201113994 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種形成窗式球柵陣列（window BGA )封 裝預基板的方法。特定言之，本發明係關於一種使用複合基 材來形成窗式球柵陣列封裝預基板的方法，而得節省製程時 間與材料成本之優點。 【先前技術】 隨著電子產品輕薄短小的需求，封裝技術的發展亦朝向-模組化、大規模積集化以節省封裝構件的體積。在封裝技術 的發展上，晶片接合技術由過去的打線接合（wire bonding) 技術，發展至目前的覆晶（flip-chip)接合技術或是窗式球 柵陣列（window BGA )封裝技術。 第1A至第1D圖例示先前技藝形成窗式球柵陣列封裝 基板的方法。如第1A圖所示，首先在基材101上鑽孔形成 治具孔102，供作後續步驟之對準/對位之用。基材101之第 一面111與第二面112均覆蓋有銅箔，作為日後形成電路圖 案之基礎。其次，如第1B圖所示，使用習知之方式，例如 乾膜配合微影與蝕刻，將基材101之第一面111圖案化，而 形成所需之電路圖案111’。同時，第二面112上之銅箔則被 完全蝕除。 接下來，如第1C圖所示，進行防焊印刷步驟，將綠漆 201113994 120覆蓋住部分的基材101與電路圖案111’，而暴露出部分 的電路圖案111’，於是形成複數個電連接點111’，作為曰後 金手指或是焊球墊之用。繼續，如第1D圖所示，使用保護 層130分別覆蓋基材101之電連接點111’。然後就可以使用 傳統方法，在基材101上形成所需要的開口 160。可以使用， 例如濕膜覆蓋法或是打孔法，來形成所需要的開口 160。最 後切割成形，即得所需之窗式球柵陣列封裝基板100。 • 然而，以上所述之方法卻有諸多缺點。第一，每一個單 次流程完成後，只能得到單一張基材成品，不但耗時又耗人 力。第二，單一基材的兩面都有銅箔，卻又需要將其中一面 上之銅箔完全蝕除，在原物料價格高昂的時候，不但浪費原 料又徒增基材與蝕刻藥水的成本。第三，蝕刻廢液中含有大 量污染環境的重金屬銅離子。處理銅離子廢液又是另一項成 本上的負擔。所以仍然急需一種新穎的製造方法，來徹底解 Φ 決這個問題。 【發明内容】 本發明於是提供一種形成窗式球栅陣列封裝預基板的 方法。首先，提供複合基材。此複合基材包含第一基材與第 二基材。第一基材與第二基材又分別包含第一面與第二面。 其中，只有第一面與第二面之其中一者具有銅。其次，在複 合基材上形成複數個板治具孔。之後，進行一蝕刻製程，以 圖案化第一基材之第二面與第二基材之第二面上之銅，而形 201113994 成第-基材之圖案化銅與第二基材之圖案化銅。繼續，以— 防焊層覆蓋第-基材之圖案化鋼與第二基材之圖案化鋼，同 時暴露出部分之圖案化銅以形成複數個電連接點。然後，以 保護層覆蓋第-基材之電連接點與第二基材之電連接點。接 著，將複合基材分離，而分別得到第—基材與第二基材十 後’分別在第基材與第二基材上形成複數個條治具孔 來，分別在第-基材之第—面與第二基材之第—面上形成一 對位標記，於是得到窗式球柵陣列封裝預基板。 本發明又提供—種窗式球栅陣贿裝基板。本發明之窗 式球柵陣韻.裝基板包含基材、開σ、複數㈣連接畔 焊層。基材包含第-面與第二面。開σ連通第—面盘第;; 面。複數個電連接點何第二面上並職開口。防焊層覆蓋 基材’並暴露出複數個電連接點。本發明窗式球栅陣列封襄 基板之特徵在於：位於第—面上之對位標記，其實質上可二 由一非金屬性材料所組成。 本心月方法的優點之一在於，可以使用包含兩組單一基 材之複合基材，而在—讀程完錢就可以同時得到兩張基 材成品，節省了製造時間與人力成本。另外，單-基材的^ 面中僅需-面具有銅’因此又可以在原物料價格高昂的時 候，明顯降低闕基材的成本。這實在是—種—舉兩得的技 術解决方案。還有，經由本發明方法所製得的窗式球拇陣列 ’于裝土板位於基材成品其中一面上的對位標記，可以不需 要包含銅金屬，而實質上由-非金屬性材料所組成。 201113994 【實施方式】 本發明首先提供一種开>成窗式球栅陣列封裝預基板的 方法。第2A圖至第21圖例示本發明形成窗式球栅陣列封裝 預基板方法的一較佳實施例。一開始，如第2A圖所示，提 供複合基材201。複合基材201之特點為包含第一基材21〇 與第二基材220。第一基材210包含第一面211與第二面 鲁 212，而第二基材220分別包含弟一面221與第二面222。第 一基材210與第二基材220只有其中一面需要覆蓋有銅箔。 例如，第一基材210之第二面212與第二基材220之第二面 222覆蓋有銅箔。此時，第一基材21〇之第一面211與第二 基材220之第一面221直接接觸。例如，第一基材21〇之第 一面211及/或第二基材220之第一面221的至少一面的一邊 203上包含一黏著劑202 ’而固定第一基材210與第二基材 φ 220 ’同時使得第一基材21〇之第一面211與第二基材220 之第一面221直接接觸。 其次’如第2B圖所示，在複合基材201上形成複數個 板治具孔204。可以使用習知之方式，例如鑽針鑽孔，在複 合基材201的四邊203上形成複數個板治具孔204，作為後 續步驟之對準/對位基礎。 之後，如第2C圖所示，進行一蝕刻製程。例如，此蝕 刻製程會圖案化第一基材21〇之第二面212與第二基材220 之第二面222上之銅，而形成第一基材210之圖案化銅212, 201113994 與第二基材220之圖案化銅222’。可以使用習知之方式，例 如乾膜配合微影與蝕刻，而在第一基材210之第二面212上 與第二基材220之第二面222上，形成所預定之線路圖案。 本發明方法的優點之一在於，由於第一基材210與第二基材 220只有一面覆蓋有銅箔，所以不需要如傳統方法還要移除 另一面之銅箔’而僅需要分別圖案化第一基材210與第二基 材22〇之單面即可。如此一來，不但可以節省進行姓刻製程 之時間’還可以延長蝕刻溶液之壽命，大大降低了本發明窗 式球栅陣列封裝預基板生產製造的成本。 繼續’如第2D圖所示，以一防焊層230覆蓋第一基材 210之圖案化銅212’與第二基材220之圖案化銅222，，同 時暴露出部分之圖案化銅212，/222，以形成複數個電連接 點212’’/222”。此等防焊層23〇可以使用習知之材料，例如 綠漆，而根據預定之電路圖案，來覆蓋第一基材210之圖案 化銅212與苐一基材220之圖案化銅222’ ，於是就可以 知*到暴露出之複數個電連接點212，，/222”。複數個電連接點 212 /222可以包含，例如金手指231與焊球墊232。在本發 明一較佳實施態樣中’好指231 S可以呈環狀排列。^ 然後，如第2E圖所示，以保護層24〇分別覆蓋第一基 材210之電連接點212”與第二基材22〇之電連接點222，，二 保護層之材料可以為金屬或是合金。例如，保護層24〇 可以包3金與鎳之至少—者。在本發明—較佳實施態樣中， 可以先使用鎳來覆蓋複數個電連接點212，’/222”，再使用金 201113994 來覆蓋鎳，以徹底杜絕氧氣或水氣的潛在傷害。 接著’如第2F圖所示，將複合基材201中之第一基材 210與第一基材220分開。較佳者，在本發明一較佳實施態 樣中，分開複合基材201中之第一基材210與第二基材22〇 之時，還可以一併移除複合基材2〇1之四邊203之黏著劑 202。在本發明另一較佳實施態樣中，分開複合基材2〇ι中 之第基材21〇與第一基材220之時，還可以一併移除複數 •個板治具孔204，而分別得到圖案化過之第一基材210與圖 案化過之第二基材220。 隨後，如第2G圖所示，分別在第一基材21〇與第二基 材220上形成複數個條治具孔2〇5。可以使用習知之方式， 例如鑽針鑽孔，分別在第一基材21〇與第二基材22〇上分別 形成複數個條治具孔205，作為以後步驟之對準/對位基礎。 再來，如第2H圖所示，分別在第一基材21〇之第二面 • 212與第二基材220之第二面222上形成對位標記200，於 是得到窗式球柵陣列封裝預基板250。只要能為機器所判 讀，可以使用多種不同之方法來形成對位標記2〇6。例如， 可以使用雷射以形成對位標記206。或是，可以使用白漆以 形成對位標記206。另外’對位標記206亦可以包含金屬材 料或是非金屬材料。如果考慮到傳統機台的對位機制時，對 位標記206可以包含金屬或金屬化合物，例如銅、銀或銀膏、 銅膏、錫膏。對位標記206亦可以包含非金屬性材料，或是 由非金屬性材料所組成。非金屬性材料例如是非金屬，例如 201113994 白漆'綠漆、藍漆、黑漆等等。 接下來，如第21圖所示，還可以使用一習知之方法， 在窗式球栅陣列封裝預基板250上，繼續形成—開口 26〇。 可以使用，例如濕膜覆蓋法或是打孔法，來形成所需要的開 口 260。開口 260連通同一基材之第一面與第二面例如第 一基材210之第一面211與第二面212，或是第二基材22〇 之第一面221與第二面222 ,而使得複數個電連接點 212”/222”環繞開口 260,於是得到一窗式球柵陣列封裝基板 200。 經過以上方法’即可以得到一窗式球柵陣列封裝預基板 200’如第21圖所示。本發明之窗式球栅陣列封裝基板2〇〇， 包含基材270、開口 260、複數個電連接點273與防焊層23〇。 基材270包含第-面271與第二面奶。開〇 26〇連通第一 面27!與第二面272。複數個電連接點奶位於第二面⑺ 上並環繞開口 260。防焊層23〇覆蓋基材，，並暴露出複 數個電連接點212，，/222”之-。本發明窗式球桃陣列封裝基 板之特徵在於位於第二面272上之對位標記綱，其實質上 由一非金屬性材料所組成。 只要能為機器所判讀，可以使用多種不同之材料來形成 對位標記206。例如，可以使用白漆以形成對位標記雇。 另外，對位L亦可以包含金屬持料或是非金屬材料。 如果考慮到傳統機台的對位機制時，對位標記施可以包含 金屬或是金屬化合物，例如銅、銀或银膏、銅膏、錫膏。要 201113994 不然，對位標記206亦可以包含非金屬性材料，或是由非金 屬性材料所組成。非金屬性材料例如可以是非金屬，例如， 白漆、綠漆、藍漆、黑漆等等。 以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍 所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 【圖式簡單說明】 第1A至第1D圖例示切技藝形成窗式球栅陣列 基板的方法。 展 預 第2A圖至第21圖例示本發明形成窗式球拇陣列 基板方法的一較佳實施例。 又 【主要元件符號說明】 1 〇〇窗式球栅p車列封裝基板 ιοί基材 102治具孔 111第一面 11Γ電連接點/電路圖案 112第二面 120綠漆 160 開口 20〇窗式球柵陣列封裝基板201113994 VI. Description of the Invention: [Technical Field] The present invention relates to a method of forming a window ball grid array (window BGA) package pre-substrate. In particular, the present invention relates to a method of forming a window ball grid array package pre-substrate using a composite substrate, thereby saving the advantages of process time and material cost. [Prior Art] With the demand for light and thin electronic products, the development of packaging technology is also oriented toward modularization and large-scale accumulation to save the volume of package components. In the development of packaging technology, wafer bonding technology has evolved from the past wire bonding technology to the current flip-chip bonding technology or window BGA packaging technology. 1A through 1D illustrate a prior art method of forming a window ball grid array package substrate. As shown in Fig. 1A, a jig hole 102 is first drilled in the substrate 101 for alignment/alignment of subsequent steps. The first side 111 and the second side 112 of the substrate 101 are covered with a copper foil as a basis for forming a circuit pattern in the future. Next, as shown in Fig. 1B, the first side 111 of the substrate 101 is patterned by a conventional method such as dry film matching lithography and etching to form a desired circuit pattern 111'. At the same time, the copper foil on the second side 112 is completely etched away. Next, as shown in FIG. 1C, a solder resist printing step is performed to cover a portion of the substrate 101 and the circuit pattern 111' with the green paint 201113994 120, thereby exposing a portion of the circuit pattern 111', thus forming a plurality of electrical connections. Point 111', used as a gold finger or solder ball pad. Continuing, as shown in Fig. 1D, the protective layer 130 is used to cover the electrical connection points 111' of the substrate 101, respectively. The desired opening 160 can then be formed on the substrate 101 using conventional methods. The desired opening 160 can be formed using, for example, a wet film overlay or a perforation process. The final cut is formed to obtain the desired window type ball grid array package substrate 100. • However, the methods described above have a number of disadvantages. First, after each single process is completed, only a single substrate can be obtained, which is time consuming and labor intensive. Second, there is copper foil on both sides of a single substrate, but the copper foil on one side needs to be completely etched away. When the price of the original material is high, not only the original material but also the cost of the substrate and the etching solution are wasted. Third, the etching waste liquid contains a large amount of heavy metal copper ions that pollute the environment. Handling copper ion waste is another cost burden. Therefore, there is still a need for a novel manufacturing method to completely solve this problem. SUMMARY OF THE INVENTION The present invention therefore provides a method of forming a window ball grid array package pre-substrate. First, a composite substrate is provided. The composite substrate comprises a first substrate and a second substrate. The first substrate and the second substrate further comprise a first side and a second side, respectively. Among them, only one of the first side and the second side has copper. Next, a plurality of plate jig holes are formed on the composite substrate. Thereafter, an etching process is performed to pattern the second surface of the first substrate and the second surface of the second substrate, and the shape of the patterned substrate of the first substrate and the second substrate is 201113994. Copper. Continuing, the patterned steel of the first substrate and the patterned steel of the second substrate are covered by a solder mask, while a portion of the patterned copper is exposed to form a plurality of electrical connection points. Then, the electrical connection point of the electrical connection point of the first substrate and the second substrate is covered with a protective layer. Next, the composite substrate is separated, and the first substrate and the second substrate are respectively obtained to form a plurality of strip holes on the first substrate and the second substrate, respectively, in the first substrate. A first pair of marks are formed on the first surface of the first substrate and the second substrate, thereby obtaining a window type ball grid array package pre-substrate. The invention further provides a window type ball grid array bristle substrate. The window type ball grid array of the present invention comprises a substrate, an open σ, and a plurality (four) connection side solder layer. The substrate includes a first side and a second side. Open σ to connect the first - face plate;; face. Multiple electrical connection points on the second side of the joint opening. The solder mask covers the substrate' and exposes a plurality of electrical connection points. The window type ball grid array sealing substrate of the present invention is characterized in that the alignment mark on the first surface is substantially composed of a non-metallic material. One of the advantages of this monthly method is that a composite substrate comprising two sets of single substrates can be used, and two base products can be obtained at the same time as the reading is completed, saving manufacturing time and labor costs. In addition, only the surface of the single-substrate has copper on the surface, so that the cost of the base material can be significantly reduced when the price of the raw material is high. This is really a technical solution for both. Further, the acicular ball array "made by the method of the present invention" may be provided on the one side of the finished substrate on the side of the finished substrate without the inclusion of copper metal, but substantially by the non-metallic material. composition. [2011] [Embodiment] The present invention first provides a method of encapsulating a pre-substrate by a windowed ball grid array. 2A through 21 illustrate a preferred embodiment of the method of forming a window type ball grid array package pre-substrate of the present invention. Initially, as shown in Figure 2A, a composite substrate 201 is provided. The composite substrate 201 is characterized by comprising a first substrate 21A and a second substrate 220. The first substrate 210 includes a first surface 211 and a second surface 212, and the second substrate 220 includes a second side 221 and a second side 222, respectively. Only one of the first substrate 210 and the second substrate 220 needs to be covered with a copper foil. For example, the second side 212 of the first substrate 210 and the second side 222 of the second substrate 220 are covered with a copper foil. At this time, the first surface 211 of the first substrate 21 is in direct contact with the first surface 221 of the second substrate 220. For example, the first substrate 211 of the first substrate 21 and/or the side 203 of at least one surface of the first surface 221 of the second substrate 220 includes an adhesive 202 ′ to fix the first substrate 210 and the second substrate. The material φ 220 ′ simultaneously causes the first surface 211 of the first substrate 21 to be in direct contact with the first surface 221 of the second substrate 220 . Next, as shown in Fig. 2B, a plurality of plate jig holes 204 are formed on the composite substrate 201. A plurality of plate jig holes 204 may be formed on the four sides 203 of the composite substrate 201 in a conventional manner, such as by drilling a hole, as an alignment/alignment basis for subsequent steps. Thereafter, as shown in FIG. 2C, an etching process is performed. For example, the etching process may pattern the copper on the second side 212 of the first substrate 21 and the second side 222 of the second substrate 220 to form the patterned copper 212 of the first substrate 210, 201113994 and The patterned copper 222' of the two substrates 220. The predetermined pattern of lines can be formed on the second side 212 of the first substrate 210 and the second side 222 of the second substrate 220 by conventional means, such as dry film lithography and etching. One of the advantages of the method of the present invention is that since only one side of the first substrate 210 and the second substrate 220 is covered with copper foil, there is no need to remove the copper foil of the other side as in the conventional method, and only need to be separately patterned. The first substrate 210 and the second substrate 22 may be formed on one side. In this way, not only can the time for the surname process be saved, but the life of the etching solution can be prolonged, and the cost of manufacturing the pre-substrate of the window ball grid array package of the present invention is greatly reduced. Continuing, as shown in FIG. 2D, the patterned copper 212' of the first substrate 210 and the patterned copper 222 of the second substrate 220 are covered with a solder mask 230, and at the same time, a portion of the patterned copper 212 is exposed. /222, to form a plurality of electrical connection points 212"/222". These solder resist layers 23 can be covered with a conventional material, such as green paint, to cover the pattern of the first substrate 210 according to a predetermined circuit pattern. The copper 212 and the patterned copper 222' of the substrate 220 are then known to be exposed to a plurality of electrical connection points 212, /222". A plurality of electrical connection points 212 / 222 may include, for example, gold fingers 231 and solder ball pads 232. In a preferred embodiment of the invention, the good fingers 231 S may be arranged in a ring shape. Then, as shown in FIG. 2E, the electrical connection points 212 222 of the first substrate 210 and the electrical connection points 222 of the second substrate 22 are respectively covered by the protective layer 24 ,, and the material of the second protective layer may be metal. Or an alloy. For example, the protective layer 24 can contain at least 3 gold and nickel. In the preferred embodiment of the invention, nickel can be used to cover a plurality of electrical connection points 212, '/222", Use gold 201113994 to cover the nickel to completely eliminate the potential damage of oxygen or moisture. Next, as shown in Fig. 2F, the first substrate 210 in the composite substrate 201 is separated from the first substrate 220. Preferably, in a preferred embodiment of the present invention, when the first substrate 210 and the second substrate 22 in the composite substrate 201 are separated, the composite substrate 2〇1 may be removed together. Adhesive 202 on four sides 203. In another preferred embodiment of the present invention, when the first substrate 21〇 of the composite substrate 2〇 is separated from the first substrate 220, a plurality of plate fixture holes 204 may be removed at the same time. The patterned first substrate 210 and the patterned second substrate 220 are obtained, respectively. Subsequently, as shown in Fig. 2G, a plurality of jig holes 2〇5 are formed on the first substrate 21〇 and the second substrate 220, respectively. A plurality of strip holes 205 may be formed on the first substrate 21 and the second substrate 22, respectively, by a conventional method, such as drilling a hole, as an alignment/alignment basis for the subsequent steps. Then, as shown in FIG. 2H, alignment marks 200 are formed on the second surface 212 of the first substrate 21 and the second surface 222 of the second substrate 220, respectively, thereby obtaining a window type ball grid array package. Pre-substrate 250. As long as it can be interpreted by the machine, a number of different methods can be used to form the alignment mark 2〇6. For example, a laser can be used to form the alignment mark 206. Alternatively, white paint can be used to form the alignment mark 206. Alternatively, the alignment mark 206 may also comprise a metallic material or a non-metallic material. If the alignment mechanism of the conventional machine is taken into consideration, the alignment mark 206 may contain a metal or a metal compound such as copper, silver or silver paste, copper paste, solder paste. The alignment mark 206 may also comprise a non-metallic material or be composed of a non-metallic material. Non-metallic materials such as non-metals, such as 201113994 white paint 'green paint, blue paint, black paint, and the like. Next, as shown in Fig. 21, it is also possible to continue forming the opening 26 on the window type ball grid array package pre-substrate 250 by a conventional method. The desired opening 260 can be formed using, for example, a wet film overlay or a perforation process. The opening 260 is connected to the first surface and the second surface of the same substrate, for example, the first surface 211 and the second surface 212 of the first substrate 210, or the first surface 221 and the second surface 222 of the second substrate 22, The plurality of electrical connection points 212"/222" surrounds the opening 260, thereby obtaining a window type ball grid array package substrate 200. After the above method, a window type ball grid array package pre-substrate 200' can be obtained as shown in Fig. 21. The window type ball grid array package substrate 2 of the present invention comprises a substrate 270, an opening 260, a plurality of electrical connection points 273 and a solder resist layer 23A. Substrate 270 includes a first side 271 and a second side milk. The opening 26 is connected to the first side 27! and the second side 272. A plurality of electrical connection points are located on the second side (7) and surround the opening 260. The solder resist layer 23 covers the substrate and exposes a plurality of electrical connection points 212, /222". The windowed ball array package substrate of the present invention is characterized by a alignment mark on the second surface 272. It consists essentially of a non-metallic material. As long as it can be interpreted by the machine, a number of different materials can be used to form the alignment mark 206. For example, white paint can be used to form the alignment mark. L may also contain metal holding materials or non-metallic materials. If considering the alignment mechanism of the conventional machine, the alignment mark may contain metal or a metal compound such as copper, silver or silver paste, copper paste, solder paste. To 201113994, the alignment mark 206 may also comprise a non-metallic material or be composed of a non-metallic material. The non-metallic material may be, for example, a non-metal such as white paint, green paint, blue paint, black paint, etc. The above is only the preferred embodiment of the present invention, and all the equivalent changes and modifications made by the scope of the present invention should be within the scope of the present invention. [Simplified Schematic] 1A to 1D illustrates a method of forming a window type ball grid array substrate by a cutting technique. A second embodiment of the present invention exemplifies a preferred embodiment of the method for forming a window ball array substrate according to the present invention. 〇〇 式 球 p 车 车 车 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材 基材
11 201113994 201複合基材 202黏著劑 203邊 204板治具孔 205條治具孔 206對位標記 210第一基材 211第一面 212第二面 212’ /222’圖案化銅 212”/222”電連接點 220第二基材 221第一面 222第二面 230防焊層 231金手指 232焊球墊 240保護層 250窗式球柵陣列封裝預基板 260 開口 270基材 271第一面 272第二面 201113994 273電連接點11 201113994 201 composite substrate 202 adhesive 203 side 204 plate fixture hole 205 jig hole 206 alignment mark 210 first substrate 211 first face 212 second face 212' / 222 'patterned copper 212" / 222 Electrical connection point 220 second substrate 221 first surface 222 second surface 230 solder mask 231 gold finger 232 solder ball pad 240 protective layer 250 window ball grid array package pre-substrate 260 opening 270 substrate 271 first side 272 Second side 201113994 273 electrical connection point