間是否短路。此時， 若指示單元202發出指示，即指示燈L2發光，則接腳Ρ1 〜Ρ19之間存在短路。反之，若指示單元202未發出指示， φ 則接腳Ρ1〜Ρ19之間不存在短路。 此外，於本實施例中，當第一開關電路21斷開且第 二開關電路22導通時，檢測接腳Ρ1〜Ρ19與焊接點S1〜 S19之間是否開路。此時，若指示單元202發出指示，即 指示燈L2發光，則接腳Ρ1〜Ρ19與對應的焊接點S1〜S19 之間焊接正常。反之，若指示單元202無指示，則接腳Ρ1 〜Ρ19與對應的焊接點S1〜S19之間存在開路。如此，操 作者可快速且方便地判斷接腳Ρ1〜Ρ19的焊接狀況。 於本實施例中，第一開關電路21與第二開關電路22 15 201122500 的檢測原理同第一货施例所述。故在此不再贅述。 圖4所示為根拽本發明之第四較佳實施例之檢測裝5t 的電路圖。如圖4所示，本實施例所提供之檢測裝置2包 括檢測單元20、第1關電路21以及第二開關電路i 於本實施例中，_裝置2亦用於檢測J33連接器（關 ’未示）的19個接腳Pl〜pi9的焊接狀況。該些接腳 ⑽包括第-組接腳231與第二組接腳加。第—組接腳 31與第—組接腳议分別與電路板（於&，即 電路板）上的第一組焊接點241與第二組焊接^ ^ 对應焊接。即該些接腳Pl〜pl9與該些焊接點s 〜對應焊接。 本貫施例與第二實施例所不同的是 卿-的數目，觸二組接腳232的數目:具體^組， 〜組接腳231包括九個接腳ρι八3 。 ^ ^ ^ r I ·> » p 1 ] 13 ’ P15，P17。第二組接腳232包括十個接腳打，’ / /8 ’ Pi〇，P12，P14，pi6，m , pi9。對應地，第— 、，且焊接點241包括九個焊接點si，S3，s5，S7，％， m15 ’S17 n焊接點242包括十個焊接點= 4’％，88’810,312’814,816’818,819。然 發明並不限定於此，， 、、、本 公共節點 檢測單元 於本實施例中，第一組接腳231具有第.In the conventional example, the detection device 2 can also detect a connector having the number of other pins. U 201122500 In this example, the connection is crying 47 Λ ~ P1Q44 〃 connecting σσ includes 19 pins. The pins P1 ～ 9 include a first set of pins 23 and an ankle 232. The first set of pins 231 are soldered to the first set of solder joints 241 to 241 of the circuit board (in the 941 丨 运 运The set of pins 232 is soldered to the second corresponding to the board. In other words, the soldering points S1H- of the plurality of pins P1 to pi9" are corresponding to the soldering. In this embodiment, the number of the first set of legs 231 is greater than the number of the second set of contacts, and 5, The set of pins 231 includes ten pins Ρ1, Ρ3, Ρ5'Ρ7, 'Ρ-, Ρ15, ΡΠ, Ρ191: the group pin 232 includes nine pins 2, Ρ4, Ρ6, Ρ8, Ρ10, Ρ12, Ρ14 ' Ρ16, Ρ18. For the gallery, 笙^ l 卞 第 第 组 组 焊接 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 241 The group of solder joints 242 includes nine L-shaped contacts S2, S4, S6, S8, S10, and S16 'S18 °. However, the present invention is not limited thereto. In the present embodiment, the first group chats. 231 has a first common node = second red solder joint 242 has a second common node A2. The detecting unit is coupled to the first common node A1 and the second common node A2. In the embodiment, the first switch circuit 21 respectively The group pin" - called the contact 242 - (d) to the detecting unit 20. The first switch circuit 22 is separated from the second set of solder joints 241 and the second set: a 2 and a second set of solder joints 242, MJ, and the pin 232 contacts 24 are suitable, a, and a set of pins 231, in order to make the first group welding = (4) attack, the second group of welding points 2 pins 231 are sequentially connected one by one to the detection unit 2〇4 group. Specifically, in the embodiment, the first switching circuit 21 includes The 13th 201122500 group of switches K1~K9 and the second group of switches K1〇~Κ1δ. The first group of switches Κ1 to Κ9 are respectively coupled to the pins P3 ’ P5 ’ P7 ’ P9, P11, P13 ′ P15, pi7, pi9 of the first common node Α丨 and the first group of pins 2 31 . The second group of switches K10 to K18 are assigned to the second common node A2 and the second group of solder joints = 42. The pin ρ. of the first group of pins 231 directly faces the first common node A1. However, the invention is not limited thereto. In other embodiments, the pin P1 of the first set of pins 231 can also be connected to the first public node A. The first set of pins 231 and the second set of soldering points 242 are coupled to the detecting unit 20 . In the present example, the second switch circuit 22 includes a third group of switches (ie, group switches (ie, switches k2, k4, k6, k8, klO, kl2, kl4, kl6, kl8) and a first switch kl9. Group switch - corresponding to the first group of solder joints 241 (except solder joint S19) and the second group of pins 232. Fourth, and the switch will be the first group of solder pins 242 respectively - correspondingly connected to the first group of pins Pins 231, P3, P7, P9, p11, pi3 pi5 pi7, P19, in addition, 'the first switch k19 is connected to the first set of solder joints 241...'s S19 and the first common defect A2. However, this The present invention is not limited thereto. In the present embodiment, the first switching circuit 2A and the second switching circuit D respectively include multiple_off', but the present invention is not limited thereto, and in other embodiments, The switching circuit 21 and the second switching circuit 22 can be controlled by one main switch. Alternatively, the 'the first switching circuit 21 and the second switching circuit 22 can be relays. In addition, in the embodiment of the present invention, the detecting unit 2 includes a power source and a finger 14 201122500 shows unit 202 and switch K. The indicating unit 202 is coupled to the power source 200. The indicating unit 202 includes an indicator light L1. The indicator light L2 is connected to the power source 200 and the indicator light L1. In the embodiment, the indicator light L1 can be a red indicator light, and the indicator light L2 can be a green indicator light. However, the invention is not limited thereto. In other embodiments, the indicating unit 202 may include an element having other indicating effects. Here, the indicator light L1 is an indicator light of the power source 200. Further, in other embodiments, the detecting unit 20 may be a three-meter power meter. At this time, the three-meter power meter can be dialed to the ohmic gear, and the two ends thereof are respectively coupled to the first common node Α1 and the second common node Α2. In this embodiment, during the detection process, the switch 闭合 is closed. When the indicator L1 is illuminated, it indicates that the power supply 200 is working normally. In this embodiment, when the first switch circuit 21 is turned on and the second switch circuit 22 is turned off, it is detected whether there is a short circuit between the pins 1 to 19. If the indication unit 202 gives an indication that the indicator light L2 is illuminated, there is a short circuit between the pins 1 to 19; conversely, if the indication unit 202 does not give an indication, φ is not short-circuited between the pins 1 to 19. In this embodiment When the first switch circuit 21 is turned off and the second switch circuit 22 is turned on, it is detected whether there is an open circuit between the pins 1 to 19 and the solder joints S1 to S19. At this time, if the indication unit 202 gives an instruction, the indicator light L2 is illuminated. Then, the welding between the pins 1 to 19 and the corresponding welding points S1 to S19 is normal. On the contrary, if the indicating unit 202 has no indication, there is an open circuit between the pins 1 to 19 and the corresponding welding points S1 to S19. The welding condition of the pins 1 to 19 can be judged quickly and conveniently. In the present embodiment, the detection principle of the first switching circuit 21 and the second switching circuit 22 15 201122500 is the same as that described in the first embodiment. Therefore, it will not be repeated here. Fig. 4 is a circuit diagram showing a detecting device 5t according to a fourth preferred embodiment of the present invention. As shown in FIG. 4, the detecting device 2 provided in this embodiment includes a detecting unit 20, a first off circuit 21, and a second switch circuit i. In this embodiment, the device 2 is also used to detect a J33 connector (off). The welding condition of the 19 pins P1 to pi9 (not shown). The pins (10) include a first set of pins 231 and a second set of pins. The first set of pins 31 and the first set of pins are respectively soldered to the first set of solder joints 241 on the circuit board (on &, the circuit board) and the second set of solder joints ^^. That is, the pins P1 to pl9 are soldered to the solder joints s~. The difference between the present embodiment and the second embodiment is the number of the pair, the number of the two sets of pins 232: the specific group, the group pin 231 includes nine pins ρι 八3. ^ ^ ^ r I ·> » p 1 ] 13 ’ P15, P17. The second set of pins 232 includes ten pins, '/ /8 ’ Pi〇, P12, P14, pi6, m, pi9. Correspondingly, the first, and the weld 241 includes nine welds si, S3, s5, S7, %, m15 'S17 n weld 242 including ten welds = 4'%, 88'810, 312'814, 816'818, 819 . However, the invention is not limited thereto, and the common node detecting unit is in the present embodiment, the first group of pins 231 has the first.
Al。第二組焊接點242具有第二公共節點A2 2〇叙接第一公共節點A1與第二公共節點A2。 於本實施例中，第-開關電路21分別將第—組接腳 16 201122500 231與第二組焊接點242 --搞接至檢測料2〇。第二開 關電，22刀別耦接第一組焊接點241與第二組接腳232 以及第一、、且^接點242與第一組接腳231，以使第二組接 腳32第組焊接點241、第一組接腳231及第二組焊 接點242依次――對應串聯連接至檢測單元20。 具體而言’於本實施例中’第一開關電路21包括第 、、’]關K1〜K9與第二組開關κ 10〜K18。第一組開關 _ K1〜K9分別耦接第一公共節點A1與第一組接腳231 (即 接腳 PI ’ Ρ3，Ρ5，Ρ7，Ρ9，Pll，Ρ13 ’ Ρ15，Ρ17)。第二 組開關κιο〜Kl8分別耦接第二公共節點α2與第二組焊 接點 242 的焊接點 S4，S6，S8，S10，S12，S14，S16， S18 ’ S19。其中，第二組焊接點242的焊接點S2直接耦 接第二公共節點Α2。然而，本發明並不限定於此。於其它 貫施例中’第二組焊接點242的焊接點S2亦可通過開關 耦接第二公共節點Α2。如此，第—組接腳231與第二組焊 •接點242分別一一耦接至檢測單元20。 於本實施例中’第二開關電路22包括第三.組開關（即 開關 kl，k3，k5，k7 ’ k9，kll，kl3，kl5，kl7)、第四 組開關（即開關 k2，k4，k6，k8，kl〇，kl2，kl4，kl6， k18)以及第一開關kl9。第三組開關——對應耦接第一組 焊接點241與第二組接腳232 (接腳S19除外）。第四組開 關將第一組接腳231分別--對應耦接至第二組焊接點 242 的焊接點 S4，S6，S8，S10，S12，S14，S16，S18， S19。此外’第一開關kl9耦接第二組接腳232的接腳P19 17 201122500 與第一公共節點A1。然而，本發明並不限定於此。 於本實施例中，檢測裝置2的檢測單元20的結構與 連接關係與第三實施例中的檢測裝置2的檢測單元20 — 致。故在此不再贅述。此外，本實施例中的檢測裝置2的 檢測原理與第三實施例中的檢測裝置2的檢測原理一致。 故在此亦不再贅述" 圖5所示為根據本發明之一較佳實施例之檢測方法的 流程圖。請' 併麥考圖1至圖5。本貫施例中提供之檢测 方法用於檢測多個接腳的焊接狀況。檢測方法包括步驟 S01至步驟S03。 於本實施例中，如步驟S01所示，提供檢測裝置。具 體而言，依據需要檢測的接腳數目，提供檢測裝置。檢测 裝置包括檢測單元、第一開關電路與第二開關電路。舉例 而言，當需檢測的接腳的數目為偶數時，提供具有如圖1 或圖2所示電路圖的檢測裝置，並將接腳均分為兩組接 腳。當需檢測的接腳的數目為奇數時，提供具有如圖3或 圖4所示電路圖的楡測裝置，並將接腳分為兩組接腳，且 其中一組接腳的數比另一組接腳的數目多一。由於檢測 裝置已於上述四個較佳實施例中詳述，故在此不再赘述。 於本實施例中，於步驟S02中，當第一開關電路導通 且第二開關電路斷開時，檢測該些接腳之間是否短路。於 步驟S03中，當第一開關電路斷開且第二開關電路導通 時，檢測該些接腳與對應的焊接點之間是否開路。然而， 本發明並不限定於此。於實際應用中，亦可先檢測該些接 18 201122500 腳與對應的焊接點之間是否開路。然後，再檢測該些接腳 之間是否短路。 綜上所述，藉由本發明較佳實施例所提供之檢測裝置 的第一開關電路與第二開關電路，檢測裝置可檢測該些接 腳之間是否短路或該些接腳與對應的焊接點之間.是否開 路。藉由本發明較佳實施例提供之檢測裝置，操作者無需 逐點量測即可快速方便地判斷多個接腳的焊接狀況。此 外，藉由本發明較佳實施例中提供之檢測方法，不僅操作 省時省力，而且提高了工作效率。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在不 脫離本發明的精神和範圍内，當可作些許的更動與潤飾， 因此本發明的保護範圍當視申請專利範圍所界定者為準。 【圖式簡單說明】 圖1所示為根據本發明之第一較佳實施例之檢測裝置 的電路圖。 圖2所示為根據本發明之第二較佳實施例之檢測裝置 的電路圖。 圖3所示為根據本發明之第三較佳實施例之檢測裝置 的電路圖。 . 圖4所示為根據本發明之第四較佳實施例之檢測裝置 的電路圖。 圖5所示為根據本發明之一較佳實施例之檢測方法的 19 201122500 流程圖。 【主要元件符號說明】 卜2 檢測裝51 10，20 檢測單元 100 ， 200 電源 102 > 202 指示單元 U，21 第一開關電路 12，22 第二開關電路 131 » 231 第一組接腳 132 ， 232 第二組接腳 141 ， 241 第一組烊接點 142 ， 242 第二組焊接點 A1 第一公共節點 A2 第二公共節點 B1 蜂鳴器 LI，L2 指示燈 K，K1 〜K18，kl〜kl8 開關 kl9 第一開關 P1 〜P19 接腳 SOI〜S03 步驟 S1 〜S19 焊接點 20Al. The second set of solder joints 242 has a second common node A2 2 〇 which is connected to the first common node A1 and the second common node A2. In the present embodiment, the first switch circuit 21 respectively connects the first set of pins 16 201122500 231 and the second set of solder joints 242 to the test material 2 . The second switch is electrically coupled to the first set of solder joints 241 and the second set of pins 232 and the first and second contacts 242 and the first set of pins 231 so that the second set of pins 32 The set of solder joints 241, the first set of pins 231, and the second set of solder joints 242 are sequentially connected to the detection unit 20 in series. Specifically, in the present embodiment, the first switch circuit 21 includes the first, the '] off K1 to K9 and the second group of switches κ 10 to K18. The first group of switches _ K1 - K9 are respectively coupled to the first common node A1 and the first group of pins 231 (ie, pins PI Ρ Ρ 3, Ρ 5, Ρ 7, Ρ 9, P11, Ρ 13 Ρ Ρ 15, Ρ 17). The second set of switches κιο~Kl8 are respectively coupled to the solder joints S4, S6, S8, S10, S12, S14, S16, S18' S19 of the second common node α2 and the second set of solder joints 242. The solder joint S2 of the second set of solder joints 242 is directly coupled to the second common node Α2. However, the invention is not limited thereto. In other embodiments, the solder joint S2 of the second set of solder joints 242 can also be coupled to the second common node Α2 via a switch. Thus, the first set of pins 231 and the second set of solder joints 242 are coupled to the detecting unit 20 one by one. In the present embodiment, the second switch circuit 22 includes a third group switch (ie, switches k1, k3, k5, k7 'k9, kll, kl3, kl5, kl7) and a fourth group of switches (ie, switches k2, k4, K6, k8, kl〇, kl2, kl4, kl6, k18) and the first switch kl9. The third set of switches - correspondingly coupled to the first set of solder joints 241 and the second set of pins 232 (except for pin S19). The fourth set of switches respectively couples the first set of pins 231 to the solder joints S4, S6, S8, S10, S12, S14, S16, S18, S19 of the second set of solder joints 242. In addition, the first switch k19 is coupled to the pin P19 17 201122500 of the second set of pins 232 and the first common node A1. However, the invention is not limited thereto. In the present embodiment, the structure and connection relationship of the detecting unit 20 of the detecting device 2 are the same as those of the detecting unit 20 of the detecting device 2 in the third embodiment. Therefore, it will not be repeated here. Further, the detection principle of the detecting device 2 in the present embodiment is identical to the detecting principle of the detecting device 2 in the third embodiment. Therefore, it is not described herein again. Fig. 5 is a flow chart showing a detecting method according to a preferred embodiment of the present invention. Please 'and McCaw Chart 1 to Figure 5. The detection method provided in the present embodiment is used to detect the welding condition of a plurality of pins. The detecting method includes steps S01 to S03. In the embodiment, as shown in step S01, a detecting device is provided. Specifically, a detecting device is provided depending on the number of pins to be detected. The detecting device includes a detecting unit, a first switching circuit and a second switching circuit. For example, when the number of pins to be detected is an even number, a detecting device having a circuit diagram as shown in Fig. 1 or Fig. 2 is provided, and the pins are equally divided into two sets of pins. When the number of pins to be detected is an odd number, a detecting device having a circuit diagram as shown in FIG. 3 or FIG. 4 is provided, and the pins are divided into two sets of pins, and the number of one set of pins is higher than the other The number of group pins is one more. Since the detecting device has been described in detail in the above four preferred embodiments, it will not be described herein. In this embodiment, in step S02, when the first switch circuit is turned on and the second switch circuit is turned off, it is detected whether there is a short circuit between the pins. In step S03, when the first switch circuit is turned off and the second switch circuit is turned on, it is detected whether an open circuit is between the pins and the corresponding solder joint. However, the invention is not limited thereto. In practical applications, it is also possible to detect whether there is an open circuit between the legs of the 201122500 and the corresponding solder joints. Then, it is detected whether there is a short circuit between the pins. In summary, with the first switch circuit and the second switch circuit of the detecting device provided by the preferred embodiment of the present invention, the detecting device can detect whether there is a short circuit between the pins or the pins and corresponding solder joints. Whether it is open or not. With the detecting device provided by the preferred embodiment of the present invention, the operator can quickly and conveniently determine the welding condition of the plurality of pins without the point-by-point measurement. In addition, by the detection method provided in the preferred embodiment of the present invention, not only the operation saves time and labor, but also the work efficiency is improved. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a circuit diagram of a detecting apparatus according to a first preferred embodiment of the present invention. Fig. 2 is a circuit diagram of a detecting device in accordance with a second preferred embodiment of the present invention. Fig. 3 is a circuit diagram of a detecting device in accordance with a third preferred embodiment of the present invention. Fig. 4 is a circuit diagram showing a detecting device in accordance with a fourth preferred embodiment of the present invention. Figure 5 is a flow chart of a 201122500 process for detecting a method in accordance with a preferred embodiment of the present invention. [Main component symbol description] Bu 2 detection device 51 10, 20 detection unit 100, 200 power supply 102 > 202 indication unit U, 21 first switch circuit 12, 22 second switch circuit 131 » 231 first group of pins 132, 232 second set of pins 141, 241 first set of contact points 142, 242 second set of solder joints A1 first common node A2 second common node B1 buzzer LI, L2 indicator lights K, K1 ~ K18, kl ~ Kl8 switch kl9 first switch P1 ~ P19 pin SOI ~ S03 step S1 ~ S19 solder joint 20