201112373 六、發明說明： 【發明所屬之技術領域】 本創作係有關一種導線架之製造方法，特別指一種具 有保護結構之導線架的製造方法。 【先前技術】 隨著科技不斷進步，發光二極體（LED；)以大幅應用 於各種照明、燈具等領域。發光二極體之固態照明具有體 積小、發光效率佳、壽命長、可靠度高、不易破損、無熱 幸田射、無水銀污染、耗能少等優勢，不但是節能、環保且 女全之照明，且因其高彩度特性，也成為平面顯示器之下 世代月光光源，而成為各國產學研的重要研究領域，也是 廣受矚目的明星產業。 在一般的發光二極體的使用上，發光二極體係固晶嗖 置於-金屬技上，_金屬支架達錢接電訊號/控制訊 號以及散熱等功能。而上述金屬支架會裝設有晶片模座， 以利發光二極體的固晶及後續的樹脂封裝製程。、 但是由於晶片模座的製造，是藉由塑膠射出模具在該 金屬支架上利用射出方法所製成’且利用模具上的擋二 構阻播塑料流至導電端子之間的空隙，但塑膠射出時所告 成的液態塑料的竄流以及射出壓力，即可能造成 7 之結構變形。另外，上述在射出成型的製程中，可能= 現罪破位置不穩定，而造成溢膠等不當的情況。 201112373 再方面，由於導電端子等金屬物件可能受到夠 而導致金屬表面的刮傷，而影 電而子在傳廷電流或訊號上的品質。 計發明人有感上述缺失之可改善，提出一種設 & 有效改善上述缺失之本發明。 【發明内容】 去’太J之主要目的’在於提供-種導線架之製造方 法，该方法係在射出步驟中將塑料填滿於相鄰的導電 之間的裸空部’以補強下料.S μ ?此 提高所生產之導線架料帶的品^ 之強度’進而 造方;=之==發=提供-種導線架之製 ϋΐ上形成複數個導線架，每一該導線架包含有至少 列設置係對應地排 成有-裸空部。接著，射出相;"的嶋電端子之間形 上，以㈣”塑膠材料於每一該導線架 料更於每—該導線架上，且該塑膠材 -保護結構;接下；=;子::01的該裸空部h 端子，並且移除該保護結折步驟，以彎折該些導電 在導線架之製造方法’步驟如下·· 架，每一兮導後举μ/驟，使該基板形成複數個導線 端子二η 少—個功能區及複數個導電 、子’w電端子係對應地排列設置於該功能區的兩 201112373 側’而相㈣該些導電端子之間 沖屋步驟令同時對該些導電端子進且在本 塑膠材料於每—該導線架上以成型—斤=者’射出— 膠材料更填入相鄰的該些導電;;片且該塑 成一保護結構。 4的忒稞空部，以形 ^發明具有以下有益的效果：本發明 法，利用射出方法成型該晶片承載座，同時二方 兩於相心Μ子之間_空部，以形成該保護 一的強度Μ—物 為使旎更進一步瞭解本發明之特徵及技術内容，請泉 閱町有關本發明之詳細說明與附圖，然而所附圖式^提 供參考與說明用，並非用來對本發明加以限制者。 【實施方式】201112373 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a method of manufacturing a lead frame, and more particularly to a method of manufacturing a lead frame having a protective structure. [Prior Art] With the continuous advancement of technology, light-emitting diodes (LEDs) have been widely applied in various fields such as lighting and lamps. The solid-state lighting of the light-emitting diode has the advantages of small volume, good luminous efficiency, long life, high reliability, not easy to break, no heat, good field radiation, no mercury pollution, low energy consumption, etc., not only energy saving, environmental protection, but also full lighting. Because of its high chroma characteristics, it has also become a generation of moonlight sources under the flat-panel display, and has become an important research field of production, education and research in various countries, and is also a star industry that has attracted much attention. In the use of general light-emitting diodes, the light-emitting diode system is placed on the metal technology, and the metal brackets are connected to the power signal/control signal and heat dissipation. The metal holder is provided with a wafer mold base for the solid crystal of the light-emitting diode and the subsequent resin packaging process. However, since the manufacture of the wafer mold base is made by the injection molding method on the metal bracket by the plastic injection mold, and the plastic material on the mold is used to block the plastic material from flowing to the gap between the conductive terminals, the plastic injection is performed. The turbulent flow of the liquid plastic and the injection pressure at the time may cause structural deformation of 7. In addition, in the above-described process of injection molding, it is possible that the position of the current sin is unstable, which may cause an improper situation such as overflowing of glue. 201112373 On the other hand, because metal objects such as conductive terminals may be adequately damaged, the surface of the metal is scratched, and the quality of the image is reflected in the current or signal. The inventors have felt that the above-mentioned deficiency can be improved, and proposes a present invention which effectively improves the above-mentioned deficiency. SUMMARY OF THE INVENTION The main purpose of the 'too J' is to provide a method of manufacturing a lead frame, which is to fill the plastic between the adjacent conductive spaces in the injection step to reinforce the blanking. S μ ? This improves the strength of the product of the lead frame strip produced by the manufacturing method; and ============================================================================= At least the column arrangement is correspondingly arranged with a bare-empty portion. Next, the injection phase; " the electrical terminal between the shape, with (four) "plastic material on each of the wire frame material on each of the lead frame, and the plastic material - protection structure; Sub::01 the bare space h terminal, and remove the protective folding step to bend the conductive in the lead frame manufacturing method 'steps as follows · frame, each 兮 guide after the μ / step, The substrate is formed into a plurality of wire terminals, and the plurality of functional regions and the plurality of conductive and sub-w electrical terminals are arranged correspondingly on the two sides of the functional zone, and the phase (4) is between the conductive terminals. The step is to enter the conductive terminals at the same time, and the plastic material is formed on each of the lead frames by molding, and the glue material is further filled into the adjacent conductive materials; the sheet is molded into a protective structure. The hollow portion of the invention has the following beneficial effects: the method of the present invention, the wafer carrier is formed by an injection method, and the two sides are separated from each other by a hollow portion to form the protection. The strength of one is to further understand the characteristics of the present invention and Surgery content, Izumi-cho detailed description read with the accompanying drawings relating to the present invention, however ^ the accompanying drawings and described with reference provides, not intended to limit the invention to those. [Embodiment
請參閱第一圖至第三圖，本發明係提供一種導線架之 製造方法，本發明提出一種導線架之製造方法，其係用以 製作一種導線架1 〇，導線架1 0係規則地排列於一基板 1上’以利後續的生產流程。每一個導線架1〇具有一晶 片承載座1 0 1以及複數個排列於晶片承载座1 〇 1兩 侧的導電端子1 0 2，且位於該晶片承載座1 0 1之同側 的導電端子10 2之間形成有裸空部1 〇 3，該裸空部1 0 3中係填入有一保護結構1 〇 5，該保護結構1 〇 5可 補強下料時晶片承載座1 〇 1的強度，且該保護結構1 ◦ 5可避免導電端子1 〇 2或其他金屬料件的壓傷問題。其 201112373 製造方法包括如下步驟： 乂驟（a ) k供一基板1 ’其大致上為一金屬薄板， 並於該基板上施以—沖壓製程，使該基板1形成複數個導 線架1 0。如第二圖所示，該基板1上包含有複數個具有 功能區100及導電端子102的導線架1〇，而在本具 體實施例中，複數個該導線架丄〇係規則地排列於該導線 架料帶上，每一該導線架10包含有一功能區1 〇 〇及三 組導電端子1 0 2，該三組係相互對應地排列設置於該功 能區1 0 〇的兩側，且相鄰的導電端子丄〇 2之間形成有 一裸空部103，且該每一導電端子1〇2具有一外側端 1 0 2 2及一内側端1 〇 2 1。 另外，§亥基板1可採用鐵或銅材質的底材薄片，而在 知以冲壓製知之後，該基板1可再進行一電鑛步驟，例如 包括鍍底銅、鍍鎳、鍍銀等電鍍製程，以得到更好的防銹 效果，亦可增加導線架料帶的硬度。 步驟（b)射出一塑膠材料。請參閱第二a圖及第三 圖，利用射出成型技術於每一該導線架丄〇上成型有一晶 片承載座1 0 1，該晶片承載座i 0丄係覆蓋於該功能區 1 0 0上，並裸露出該功能區1 0 〇的中央位置；同時該 晶片承載座1 0 1更使該些導電端子i 〇 2的内側端^ 0 2 1裸路於晶片承載座1 Q 1内部，並使該些導電端子 1 0 2的外側端1 0 2 2延伸凸設於該晶片承載座工〇 1的外部。再者，在本步驟中，更將該塑膠材料填入相鄰 的導電端子1 0 2的外側端1 ◦ 2 2之間的裸空部工〇 201112373 3，以形成保護結構1 〇 5。 再-方面，在本具體實施例中，每—個導線架丄〇更 包括四個固定腳1 0 4，該四個固定腳工〇4係由該功能 區1 ο 〇向晶片承載座1〇1的外側延伸；而該些固定腳 • 104大致上係成型於該晶片承載座1〇1的四個角落 位置，而每一固定腳丄〇4與其相鄰之導電端子丄〇 2白^ 外側端1 0 2 2之間同樣形成有上述之裸空部1 〇 3，因 此該保護結構1 〇 5則同樣地填滿位於固定腳i 〇 4與 • 其相鄰之導電端子1 0 2之間的裸空部丄〇 3。 /、 如第三A圖至第三d圖所示，為了達到較佳的保護 功能，該保護結構i 〇 5之肉厚D1係大於該些導電端子 1 0 2之肉厚D2,以使該保護結構丄〇 5得以避免該些 導電端子1 0 2的金屬表面受到模具的壓傷。例如，該保 護結構1 0 5的肉厚D1係大於該些導電端子丄〇 2的肉 厚D2，且該保護結構1 〇 5可具有上凸下平、上下皆凸、 _ 上平下凸或上下皆平等各種態樣。 因此，在上述步驟之後，即可於基板i製成複數個導 線架1 0，每一個導線架1〇具有-晶片承載座1〇工以 及複數個排列於晶片承載座i 0 i兩側的導電端子工0 2，且位於該晶片承載座1 〇 1之同側的導電端子1 〇 2 之間形成有裸空部i 〇 3，該裸空部i 〇 3中係填入有一 保護結構1 〇 5，該保護結構1 0 5即可避免導電端子工 0 2或其他金屬料件的壓傷問題。 201112373 而在後製程部分，該些導電端子i 〇 2必須經過彎 折，以形成焊接腳位；且保護結構2 〇 5也必須加以去 除。以下說明三種實施的方式： 方式1、在彎折該些導電端子工〇2的同時，移除該 保護結構1 0 5。換言之，在同一步驟中，利用工具同時 彎折該些導電端子1 〇 2及折斷該保護結構i 〇 5，以將 該保護結構1 0 5自該晶片承載座i 〇 2上移除。 方式2、先移除該保護結構i 〇 5，再彎折該些導電 端子1 0 2，換言之，利用不同的工序步驟，先折斷該保 護結構1 0 5，再進行彎折該些導電端子的動作。 方式3先移除该些導電端子1 〇 2，再彎折該保護 結構1 0 5。 因此最後成型之導線架料帶即可出貨給下游廠商。 下游廠商將固定腳104切斷分離後（如第四圖所示）， 可於晶片承載座1〇1中的功能區1〇 〇上固設至少一 個發光-極體晶片’同時利用導線連接發光二極體晶片以 及導電端子1 02，再利用封裝材料填人晶片承載座1 〇 1，使發光二極體晶片與導線包覆於封裝材料内部，即可 構成一發光二極體單元。 °月參考第五圖’其為本發明之第二實施例，包括以下 步驟（請同時參考第六圖及第七圖）： 二步驟（a )提供一基板1，其大致上為一金屬薄板， 亥基板1上施以—沖壓製程使該基板丄上形成複數 個導線架1 〇。如第一實施例之第二圖所示，該基板工上 201112373 包含有至少一個功能區i 〇 0及導電端子丄〇 2的導線 架1 0，而在本具體實施例中，複數個該導線架丄〇係規 則地排列於該基板1上，每一該導線架1〇包含有一功能 區1 0 0及二組導電端子1 〇 2，該三組係相互對應地排 列设置於該功能區1 0 0的兩側，且相鄰的導電端子1 〇 2之間形成有一裸空部丄〇 3。在本步驟申，更針對導電 端子1 0 2進行沖壓成型；換言之，本實施例的沖壓步驟 係同時利用沖壓成型該基板i及導電端子1 〇 2，以使導 鲁電端子1 0 2具有彎折的結構。 另外，該基板1可採用鐵或銅材質的底材薄片，而在 施以沖壓製程之後，該基板丄可再進行一電鑛步驟，例如 包括鑛底銅、鑛鎳、鑛銀等電鑛製程，以得到更好的防錄 效果’亦可增加導線架料帶的硬度。 步驟（b)射出一塑膠材料。請參閱第六圖及第七圖， 利用射出成型技術於每一該導線架丄◦上成型有一晶片 藝承載座1〇 1，該晶片承載座ii係覆蓋於該功能區丄 〇 0上’並裸露出該功能區1Q G的中央位置；同時該晶 =承載座1 G 1更使該些導電端子i Q 2的内侧端丄〇 1裸露於該晶片承載座i Q i内部，而該些導電端子工 冗2的外側端工〇 2 2延伸凸設於該晶片承載座工〇工 •外部。再者，在本步驟中，更將該塑膠材料填入相鄰的 T電端子1 0 2的外側端1 〇 2 2之間的裸空部1 〇 3 ’以形成保護結構1 〇 5。 201112373 再一方面，在本具體實施例中，每一個導線架1 〇更 包括四個固定腳1 0 4，該四個固定腳1 0 4係由該功能 區1 〇 0向晶片承載座1 〇 1的外侧延伸；該四個固定腳 1 0 4大致上係成型於該晶片承載座1 〇 1的四個角落 位置’而每一固定腳1 04與其相鄰之導電端子1 〇 2之 間同樣形成有上述之裸空部1 0 3，因此該保護結構工〇 5則同樣地填滿位於固定腳1 〇 4與其相鄰之導電端子 102之間的裸空部1〇3。 同於第一實施例’如第五A圖至第五D圖所示，為 了達到較佳的保護功能，該保護結構i 0 5之肉厚D1係 大於該些導電端子1 〇 2之肉厚D2，以使該保護結構工 〇 5得以保護該些導電端子1 〇 2的金屬表面受到模具 的壓傷，且該保護結構丄05可具有上凸下平、上下:音 凸、上平下凸或上下皆平等各種態樣。 因此，在上述步驟之後，即可製成一種基板i，其上 具有複數個導線架1〇，每一個導線架i 0具有一晶片承 載座1 0 1以及複數個排列於晶片承載座i 〇丄兩側的 導電端子1 0 2，且位於該晶片承載座i 〇丄之同側的導 電端子1 0 2之間形成有裸空部i 0 3，該裸空部工〇 3 中係填入有一保護結構1 〇 5，該保護結構丄〇 5即可避 免導電端子1 0 2或其他金屬料件的壓傷問題。 而在後製程部分，在射出塑膠材料成型晶片承载座工 〇1的步驟之後’更包括-壓出步驟，以移除該保護 10 5° 201112373 最後，成型之導線架料帶即可出貨給下游廠商。下游 廠商將固定腳1 0 4切斷分離後（如第八圖所示），於晶 片承載座1 〇 1中的功能區丄〇 〇上固設至少一個發光 -極體晶片’同時利用導線連接發光二極體晶片以及導電 端子1 0 2的内側端丄0 2 i，再利用封裝材料填入晶片 承載座1〇1中，以使發光二極體晶片與導線包覆於封裝 材料内部，即可構成一發光二極體單元。 惟以上所述僅為本發明之較佳實施例，非意欲偈限本 2明之專利保護㈣，故舉凡運用本發明說明書及圖式内 容所為之等效變化，均同理皆包含於本發明之權利保護範 圍内’合予陳明。 【圖式簡單說明】 第-圖係為本發明第—實施例之導線架製作方法的流程 圖0 圖係為本發明第一實施例之導線架料帶之示意圖。 第二A圖係為第二圖之A部分之示意圖，其顯示該些導 電端子之間的裸空部。 ^二圖係顯示保護結構成型於該裸空部之示意圖。 ，一A圖至第二D圖係為本發明之保護結構的四種結構 態樣。 第四圖係顯示本發明第-實施例之單-導線架之,亥此導 電端子彎折後的示意圖。 一、 =五圖係為本發明第二實施例之導線架料帶製作方法的 流程圖。 201112373 第六圖係為本發明第二實施例之導線架之示意圖，其顯示 該些導電端子之間的裸空部。 第七圖係顯示保護結構成型於該裸空部之示意圖。 第八圖係顯示本發明第二實施例之單一導線架的示意圖。 【主要元件符號說明】 1 基板 導線架 10 功能區 晶片承載座 導電端子 内侧端 外側端 裸空部 固定腳 保護結構 肉厚Referring to the first to third figures, the present invention provides a method for manufacturing a lead frame. The present invention provides a method for manufacturing a lead frame for manufacturing a lead frame 1 〇, and the lead frame 10 is regularly arranged. On a substrate 1 'to facilitate the subsequent production process. Each of the lead frames 1 has a wafer carrier 110 and a plurality of conductive terminals 102 arranged on both sides of the wafer carrier 1 ,1, and the conductive terminals 10 on the same side of the wafer carrier 1 0 1 A bare space 1 〇 3 is formed between the two, and the bare space 1 0 3 is filled with a protective structure 1 〇 5, which can reinforce the strength of the wafer carrier 1 〇 1 when the material is cut. Moreover, the protective structure 1 ◦ 5 can avoid the problem of crushing of the conductive terminal 1 〇 2 or other metal parts. The manufacturing method of the 201112373 includes the following steps: Step (a) k for a substrate 1 'which is substantially a thin metal plate, and a stamping process is applied to the substrate to form the plurality of wire frames 10 of the substrate 1. As shown in the second figure, the substrate 1 includes a plurality of lead frames 1 having a functional area 100 and conductive terminals 102. In the specific embodiment, a plurality of the lead frames are regularly arranged in the lead frame. On the lead frame strip, each of the lead frames 10 includes a functional area 1 〇〇 and three sets of conductive terminals 1200, and the three sets are arranged correspondingly on opposite sides of the functional area 10 , A bare portion 103 is formed between the adjacent conductive terminals 丄〇2, and each of the conductive terminals 1〇2 has an outer end 1 0 2 2 and an inner end 1 〇 2 1 . In addition, the substrate 1 can be made of a substrate sheet of iron or copper, and after knowing by stamping, the substrate 1 can be further subjected to an electro-penetration step, for example, plating including copper plating, nickel plating, silver plating, etc. Process for better rust prevention and increase the hardness of the lead frame strip. Step (b) ejects a plastic material. Referring to the second and third figures, a wafer carrier 110 is formed on each of the lead frames by an injection molding technique, and the wafer carrier i 0 is covered on the functional area 100. And exposing the central position of the functional area 10 〇; at the same time, the wafer carrier 110 further makes the inner end ^ 0 2 1 of the conductive terminals i 〇 2 bare inside the wafer carrier 1 Q 1 , and The outer ends 1 0 2 2 of the conductive terminals 1 0 2 are extended and protruded outside the wafer carrier work 1 . Furthermore, in this step, the plastic material is further filled into the bare space part 201112373 3 between the outer ends 1 ◦ 2 2 of the adjacent conductive terminals 1 0 2 to form the protective structure 1 〇 5. In another aspect, in the specific embodiment, each of the lead frames further includes four fixing legs 104, and the four fixed foot units 4 are from the functional area 1 to the wafer carrier. The outer side of the first embodiment is extended to the four corners of the wafer carrier 1〇1, and each of the fixed ankles 4 and its adjacent conductive terminal 丄〇2 white ^ outside The bare space 1 〇 3 is also formed between the terminals 1 0 2 2, so the protection structure 1 〇 5 is also filled between the fixed pin i 〇 4 and the adjacent conductive terminal 1 0 2 The bare space is 丄〇3. /, as shown in the third A to the third d, in order to achieve a better protection function, the thickness D1 of the protective structure i 〇 5 is greater than the thickness D2 of the conductive terminals 1 0 2 so that the The protective structure 丄〇5 is used to prevent the metal surface of the conductive terminals 102 from being crushed by the mold. For example, the thickness D1 of the protective structure 105 is greater than the thickness D2 of the conductive terminals 丄〇2, and the protective structure 1 〇5 may have a convex upper and lower flat, a top and a bottom convex, a _ upper flat convex or upper and lower All are equal in all aspects. Therefore, after the above steps, a plurality of lead frames 10 can be formed on the substrate i, each lead frame 1 has a wafer carrier 1 and a plurality of conductive electrodes arranged on both sides of the wafer carrier i 0 i A terminal portion 0 2, and a bare space i 〇 3 is formed between the conductive terminals 1 〇 2 on the same side of the wafer carrier 1 , 1 , and the bare space i 〇 3 is filled with a protective structure 1 〇 5, the protection structure 1 0 5 can avoid the problem of crushing of the conductive terminal 0 2 or other metal parts. 201112373 In the post-process part, the conductive terminals i 〇 2 must be bent to form the soldering feet; and the protective structure 2 〇 5 must also be removed. The following describes the three implementation modes: Mode 1. The protective structure 1 0 5 is removed while bending the conductive terminal processes 2. In other words, in the same step, the conductive terminals 1 〇 2 are simultaneously bent by the tool and the protective structure i 〇 5 is broken to remove the protective structure 105 from the wafer carrier i 〇 2 . Method 2, first removing the protection structure i 〇 5, and then bending the conductive terminals 1 0 2, in other words, using different process steps, first breaking the protection structure 1 0 5, and then bending the conductive terminals action. In the manner 3, the conductive terminals 1 〇 2 are removed first, and then the protection structure 1 0 5 is bent. Therefore, the final formed lead frame strip can be shipped to downstream manufacturers. After the downstream manufacturer cuts off the fixed leg 104 (as shown in the fourth figure), at least one light-emitting body wafer can be fixed on the functional area 1〇〇 in the wafer carrier 1〇1 while light is connected by wire connection. The diode chip and the conductive terminal 102 are filled with the package material to fill the wafer carrier 1 〇1, and the LED substrate and the wire are coated inside the package material to form a light-emitting diode unit. Referring to the fifth figure, which is a second embodiment of the present invention, the following steps are included (please refer to the sixth and seventh figures at the same time): Two steps (a) provide a substrate 1 which is substantially a metal sheet A plurality of lead frames 1 are formed on the substrate 1 by a stamping process. As shown in the second figure of the first embodiment, the substrate assembly 201112373 includes at least one functional area i 〇 0 and a lead frame 10 of the conductive terminal 丄〇 2, and in the specific embodiment, the plurality of wires The trusses are regularly arranged on the substrate 1. Each of the lead frames 1 〇 includes a functional area 100 and two sets of conductive terminals 1 〇 2, and the three sets are arranged correspondingly to each other in the functional area 1 On both sides of 0 0, a bare space 丄〇3 is formed between adjacent conductive terminals 1 〇2. In this step, the conductive terminal 102 is further stamped; in other words, the stamping step of the embodiment is simultaneously stamping and molding the substrate i and the conductive terminal 1 〇 2 so that the conductive terminal 1 0 2 has a bend. Folded structure. In addition, the substrate 1 may be a sheet of a substrate made of iron or copper, and after the stamping process is applied, the substrate may be subjected to an electro-minening step, for example, an electric ore process including a copper bottom, a nickel ore, or a silver ore. For better anti-recording effect' can also increase the hardness of the lead frame strip. Step (b) ejects a plastic material. Referring to FIG. 6 and FIG. 7 , a wafer art carrier 1〇1 is formed on each of the lead frame by injection molding technology, and the wafer carrier ii is covered on the functional area '0. Exposing the central position of the functional area 1Q G; at the same time, the crystal=carrier 1 G 1 exposes the inner end 丄〇1 of the conductive terminals i Q 2 to the inside of the wafer carrier i Q i , and the conductive The outer end of the terminal 2 is extended to the outside of the wafer carrier. Furthermore, in this step, the plastic material is further filled into the bare space 1 〇 3 ′ between the outer ends 1 〇 2 2 of the adjacent T electrical terminals 10 2 to form the protective structure 1 〇 5 . 201112373 In another aspect, in the specific embodiment, each of the lead frames 1 further includes four fixing legs 104, and the four fixing legs 104 are from the functional area 1 〇0 to the wafer carrier 1 The outer side of the first fixing leg 104 is formed substantially at the four corner positions of the wafer carrier 1 〇1 and the same between each fixing leg 104 and its adjacent conductive terminal 1 〇2 The bare space 1 0 3 described above is formed, so that the protective structure 5 similarly fills the bare space 1〇3 between the fixed leg 1 〇4 and the adjacent conductive terminal 102. As shown in the fifth embodiment to the fifth embodiment, in order to achieve a better protection function, the thickness D1 of the protective structure i 0 5 is greater than the thickness of the conductive terminals 1 〇 2 D2, so that the protective structure process 5 can protect the metal surface of the conductive terminals 1 〇2 from being crushed by the mold, and the protection structure 丄05 can have an upper convex lower, a top and bottom: a convex convex, an upper flat convex or Both upper and lower are equal in all aspects. Therefore, after the above steps, a substrate i having a plurality of lead frames 1 〇, each of the lead frames i 0 having a wafer carrier 10 1 and a plurality of arrays on the wafer carrier i 即可 can be fabricated. A conductive portion 1 0 2 on both sides, and a bare space i 0 3 is formed between the conductive terminals 1 0 2 on the same side of the wafer carrier i ,, and the bare empty portion 3 is filled with a The protection structure 1 〇 5, the protection structure 丄〇 5 can avoid the problem of crushing of the conductive terminal 102 or other metal parts. In the post-process part, after the step of injecting the plastic material to form the wafer carrier 1 , the step further includes an extrusion step to remove the protection. 10 5° 201112373 Finally, the formed lead frame strip can be shipped to Downstream manufacturers. After the downstream manufacturer cuts off the fixed pin 104 (as shown in the eighth figure), at least one light-polar body chip is fixed on the functional area 中 in the wafer carrier 1 〇1 while using the wire connection The light-emitting diode chip and the inner end 丄0 2 i of the conductive terminal 102 are filled into the wafer carrier 1〇1 by using a packaging material, so that the light-emitting diode wafer and the wire are covered inside the package material, that is, A light emitting diode unit can be constructed. The above is only the preferred embodiment of the present invention, and it is not intended to limit the patent protection (4) of the present invention. Therefore, the equivalent changes of the present specification and the contents of the drawings are all included in the present invention. Within the scope of rights protection, 'combined with Chen Ming. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a lead frame strip according to a first embodiment of the present invention. FIG. The second A is a schematic view of a portion A of the second figure showing the bare space between the conductive terminals. ^The second figure shows a schematic view of the protective structure formed on the bare space. The first to second D drawings are the four structural aspects of the protective structure of the present invention. The fourth figure shows a schematic view of the single-lead frame of the first embodiment of the present invention after the conductive terminal is bent. A fifth diagram is a flow chart of a method for fabricating a lead frame strip according to a second embodiment of the present invention. 201112373 The sixth figure is a schematic view of a lead frame according to a second embodiment of the present invention, showing a bare space between the conductive terminals. The seventh figure shows a schematic view of the protective structure formed on the bare portion. Figure 8 is a schematic view showing a single lead frame of a second embodiment of the present invention. [Main component symbol description] 1 Substrate lead frame 10 Functional area Wafer carrier Conductive terminal Inner end Outside end Naked space Fixed foot Protective structure Thick meat
10 0 10 1 10 2 10 2 1 10 2 2 10 3 10 4 10 5 Dl、D2 1210 0 10 1 10 2 10 2 1 10 2 2 10 3 10 4 10 5 Dl, D2 12