US20120301281A1 - Fan module - Google Patents
Fan module Download PDFInfo
- Publication number
- US20120301281A1 US20120301281A1 US13/419,429 US201213419429A US2012301281A1 US 20120301281 A1 US20120301281 A1 US 20120301281A1 US 201213419429 A US201213419429 A US 201213419429A US 2012301281 A1 US2012301281 A1 US 2012301281A1
- Authority
- US
- United States
- Prior art keywords
- top cover
- fan module
- bottom plate
- housing
- accommodating space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/4206—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
- F04D29/4226—Fan casings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/601—Mounting; Assembling; Disassembling specially adapted for elastic fluid pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/62—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps
- F04D29/624—Mounting; Assembling; Disassembling of radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
- F04D29/626—Mounting or removal of fans
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
- F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
A fan module suitable for an electronic apparatus is provided. The fan module includes a bottom plate, a top cover. a sidewall, a heat-dissipating fan and a housing. The sidewall is assembled between the top cover and the bottom plate. The sidewall, the top cover and the bottom plate together form an accommodating space. The heat-dissipating fan is disposed on the bottom plate and located in the accommodating space. The housing is stacked on the top cover.
Description
- This application claims the priority benefits of U.S. provisional application Ser. No. 61/489,672, filed on May 24, 2011. The entirety of the above-mentioned patent applications is hereby incorporated by reference herein and made a part of this specification.
- 1. Field of the Invention
- The invention generally relates to a fan module, and more particularly, to a fan module suitable for an electronic apparatus.
- 2. Description of Related Art
- In order to meet the requirements of high speed, high performance, light-weight, small-size and low-profile of current electronic products, various portable electronic products have become the main stream in the market. As far as a notebook computer is concerned, because the notebook computer has only a limited space for receiving a heat dissipating system, how to enhance the heat dissipating efficiency in the limited space has become one of the research focuses in the electronics industry.
- In general, a notebook computer is normally equipped with a fan module to dissipate heat on the heat-generating components inside a notebook computer. To reduce the weight and the thickness of the integrated structure, the top cover and the bottom plate for the fan module to accommodate the heat-dissipating fan have thinner thicknesses by design, and the distance between the heat-dissipating fan and the top cover and the distances between the top cover and other structure parts inside the notebook computer are also smaller by design. Such design can be, in particular, suitable for an ultra-thin type notebook computer where light-thin-portable features are dominated design consideration.
- However, a thinner top cover has accordingly a lower structure strength. When the distance between the heat-dissipating fan and the top cover and the distances between the top cover and other structure parts inside the notebook computer are smaller, the top cover is easily deformed by the pressing of the above-mentioned structure parts so that the normal operation of the fan module is affected by the pressing of the top cover on the heat-dissipating fan.
- Accordingly, the invention is directed to a fan module with better structure strength.
- The invention provides a fan module suitable for an electronic apparatus. The fan module includes a bottom plate, a top cover. a sidewall, a heat-dissipating fan and a housing. The sidewall is assembled between the top cover and the bottom plate, in which the sidewall, the top cover and the bottom plate together form an accommodating space. The heat-dissipating fan is disposed on the bottom plate and located in the accommodating space. The housing is stacked on the top cover.
- In an embodiment of the present invention, the above-mentioned housing and sidewall are integrally formed.
- In an embodiment of the present invention, the above-mentioned housing covers a first portion of the top cover and exposes a second portion of the top cover, a structure part of the electronic apparatus contacts the housing, the structure part and the second portion have a gap therebetween to form an inlet and the inlet is communicated with the accommodating space.
- In an embodiment of the present invention, the above-mentioned top cover has an opening, the opening exposes the accommodating space and the inlet is communicated with the accommodating space through the opening.
- In an embodiment of the present invention, the above-mentioned housing and bottom plate have an interval therebetween to form an outlet and the outlet is communicated with the accommodating space.
- In an embodiment of the present invention, the above-mentioned fan module further includes a supporting pillar, in which the supporting pillar is located at the outlet and supported between the bottom plate and the housing.
- In an embodiment of the present invention, the above-mentioned housing has an extension portion, the extension portion is connected to an edge of the housing and the supporting pillar is supported between the bottom plate and the extension portion.
- In an embodiment of the present invention, the above-mentioned housing and supporting pillar are integrally formed.
- In an embodiment of the present invention, the materials of the above-mentioned top cover and bottom plate are metal.
- In an embodiment of the present invention, the material of the above-mentioned housing is plastic.
- In an embodiment of the present invention, the above-mentioned top cover and housing are integrally formed.
- The invention also provides a fan module suitable for an electronic apparatus and the fan module includes a bottom plate, a top cover, a sidewall and a heat-dissipating fan. The thickness of a first portion of the top cover is greater than the thickness of a second portion of the top cover. The sidewall is assembled between the top cover and the bottom plate, in which the sidewall, the top cover and the bottom plate together form an accommodating space. The heat-dissipating fan is disposed on the bottom plate and located in the accommodating space.
- In an embodiment of the present invention, the above-mentioned top cover and sidewall are integrally formed.
- In an embodiment of the present invention, a structure part of the above-mentioned electronic apparatus contacts the first portion, the structure part and the second portion have a gap therebetween to form an inlet and the inlet is communicated with the accommodating space.
- In an embodiment of the present invention, the above-mentioned top cover has an opening, the opening exposes the accommodating space and the inlet is communicated with the accommodating space through the opening.
- In an embodiment of the present invention, the above-mentioned top cover and bottom plate have an interval therebetween to form an outlet and the outlet is communicated with the accommodating space.
- In an embodiment of the present invention, the above-mentioned fan module further includes a supporting pillar, in which the supporting pillar is located at the outlet and supported between the bottom plate and the top cover.
- In an embodiment of the present invention, the above-mentioned top cover and supporting pillar are integrally formed.
- In an embodiment of the present invention, the materials of the above-mentioned top cover and bottom plate are metal.
- Based on the description above, in the fan module of the invention, the housing stacked on the top cover can improve the whole structure strength, so that when the top cover is pressed, the top cover is unlikely deformed. In this way, the heat-dissipating fan is prevented from being pressed by the top cover to maintain the normal operation of the fan module.
- Other objectives, features and advantages of the present invention will be further understood from the further technological features disclosed by the embodiments of the present invention wherein there are shown and described preferred embodiments of this invention, simply by way of illustration of modes best suited to carry out the invention.
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FIG. 1 is a schematic three-dimensional diagram of a fan module according to an embodiment of the invention. -
FIG. 2 is an exploded diagram of the fan module ofFIG. 1 . -
FIG. 3 is a partial side-view diagram for the fan module ofFIG. 1 used in an electronic apparatus. -
FIG. 4 is a schematic three-dimensional diagram of a fan module according to another embodiment of the invention. -
FIG. 5 is an exploded diagram of the fan module ofFIG. 4 . -
FIG. 6 is a partial side-view diagram for the fan module ofFIG. 4 used in an electronic apparatus. -
FIG. 1 is a schematic three-dimensional diagram of a fan module according to an embodiment of the invention andFIG. 2 is an exploded diagram of the fan module ofFIG. 1 . Referring toFIG. 1 , afan module 100 of the embodiment includes abottom plate 110, atop cover 120, asidewall 130, a heat-dissipatingfan 140 and ahousing 150. Thesidewall 130 is assembled between thetop cover 120 and thebottom plate 110, and thesidewall 130, thetop cover 120 and thebottom plate 110 together form anaccommodating space 160. The heat-dissipatingfan 140 is disposed on thebottom plate 110 and located in theaccommodating space 160. Thehousing 150 is stacked on thetop cover 120, and thetop cover 120 is located between thehousing 150 and thebottom plate 110, in which thehousing 150 and thetop cover 120 can be assembled together through adhering, fastening or coating-injection. In other embodiments, thehousing 150 can be assembled at thetop cover 120 through other processes, which the invention is not limited to. - Under the above-mentioned layout, the
housing 150 stacked on thetop cover 120 can improve the entire structure strength so that thetop cover 120 is unlikely to deform under pressing force. In this way, the design can prevent the heat-dissipatingfan 140 from being pressed by thetop cover 120 to maintain the normal operation of thefan module 100. - The
fan module 100 of the embodiment is used, for example, in a notebook computer to dissipate heat on the heat-generating components inside a notebook computer. In other embodiments, thefan module 100 can be used in other kinds of electronic apparatus, which the invention is not limited to. -
FIG. 3 is a partial side-view diagram for the fan module ofFIG. 1 used in an electronic apparatus. For description simplicity, inFIG. 3 , only astructure part 50 of the electronic apparatus is shown. Thestructure part 50 is, for example, a casing or a component adjacent to thefan module 100 inside an electronic apparatus, which the invention is not limited to. Referring toFIGS. 1-3 , in the embodiment, thehousing 150 covers afirst portion 122 of thetop cover 120 and exposes asecond portion 124 of thetop cover 120, and thetop cover 120 has anopening 126 to expose theaccommodating space 160. Thestructure part 50 contacts thehousing 150, thestructure part 50 and thesecond portion 124 have a gap therebetween to form an inlet 170, and the inlet 170 is communicated with theaccommodating space 160 through theopening 126. In addition, as shown byFIG. 1 , thehousing 150 and thebottom plate 110 have an interval therebetween to form anoutlet 180 and theoutlet 180 is communicated with theaccommodating space 160. In this way, when thefan module 100 is running, the cooling air-current can enter thefan module 100 through the inlet 170 and can be expelled from thefan module 100 through theoutlet 180 to make the cooling easier. - In a slim electronic apparatus, the
fan module 100 and thestructure part 50 are disposed very closely. By stacking thehousing 150 on thetop cover 120, the structure strength of thefan module 100 is enhanced, which limits the possibility of thetop cover 120 and the heat-dissipatingfan 140 being pressed by thestructure part 50 due to the slimming design of the electronic apparatus. In addition, the above-mentioned design that thehousing 150 only covers thefirst portion 122 of thetop cover 120 and exposes thesecond portion 124 of thetop cover 120 and that thetop cover 120 and thestructure part 50 together form the inlet 170 therebetween can prevent thestructure part 50 adjacent to thefan module 100 from blocking the flowing of the cooling air-current. - In the embodiment, the
fan module 100 further includes a supportingpillar 190. The supportingpillar 190 is located at theoutlet 180 and supported between thebottom plate 110 and thehousing 150 to further enhance the structure strength of thefan module 100. In more details, thehousing 150 of the embodiment has anextension portion 152, theextension portion 152 is connected at an edge of thehousing 150 and the supportingpillar 190 is supported between thebottom plate 110 and theextension portion 152. - In the embodiment, the materials of the
bottom plate 110 and thetop cover 120 are a metallic material with light weight and better structure strength, for example, aluminium or magnesium. The materials of thehousing 150, the supportingpillar 190 and thesidewall 130 are, for example, plastic, which enables thehousing 150, the supportingpillar 190 and thesidewall 130 to be simultaneously fabricated by injection moulding. In other embodiments, thehousing 150, the supportingpillar 190 and thesidewall 130 can be made of other appropriate materials, which the invention is not limited to. - In other embodiments, the
top cover 120 can be integrally formed with thehousing 150. When thetop cover 120 and thehousing 150 are integrally formed, thehousing 150 can be treated as a portion of thetop cover 120, so that the portion oftop cover 120 has a larger thickness, which would be explained in following through some figures. -
FIG. 4 is a schematic three-dimensional diagram of a fan module according to another embodiment of the invention andFIG. 5 is an exploded diagram of the fan module ofFIG. 4 . Referring toFIG. 4 , a fan module 200 of the embodiment includes abottom plate 210, atop cover 220, asidewall 230 and a heat-dissipatingfan 240. The thickness of afirst portion 222 of thetop cover 220 is greater than the thickness of asecond portion 224 of thetop cover 220. Thesidewall 230 is assembled between thetop cover 220 and thebottom plate 210, and thesidewall 230, thetop cover 220 and thebottom plate 210 together form anaccommodating space 260. - Under the above-mentioned layout, the
first portion 222 of thetop cover 220 is able to improve the entire structure strength so that thetop cover 220 is unlikely to deform by pressing force, which can accordingly prevent the heat-dissipatingfan 240 from being pressed by thetop cover 220 to maintain the normal operation of the fan module 200. -
FIG. 6 is a partial side-view diagram for the fan module ofFIG. 4 used in an electronic apparatus. For description simplicity, inFIG. 6 , only astructure part 50 of the electronic apparatus is shown. Thestructure part 50 is, for example, a casing or a component adjacent, to the fan module 200 inside an electronic apparatus, which the invention is not limited to. Referring toFIGS. 4-6 , in the embodiment, thestructure part 50 contacts thefirst portion 222, thestructure part 50 and thesecond portion 224 have a gap therebetween to form an inlet 270, and the inlet 270 is communicated with theaccommodating space 260. In addition, thetop cover 220 has anopening 226, in which theopening 226 exposes theaccommodating space 260 and the inlet 270 is communicated with theaccommodating space 260 through theopening 226. As shown byFIG. 4 , thetop cover 220 and thebottom plate 210 have an interval therebetween to form anoutlet 280 and theoutlet 280 is communicated with theaccommodating space 260. In this way, when the fan module 200 is running, the cooling air-current can enter the fan module 200 through the inlet 270 and can be expelled from the fan module 200 through theoutlet 280 to make the cooling easier. - In a slim electronic apparatus, the positions where the fan module 200 and the
structure part 50 are disposed are very close. By increasing the thickness of thetop cover 220, the structure strength of the fan module 200 is advanced, and so that thetop cover 220 and the heat-dissipatingfan 240 will not be pressed by thestructure part 50 due to the slimming design of the electronic apparatus. In addition, the above-mentioned design that the thickness of thefirst portion 222 of thetop cover 220 is greater than the thickness of thesecond portion 224 and there is an inlet 270 between thetop cover 220 and thestructure part 50 can prevent thestructure part 50 adjacent to the fan module 200 from blocking the flowing of the cooling air-current. - In the embodiment, the fan module 200 further includes a supporting
pillar 290. The supportingpillar 290 is located at theoutlet 280 and supported between thebottom plate 210 and thetop cover 220 to further advance the structure strength of the fan module 200. - In the embodiment, the materials of the
bottom plate 210 and thetop cover 220 are a metallic material with light weight and better structure strength, for example, aluminium or magnesium. In other embodiments, thebottom plate 210 and thetop cover 220 can be made of other appropriate materials, which the invention is not limited to. In addition, the supportingpillar 290 and thetop cover 220 can be integrally formed. - In summary, in the fan module of the invention, the housing stacked on the top cover can improve the whole structure strength, so that when the top cover is pressed, the top cover is unlikely to deform. In this way, the heat-dissipating fan is prevented from being pressed by the top cover to maintain the normal operation of the fan module. In addition, the invention disposes a supporting pillar at the outlet and supported between the bottom plate and the housing to further advance the structure strength of the fan module.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (19)
1. A fan module, suitable for an electronic apparatus and comprising:
a bottom plate;
a top cover;
a sidewall, assembled between the top cover and the bottom plate, wherein the sidewall, the top cover and the bottom plate together form an accommodating space;
a heat-dissipating fan, disposed on the bottom plate and located in the accommodating space; and
a housing, stacked on the top cover.
2. The fan module as claimed in claim 1 , wherein the housing and the sidewall are integrally formed.
3. The fan module as claimed in claim 1 , wherein the housing covers a first portion of the top cover and exposes a second portion of the top cover, a structure part of the electronic apparatus contacts the housing, the structure part and the second portion have a gap therebetween to form an inlet and the inlet is communicated with the accommodating space.
4. The fan module as claimed in claim 3 , wherein the top cover has an opening, the opening exposes the accommodating space and the inlet is communicated with the accommodating space through the opening.
5. The fan module as claimed in claim 1 , wherein the housing and the bottom plate have an interval therebetween to form an outlet and the outlet is communicated with the accommodating space.
6. The fan module as claimed in claim 5 , further comprising a supporting pillar, wherein the supporting pillar is located at the outlet and supported between the bottom plate and the housing.
7. The fan module as claimed in claim 6 , wherein the housing has an extension portion, the extension portion is connected to an edge of the housing and the supporting pillar is supported between the bottom plate and the extension portion.
8. The fan module as claimed in claim 6 , wherein the housing and the supporting pillar are integrally formed.
9. The fan module as claimed in claim 1 , wherein the materials of the top cover and the bottom plate are metal.
10. The fan module as claimed in claim 1 , wherein the material of the housing is plastic.
11. The fan module as claimed in claim 1 , wherein the top cover and the housing are integrally formed.
12. A fan module, suitable for an electronic apparatus and comprising:
a bottom plate;
a top cover, the thickness of a first portion of the top cover is greater than the thickness of a second portion of the top cover;
a sidewall, assembled between the top cover and the bottom plate, wherein the sidewall, the top cover and the bottom plate together form an accommodating space; and
a heat-dissipating fan, disposed on the bottom plate and located in the accommodating space.
13. The fan module as claimed in claim 12 , wherein the top cover and the sidewall are integrally formed.
14. The fan module as claimed in claim 12 , wherein a structure part of the electronic apparatus contacts the first portion, the structure part and the second portion have a gap therebetween to form an inlet and the inlet is communicated with the accommodating space.
15. The fan module as claimed in claim 14 , wherein the top cover has an opening, the opening exposes the accommodating space and the inlet is communicated with the accommodating space through the opening.
16. The fan module as claimed in claim 12 , wherein the top cover and the bottom plate have an interval therebetween to form an outlet and the outlet is communicated with the accommodating space.
17. The fan module as claimed in claim 16 , further comprising a supporting pillar, wherein the supporting pillar is located at the outlet and supported between the bottom plate and the top cover.
18. The fan module as claimed in claim 17 , wherein the top cover and the supporting pillar are integrally formed.
19. The fan module as claimed in claim 12 , wherein the materials of the top cover and the bottom plate are metal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US13/419,429 US20120301281A1 (en) | 2011-05-24 | 2012-03-13 | Fan module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161489672P | 2011-05-24 | 2011-05-24 | |
US13/419,429 US20120301281A1 (en) | 2011-05-24 | 2012-03-13 | Fan module |
Publications (1)
Publication Number | Publication Date |
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US20120301281A1 true US20120301281A1 (en) | 2012-11-29 |
Family
ID=47201305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/419,429 Abandoned US20120301281A1 (en) | 2011-05-24 | 2012-03-13 | Fan module |
Country Status (3)
Country | Link |
---|---|
US (1) | US20120301281A1 (en) |
CN (1) | CN102802380B (en) |
TW (1) | TWI480471B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140133974A1 (en) * | 2012-11-15 | 2014-05-15 | Hon Hai Precision Industry Co., Ltd. | Cooling fan and cooling device with cooling fan |
US20140177173A1 (en) * | 2012-12-20 | 2014-06-26 | Compal Electronics, Inc. | Electronic apparatus |
CN105090063A (en) * | 2014-05-21 | 2015-11-25 | 台达电子工业股份有限公司 | Fan device |
CN105283053A (en) * | 2015-11-30 | 2016-01-27 | 英业达科技有限公司 | Heat-dissipating module |
US20160090682A1 (en) * | 2014-09-30 | 2016-03-31 | General Electric Company | Impeller housing for an appliance |
JP2021134786A (en) * | 2020-02-26 | 2021-09-13 | 宏達國際電子股▲ふん▼有限公司 | Electronic device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI537478B (en) * | 2013-10-09 | 2016-06-11 | 仁寶電腦工業股份有限公司 | Fan module |
CN107734939B (en) * | 2017-11-20 | 2020-02-28 | 英业达科技有限公司 | Airflow generating device |
TWI772044B (en) * | 2021-05-31 | 2022-07-21 | 英業達股份有限公司 | Heat dissipation device |
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2012
- 2012-01-17 TW TW101101783A patent/TWI480471B/en not_active IP Right Cessation
- 2012-02-14 CN CN201210032503.8A patent/CN102802380B/en not_active Expired - Fee Related
- 2012-03-13 US US13/419,429 patent/US20120301281A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
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CN102802380B (en) | 2015-03-04 |
TWI480471B (en) | 2015-04-11 |
CN102802380A (en) | 2012-11-28 |
TW201248019A (en) | 2012-12-01 |
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