201104394 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係關於一種散熱裝置。 [先前技術] [0002] 目前’隨著電子技術的不斷發展，電子元件（如CPU)的 工作頻率愈來愈高，對其散熱的要求也愈來愈高。通常 對CPU進行散熱是在CPU上先設置散熱片以吸收CPU產生 的熱量’然後在散熱片上設置風扇以將散熱片吸收的熱 量散發至外界。但是，由於CPU的頻率愈來愈高，習知的 散熱裝置已不能滿足對其散熱的要求。 【發明内容】 • [0003]馨於上述内容，有必要提供一種可有效提高教熱效率的 散熱裝置。 [0004] 一種散熱裝置，包括—設有容置區的散熱•片、一鼓風機 、一連接件及一風扇，該鼓風機及風扇分別固定於該連 接件的兩侧，該鼓風機還導過該連接件固定於該散熱片 〇 的容置區内。 [0005] 上述散熱裝置由於將該散熱片的内部設置了容置區，使 該鼓風機放置在了該容置區内，故大大節省了空間。另 外，該散熱裝置又透過該連接件同時將該鼓風機及風扇 連接在了一起，可同時進行散熱工作，故大大提高了散 熱效率。 【實施方式】 [0006] 098125767 请參照圖1，本發明散熱裝置1〇用於為一電子元件如一設 置在電腦主機板20上的CPU22進行散熱該散熱裝置10 表單編號A0101 第3頁/共11頁 098! 201104394 的較佳實施方式包括一散熱片110、一鼓風機120、一連 接件130及一風扇140。 [0007] 該散熱片110包括一方形的導熱板112，該導熱板112的 四角處各設有一固定孔114，該導熱板112上垂直設有複 數散熱柱116 ’該等散熱柱116圍成一略呈圓形的容置區 118。為更好的提高導熱效率，該導熱板112可選用導熱 性能較好的真空腔均熱板。 [0008] 該鼓風機120包括一圓形的本體部122，該本體部122底 部向外對稱延伸四個向上垂直的固定柱124，每一固定柱 124上設有均設有一螺孔1242。 [0009] 該連接件130包括一方形的板體132，該板體132的中心 設有一花瓣形的開口 1322，該板體132上方位於該花瓣形 開口 1322的四個對稱的内凸耳上各設有一第一通孔1324 及在該第一通孔13 2 4的外側對稱設有四個第二通孔13 2 6 。該板體13 2的四角分別向下延伸出一卡固部1 3 4，每一 卡固部134的底部向内設有一凸片;j36。 [0010] 該風扇140包括一本體部142，該本體部142的四角設有 四個固定孔144。其他實施方式中，該鼓風機12〇及風扇 140也可根據需要選用其他類型的散熱元件。由於鼓風機 120及風扇140上的電源線為習知技術，故圖中未示出。 [0011] 請參照圖2及圖3，組裝時，透過四個螺絲3〇穿過該散熱 片110上的固定孔11 4後螺鎖至該電腦主機板2〇上的對應 四個螺孔24内，該散熱片11〇被固定在該電腦主機板2〇上 ，5亥、熱板112與β亥CPU22緊密接觸，以吸收其產生的熱 098125767 表單編號Α0101 第4頁/共11頁 0982044167-0 201104394 量。透過四個螺絲40穿過該連接件130上的第—通孔 1324後螺鎖至該鼓風機120上的對應四個螺孔1242内， 5玄妓風機120與該連接件130固定在了 一起。將該鼓風機 放置於該散熱片110的容置區118内，同時向外側扳 動該連接件130的卡固部134 ’以使該凸片136卡固於該 導熱板112的底部，該鼓風機120透過該連接件13〇固定 在了該散熱片110上。透過四個螺絲50穿過該風扇14〇的 四個固定孔144後螺鎖至該連接件130的第二通孔1326内 ’該風扇140被固定在了該連接件130上。 °闺 工作時’該鼓風機120可將該散熱柱116周圍的熱量吹出 至該散熱柱116的外部。该風扇14 0則有.兩—種工作狀雄， ❹ [0013] 當該風扇140的吹風方向朝向該鼓風機12〇的相反方向時 ，該風扇140可將該散熱柱116上方的熱量吸出至該散熱 柱116的外部；當該風扇140的吹風方向朝向該鼓風機 120的方向時，則該風扇140可輔助該鼓風機12〇加快將 該散熱柱116周圍的熱量吹出至該散熱柱116的外部，上 述兩種工作狀態均可提高散熱效專。 本發明散熱裝置10由於將該散熱片110的内部進行了挖空 設計，使鼓風機120放置在了該容置區118内，大大節省 了空間。另外，该散熱裝置1〇又透過該連接件13〇同時將 該鼓風機120及風扇140連接在了一起，故可使用該鼓風 機120及該風扇140同時給該CPU22進行散熱，可大大提 高散熱效率。 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 098125767 0982044167-0 表單編號A0101 第5頁/共π頁 [0014] 201104394 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0015] [0016] [0017] [0018] 圖1係本發明散熱裝置較佳實施方式與一電腦主機板的立 體分解圖。 圖2係圖1的部分組裝圖。 圖3係圖1的組裝圖。 【主要元件符號說明】 散熱裝置 10 散熱片 110 導熱板 112 固定孔 114 、 144 散熱柱 116 容置區 118 鼓風機 120 本體部 122 ' 142 固定柱 124 螺孔 1242 、 24 連接件 130 板體 132 開口 1322 第一通孔 1324 第二通孔 1326 卡固部 134 凸片 136 風扇 140 電腦主機板 20 CPU 22 螺絲 30、40 ' 50 098125767 表單編號A0101 第6頁/共11頁 0982044167-0201104394 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a heat sink. [Prior Art] [0002] At present, with the continuous development of electronic technology, the operating frequency of electronic components (such as CPU) is getting higher and higher, and the requirements for heat dissipation are becoming higher and higher. Usually, the CPU is cooled by setting a heat sink on the CPU to absorb the heat generated by the CPU. Then a fan is placed on the heat sink to dissipate the heat absorbed by the heat sink to the outside. However, as the frequency of the CPU is getting higher and higher, the conventional heat sink cannot meet the requirements for heat dissipation. SUMMARY OF THE INVENTION • [0003] In the above, it is necessary to provide a heat sink that can effectively improve the efficiency of teaching. [0004] A heat dissipating device includes: a heat dissipating sheet provided with a receiving area, a blower, a connecting member and a fan, wherein the blower and the fan are respectively fixed on two sides of the connecting member, and the blower further guides the connection The piece is fixed in the receiving area of the heat sink 〇. [0005] The above-mentioned heat dissipating device has a space in which the inside of the heat dissipating fin is disposed in the accommodating area, so that the air blower is placed in the accommodating area. In addition, the heat dissipating device connects the blower and the fan through the connecting member at the same time, and can simultaneously perform heat dissipation work, thereby greatly improving the heat dissipation efficiency. [0006] 0006125767 Referring to FIG. 1, the heat dissipating device 1 of the present invention is used for dissipating heat dissipation of an electronic component such as a CPU 22 disposed on a computer motherboard 20. Form No. A0101 Page 3 of 11 A preferred embodiment of page 098! 201104394 includes a heat sink 110, a blower 120, a connector 130, and a fan 140. [0007] The heat sink 110 includes a square heat conducting plate 112. Each of the four ends of the heat conducting plate 112 is provided with a fixing hole 114. The heat conducting plate 112 is vertically provided with a plurality of heat dissipating columns 116. A slightly circular receiving area 118. In order to better improve the heat conduction efficiency, the heat conducting plate 112 may be selected from a vacuum cavity soaking plate with better thermal conductivity. The air blower 120 includes a circular body portion 122. The bottom portion of the body portion 122 extends symmetrically outwardly and four upwardly extending fixing posts 124. Each of the fixing posts 124 is provided with a screw hole 1242. The connecting member 130 includes a square plate body 132. The center of the plate body 132 is provided with a petal-shaped opening 1322. The plate body 132 is located above the four symmetric inner lugs of the petal-shaped opening 1322. A first through hole 1324 is disposed, and four second through holes 13 2 6 are symmetrically disposed outside the first through hole 13 2 4 . The four corners of the plate body 13 2 respectively extend downwardly from a fastening portion 134, and a bottom portion of each of the fastening portions 134 is provided with a protrusion; j36. [0010] The fan 140 includes a body portion 142 having four fixing holes 144 at four corners thereof. In other embodiments, the blower 12 and the fan 140 may also use other types of heat dissipating components as needed. Since the power lines on the blower 120 and the fan 140 are conventional, they are not shown. [0011] Referring to FIG. 2 and FIG. 3, during assembly, the four screws 3 are passed through the fixing holes 11 4 of the heat sink 110 and then screwed to the corresponding four screw holes 24 of the computer motherboard 2 . The heat sink 11 is fixed on the computer motherboard 2, and the hot plate 112 is in close contact with the βH CPU 22 to absorb the heat generated by the 098125767. Form No. 1010101 Page 4 / 11 pages 0982044167- 0 201104394 Quantity. Through the four screws 40 passing through the first through hole 1324 of the connecting member 130, the screw is screwed into the corresponding four screw holes 1242 of the air blower 120, and the quenching fan 120 is fixed with the connecting member 130. The air blower is placed in the accommodating area 118 of the heat sink 110, and the fixing portion 134 ′ of the connecting member 130 is pulled to the outside to fix the protruding piece 136 to the bottom of the heat conducting plate 112 . The heat sink 110 is fixed to the heat sink 110 through the connector 13A. The four screws 50 pass through the four fixing holes 144 of the fan 14 and are screwed into the second through holes 1326 of the connecting member 130. The fan 140 is fixed to the connecting member 130. The blower 120 can blow heat around the heat dissipating post 116 to the outside of the heat dissipating post 116. The fan 140 has two working states, ❹ [0013] when the blowing direction of the fan 140 is opposite to the blower 12 ,, the fan 140 can suck the heat above the heat sink 116 to the The outside of the heat dissipation column 116; when the blowing direction of the fan 140 is directed toward the blower 120, the fan 140 can assist the blower 12 to accelerate the heat around the heat dissipation column 116 to the outside of the heat dissipation column 116, Both working states improve heat dissipation. The heat dissipating device 10 of the present invention has a hollowed out design of the heat sink 110, so that the air blower 120 is placed in the accommodating area 118, which greatly saves space. In addition, the heat sink 1 is connected to the blower 120 and the fan 140 through the connecting member 13 ,. Therefore, the blower 120 and the fan 140 can be used to simultaneously dissipate heat to the CPU 22, thereby greatly improving heat dissipation efficiency. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, such as 098125767 0982044167-0 Form No. A0101 Page 5 / Total π Page [0014] 201104394 Those skilled in the art, in the spirit of the present invention, etc. Modifications or changes shall be covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS [0018] FIG. 1 is a perspective exploded view of a preferred embodiment of a heat sink device of the present invention and a computer motherboard. Figure 2 is a partial assembled view of Figure 1. Figure 3 is an assembled view of Figure 1. [Main component symbol description] Heat sink 10 Heat sink 110 Heat conducting plate 112 Fixing hole 114, 144 Heat sink 116 Housing area 118 Blower 120 Body part 122 ' 142 Fixing post 124 Screw hole 1242, 24 Connector 130 Plate 132 Opening 1322 First through hole 1324 Second through hole 1326 Fixing portion 134 Tab 136 Fan 140 Computer motherboard 20 CPU 22 Screw 30, 40 ' 50 098125767 Form No. A0101 Page 6 of 11 0982044167-0