1241514 玖、發明說明： 【發明所屬之技術領域】 本發明是有關於一種觸控板之製造方法，特別是指一 種此製造出低驅動力之觸控板的製造方法。 5 【先前技術】 觸控板是一種人性化的輸入裝置，因為以往鍵盤、滑 氣、執跡球等輸入裝置未能充份滿足使用者的需求，又因現 今電子產品設計皆以輕、薄、短、小為取向，自無法將所有 種類的輸入裝置整合於其中，而觸控板除了符合可作多層次 〇 選單設計要求外，亦能同時擁有鍵盤、滑鼠及手寫輸入等人 性化的#作方式，尤其是具備有將輸入與輸出整合在同一介 面（觸控式螢幕）的特質，更是其他傳統的輸入裝置所不及之 處’故已成為最流行之選擇。 麥閱圖1，觸控板10乃是經由一撓性排線2〇與一控制 5 為3〇相連接，當使用者利用·手指或者觸控筆按壓觸控板1〇 的表面時，受控制器30驅動的觸控板10會在按壓點處產生1241514 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a touch panel, and particularly to a method for manufacturing a touch panel with a low driving force. 5 [Previous technology] The touchpad is a user-friendly input device. In the past, input devices such as keyboards, air slides, and trackballs failed to fully meet user needs. At the same time, current electronic product designs are light and thin. Short, small, and orientation are not able to integrate all kinds of input devices, and the touchpad not only meets the requirements for multi-level menu design, but also has a keyboard, mouse, and handwriting input. #Working method, especially with the characteristics of integrating input and output in the same interface (touch screen), is beyond the reach of other traditional input devices', so it has become the most popular choice. As shown in Figure 1, the touchpad 10 is connected to a control 5 through 30 through a flexible cable 20. When a user presses the surface of the touchpad 10 with a finger or a stylus, the touchpad 10 receives The touchpad 10 driven by the controller 30 will be generated at the pressing point
-層由銦錫氧化物(IT0)所構成 100與基板200間，設置有複 1241514 數個點間隔器（dot spacer)300，用以避免上、下導電層1〇1 、201在觸控板10未按壓使用的狀態下相接觸而導通。為 了保護觸控板1〇起見，在薄膜上方可能會再貼設有一層硬 質保護膜400。 配合圖3與圖4，其中圖3乃是觸控板1〇之俯視示意 圖。在上、下導電層1〇1、2〇1上，會再各自形成有複數相 交錯的電極1〇2、2〇2,這些電極102、202是透過排線2〇 與控制器30相連接，因此會受控制器3〇之驅動而提供一定 的电壓或電流至導電層i〇丨、2〇丨上，其中，上電極i 會 在X方向產生一線性的電壓梯度，下電極2〇2則會沿y方向 產生一線性的電壓梯度，當使用者按壓保護膜時，按壓點附 近的上導電層101會與下導電層201相導接，進而產生電流 或電壓變化值，因此控制器30即能藉此計算出按壓點所在 的（X，y)座標位置。 在上述觸控板10的製造過程中，習知是將薄膜1〇〇與 基板200相貼合後，再進行保護膜4〇〇與薄膜丨〇〇的貼合動 作，部常會產生以下缺點：首先，硬質保護膜400與薄膜 100間常會無法完全密合，故會產生氣泡，造成良率降低。 其次，習知在薄膜100與基板200相貼合後，貼合二者之膠 體會使上、下導電層1〇1、201間維持有一約1〇〇〜2〇〇/zm 之間距’此間距乃關乎使用者按壓觸控板時，使上、下導電 層1 〇 1、2 01相接觸之驅動力大小。 故若能有效地消除保護膜與薄膜間無法完全密合之現 象’就能提高成品的良率，而若能縮短薄膜與基板間的距 1241514 離’則可以降低驅動力 【發明内容】 使得偵測觸控動作更為敏銳 因此，本發明之目的在於提供一種改善習知製程，以 5 p爷低觸控板之驅動力與消除保護膜與薄膜間未能完全密合 之缺點的觸控板製造方法。 本I明針對習知之電阻式觸控板之缺點在製程上予以 改良，其技術特徵為： A)將觸控板之薄膜先以熱處理的方式，除去其㈣之含水 10 並去除其張力’使其於製程中處於相對密度較大之狀態 :此。(^刀與習知製程之最大差異在於··本發明在進行後 、只衣輊凡成後，因該經熱處理過的薄膜於常溫下會吸收 K刀而踡脹’而與其結合之保護膜因未經大量之除濕過 私而不曰再吸收空氣中之水分，故兩者結合在一起後， 15 將因彼此之膨脹程度不一致，而會產生一下凹陷現象， 且該下凹現象可使上、下導電層之間隙縮小，藉以改良 白决觸控板其未經除濕處理，以致間隙過大所造成之高 驅動力等缺威，疋以本發明具有低趨動力及高靈敏度等 特性。 20 B)本U之另-製程改良為：將除水後之薄膜接著與％或 卿訂等材質之保護膜紐結合，其可改善習知製程中， 薄膜舁基板等結合後再行結合該保護膜所導致之不良率 問題，例如.薄膜與基板間會存在一間隙，當結合保護 膜％，其組合加壓過程中，會有應力不均勻之現象，因 此薄膜與保護膜間極易產生氣泡，而嚴重影響製造良率 6 1241514 C)本發明之又一製程改自一 為·薄膜與保護膜之黏合，係選 用黏性較低且流動性佳之狀 材，其所具備之優點在於··當 加力產生時’所產生之庫六 5 應力可猎由該膠材分散掉非正向之 部分，而較不易造成結構蠻 一 傅又形，以及驅動力之不均勻；又 當薄膜與保護膜因极火而T h 火而不均勻膨脹時，流動性較佳之膠 材，能均句分散兩者相互變形不一致所產生之剪内應力， 而可消除或均化剪力方向之作用力，而不會因變形不均句 ia成驅動力各處不等之情形。 10 【實施方式】 有關本1月之月;!述及其他技術内容、特點與功效，在 以下配合茶考圖式之一私/土 ^ K土貫知例的詳細說明中，將可清 楚的明白。 在進订本發明之步驟前，如圖5與圖6所示，需先製 15 備有。又置有一第一導電層u之薄膜⑼响，以及一設置 有第一^電層21之基板2。薄膜1是由聚對苯二甲酸二 構成’基板2之材質則可以是玻璃、塑膠或 者是PET薄膜。 第一導電声 11 a 曰 疋以堵如蒸鑛（evaporation)、滅鍵 (sputtering)等物王里氣相沈積方法將銦錫氧化物（― • )或鋼鋅氧化物（indium-zinc-oxide，IZO)、或銦 錫鋅氧化物（indium-tin / ·」 mtln_Zlnc-〇xide5 ITZO)設置於薄膜 1 之底 面110上同理’基板2之上頂面210上亦設置有一以上述 相同製法之第二導電層21。 20 1241514 配口圖7 ’本發明製造低驅動力電阻式觸控板之方法是 先如步驟701所示，對已設置有第-導電層11之薄膜1進 仃熱處理，以消除該薄膜1之内應力，本實施例中，是在 酿度為8〇C〜150°c之間，對薄膜1與第一導電層11進行 丸、烤即以熱處理（heat treatment)方式去除内應力及水氣， 准此觀度遠低於第一導電層u之熔點，故不會造成第一導 電層11之晶系產生變化。 接著’如步驟702並配合圖8所示，是先將一保護膜3 與完成步驟701之薄膜丨相貼合後再進行其它步驟，此處 與白知先貼合薄膜1、基板2後再貼合保護膜3的製程不同 進而吕之’本步驟是將預先儲存在室溫狀態（〇〇c〜3〇〇c， 2〇〜85RH)下之保護膜3，與步驟701之薄膜1以膠合方式 ，‘合在該薄膜1之非導電面（頂面112)上。 為了減少保護膜3與薄膜i黏合後所產生之氣泡，此 保"蔓膜3之材質是採較薄膜1為軟之材質，例如聚酯 (polyester’ Mylar)或聚石发酸錯（p〇iyCarb〇nate，pc)。特別是保 遵膜3與薄膜1間貼合用之黏膠，應選擇黏性較低且流動 f生it之|材者為佳’其有助於使用者施力於保護膜3上時 ’黏膠所產生的應力可分散掉非正向力之部分，故保護膜3 較不易產生形變。此外，薄膜1表面會經由一道硬化處理 私序’使薄膜1表面免於因為一般施力不當而造成的損傷 〇 由於薄膜1已先經過熱處理，故薄膜1相對於保護膜3 會處在一相對密度較大的狀態，所以當步驟702完成後， 8 1241514 在室溫裱境下，薄膜！因事先經過除濕過程，故其會吸收 水份而膨脹，另-方面，因為保制3因未經熱處^，故 其吸水膨脹能力較小，因爲不對稱膨脹之緣故，使得薄膜工 與保護膜3中間部分略為下凹。 … 5 如步驟703所示，係在第一導電層u或第二導電層幻 上，設置複數個點間隔器（dot spacer)4。該點間隔器4曰乃是 用來避免薄膜1與基板2二者相接合後，第一、第二導電 層11、21在未觸壓使用之狀態下而相接觸。 10 將點間隔器4成形於第一、第二導電層1丨、2ι之間乃 為熟習此技者所能了解之技術，在此不再贅述。 15 20 接著，如步驟704並請參閱圖8、9，在薄膜i其第一 =電層11之邊緣設置-第—電路層13,並在基板2其第二 導電層21之邊緣設置一第二電路層23。電路層ΐ3、μ之 设置是為提供電信.號的傳遞，本實施例中，是以四線式之 觸控板為例，故第-電路層13 ^用來提供χ方向的電壓梯 度，故應在左右兩側各形成有一以銀線印製而成之第一電 極尸1 ’以及連接此兩第-電極131之第一導線132，其中 該第一電極分別舆第一導電層u之左右兩側電性連接 ’同理，第二電路層23是用來提供y方向之電壓梯度，故 應在w後兩側形成有_第二電極23卜以及連接此兩第二電 =231之第—導線232，其中該第二電極231分別與第二導 兒層21之其W後兩側電性連接，上述各電極及導線係分別 數成對對稱方式排列，且各電極分別與各導電層之端 P包性連接’相關電路層之製作係為習知技藝，在此不再 9 1241514 贅述。 需說明的是，若熹盔x治斗、 „许，贫+ 疋為五線式、六線式，甚至八線式之 口又°t，其電極之數目、 u〜μ 酉己置位置將有所不㈤，由於此乃一 5 又且非本發明之重點，故在此不再贅述。 10 ，後’如步驟7。5,將步驟7G2已完成黏合保護膜3之 兵基板2以朦體5相貼合，此處可以使用厚度約在 #之異方性導膠、雙面膠帶’或印刷框卯5〜別 Am)於基板2之第二電路層23上，將薄膜}之第一電路層 =、貼合於黏朦上，使得第一導電層13與第二導電層Μ相 鄰近’由於缚膜1呈下凹狀態，因此第_、第二電極間Η 、23各處的間距並不相同，以中間部分的間距最短 間距最大。 15 在薄膜1與基板2藉由朦體5相黏合後，應加壓加熱（ 約3(TC〜50。〇155秒至18〇秒，使其固化黏著，最後並可 加上一選擇性之步驟’即當觸控板組立完成後，可在溫度 somot下，再進行約1G〜3G分鐘之熱處理烘烤，以 除去保護膜3上之水氣。 20 當然，在薄膜丨與基板2相貼合時，亦需將一繞性排 線6設置於薄膜i與基板2之間，使得薄膜i與基板2相 貼合後，撓性排線6係以等數量對稱方式分別與該等導線 13 2、2 3 2相電性連接，以便於控制器（圖未示）經由此挽性排 線6來供應電壓或電流至第一電極丨3 1、第二電極1上， 以進行使用者觸壓動作的感測。 综合上述，本發明是將薄膜丨進行熱處理以去除内應 10 10 15 20 圖2是一剖視圖，說明該觸控板之結構； 圖3是一俯視示意圖，說明該觸控板之上、下電極 1241514 力與水氣，並先與保護膜3進行貼合後再與基板2相貼合 ’因此在薄膜1與保護膜3相黏合時，可以減少結合後的 氣泡產生’更佳的是，由於在將保護膜3與薄膜1相結合 ’因此經熱處理後之薄膜1，當回到室溫環境下會再次吸收 水氣’藉由薄膜1與保護膜3兩者間不對稱之膨脹而產生 下凹，進而縮短了第一、第二導電層丨丨、2 i間之間隙，降 低了觸控板之驅動力，確實達到本發明之目的。 惟以上所述者’僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1疋一不意圖，說明一觸控板、一控制器，以及一主機 間的關係； 圖4是—示意圖，說明該等上、下電極的相對關係； 圖5是-示意圖’說明一具有一第一導電層之薄膜； 圖6是-示意圖’說明—具有—第二導電層之基板； 圖7是-流程圖，說明本發明低驅動力電阻式觸控板 造方法的步驟； 夂 圖8是一示意圖， 及、 說明以本發明之方法所得 之觸控板；以 圖9是一示意圖，說明一第 電路層與一第二電 路層 11 25 1241514 【圖式之主要元件代表符號說明】 1 薄膜 210 上頂面 2 基板 131 第一 電極 3 保護膜 231 第二 電極 4 點間隔器 132 第一 導線 5 膠體 232 第二 導線 6 排線 13 第一 電路層 11 第一導電層 23 第二 電路層 21 第二導電層 70L· -705 步驟 110 底面 112 頂面 12-The layer is composed of indium tin oxide (IT0) 100 and the substrate 200, and a plurality of 1241514 dot spacers 300 are provided to avoid the upper and lower conductive layers 101 and 201 on the touch panel. 10 It is in contact with each other in a state of being used without being pressed, and is turned on. In order to protect the touch panel 10, a hard protective film 400 may be pasted on the film. In conjunction with FIG. 3 and FIG. 4, FIG. 3 is a schematic top view of the touchpad 10. On the upper and lower conductive layers 101 and 201, a plurality of interleaved electrodes 102 and 202 are formed respectively, and these electrodes 102 and 202 are connected to the controller 30 through a cable 20. Therefore, it will be driven by the controller 30 to provide a certain voltage or current to the conductive layers i〇 丨, 2〇 丨, where the upper electrode i will generate a linear voltage gradient in the X direction, and the lower electrode 20 A linear voltage gradient will be generated along the y direction. When the user presses the protective film, the upper conductive layer 101 near the pressing point will be connected to the lower conductive layer 201, which will generate a current or voltage change value. Therefore, the controller 30 That is, the (X, y) coordinate position at which the pressing point is located can be calculated. In the manufacturing process of the above-mentioned touch panel 10, it is conventionally known that after the thin film 100 is bonded to the substrate 200 and then the protective film 400 and the thin film are bonded together, the following problems often occur in the department: First, the rigid protective film 400 and the thin film 100 often cannot be completely adhered to each other, so air bubbles are generated and the yield is reduced. Secondly, it is known that after the film 100 is adhered to the substrate 200, the colloid of the two will maintain a distance between the upper and lower conductive layers 101 and 201 of about 100 ~ 200 / zm. The pitch is related to the driving force for bringing the upper and lower conductive layers into contact with each other when the user presses the touch panel. Therefore, if the phenomenon of incomplete adhesion between the protective film and the thin film can be effectively eliminated, the yield of the finished product can be improved, and if the distance between the thin film and the substrate can be shortened, the driving force can be reduced. [Content of the Invention] The touch detection action is more sensitive. Therefore, the object of the present invention is to provide a touch pad that improves the conventional manufacturing process and uses the driving force of the 5 p low touch pad and eliminates the defect that the protective film and the film are not fully adhered. Production method. This document addresses the shortcomings of the conventional resistive touch panel in the manufacturing process. Its technical characteristics are: A) The film of the touch panel is first heat-treated to remove the water content 10 and remove its tension. It is in a relatively dense state in the manufacturing process: this. (^ The biggest difference between the knife and the conventional process is that after the present invention is performed, only after the clothing is finished, the heat-treated film will swell by absorbing the K knife at normal temperature, and the protective film combined with it Because a large amount of dehumidification has not been used to privately rather than reabsorb the moisture in the air, after the two are combined together, 15 will cause a depression phenomenon due to the different expansion degrees, and the depression phenomenon can make the upper The gap of the lower conductive layer is narrowed, so that the white driving touch panel is not dehumidified, and the high driving force caused by the gap is too large. Therefore, the invention has the characteristics of low driving force and high sensitivity. 20 B ) Another improvement of this process is to combine the water-removed film with a protective film such as% or green, which can improve the conventional manufacturing process, and then combine the film with the substrate and then combine the protective film. The problem caused by the defective rate, for example, there will be a gap between the film and the substrate. When the protective film is combined, the stress will be uneven during the combined pressing process. Therefore, air bubbles are easily generated between the film and the protective film. and Heavy impact on manufacturing yield 6 1241514 C) Another process of the present invention is changed from the adhesion of thin film and protective film, which uses a low-viscosity and good fluidity material, which has the advantages of ... When the force is generated, the stress caused by Ku 6 5 can be used to disperse the non-positive part by the glue, which is less likely to cause the structure to be superb and shape, and the driving force is uneven; when the film and the protective film are caused When the fire is extremely hot and the T h fires are unevenly expanded, the plastic material with better fluidity can evenly disperse the internal shear stress caused by the mutual deformation and inconsistency, and can eliminate or equalize the force in the direction of the shear force without The driving force may vary depending on the uneven sentence. 10 [Implementation] Regarding the month of January; the other technical content, characteristics and effects are mentioned, and it will be clear in the following detailed description of one of the tea research schemes, private / soil ^ K. understand. Before ordering the steps of the present invention, as shown in FIG. 5 and FIG. A thin film of a first conductive layer u and a substrate 2 provided with a first conductive layer 21 are disposed. The material of the film 1 is made of poly-terephthalic acid 'and the substrate 2 can be glass, plastic or PET film. The first conductive sound 11a refers to indium-tin oxide (― •) or steel zinc oxide (indium-zinc-oxide) by vapor deposition methods such as evaporation and sputtering. (IZO), or indium-tin-zinc oxide (indium-tin / · "mtln_Zlnc-〇xide5 ITZO) is provided on the bottom surface 110 of the film 1 and the same as the 'top surface 210 on the substrate 2 is also provided with a method of the same manufacturing method as above Second conductive layer 21. 20 1241514 Figure 7 'The method of manufacturing a low driving force resistance touch panel according to the present invention is to perform heat treatment on the film 1 provided with the first conductive layer 11 as shown in step 701, so as to eliminate the film 1 Internal stress, in this embodiment, the internal stress and water vapor are removed by heat treatment after the film 1 and the first conductive layer 11 are pelletized and baked at a brewing degree between 80 ° C and 150 ° C. Since this observation is far lower than the melting point of the first conductive layer u, it will not cause the crystal system of the first conductive layer 11 to change. Next, as shown in step 702 and shown in FIG. 8, a protective film 3 is first bonded to the film that has completed step 701 and then other steps are performed. Here, the film 1 and the substrate 2 are bonded with Bai Zhi before bonding. The manufacturing process of the protective film 3 is different, and Lu Zhi's this step is to glue the protective film 3 stored in room temperature (00c ~ 300c, 20 ~ 85RH) in advance, and glue the film 1 in step 701. , 'On the non-conductive surface (top surface 112) of the film 1. In order to reduce the bubbles generated after the protective film 3 is adhered to the film i, the material of the film 3 is made of a material that is softer than the film 1, such as polyester (Myester) or polysacral acid (p〇). iyCarbonate, pc). In particular, the adhesive used for bonding between the film 3 and the film 1 should be selected with a low viscosity and a flowing fluid. It is better to use it when it helps the user to apply force on the protective film 3. The stress generated by the adhesive can disperse the non-positive force, so the protective film 3 is less likely to deform. In addition, the surface of the film 1 will undergo a hardening process to protect the surface of the film 1 from damage caused by improper application of force. Since the film 1 has been heat-treated first, the film 1 will be in a relative position relative to the protective film 3. The density is higher, so when step 702 is completed, 8 1241514 is mounted at room temperature, the film! Because it undergoes a dehumidification process in advance, it will absorb water and swell. On the other hand, because the protection 3 is not heated, its water swell capacity is small. Because of the asymmetric expansion, it makes the film work and protection. The middle part of the film 3 is slightly concave. … 5 As shown in step 703, a plurality of dot spacers 4 are set on the first conductive layer u or the second conductive layer u. The dot spacer 4 is used to prevent the first and second conductive layers 11 and 21 from contacting each other after the thin film 1 and the substrate 2 are bonded. 10. Forming the dot spacer 4 between the first and second conductive layers 1 丨 and 2ι is a technique that can be understood by those skilled in the art, and will not be repeated here. 15 20 Next, as shown in step 704 and referring to FIGS. 8 and 9, a first layer of the film i = the first layer of the electrical layer 11—a circuit layer 13 is provided, and a first layer of the second conductive layer 21 of the substrate 2 is provided.二 电路 层 23。 Two circuit layers 23. The circuit layers ΐ3 and μ are provided to provide the transmission of telecommunication numbers. In this embodiment, a four-wire touchpad is taken as an example. Therefore, the -circuit layer 13 ^ is used to provide a voltage gradient in the χ direction, so A first electrode body 1 ′ printed with silver wire and a first wire 132 connected to the two second-electrodes 131 should be formed on each of the left and right sides, wherein the first electrodes are respectively connected to the left and right of the first conductive layer u. The electrical connection on both sides is the same. The second circuit layer 23 is used to provide a voltage gradient in the y direction. Therefore, a second electrode 23b should be formed on both sides after w and a connection between the two -A lead 232, in which the second electrode 231 is electrically connected to two sides of the second conductive layer 21 on the rear side of the second conductive layer 21, and each of the electrodes and the leads are arranged in pairs and symmetrically, and each of the electrodes and the conductive layer are respectively The production of the related P-layer connections of the relevant circuit layer is a conventional technique, which is not repeated here. It should be noted that, if the helmet x Zhidou, „Xu, Poor + 疋 is a five-wire type, a six-wire type, or even an eight-wire type port, the number of electrodes, u ~ μ 酉 own position will be Somewhat awkward, because this is a 5 and is not the focus of the present invention, it will not be repeated here. 10, after 'as in step 7. 5, the step 7G2 has completed the protective substrate 3 of the soldier substrate 2 to obscure The body 5 is attached to each other. Here, an anisotropic conductive adhesive having a thickness of about #, a double-sided adhesive tape, or a printing frame (5 to 5 Am) can be used on the second circuit layer 23 of the substrate 2. A circuit layer =, attached to the adhesive layer, so that the first conductive layer 13 and the second conductive layer M are adjacent to each other. 'Because the binding film 1 is in a recessed state, The pitch is not the same, the shortest pitch is the shortest at the middle part. 15 After the film 1 and the substrate 2 are bonded to each other by the haze 5, it should be heated under pressure (approximately 3 (TC ~ 50. 155 seconds to 180 seconds, It is allowed to solidify and adhere. Finally, an optional step can be added, that is, after the touch pad is assembled, it can be heat-treated at a temperature of somot for about 1G ~ 3G minutes. Bake to remove moisture from the protective film 3. 20 Of course, when the film 丨 is attached to the substrate 2, a winding wire 6 needs to be placed between the film i and the substrate 2 so that the film i and the substrate After the 2 phases are laminated, the flexible cable 6 is electrically connected to the wires 13 2, 2 3 and 2 in an equal quantity and symmetrical manner, so that the controller (not shown) can be connected via the flexible cable 6 Supply voltage or current to the first electrode 3, 1 and the second electrode 1 to sense the user's touch action. In summary, the present invention is to heat treat the film to remove the internal stress 10 10 15 20 Figure 2 Is a cross-sectional view illustrating the structure of the touchpad; FIG. 3 is a schematic plan view illustrating the upper and lower electrodes of the touchpad 1241514 force and water vapor, and after bonding with the protective film 3 and then with the substrate 2 Lamination ', so when the film 1 is bonded to the protective film 3, the generation of bubbles after bonding can be reduced.' Better, because the protective film 3 is combined with the film 1 ', the film 1 after heat treatment, when back At room temperature, it will absorb water vapor again. It is said to swell and cause depression, thereby shortening the gap between the first and second conductive layers, and reducing the driving force of the touch panel, and indeed achieves the purpose of the present invention. This is only a preferred embodiment of the present invention. When the scope of implementation of the present invention cannot be limited in this way, that is, any simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the invention description should still belong to the patent of the present invention. [Schematic description] Figure 1 is not intended to illustrate the relationship between a touchpad, a controller, and a host; Figure 4 is a schematic diagram illustrating the relative of the upper and lower electrodes Relationship; FIG. 5 is a schematic diagram illustrating a thin film having a first conductive layer; FIG. 6 is a schematic diagram illustrating a substrate having a second conductive layer; and FIG. 7 is a flowchart illustrating a low driving resistance of the present invention. Steps of the method for manufacturing a touch panel; 夂 FIG. 8 is a schematic diagram illustrating a touch panel obtained by the method of the present invention; FIG. 9 is a schematic diagram illustrating a first circuit layer and a second circuit layer 11 25 12 41514 [Description of the main symbols of the drawings] 1 Thin film 210 Top surface 2 Substrate 131 First electrode 3 Protective film 231 Second electrode 4 Point spacer 132 First lead 5 Gel 232 Second lead 6 Row 13 First Circuit layer 11 First conductive layer 23 Second circuit layer 21 Second conductive layer 70L · -705 Step 110 bottom surface 112 top surface 12