JP4006163B2 - Touch panel - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resistive film type touch panel having a transparent conductive film and a manufacturing method thereof, and more particularly to a technique for forming a conductive film pattern on a touch panel substrate.
[0002]
[Prior art]
A resistive film type touch panel, for example, forms a transparent conductive film pattern on each facing surface of both substrates of ultra-thin glass (lower side member) and a flexible transparent resin film (upper side member). At the same time, both planar members are arranged to face each other at regular intervals with a spacer interposed therebetween.
[0003]
A conventional method of pattern formation (hereinafter referred to as “patterning”) of a transparent conductive film formed on such a substrate will be described with reference to FIGS.
First, the conductive film 501 is formed on the surface of the substrate 500. As the conductive film, ITO (indium tin oxide) is generally formed by sputtering.
[0004]
Thereafter, a mask 502 is formed where it is desired to leave as a pattern by a photoresist method or a screen printing method, and a portion other than the mask 502 (portion other than the hatched portion in FIG. 11A) is formed using an acidic etching solution. The conductive film is removed. Then, the mask is dissolved and removed with an alkaline stripping solution, and conductive ink such as silver paste is screen-printed to form a pair of electrodes 503 and lead portions 504 and 505.
[0005]
[Problems to be solved by the invention]
However, the conventional patterning method has the following problems.
That is, there is a problem that the surface of the conductive film is eroded or soiled due to the influence of the stripping solution when the mask is removed, or the transparency is deteriorated due to scratches.
[0006]
In addition, there are environmental problems in terms of management and handling of the etching solution, and further, processing of the etching waste solution. In addition, ITO film is often formed by sputtering, but it is conductive depending on whether the power source for sputtering is AC or DC, or depending on sputtering power, gas pressure, gas type, film temperature, target condition, etc. There is also a problem that the properties of the film are easily changed and it is difficult to set etching conditions. Further, with respect to the conductive film whose crystallinity has been increased in order to increase the resistance to frictional scratches, there is a problem that the etching is not sufficiently performed and a pattern defect occurs.
[0007]
The present invention has been made in view of the above problems, and removes various adverse effects due to the etching process, and the touch panel patterned without causing deterioration of the transparency or durability of the conductive film and its touch panel An object is to provide a manufacturing method.
[0008]
[Means for Solving the Problems]
In order to solve the above-described problems, the touch panel according to the present invention includes a first conductive sheet and a second planar member arranged at regular intervals, and a transparent conductive film pattern formed on the opposing surfaces of both members. In the touch panel, the conductive film pattern in at least one of the first and second planar members is such that the conductive film formed on almost the entire surface of the planar member is formed by a linear peeling portion. It is divided into a planar pattern portion for detecting the pressed position and a wiring pattern portion for energizing the planar pattern portion from the outside. In addition, a linear peeling portion is formed along at least a part of the peripheral portion, and the planar pattern portion and the wiring pattern portion are electrically insulated from the peripheral portion. It is characterized by that.
[0009]
In the touch panel according to the present invention, a conductive ink layer is formed on the surface of the wiring pattern portion along the pattern.
Furthermore, in the touch panel according to the present invention, the first planar member is a glass plate, and the conductive film formed on one surface thereof is a tin oxide film or a metal film containing tin. To do.
[0010]
Furthermore, in the touch panel according to the present invention, the conductive film is formed by laminating a plurality of thin films, among which a first metal layer, an insulating layer, and a second metal layer are formed in this order. It is characterized by including.
[0011]
Furthermore, in the touch panel according to the present invention, the linear peeling portion in the conductive film is formed by irradiating a laser to physically remove the corresponding conductive film. .
In addition, the present invention provides a first step of forming a transparent conductive film pattern on each of the opposing surfaces of the first planar member and the second planar member, and the first and first conductive layer formed thereon. In the method for manufacturing a touch panel, the method includes: a second step of forming electrodes on the two planar members; and a third step of bonding the first and second planar members through a spacer member. The step includes forming a conductive film on substantially one surface of at least one of the first and second planar members, and linearly irradiating a part of the conductive film with laser irradiation. Peeling and partitioning into a planar pattern part for detecting the pressed position and a wiring pattern part for energizing the planar pattern part from the outside At the same time, the conductive film is linearly peeled along at least a part of the peripheral portion thereof, and processed so that the planar pattern portion and the wiring pattern portion are electrically insulated from the peripheral portion. And a pattern creating step.
[0012]
Here, it is preferable that a YAG laser is used for peeling of the conductive film in the pattern forming step.
[0013]
[Embodiment]
Hereinafter, embodiments of the touch panel of the present invention will be described with reference to the drawings.
(Overall configuration of touch panel)
FIG. 1 is a perspective view of a touch panel according to the present embodiment.
[0014]
As shown in the figure, the touch panel 100 is configured by laminating an upper side surface member 110 and a lower side surface member 130 via a spacer 140.
The upper side surface member 110 is a transparent and flexible surface member on the touch panel 100 that receives an input from the operator using a finger or an input pen, and is mainly a resin film such as polyethylene terephthalate (PET). The thickness is set to about 20 μm to 500 μm.
[0015]
The lower side surface member 130 is formed of a glass plate having a thickness of about 1 mm. A conductive film pattern made of ITO (indium tin oxide) is formed on the opposing surfaces of the upper side member 110 and the lower side member 130 by a method described later, and the connector portion. A current for detecting the pressed position is supplied to the conductive film from an external controller via 120.
[0016]
FIG. 2 is an exploded view of the touch panel 100 of FIG.
As shown in the figure, the spacer 140 is formed in a continuous frame shape except for the part where the connector part 120 is mounted and the cutout part 141 on the opposite side of the connector part. Etc. are used. An adhesive is applied to both surfaces of the spacer 140, and the upper side surface member 110 and the lower side surface member 130 are adhered to the periphery thereof. In the excision part 141, since no spacer member is interposed, a gap is formed between the upper side surface member 110 and the lower side surface member 130. This acts as an internal air vent hole.
[0017]
In the gap between the upper side member 110 and the lower side member 130 inside the spacer 140, dot-like spacers 160 are provided at predetermined intervals, and in cooperation with the frame-like spacer 140, The distance between the opposing surfaces of the upper and lower surface members 110 and 130 is maintained approximately uniformly at about 100 μm.
A pattern of the conductive film 131 is formed on the main surface on the side facing the upper side member 110 of the lower side member 130 (see FIG. 3. In FIG. 2, illustration of the pattern is omitted for simplification. Yes.) A pair of electrodes 132 and 132 are formed on the two opposite sides of the conductive film 131, and the remaining region of the main surface is connected to the pair of connection electrodes 123 and 123 on the connector part 120 side. A pair of electrode end portions 134 and 134 are formed, and wiring patterns 133 and 135 connecting the electrode end portions 134 and 134 to the electrodes 132 and 132 provided on the two sides of the conductive film 131 are formed. . Similarly to the lower side member 130, the electrode end connected to the pattern of the conductive film 111 and the connection electrode 122 of the connector part 120 is also provided on the main surface facing the lower side member 130 of the upper side member 110. 114 and the like are formed. The conductive film pattern of the upper side member 110 and the lower side member 130 will be described in detail later.
[0018]
The connector portion 120 is one end portion of a connection cable 190 formed by sandwiching four flexible wires 129 made of silver with a material such as PET film or polyimide. The connection electrodes 122, 122, 123, 123 connected to the electrode end portions 114, 114, 134, 134 are exposed on the upper and lower surfaces, and the terminal ends of the flexible wires 129 are connected to the connection electrodes 122, 122, 123, 123. It has become the composition.
[0019]
The reason why the four flexible wires and the four connection electrodes are collected in one connector portion without being divided is to reduce costs in terms of both material costs and man-hours.
In the assembled state of the touch panel, the upper connection electrodes 122 and 122 are bonded to the upper electrode ends 114 and 114, and the lower connection electrodes 123 and 123 are bonded to the lower electrode ends 134 and 134, respectively. Adhesion of this part is performed by attaching a conductive paste obtained by kneading carbon to silver, which is a common material of each extraction part, and then thermocompression bonding from both sides.
[0020]
In addition, a notch 121 is provided between the upper and lower connection electrodes 122 and 123 of the connector portion 120, thereby eliminating the stress caused by the difference in expansion coefficient between the upper and lower planar members 110 and 130. That is, when expansion of the planar member occurs due to temperature rise, expansion occurs in the two upper and lower planar members. By providing this notch 121, thermal expansion between the upper lateral member 110 and the lower lateral member 130 occurs. It is possible to absorb the stress acting on the connector part 120 based on the difference in amount, and even if used in a wide temperature range, it is possible to obtain an effect that it is difficult to cause contact failure or disconnection in this part.
[0021]
(Method for patterning conductive film)
3A and 3B are views showing a process of forming a pattern of the conductive film 131 on the lower surface member 130 of the touch panel 100 and forming an electrode or the like thereon.
First, the conductive film 131 made of ITO is uniformly formed on the surface of the glass sheet to be the lower side member 130 by sputtering. After that, the conductive film 131 is irradiated with laser, and a part of the conductive film is linearly peeled to form insulating portions 1311 to 1314 (FIG. 3A).
[0022]
Next, conductive ink (silver paste) is printed as shown in FIG. 3B by a pattern printing method to form a pair of electrodes 132 and 132 and wiring patterns 133 and 135 from each electrode 132.
The same applies to the case where the conductive film pattern is formed on the upper side surface member 110. As shown in FIG. 4A, first, the conductive film 111 is uniformly formed on the surface of the upper side surface member 110 by sputtering. After that, the conductive film 111 is irradiated with a laser so that a part of the conductive film 111 is linearly peeled to form the insulating portions 1101 to 1103. Next, conductive ink is printed as shown in FIG. 4B by a pattern printing method to form a pair of electrodes 112 and 112 and wiring patterns 113 and 115 from each electrode 112.
[0023]
FIG. 5 is a diagram illustrating an example of a laser processing apparatus 200 for forming the linear insulating portion. The inside of the processing table 210 is hollow, and a plurality of suction holes 211 are provided on the upper surface thereof, and the processing film is sucked and held by lowering the internal pressure by a suction device (not shown). The processing table 210 can be moved in the X direction and the Y direction by a drive mechanism (not shown), and a laser head 221 is held by the laser main body 220 via the arm 222 above the processing table 210.
[0024]
The arm 222 is movable in the Z direction by the rail 223 of the laser main body 220 and is driven in the vertical direction by an internal driving mechanism, thereby adjusting the machining position of the laser in the Z direction.
When patterning the conductive film 131 of the lower side surface member 130, a glass sheet is placed on the processing table 210, and is sucked and held so as not to be displaced, and the laser head 221 is lowered to a predetermined height. Then, while moving the processing table 210 in the XY direction, a laser is irradiated from the laser head 221 to form a linear insulating portion.
[0025]
The laser processing apparatus is not limited to such a configuration, and only the laser head may be movable in the X, Y, and Z directions while the processing table remains fixed.
FIG. 6 is a diagram schematically showing a state in which the insulating portion 1313 is formed by physically peeling the conductive film 131 on the lower side surface member 130 with a laser beam. When the surface of the conductive film 131 is irradiated with laser, the conductive film 131 is sublimated or scattered by the energy and removed. Here, instead of continuously emitting laser light and irradiating it, the processing table 210 was moved in the direction of the arrow while being intermittently driven and irradiated with laser pulse light. A linear insulating portion is formed so that the spots overlap.
[0026]
By intermittently driving the laser in this way, desired processing can be realized with lower power than when continuous light emission is performed. A YAG laser or carbonic acid laser can be used as the laser device. However, when the resin film is a base material, a YAG laser that has little damage due to heat to the film and has a stable output is used. Is desirable.
[0027]
(Experimental example 1)
In this experiment, a conductive film pattern was processed using a YAG laser device. The oscillation wavelength of the YAG laser was 1.064 μm near-infrared light, and was used in combination with an optical system having a diameter of 0.45 mm when the beam was most condensed (beam waist).
[0028]
A PET film having a thickness of 188 μm was used as the film substrate, and an ITO film having a sheet resistance of 300Ω / □ was formed on the film by sputtering. The patterning processing conditions were set such that the laser oscillation output was 23 W, the laser oscillation pulse frequency was 3 KHz, and the table moving speed was 1026 mm / S.
The amount of movement of one pitch per pulse of the laser is calculated from the table moving speed and the laser oscillation pulse frequency, and is about 0.342 mm. When the linear separation part was formed with the table moving distance of 30 cm, the wide irradiation width range was 0.45 mm to 0.41 mm, and the narrow irradiation width range was 0.32 mm to 0.28 mm. The conductive film was continuously peeled in the range. In terms of appearance, there were no bulges or depressions exceeding 1 μm due to the melting of the underlying film, and there were no microcracks (microcracks) in the conductive film. Electrically, the insulation resistance when DC 25 V was applied was 100 MΩ or more. Even after 120 hours had passed at a temperature of 60 ° C. and a humidity of 90%, both the appearance and insulation resistance did not change and were good.
[0029]
(Experimental example 2)
As a film substrate, an Arton film made by JRS (“Arton” is a registered trademark of the company) made of a non-bornene thermoplastic transparent resin with a thickness of 188 μm is used, and ITO having a sheet resistance of 300Ω / □ is formed on the surface by sputtering. A film was formed. An experiment was performed under exactly the same conditions as in Experimental Example 1 except that the laser oscillation output was set to 34 W. As a result, good results were obtained as in Experimental Example 1.
[0030]
(Experimental example 3)
As a film substrate, a PET film having a thickness of 188 μm and an uneven surface with an average roughness of 2 μm at the maximum was used, and an ITO film having a sheet resistance of 300Ω / □ was formed on the surface of the uneven surface by sputtering. Except for setting the laser oscillation output to 34 W, an experiment was performed under exactly the same conditions as in Experimental Example 1. As a result, good results were obtained as in Experimental Example 1.
[0031]
However, when laser processing was performed with the laser oscillation output of 24 W, which was the same as in Experimental Example 1, the conductive film was removed in a thin line shape, but the portion that was not completely peeled remained and there was a problem in insulation. Thus, even if the same PET film is used as a base material, it is necessary to adjust the processing conditions depending on the surface state.
In addition, when the film is formed on the uneven surface as described above, the surface of the ITO film is also roughened, thereby obtaining the effect that Newton's ring can be prevented from occurring. That is, when the surface of a normal touch panel is pressed, the distance between the conductive films 111 and 131 around the pressing portion also changes, and thus light reflected from the respective surfaces of the conductive films 111 and 131 among the incident light from the outside. Interfere with each other to generate a so-called Newton ring, making the screen very difficult to see. However, when unevenness is formed on the surface of the conductive film 111 and becomes rough as described above, light incident on the surface of the conductive film is irregularly reflected, so that there is almost no interference with the reflected light on the surface of the conductive film 131, and the Newton ring. Can be effectively prevented.
[0032]
(Experimental example 4)
A glass plate having a thickness of 1100 μm was used as the base material of the conductive film, an ITO film was formed on the surface thereof, and processed under the same conditions as in Experimental Example 1. However, the laser oscillation output was 160 W, and the laser oscillation pulse frequency was 4 KHz. Thereby, the linear peeling part excellent in insulation was able to be formed.
[0033]
In an actual production process, in order to increase production efficiency, a method is used in which a plurality of patterns are formed on a substrate (resin film or glass) having a large size and then cut into a predetermined size for use.
FIG. 7 is a diagram showing a patterning process to the glass sheet for the lower side surface member 130 placed on the processing table 210, and the insulating portions 1311 to 1314 are provided at predetermined positions of the large-sized glass sheet. After forming by laser processing, it cuts in the position of a broken line, and forms the several lower side surface-shaped member 130. FIG.
[0034]
The reason why the tip portions of 1312, 1313, and 1314 protrude to the left work part is to compensate for errors in the machining position, by removing the conductive film slightly beyond the intended cutting position. This is to ensure insulation at this portion. The upper side surface member 110 is similarly processed.
<Modification>
Needless to say, the content of the present invention is not limited to the above embodiment, and the following modifications can be considered.
[0035]
(1) When the touch panel is mounted on another display device or the like via a metal frame, the conductive film is exposed at the end in the patterning in the above embodiment. There is a possibility that the conductive films of 110 and the lower side surface member 130 may be short-circuited.
In order to avoid such a situation, with respect to the pattern of at least one conductive film of the upper and lower planar members, the central pressing position detection part or the wiring pattern part and the peripheral edge part thereof are electrically insulated. It is better to be.
[0036]
FIG. 8A shows an example of the pattern of the lower side surface member 130 in such a case.
In addition to the example of FIG. 3, linear insulating portions 1315, 1316, and 1317 are provided along the three sides, and electrodes 132 and 132 and wiring patterns 133 and 135 are formed on the conductive insulating ink. FIG. 8B).
[0037]
As a result, the central area A1 and the wiring pattern for detecting the pressed position are electrically insulated from the peripheral areas A2 to A4, and the above-described short circuit problem does not occur. In the case of the upper side surface member 110, patterning can be performed in the same manner.
In addition, it is not necessary to provide an insulation part over the whole length along each side, and you may make it provide only in the place which may produce a short circuit at the time of apparatus attachment.
[0038]
(2) In the said embodiment, the example of the patterning in the touch panel of the 4 electrode system which provided two electrodes in each of the upper side surface member 110 and the lower side surface member 130 was shown.
The shape of these patterns can be changed at any time according to the number of electrodes, the position of the connector portion, and the like. As an example of this, an 8-electrode touch panel that has two auxiliary electrodes for calibration on each of the upper and lower planar members, separately from the main electrode, is provided for correcting resistance changes with time of the conductive film. The example of the patterning in a case is shown.
[0039]
The calibration method using the 8-electrode method is disclosed in detail in Japanese Patent Application Laid-Open No. 7-56673, which is filed by the present applicant, and will not be described here.
FIG. 9A shows an example of patterning of the lower side surface member 130 in the 8-electrode touch panel. Compared with the case of FIG. 8A, insulating portions 1318 and 1319 are formed between the linear insulating portions 1311 and 1312 and between the insulating portions 1313 and 1314, respectively, as shown in FIG. 9B. By screen-printing the conductive ink, auxiliary electrodes 1321 and 1322 and a wiring pattern integrated with the auxiliary electrodes 1321 and 1322 are newly formed in addition to the above-described electrode 132 and the like.
[0040]
FIG. 10A shows an example of patterning of the upper side member 110 combined with the lower side member 130 of FIG. 9B. Note that the size of the upper side surface member 110 is designed to be slightly smaller than the size of the lower side surface member 130 mainly for the purpose of saving material costs. In this embodiment, only the lower side surface member 130 is likely to be short-circuited. Therefore, in the present embodiment, the upper side surface member 110 is insulated from the peripheral portion like the lower side surface member 130. ˜1317 is not provided. Of course, in the event of an emergency, the upper side surface member 110 may also be provided with a linear insulating portion for insulating the peripheral portion from the internal pattern.
[0041]
Compared to the case of FIG. 4, 1104 and 1105 are added between the linear insulating portions 1105 and 1102, and conductive ink is screen-printed as shown in FIG. In addition, the auxiliary electrodes 1121 and 1122 and a wiring pattern integrated with the auxiliary electrodes 1121 and 1122 are newly formed.
(3) In addition to the above PET film, the upper side member 110 is made of polyimide (PI), polyethersulfone (PES), polyetheretherketone (PEEK), polycarbonate (PC), polypropylene (PP), A film made of polyamide (PA), polyacrylic (PAC), norbornene-based thermoplastic transparent resin, or a laminate of these films is used.
[0042]
In the case of laminates, the visibility of the screen and anti-glare properties (to prevent external light from being reflected on the surface of the touch panel or the inner layer part and glaring) by interposing a deflecting film layer are improved. Can be made. Similarly, in order to obtain anti-glare properties, a hard coat layer that is non-glare processed may be provided on the surface of the upper side surface member 110. As a result, not only antiglare properties but also abrasion resistance and scratch resistance can be increased.
[0043]
In addition, an acrylic resin coating is provided between the conductive film and the resin film on the surface of the upper side member 110 on which the conductive film is provided in order to prevent deterioration of the resin film due to generation of oligomers due to heat during laser processing. A layer may be provided.
(4) The conductive film forming material is not limited to the ITO film. For example, a tin oxide film, copper, aluminum, nickel, chromium, etc. can be considered. As described above, according to the present invention, since a wet etching method is not used as in the prior art, a simple metal that is weak against acid or alkali can be used as a conductive film. In addition, a tin oxide film or a metal film containing tin is mainly used on a glass substrate and has not been conventionally used because it is difficult to perform an etching process despite being excellent in transparency. It became possible to use by the patterning method.
[0044]
The conductive film is not limited to a single layer, and may have a multilayer structure. For example, a first metal layer, an insulating layer, and a second metal layer are formed on a base material, and the second metal layer is a conductive film. You may make it act as. Here, the first and second metals are selected from the metals described above, and a silicon oxide thin film is selected as the insulating layer.
It is known that by laminating such different types of thin films, the reflected light is reduced due to the difference in refractive index of each layer, and high transparency can be obtained. Moreover, it can be set as the structure which is hard to peel as the whole electrically conductive film by selecting a material with high adhesiveness with a base material as a 1st thin film.
[0045]
Furthermore, the method for forming the transparent conductive film is not limited to the above-described sputtering method, and depending on the type of the conductive film to be formed, other PVD methods such as a vacuum deposition method and an ion plating method, or a CVD method, A method such as a coating method or a printing method is appropriately selected.
In addition, if the surface of the base material is subjected to a coating treatment with an acrylic resin, it is possible to obtain an effect that a conductive film can be easily formed on the surface of the base material and is not easily peeled off.
[0046]
(5) In the above embodiment, laser processing has been shown as an example of a method for stripping the conductive film in patterning. However, for example, the processing is not so sharp as to cut the resin film as the base material. It can also be realized by a method in which an appropriate metal tip is directly applied to the surface of the conductive film with an appropriate pressing force and the conductive film in that portion is cut off.
[0047]
(6) In the above embodiment, the lower side surface member is formed of a glass plate. However, a resin film such as a PET film is bonded to the surface of the other plastic plate as a support, and the above resin film is placed on the resin film. A conductive film pattern may be formed. By doing this, a touch panel that is lightweight and difficult to break can be formed, which is particularly advantageous when it is mounted on a portable device.
[0048]
【The invention's effect】
As is clear from the above description, the touch panel according to the present invention has a conductive film pattern on at least one of the first and second planar members arranged so as to be substantially the same as one surface of the planar member. The conductive film formed on the entire surface is divided by a linear peeling portion into a planar pattern portion for detecting a pressed position and a wiring pattern portion for energizing the planar pattern portion from the outside. . Since the linear peeling portion can be easily formed by physically removing the conductive film by laser light irradiation, no complicated process or condition setting in the conventional etching process is required, and the waste liquid There is no problem.
[0049]
In addition, this greatly simplifies the patterning process, contributes to the efficiency and cost reduction of touch panel production, and lowers the durability and transparency of the conductive film that has been generated mainly in the mask peeling process in the conventional etching process. It is possible to provide an excellent touch panel that does not cause any deterioration in performance.
[Brief description of the drawings]
FIG. 1 is a perspective view of a touch panel according to an embodiment of the present invention.
FIG. 2 is an exploded view showing a structure of the touch panel.
FIG. 3 is a view showing an example of a conductive film pattern on a lower side surface member of the touch panel and an example in which electrodes and a wiring pattern are formed using a conductive ink.
FIG. 4 is a diagram showing an example of a conductive film pattern on the upper side surface member of the touch panel and an example in which electrodes and a wiring pattern are formed using a conductive ink.
FIG. 5 is a perspective view showing an example of a laser processing apparatus.
FIG. 6 is a partial perspective view showing a state where a conductive film is stripped linearly by laser processing.
FIG. 7 is a diagram showing a laser processing pattern in an actual patterning step.
8 is a diagram showing an example of a pattern in which a linear insulating portion is further formed along the peripheral edge in the conductive film pattern of the lower side surface member in FIG. 3; FIG.
FIG. 9 is a diagram showing an example of a conductive film pattern on a lower surface member of an 8-electrode touch panel and an example in which electrodes and a wiring pattern are formed using a conductive ink.
FIG. 10 is a diagram showing an example of a conductive film pattern on an upper surface member of an 8-electrode touch panel and an example in which electrodes and a wiring pattern are formed using a conductive ink.
FIG. 11 is a diagram showing an example of a conductive film pattern of a lower side surface member of a conventional touch panel and a state in which electrodes and a wiring pattern are formed using a conductive ink.
[Explanation of symbols]
100 touch panel
110 Upper side surface member
1101-1105, 1311-1319 Insulating part
111 conductive film
112,132 electrodes
1121, 1122, 1321, 1322 Auxiliary electrode
113, 115, 133, 135 Wiring pattern
130 Lower side member
131 conductive film
1315-1317 Insulation part
200 Laser processing equipment

Claims (7)

In the touch panel in which the first and second planar members are opposed to each other at a constant interval, and a transparent conductive film pattern is formed on the opposing surfaces of both members,
The pattern of the conductive film in at least one of the first and second planar members is
The conductive film formed on almost the entire surface of the planar member has a linear pattern for detecting the pressed position and a wiring pattern for externally energizing the planar pattern by a linear peeling portion. Rutotomoni is divided into the door,
A touch panel , wherein a linear peeling portion is formed along at least a part of the peripheral portion, and the planar pattern portion and the wiring pattern portion are electrically insulated from the peripheral portion . The touch panel according to claim 1, wherein a layer of conductive ink is formed on the surface of the wiring pattern portion along the pattern. 3. The touch panel according to claim 1, wherein the first planar member is a glass plate, and the conductive film formed on one surface thereof is a tin oxide film or a metal film containing tin. . The said electrically conductive film is comprised by laminating | stacking a some thin film, The laminated body formed by forming the 1st metal layer, the insulating layer, and the 2nd metal layer in this order among these is characterized by the above-mentioned. 2. The touch panel according to 2. The linear peeling part in the said electrically conductive film is formed by irradiating a laser and removing the electrically conductive part of the applicable part physically, The one in any one of Claim 1 to 4 characterized by the above-mentioned. Touch panel. A first step of forming a transparent conductive film pattern on each of the opposing surfaces of the first planar member and the second planar member; and the first and second planar members on which the conductive film is formed. In a method for manufacturing a touch panel, including a second step of forming an electrode, and a third step of bonding the first and second planar members through a spacer member,
The first step includes
A conductive film forming step of forming a conductive film on almost one surface of at least one of the first and second planar members;
A part of the conductive film is linearly peeled by irradiating a laser, and is divided into a planar pattern part for detecting a pressed position and a wiring pattern part for energizing the planar pattern part from the outside ,
Pattern forming step of peeling the conductive film linearly along at least a part of the peripheral portion thereof, and processing the planar pattern portion and the wiring pattern portion so as to be electrically insulated from the peripheral portion. A manufacturing method of a touch panel characterized by the above. 7. The touch panel manufacturing method according to claim 6 , wherein a YAG laser is used for peeling the conductive film in the pattern creating step.

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