201100817 六、發明說明： 【發明所屬之技術領域] 本發明係與電路基板之檢測方法 指一種電路基板之雙路徑檢測方法。足咩而言之係 【先前技術】 Ο ο 按，-般之電路板測試機係採用單路 路基板之職妓，其綠核如下，H式進行電 待測電路基板放置於一置板台上， 由一手臂將一 之電路基板婦並輸送至—咖取板台上 像判讀電路基板與夹臂間之相關位置，# 取 路基板輸送至-電魏巾進行位置校正，^㈣將讀電 對電路基板進行接觸式之電性探測，爾後再由紐 測試後之電路基板放至於置板台上，再由該手臂=將已 之電路基板放人於敎之電路板纏架上，2式後 基板為正常時，則放人於正常區之載料架上，如=電路 路基板為不正常時，則放人科正常區之载料架上疋該電 該手臂將另-待測試之電路基板放置於置板再由 此一流程。 以重覆 惟，上述之檢測流程，係以單一路徑進行， ::1::將測試過後之電路基板選擇放入载料架;失: 二補充铜試之基板至置板台上，核再度進行 二《式之電路基极輸送至CCD取像區及電測區中進行位置 A及接觸式探測，使得CCD取像區及電測區將有長時間 201100817 之待機時間，而導致測試電路基板之效率不張。 【發明内容】 有鑑於此’本發明之主要目的乃在提供一種電路基板 之雙路徑檢測方法，係能以雙路徑之方式進行電路基板之 檢測輸送作業，以提升檢測電路基板之效率者。 緣此，本發明乃提供一種電路基板之雙路徑檢測方 法，包含有以下步驟：（A)由一吸附式手臂以一第一吸附 €> 組件吸取一待檢測電路基板放置於一置板台上，再以一第 二吸附組件進行一待檢測電路基板之吸取，並進行待命； (B)由一位於第一路徑上之第一夾臂將置板台上之待檢測 電路基板移動至一取像區中，進行CCD取像；（c)由該第 一夾臂將已進行CCD取像之待檢測電路基板移動至一電 測區中’進行接觸式電性檢測判讀；（D)由該吸附式手臂 之第二吸附組件將待檢測電路基板放置於該置板台上；（E ) 〇 由一位於第二路徑上之第二夾臂將置板台上之待檢測電路 基板移動至該取像區中，進行CCD取像；（F)由該第一夾 臂將檢測元成之電路基板放置於置板台上，由吸附式手臂 之第一吸附組件將檢測完成之電路基板自該置板台上取出 放置於一預定位置之載料架上；（G)第二夾臂將已進行 CCD取像之待檢測電路基板移動至該電測區中，進行接觸 式電性檢測判讀，（H)第二夾臂將檢測完成之電路基板放 置於置板台上’由吸附式手臂之第二吸附組件將檢測完成 4 201100817 之電路基板自該置板台上取出放置於一預定位置之载料架 上；重覆以上步驟，即能以分別位於第一路徑及第二路徑 上之第一、二夾臂配合吸附式手臂而達到進行雙路徑之電 路基板檢測。 【實施方式】 為使貴審查委員能對本發明之特徵與特點有更進— 步之了解與認同’茲列舉以下較佳實施例並配合圖式說明 〇 如下： 請參閱第一圖’係本發明一較佳實施例所提供一種電 路基板之雙路徑檢測方法’係運用於一電路板測試機上， 其中該電路板測試機包含有多數之載料架、一吸附式手 臂、一置板台、一第一夾臂、一第二夾臂、一 CCD取像裝 置及一電測模組’該等載料架係分別用以承載待檢測之電 路基板、已檢測完成判定為正常之電路基板及已檢測完成 Q 判定為不正常之電路基板’以將電路基板作一分類置放， 該吸附式手臂具有二吸附組件，係可藉由該吸附式手臂進 行1 8 0度之旋轉而變換位置，該置板台係用以供電路基 板放置，該第一、二夾臂係用以夾持於置放在該置板台上 待檢測之電路基板’並將該電路基板移動至一取像區中由 該CCD取像裝置進行取像，並將取像後之電路基板移動至 一電測區中由該電测模組進行接觸式之電性探測，以判讀 該電路基板為正常良品或為不正常淘汰品，再將已經檢測 5 201100817 後之電路基板由第一、二夾臂放置於置板台上，再由該吸 附式手臂加以吸附並放置預定之載料架中。 本發明電路基板之雙路徑檢測方法，其步驟包含如下： (Α)首先，由吸附式手臂之第一吸附紱件將一置於 待檢測載料架中之電路基板加以吸起，並旋轉i 8 〇度後 將該待檢測電路基板放置於該置板台上；該吸附式手臂之 第一吸附組件並再將一置於待檢測載料架中之電路基板加 以吸起，並進行待命； 土201100817 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method of detecting a circuit board, and refers to a method of detecting a dual path of a circuit board. In terms of foot and foot, [prior art] Ο ο Press, the general circuit board test machine uses a single-channel substrate, the green core is as follows, and the H-type electrical circuit board is placed on a board. On the upper side, a circuit board is transported by an arm to the position of the circuit board and the clamp arm, and the position of the circuit board is transferred to the electric hair towel for position correction, and (4) will be read. The electrical circuit is electrically contacted to the circuit substrate, and then the circuit substrate after the test is placed on the mounting table, and then the arm = the circuit board is placed on the circuit board entanglement, 2 When the rear substrate is normal, it is placed on the loading rack of the normal area. If the circuit board is not normal, it will be placed on the loading rack of the normal area. The arm will be tested again. The circuit substrate is placed on the board and then the process. In order to repeat, the above detection process is carried out in a single path, ::1:: The circuit board after the test is selected and placed in the carrier; Loss: The substrate of the copper test is added to the table, and the core is again Performing the second method of circuit base transmission to the CCD image capturing area and the electrical measuring area for position A and contact detection, so that the CCD image capturing area and the electrical measuring area will have a long standby time of 201100817, resulting in the test circuit substrate. The efficiency is not good. SUMMARY OF THE INVENTION In view of the above, a main object of the present invention is to provide a dual path detecting method for a circuit board, which is capable of detecting and transporting a circuit board in a two-path manner to improve the efficiency of detecting a circuit board. Therefore, the present invention provides a dual path detection method for a circuit board, comprising the steps of: (A) drawing a circuit board to be inspected by a suction arm with a first adsorption component; And performing a suction of the circuit board to be inspected by a second adsorption component, and performing standby; (B) moving the circuit substrate to be inspected on the mounting stage to the first substrate by a first clamping arm located on the first path In the image capturing area, CCD image capturing is performed; (c) the circuit board to be detected that has undergone CCD image capturing is moved into an electrical measuring area by the first clamping arm to perform contact electrical detection; (D) a second adsorption component of the adsorption arm places a circuit substrate to be inspected on the mounting table; (E) a second clamping arm located on the second path moves the circuit substrate to be inspected on the mounting table to In the image capturing area, CCD image capturing is performed; (F) the circuit board formed by the detecting arm is placed on the mounting table by the first clamping arm, and the circuit substrate is completed by the first adsorption component of the adsorption arm The platen is taken out and placed in a predetermined position (G) The second clamping arm moves the circuit substrate to be inspected for which the CCD image has been taken to the electrical measurement area, and performs contact electrical detection, (H) the second clamping arm will complete the detection. The circuit substrate is placed on the mounting table. The circuit substrate that has been inspected and completed by the second adsorption component of the adsorption arm is removed from the mounting plate and placed on a loading frame at a predetermined position; The circuit board detection for the dual path can be achieved by using the first and second clamp arms respectively located on the first path and the second path with the adsorption arm. [Embodiment] In order to enable the reviewing committee to have a better understanding and recognition of the features and features of the present invention, the following preferred embodiments are illustrated with the following description: A preferred embodiment of the present invention provides a dual path detection method for a circuit board, which is applied to a board tester, wherein the board tester includes a plurality of carrier racks, an adsorption arm, and a plate table. a first clamping arm, a second clamping arm, a CCD image capturing device and an electrical measuring module respectively for carrying the circuit substrate to be inspected, the circuit substrate that has been detected to be normal and The circuit substrate 'determined to be abnormal Q has been detected to be placed in a sorting manner. The adsorption arm has two adsorption components, and the adsorption arm can be rotated by 180 degrees to change the position. The mounting plate is used for the circuit board, and the first and second clamping arms are used for clamping the circuit substrate to be detected placed on the mounting table and moving the circuit substrate to an image capturing area. In the middle The CCD image capturing device performs image taking, and moves the taken circuit substrate to an electrical measurement area, and the electrical detection module performs contact electrical detection to determine that the circuit substrate is a normal good or is not properly eliminated. Then, the circuit board after the detection of 5 201100817 is placed on the table by the first and second clamp arms, and then adsorbed by the adsorption arm and placed in a predetermined carrier. The method for detecting the dual path of the circuit substrate of the present invention comprises the following steps: (Α) First, a circuit substrate placed in the carrier to be inspected is sucked up by the first adsorption member of the adsorption arm, and rotated. After the temperature is reached, the circuit board to be inspected is placed on the platen table; the first adsorption component of the adsorption arm is further sucked up by a circuit substrate placed in the carrier to be inspected, and is on standby; earth
Ο (B)接著，由位於第一路徑上之該第一夹臂移動至置 板台上’將置板台上之待檢測電路基板妓，並移動至該 取像區令由CCD取像裝置進行取像作業； ⑻再於取像作業後由該第一夹臂將已進行CCD取 ^待檢測電路基板，由第—路徑輸送至電測區中，並依 據CCD取像之位置加以比對、判讀、校 、 板位於該電測區中之正確位置’再由電測模= 方式對該待_電路基板進行電性 》 基板為正常良品或不正常淘汰品；料“賣出該電路 (D) 上述步驟（C)於第一夾臂進行 基板輪送至電_中之同時，該吸㈣檢測電路 附上之待㈣電路基板電路放置於置板心上將該第-吸 (E) 前述步驟（C)於第一夾臂由 待檢測電路基板輸絲電_中徑進行將該 之該第時，位於第二路徑上 乂弟一失臂已移動至置板台上，待 (D)完成後由 6 201100817 該第-夹臂將置板台上之待檢測電路基板爽起，並移動至 該取像區巾纟CCD取像裝置進躲像作業； (F) 田該第一夹臂上之電路基板撿測完成後，該第— 夾#則由帛_將該電路基板放置於置板台上，此時該 吸附式手臂由第-吸附式組件將已進行電性探試後之電^ ^加以吸起’並依電測裝置所判讀之結果，由該吸附式 之第一吸附組件將檢測後之電路基 Ο ❹ 之载料架中或放入於不正常淘汰品之載料架中；、 (G) 該第二夹臂此時縣所夹持之電路基板輸送至 Z區中並依據CCD取像之位置加以比對、判讀、校正 -夾臂上該待檢測電路基板位於該電測區中之正破位 ，再進行接觸式之電性檢測判讀； (H) 第二夾料_完成之f路基板放置於置板台 兮由吸附式手臂之第二吸附組件將檢測完成之電路基板 目該置板台上取出以旋轉；L 8 Q度後放置於—預定位置之 載料架上，如正常良品則放入於正常良品之載料架中，如 不正常淘汰品則放入於不正常淘汰品之载料架中； 再覆Μ⑷至（H)之步驟，即能持續地以雙路徑 進行電路基板之檢測。 行袷t丨此—來’便能藉由該第—夾臂作為提供電路基板進 行拾^[雜’而㈣第^臂作為提供電路基板進 人d之第二路徑，輔以吸附式手臂上二吸附組件之配 口 ’以其-吸附組件進行將待檢測電路基板自載料架中吸 201100817 附並放置於置板台上，而以另一吸附組件進行將已檢測完 成電路基板自置板台上加以吸附並放置於預定之載料架 中。使本發明利用第一夾臂與第二夾臂之同時運作並錯開 其位置，而能以雙路徑之型態進行電路基板之檢測作業， 藉以大幅縮短CCD取像裝置及電測模組每次使用運作後 之停頓空檔，而能提升檢測電路基板之效率。 以上所揭，僅為本發明的較佳實施方式而已，並非用 以限定本發明實施例的範圍，本技術領域内的一般技術人 員根據本發明所作的均等變化，以及本領域内技術人員熟 知的改變，仍應屬本發明涵蓋的範圍。 8 201100817 * 【圖式簡單說明】 第一圖係本發明一較佳實施例之流程示意圖。 【主要元件符號說明】Ο (B) Next, the first clamping arm located on the first path is moved to the mounting table. The circuit board to be inspected on the mounting table is turned and moved to the image capturing area to be used by the CCD image capturing device. Performing an image capturing operation; (8) after the image capturing operation, the circuit board for which the CCD has been taken is detected by the first clamping arm, and is transported from the first path to the electrical measuring area, and is compared according to the position of the CCD image capturing. The interpretation, calibration, and board are located at the correct position in the electrical measurement area, and then the electrical circuit is electrically performed by the electrical test die = mode. The substrate is a normal good or an abnormally eliminated product; the material "sells the circuit ( D) the above step (C) is performed when the first clamp arm performs the substrate transfer to the power_in, and the suction (four) detection circuit is attached to the (four) circuit substrate circuit placed on the board core to the first suction (E) The foregoing step (C) is performed when the first clamp arm is driven by the circuit board to be inspected, and the second arm is moved to the mounting table. After completion, by 6 201100817, the first-clamp arm will cool the circuit board to be tested on the mounting table, and move to the The area 纟 CCD image capturing device enters the hiding operation; (F) after the circuit board on the first clamping arm is measured, the first folder is placed on the mounting table by 帛_ At this time, the adsorption arm is sucked up by the first adsorption module after the electrical test has been performed, and the result is determined by the electric measuring device, and the first adsorption component of the adsorption type is detected. The circuit substrate is placed in the carrier of the 或 or placed in the carrier of the abnormally eliminated product; (G) the second clamping arm is transported to the Z zone by the circuit board held by the county at this time and according to the CCD The position of the image is compared, interpreted, corrected, and the circuit board to be detected on the clamp arm is located in the electrical test area, and then the contact type electrical detection is performed; (H) the second clamp _ completed The circuit board is placed on the platen table, and the circuit board which is detected by the second adsorption component of the adsorption arm is taken out and rotated to rotate; after L 8 Q degree, it is placed on the carrier rack at the predetermined position. If the normal good product is placed in the carrier of the normal good product, if it is not properly eliminated, it will be placed in the wrong product. In the loading rack of the elimination product; the steps of (4) to (H) are repeated, that is, the detection of the circuit substrate can be continuously performed in a double path. The operation can be performed by the first clamping arm. The circuit substrate is subjected to pick-up and (4) the second arm as a second path for providing the circuit substrate into the d, supplemented by the matching port of the second adsorption component on the adsorption arm, and the circuit substrate to be inspected by the adsorption component In the loading rack, the suction 201182017 is attached and placed on the table, and the other adsorption assembly is used to adsorb and place the detected circuit substrate on the self-supporting plate table in the predetermined loading frame. When the clamp arm and the second clamp arm operate simultaneously and are staggered, the detection of the circuit substrate can be performed in a dual path manner, thereby greatly shortening the pause of the CCD image capturing device and the electrical measurement module after each use operation. Empty, and can improve the efficiency of the detection circuit substrate. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the embodiments of the present invention, and equivalent variations made by those skilled in the art in accordance with the present invention, as well as those skilled in the art. Changes are still within the scope of the invention. 8 201100817 * [Simplified description of the drawings] The first figure is a schematic flow chart of a preferred embodiment of the present invention. [Main component symbol description]