201120727 六、發明說明： 【發明所屬之技術領域j 本發明係主張_2_年G9月29日申請之韓國專利案 號特願10-2_-0092598之優先權。藉以引用的方式併入本文 用作參考。 本發明係關於-種可以彳貞測多點觸控的電阻型觸控螢幕 及其製造方法。 【先前技術】 伴隨著電子工程和資訊科技不斷的發展，電子設備在日 常生活中’包括J1作魏仙，所佔的份量敎增加。電子設 備的類型近來變化繁多’具有新魏_型設計，尤其在筆記 型電腦和手機之_可攜式電子產品領域，如雨後春荀出現。 因為在日常生种我們所接觸的電子設備日趨多樣化，而且其 功能亦變·奇與因此提高了對容祕用且可依直覺操 作的使用者介面的需求。 ^控式螢幕因是—種可以滿足上述f求的輸人裝置而受 T意二且料奸設備狀採闕控錢幕。觸控式瑩幕 是-種設定為可在顯示螢幕上_到—接觸位置，並且藉由使 用該接觸位置輸人資訊而控做括顯示在_電子設備。 圖1為先前技術的4-線電阻型觸控螢幕。 此具有—透明導賊的4_線電阻型觸控#幕，如圖1所 201120727 示，包括-下基板10、结構其上形成㈣極2〇、透明導電膜5〇 以及點間隔物6G (dotsp請）、-上基板3G結構其上形成有 透明導電膜50和電極20、以及一雙面膠帶配置來貼合上基板 結構和下基板結構’因此，4_線電賴法_控螢幕可從外部 輸入訊號至上基板結構和下基板結構，且，或從上基板結構和 下基板結構輸出訊號至外部。 以觸控輸人是在上基板3G輸人的情況而言，觸控輸入的 辨別位置為在上/下基板30、10的透明導電膜進行一機械性接 觸，其中在反面基板接觸點形成的χ姊Y軸的位能 (potentials)被辨別，以根據位能值間接辨別位置。 參閱圖2⑻’在具有-預定電阻值的透明導電膜的上/ 下端部10對獅成γ練能產生電極4()以及在上/下電極 4〇、施以-預定電壓的情況下，γ軸方向位能的形成為在一透 明導電膜1G上形成-γ軸方向祉線45 (哪㈣_ 在上/下基板接觸點的一 Y座標辨識的測量，是以透過 對向基板(opposite substrate)的透明導電獏1〇，藉由觸控壓力 而測量和辨識Y方向位能值之方式進行。如圖2(b)所:，χ 轴位此測量的進行是以# —情況τ，施加—預定電壓在橫跨對 稱形成在具有預定電阻值的透明導賊10左/右端部的叫 方向電極時’ —X轴方向等位線45形成在透明導電膜1〇上 方式進行。而在上/下基板麵闕—χ座標辨識的測量 201120727 與辨識是透過具有戦在X财向驗能值讀向基板的透 明導電膜’藉由觸控壓力之方式進行。 因結構簡單，上述4·線電阻_觸控螢幕藉由使用網板 印刷法(screenprimmethod)來形成電極。然而，配有觸控螢幕 的可穩式終賴上顯tf裝置的魏最近趨於乡樣化，對多關 控勞幕的需求亦日益增加，而不只是單純識別觸控訊號，如此 來亦增加了對藉由偵測多點觸控訊號而驅動的電阻型觸控 鸯幕的需求。 、為了製造生產多點觸控勞幕，增加電極是無法避免的， 尤其是在多關控縣朗至可攜式終端機的情況下。特別是 目前的潮流’螢幕（作)邊緣作為非作用區的邊框尺寸縮 J至3mm之内。然而，由於形成傳統佈線圖案的作業限制， 大里生產佈線見度小於8()pm是有困難的^亦即，由於用來形 成傳統佈_案_版印刷齡（s_n prim pra⑽）的限 制，形成一具有細微線寬和線距的佈線結構是困難的。 事實上’在傳統絲網印制法（silkscreenmeth〇d)的線寬 和線距小於2〇〇μιη的情況下，大量生鱗錄㈣尺寸。因 此，去除獨以獲得穩定產率，然而對於佈線寬度小於卿m 時’也幾乎不可能大量生產。 。作為克服這些缺點的方法，雖然已考量使用微影技術製 心（photolnhography engineering process)形成佈線，但在使 6 201120727 影技術製裎時仍有高 用金屬薄型電極材料形成佈線圖案的微 電阻的缺點。 實際上在多重電阻式觸控螢幕，增 9加升>成電極圖幸的佑 線數量以增長電極佈線圖案會快速增加電卩且。 〃 ^ 【發明内容】 本發明鑑於上述問題，而本發明的一目標為提供 侧多點觸控的電阻型觸控螢幕，麵微影技術製程和網 刷製程形成-具有細微圖案和明顯減少佈線電阻 resistance )的金屬佈線圖案來提供高解析度。 在本發明的一考量面，提供一可偵測多點觸控的電阻型 觸控螢幕的製造方法，其中此方法包括—金屬佈線圖案形成過 程’其中在該過程中’在透明導賴上的至少—或多個單元作 用區（cell active area)形成有一金屬佈線圖案，而部份的金屬 佈線圖案施以微影技術法，其餘則施賴版印刷製程於該金屬 佈線圖案其形成在氧化銦錫（ITO)、氧化銦鋅（IZN)或氧 化鋅（ZnO)翻導電_任-者上形賴至少—或多個單元 作用區。 在本毛月些貫施例中，金屬佈線圖案形成過程為連接 =接近末端部份的單猶用區的m片第一絲_群是由微 Ά程形成’ n #第二佈線職群細版印織程形成，或者 201120727 是在全部金屬佈線®飾成在透明導細上後，除了 @片第 -佈線圖案群外，Μ第二佈線随群由網版印·程形成， 其中整個金屬佈線圖案的長度㈤=m長度+η長度，Ν、 m和η為自然數，且^仝η。 义 在本發明-些實施例中，金屬佈線圖案形成過程可包 括：為形成-線路’在-透明導電膜上形成金屬形成一 金屬佈線圖案’其巾每-金屬細_微影製麵連接至單元 作用區’·以及除了與連接至接近末端部份的單元作用區之第一 佈線圖案群的多個m片之外，在第—佈線圖案群的多個η 片的-佈線圖案形成第二佈線圖案，其中整個金屬佈線圖案的 長度（N) = m長度+η長度’N、m和η為自然數，且爪 > η ° 在本發明-些實施财，微難程可包簡由在透明導 電膜塗上感光物質、經由曝光、顯影和_而形成—佈線圖案 的步驟。 / 在本發明一些實施例中，形成金屬佈線圖案的傳導物質 可包括含有銀、铭、銅、金、鎳、把（Pd)、錫、和姑的任一 材料，或是使用具有這些金屬二元合金或三元合金的材料。 在本發明一些實施例中，金屬佈線圖案線寬可在 至80μηι的範圍。 在本發明的另-考量面’提供一可偵測多點觸控的電阻 201120727 =2帽控螢幕由在一透明導電膜上形成上層板和 曰σ、、有由微顯齡和峨印㈣程形成並連接至單元 =側蠕部的金屬佈線圖案’財在上層板和下層板形成 此:Γ疋作用區互相垂直’且其中金屬佈線圖案連接越過這 二早70作用區的線寬範圍為ωμΐΒ至80μηι。 本翻—些實闕t，金屬佈義射包括在上層板 口曰板上形成、接近末端部份的第—佈線圖轉，和排除了 :佈線圖案群的第二佈線圖案群，其中第二佈線圖案群印製 在第一佈線圖案群的上表面。 在本發明一些實施例中，金屬佈線圖案可包括在上層板 和y層板上形成、接近末端部份的一第一佈線圖案群，和排除 第佈線圖案群後的第二佈線圖案群，其中在第一和第二佈 線圖案群之間形成多個連接圖案單元（_eetiGn pattem units)。 在本發明-些實施例巾，連接酵單元的數量對應整個 佈線圖案的數量。 在本#貫施例中’第一佈線圖案群電阻的範圍可 在200Ω至肋’第二佈線圖案群電阻的範圍則在聰至观。 根據本發明可細彳乡關控的電阻购控螢幕及其製造 方法’藉由利用微影製程和網版印刷製程進行金屬伟線圖案， 而得以實施-微_案並大量減少電阻，實現高解析度的優 201120727 點。 本發明欲解決的技術主題並不只限於以上描述，任何熟 知此技藝者可如下描述喊楚了解任域至目前尚未私 的其它技術問題。 在1 下敘述中將部份描述本發明額外的優點、目標、和 特色其匕心則對熟知此技藝者在審視町敘述後將變得顯 =易見，或者可從本發明的實施例中習得。本發明的目標和其 匕優點可攸此書面說明和中請專々範圍指出的結構和附圖中 得到理解。 =須了解以上對本發明概括性描述和以下的詳細描述， "、範和解4性冑，且旨在$本發#所巾請的專利提供 進一步解說。 【實施方式】 、下將伴縫圖示詳細描述本發明的實施例。為求清晰和 便利纟赋元件的尺寸或形狀可能被誇大。 =定名柯依發日狀所瞭解來定義以於最佳模式來描述 ^揭路本L據此’在本說明書和中料利範圍所使用的特 定名§)或用字的忍義不應限於字面上或—般使用的認知，而應 根據本發明的她σ鱗來轉。因麟些名顺定義應根據 整份說明書内容而定。 201120727 圖 中相同的元件符縣指_或對麟元件。為求清 I、_’習知的建構或製程敘述將可能被省略，卩避免不必 要的細節模糊了本發明。 )再者’在詳細敘述或中請專利朗中所使用「包括」一 巧的程度’旨在涵蓋所有翻，類似於「包含」—詞於申請專 利時作為一過渡名詞的方式。 第-」、「第二」以及類似的用詞在此並不代表任何 順序、品質、献重要性，而是用_分各項猶，而且在此 的「一」並不代表數量的限制，而是代表至少—參考項目。 在形成可_多關㈣電_觸控螢幕（在此之後以 「觸控螢幕」稱之）的金屬佈線時’在金屬佈線密度高的部份 使用微影製細彡成金屬佈線，在金屬佈_度低㈣份則使用 網版印刷製獅成金屬佈線，細完成—細微_並減低 電阻。 參閱圖3、4和5，圖3顯示在觸控營幕上層板一透明導 電膜的結構’圖4概念上顯稀翻導電_金屬佈線架構， 以及圖5醜科縣τ層板—透料電膜的結構。 可偵測多點觸控的電阻型觸控螢幕，如騎示，通常包 括在-上層板和下層板之_—結合結構，其财在—透明導 電膜上形成金屬佈線圖案。如圖3和4所示，可偵測多點觸控 的電阻型觸控螢幕包括在複數個單元的多個有效區⑷， 11 201120727 ..Cn)(在此之後以 C2 外部接觸（碰觸早70伽區」狄），其藉由一 、I啁）造成電阻值的改 接至一金屬介 (touch signal) =別疋’連接至每—單元作賴的金屬佈、軸案聚集 居取(P，11G) ’該末端部份依次序地連接至」配置為 。貝’測連接訊號值改變的電路單元(circuitunit)。 每—單元作㈣形成有二個金屬佈線圖案， ^，㈣細者翻導電_外部以縣在末端部份110,因 ’端部份110較遠部位的金屬佈、線130之長度自然加 :而離末端部份11G Μ近部位的金屬佈線⑽之長度自然變 短’其中依序聚集的這些金屬饰線以增加金屬佈線的密度，如 聚集的金屬佈線120所示。 牛〇而。φ於單元作龍的η個數量，最靠近末端 份no料元作(⑴左右兩婦_金勒線的總數 應為2n，而距離末端部份110最遠的單元作用區（Cn)左右 兩側聚集金屬佈線的總數應為2。 金屬佈線數量增加流露出製造生產工程的限制，尤其是 實現電極寬度小於8(^m的細微酸是非常嶋的。再者，在 金屬佈線（電極）加長的狀況下，電阻將無可避免地增加，致 使需要非常低電阻物理特性的多點觸控螢幕產生不足。 12 201120727 此物理特性同樣應用在下層板的透明導電膜形成的圖案 結構。亦即，下層板的透明導賴的配置紅層板的單元作用 區垂直於單元作用區（Dl，〇2,D3......D1)的方式，其中聚集 每-金屬佈_末端部份則因金屬佈線_密度增加而造 成執行細翻案上的瞻，職離末端部份較遠的料作用區 增加電極電阻是產生的另一缺點。 、圖6顯示圖4中金屬佈線的佈線電阻’更仔細的說，圖6 為測量在上層/T層板和氧化觸（ΠΌ)的電極電阻之數據。 假设總共排列24個金屬佈線’左右侧各12個，從最外部到右 側結尾的每個佈線以—〜x命名，並測量金屬佈線的佈線電 阻。 更仔細的說’在塾片組（padunit)的兩個電極的電阻值 顯示（佈線+氧化銦錫+佈線）的電阻，如圖所示，其中由於 氧化銦錫的高電阻使該值偏高。這顯示，當佈線電阻在 200〜1_Ω哺®内，即使忽視氧化轉的電阻，要實施多 電阻膜所需求小於100Ω的佈線電阻是困難的，但可藉由圖7 所建議的步驟可克服這項缺點。 亦即’在上層板或下層板形錢明導電膜的金屬佈線圖 案時，透過微影方法形成距離末端部份更遠的區域。 <第一實施例> 13 201120727 > 7、8和9’根據本發明，形成—金屬佈線的方 法為在-透明導電膜（S1，S2)上形成用於佈線圖案的一金 屬薄膜層、。接著’金屬薄膜層塗上感光材料（亦即，DFR)， 並透過曝光、顯影和糊製程⑸，⑷形成—第一饰線圖 案。已形成第一佈線圖案的部位可限制在末端部份（P區域） 和接近及朝向該末端部份的部位（Q區域）。接著，藉由網版 P刷衣私域—慨末端部份（p區域）更遠的區域15〇，並 連接至第一佈線圖案（S5)。 叙°又所有佈線圖案的長度為N ’總共Μ數量的佈線圖案 和η數量的佈線圖案使⑽版印刷製程而分卿成為第一佈 線圖案和第二佈線圖案（N、m和η為自然數，且略，化m 長度+n長度，且可根據製造情況和產品規格來調整m和n 值）。 舉例而言，如果Ν=12，藉由微影製程可形成接近末端部 份的第1至第6金屬佈線電極’而使用網版印刷製程形成較遠 處的第7至第12金屬佈線。 網版印刷製程是將銀膏（Ag paste)塗佈在第7至第I) 金屬佈線電極使電阻小於1〇至3〇Ω的範圍内，且靠近末端部 份的金屬佈線電阻影響佈線電阻。由微影製程形成在末端部份 附近區域的金屬，其長度可減少至傳統長度的一半，而使電陡 小於200至lkQ。 14 201120727 °月參閲圖9 ’藉由微影製程形成佈線集中部14G (第-佈 線圖案）A就是#近末端部份（p)的區域⑼，而距離 末端部伤遂處的單元作用區（R區域）的金屬佈線（第二佈線 圖案）由網版印刷製程實現。在此例中，第一和第二佈線圖案 可連接至數1可多達於佈線總數的連接圖案單元⑺。 <第二實施例> 以下將描述-不同於上述製造方法的實施例。 首先，在形成第一佈線圖案時，形成一金屬薄膜其用以 在透明導電膜的整個區域形成佈線，以及經由曝光、顯影和餘 刻製程在該整個區形成金屬佈線。接著，藉由網版印刷製程， 在形成有上述第二佈線圖案的一區域的第一佈線圖案上表面 形成一第二佈線圖案。也就是說，使用網版印刷製程使第一佈 線圖案的上表面覆蓋一金屬材料以形成第二佈線圖案。在此例 中，第二佈線圖案的區域更有一雙層構造形成在第一佈線圖案 底下。 假設金屬佈線圖案的總數為N、第二線路圖案的數量為 η、以及透過網版印刷製私以遮盖在第一佈線圖案上表面所开/ 成的第二佈線圖案的數量為η ’其中雖然各別的數字相同，八 部佈線的總長度（Ν)與暴露出的苐一佈線圖案和第二線路圖 案兩者長度相加的值相同。 15 201120727 即使在本例中，介於第二佈線圖案的一區域和第一佈線 圖案的一區域之間的邊線(border)定義為一連接圖案單元 (J)，而第一佈線圖案和第二佈線圖案以疊層的架構所形成。 在任一情況下，本發明中的金屬佈線圖案，形成金屬佈 線圖案的傳導物質為包括銀、紹、銅、金、鎳、把、錫和始的 任-種材料’或者使用上述金屬中的二元合金或三元合金的材 料。再者，可由氧化銦錫（IT〇)、氧化銦鋅（KN)或氧化 鋅（ZnO)中任—種實施透明導電膜，且金屬佈線圖案的寬度 在10〜80μπι的範圍。 亦即，根據本發明，微影和網版印刷製程可同時應用來 形成金屬佈線’例如，—個可以增加製造效能的雜、細微圖 案的金屬佈線和防止因電阻而降低可靠性。同時，加以利用形 成時帶有透明導賴金屬佈線圖㈣上層板和下層板。也就是 說，藉由微影和網版印刷製程，而在透明導電膜形成帶有金屬 佈線圖案並連接至單元作用區賴邊端部的上層板和下層 板，且在此例中，在上層板/下層板形成的單元作用區以直角 排列的架構形成’在此連接至單猶用區兩端的金屬佈線圖案 的線寬為小於10〜80μιη的細微圖案。 雖然以揭露實施例來描述本發明，此申請中所揭露的實 施例從各方面來說應被視為說明性質且非具有限制性。而熟知 此技術者應可在不偏離如申請專利所定義之權利範圍而對實 16 201120727 施例做出的改變。本發明的範如所_申請專麟定，而# 上述說明，而聽含轉㈣料·_含紅内而做的修 正或改變。 【圖式簡單說明】 附圖用於提供對本發明進一步的了解，並已納入且成為 本申請的一部份，圖解顯示本發明的實施例，且連同文字說明 解釋本發明的原理。在圖形中： 圖1和2顯示根據先前技術之可偵測多點觸控的電阻式 觸控螢幕結構的概念圖； 圖3至6顯示根據本發明之可偵測多點觸控的電阻式觸 控螢幕構造及其製造方法的概念圖；以及 圖7至9顯示根據本發明之可偵測多點觸控的電阻式觸 控螢幕主要零件和其製程的概念圖。 17 201120727 【主要元件符號說明】 10 20 30 40 45 50 60 110 120 130 140 210201120727 VI. Description of the Invention: [Technical Field of the Invention] The present invention claims the priority of Korean Patent Application No. 10-2_-0092598 filed on September 29, 2009. This is incorporated herein by reference. The present invention relates to a resistive touch screen capable of speculating multi-touch and a method of fabricating the same. [Prior Art] With the continuous development of electronic engineering and information technology, electronic equipment has increased its weight in daily life, including J1 as Wei Xian. The types of electronic devices have changed a lot recently. They have a new Wei-type design, especially in the field of portable electronic products such as notebook computers and mobile phones, such as the spring after the rain. Because the electronic devices that we are exposed to in daily life are becoming more diverse, and their functions are also surprisingly enhanced, the need for a user interface that is intuitive and intuitive to operate is increased. ^ Controlled screen is a kind of input device that can satisfy the above-mentioned f-demanding device and is controlled by T. The touch screen is set to be on the display screen _ to - contact position, and is controlled to be displayed on the electronic device by using the contact position input information. 1 is a prior art 4-wire resistive touch screen. The 4-ray resistance type touch screen of the transparent guide thief, as shown in FIG. 1 201120727, includes a lower substrate 10, a structure on which a (four) pole 2 is formed, a transparent conductive film 5 〇, and a dot spacer 6G ( Dotp please), the upper substrate 3G structure is formed with a transparent conductive film 50 and an electrode 20, and a double-sided tape is disposed to fit the upper substrate structure and the lower substrate structure. Therefore, the 4-wire electric ray-control screen can be The signal is input from the outside to the upper substrate structure and the lower substrate structure, and the signal is outputted from the upper substrate structure and the lower substrate structure to the outside. In the case where the touch input is input on the upper substrate 3G, the identification position of the touch input is a mechanical contact between the transparent conductive films of the upper/lower substrates 30, 10, wherein the contact points at the opposite substrate are formed. The potentials of the χ姊Y axis are discerned to indirectly identify the position based on the potential energy value. Referring to FIG. 2(8)', in the case where the upper/lower end portion 10 of the transparent conductive film having a predetermined resistance value is used to generate the electrode 4 () and the upper/lower electrode 4 is applied with a predetermined voltage, γ The axial direction potential energy is formed by forming a -γ-axis direction 45 line 45 on a transparent conductive film 1G (which is a measurement of a Y coordinate at the upper/lower substrate contact point, which is transmitted through an opposite substrate (opposite substrate). The transparent conductive 貘1〇 is measured by the touch pressure to measure and recognize the Y-direction potential energy value. As shown in Fig. 2(b): χ Axis position This measurement is performed by #—condition τ, application— The predetermined voltage is formed on the transparent conductive film 1 在 when the directional electrode is formed across the symmetrically formed left/right end portion of the transparent thief 10 having a predetermined resistance value. The X-axis direction equipotential line 45 is formed on the transparent conductive film 1 。. The measurement of the lower substrate surface 阙-χ coordinate identification 201120727 and the identification is performed by means of the touch pressure by the transparent conductive film having the readout value of the X-energy test value. Due to the simple structure, the above 4-wire resistance _Touch screen by using screen printing method (screenprimmethod) The electrode is formed. However, Wei, which is equipped with a touch screen and stabilized by the tf device, has recently become more and more popular, and the demand for multiple control screens is increasing, rather than simply recognizing touch signals. This has also increased the demand for resistive touch screens driven by detecting multi-touch signals. In order to manufacture multi-touch screens, it is unavoidable to add electrodes, especially in multiple levels. In the case of controlling the county to the portable terminal, especially the current trend of the 'screen' edge as the inactive area of the frame size is reduced to J to 3mm. However, due to the limitation of the operation of the traditional wiring pattern, Dali It is difficult to produce a wiring of less than 8 () pm. That is, due to the limitation of forming a conventional cloth printing age (s_n prim pra (10)), a wiring structure having a fine line width and a line spacing is formed. Difficult. In fact, in the case of the traditional screen printing method (silkscreenmeth〇d), the line width and the line spacing are less than 2〇〇μιη, a large number of scales (4) size. Therefore, the removal of the unique to obtain a stable yield, However for the wiring width When it is smaller than Qingm, it is almost impossible to mass produce. As a method to overcome these shortcomings, although the use of photolnhography engineering process has been considered to form wiring, it is still high when making 6 201120727 shadow technology. The disadvantage of forming a micro-resistor of a wiring pattern using a thin metal electrode material. In fact, in a multi-resistance touch screen, an increase of 9 liters is added to the electrode pattern to increase the electrode wiring pattern to rapidly increase the power. 〃 ^ [ SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a side-touch multi-touch resistive touch screen, a surface lithography process and a net brush process - having a fine pattern and significantly reducing wiring The metal wiring pattern of the resistance is provided to provide high resolution. In a consideration of the present invention, a method for manufacturing a resistive touch screen capable of detecting multi-touch is provided, wherein the method includes a metal wiring pattern forming process in which a process is performed on a transparent guide At least one or more cell active areas are formed with a metal wiring pattern, and part of the metal wiring pattern is subjected to a lithography technique, and the rest is applied to the metal wiring pattern to form an indium oxide. Tin (ITO), indium zinc oxide (IZN) or zinc oxide (ZnO) turn over and/or have at least one or more unit active regions. In some examples of this month, the metal wiring pattern forming process is the connection of the single-use region of the near-end portion of the m-slice first wire_group is formed by the micro-passing process. The printing process is formed, or 201120727 is after all the metal wirings are embossed on the transparent guide, except for the @片第- wiring pattern group, the second wiring group is formed by the screen printing process, wherein the whole metal The length of the wiring pattern (five) = m length + η length, Ν, m and η are natural numbers, and ^ is the same as η. In some embodiments of the present invention, the metal wiring pattern forming process may include: forming a metal wiring pattern on the forming-line 'on the transparent conductive film to form a metal wiring pattern' with a towel-metal thin-micro-shadow surface connected thereto a unit active region '· and a second wiring pattern of the plurality of n-pieces of the first wiring pattern group are formed in addition to the plurality of m-pieces of the first wiring pattern group connected to the cell active region near the end portion a wiring pattern in which the length (N) of the entire metal wiring pattern = m length + η length 'N, m, and η are natural numbers, and the claws > η ° are in the present invention, and the micro-hardship can be simplified by The step of applying a photosensitive material to the transparent conductive film, forming a wiring pattern via exposure, development, and _. / In some embodiments of the present invention, the conductive material forming the metal wiring pattern may include any material containing silver, inscription, copper, gold, nickel, palladium (Pd), tin, and australis, or A material of a metaalloy or a ternary alloy. In some embodiments of the invention, the metal wiring pattern line width may be in the range of 80 μm. In the other aspect of the present invention, a resistance-detectable multi-touch resistor is provided. 201120727=2The cap-control screen is formed by forming an upper layer and a 曰σ on a transparent conductive film, and has a micro-age and print (4) The metal wiring pattern formed and connected to the cell=side creep portion is formed in the upper layer and the lower layer: the Γ疋 active regions are perpendicular to each other and the metal wiring pattern is connected over the line width of the active area ωμΐΒ to 80μηι. The flipping of the metal sheet includes the first wiring pattern formed on the upper plate edge plate and close to the end portion, and the second wiring pattern group of the wiring pattern group is excluded, wherein the second wiring pattern group The wiring pattern group is printed on the upper surface of the first wiring pattern group. In some embodiments of the present invention, the metal wiring pattern may include a first wiring pattern group formed on the upper layer and the y layer board, close to the end portion, and a second wiring pattern group after the wiring pattern group is excluded, wherein A plurality of connection pattern units (_eetigen) are formed between the first and second wiring pattern groups. In the embodiments of the present invention, the number of connected cells corresponds to the number of entire wiring patterns. In the present embodiment, the range of the resistance of the first wiring pattern group can be in the range of 200 Ω to the rib's resistance of the second wiring pattern group. According to the present invention, the resistor purchase control screen and the manufacturing method thereof can be implemented by using a lithography process and a screen printing process to implement a metal wire pattern, thereby implementing a micro-case and greatly reducing the resistance and achieving high The resolution is excellent 201120727 points. The technical subject matter to be solved by the present invention is not limited to the above description, and any skilled person skilled in the art can describe other technical problems that are not yet private. Additional advantages, objects, and features of the present invention will be described in part in the following description, which will become apparent to those skilled in the art, or may be apparent from the embodiments of the present invention. Learned. The objectives and advantages of the present invention can be understood from the written description and the structure and drawings pointed out in the specification. It is to be understood that the above description of the invention and the following detailed description, ", and the scope of the invention, and the patents of the present invention are further explained. [Embodiment] An embodiment of the present invention will be described in detail with reference to the accompanying seam. The size or shape of the component may be exaggerated for clarity and convenience. = Named by Ke Yifa, as defined by the definition of the best mode to describe the method, the specific name used in this specification and the scope of the material §) or the use of the word should not be limited to literally Or the general use of cognition, but should be based on her sigma scales. The definition of Lin's name should be based on the content of the entire manual. 201120727 The same component in the figure refers to the _ or the lining component. In order to clarify the construction of the I, _', or the description of the process, it may be omitted, and the unnecessary details are obscured to obscure the present invention. In addition, the degree of "including" is used in the detailed description or in the patent franchise, which is intended to cover all translations, similar to "including" - the way in which a word is used as a transition term when applying for a patent. The terms "-", "second" and similar terms do not imply any order, quality, or importance, but rather use _ points, and the "one" here does not represent a limitation of quantity. It represents at least the reference project. When forming a metal wiring that can be used in a high-density metal wiring, the metal wiring is made in a metal wiring with a high density of metal wiring. The cloth _ low (four) copies use the screen printing to make the lion into metal wiring, fine-finished _ and reduce the resistance. Referring to Figures 3, 4 and 5, Figure 3 shows the structure of a transparent conductive film on the top of the touch screen. Figure 4 conceptually shows the conductive-metal wiring structure, and Figure 5 shows the λ layer of the Buchko County. The structure of the electric film. A multi-touch resistive touch screen, such as a riding display, usually includes a combination of a top layer and a lower layer, and a metal wiring pattern is formed on the transparent conductive film. As shown in Figures 3 and 4, the multi-touch resistive touch screen is detected in multiple active areas (4), 11 201120727 ..Cn) of multiple units (after this, C2 external contact (touch) Early 70 gamma "Di", which is caused by one, I 啁) to change the resistance value to a touch signal = 疋 疋 'connected to each unit to rely on the metal cloth, axis case collection (P, 11G) 'The end portions are sequentially connected to the configuration". The board measures the circuit unit whose connection signal value is changed. Each cell is formed with two metal wiring patterns, (4), and the fourth is turned over. The outer portion is 110 at the end portion of the county. The length of the metal cloth and the line 130 at the far end of the end portion 110 is naturally added: The length of the metal wiring (10) which is close to the end portion 11G is naturally shortened, and the metal wirings which are sequentially gathered to increase the density of the metal wiring, as shown by the concentrated metal wiring 120. The burdock is. φ is the number of η in the unit, and is closest to the end part no material ((1) the total number of the two women's jinle lines should be 2n, and the unit action area (Cn) farthest from the end part 110 is left and right. The total number of side-aggregated metal wirings should be 2. The increase in the number of metal wirings reveals the limitations of manufacturing and manufacturing engineering, especially the realization of fineness of the electrode with an electrode width of less than 8 (^m is very embarrassing. Furthermore, the metal wiring (electrode) is lengthened. Under the circumstance, the resistance will inevitably increase, resulting in a shortage of multi-touch screens that require very low resistance physical properties. 12 201120727 This physical property is also applied to the pattern structure formed by the transparent conductive film of the lower layer. The transparent layer of the lower layer is arranged in a manner that the unit action area of the red layer is perpendicular to the unit active area (D1, 〇2, D3, ..., D1), wherein the per-metal cloth _ end portion is concentrated The increase in metal wiring _ density results in the implementation of fine reversal, the electrode resistance in the farther end of the material is increased. The electrode resistance is another disadvantage. Figure 6 shows the wiring resistance of the metal wiring in Figure 4 'more careful Say Figure 6 shows the data of the electrode resistance measured in the upper/t layer and the oxidized contact (ΠΌ). Suppose that a total of 24 metal wirings are arranged in a total of 12 left and right sides, and each wiring from the outermost to the right end is -x Name and measure the wiring resistance of the metal wiring. More carefully, the resistance values of the two electrodes in the padunit display (wiring + indium tin oxide + wiring) resistance, as shown in the figure, due to oxidation The high resistance of indium tin makes this value higher. This shows that when the wiring resistance is within 200~1_Ω, it is difficult to implement a wiring resistance of less than 100Ω for a multi-resistive film even if the resistance of the oxidation is neglected. This disadvantage can be overcome by the steps suggested in Fig. 7. That is, when the metal wiring pattern of the upper or lower plate-shaped conductive film is formed, a region farther from the end portion is formed by the lithography method. First Embodiment> 13 201120727 > 7, 8, and 9' According to the present invention, a method of forming a metal wiring is to form a metal thin film layer for a wiring pattern on a transparent conductive film (S1, S2). Then 'metal film Applying a photosensitive material (ie, DFR), and forming a first decorative line pattern through exposure, development, and paste processes (5), (4). The portion where the first wiring pattern has been formed may be limited to the end portion (P region) and close to And a portion (Q region) facing the end portion. Then, the screen P is used to brush the private region - the region farther from the end portion (p region) 15 〇, and is connected to the first wiring pattern (S5) The length of all the wiring patterns is N 'the total number of wiring patterns and the n number of wiring patterns make the (10) printing process become the first wiring pattern and the second wiring pattern (N, m, and η are natural) Number, and slightly, m length + n length, and m and n values can be adjusted according to manufacturing conditions and product specifications). For example, if Ν = 12, the first to sixth metal wiring electrodes ' near the end portions can be formed by the lithography process, and the seventh to twelfth metal wirings formed farther away can be formed using the screen printing process. The screen printing process is to apply an Ag paste to the seventh to the first metal wiring electrodes so that the electric resistance is in the range of less than 1 Torr to 3 Ω, and the metal wiring resistance near the end portion affects the wiring resistance. The metal formed by the lithography process in the vicinity of the end portion can be reduced in length to half the conventional length, and the electric steepness is less than 200 to lkQ. 14 201120727 ° month Referring to FIG. 9 'The wiring concentration portion 14G (the first wiring pattern) A by the lithography process is the region (9) of the near end portion (p), and the unit action region at the end portion of the flaw portion The metal wiring (second wiring pattern) of the (R region) is realized by a screen printing process. In this case, the first and second wiring patterns can be connected to the number of connection pattern units (7) which can be up to the total number of wirings. <Second Embodiment> An embodiment different from the above manufacturing method will be described below. First, at the time of forming the first wiring pattern, a metal thin film is formed for forming wirings over the entire area of the transparent conductive film, and metal wiring is formed in the entire area via exposure, development, and a residual process. Next, a second wiring pattern is formed on the upper surface of the first wiring pattern in a region where the second wiring pattern is formed by a screen printing process. That is, the upper surface of the first wiring pattern is covered with a metal material using a screen printing process to form a second wiring pattern. In this case, the region of the second wiring pattern has a two-layer structure formed under the first wiring pattern. It is assumed that the total number of metal wiring patterns is N, the number of second line patterns is η, and the number of second wiring patterns opened by the screen printing to cover the upper surface of the first wiring pattern is η ' although The respective numbers are the same, and the total length (Ν) of the eight wirings is the same as the value of the length of both the exposed wiring pattern and the second wiring pattern. 15 201120727 Even in this example, a border between a region of the second wiring pattern and a region of the first wiring pattern is defined as a connection pattern unit (J), and the first wiring pattern and the second The wiring pattern is formed by a laminated structure. In either case, the metal wiring pattern in the present invention, the conductive material forming the metal wiring pattern is any material including silver, sho, copper, gold, nickel, palladium, tin, and the like or using two of the above metals A material of a metaalloy or a ternary alloy. Further, the transparent conductive film may be formed of any one of indium tin oxide (IT〇), indium zinc oxide (KN) or zinc oxide (ZnO), and the width of the metal wiring pattern is in the range of 10 to 80 μm. That is, according to the present invention, the lithography and screen printing processes can be simultaneously applied to form metal wirings, for example, a metal wiring which can increase the manufacturing efficiency of the fine and fine patterns and prevent the reliability from being lowered by the electric resistance. At the same time, it is used to form a transparent wiring metal wiring pattern (4) upper and lower boards. That is, by the lithography and screen printing process, the upper and lower plates with the metal wiring pattern and connected to the edge of the cell active region are formed on the transparent conductive film, and in this case, in the upper layer The unit active regions formed by the plate/lower layer are formed at right angles to form a fine pattern in which the metal wiring pattern connected to both ends of the single-use region has a line width of less than 10 to 80 μm. The invention disclosed in this application is to be considered in all respects as illustrative and not restrictive. Those skilled in the art should be able to make changes to the actual 16 201120727 embodiment without departing from the scope of the rights as defined in the patent application. The invention of the present invention is as claimed in the above-mentioned specification, and the above description, and the correction or change in the case of the inclusion of the red (four) material. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in FIG. In the figures: Figures 1 and 2 show conceptual diagrams of a resistive touch screen structure capable of detecting multi-touch according to the prior art; Figures 3 to 6 show resistive multi-touch detection according to the present invention. A conceptual diagram of a touch screen configuration and a method of fabricating the same; and FIGS. 7-9 show conceptual diagrams of the main components of the resistive touch screen that can detect multi-touch according to the present invention and processes thereof. 17 201120727 [Description of main component symbols] 10 20 30 40 45 50 60 110 120 130 140 210
Cl，C2,C3,C4...Cn D1,D2, D3,D4. . . Dn J PCl, C2, C3, C4...Cn D1, D2, D3, D4. . . Dn J P
QQ
R 51 〜S5 下基板 電極 上基板 電極 Y軸方向等位線 透明導電膜 點間隔物 末端部份 金屬佈線 金屬佈線 佈線集中部份 末端部份 單元作用區 單元作用區 連接圖案單元 末端部份 末端部份附近部份 距離末端部份遠處的部份 步驟 18R 51 to S5 lower substrate electrode substrate electrode Y-axis direction equipotential line transparent conductive film dot spacer end portion metal wiring metal wiring wiring concentrated portion end portion unit action region unit action region connection pattern unit end portion end portion Part of the vicinity of the part far from the end part of the step 18