201105458 六、發明說明： 【發明所屬之技術領域】 本發明有關於一種無心研磨技術，在使工作物（工件)旋轉 進行研磨時，不需利用其旋轉中心，而是旋轉、支持工作物 之外周面同時研磨工作物，特別是有關於一種在連續研磨多 數工件之情況時，改良為以縮短研磨砂輪之作業等待時間， 提高實際作業時間效率之進給方式之無心研磨方法，及適於 實施該方法之改良之無心研磨裝置。 【先前技術】 無心研磨裝置是在使研磨對象之工作物（工件）旋轉進行 研磨時，不利用該工作物之其旋轉中心，而是在被固定的支 持刀（刀片）和欲旋轉的調整砂輪之間’旋轉支持工作物之外 周面’使欲旋轉之研磨砂輪壓接在該欲旋轉之工作物之外周 面並進行研磨。另外，進給方式之無心研磨裝置係成為將調 整砂輪之旋轉軸和研磨砂輪之旋轉軸配置成平行之構造。 該無心研磨裝置之基本構造以圖5和圖6表示。 圖5⑷表示習知無心研磨裝置之正面外觀，無心研磨』 ^係在磨床21上搭載有研磨砂輪22和調整砂輪η 對向且互相離開而配置有刀片24。要被研狀〕 ^人疋轉之調整砂輪23和刀片24支持同時旋轉⑽ =::Γ輪22接觸，以對該工件進行研磨缕 a磨床21上面設置有調整砂輪滑動器25，並在該 TF995264 201105458 調整砂輪滑動器25搭載調整砂輪23和刀片24。 用以連結調整砂輪和研磨砂輪之直線成為水平，以其作為 X轴。但是為使工件穩定等目的，亦有如圖5(B)所示，使調 整砂輪滑動器25傾斜為習知例，此種情況之X軸形成與調 整砂輪之旋轉軸正交，且與傾斜之調整砂輪滑動器大致平 行。 圖6是圖5(A)所示之無心研磨裝置之分解立體圖。調整 φ 砂輪滑動器25係載置在磨床21上，利用調整砂輪滑動器驅 動機構25a，驅動成可相對於研磨砂輪22前進、後退。 另外，在一般無心研磨裝置設有使磨石台繞垂直轴轉動之 垂直旋轉盤，並設有使磨石台移動之手段作為維護用，或併 設有用來研磨（修整）研磨砂輪或調整砂輪之砂輪部分之修 整器，但是因為與本發明沒有直接關係，所以省略其圖示。 圖7表示習知無心研磨裝置之研磨作業，如圖7(A)所 φ 示，第1號之工件Wa由調整砂輪23和刀片24支持，以與 調整砂輪23之相反方向旋轉。 搭載有調整砂輪23和刀片24之調整砂輪滑動器25，在 往復箭頭f-r方向，藉由調整砂輪滑動器驅動機構25a驅動。 調整砂輪滑動器25在前進(箭頭f)方向移動，使工件與研 磨砂輪22接觸，且在同方向切入傳送。該移動、接觸、切 入傳送係為相對，亦可以將研磨砂輪22搭載在滑動器，在 箭頭r方向進行該移動、接觸、切入傳送。 TF995264 5 201105458 當上述第1 ¥ 观之工件Wa研磨完成時，如圖7(扪所 調整砂輪滑動写± ）厅不，使 25朝箭頭r方向後退，使用用以搬出工件 之卸載态6且如斡-κ 件 立如前碩a所示，搬出完成研磨之第丨號之工201105458 VI. Description of the Invention: [Technical Field] The present invention relates to a centerless grinding technique in which a workpiece (workpiece) is rotated without being rotated, and the workpiece is rotated. Simultaneously grinding the workpiece at the same time, in particular, in the case of continuously grinding a plurality of workpieces, the method is improved to a centerless grinding method for shortening the working waiting time of the grinding wheel and improving the efficiency of the actual working time, and is suitable for implementing the method Improved method of centerless grinding apparatus. [Prior Art] The centerless grinding device does not utilize the center of rotation of the workpiece when the workpiece (workpiece) of the object to be polished is rotated, but the fixed support blade (blade) and the adjustment wheel to be rotated. The 'rotation support work outer peripheral surface' is crimped to the outer surface of the workpiece to be rotated and ground. Further, the feedless centerless polishing apparatus has a structure in which the rotating shaft of the grinding wheel and the rotating shaft of the grinding wheel are arranged in parallel. The basic configuration of the centerless grinding apparatus is shown in Figs. 5 and 6. Fig. 5 (4) shows the front appearance of the conventional centerless polishing apparatus, and the centerless polishing is carried out by mounting the grinding wheel 22 on the grinding machine 21 and the adjusting grinding wheel η to face each other and to arrange the blade 24. The grinding wheel 23 and the blade 24 support the simultaneous rotation (10) =:: the wheel 22 contacts to grind the workpiece. The grinding wheel 21 is provided with an adjustment wheel slider 25, and TF995264 201105458 The adjustment wheel slider 25 is equipped with an adjustment grinding wheel 23 and a blade 24. The line for connecting the adjustment grinding wheel and the grinding wheel is leveled as the X axis. However, for the purpose of stabilizing the workpiece, etc., as shown in FIG. 5(B), the adjustment of the grinding wheel slider 25 is a conventional example. In this case, the X-axis is formed to be orthogonal to the rotation axis of the adjustment grinding wheel, and is inclined. Adjust the wheel sliders to be roughly parallel. Fig. 6 is an exploded perspective view of the centerless polishing apparatus shown in Fig. 5(A). The adjustment φ wheel slider 25 is placed on the grinding machine 21, and is driven to advance and retreat with respect to the grinding wheel 22 by the adjustment grinding wheel slider driving mechanism 25a. In addition, the general centerless grinding device is provided with a vertical rotating disk for rotating the grinding stone table around the vertical axis, and is provided with means for moving the grinding stone table for maintenance, or for grinding (trimming) the grinding wheel or adjusting the grinding wheel. The dresser of the grinding wheel portion, but since it is not directly related to the present invention, its illustration is omitted. Fig. 7 shows a grinding operation of a conventional centerless grinding apparatus. As shown in Fig. 7(A), the workpiece No. No. 1 is supported by the adjusting grinding wheel 23 and the blade 24 to rotate in the opposite direction to the adjusting grinding wheel 23. The adjustment grinding wheel slider 25 equipped with the adjustment grinding wheel 23 and the blade 24 is driven by the adjustment grinding wheel slider driving mechanism 25a in the reciprocating arrow f-r direction. The adjustment wheel slider 25 is moved in the forward (arrow f) direction to bring the workpiece into contact with the grinding wheel 22 and cut in and out in the same direction. The moving, contacting, and cutting transport systems are opposed to each other, and the grinding wheel 22 may be mounted on the slider to perform the movement, contact, and cut-in transmission in the direction of the arrow r. TF995264 5 201105458 When the grinding of the workpiece No. 1 of the above-mentioned 1st view is completed, as shown in Fig. 7 (the adjustment of the grinding wheel of the grinding wheel), the 25 is retracted in the direction of the arrow r, and the unloading state 6 for carrying out the workpiece is used and斡-κ 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立 立
Wa，又，估田田、 儿件 用用从搬入工件之裝載器7且如箭頭b ， 搬入未研磨之笛1 Dt 丁 弟2唬之工件Wb。在該步驟中調整 之後退亦為相對，亦可以使研磨砂輪22後退。"" 在匕’疼丁· Jf\ '件，完成研磨或未研磨係指與該圖所示之 磨^輪22所進行之研磨作業有關者，即使在圖外之上游 業站被粗研磨者’在本作業站亦為未研磨，即使在圖外之 游作業站進—步加卫研磨者，在本作業站為已完成研磨。 另外’搬出第1號之工件Wa(箭頭a)，搬入第2號之 WbU碩b)時’如圖7(c)所示，開始第2號之工件別 研磨。然後’重複進行該等步驟。 [先前技術文獻] [專利文獻] [專利文獻1]曰本專利特開2004414179號公報 [專利文獻2]日本專利特開2〇〇4_142〇〇8號公報 [非專利文獻] [非專利文獻1](財)機械振興協會技術研究所發行「加工 技術資料檔案」1982年第6卷+島利-著無心研磨 【發明内容】 (發明所欲解決之問題） TF995264 201105458 在圖7所示之習知進給方式之無心研磨中，在進行 之研磨實際作業後，在圖7⑻之更換工件之期間，研A) 輪22呈待機 '然後，至圖7(c)之再度開始研磨，產生等： 時間。其-實例是在研磨砂輪22，當實際研磨時間為$ 等待時間為3秒之情況時，實際作業之時間效率為5外+’ 3)=62.5% ’但是假如使等待時間從3秒縮短為2秒時，· •際作業之時間效率提高為5/(5 + 2) =714%。 μ • 树明針對上述之情況，其目的是提供-種可以格外提高 研磨實際作業之時間效率之無心研磨方法及適於實施上述 方法之無心研磨裝置。 (解決問題之手段） 對於本發明之基本原理，參照與其工實施形態對應之圖工 進行說明時，如下所述。 將第1調整砂輪(9)和第2調整砂輪(1〇)同軸並排，將該 .❿等搭載在調整砂輪滑動器（5)，而在箭頭&方向進行往復驅 動。 在直通進給研磨時，調整砂輪被搭载在垂直旋轉盤，具有 一疋之傳送角，但是在進給研磨時，調整砂輪之旋轉軸被配 置成與研磨砂輪(2)之旋轉軸大致平行。將該旋轉軸方向設 為Z軸，上述箭頭f-r方向與z軸呈直角。 在上述調整砂輪滑動器（5)搭载有2個刀片（4)，使其一方 與第1調整砂輪(9)對向且互相離開，使另外一方與第2調 TF995264 7 201105458 整砂輪（10)對向且互相離開，用來將該2個區域設定在可以 支持工件而進行研磨之第1研磨區域（11)和第2研磨區域 (12)。 另一方面，將研磨砂輪(2)搭載在研磨砂輪Z滑動器 (13)，且如箭頭L-R所示，可在Z軸方向往復驅動。利用 此種方式，被搭載之研磨砂輪(2)可以與第1研磨區域（11) 對向或與第2研磨區域（12)對向。習知，前例之構造是使研 磨砂輪移動以進行維護等，但是未構建成在2個之研磨區域 間往復。 依照此種構造之無心研磨裝置，如圖1所示，使研磨砂輪 (2)在箭頭R方向移動，且與第2調整砂輪（1〇)呈對向，在第 2研磨區域（12)於研磨工件（省略圖示）之期間，在第1研磨 區域（11)進行工件之更換，當第1研磨區域（11)之工件更換 完成時，使研磨砂輪(2)在箭頭L方向移動，且與第丨調整 砂輪(9)呈對向，可以在第1研磨區域（u)研磨工件（省略圖 示）。 依照此種方式’ 1個研磨砂輪(2)僅可在z軸方向移動，不 會有工件更換之等待時間，可以前進到下一個循環之實際研 磨作業。 根據上述原理，本發明之無心研磨方法，係使調整砂輪和 刀片對向且互相離開，並於所支持的工件使研磨砂輪接^而 進行研磨者，其特徵在於：利用同軸並排之第丨調整砂輪和 TF995264 8 201105458 第2調整砂輪構成上述調整砂輪’且設定使上述第1調整砂 輪與刀片對向且互相離開，並支持工件之第1研磨區域，同 時設定使上述第2調整砂輪和刀片對向且互相離開，並支持 工件之第2研磨區域；並重複地實行下述步驟：第1步驟’ 使上述研磨砂輪移動到第1研磨區域，並與由上述第1調整 • 砂輪與刀片所支持之工件接觸而進行研磨，且從上述第2 研磨區域搬出完成研磨之工件，將未研磨之工件搬入到該第 φ 2研磨區域；及第2步驟，使上述研磨砂輪移動到第2研磨 區域，並與由上述第2調整砂輪與刀片所支持之工件接觸而 進行研磨’且從上述第1研磨區域搬出完成研磨之工件’將 未研磨之工件搬入到該第1研磨區域。 另外，本發明之無心研磨方法，係將上述第1調整砂輪和 第2調整砂輪連設成一體，並作成具有研磨砂輪寬度2倍以 上之砂輪寬度的寬幅度調整砂輪。 _ 另外’本發明之無心研磨裝置，係使調整砂輪和刀片對向 且互相離開，使研磨砂輪與被支持之工件接觸而進行研磨 ‘ 者，其特徵在於：利用同軸並排之第1調整砂輪和第2調整 砂輪構成上述調整砂輪，使刀片與上述第1調整砂輪對向且 互相離開，而設定第1研磨區域，同時使刀片與上述第2 調整砂輪對向且互相離開，而設定第2研磨區域，且’設置 搭載上述研磨砂輪並在研磨砂輪之旋轉軸方向往復移動之 研磨砂輪滑動器，以使上述研磨砂輪在第1研磨區域和第2 TF995264 9 201105458 研磨區域之間往復移動。 另外，本發明之無心研磨裝置，係將上述第丨調整砂輪和 第2調整砂輪連設成一體，並作成具有研磨砂輪寬度2倍以 上之砂輪寬度的寬幅調整砂輪。 另外，本發明之無心研磨裝置，係設置有搭載上述第j 調整砂輪和第2調整砂輪’並在其旋轉軸方向移動之調整砂 輪滑動器。 另外，本發明之無心研磨裝置，係具備有與上述研磨砂輪 滑動器或調整砂輪滑動器連動，對未接近研磨砂輪之一方之 研磨區域搬入未研磨之工件之手段，以及搬出完成研磨之工 件之手段。 (發明效果） 依照本發明之無心研磨方法，因為使1個研磨砂輪在2 個之研磨區域之間往復，所以在沒有研磨砂輪之一方之研磨 區域，更換工件以進行研磨操作之準備，然後研磨砂輪在完 成準備之研磨區域可以進行研磨操作。利用此種方式，研磨 ◊輪不會產生更換工件之等待閒置時間，可以提高實際研磨 作業之時間效率。 另外’依照本發明之無心研磨裴置，經由設置滑動機構使 研磨0輪在2個之研磨區域間往復，可以充分地發揮其效 果。 另外’依照本發明之無心研磨裝置，因為隨著研磨作業對 TF995264 201105458 第1研磨區域和第2研磨區域進行工件之搬入和搬出，所以 可以連續地順利研磨多數之工件。 【實施方式】 圖1疋模式俯視圖’用來表示本發明之無心研磨裝置之第 1實施例。 無〜研磨裝置係在作為其基台之磨床i上設有研磨砂輪2 '滑動器13 ’其上搭載有研磨砂輪2。在圖：1中，將座標軸z φ設定成與研磨砂輪2之旋轉軸2a平行，χ軸與該乙軸正交。 研磨砂輪ζ滑動器13如箭頭L_R在ζ轴方向被往復驅 動。另外，在上述磨床1上亦設有調整砂輪滑動器5，配置 有在Ζ軸方向並排且共用旋轉軸之第1調整砂輪9和第2 調整砂輪10。 接著，使上述第i調整砂輪9和刀片4對向且互相離開， 在該區域支持功(省略圖*) ’使研磨砂輪接近該工件以進 # 行研磨’該區域成為第1研磨區域11。 同樣地’使第2調整砂輪1G和刀片4對向且互相離開， 在該區域域K省略_)，使研磨砂輪接賴工件以進 行研磨，將職域設為第2研純域12。這時，上述調整 砂輪滑動器5如箭頭f_r所示，在χ軸方向被往復驅動。 在圖^中，當將工件(省略圖示)供給到第2研磨區域^ 並加以支持，使調整砂輪滑動器5在箭頭f方向移動時 磨砂輪2相對接近工件，接觸該工件而進行無心研磨。另 TF995264 201105458 外，當使研磨砂輪Z滑動器13在箭頭^方向移動，使研磨 砂輪2與第i研磨區域n呈對向，則可將工件(省略圖示) 供給到該第1研磨區域，並進行無心研磨。 依照此種方式，利用1個研磨砂輪之往復移動，用來在2 個研磨區域進行研磨為本實施形態之特徵。 0 2疋圖1所示之貫把开》態之無心研磨作業說明圖。本發 明之方法是使多數工件連續輯“研磨者，並重複進行以 下步驟。 圖2(A)表示第1步驟，研磨砂輪2與第ι研磨區域u呈 對向。未’之第1號工件預先搬人到第1研磨區域U， 研磨砂輪2在第1研磨區域u進行第i號工件之研磨。在 該期間利用裳載器7將第2號工件肌搬入到第2研磨區域 12(箭頭b)。 圖2⑻表示第2步驟，在第2研磨區域12因為在前步驟 搬入有第2號工件Wb，所以研磨砂輪2朝Z軸之右方向移 動’在第2研磨區域12研磨第2號工件勸(在該圖中省略 圖示）。 當研磨砂輪2在第2研磨區域12研磨第2號工件肌之 期間，利用卸載器6將在前步驟研磨完成之第1號工件Wa 搬出（箭頭小然後，利用裝載器7將第3號工件*，搬入 到第1號工件Wa被搬出之第w磨區域u。 在該第2步驟’第1號工件Wa完成研磨而被搬出，第2 TF995264 12 201105458 號工件Wb在第2研磨區域12被研磨’第3號工件Wc被 搬入到第1研磨區域11。 上述之搬出用卸載器6和搬入用裝載器7可以為分開之個 體構件’亦可以為一個構件兼具雙方功能。 圖2(C)表示第3步驟’研磨砂輪2回復到圖2(A)之位置， '對在前步驟被搬入到第1研磨區域11之第3號工件Wc進 ' 行研磨，同時利用卸载器6，將在第2研磨區域π研磨完 φ 成之第2號工件wb搬出，並取而代之，利用裝載器7將第 4號工件Wd搬入。 ’ 依照此種方式’之後，經由重複進行上述第2步驟和第3 步驟’可以將複數之工件連續地研磨。 圖3表示本發明之第2實施例，將第1實施例中在z軸 方向並排之2個調整砂輪連設成一體，作成具有研磨砂輪2 寬度之2倍以上之砂輪寬度的寬幅調整砂輪14。經由成為 •此種寬幅凋整砂輪14 ’可以將研磨區域設在左右之2個位 置。另外，亦可以設置其他者作為第i研磨區域。 在5亥實施例中’研磨砂輪2如箭頭L-R所示在Z軸方向 往復被驅動’使搭栽有寬幅調整砂輪14之調整砂輪z滑動 器15 ’如箭頭f-r戶斤示在χ軸方向往復驅動。 圖4表不本發明之第3實施例’在該實施例令’與上述第 2實施例同樣地設有寬幅調整砂輪14，但是與第 2實施例之 差異疋搭载有該寬幅調整砂輪14之調整砂輪Ζ滑動器Μ， TF995264 13 201105458 係如箭頭L’-R，所示在Z軸方向被往復驅動。 在本實施形態中，為進行無心研磨之切入傳送，設有如箭 頭f_r，所示在χ軸方向往復驅動之研磨砂輪切入滑動器 16在其上格載研磨砂輪2。為了在該無心研磨進行切入傳 送，搭載有調整砂輪之滑動器，或搭載有研磨砂輪之滑動器 之至少任一方係在χ軸方向被往復驅動。 對於上述砂輪滑動器之驅動機構以何種方式構成，具有設 片自由度’但疋在本發明必須構建成使調整砂輪搭載滑動器 或研磨妙輪搭載滑動器之至少有任-方在Z軸方向(研磨砂 輪之旋轉軸方向）移動，使研磨砂輪在2個之研磨區域之間 往復。 【圖式簡單說明】 圖1是表示本發明第1實施例之模式俯視圖。 圖2(A)至(C)是表示本發明第1實施例之研磨作業說明 圖。 圖3是表示本發明第2實施例之模式俯視圖。 圖4是表示本發明第3實施例之模式俯視圖。 圖5(A)及(B)是表示習知無心研磨裝置之2實例之前視 圖。 圖6是圖5(A)之分解立體圖。 圖7(A)至(C)是表示習知無心研磨裝置之研磨作業說明 圖。 TF995264 201105458 主要元件符號說明 1 磨床 2 研磨砂輪 2a 旋轉軸 3 調整砂輪 4 刀片 5 調整砂輪滑動器 6 卸載器 7 裝載器 9 第1調整砂輪 10 第2調整砂輪 11 第1研磨區域 12 第2研磨區域 13 研磨砂輪Z滑動器 14 寬幅調整砂輪 15 調整砂輪Z滑動器 16 研磨砂輪切入滑動器 21 磨床 22 研磨砂輪 23 調整砂輪 24 刀片 25 調整砂輪滑動器 TF995264 15 201105458 25a 調整砂輪滑動器驅動機構 Wa 第1號工件 Wb 第2號工件 Wc 第3號工件 Wd 第4號工件 TF995264 16Wa, again, estimate the field, the children use the loader 7 that is loaded into the workpiece and, as the arrow b, move into the unwound flute 1 Dt Ding 2's workpiece Wb. In this step, the adjustment is also reversed, and the grinding wheel 22 can be retracted. "" In the case of 'Dry Ding·Jf\', the completion of grinding or ungrinding refers to the grinding operation performed by the grinding wheel 22 shown in the figure, even if the upstream station outside the figure is thick The grinder 'is also not grinded at the work station, and even if the grinder is added to the work station outside the map, the grind is completed at the work station. In addition, when the No. 1 workpiece Wa (arrow a) is carried out and the No. 2 WbU master b) is moved, as shown in Fig. 7(c), the workpiece No. 2 is started to be polished. Then 'repeated these steps. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A No. 2004-414179 [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei No. Hei. (Finance) Machinery Research Institute Technology Research Institute issued "Processing Technology Data Archive" 1982, Volume 6 + Shima Lee - Unintentional Grinding [Inventive Contents] (Problems to be Solved by the Invention) TF995264 201105458 In Figure 7 In the unintentional grinding of the feed mode, after the actual grinding operation is performed, during the replacement of the workpiece in Fig. 7 (8), the grinding wheel A 22 is in the standby state. Then, the grinding is started again in Fig. 7 (c), and the like: time. The example is in the grinding wheel 22, when the actual grinding time is $waiting time is 3 seconds, the actual working time efficiency is 5 outside + '3) = 62.5% 'but if the waiting time is shortened from 3 seconds to At 2 seconds, the time efficiency of the operation is increased to 5/(5 + 2) = 714%. μ • For the above-mentioned situation, the purpose of the invention is to provide a centerless grinding method which can greatly improve the time efficiency of the actual grinding operation and a centerless grinding apparatus suitable for carrying out the above method. (Means for Solving the Problem) The basic principle of the present invention will be described below with reference to the drawings corresponding to the embodiment of the present invention. The first adjustment grinding wheel (9) and the second adjustment grinding wheel (1 〇) are coaxially arranged side by side, and the ❿ or the like is mounted on the adjustment grinding wheel slider (5), and is reciprocally driven in the arrow & direction. In the straight feed grinding, the adjusting grinding wheel is mounted on the vertical rotating disk and has a transfer angle of one turn, but during the feed grinding, the rotating shaft of the adjusting grinding wheel is arranged substantially parallel to the rotating shaft of the grinding wheel (2). The direction of the rotation axis is set to the Z axis, and the direction of the arrow f-r is perpendicular to the z-axis. Two blades (4) are mounted on the adjustment grinding wheel slider (5) so that one of them faces the first adjustment grinding wheel (9) and is separated from each other, and the other one and the second adjustment TF995264 7 201105458 grinding wheel (10) The first polishing region (11) and the second polishing region (12) are used to set the two regions to be polished while being supported by the opposing regions. On the other hand, the grinding wheel (2) is mounted on the grinding wheel Z slider (13), and is reciprocally driven in the Z-axis direction as indicated by an arrow L-R. In this manner, the mounted grinding wheel (2) can face the first polishing zone (11) or face the second polishing zone (12). Conventionally, the construction of the former example is to move the grinding wheel for maintenance or the like, but is not constructed to reciprocate between the two grinding regions. According to the centerless polishing apparatus having such a configuration, as shown in FIG. 1, the grinding wheel (2) is moved in the direction of the arrow R, and is opposed to the second adjustment grinding wheel (1〇), and is in the second polishing area (12). During the polishing of the workpiece (not shown), the workpiece is replaced in the first polishing zone (11), and when the workpiece replacement of the first polishing zone (11) is completed, the grinding wheel (2) is moved in the direction of the arrow L, and The workpiece is polished in the first polishing region (u) (not shown) in opposition to the second adjustment grinding wheel (9). According to this method, one grinding wheel (2) can be moved only in the z-axis direction, and there is no waiting time for workpiece replacement, and it is possible to proceed to the actual grinding operation of the next cycle. According to the above principle, the centerless grinding method of the present invention is such that the adjusting grinding wheel and the blade are opposed to each other and are separated from each other, and the grinding wheel is connected to the supported workpiece to perform grinding, which is characterized by: adjusting the second side by coaxial side by side Grinding wheel and TF995264 8 201105458 The second adjusting grinding wheel constitutes the above-mentioned adjusting grinding wheel', and the first adjusting grinding wheel is opposed to the blade and separated from each other, and supports the first polishing region of the workpiece, and the second adjusting grinding wheel and the blade pair are set at the same time. Moving away from each other and supporting the second polishing zone of the workpiece; and repeatedly performing the following steps: the first step of moving the grinding wheel to the first polishing zone and supporting by the first adjustment wheel and the blade The workpiece is contacted and polished, and the workpiece that has been polished is carried out from the second polishing region, and the unpolished workpiece is carried into the first φ 2 polishing region; and in the second step, the polishing wheel is moved to the second polishing region. And polishing is performed by contacting the workpiece supported by the blade by the second adjustment grinding wheel and moving out from the first polishing region. The ground workpiece 'loads the unground workpiece into the first polishing zone. Further, in the centerless grinding method of the present invention, the first adjusting grinding wheel and the second adjusting grinding wheel are integrally connected to each other, and the grinding wheel having a wide width of the grinding wheel having a width of the grinding wheel of 2 times or more is formed. _ In addition, the centerless grinding device of the present invention is characterized in that the grinding wheel and the blade are opposed to each other and are separated from each other, and the grinding wheel is brought into contact with the workpiece to be supported for grinding, and the first adjusting wheel and the first adjusting wheel are coaxially arranged side by side. The second adjustment grinding wheel constitutes the adjustment grinding wheel, and the blade is opposed to the first adjustment grinding wheel and separated from each other, and the first polishing region is set, and the blade is opposed to the second adjustment grinding wheel and separated from each other, and the second polishing is set. And a grinding wheel slider that mounts the grinding wheel and reciprocates in the direction of the rotation axis of the grinding wheel to reciprocate the grinding wheel between the first polishing zone and the second TF995264 9 201105458 polishing zone. Further, in the centerless polishing apparatus of the present invention, the second adjustment grinding wheel and the second adjustment grinding wheel are integrally connected to each other, and a wide adjustment grinding wheel having a grinding wheel width of at least twice the width of the grinding wheel is formed. Further, the centerless polishing apparatus of the present invention is provided with an adjustment wheel slider that mounts the j-th adjustment grinding wheel and the second adjustment grinding wheel 'and moves in the direction of the rotation axis thereof. Further, the centerless polishing apparatus of the present invention is provided with means for moving the unpolished workpiece to the polishing region not adjacent to the grinding wheel in conjunction with the polishing wheel slider or the adjustment grinding wheel slider, and carrying out the finished workpiece. means. (Effect of the Invention) According to the centerless grinding method of the present invention, since one grinding wheel is reciprocated between two grinding regions, the workpiece is replaced in a grinding region which is not one of the grinding wheels to prepare for the grinding operation, and then ground. The grinding wheel can be ground in the finished grinding area. In this way, the grinding wheel does not have the waiting time to replace the workpiece, which can improve the time efficiency of the actual grinding operation. Further, the centerless polishing device according to the present invention can sufficiently exhibit the effect by reciprocating the polishing 0 wheel between the two polishing regions by providing the sliding mechanism. Further, in the centerless polishing apparatus according to the present invention, since the workpiece is carried in and out of the first polishing zone and the second polishing zone in the TF995264 201105458, the workpiece can be smoothly and continuously polished. [Embodiment] Fig. 1 is a plan view showing a first embodiment of a centerless polishing apparatus of the present invention. The non-grinding apparatus is provided with a grinding wheel 2 'slider 13' on a grinding machine i as a base thereof, on which a grinding wheel 2 is mounted. In Fig. 1, the coordinate axis z φ is set to be parallel to the rotation axis 2a of the grinding wheel 2, and the χ axis is orthogonal to the ordinate axis. The abrasive rim slider 13 is reciprocally driven in the z-axis direction as indicated by an arrow L_R. Further, the grinding wheel 1 is provided with an adjustment grinding wheel slider 5, and a first adjusting grinding wheel 9 and a second adjusting grinding wheel 10 which are arranged in the z-axis direction and share a rotating shaft are disposed. Next, the i-th adjustment grinding wheel 9 and the insert 4 are opposed to each other and are separated from each other, and work is supported in this region (omitted from Fig.*). The grinding wheel is brought close to the workpiece to perform the grinding process. This region becomes the first polishing region 11. Similarly, the second adjustment grinding wheel 1G and the insert 4 are opposed to each other and are separated from each other, and _) is omitted in the region K, and the grinding wheel is attached to the workpiece for grinding, and the occupation area is the second pure field 12. At this time, the above-described adjustment wheel slider 5 is reciprocally driven in the x-axis direction as indicated by an arrow f_r. In the drawing, when a workpiece (not shown) is supplied to and supported by the second polishing zone ^, the grinding wheel slider 5 is relatively close to the workpiece when the adjustment grinding wheel slider 5 is moved in the direction of the arrow f, and the workpiece is contacted to perform centerless grinding. . Further, in addition to TF995264 201105458, when the grinding wheel Z slider 13 is moved in the direction of the arrow ^, and the grinding wheel 2 is opposed to the i-th polishing region n, a workpiece (not shown) can be supplied to the first polishing region. And carry out centerless grinding. In this manner, the reciprocating movement of one grinding wheel for polishing in two polishing regions is a feature of the embodiment. 0 2 疋 Figure 1 shows the unsuccessful grinding operation diagram of the open state. In the method of the present invention, a plurality of workpieces are continuously "grinded" and the following steps are repeated. Fig. 2(A) shows the first step, and the grinding wheel 2 is opposed to the first grinding region u. The workpiece is moved to the first polishing zone U in advance, and the grinding wheel 2 grinds the workpiece ith in the first polishing zone u. During this period, the second workpiece is moved into the second polishing zone 12 by the skid 7 (arrow) b) Fig. 2 (8) shows the second step, in which the second workpiece Wb is moved in the second polishing zone 12, the grinding wheel 2 is moved in the right direction of the Z axis, and the second polishing zone 12 is ground in the second polishing zone 12 The workpiece is advised (not shown in the drawing). When the grinding wheel 2 grinds the second workpiece muscle in the second polishing region 12, the first workpiece Wa which has been polished in the previous step is carried out by the unloader 6 (arrow) In the second step, the first workpiece No. 12 No. 201105458 workpiece Wb is ground in the second polishing zone 12 'The third workpiece Wc is moved The above-described carry-out unloader 6 and the carry-in loader 7 may be separate individual members', and one member may have both functions. Fig. 2(C) shows the third step 'grinding wheel 2, returning to the position of FIG. 2(A), 'grinding the No. 3 workpiece Wc that has been carried into the first polishing zone 11 in the previous step, and grinding the second polishing zone π by the unloader 6. The second workpiece wb of φ is carried out, and the fourth workpiece Wd is carried in by the loader 7. By following this method, the plurality of workpieces can be repeated by repeating the second and third steps described above. Fig. 3 shows a second embodiment of the present invention, in which two adjusting grinding wheels arranged side by side in the z-axis direction are integrally formed in the first embodiment, and a grinding wheel width having a width equal to or more than twice the width of the grinding wheel 2 is formed. The grinding wheel 14 is widely adjusted. The grinding area can be set to two positions on the left and right by the wide-sized grinding wheel 14'. Alternatively, other ones can be provided as the ith polishing area. Grinding wheel 2 as indicated by arrow LR The Z-axis direction is reciprocated to be driven 'to make the adjustment grinding wheel z slider 15' of the wide-adjusting grinding wheel 14 reciprocally driven in the direction of the x-axis as shown by the arrow fr. Figure 4 shows the third embodiment of the present invention. In this embodiment, the wide adjustment grinding wheel 14 is provided in the same manner as in the second embodiment, but the adjustment grinding wheel slider 疋 of the wide adjustment grinding wheel 14 is mounted differently from the second embodiment, TF995264 13 201105458 As shown by the arrow L'-R, it is reciprocally driven in the Z-axis direction. In the present embodiment, in order to perform the cut-in transfer of the centerless grinding, the grinding wheel is cut into the slider which is reciprocally driven in the x-axis direction as indicated by an arrow f_r. 16 on which the grinding wheel 2 is loaded. In order to carry out the cutting and conveying in the centerless polishing, at least one of the slider equipped with the adjustment grinding wheel or the slider equipped with the grinding wheel is reciprocally driven in the x-axis direction. In view of the manner in which the driving mechanism of the above-mentioned grinding wheel slider is configured, there is a degree of freedom of setting. However, in the present invention, it is necessary to construct at least one of the adjustment grinding wheel mounting slider or the grinding wheel mounting slider in the Z axis. The direction (the direction of the rotation axis of the grinding wheel) is moved so that the grinding wheel reciprocates between the two grinding regions. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a mode of a first embodiment of the present invention. Fig. 2 (A) to (C) are explanatory views showing the polishing operation of the first embodiment of the present invention. Fig. 3 is a plan view showing a second embodiment of the present invention. Fig. 4 is a plan view showing a mode of a third embodiment of the present invention. Figures 5(A) and (B) are front views showing an example of a conventional centerless grinding apparatus. Fig. 6 is an exploded perspective view of Fig. 5(A). Fig. 7 (A) to (C) are explanatory views showing a grinding operation of a conventional centerless polishing apparatus. TF995264 201105458 Main component symbol description 1 Grinding machine 2 Grinding wheel 2a Rotating shaft 3 Adjusting grinding wheel 4 Blade 5 Adjusting grinding wheel slider 6 Unloader 7 Loader 9 1st adjustment grinding wheel 10 2nd adjustment grinding wheel 11 1st grinding area 12 2nd grinding area 13 Grinding wheel Z slider 14 Wide adjustment grinding wheel 15 Adjusting the grinding wheel Z slider 16 Grinding wheel cutting slide 21 Grinding machine 22 Grinding wheel 23 Adjusting the grinding wheel 24 Blade 25 Adjusting the grinding wheel slider TF995264 15 201105458 25a Adjusting the grinding wheel slider drive mechanism Wa No. 1 workpiece Wb No. 2 workpiece Wc No. 3 workpiece Wd No. 4 workpiece TF995264 16