201114337 六、發明說明： 【發明所屬之技術領域】 本發明是揭露一種軟性印刷電路板，尤指一種利用絕緣層來保 濩軟性印刷電路板發生撕裂問題的結構。 【先前技術】201114337 VI. Description of the Invention: [Technical Field] The present invention discloses a flexible printed circuit board, and more particularly to a structure that utilizes an insulating layer to protect a flexible printed circuit board from tearing. [Prior Art]
平面顯示模組為目前曰趨流行的一種顯示模組，其中液晶顯示 器(LCD)更因為具有外型輕薄、耗電量少以及無輻射污染等特性， 故已被廣泛地應用在個人桌上型電腦螢幕以及筆記型電腦、個人 數位助理(PDA)、手機等攜帶式資訊產品上，甚至已有逐漸取代陰 極射線管(Cathode Ray Tube, CRT)監視器及傳統電視的趨勢。 為了滿足市場對攜帶式電子產品輕薄化的需求，業界必須不斷 研發在有限的產品空間内配置各元件與裝置。一般而言，液晶顯 示面板都會藉由一軟性印刷電路板(fjexibie printe(j circuit board)而與外部讯號作連接，以控制面板晝面，由於軟性印刷電路 板具有可繞特性’因此為了節省空間，在設置液晶顯示面板時， 通常會將FPC依據整個模組的設置空間而向後摺疊。 然而，現今所使用的軟性印刷電路板通常為單層、雙層或多層 結構。由於產^組裝過程或模組使財常需要崎軟性印刷電 路’因此僅具有較薄結構的軟性印職路板經常發生被液晶顯示 面板之玻喊賴斷或受繞折應力峨裂關題。在大部分情兄 下，軟性印刷電路板的撕置通f發生在軟性印刷電路板^合 於液晶顯示疏之玻璃基板的邊緣處，或是軟性印刷電路板: 〇形狀外觀具撕的㈣處。但不f __方式或在何處 4 ’均會對整個LCD·的運作產生影響’在嚴重情況 201114337 導致LCD模組無法運作。The flat display module is a popular display module. Among them, the liquid crystal display (LCD) has been widely used in personal desktops because of its thinness, low power consumption and no radiation pollution. Computer screens and portable information products such as notebook computers, personal digital assistants (PDAs), and mobile phones have even gradually replaced the trend of cathode ray tubes (CRT) monitors and traditional televisions. In order to meet the market demand for thinner and lighter portable electronic products, the industry must continuously develop components and devices in a limited product space. In general, the liquid crystal display panel is connected to an external signal by a fjxibie printe (j circuit board) to control the face of the panel, since the flexible printed circuit board has a wrapable characteristic, thus saving Space, when setting the LCD panel, the FPC is usually folded back according to the installation space of the entire module. However, the flexible printed circuit boards used today are usually single-layer, double-layer or multi-layer structures. Or the module makes the need for a soft printed circuit. Therefore, only the soft printed circuit board with a thinner structure often suffers from the screaming of the liquid crystal display panel or the stress of the winding. Next, the tear-off pass of the flexible printed circuit board occurs at the edge of the flexible printed circuit board which is bonded to the glass substrate of the liquid crystal display, or the flexible printed circuit board: the shape of the 〇 shape is torn (4). But not f _ The _ mode or where 4' will affect the operation of the entire LCD. In severe cases 201114337, the LCD module will not work.
【發明内容】 因，，本發明是揭露一種軟性印刷電路板，以解決現今軟性 電路板合易產生撕麵問題，包括防撕裂以及不使紐印刷電路 板變更硬或明顯變厚。 ，發明較佳實施例是揭露—種軟性印刷電路板，其設於—基 板之心之-上表面且反折至該基板之—下表面。軟性印刷電路 板主要包含-紐基板以及―絕緣層包覆軟性基板，鱗緣層具 有開口至少暴露位於基板側壁之部分軟性基板。SUMMARY OF THE INVENTION Accordingly, the present invention is directed to a flexible printed circuit board that solves the problem of tearing surfaces that are susceptible to today's flexible circuit boards, including tearing prevention and non-hardening or significant thickening of the printed circuit board. DETAILED DESCRIPTION OF THE INVENTION A preferred embodiment of the invention discloses a flexible printed circuit board disposed on the upper surface of the center of the substrate and folded back to the lower surface of the substrate. The flexible printed circuit board mainly comprises a -new substrate and an insulating layer covering the flexible substrate, and the scale layer has an opening to expose at least a part of the flexible substrate located on the side wall of the substrate.
本發明主要利用一由聚亞醯胺㈣yimide)膜或感光油墨所構 成的絕緣層來包覆-軟性基板，錄絕緣層t形成—開口並至少 暴露出軟1±基板相f彳於板的彳賴處。依據本發明之較佳實施 例’包覆軟性基板的絕緣層主要針雌㈣邊緣及糾處提供一 種補強作用，使軟性基板被反折時不基板本身結構過於單薄 而發生撕裂的現象。藉此設計，本發明可大幅提昇軟性印刷電路 板的抗撕裂強度，並進而改善整個顯示模組的穩定性。 有關本發_特徵與實作，舰合圖示作最佳實施例詳細說明 如下。 【實施方式】 請參照圖1及圖2 ’圖1為本發明較佳實施例之，示模植 二之示賴’而圖2則為圖i中顯示模組沿著切線从，之剖面示 意圖。如圖中所示’顯示模、组10主要包含—基板12以及一軟性 印刷電路板14設於基板：12上。其中，基板12可主要由一液晶顯 201114337 示面板或觸控式面板等顯示面板所構成，其具有一上表面26、至 • 少一侧壁28以及一下表面30。基板12的上表面26設有一顯示區 -W與一週邊電路區18以及若干個驅動晶片20設於基板12的週 邊電路區18上，用來驅動基板12。驅動晶片2〇可為一集成閘極 (gate)驅動晶片或一源極(source)驅動晶片，且驅動晶片2〇可利用 玻璃覆晶(chip on glass，COG)封裝方式黏結於基板12上。 本較佳實施例之軟性印刷電路板14主要由一具單層板結構之 軟性基板22及包覆部分軟性基板22的絕緣層32所構成，且較佳 • 設於基板12的部分上表面並反折至基板12的侧壁28及下表面 30。本實施例所揭露之軟性印刷電路板14雖以反折至基板12的 侧壁28及下表面30為例，但不侷限於反折的設計，又可應用至 不翻折的模組，例如終端操作時需來回繞區等滑蓋機中。相對於 基板12的上表面26與下表面30，軟性基板22具有一第一表面 34以及一第二表面36 ,軟性印刷電路板14反折時，其第二表面 36相較於第一表面34較接近基板12之側壁28。軟性基板22的 第一表面36另可設有複數個電子元件38用來控制顯示模組1〇的 • 運作。絕緣層32可同時包覆軟性基板22的部分第一表面34及部 分第二表面36，但不侷限於此，又可僅覆蓋軟性基板22的部分第 表面34或僅覆蓋軟性基板22的部分第二表面％，此實施例亦 可屬本發明所涵蓋的範圍。 依據本發明之較佳實施例，絕緣層32是由一聚亞醯胺 (polymnde)膜所構成，但不侷限於此，又可採用其他具有保護效果 的絕緣材料。其次，絕緣層32覆蓋於軟性基板22時較佳形成一 開口 40並暴露出相對位於基板12側壁28的部分軟性基板表 面。另外，本較佳實施例所揭露的軟性印刷電路板14本身另包含 201114337 一線路區(circuit region)以及一無線路區(non_circuit regi〇n)，其中 線路區中設有複數條導線’用來電連接至基板12上的驅動晶片2〇 或其他電子元件以及電連接軟性基板22的電子元件38，且絕緣層 32中的開口 40較佳暴露出軟性印刷電路板14本身的無線路區。 請再同時參照圖3及圖4，圖3為未固定軟性基板22於基板 12上的第一表面34之放大示意圖，而圖4則為軟性基板22第二 表面36之放大示意圖。以下將搭配圖3及圖4並針舰緣層％ 設於軟性基板22上的位置進行說明。 曰The invention mainly utilizes an insulating layer composed of a polyimide film or a photosensitive ink to coat a flexible substrate, and the insulating layer t forms an opening and at least exposes a soft 1± substrate phase f to the plate. Lai. According to a preferred embodiment of the present invention, the insulating layer of the flexible substrate mainly provides a reinforcing effect for the edge of the female (four) and the squeezing, so that the flexible substrate is not folded, and the structure of the substrate itself is too thin to be torn. By this design, the present invention can greatly improve the tear strength of the flexible printed circuit board and thereby improve the stability of the entire display module. For a detailed description of the preferred embodiment of the present invention, the ship's joint diagram is as follows. [Embodiment] Please refer to FIG. 1 and FIG. 2 'FIG. 1 is a schematic diagram of a preferred embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of the display module along the tangential line in FIG. . As shown in the figure, the display mode, the group 10 mainly includes a substrate 12 and a flexible printed circuit board 14 disposed on the substrate: 12. The substrate 12 can be mainly composed of a display panel such as a liquid crystal display panel or a touch panel, and has an upper surface 26, a side wall 28 and a lower surface 30. The upper surface 26 of the substrate 12 is provided with a display area -W and a peripheral circuit area 18 and a plurality of driving chips 20 are disposed on the peripheral circuit area 18 of the substrate 12 for driving the substrate 12. The driving chip 2 can be an integrated gate driving chip or a source driving chip, and the driving chip 2 can be bonded to the substrate 12 by a chip on glass (COG) package. The flexible printed circuit board 14 of the preferred embodiment is mainly composed of a flexible substrate 22 having a single-layer plate structure and an insulating layer 32 covering a portion of the flexible substrate 22, and is preferably disposed on a portion of the upper surface of the substrate 12 and The side wall 28 and the lower surface 30 of the substrate 12 are folded back. The flexible printed circuit board 14 disclosed in this embodiment is exemplified by the side wall 28 and the lower surface 30 of the substrate 12, but is not limited to the reverse folding design, and can be applied to a module that does not fold, for example. When the terminal is operated, it needs to be wound back and forth in the slider machine. The flexible substrate 22 has a first surface 34 and a second surface 36 opposite to the upper surface 26 and the lower surface 30 of the substrate 12. When the flexible printed circuit board 14 is folded back, the second surface 36 is compared to the first surface 34. It is closer to the side wall 28 of the substrate 12. The first surface 36 of the flexible substrate 22 may be further provided with a plurality of electronic components 38 for controlling the operation of the display module 1 . The insulating layer 32 may simultaneously cover a portion of the first surface 34 and a portion of the second surface 36 of the flexible substrate 22, but is not limited thereto, and may cover only a portion of the first surface 34 of the flexible substrate 22 or only a portion of the flexible substrate 22 Two surface %, this embodiment is also within the scope of the present invention. In accordance with a preferred embodiment of the present invention, the insulating layer 32 is formed of a polymnde film, but is not limited thereto, and other insulating materials having protective effects may be employed. Next, when the insulating layer 32 covers the flexible substrate 22, an opening 40 is preferably formed and a portion of the surface of the flexible substrate opposite to the side wall 28 of the substrate 12 is exposed. In addition, the flexible printed circuit board 14 disclosed in the preferred embodiment further includes a circuit region of 201114337 and a wireless circuit region (non-circuit regi〇n), wherein a plurality of wires are disposed in the circuit region for powering The driver wafer 2 or other electronic components on the substrate 12 and the electronic components 38 electrically connected to the flexible substrate 22 are connected, and the opening 40 in the insulating layer 32 preferably exposes the wireless road region of the flexible printed circuit board 14 itself. Referring to FIG. 3 and FIG. 4 simultaneously, FIG. 3 is an enlarged schematic view of the first surface 34 of the flexible substrate 22 on the substrate 12, and FIG. 4 is an enlarged schematic view of the second surface 36 of the flexible substrate 22. Hereinafter, the position where the ship's edge layer % is provided on the flexible substrate 22 will be described with reference to Figs. 3 and 4 .曰
如圖3所示，絕緣層32較佳包覆軟性基板22第一表面^灰 相對位於基板12繼28的顯部分，輯層32巾的開口 4〇销 為-矩型開口 4〇 ’且開口 4〇較佳設於軟性基板22相對於基板ι: 侧壁28的相射央位置。需注意的是，本實施例雖以開口 40設 於軟性基板22 _祕板12 _ 28 _射纽置為例，但不 侷限於此，本㈣又可缝品絲輕開口 4㈣設置的位置及大 小’例如除了設於軟性基板22相對於基板12側壁28所在的位置 =卜，又可_將和4G延伸至軟性基板22相對於基板η上表 面26及/或下表面3〇的位置。 而門^ ^ = 4G所暴露出的軟性基板22部分較佳為無線路區， 開:40周圍由絕緣層32覆蓋的軟性基板 =:::=板14被反一下表心 不侷本實施例的開口 4〇雖以矩型為例，但開口 4〇的形狀 揭限於此’x可触產品㈣雜作料娜朗和40= 201114337 如圓形或正方形等。在本實施例中，矩型開口 4〇較佳具有一長邊 ‘ 42與至少一短邊私，其中長邊42至軟性基板22相對於基板12 -下表面及側壁28父界處的距離a是小於0.5公釐，而短邊44至絕 緣層32的邊緣b則小於0.8公釐。但不侷限於此，上述距離均可 依據產品需求任意調整，皆屬本發明所涵蓋的範圍。 如圖4所示，軟性基板22主要包含三個區域46/48/5〇，其中 區域46是軟性基板22之第二表面36貼合於基板12部分上表面 26的區域，區域48是軟性基板22第二表面％對應基板12側壁 • 28的區域，而區域50則是軟性基板22第二表面36對應基板12 下表面30的區域。在本實施例中，由於區域46/48/5〇均包含至少 部分線路區，因此絕緣層32較佳包覆軟性基板22第二表面％的 絕大部分區域’包括區域46/48/50。但不侷限於此，本發明又依據 產品需求選擇性將絕緣層32包覆區域46、區域48或區域50,此 設計也屬本發明所涵蓋的範圍。 依據上述圖1至圖4所揭露之結構，本發明另揭露一種軟性 印刷電路板14的製作方法。其中，軟性印刷電路板14是應用至 • 基板12 ’例如一液晶顯示面板或觸控示面板等顯示面板，且軟 性印刷電路板14包含一軟性基板22與一絕緣層32。本實施例所 揭路的方法主要先以模具沖壓形成一具有至少一開口 4〇的絕緣層 32，然後再將此絕緣層貼附於軟性基板22上。 此外，依據上述實施例所揭露之結構，本發明又揭露一種顯 示态的製造方法，其主要先以模具沖形出一具有至少一開口 4〇的 、、’邑緣層32，然後貼附絕緣層32於一軟性基板22上。接著固定設 有絕緣層32的軟性基板22之-側於一基板12(如液晶顯示面板或 觸控不面板等)之-上表Φ 26 ’絲再反折軟性基板22並使軟性 201114337 基板22的另一侧接近基板12之一下表面30〇 ”綜上所不’本發明主要利用一由聚亞醒胺⑽細⑽膜所構成 =絕緣層來包覆—軟性基板，且於絕緣層中形成—開口並至少暴 露出軟性基板相對於—基板_魏。鋪本發明之較佳實施 例匕覆軟性基板之具開口的絕緣層主要針對軟性印刷電路板的 邊緣及軟性印稱路板本身之形狀外觀具轉折的拐肢提供一種 補強以及遮蔽倾的作用，贿軟性基板被反折時不至因基板本 身結構過於單_發生㈣的現象，亦使軟性基板可不被液晶顯 =面板=玻璃邊緣騎，更提高軟性基板承受繞折應力與耐繞折 次數。藉此開口式絕緣層的包覆設計，本發明可在保有單層、雙 層或多層板結構之紐_電路板的雜恢復力及可繞折特性ς 狀況下’大幅提昇單層板結構之軟性印刷電路板的抗撕裂強度及 耐繞折性能’進喊善整麵賴組的可靠度與穩定性。 雖然本發明以前述之較佳實施_露如上，财並_以限— 本發明，任何翻姆技藝者，在视縣發明之精神和範_疋 當可作些許之更動與_，本發明之專娜魏 明書所附之申請專利範圍所界定者為準。 β 【圖式簡單說明】 圖1為本發明較佳實施例之一顯示模組之示意圖。 圖2為圖1中顯示模組沿著切線ΑΑ，之剖面示意圖。 圖3為軟性基板第一表面之放大示意圖。 圖4為軟性基板第二表面之放大示意圖。 【主要元件符號說明】 201114337 10 顯示模組 12 基板 14 軟性印刷電路板 16 顯示區 18 周邊電路區 20 驅動晶片 22 軟性基板 26 上表面 28 側壁 30 下表面 32 絕緣層 34 第一表面 36 第二表面 38 電子元件 40 開口 42 長邊 44 短邊 46 區域 48 區域 50 區域As shown in FIG. 3, the insulating layer 32 preferably covers the first surface of the flexible substrate 22, and is located on the display portion of the substrate 12, and the opening 4 of the layer 32 is a rectangular opening 4〇' 4〇 is preferably provided at a center position of the flexible substrate 22 with respect to the substrate ι: side wall 28. It should be noted that, in the embodiment, the opening 40 is provided on the flexible substrate 22 _ the secret plate 12 _ 28 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The size 'for example, in addition to the position of the flexible substrate 22 relative to the side wall 28 of the substrate 12, may extend and 4G to a position of the flexible substrate 22 relative to the upper surface 26 and/or the lower surface 3 of the substrate n. The portion of the flexible substrate 22 exposed by the gate ^^=4G is preferably a wireless road zone, and the flexible substrate covered by the insulating layer 32 around the opening 40:=::=the board 14 is reversed to the center of the head. The opening 4〇 is exemplified by a rectangular shape, but the shape of the opening 4〇 is limited to this 'x touchable product (4) miscellaneous material Nalang and 40=201114337 such as a circle or a square. In the present embodiment, the rectangular opening 4 〇 preferably has a long side ' 42 and at least one short side, wherein the distance from the long side 42 to the flexible substrate 22 relative to the lower surface of the substrate 12 and the parent side of the side wall 28 a It is less than 0.5 mm, and the edge b of the short side 44 to the insulating layer 32 is less than 0.8 mm. However, the present invention is not limited thereto, and the above distances can be arbitrarily adjusted according to product requirements, and are within the scope of the present invention. As shown in FIG. 4, the flexible substrate 22 mainly includes three regions 46/48/5, wherein the region 46 is a region where the second surface 36 of the flexible substrate 22 is attached to the upper surface 26 of the substrate 12, and the region 48 is a flexible substrate. 22, the second surface % corresponds to the area of the side wall 28 of the substrate 12, and the area 50 is the area where the second surface 36 of the flexible substrate 22 corresponds to the lower surface 30 of the substrate 12. In the present embodiment, since the regions 46/48/5 are each including at least a portion of the wiring region, the insulating layer 32 preferably covers most of the second surface % of the flexible substrate 22, including the regions 46/48/50. However, the present invention is not limited thereto, and the present invention selectively coats the insulating layer 32 with the region 46, the region 48 or the region 50 depending on the product requirements. This design is also within the scope of the present invention. In accordance with the structure disclosed above with reference to Figures 1 through 4, the present invention further discloses a method of fabricating a flexible printed circuit board 14. The flexible printed circuit board 14 is applied to a substrate 12 such as a liquid crystal display panel or a touch panel, and the flexible printed circuit board 14 includes a flexible substrate 22 and an insulating layer 32. The method disclosed in this embodiment is mainly to form an insulating layer 32 having at least one opening 4 by die stamping, and then attaching the insulating layer to the flexible substrate 22. In addition, according to the structure disclosed in the above embodiments, the present invention further discloses a manufacturing method of the display state, which firstly punches out a 'brim edge layer 32 having at least one opening 4 以, and then attaches the insulation. Layer 32 is on a flexible substrate 22. Then, the flexible substrate 22 with the insulating layer 32 is fixed on the side of the substrate 12 (such as a liquid crystal display panel or a touch panel, etc.) - the upper surface Φ 26 ' wire re-folds the flexible substrate 22 and makes the soft 201114337 substrate 22 The other side is close to the lower surface of one of the substrates 12, 30"". The present invention mainly utilizes a layer composed of a poly (Alumina) (10) thin film (10) to cover a flexible substrate, and is formed in the insulating layer. Opening and at least exposing the flexible substrate relative to the substrate. The preferred embodiment of the present invention has an open insulating layer for the flexible substrate mainly for the edge of the flexible printed circuit board and the shape of the soft printed circuit board itself. The turning limb with a turning point of appearance provides a function of reinforcing and shielding the tilting. When the brittle flexible substrate is folded back, the structure of the substrate itself is not too single_(4), and the flexible substrate can be prevented from being displayed by the liquid crystal panel = panel edge Moreover, the flexible substrate is subjected to the winding stress and the number of times of winding resistance. By virtue of the covering design of the open insulating layer, the present invention can maintain the impurity recovery of the single-layer, double-layer or multi-layer board structure. And the wrap-around characteristics 状况 under the condition of greatly improving the tear strength and the folding resistance of the flexible printed circuit board of the single-layer structure, the reliability and stability of the group are satisfied. The preferred implementation _ dew as above, Cai _ _ limit - the present invention, any of the skills of the artist, in the spirit of the invention and the scope of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a display module according to a preferred embodiment of the present invention. FIG. 2 is a cross-sectional view of the display module of FIG. Fig. 3 is an enlarged schematic view of the first surface of the flexible substrate. Fig. 4 is an enlarged schematic view of the second surface of the flexible substrate. [Description of main components] 201114337 10 Display module 12 Substrate 14 Flexible printed circuit board 16 Display area 18 Peripheral circuit area 20 drive wafer 22 flexible substrate 26 upper surface 28 side wall 30 lower surface 32 insulating layer 34 first surface 36 second surface 38 electronic component 40 opening 42 long side 44 short side 46 area 4 8 area 50 area