TW201111695A - Illumination device - Google Patents

Illumination device Download PDF

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Publication number
TW201111695A
TW201111695A TW099121064A TW99121064A TW201111695A TW 201111695 A TW201111695 A TW 201111695A TW 099121064 A TW099121064 A TW 099121064A TW 99121064 A TW99121064 A TW 99121064A TW 201111695 A TW201111695 A TW 201111695A
Authority
TW
Taiwan
Prior art keywords
led
light
substrate
cooling plate
water
Prior art date
Application number
TW099121064A
Other languages
Chinese (zh)
Inventor
Kazuaki Yano
Kenji Ishida
Hiroshige Hata
Kiyoyuki Kabuki
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW201111695A publication Critical patent/TW201111695A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

In an illumination device having sectional light sources arranged in a row manner, problems of deformation of a LED substrate and compacting the electric feeding wiring can be solved at the same time. The invention provides an illumination device (100) wherein sealing agents provided between transparent substrates being subject to light for solidification, and characterized in that: the mentioned illumination device (100) is installed with plural LED substrates (237) having LEDs, the LED substrates (237) are disposed at a lower part of a water cooling plate (24) having a cooling medium path, the top of the water cooling plate (24) is installed with a power source feeding electricity to the LED substrates, plural holes (242) penetrating each LED substrate (237) in a top/down manner are formed on the water cooling plate (24), such that an electric feeding wire (239) connected to each LED substrate (237) can be guided to the top of the water cooling plate (24) so as to be connected to the power source (22).

Description

201111695 六、發明說明： 【發明所屬之技術領域】 本發明是關於一種形成具備發光二極體的線狀或面狀 的光源的光照射裝置。尤其是關於一種將液晶面板等的透 明基板，經硬化所塗佈的密封劑而予以黏貼的光照射裝置 【先前技術】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light irradiation device that forms a linear or planar light source including a light-emitting diode. In particular, a light irradiation device for adhering a transparent substrate such as a liquid crystal panel to a cured sealant is applied. [Prior Art]

作爲具備發光二極體（以下稱爲LED )的光照射裝置 ’眾知例如專利文獻1所述的將多數LED排列於基板上 所配置的外線照射裝置。此裝置是在相當於液面面板的 玻璃基板的最大尺寸的大面積的基板全面舖滿配置LED 兀件’僅點亮所預定的密封材硬化所必需的LED而加以 照射者。 第5圖是說明LED被排列於基板上的光照射裝置的 構成的槪略圖，第5 ( a )圖是從照射面側觀看光源部分的 前視圖’第5 ( b )圖是從橫方向觀看的側面圖。此光照射 裝置800是光源爲藉由多數LED81所構成，LED81行列 狀地舖滿於光源平台8 2上的方式所配置。該光照射裝置 是對於各個LED ’具備切換導通/斷開的電源裝置（未圖 示）’配合工件的形狀來選擇點燈領域，而電力由電源裝 置被供應於L E D 8 1。 依照專利文獻1的記載，工件是例如液晶面板用的玻 璃基板。這時候，在兩枚基板8 3，8 3之間沿著所定畫框 [S] -5- 201111695 矩形形狀地形成有密封材料84，而在其畫框內塡充有液晶 。爲了進行被夾住於基板83’ 83的密封材料84的硬化， 僅將電力供應於對應於矩形形狀的畫框所選擇的LED而 進行點燈，俾照射光。 專利文獻1 :日本特開2006-235617號公報 【發明內容】 然而，近年來’液晶面板是被大型化，例如，在最尖 端的液晶面板工廠中，被擴大至稱爲G10 ( 2850x3050mm )的尺寸’而對於其玻璃基板的照射面積也擴大。所以， 增加了光源的LED數’而LED基板被大型化，而增加來 自LED的發熱量。習知爲藉由一枚或少數的LED基板來 構成光照射裝置的光源，惟基板的面積大之故，因而藉由 熱使得基板膨脹，或以應力會彎曲而發生會變形的缺點問 題。藉此’產生LED或透鏡的偏位，或降低照度或產生 照度分布參差不齊會發生等的缺點問題。 爲了防止LED基板之變形，考量例如將LED基板分 割成複數LED基板，俾減少應力的方法，或是冷卻基板 的方法。 但是，當將LED基板分割成複數，則在每一 LED基 板成爲需要配線，而在多數LED光源無間隙又行列狀地 排列的光照射裝置中，從各LED基板所導出的配線量龐 大，而處理上有困難。又，必須多餘地設置配線的空間， 也有裝置成爲大型化的缺點問題。如此地，僅解決了基板 -6- 201111695 的變形，則會發生其他問題。 又，LED基板的尺寸是對應於液晶面板的玻璃基板成 爲極大面積，而僅以水冷等的冷卻來解決基板變形的問題 有所困難，若另外準備熱導管等的熱交換器，則會增加成 本° 由以上，本發明是將多數LED作爲一個段光源，將 其行列狀地配置的光照射裝置，同時地解決LED基板的 變形與饋電配線的精緻化的課題者。 爲了解決上述課題，本發明是一種光照射裝置，在設 於具有透光性的基板間的密封劑照射光使之硬化的光照射An external light irradiation device in which a plurality of LEDs are arranged on a substrate, as described in Patent Document 1, is known as a light-emitting device having a light-emitting diode (hereinafter referred to as an LED). This device is a device in which a large-area substrate having a maximum size corresponding to the liquid crystal panel of the liquid-surface panel is completely covered with an LED element, and only the LED necessary for curing the predetermined sealing material is illuminated. Fig. 5 is a schematic view showing a configuration of a light irradiation device in which LEDs are arranged on a substrate, and Fig. 5(a) is a front view of a light source portion viewed from an irradiation surface side. Fig. 5(b) is a view from the lateral direction Side view. The light irradiation device 800 is configured such that the light source is constituted by a plurality of LEDs 81, and the LEDs 81 are arranged in a row on the light source platform 8 2 . The light irradiation device selects a lighting field for a power supply device (not shown) having switching ON/OFF for each LED ‘, and power is supplied from the power supply device to L E D 8 1 . According to Patent Document 1, the workpiece is, for example, a glass substrate for a liquid crystal panel. At this time, a sealing material 84 is formed in a rectangular shape along the predetermined frame [S] -5 - 201111695 between the two substrates 8 3, 8 3 , and liquid crystal is filled in the frame. In order to harden the sealing material 84 sandwiched by the substrate 83' 83, only the electric power is supplied to the LED selected in accordance with the frame of the rectangular shape, and the light is irradiated. However, in recent years, the liquid crystal panel has been enlarged, for example, in the most advanced liquid crystal panel factory, it has been expanded to a size called G10 (2850×3050 mm). 'The irradiation area of the glass substrate is also enlarged. Therefore, the number of LEDs of the light source is increased, and the size of the LED substrate is increased, and the amount of heat generated from the LED is increased. Conventionally, a light source of a light-irradiating device is constituted by one or a small number of LED substrates. However, since the area of the substrate is large, the substrate is expanded by heat, or the stress is bent to cause deformation. In this way, the occurrence of defects such as the deflection of the LED or the lens, or the reduction of the illuminance or the occurrence of uneven illumination distribution may occur. In order to prevent deformation of the LED substrate, for example, a method of dividing the LED substrate into a plurality of LED substrates, reducing stress, or a method of cooling the substrate is considered. However, when the LED substrate is divided into a plurality of numbers, the amount of wiring derived from each of the LED boards is large in a light irradiation device in which a plurality of LED light sources are arranged in a row without a gap. There are difficulties in handling. Further, it is necessary to provide a space for wiring redundantly, and there is also a problem that the device is disadvantageous in size. As such, only the deformation of the substrate -6-201111695 is solved, and other problems occur. Further, the size of the LED substrate is such that the glass substrate corresponding to the liquid crystal panel has a large area, and it is difficult to solve the problem of deformation of the substrate only by cooling such as water cooling, and if a heat exchanger such as a heat pipe is separately prepared, the cost is increased. In the above, the present invention is a light-irradiating device in which a plurality of LEDs are used as a single-segment light source and arranged in a matrix, and at the same time, the problem of the deformation of the LED substrate and the refinement of the feed wiring is solved. In order to solve the above problems, the present invention is a light irradiation device which irradiates light which is hardened by a sealant disposed between substrates having light transmissivity.

裝置，其特徵爲：上述光照射裝置是行列狀地配置有LED 配置複數的LED基板，該LED基板是被固定於在內部具 有冷卻媒體的流路的水冷板的下面部，在該水冷板的上部 設有饋電於該LED基板的電源，在該水冷板形成有上下In the above-described light-emitting device, the LED substrate is arranged in an array of LEDs, and the LED substrate is fixed to a lower surface of a water-cooling plate having a flow path of a cooling medium therein, and the water-cooling plate is The upper part is provided with a power source fed to the LED substrate, and the water-cooled plate is formed with upper and lower sides.

地貫通每一LED基板的孔，經該孔，使得被連接於LED 基板的饋電線被導出於水冷板的上部，而被連接於該電源 〇 又’本發明爲該LED基板是具備以上述LED基板作 爲光源的段光源，上述該段光源是具有：至少一個的該 LED基板，及被安裝於上述LED的LED透鏡，及透鏡單 元’及保持該透鏡單元的導光體，爲其特徵者。 又’本發明是，導光體是抵接於水冷板，爲其特徵者 依照本發明，行列狀地配置的複數LED基板被固定 201111695 於水冷板的下面部之故，因而基板被冷卻，應力也小 此不會有基板變形而有LED偏位的情形。所以，可 在照度分布上產生參差不齊的情形。又，在所安裝的 LED基板，在水冷板形成有上下地貫通的孔，而爲了 孔與電源連接，配線的處理簡單，使得饋電路變短之 因而也可防止耗電。 又，LED基板爲分割所配置之故，因而若有一個 基板時，則容易更換。 又，本發明是以上述LED基板作爲光源的行列 配置的複數段光源，具有對應於此LED基板的LED ’透鏡卓兀及導光體。於是，此LED基板被固定於 板的下面部之故，因而基板被冷卻，應力也小，因此 不會變形。所以，LED的位置或與透鏡單元的位置關 會偏離。 又，LED基板爲每一段光源都有之故，因而即使 LED基板劣化時，安裝拆除都簡單而容易更換。 又，依照本發明，段光源的導光體，直接抵接於 板，經由導光體也可冷卻透鏡單元。所以，抑制透鏡 的熱脹，而可防止產生配置關係的偏差。 【實施方式】 第1圖是說明本發明的實施形態的光照射裝置的 的圖式。 如第1圖所示地，在光照射裝置100，配置有將 ，因 防止 每一 經該 故， LED 狀地 透鏡 水冷 基板 係不 一個 水冷 單元 構成 全體 -8- 201111695 等分於8個長方形的領域的板狀支撐構件i〇，ii。此些支 持構件10’ 11是藉由未圖示的框體被固定。支持構件10 是各個面所延伸的方向成爲平行的方式等間隔地配置，有 光照射單元2 0裝卸自如地裝設於兩枚的支持構件1 〇之間 。亦即’朝與支持構件10延伸方向平行方向滑動插入光 照射單元20，而碰上配置於裝置中央的支撐構件1 1裝設 著光照射單元2 0。 光照射裝置20是具備：與支持構件1〇嵌合的未圖示 的被嵌合部，及配置於上面部側的電源裝置22，及安裝於 下面側的複數·段光源2 3所構成。支持構件1 〇是例如鋁或 不錄鋼等。 第2圖是從下面側觀看光照射單元20的立體圖。被 安裝於光照射單元20的下面側的段光源23是光照射方向 朝下方的狀態下，行列狀地排列而被配置。此段光源23 是在該圖中以未圖示的LED作爲光源；各個爲獨立地饋 電而進行發光者。 在段光源23的上面側，設有水冷板24與電源22。 在第3圖針對於該段光源的構成加以表示。 在水冷板2 4的下面部利用螺絲等安裝被固定複數 LED配置於其表面的LED基板237。該LED基板237是 例如以鋁作爲基材而利用印刷形成有配線圖案者，而上側 面密接於水冷板2 3 4。 各LED是例如模塑成形的透光性樹脂所成的LED透 鏡231覆蓋其周圍的方式被安裝。從LED所發出的光是 -9 - 201111695 —面折射或反射該LED透鏡231內部一面通過， 方向引導。 由各LED透鏡所出射的光，是通過複數透鏡 成的透鏡單元而成爲面狀的光。透鏡單元的構成是 該圖所示地，爲兩枚的多透鏡 232，及菲湼耳 Fresnel lens ) 2 3 3，光是藉由多透鏡2 3 2被混合均 又，藉由菲湼耳透鏡2 3 3調整成朝著所定角度出射 雖未予圖示，惟代替菲湼耳透鏡使用圓柱的透鏡或 透鏡也可以。 構成於透鏡單元的各透鏡，是藉由導光體236 。導光體是使用著將樹脂或金屬板成形成方型的筒 而作成朝不期望的方向洩漏從LED所放射的光。 236的上端面是被抵接於水冷板24，而藉由支持構 持。 這時候，由各個段光源23所照射的光，是對 方向爲斷面矩形狀的光，而對於照射面被照射成以 度擴展。對於被選擇的所期望的領域爲了進行均勻 ，從各段光源所出射的光’是藉由導光體236所區 此，多餘的光重疊地被照射在照射面，而防止照度 爲不均勻的情形。 列舉照射方向的一例子’僅照射在成爲矩形狀 領域時，構成框四邊的方式’選擇段光源使之點燈 將光照射成所期望的形狀。所以’當不相同尺寸的 次被硬化處理時，即使逐次變化須照射的領域’也 朝一定 組合所 例如如 透鏡（ 勻化， 。又， 是球面 所支持 體者， 導光體 件所保 於出射 一定角 地照射 劃。藉 分布成 的框的 ，就可 工作依 不必移 -10- 201111695 動光源。 第4(a)圖是複數段光源的斷面圖，第4(b)圖是 從橫方向觀看爲了說明段光源，水冷板，電源的配置關係 的本發明的光照射裝置的一部分的擴大斷面圖。針對於與 第3圖同樣的構成省略了說明。 在水冷板24的內部，形成有用以流通冷卻媒體的流 路241。又，對應於安裝有一個LED基板的每一位置，形 成有上下地貫通水冷板24的一個孔242。此爲因應於 LED基板數量而必須導出饋電線》 設置於水冷板24上部的電源22，是配置在每一LED 基板，有供應基板單位的電力的作用。又，電源22是受 到來自設置於LED基板上的未圖示的光電二極體的回饋 ，有變更電力的作用。 在水冷板2 4的下面部2 4 3，以例如螺絲2 3 4密接安裝 有LED基板237。如此地，LED基板237是並不使用大面 積者，至少每一段光源地分割而被安裝之故，因而可解決 依來自LED的發熱所致的基板的延伸，彎曲等的變形。 又，LED基板237是至少每一段光源地分割而被安裝 之故’因而容易更換。例如，當LED劣化而成爲必須更 換時，以段光源單位拆下或安裝LED基板就可以，而作 業很簡單。又’ LED的劣化，是利用設於LED基板狀的 未圖示的光電二極體就可予以檢測。 在各LED基板237，連接有用以饋電的連接器235。 該連接器23 5是在其兩端，例如具備金屬銷的饋電線23 8 -11 - 201111695 ，23 9，一端側是電氣地被連接於LED基板23 7。 從該連接器23 5所延伸的另一端側的饋電銷239是經 被形成於水冷板24的孔242而被導出至上面側，而被連 接於電源22。 又，圖示的饋電銷239是對於孔徑極細小之故，因而 與水冷板24未接觸以保持絕緣，惟依所供應的電力，視 需要，以樹脂等的絕緣物加以被覆也可以》 藉此，從電源22饋電至LED基板23 7，是經水冷板 24的孔242所進行之故，因而配線不會成爲複雜化，處理 很簡單。又將配線滙集成較小之故，因而也可將裝置作成 小型化。 又，從電源至LED基板的饋電路變短，也可防止耗 電。 又，藉由金屬所成的導光體23 6的上端面抵接於水冷 板24，導光體23 6本體被冷卻，同時也可冷卻所保持的透 鏡單元。 藉此，可抑制導光體23 6或構成透鏡單元的透鏡的熱 脹，而有不容易產生透鏡配置關係的偏離等的效果。 【圖式簡單說明】 第1圖是表示有關於本發明的光照射裝置的全體構成 的立體圖。 第2圖是表示有關於本發明的光照射單元的構成的立 體圖。 -12- 201111695 第3圖是表示有關於本發明的段光源的構成的立體圖 成a hole penetrating through each of the LED substrates, through which the feed line connected to the LED substrate is led to the upper portion of the water-cooled plate and connected to the power source, and the LED substrate is provided with the LED The segment light source is a segment light source having at least one of the LED substrate, and an LED lens mounted on the LED, and a lens unit and a light guide body that holds the lens unit. Further, in the present invention, the light guide body is in contact with the water-cooling plate, and according to the present invention, the plurality of LED substrates arranged in an array are fixed to the lower portion of the water-cooled plate in 201111695, so that the substrate is cooled and stressed. Also, there is no case where the substrate is deformed and the LED is biased. Therefore, a situation in which the illuminance distribution is uneven can be generated. Further, in the mounted LED substrate, a hole penetrating vertically is formed in the water-cooling plate, and the wiring is handled simply for the purpose of connecting the hole to the power source, so that the power supply can be prevented from being shortened. Further, since the LED substrate is arranged for division, if there is one substrate, it is easy to replace. Further, the present invention is a plurality of segment light sources in which the LED substrate is used as a light source in a row, and has an LED' lens and a light guide corresponding to the LED substrate. Therefore, the LED substrate is fixed to the lower surface of the board, so that the substrate is cooled and the stress is small, so that it is not deformed. Therefore, the position of the LED or the position of the lens unit is deviated. Moreover, since the LED substrate is used for each of the light sources, even if the LED substrate is deteriorated, the mounting and removal are simple and easy to replace. Further, according to the present invention, the light guide of the segment light source directly abuts against the plate, and the lens unit can be cooled via the light guide. Therefore, the thermal expansion of the lens is suppressed, and the deviation of the arrangement relationship can be prevented. [Embodiment] Fig. 1 is a view for explaining a light irradiation device according to an embodiment of the present invention. As shown in Fig. 1, in the light-irradiating device 100, it is arranged that the LED-cooled substrate is not water-cooled, and the water-cooling unit is formed in a total of -8-201111695. Plate-shaped support member i〇, ii. These support members 10'11 are fixed by a frame (not shown). The support member 10 is disposed at equal intervals such that the directions in which the respective faces extend are parallel, and the light irradiation unit 20 is detachably mounted between the two support members 1A. That is, the light-irradiating unit 20 is slid in the direction parallel to the extending direction of the supporting member 10, and the light-irradiating unit 20 is attached to the supporting member 1 1 disposed at the center of the apparatus. The light irradiation device 20 includes a fitting portion (not shown) that is fitted to the support member 1A, a power supply device 22 that is disposed on the upper surface side, and a plurality of segment light sources 23 that are attached to the lower surface side. The support member 1 is, for example, aluminum or non-recorded steel. Fig. 2 is a perspective view of the light irradiation unit 20 viewed from the lower side. The segment light sources 23 attached to the lower surface side of the light irradiation unit 20 are arranged in a matrix in a state in which the light irradiation direction is downward. This segment of the light source 23 is an LED (not shown) as a light source in the figure; each of them is independently fed to emit light. On the upper surface side of the segment light source 23, a water-cooling plate 24 and a power source 22 are provided. In Fig. 3, the configuration of the segment of the light source is shown. The LED substrate 237 on which the plurality of LEDs are fixed is disposed on the lower surface of the water-cooling plate 24 by screws or the like. The LED substrate 237 is formed by, for example, forming a wiring pattern by printing using aluminum as a substrate, and the upper surface is in close contact with the water-cooling plate 234. Each of the LEDs is mounted such that the LED lens 231 made of, for example, a molded light-transmitting resin covers the periphery thereof. The light emitted from the LED is -9 - 201111695 - the surface is refracted or reflected by the inside of the LED lens 231, and the direction is guided. The light emitted from each of the LED lenses is a planar light by a lens unit formed by a plurality of lenses. The configuration of the lens unit is shown in the figure as two multi-lens 232, and a Fresnel lens 2 3 3, and the light is mixed by the multi-lens 2 2 2, by means of a Fresnel lens. 2 3 3 Adjusting to emit at a predetermined angle Although not illustrated, a lens or a lens using a cylinder instead of a Fresnel lens may be used. Each of the lenses formed in the lens unit is guided by a light guide 236. The light guide body is made to leak light emitted from the LED in an undesired direction by using a resin or a metal plate into a rectangular tube. The upper end surface of 236 is abutted against the water-cooled plate 24, and is supported by support. At this time, the light irradiated by each of the segment light sources 23 is light having a rectangular cross section in the direction of the pair, and the irradiation surface is irradiated with a degree of expansion. In order to perform uniformity for the selected desired region, the light emitted from each segment of the light source is surrounded by the light guide body 236, and the excess light is superimposed on the illumination surface to prevent the illumination from being uneven. situation. An example of illuminating the irradiation direction is a method of constituting only four sides of the frame when irradiated in a rectangular region. The segment light source is selected to illuminate the light to a desired shape. Therefore, 'when the times are not hardened by the same size, even if the fields to be irradiated are changed one by one, it is toward a certain combination, for example, a lens (homogenization, and, in addition, is a spherical support body, the light guide body is protected by The illuminating stroke is emitted at a certain angle. By the frame that is distributed, it can work without shifting the -10-201111695 moving light source. Figure 4(a) is a sectional view of the plurality of light sources, and Figure 4(b) is a horizontal view. An enlarged cross-sectional view of a part of the light irradiation device of the present invention for explaining the arrangement relationship between the segment light source, the water-cooling plate, and the power source is omitted. The description of the configuration similar to that of Fig. 3 is omitted. The inside of the water-cooling plate 24 is formed. There is a flow path 241 for circulating a cooling medium. Further, a hole 242 which penetrates the water-cooling plate 24 up and down is formed corresponding to each position where one LED substrate is mounted. This is necessary to derive the feeder according to the number of LED substrates. The power source 22 provided on the upper portion of the water-cooling plate 24 is disposed on each of the LED substrates and has a function of supplying power of the substrate unit. Further, the power source 22 is received from an unillustrated device provided on the LED substrate. The feedback of the photodiode has a function of changing the electric power. The LED substrate 237 is closely attached to the lower surface portion 243 of the water-cooling plate 24, for example, by screws 234. Thus, the LED substrate 237 is not used in a large area. At least each of the light sources is divided and mounted, so that deformation of the substrate, bending, or the like due to heat generated from the LED can be solved. Further, the LED substrate 237 is divided and installed at least for each of the light sources. Therefore, it is easy to replace. For example, when the LED is degraded and it has to be replaced, the LED substrate can be removed or mounted in units of the segment light source, and the operation is very simple. Moreover, the deterioration of the LED is made by using the LED substrate. The illustrated photodiode can be detected. A connector 235 for feeding is connected to each LED substrate 237. The connector 23 5 is a feed line 23 8 -11 at both ends thereof, for example, having a metal pin. - 201111695, 23, one end side is electrically connected to the LED substrate 23 7. The other end side of the feed pin 239 extending from the connector 23 5 is derived through the hole 242 formed in the water-cooling plate 24 To the upper side, but connected In addition, the feed pin 239 is shown to be extremely small in diameter, so that it is not in contact with the water-cooling plate 24 to maintain insulation. However, depending on the supplied electric power, it is covered with an insulator such as resin. Therefore, the power is supplied from the power source 22 to the LED substrate 237 through the hole 242 of the water-cooling plate 24, so that the wiring is not complicated, the processing is simple, and the wiring is made smaller. Therefore, the device can be miniaturized. Further, the feeding circuit from the power source to the LED substrate can be shortened, and power consumption can be prevented. Further, the upper end surface of the light guide body 23 made of metal is in contact with water cooling. The plate 24, the body of the light guide body 23 is cooled, and the held lens unit can also be cooled. Thereby, the thermal expansion of the light guide body 23 or the lens constituting the lens unit can be suppressed, and the effect of the deviation of the lens arrangement relationship or the like is less likely to occur. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the overall configuration of a light irradiation device according to the present invention. Fig. 2 is a perspective view showing the configuration of a light irradiation unit according to the present invention. -12- 201111695 Fig. 3 is a perspective view showing the configuration of a segment light source according to the present invention.

的 第4(a)圖是表不有關於本發明的光照射單元的_ 斷面圖，第4(b)圖是主要部分擴大圖。 第5圖是表示有關於習知例的光照射裝置@ _ 是從照射面側觀看的前視圖，（b )是側面圖。 主要元件符號說明】 1 0，1 1 :支持構件 100 :光照射裝置 20 :光照射單元 22 :電源 2 3 :段光源 231： led mm 2 3 2 :多透鏡 233 :菲涯耳透鏡（Fresnel lens) 2 3 4 :螺絲 2 3 5 :連接器 23 6 :導光體 237 : LED 基板 2 3 8，2 3 9 :饋電線 2 4 :水冷板 241 :流路Fig. 4(a) is a cross-sectional view showing the light irradiation unit of the present invention, and Fig. 4(b) is a main portion enlarged view. Fig. 5 is a front view showing a light irradiation device @__ according to a conventional example, and (b) is a side view. Explanation of main component symbols] 1 0,1 1 : Support member 100 : Light irradiation device 20 : Light irradiation unit 22 : Power supply 2 3 : Segment light source 231 : led mm 2 3 2 : Multi-lens 233 : Fresnel lens 2 3 4 : Screw 2 3 5 : Connector 23 6 : Light guide body 237 : LED substrate 2 3 8, 2 3 9 : Feeder 2 4 : Water-cooled plate 241 : Flow path

242 ：孑L 243 :下面部 -13-242 :孑L 243 : Below -13-

Claims (1)

201111695 七。申請專利範圍： 1 · 一種光照射裝置，在設於具有透光性的基板間的 密封劑照射光使之硬化的光照射裝置，其特徵爲： 上述光照射裝置是行列狀地配置有led配置複數的 LED基板， 該LED基板是被固定於在內部具有冷卻媒體的流路 的水冷板的下面部， 在該水冷板的上部設有饋電於該LED基板的電源， 在該水冷板形成有上下地貫通每一 LED基板的孔， 經該孔，使得被連接於LED基板的饋電線被導出於 水冷板的上部，而被連接於該電源。 2 ·如申請專利範圍第1項所述的光照射裝置，其中 該LED基板是具備以上述LED基板作爲光源的段光 源， 該段光源是具有：至少一個的該LED基板，及被安 裝於上述LED的LED透鏡，及透鏡單元，及保持該透鏡 單元的導光體。 3.如申請專利範圍第2項所述的光照射裝置，其中 上述導光體是抵接於上述水冷板。 -14 -201111695 Seven. Patent application scope: 1 . A light-irradiating device, wherein a light-irradiating device is provided in a light-irradiating device in which a light-shielding substrate is irradiated with light, and the light-irradiating device is arranged in a row and arranged in a led arrangement. a plurality of LED boards which are fixed to a lower surface of a water-cooling plate having a flow path of a cooling medium therein, and a power supply for feeding the LED board to the upper portion of the water-cooling plate, wherein the water-cooling plate is formed The hole of each LED substrate is penetrated up and down, and the feed line connected to the LED substrate is led out to the upper portion of the water-cooled plate and connected to the power source. The light-emitting device according to claim 1, wherein the LED substrate is provided with a segment light source using the LED substrate as a light source, the segment light source having at least one of the LED substrates, and being mounted on the LED substrate An LED lens of an LED, and a lens unit, and a light guide that holds the lens unit. 3. The light-irradiating device according to claim 2, wherein the light guide body is in contact with the water-cooling plate. -14 -
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