201109900 六、發明說明： . 【發明所屬之技術領域】 、 本發明涉及一種散熱裝置，特別涉及電子元件 散熱之散熱裝置。 【先前技術】 政熱裝置廣泛應用於筆記型電腦中，常用之散 熱裝置一般包括吸熱板、熱管及由散熱鰭片堆疊形 Φ 成之散熱鰭片組，該吸熱板與一設於電路板上之發 熱電子元件相貼合，以吸收發熱電子元件產生之熱 里，並將該熱量傳遞給熱管，藉由熱管傳導至散熱 ."、曰片、、且由散熱縛片、組將熱量散發出去。筆記型電 腦趨向於緊湊結構設計，這就要求散熱裝置體積更 小且具有較佳之散熱性能。 【發明内容】 鑒於此，有必要提供一種體積更小且散熱較佳 Φ 之散熱裝置。 種散熱裝置，包括一散熱鰭片組、一熱管及 離心風扇，散熱鰭片組由複數散熱鰭片堆疊而 成，離心風扇設有一出風口，散熱鰭片組設置於離 〜風扇之出風口處，熱管與散熱鰭片組接觸，散熱 鰭片組中至少部分散熱鰭片之高度沿散熱鰭片組之 堆疊方向逐漸減小，散熱鰭片組之底部於對應減小 高度之散熱鰭片形成一空缺空間。 201109900 與習知技術相比，本發明之散熱裝置之散熱籍 片組中至少部分散熱鰭片之高度沿散熱鰭片組之堆 疊方向逐漸減小，使得散熱鰭片組於對應減小高度 之散熱鰭片形成一空缺空間以收容筆記本電腦之其 他元件，使得筆記本電腦之内部結構更加緊湊。 【實施方式】 如圖1及圖2所示，散熱裝置10包括離心風扇 11、熱管12及散熱鰭片組100。離心風扇11之頂端 110及底端111設有入風口 112，離心風扇11之侧 壁113開設一出風口 114。熱管12為扁平熱管，熱 管12之頂端面121及底端面122為平面，熱管12 之冷凝段123位於離心風扇11之出風口 114之頂端。 散熱鰭片組100堆疊呈直線狀並設置在離心風 扇11出風口 114處，沿堆疊方向該散熱鰭片組100 分成相互緊鄰之第一部分13與第二部分15，第一 部分13位於散熱鰭片組100之左侧，第二部分15 位於散熱鰭片組100之右側。 第一部分13由複數第一散熱鰭片14堆疊形 成，相鄰之兩個第一散熱鰭片14之間形成氣流通道 17。第一部分13呈梯形狀，各第一散熱鰭片14之 高度沿第一部分13之堆疊方向逐漸減少。第一散熱 鰭片14包括一本體140、上折邊141及下折邊142, 上折邊141由本體140之上側緣一體析彎且沿水平 201109900 方向延伸而成’下折邊142由本體i4〇之下側緣一 * 體折彎且向上傾斜延伸而成。後一第一散熱鰭片14a . 之上折邊141及下折邊142分別抵靠於前一第—散 熱縛片14b之本體140上’該複數第一散熱鰭片14 之上折邊141在同一水平面上且共同構成第一部分 13之頂面148，該複數第一散熱鰭片14之下折邊 142在同一向上傾斜之平面上且共同構成第一部分 鲁 13之底面149。該頂面148為水平面，該底面149 沿第一部分13之堆疊方向且向上傾斜延伸。 第二部分15由複數第二散熱鰭片16堆疊而 成，相鄰之兩個第二散熱鰭片16之間形成氣流通道 17。第二部分15呈矩形狀，各第二散熱鰭片16之 高度相同。第二散熱鰭片16包括一本體ι6〇、上折 邊161及下折邊162，上折邊161及下折邊ι62分 別由本體160之上、下側緣一體水平延伸而成。後 春 一第二散熱鰭片16a之上折邊161及下折邊162分 別抵罪於鈿一第二散熱籍片16b之本體160上，該 複數弟一散熱鰭片16之上折邊161在同一水平面上 且共同構成第二部分15之頂面168，該複數第二散 熱籍片16之下折邊162在同一水平面上且共同構成 第二部分15之底面169，頂面168與底面169均為 平面。 第一部分13及第二部分15位於離心風扇11之 201109900 出風口 114處，第一部分13與第二部分15排成一 . 行且第一部分13之頂面148與第二部分15之頂面 168在同一水平面上，第一部分13之頂面148與第 ·« 二部分15之頂面168貼附於熱管12之冷凝段123 之底端面122上。第一部分13之底面149與第二部 分15之底面169連接。 第一部分13最右端之第一散熱鰭片14c與第二 $ 部分15最左端之第二散熱鰭片16c相鄰。第一散熱 鰭片14c與第二散熱鰭片16c之高度相同，第二散 熱鰭片16c之上折邊161抵靠於第一散熱鰭片14c 之本體140之上側緣，第二散熱鰭片16c之下折邊 162抵靠於第一散熱鰭片14c之本體140之下側緣。 除了第一散熱鰭片14c之外，其餘第一散熱鰭片14 之高度均小於第二散熱鰭片16c之高度，且沿著遠 離第二散熱鰭片16c之堆疊方向上，各第一散熱鰭 Φ 片14之高度逐漸較小。 熱量從熱管12之冷凝段123傳遞到散熱鰭片組 100之第一部分13及第二部分15，離心風扇11產 生氣流並吹向第一部分13及第二部分15，氣流藉 由第一部分13及第二部分15之氣流通道17，並將 第一部分13及第二部分15之熱量散發到外界空氣 中 〇 第一部分13之高度沿第一部分13之堆疊方向 201109900 逐漸減少，從而第-部分13之底部形成一空 200以容納筆記型電 缺工間 1Λη Hi 電腦之其他兀件，防止散熱鰭片 、、， 一记型電腦之其他組件干涉，以適岸筆 型電腦内之複雜办鬥沾碰 2 ^ 〇ύ 热 使得筆記型電腦内部 緊凑。另’由於第-部分13之底面149為 斜面，則在相同規格情況下，底面149為斜面之面 積大於底面149為水平面之面積，這可增加第一部 分13之散熱面積，即第一部分13在減少其體積之 情況下仍能保持較佳之散熱性能。 圖3及圖4示出本發明之另一較佳實施例之散 …裝置2G ’與上—較佳實施例不同之處在於，散埶 1片組1GGa未分成兩部分結構，而是散熱鰭片^ a之所有散熱鰭片24之高度沿散熱鰭片組100a 之堆叠方向從右向左遞減，散熱籍片、组100a之頂面 施貼附於熱管22之冷凝段223之底端面222上。 散熱籍片組100a之底面249為斜面，從而形成一空 缺空間200a。 綜上所述’本發明符合發明專利之要件，爰依 法提出專利申請。惟以上所述者僅為本發明之較佳 實施例’舉凡熟悉本案技藝之人士，在纽本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 5青專利範圍内。 【圖式簡單說明】 201109900 圖1為本發明之散熱裝置之一較佳實施例之立 體組裝圖。 圖2為圖1中散熱鰭片組之前視圖。 圖3為本發明之散熱裝置之又一較佳實施例之 立體組裝圖。 圖4為圖3中散熱鰭片組之前視圖。 【主要元件符號說明】201109900 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat of electronic components. [Prior Art] Political devices are widely used in notebook computers. Commonly used heat sinks generally include a heat absorbing plate, a heat pipe, and a heat sink fin group formed by stacking fins Φ, and the heat absorbing plate and one of the heat absorbing plates are disposed on the circuit board. The heat-generating electronic components are attached to absorb heat generated by the heat-generating electronic components, and the heat is transferred to the heat pipe, and is transmitted to the heat-dissipating heat pipe by the heat pipe, and the heat is dissipated by the heat-dissipating die and the group. Go out. Notebook computers tend to be compact in design, which requires a smaller heat sink and better heat dissipation. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink having a smaller volume and better heat dissipation. The heat dissipating device comprises a heat dissipating fin group, a heat pipe and a centrifugal fan, the heat dissipating fin group is formed by stacking a plurality of heat dissipating fins, the centrifugal fan is provided with an air outlet, and the heat dissipating fin group is disposed at an air outlet of the fan. The heat pipe is in contact with the heat dissipation fin group, and the height of at least part of the heat dissipation fins of the heat dissipation fin group gradually decreases along the stacking direction of the heat dissipation fin group, and the bottom of the heat dissipation fin group forms a heat dissipation fin corresponding to the reduced height. Vacant space. 201109900 Compared with the prior art, the height of at least some of the heat dissipation fins in the heat dissipation group of the heat dissipation device of the present invention is gradually reduced along the stacking direction of the heat dissipation fin group, so that the heat dissipation fin group is disposed at a corresponding reduced height. The fins form a vacant space to accommodate other components of the notebook computer, making the internal structure of the notebook more compact. [Embodiment] As shown in Figs. 1 and 2, the heat sink 10 includes a centrifugal fan 11, a heat pipe 12, and a heat sink fin set 100. The top end 110 and the bottom end 111 of the centrifugal fan 11 are provided with an air inlet 112, and the side wall 113 of the centrifugal fan 11 defines an air outlet 114. The heat pipe 12 is a flat heat pipe. The top end surface 121 and the bottom end surface 122 of the heat pipe 12 are flat, and the condensation section 123 of the heat pipe 12 is located at the top end of the air outlet 114 of the centrifugal fan 11. The heat dissipation fin set 100 is linearly stacked and disposed at the air outlet 114 of the centrifugal fan 11. The heat dissipation fin set 100 is divided into a first portion 13 and a second portion 15 adjacent to each other in the stacking direction, and the first portion 13 is located in the heat dissipation fin group. On the left side of 100, the second portion 15 is located on the right side of the heat dissipation fin set 100. The first portion 13 is formed by stacking a plurality of first heat radiating fins 14, and an air flow path 17 is formed between the adjacent two first heat radiating fins 14. The first portion 13 has a trapezoidal shape, and the height of each of the first heat radiating fins 14 gradually decreases in the stacking direction of the first portion 13. The first heat dissipation fin 14 includes a body 140, an upper flange 141 and a lower flange 142. The upper flange 141 is integrally bent from the upper edge of the body 140 and extends along the horizontal direction of 201109900. The lower flange 142 is formed by the body i4. The side edge of the 〇 is a body bent and extended upwards. The first first heat dissipating fin 14a and the lower side 142 respectively abut against the body 140 of the first first heat dissipating fin 14b. The top surface 148 of the first portion 13 is formed on the same horizontal surface, and the lower flanges 142 of the plurality of first heat dissipation fins 14 are on the same upwardly inclined plane and together constitute the bottom surface 149 of the first portion. The top surface 148 is a horizontal plane that extends obliquely upward in the stacking direction of the first portion 13. The second portion 15 is formed by stacking a plurality of second heat dissipation fins 16, and an air flow passage 17 is formed between the adjacent two second heat dissipation fins 16. The second portion 15 has a rectangular shape, and each of the second heat radiating fins 16 has the same height. The second heat dissipating fins 16 include a body ι6 〇, an upper hem 161 and a lower hem 162. The upper hem 161 and the lower hem 62 are integrally horizontally extended from the upper and lower sides of the body 160. The second heat-dissipating fin 16a has a folded edge 161 and a lower folded edge 162 respectively on the body 160 of the first heat-dissipating fin 16b, and the plurality of fins 16 are folded in the same shape. The top surface 168 of the second portion 15 is formed on the horizontal surface, and the lower edge 162 of the second heat radiating film 16 is on the same horizontal surface and together constitute the bottom surface 169 of the second portion 15, and the top surface 168 and the bottom surface 169 are both flat. The first portion 13 and the second portion 15 are located at the 201109900 air outlet 114 of the centrifugal fan 11, and the first portion 13 and the second portion 15 are arranged in a row. The top surface 148 of the first portion 13 and the top surface 168 of the second portion 15 are On the same level, the top surface 148 of the first portion 13 and the top surface 168 of the second portion 15 are attached to the bottom end surface 122 of the condensation section 123 of the heat pipe 12. The bottom surface 149 of the first portion 13 is joined to the bottom surface 169 of the second portion 15. The first heat radiating fin 14c at the rightmost end of the first portion 13 is adjacent to the second heat radiating fin 16c at the leftmost end of the second portion 15. The first heat dissipation fins 14c and the second heat dissipation fins 16c have the same height, and the upper heat dissipation fins 16c have a folded edge 161 against the upper edge of the body 140 of the first heat dissipation fins 14c, and the second heat dissipation fins 16c. The lower flange 162 abuts against the lower side edge of the body 140 of the first heat dissipation fin 14c. Except for the first heat dissipation fins 14c, the heights of the first heat dissipation fins 14 are smaller than the height of the second heat dissipation fins 16c, and along the stacking direction away from the second heat dissipation fins 16c, the first heat dissipation fins The height of the Φ sheet 14 is gradually smaller. Heat is transferred from the condensation section 123 of the heat pipe 12 to the first portion 13 and the second portion 15 of the heat dissipation fin set 100, and the centrifugal fan 11 generates an air flow and blows the first portion 13 and the second portion 15, the air flow by the first portion 13 and the first portion The air flow passage 17 of the two portions 15 radiates the heat of the first portion 13 and the second portion 15 into the outside air. The height of the first portion 13 gradually decreases along the stacking direction 201109900 of the first portion 13, so that the bottom portion of the first portion 13 is formed. One empty 200 to accommodate the other parts of the notebook type 1 Λ Hi computer, to prevent the heat sink fins, and other components of a notebook computer from interfering with the complex handles in the pen-based computer 2 ^ 〇 ύ Heat makes the notebook compact inside. In addition, since the bottom surface 149 of the first portion 13 is a sloped surface, in the case of the same specification, the surface of the bottom surface 149 is a larger area than the surface of the bottom surface 149, which can increase the heat dissipation area of the first portion 13, that is, the first portion 13 is reduced. In the case of its volume, it still maintains better heat dissipation performance. 3 and 4 show that the device 2G' of the other preferred embodiment of the present invention differs from the above-described preferred embodiment in that the diverging 1 chip group 1GGa is not divided into two parts, but is a heat sink fin. The height of all the heat dissipation fins 24 of the film is reduced from right to left along the stacking direction of the heat dissipation fin group 100a, and the heat dissipation film and the top surface of the group 100a are attached to the bottom end surface 222 of the condensation section 223 of the heat pipe 22. . The bottom surface 249 of the heat radiation group 100a is a sloped surface to form a void space 200a. In summary, the invention conforms to the requirements of the invention patent, and the patent application is filed according to the law. However, the above description is only the preferred embodiment of the present invention. Those skilled in the art of the present invention, equivalent modifications or variations in the spirit of the invention, should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a preferred embodiment of a heat sink according to a preferred embodiment of the present invention. 2 is a front view of the heat sink fin set of FIG. 1. Fig. 3 is a perspective assembled view of still another preferred embodiment of the heat sink of the present invention. 4 is a front view of the heat sink fin set of FIG. 3. [Main component symbol description]
散熱裝置 10、20 散熱鰭片組 100、100a 離心風扇 11、21 頂端 110 底端 111 入風口 112 側壁 113 出風口 114、214 孰管 *、、、 12 ' 22 頂端面 121 底端面 122、222 冷凝段 123 ' 223 第一部分 13 第二部分 15 散熱鰭片 14、14a、 16c 14b、14c、16、 16a、 16b 、 本體 140、160 上折邊 141 、 161 下折邊 142、162 底面 149 、 249 頂面 氣流通道 148 、 168 17 、248Heat sink 10, 20 heat sink fin set 100, 100a centrifugal fan 11, 21 top end 110 bottom end 111 air inlet 112 side wall 113 air outlet 114, 214 manifold *,,, 12' 22 top surface 121 bottom end surface 122, 222 condensation Section 123 ' 223 Part 1 13 Second Part 15 Heat sink fins 14, 14a, 16c 14b, 14c, 16, 16a, 16b, body 140, 160 upper flange 141, 161 lower flange 142, 162 bottom surface 149, 249 top Surface air flow passages 148, 168 17 , 248