201120392 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，特別涉及一種用於電子裝置 之水冷式散熱裝置。 [先前技術3 [〇舰]電子裝置之中央處理器（CPU)等元器件，工作時會產生大 量之熱量，如果不及時散熱就會造成元器件溫度過高。 由於元器件於高溫下工作時，其1作效率會降低，甚至 燒毁。故’為降低元器件之溫度，通常於元器件上設有 散熱裝置，以加快散熱。 國-種水冷式散熱裝置，其用於加快電子裝置之元器件散 熱。該水冷式散熱裝置包括箱體、設於該箱體内之驅動 件及從動件、設減從動件㈣之蓋 體。該蓋體上形成有-吸水0及_排水^該驅動件包 括轉軸、定子線圈、感柄鐵環及防水隔I該從動件 包括設於該吸水口與該排水D之間之葉輪。該葉輪及感 應磁鐵環分·定於該_之兩端H請板設於定 子線圈與感應磁鐵環H與鋪接，以用 於封閉該定子線圈。該水冷式散熱裝置卫作時，該定子 線圈與感應磁鐵環相互作用，驅動轉軸帶動葉輪轉動， 將冷卻液體從吸水口導人，㈣將吸收元器件之熱量後 之冷卻液體從排水口導出，從而達到快速進行熱交換之 冷卻循環目的。 [0004] 然述之水冷式散熱裝置之防水隔板與箱體側壁並非 體成型，於驅動件之長時間之震動下 ，防水隔板與箱 098142671 表單編號A0101 第5頁/共21頁 0982073292-0 201120392 體之側壁之間容易出現缝隙，使液體從該缝隙滲透到防 水隔板下方，而浸濕該定子線圈，導致該驅動件短路而 燒毁。 【發明内容】 [0005] 鑒於上述狀況，有必要提供一種防水性較好之水冷式散 熱裝置。 [0006] 一種水冷式散熱裝置，其包括散熱座、固定於該散熱座 上之箱體、固定於箱體内之從動件及固定於箱體與散熱 座之間之驅動件，箱體内容納有冷卻液體，驅動件包括 〇 第一磁體，散熱座上開設有流道，從動件包括設於箱體 内壁上之缸體、設於缸體内且中部開設有通孔之活塞、 固定於活塞上之第二磁體及設於通孔内之閥門，散熱座 與缸體及箱體之間設有相互連通之循環管道，第一磁體 _ 與第二磁體相互作用，驅動活塞於該缸體内往復滑動， 使閥門處於關閉或打開狀態，從而將箱體中之液體導入 缸體，並從缸體内壓入到散熱座之流道内。 Ο [0007] 上述水冷式散熱裝置之驅動件設置於箱體外，並藉由驅 動件之第一磁體與從動件之第二磁體相互作用，驅動從 動件之活塞往復滑動，驅動件無需與箱體内之從動件接 觸，從而避免箱體内之液體浸濕驅動件，其防水性較好 〇 【實施方式】 [0008] 下面結合附圖及實施方式對本發明之水冷式散熱裝置作 進一步詳細說明。 098142671 表單編號A0101 第6頁/共21頁 0982073292-0 201120392 [0009] [0010] Ο [0011] [0012] 〇 [0013] [0014] 月 > 閱圖1及圖2 ,本發明實施方式一之水冷式散熱裝置 100包括散熱座10、循環管道20、驅動件30、箱體4〇、 從動件50及散熱片60。箱體40設於散熱座1〇上，箱體4〇 内設有容納腔（未標示），其内容納有水等冷卻液體（ 圖未不）。驅動件30設於箱體40内。循環管道2〇將散熱 座10與驅動件30及箱體40連通。從動件50固定於散熱座 10與箱體40之間。散熱片60封閉箱體40之開口。 散熱座10之一側基本垂直設有複數散熱鰭片11，該複數 散熱鰭片11之中部形成大體為圓形之一收容部12。散熱 座10上還開設有複數相互平行之流道13。 循環管道2〇為彎曲之圓形管道，其可與流道13相連通。 驅動件30包括一馬達31、與馬違31轴接之—轉輪33及固 定於轉輪33上之複數第一磁體35。馬達31具有轉轴312 。轉輪33之中部開設有一穿孔331，馬達31之轉轴31 2自 由端固定於穿孔331内》轉輪33上還開設有收容第一磁體 35之複數固定孔332，該複數固定孔332相對於穿孔331 呈中心對稱分佈。具體於本實施方.式中，第一磁體35為 大致呈圓柱形之永久磁鐵。- 箱體40大致呈矩形體，其具有一開口 41。箱體4〇之底板 形成有容置驅動件30之一收容槽43。具體於本實施方式 中’收容槽43凹陷形成於箱體40底部之外表面。 從動件50包括一缸體51、複數第二磁體52、一閥門53、 一活塞54、一彈簧55及一蓋體56。缸體51大致呈圓筒形 ，其固定於箱體40容納腔之底部。本實施方式中，缸體 098142671 表單編號Α0101 第7頁/共21頁 0982073292-0 201120392 51與箱體40—體成型。從動件50之第二磁體52為永久磁 鐵，且與驅動件30之第一磁體35相對之磁極相同。活塞 54可於缸體51内往復滑動。活塞54_端開設有通孔541 及圓環形之定位槽542。通孔541為階梯孔，其位於活塞 54端面之中部。定位槽542環繞該通孔54ι。活塞54之另 —端開設有複數收容第二磁體52之固定槽545。閥門53容 納於通孔541内’其與活塞54柔性連接。蓋體56固定於缸 體51之開口端《蓋體56包括設於其一側之固定部561及形 成於中部之通孔562。彈簧55抵持於蓋體56與活塞54之 間〇 .. ...... .. ..... ..... ： ....... , - ..........201120392 VI. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a water-cooled heat sink for an electronic device. [Previous Technology 3 [Chipboard] Electronic device's central processing unit (CPU) and other components, will generate a large amount of heat during operation, if not timely heat dissipation will cause the component temperature is too high. When the components are operated at high temperatures, their efficiency will be reduced or even burned. Therefore, in order to reduce the temperature of the components, a heat sink is usually provided on the components to accelerate heat dissipation. A state-of-the-water cooled heat sink that accelerates the dissipation of components in electronic devices. The water-cooling heat dissipating device comprises a box body, a driving member and a follower provided in the box body, and a cover body for reducing the follower member (4). The cover body is formed with - water absorption 0 and_drainage. The drive member includes a rotating shaft, a stator coil, a handle iron ring and a waterproof partition. The follower includes an impeller disposed between the suction port and the drain D. The impeller and the inductive magnet ring are disposed at both ends of the y. The H plate is disposed on the stator coil and the induction magnet ring H to be used for closing the stator coil. When the water-cooled heat sink is used for protection, the stator coil interacts with the induction magnet ring, the drive shaft drives the impeller to rotate, the cooling liquid is guided from the water suction port, and (4) the cooling liquid that absorbs the heat of the component is discharged from the drain port. Thereby achieving the purpose of rapid cooling cycle of heat exchange. [0004] The water-repellent partition of the water-cooling heat dissipating device and the side wall of the box are not formed in a body, and under the vibration of the driving member for a long time, the waterproof partition and the box 098142671 Form No. A0101 Page 5 / 21 pages 0982073292- 0 201120392 A gap is easily formed between the side walls of the body, so that liquid penetrates from the gap to the underside of the waterproof partition, and the stator coil is wetted, causing the drive member to be short-circuited and burned. SUMMARY OF THE INVENTION [0005] In view of the above circumstances, it is necessary to provide a water-cooled heat sink which is excellent in water repellency. [0006] A water-cooling heat dissipating device includes a heat sink, a box fixed to the heat sink, a follower fixed to the box, and a driving member fixed between the box and the heat sink, the contents of the box There is a cooling liquid, the driving component comprises a first magnet, and a heat dissipation seat is provided with a flow channel. The driven component comprises a cylinder body disposed on the inner wall of the tank body, a piston disposed in the cylinder body and having a through hole in the middle portion thereof, and fixing a second magnet on the piston and a valve disposed in the through hole, wherein the heat sink and the cylinder and the box are provided with a circulating pipe communicating with each other, and the first magnet _ interacts with the second magnet to drive the piston to the cylinder The body slides back and forth to close or open the valve, so that the liquid in the tank is introduced into the cylinder and pressed into the flow passage of the radiator from the cylinder. [0007] The driving member of the water-cooling heat dissipating device is disposed outside the casing, and the first magnet of the driving member interacts with the second magnet of the driven member to drive the piston of the driven member to reciprocately slide, and the driving member does not need to be The driven member in the casing contacts, so as to avoid the liquid-wetting driving member in the casing, and the waterproof property is better. [Embodiment] [0008] The water-cooling heat dissipating device of the present invention is further further described below with reference to the accompanying drawings and embodiments. Detailed description. 098142671 Form No. A0101 Page 6 of 21 0982073292-0 201120392 [0009] [0010] [0012] [0013] [0014] [0014] [0014] 1 and 2, Embodiment 1 of the present invention The water-cooling heat sink 100 includes a heat sink 10, a circulation duct 20, a driving member 30, a casing 4, a follower 50, and a heat sink 60. The casing 40 is disposed on the heat sink 1 , and the casing 4 is provided with a receiving chamber (not shown) containing a cooling liquid such as water (not shown). The driving member 30 is disposed in the casing 40. The circulation duct 2 connects the radiator 10 to the driving member 30 and the casing 40. The follower 50 is fixed between the heat sink 10 and the case 40. The heat sink 60 closes the opening of the case 40. A plurality of heat dissipating fins 11 are disposed substantially perpendicularly on one side of the heat dissipating block 10. The middle portion of the plurality of heat dissipating fins 11 forms a substantially circular one receiving portion 12. The heat sink 10 is also provided with a plurality of flow passages 13 which are parallel to each other. The circulation duct 2 is a curved circular duct which can communicate with the flow passage 13. The driving member 30 includes a motor 31, a shaft 33 coupled to the horse 31, and a plurality of first magnets 35 fixed to the wheel 33. The motor 31 has a rotating shaft 312. A hole 331 is defined in the middle of the runner 33. The free end of the rotating shaft 31 2 of the motor 31 is fixed in the through hole 331. The rotating wheel 33 is further provided with a plurality of fixing holes 332 for receiving the first magnet 35. The plurality of fixing holes 332 are opposite to the plurality of fixing holes 332. The perforations 331 are symmetrically distributed in the center. Specifically, in the embodiment, the first magnet 35 is a substantially cylindrical permanent magnet. - The casing 40 is substantially rectangular in shape and has an opening 41. The bottom plate of the casing 4 is formed with a receiving groove 43 for accommodating the driving member 30. Specifically, in the present embodiment, the receiving groove 43 is recessed and formed on the outer surface of the bottom of the casing 40. The follower 50 includes a cylinder 51, a plurality of second magnets 52, a valve 53, a piston 54, a spring 55, and a cover 56. The cylinder block 51 has a substantially cylindrical shape and is fixed to the bottom of the housing 40 receiving chamber. In the present embodiment, the cylinder body 098142671 form number Α0101 page 7 / total 21 page 0982073292-0 201120392 51 and the body 40 body molding. The second magnet 52 of the follower 50 is a permanent magnet and has the same magnetic pole as the first magnet 35 of the drive member 30. The piston 54 is slidable in the cylinder 51. The piston 54_ is provided with a through hole 541 and a circular positioning groove 542 at the end. The through hole 541 is a stepped hole which is located in the middle of the end face of the piston 54. The positioning groove 542 surrounds the through hole 54ι. The other end of the piston 54 is provided with a plurality of fixing grooves 545 for receiving the second magnet 52. The valve 53 is received in the through hole 541' which is flexibly connected to the piston 54. The cover 56 is fixed to the open end of the cylinder 51. The cover 56 includes a fixing portion 561 provided on one side thereof and a through hole 562 formed in the middle portion. The spring 55 abuts between the cover 56 and the piston 54............................: ......., -... ....
[0015] [0016] 散熱片60包括底板61及設於底板61兩側之第一散熱鰭片 63及第二散熱鰭片65。第一散熱鰭片63及第二散熱鰭片 65均基本垂直於底板η，其中第二散熱縛片65之尺寸小 於第一散熱鰭片63之尺寸，第二散熱鰭片65收容於箱體 40内。 請同時參閱圖3，組裝水冷式散熱裝置100時，首先，將 驅動件30放置於散熱座1〇之收容部12内。然後，將箱體 40固定於散熱座10之散熱鰭片11上，且使驅動件30對應 於箱體40之收容槽43，從而將驅動件30密封於箱體40與 散熱座10之間《接著，將閥門53固定於活塞54之通孔 541内，將第二磁體52固定於活塞54之固定槽545内，將 彈簧55之一端放置於活塞54之定位槽542内，將蓋體56 固定於缸體51之開口端，從而完成從動件50之組裝。接 著’採用循環管道20將箱體40與散熱座1〇之流道13、從 動件50之缸體51與散熱座10之流道13連通。最後，將散 098142671 表單編號A0101 第8頁/共21頁 0982073292-0 201120392 熱片封閉箱體40之開口 4卜並使第二散熱韓片β5收容 於箱體4〇内。 [0017] Ο 安敦水冷式散熱裝置100時，將散熱座1〇固定於電子裝置 之凡盗件1G2上，電子裝置之元器件1G2固定於固定板 1 曰01上。具體於本實施方式中，元器件1〇2為電腦之⑽ 晶片，固定板101為電腦之主板。工作時，冷卻液體藉由 散熱座10之散熱鰭片1卜及收電子裝置之元器件1〇2之熱量 後’導入到箱體40内，並藉由散熱片6G及箱體4〇侧壁向 外界散發熱量，冷卻後之祕導人從動件之知 體51内，並藉由驅動件3〇與從動件5〇相互作 將冷卻 後之液體壓入散熱座10之流道13内。故，冷卻液趙 元器件 述過程中循較熱與放熱，從而加快電子裝置之、於上 散熱 [0018] Ο 凊參閱圖3及圖4，水冷式散熱裝置1〇〇工作過程包括_ 程：第一行程，驅動件30之轉輪33轉動到第一位置〜。订 動件30之第-磁體35與從動件5G之第二磁體以作用產驅 —排斥力，促使從動件50之承:塞54朝向蓋體56滑動生 簧55發生彈性形變，從動件5〇之閥門53打開，冷卻’彈 從箱體40流入從動件50之缸體51内；第二行 液體 驅動件 3〇之轉輪33轉動到第二位置，驅動件3〇之第一 %艰35與 從動件50之第二磁體52之間之作用力減小，彈簧55恢1 升> 變而抵持活塞5 4，活塞5 4朝向駆動件3 〇滑動，閥門 關閉’而將冷卻液體從動件50之紅體51内壓入散熱座 之流道13内。 ° 098U2671 本發明之水冷式散熱裝置100之驅動件3〇設置於箱 表單編號A0101 第9頁/共21頁 體4〇外 °982〇7329 [0019] 201120392 ，並藉由驅動件30之第一磁體35與從動件5〇之第二磁體 52相互作用，驅動從動件50之活塞54往復滑動，並且非 接觸地作用於從動件50，驅動件30無需與箱體4〇内之從 動件50接觸，從而避免箱體4〇内之冷卻液體浸濕驅動件 30，故，本發明之水冷式散熱裝置1〇〇防水性較好。 [0020] 請參閱圖5，本發明實施方式二之水冷式散熱裝置2〇〇與 實施方式一之水冷式散熱裝置1〇〇相似，其不同之處在於 :第一磁體70為一電磁鐵，其通入單極脈衝電流，第一 磁體70與第二磁體52相對之磁極相同，使二者之間間斷 0 產生排斥力。 [0021] 請參閱圖6 ’本發明實施方式三之水冷式散熱裝置3〇〇與 實施方式一之水冷式散熱裝置1 〇〇相似，其不同之處在於 :箱體80具有蓋板81，第一磁體90為電磕鐵，其通入雙 極脈衝電流’第一磁體90與第二磁體52相對之磁極相同 或相反，使得二者之間交替產生排斥力與吸引力。 [0022] 可理解，第二磁體52亦可為完全密封於活塞54内之電磁[0016] The heat sink 60 includes a bottom plate 61 and first heat dissipation fins 63 and second heat dissipation fins 65 disposed on both sides of the bottom plate 61. The first heat dissipation fins 63 and the second heat dissipation fins 65 are substantially perpendicular to the bottom plate η, wherein the second heat dissipation fins 65 are smaller in size than the first heat dissipation fins 63, and the second heat dissipation fins 65 are received in the housing 40. Inside. Referring to FIG. 3 at the same time, when assembling the water-cooling heat sink 100, first, the driving member 30 is placed in the housing portion 12 of the heat sink 1. Then, the case 40 is fixed on the heat dissipation fin 11 of the heat sink 10, and the driving member 30 is corresponding to the receiving groove 43 of the case 40, thereby sealing the driving member 30 between the case 40 and the heat sink 10. Next, the valve 53 is fixed in the through hole 541 of the piston 54, the second magnet 52 is fixed in the fixing groove 545 of the piston 54, and one end of the spring 55 is placed in the positioning groove 542 of the piston 54 to fix the cover 56. At the open end of the cylinder 51, the assembly of the follower 50 is completed. Then, the casing 40 is connected to the flow passage 13 of the radiator 1, the cylinder 51 of the driven member 50, and the flow passage 13 of the radiator 10 by the circulation duct 20. Finally, it will be scattered 098142671 Form No. A0101 Page 8 of 21 0982073292-0 201120392 The hot film closes the opening of the box 40 and the second heat-dissipating Korean film β5 is housed in the box 4〇. [0017] When the Anton water-cooled heat sink 100 is installed, the heat sink 1 is fixed to the electronic device 1G2, and the component 1G2 of the electronic device is fixed to the fixed plate 1 曰01. Specifically, in the present embodiment, the component 1〇2 is a (10) chip of a computer, and the fixed board 101 is a motherboard of a computer. During operation, the cooling liquid is introduced into the casing 40 by the heat sink fins of the heat sink 10 and the heat of the components 1〇2 of the electronic receiving device, and is supported by the heat sink 6G and the side walls of the casing 4 The heat is dissipated to the outside, and the cooled liquid guides the inside of the body 51 of the driven member, and the cooled liquid is pressed into the flow path 13 of the heat sink 10 by the driving member 3〇 and the driven member 5〇. . Therefore, during the process of the coolant component, the heat and heat release are accelerated, thereby accelerating the heat dissipation of the electronic device [0018] 凊 凊 Referring to FIG. 3 and FIG. 4, the water-cooling heat sink 1 〇〇 process includes: In the first stroke, the runner 33 of the drive member 30 is rotated to the first position ~. The first magnet 35 of the positioning member 30 and the second magnet of the driven member 5G act to generate a repulsive force, and the bearing member 50 is urged to be elastically deformed by the sliding member 55 of the follower 54 toward the cover 56. The valve 53 of the piece 5 is opened, and the cooling 'ball is flowed from the casing 40 into the cylinder 51 of the driven member 50; the second row of the liquid driving member 3 is rotated to the second position, and the driving member 3 is turned The force between the one of the hard 35 and the second magnet 52 of the follower 50 is reduced, the spring 55 recovers 1 liter > changes to resist the piston 5 4, the piston 5 4 slides toward the raking member 3 ,, the valve closes ' The red body 51 of the cooling liquid follower 50 is pressed into the flow path 13 of the heat sink. ° 098U2671 The driving member 3 of the water-cooling heat dissipating device 100 of the present invention is disposed on the box form No. A0101, page 9 / total 21 page body 4, outside 982 〇 7329 [0019] 201120392, and is driven by the first of the driving members 30 The magnet 35 interacts with the second magnet 52 of the follower 5〇, drives the piston 54 of the follower 50 to reciprocately slide, and acts non-contact on the follower 50, and the drive member 30 does not need to be in contact with the case 4 The movable member 50 is in contact with each other, so that the cooling liquid in the casing 4 is prevented from wetting the driving member 30. Therefore, the water-cooling heat dissipating device 1 of the present invention has better water repellency. [0020] Referring to FIG. 5, the water-cooling heat dissipating device 2 of the second embodiment of the present invention is similar to the water-cooling heat dissipating device 1 of the first embodiment, except that the first magnet 70 is an electromagnet. It passes through the unipolar pulse current, and the magnetic poles of the first magnet 70 and the second magnet 52 are the same, so that a repulsive force is generated between the two. [0021] Please refer to FIG. 6 'The water-cooled heat sink 3 本 of the third embodiment of the present invention is similar to the water-cooled heat sink 1 实施 of the first embodiment, except that the box 80 has a cover 81, A magnet 90 is an electric neodymium iron that passes into a bipolar pulsed current 'the first magnet 90 is identical or opposite to the magnetic pole opposite the second magnet 52 such that a repulsive force and an attractive force are alternately generated therebetween. [0022] It can be understood that the second magnet 52 can also be an electromagnetic completely sealed in the piston 54.
Q 鐵。彈簧55亦可省略，此時，活塞54依靠其自身重力朝 向驅動件30滑動。 [0023] 综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟’以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 0982073292-0 098142671 表單編號A0101 第10頁/共21頁 201120392 [0024] 圖1係本發明實施方式一之水冷式散熱裝置之立體分解圖 [0025] 圖2係本發明實施方式一之水冷式散熱裝置之另一視角之 立體分解圖。 [0026] 圖3係圖1所示之水冷式散熱裝置應用於一電子裝置之元 器件之立體示意圖。 [0027] 圖4係沿圖3中IV-IV線之剖面示意圖。 [0028] 圖5係本發明實施方式二之水冷式散熱裝置之剖面示意圖 〇 ............ [0029] 圖6係本發明實施方式三之水冷式散熱裝置之剖面示意圖 [0030] 【主要元件符號說明】 散熱座10 [0031] ' ...... ..S 散軌鰭片 11 .S 〇 [0032] &㈣12 ...... ^ %：：s [0033] 流道13 [0034] 循環管道20 [0035] 驅動件30 [0036] 馬達31 [0037] 轉軸312 [0038] 轉輪33 098142671 表單編號A0101 第11頁/共21頁 0982073292-0 201120392 [0039] 穿孔 3 31 [0040] 固定孔3 3 2 [0041] 第一磁體 35、70、90 [0042] 箱體 40、80 [0043] 開口 41 [0044] 收容槽43Q iron. The spring 55 can also be omitted, at which time the piston 54 slides against the drive member 30 by its own weight. [0023] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view of a water-cooled heat sink according to a first embodiment of the present invention. [0025] FIG. 2 is an embodiment of the present invention. A perspective exploded view of another perspective of the water-cooled heat sink of the first mode. 3 is a perspective view of a water-cooled heat sink shown in FIG. 1 applied to an element of an electronic device. 4 is a cross-sectional view taken along line IV-IV of FIG. 3. 5 is a schematic cross-sectional view of a water-cooling heat dissipating device according to Embodiment 2 of the present invention. [0029] FIG. 6 is a cross-sectional view of a water-cooling heat dissipating device according to Embodiment 3 of the present invention. Schematic diagram [0030] [Explanation of main component symbols] Heat sink 10 [0031] ' ...... ..S loose rail fins 11 .S 〇[0032] & (d) 12 ...... ^ %:: s [0033] Flow channel 13 [0034] Circulating conduit 20 [0035] Drive member 30 [0036] Motor 31 [0037] Spindle 312 [0038] Runner 33 098142671 Form No. A0101 Page 11 of 21 0982073292-0 201120392 Perforation 3 31 [0040] fixing hole 3 3 2 [0041] first magnet 35, 70, 90 [0042] housing 40, 80 [0043] opening 41 [0044] receiving groove 43
[0045] 從動件5 0 [0046] 缸體 51 [0047] 第二磁體52 [0048] 閥門 53 [0049] 活塞 54 [0050] 通孔 541、562[0045] Follower 50 [0046] Cylinder 51 [0047] Second Magnet 52 [0048] Valve 53 [0049] Piston 54 [0050] Through Hole 541, 562
[0051] 定位槽542 [0052] 固定槽545 [0053] 彈簧 55 [0054] 蓋體 5 6 [0055] 固定部5 61 [0056] 散熱片60 [0057] 底板 61 098142671 表單編號A0101 第12頁/共21頁 0982073292-0 201120392 [0058] 第一散熱鰭片63 [0059] 第二散熱鰭片65 [0060] 蓋板81 [0061] 水冷式散熱裝置100、200、300 [0062] 元器件102 [0063] 固定板101 Ο 098142671 表單編號Α0101[0051] Positioning groove 542 [0052] fixing groove 545 [0053] Spring 55 [0054] Cover 5 6 [0055] Fixing portion 5 61 [0056] Heat sink 60 [0057] Base plate 61 098142671 Form No. A0101 Page 12 / 21 0982073292-0 201120392 [0058] First heat sink fin 63 [0059] Second heat sink fin 65 [0060] Cover plate 81 [0061] Water-cooled heat sink 100, 200, 300 [0062] Component 102 [ 0063] Fixed plate 101 Ο 098142671 Form number Α 0101
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