TWI480471B - Fan module - Google Patents
Fan module Download PDFInfo
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- TWI480471B TWI480471B TW101101783A TW101101783A TWI480471B TW I480471 B TWI480471 B TW I480471B TW 101101783 A TW101101783 A TW 101101783A TW 101101783 A TW101101783 A TW 101101783A TW I480471 B TWI480471 B TW I480471B
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- Prior art keywords
- upper cover
- fan module
- bottom plate
- housing
- receiving space
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/4206—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
- F04D29/4226—Fan casings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/601—Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/62—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps
- F04D29/624—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
- F04D29/626—Mounting or removal of fans
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
- F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Description
本發明是有關於一種風扇模組，且特別是有關於一種適用於電子裝置的風扇模組。The present invention relates to a fan module, and more particularly to a fan module suitable for an electronic device.
為因應現今電子產品高速度、高效能、且輕薄短小的要求，使得各種可攜式(portable)電子裝置已漸成主流。就筆記型電腦(notebook)而言，由於筆記型電腦無法提供很大的空間來容置散熱系統，因此如何在有限的配置空間中提高其散熱效率，乃是業界所專注的焦點之一。In order to meet the requirements of high speed, high efficiency, lightness and shortness of today's electronic products, various portable electronic devices have become mainstream. In the case of a notebook, because the notebook computer does not provide a large space to accommodate the cooling system, how to improve its cooling efficiency in a limited configuration space is one of the focuses of the industry.
一般而言，筆記型電腦通常會配備有風扇模組，用以對筆記型電腦內部之發熱元件進行散熱。為了降低整體結構的重量及厚度，風扇模組之用以容納散熱風扇的上蓋及底板被設計成具有較薄的厚度，且散熱風扇與上蓋之間的距離及上蓋與筆記型電腦內其它結構件之間的距離亦被設計為較小。此種設計方式可應用於強調輕薄可攜的超薄形筆記型電腦(ultra-thin type notebook)。In general, notebook computers are usually equipped with a fan module to dissipate heat from the internal heating elements of the notebook. In order to reduce the weight and thickness of the overall structure, the upper cover and the bottom plate of the fan module for accommodating the cooling fan are designed to have a thin thickness, and the distance between the cooling fan and the upper cover and the upper cover and other structural components in the notebook computer The distance between them is also designed to be smaller. This design can be applied to ultra-thin type notebooks that emphasize thin and light portable.
然而，厚度較薄的上蓋具有較低的結構強度，在散熱風扇與上蓋之間距離較小且上蓋與筆記型電腦內結構件之間距離較小的情況下，上蓋容易因所述結構件的壓迫而產生變形，使散熱風扇受到上蓋的壓迫而影響風扇模組的正常運作。However, the thinner upper cover has a lower structural strength, and in the case where the distance between the cooling fan and the upper cover is small and the distance between the upper cover and the structural member inside the notebook is small, the upper cover is easily caused by the structural member. The deformation caused by the compression causes the cooling fan to be pressed by the upper cover to affect the normal operation of the fan module.
本發明提供一種風扇模組，具有較佳的結構強度。The invention provides a fan module with better structural strength.
本發明提出一種風扇模組，適用於一電子裝置。風扇模組包括一底板、一上蓋、一側壁、一散熱風扇及一殼體。側壁組設在上蓋與底板之間，其中側壁、上蓋與底板構成一容納空間。散熱風扇配置於底板上而位於容納空間內。殼體疊設於上蓋上。The invention provides a fan module suitable for an electronic device. The fan module includes a bottom plate, an upper cover, a side wall, a heat dissipation fan and a casing. The side wall is disposed between the upper cover and the bottom plate, wherein the side wall, the upper cover and the bottom plate form an accommodation space. The cooling fan is disposed on the bottom plate and is located in the receiving space. The housing is stacked on the upper cover.
在本發明之一實施例中，上述之殼體與側壁一體成型。In an embodiment of the invention, the housing is integrally formed with the side wall.
在本發明之一實施例中，上述之殼體覆蓋上蓋的一第一部分且暴露上蓋的一第二部分。電子裝置的一結構件接觸殼體，結構件與第二部分之間具有間隙而形成一入風口，入風口連通容納空間。In an embodiment of the invention, the housing covers a first portion of the upper cover and exposes a second portion of the upper cover. A structural member of the electronic device contacts the housing, and a gap is formed between the structural member and the second portion to form an air inlet, and the air inlet communicates with the receiving space.
在本發明之一實施例中，上述之上蓋具有一開口，開口暴露容納空間，入風口透過開口連通容納空間。In an embodiment of the invention, the upper cover has an opening that exposes the receiving space, and the air inlet communicates with the receiving space through the opening.
在本發明之一實施例中，上述之殼體與底板之間具有間距而形成一出風口，出風口連通容納空間。In an embodiment of the invention, the housing and the bottom plate have a spacing to form an air outlet, and the air outlet communicates with the receiving space.
在本發明之一實施例中，風扇模組更包括一支撐柱，支撐柱位於出風口且支撐於底板與殼體之間。In an embodiment of the invention, the fan module further includes a support column, the support column is located at the air outlet and supported between the bottom plate and the housing.
在本發明之一實施例中，上述之殼體具有一延伸部，延伸部連接於殼體的邊緣。支撐柱支撐於底板與延伸部之間。In an embodiment of the invention, the housing has an extension connected to an edge of the housing. The support column is supported between the bottom plate and the extension.
在本發明之一實施例中，上述之殼體與支撐柱一體成型。In an embodiment of the invention, the housing is integrally formed with the support post.
在本發明之一實施例中，上述之上蓋與底板的材質為金屬。In an embodiment of the invention, the upper cover and the bottom plate are made of metal.
在本發明之一實施例中，上述之殼體的材質為塑膠。In an embodiment of the invention, the housing is made of plastic.
在本發明之一實施例中，上述之上蓋與殼體一體成型。In an embodiment of the invention, the upper cover is integrally formed with the housing.
本發明提出一種風扇模組，適用於一電子裝置。風扇模組包括一底板、一上蓋、一側壁及一散熱風扇。上蓋的一第一部分的厚度大於上蓋的一第一部分的厚度。側壁組設在上蓋與底板之間，其中側壁、上蓋與底板構成一容納空間。散熱風扇配置於底板上而位於容納空間內。The invention provides a fan module suitable for an electronic device. The fan module includes a bottom plate, an upper cover, a side wall and a cooling fan. The thickness of a first portion of the upper cover is greater than the thickness of a first portion of the upper cover. The side wall is disposed between the upper cover and the bottom plate, wherein the side wall, the upper cover and the bottom plate form an accommodation space. The cooling fan is disposed on the bottom plate and is located in the receiving space.
在本發明之一實施例中，上述之上蓋與側壁一體成型。In an embodiment of the invention, the upper cover is integrally formed with the side wall.
在本發明之一實施例中，上述之電子裝置的一結構件接觸第一部分。結構件與第二部分之間具有間隙而形成一入風口，入風口連通容納空間。In an embodiment of the invention, a structural member of the electronic device contacts the first portion. A gap is formed between the structural member and the second portion to form an air inlet, and the air inlet communicates with the receiving space.
在本發明之一實施例中，上述之上蓋具有一開口，開口暴露容納空間，入風口透過開口連通容納空間。In an embodiment of the invention, the upper cover has an opening that exposes the receiving space, and the air inlet communicates with the receiving space through the opening.
在本發明之一實施例中，上述之上蓋與底板之間具有間距而形成一出風口，出風口連通容納空間。In an embodiment of the invention, the upper cover and the bottom plate have a spacing to form an air outlet, and the air outlet communicates with the receiving space.
在本發明之一實施例中，風扇模組更包括一支撐柱，其中支撐柱位於出風口且支撐於底板與上蓋之間。In an embodiment of the invention, the fan module further includes a support column, wherein the support column is located at the air outlet and supported between the bottom plate and the upper cover.
在本發明之一實施例中，上述之上蓋與支撐柱一體成型。In an embodiment of the invention, the upper cover is integrally formed with the support post.
在本發明之一實施例中，上述之上蓋與底板的材質為金屬。In an embodiment of the invention, the upper cover and the bottom plate are made of metal.
基於上述，在本發明的風扇模組中，疊設於上蓋的殼體可增強整體結構強度，使上蓋受壓迫時不易產生變形。藉此，可避免散熱風扇受到上蓋壓迫，以維持風扇模組的正常運作。Based on the above, in the fan module of the present invention, the housing stacked on the upper cover can enhance the overall structural strength, and the upper cover is less likely to be deformed when pressed. Thereby, the cooling fan can be prevented from being pressed by the upper cover to maintain the normal operation of the fan module.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1為本發明一實施例之風扇模組的立體圖。圖2為圖1之風扇模組的爆炸圖。請參考圖1，本實施例的風扇模組100包括一底板110、一上蓋120、一側壁130、一散熱風扇140及一殼體150。側壁130組設在上蓋120與底板110之間，且側壁130、上蓋120與底板110構成一容納空間160。散熱風扇140配置於底板110上而位於容納空間160內。殼體150疊設於上蓋120上，且上蓋120位於殼體150及底板110之間，其中殼體150與上蓋120可透過黏貼、鎖固或包覆射出的方式組裝在一起。在其它實施例中，殼體150亦可藉由其它方式組裝於上蓋120，本發明不對此加以限制。1 is a perspective view of a fan module according to an embodiment of the present invention. 2 is an exploded view of the fan module of FIG. 1. Referring to FIG. 1 , the fan module 100 of the present embodiment includes a bottom plate 110 , an upper cover 120 , a sidewall 130 , a cooling fan 140 , and a housing 150 . The side wall 130 is disposed between the upper cover 120 and the bottom plate 110, and the side wall 130, the upper cover 120 and the bottom plate 110 form a receiving space 160. The cooling fan 140 is disposed on the bottom plate 110 and located in the accommodating space 160. The housing 150 is stacked on the upper cover 120, and the upper cover 120 is located between the housing 150 and the bottom plate 110. The housing 150 and the upper cover 120 can be assembled by being attached, locked or covered. In other embodiments, the housing 150 can also be assembled to the upper cover 120 by other means, which is not limited by the present invention.
在上述配置方式之下，疊設於上蓋120的殼體150可增強整體結構強度，使上蓋120受壓迫時不易產生變形。藉此，可避免散熱風扇140受到上蓋120壓迫，以維持風扇模組100的正常運作。Under the above configuration, the housing 150 stacked on the upper cover 120 can enhance the overall structural strength, so that the upper cover 120 is less likely to be deformed when pressed. Thereby, the heat dissipation fan 140 can be prevented from being pressed by the upper cover 120 to maintain the normal operation of the fan module 100.
本實施例的風扇模組100例如是用於筆記型電腦(notebook computer)，用以對筆記型電腦內部的發熱元件進行散熱。在其它實施例中，風扇模組100可用於其它種類之電子裝置，本發明不對此加以限制。The fan module 100 of this embodiment is, for example, a notebook computer for dissipating heat from a heat generating component inside the notebook computer. In other embodiments, the fan module 100 can be used in other types of electronic devices, and the invention is not limited thereto.
圖3為圖1之風扇模組應用於電子裝置的局部側視圖。為使圖式較為清楚，圖3僅繪示出電子裝置的結構件50。結構件50例如為電子裝置內鄰近風扇模組100的機殼或元件，本發明不對此加以限制。請參考圖1至圖3，在本實施例中，殼體150覆蓋上蓋120的一第一部分122且暴露上蓋120的一第二部分124。上蓋120具有一開口126，開口126暴露容納空間160。結構件50接觸殼體150，結構件50與第二部分124之間具有間隙而形成一入風口170，入風口170透過開口126連通容納空間160。此外，如圖1所示，殼體150與底板110之間具有間距而形成一出風口180，出風口180連通容納空間160。藉此，當風扇模組100運作時，散熱氣流可透過入風口170進入風扇模組100，並透過出風口180從風扇模組100排出，以利散熱的進行。3 is a partial side elevational view of the fan module of FIG. 1 applied to an electronic device. In order to make the drawings clearer, FIG. 3 only shows the structural member 50 of the electronic device. The structural member 50 is, for example, a casing or an element adjacent to the fan module 100 in the electronic device, which is not limited by the present invention. Referring to FIG. 1 to FIG. 3 , in the embodiment, the housing 150 covers a first portion 122 of the upper cover 120 and exposes a second portion 124 of the upper cover 120 . The upper cover 120 has an opening 126 that exposes the receiving space 160. The structural member 50 contacts the housing 150, and the gap between the structural member 50 and the second portion 124 forms an air inlet 170. The air inlet 170 communicates with the receiving space 160 through the opening 126. In addition, as shown in FIG. 1 , the housing 150 and the bottom plate 110 have a spacing to form an air outlet 180 , and the air outlet 180 communicates with the receiving space 160 . Therefore, when the fan module 100 is in operation, the heat dissipation airflow can enter the fan module 100 through the air inlet 170 and be discharged from the fan module 100 through the air outlet 180 to facilitate heat dissipation.
在薄型化的電子裝置中，風扇模組100與結構件50的配置位置會非常靠近。在上蓋120上疊設殼體150可提升風扇模組100的結構強度，使上蓋120與散熱風扇140不會因電子裝置薄型化的設計而受到結構件50壓迫。此外，如上述方式將殼體150設計為僅覆蓋上蓋120的第一部分122並暴露上蓋120的第二部分124，而在上蓋120 與結構件50之間形成入風口170，可避免鄰近風扇模組100的結構件50阻礙散熱氣流的流動。In the thinned electronic device, the arrangement positions of the fan module 100 and the structural member 50 are very close. Stacking the housing 150 on the upper cover 120 can increase the structural strength of the fan module 100, so that the upper cover 120 and the heat dissipation fan 140 are not pressed by the structural member 50 due to the thin design of the electronic device. Further, the housing 150 is designed to cover only the first portion 122 of the upper cover 120 and expose the second portion 124 of the upper cover 120 as in the above manner, while the upper cover 120 is The air inlet 170 is formed between the structural member 50 and the structural member 50 adjacent to the fan module 100 to prevent the flow of the heat dissipation airflow.
本實施例中的風扇模組100還包括一支撐柱190。支撐柱190位於出風口180且支撐於底板110與殼體150之間，以進一步提升風扇模組100的結構強度。詳細而言，本實施例的殼體150具有一延伸部152，延伸部152連接於殼體150的邊緣，支撐柱190支撐於底板110與延伸部152之間。The fan module 100 in this embodiment further includes a support post 190. The support column 190 is located at the air outlet 180 and supported between the bottom plate 110 and the housing 150 to further enhance the structural strength of the fan module 100. In detail, the housing 150 of the present embodiment has an extending portion 152 connected to the edge of the housing 150 , and the support post 190 is supported between the bottom plate 110 and the extending portion 152 .
在本實施例中，底板110及上蓋120的材質例如為鋁、鎂等金屬材料而具有較輕的重量及較佳的結構強度。殼體150、支撐柱190及側壁130的材質例如為塑膠，使殼體150、支撐柱190及側壁130能夠藉由射出成形的方式同時被製造出，而為一體成型的結構。在其它實施例中，底板110、上蓋120及殼體150可選用其它適當材料，本發明不對此加以限制。In the present embodiment, the material of the bottom plate 110 and the upper cover 120 is, for example, a metal material such as aluminum or magnesium, and has a light weight and a preferable structural strength. The material of the housing 150, the support post 190, and the side wall 130 is, for example, plastic, and the housing 150, the support post 190, and the side wall 130 can be simultaneously manufactured by injection molding, and are integrally formed. In other embodiments, the bottom plate 110, the upper cover 120, and the housing 150 may be other suitable materials, which are not limited by the present invention.
在其它實施例中，上蓋120也可與殼體150一體成型。在上蓋120與殼體150一體成型的情況下，殼體150可視為上蓋120的一部分，而使上蓋120在此部分具有較大的厚度。以下藉由圖式對此加以詳細說明。In other embodiments, the upper cover 120 can also be integrally formed with the housing 150. In the case where the upper cover 120 is integrally formed with the housing 150, the housing 150 can be regarded as a part of the upper cover 120, and the upper cover 120 has a larger thickness in this portion. This will be described in detail below by means of the drawings.
圖4為本發明另一實施例之風扇模組的立體圖。圖5為圖4之風扇模組的爆炸圖。請參考圖4，本實施例的風扇模組200包括一底板210、一上蓋220、一側壁230及一散熱風扇240。上蓋220的一第一部分222的厚度大於上蓋220的一第二部分224的厚度。側壁230組設在上蓋220與底板210之間，且側壁230、上蓋220與底板210構成一容納空間260。散熱風扇240配置於底板210上而位於容納空間260內。4 is a perspective view of a fan module according to another embodiment of the present invention. Figure 5 is an exploded view of the fan module of Figure 4. Referring to FIG. 4 , the fan module 200 of the embodiment includes a bottom plate 210 , an upper cover 220 , a side wall 230 , and a cooling fan 240 . A first portion 222 of the upper cover 220 has a thickness greater than a thickness of a second portion 224 of the upper cover 220. The side wall 230 is disposed between the upper cover 220 and the bottom plate 210, and the side wall 230, the upper cover 220 and the bottom plate 210 form a receiving space 260. The cooling fan 240 is disposed on the bottom plate 210 and located in the accommodating space 260.
在上述配置方式之下，上蓋220的第一部分222可增強整體結構強度，使上蓋220受壓迫時不易產生變形。藉此，可避免散熱風扇240受到上蓋220壓迫，以維持風扇模組200的正常運作。Under the above configuration, the first portion 222 of the upper cover 220 can enhance the overall structural strength, so that the upper cover 220 is less susceptible to deformation when pressed. Thereby, the cooling fan 240 can be prevented from being pressed by the upper cover 220 to maintain the normal operation of the fan module 200.
圖6為圖4之風扇模組應用於電子裝置的局部側視圖。為使圖式較為清楚，圖6僅繪示出電子裝置的結構件50。結構件50例如為電子裝置內鄰近風扇模組200的機殼或元件，本發明不對此加以限制。請參考圖4至圖6，在本實施例中，電子裝置的結構件50接觸第一部分222，結構件50與第二部分224之間具有間隙而形成一入風口270，入風口270連通容納空間260。上蓋220具有一開口226，開口226暴露容納空間260，入風口270透過開口226連通容納空間260。此外，如圖4所示，上蓋220與底板210之間具有間距而形成一出風口280，出風口280連通容納空間260。藉此，當風扇模組200運作時，散熱氣流可透過入風口270進入風扇模組200，並透過出風口280從風扇模組200排出，以利散熱的進行。6 is a partial side elevational view of the fan module of FIG. 4 applied to an electronic device. In order to make the drawings clearer, FIG. 6 only shows the structural member 50 of the electronic device. The structural member 50 is, for example, a casing or an element adjacent to the fan module 200 in the electronic device, which is not limited by the present invention. Referring to FIG. 4 to FIG. 6 , in the embodiment, the structural member 50 of the electronic device contacts the first portion 222 , and the gap between the structural member 50 and the second portion 224 forms an air inlet 270 , and the air inlet 270 communicates with the receiving space. 260. The upper cover 220 has an opening 226 that exposes the receiving space 260 through which the air inlet 270 communicates with the receiving space 260. In addition, as shown in FIG. 4, the upper cover 220 and the bottom plate 210 have a spacing to form an air outlet 280, and the air outlet 280 communicates with the receiving space 260. Therefore, when the fan module 200 is in operation, the heat dissipation airflow can enter the fan module 200 through the air inlet 270, and is discharged from the fan module 200 through the air outlet 280 to facilitate heat dissipation.
在薄型化的電子裝置中，風扇模組200與結構件50的配置位置會非常靠近。故上蓋220增加厚度可提升風扇模組200的結構強度，使上蓋220與散熱風扇240不會因電子裝置薄型化的設計而受到結構件50壓迫。此外，如上述方式將上蓋220設計為第一部分222的厚度大於第二部分224的厚度，而在上蓋220與結構件50之間形成入風口270，可避免鄰近風扇模組200的結構件50阻礙散熱氣流的流動。In the thinned electronic device, the arrangement positions of the fan module 200 and the structural member 50 are very close. Therefore, increasing the thickness of the upper cover 220 can increase the structural strength of the fan module 200, so that the upper cover 220 and the heat dissipation fan 240 are not pressed by the structural member 50 due to the thin design of the electronic device. In addition, the upper cover 220 is designed such that the thickness of the first portion 222 is greater than the thickness of the second portion 224, and the air inlet 270 is formed between the upper cover 220 and the structural member 50 to avoid obstruction of the structural member 50 adjacent to the fan module 200. The flow of the cooling airflow.
本實施例中的風扇模組200更包括一支撐柱290。支撐柱290位於出風口280且支撐於底板210與上蓋220之間，以進一步提升風扇模組200的結構強度。The fan module 200 in this embodiment further includes a support column 290. The support column 290 is located at the air outlet 280 and supported between the bottom plate 210 and the upper cover 220 to further enhance the structural strength of the fan module 200.
在本實施例中，底板210及上蓋220的材質例如為鋁、鎂等金屬材料而具有較輕的重量及較佳的結構強度。在其它實施例中，底板210及上蓋220可選用其它適當材料，本發明不對此加以限制。此外，支撐柱290與上蓋220可為一體成型。In the present embodiment, the material of the bottom plate 210 and the upper cover 220 is, for example, a metal material such as aluminum or magnesium, and has a light weight and a good structural strength. In other embodiments, the bottom plate 210 and the upper cover 220 may be made of other suitable materials, which are not limited by the present invention. In addition, the support post 290 and the upper cover 220 may be integrally formed.
綜上所述，在本發明的風扇模組中，疊設於上蓋的殼體可增強整體結構強度，使上蓋受壓迫時不易產生變形。藉此，可避免散熱風扇受到上蓋壓迫，以維持風扇模組的正常運作。此外，可在出風口處形成支撐於底板與殼體之間的支撐柱，以進一步提升風扇模組的結構強度。In summary, in the fan module of the present invention, the housing stacked on the upper cover can enhance the overall structural strength, and the upper cover is less likely to be deformed when pressed. Thereby, the cooling fan can be prevented from being pressed by the upper cover to maintain the normal operation of the fan module. In addition, a support column supported between the bottom plate and the housing may be formed at the air outlet to further enhance the structural strength of the fan module.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
50．．．結構件50. . . Structure
100、200．．．風扇模組100, 200. . . Fan module
110、210．．．底板110, 210. . . Bottom plate
120、220．．．上蓋120, 220. . . Upper cover
122、222．．．第一部分122, 222. . . first part
124、224．．．第二部分124, 224. . . the second part
126、226．．．開口126, 226. . . Opening
130、230．．．側壁130, 230. . . Side wall
140、240．．．散熱風扇140, 240. . . Cooling fan
150．．．殼體150. . . case
152．．．延伸部152. . . Extension
160、260．．．容納空間160, 260. . . Accommodating space
170、270．．．入風口170, 270. . . Air inlet
180、280．．．出風口180, 280. . . Air outlet
190、290．．．支撐柱190, 290. . . Support column
圖1為本發明一實施例之風扇模組的立體圖。1 is a perspective view of a fan module according to an embodiment of the present invention.
圖2為圖1之風扇模組的爆炸圖。2 is an exploded view of the fan module of FIG. 1.
圖3為圖1之風扇模組應用於電子裝置的局部側視圖。3 is a partial side elevational view of the fan module of FIG. 1 applied to an electronic device.
圖4為本發明另一實施例之風扇模組的立體圖。4 is a perspective view of a fan module according to another embodiment of the present invention.
圖5為圖4之風扇模組的爆炸圖。Figure 5 is an exploded view of the fan module of Figure 4.
圖6為圖4之風扇模組應用於電子裝置的局部側視圖。6 is a partial side elevational view of the fan module of FIG. 4 applied to an electronic device.
100．．．風扇模組100. . . Fan module
110．．．底板110. . . Bottom plate
120．．．上蓋120. . . Upper cover
124．．．第二部分124. . . the second part
126．．．開口126. . . Opening
130．．．側壁130. . . Side wall
140．．．散熱風扇140. . . Cooling fan
150．．．殼體150. . . case
152．．．延伸部152. . . Extension
160．．．容納空間160. . . Accommodating space
180．．．出風口180. . . Air outlet
190．．．支撐柱190. . . Support column
Claims (19)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161489672P | 2011-05-24 | 2011-05-24 |
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| TW201248019A TW201248019A (en) | 2012-12-01 |
| TWI480471B true TWI480471B (en) | 2015-04-11 |
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| TW101101783A TWI480471B (en) | 2011-05-24 | 2012-01-17 | Fan module |
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| US (1) | US20120301281A1 (en) |
| CN (1) | CN102802380B (en) |
| TW (1) | TWI480471B (en) |
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| TW201418581A (en) * | 2012-11-15 | 2014-05-16 | Hon Hai Prec Ind Co Ltd | Cooling fan and cooling device with cooling fan |
| TWI530243B (en) * | 2012-12-20 | 2016-04-11 | 仁寶電腦工業股份有限公司 | Elecrronic apparatus |
| TWI537478B (en) * | 2013-10-09 | 2016-06-11 | 仁寶電腦工業股份有限公司 | Fan module |
| CN105090063B (en) * | 2014-05-21 | 2017-09-19 | 台达电子工业股份有限公司 | Fan assembly |
| US9890496B2 (en) * | 2014-09-30 | 2018-02-13 | Haier Us Appliance Solutions, Inc. | Impeller housing for an appliance |
| CN105283053B (en) * | 2015-11-30 | 2017-08-25 | 英业达科技有限公司 | Radiating module |
| CN107734939B (en) * | 2017-11-20 | 2020-02-28 | 英业达科技有限公司 | Airflow generating device |
| TWI727887B (en) * | 2020-02-26 | 2021-05-11 | 宏達國際電子股份有限公司 | Electronic device |
| TWI772044B (en) * | 2021-05-31 | 2022-07-21 | 英業達股份有限公司 | Heat dissipation device |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20120301281A1 (en) | 2012-11-29 |
| TW201248019A (en) | 2012-12-01 |
| CN102802380B (en) | 2015-03-04 |
| CN102802380A (en) | 2012-11-28 |
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