201044958 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係關於一種散熱器固定裝置。 【先前技術】 [0002] 電腦等電子產品中，通常在主機板上的一些發熱電子元 件上裝設有散熱器，用以給電子元件進行散熱。一些長 形的散熱器，如用於給CPU電壓調節裝置散熱的散熱器， 通常都係透過在散熱器的兩端裝設兩個鎖固件以將該散 熱器固定在主機板上。然而，在此過程中，散熱器兩端 Ο ^ 受力較大，中間部分受力較小，散熱器受力不均勻從而 導致散熱器底部的散熱膏與電子元件的表面接觸不均勻 ，進而影響散熱效果。 【發明内容】 [0003] 鑒於以上，有必要提供一種可以保證散熱器在安裝過程 中受力均勻的散熱器固定裝置。 [0004] —種散熱器固定裝置，包括兩鎖固件，該兩鎖固件的頂 Q 部連接有一彈性連接片，該彈性連接片包括一長條形主 體部，該主體部的中部向上彎折形成一突出部，該主體 部的兩端向下彎折分別形成一連接部，該兩連接部分別 連接於該兩鎖固件的頂部。 ’ [0005] 相較先前技術，利用上述散熱器固定裝置安裝散熱器時 ，該兩鎖固件可以向散熱器的兩端施力，該彈性連接片 的主體部可以向該散熱器的鄰近中間處施力，從而使得 散熱器在安裝過程中受力均勻，進而使得散熱器底部的 散熱膏與電子元件的表面接觸均勻，提高散熱性能。 098118489 表單編號A0101 第3頁/共9頁 0982031342-0 201044958 【實施方式】 [0006] 請參照圖1與圖2 ’為本發明散熱器固定裝置1〇的較佳實 施方式’用於將一散熱器20緊密貼附一電子元件並固定 於一電路板上（圖未示）。 [0007] 該散熱器20包括一長形的底部塗有散熱膏的底板21。該 底板21鄰近兩端分別設有一通孔212。複數散熱鰭片23設 置於該底板21上並位於該兩通孔212之間。 [0008] 該散熱器固定裝置10包括兩鎖固件11、兩彈簧13及一彈 性連接片15。每一鎖固件11包括一固定部丨丨2及一由該固 定部112的中部向下延伸的凸柱Π4。該凸柱114的圓柱 面於遠離該固定部112的一端.的兩相對側被切削形成一板 體115，該板體115遠離該固定部112的一端向該兩被切 削側分別延伸一彈性卡扣116。該兩彈性卡扣116的上部 向外擴張，且每一彈性卡扣116的頂部鄰近板體H5處向 上延伸出 ^扣片117。該彈性連接片15包括一長條形主 體部152，該主體部152的中部向上彎折形成一“门，，形 的突出部15 3，該主體部15 2、的兩端向下並向外彎折分別 形成一 L·形的連接部155。該彈性連接片15的兩連接 部155分別連接於該兩鎖固件Η的固定部112的頂部。在 本實施方式中，該彈性連接片15與該兩鎖固件11 一體成 型。 [0009] 使用5玄散熱器固定裝置10時，首先，將該兩彈簧13分別 由^亥兩鎖固件11的設有彈性卡扣丨16的一端套設於該兩鎖 固件11的凸柱114上。將該散熱器固定裝置1〇由該散熱器 20的頂部向下按，使該兩鎖固件11的彈性卡扣11 6穿過該 098118489 表單編號A0101 0982031342-0 201044958 散熱器20的兩通孔212，該彈性連接片15的主體部152抵 接於該散熱器20的散熱鰭片23的頂部，該兩彈簧13的兩 端分別抵頂於該散熱器20的底板21與對應鎖固件U的固 疋部112。然後，將該散熱器2〇連同該散熱器固定裝置1〇 一併放置於一電路板的電子元件（圖未示）上，向下按 壓該散熱器固定裝置1〇的彈性連接片〗5的突出部153及兩 鎖固件11，使該兩鎖固件11的彈性卡扣116穿過確主機板 上的對應穿孔，彈性卡扣116彈性回復與其上的卡扣片 11 7—併卡置於該主機板，從而將該散熱器2〇固定於該主 機板上。在此過程中，該兩禪簧丨3受壓變形而彈性抵頂 於鎖固件11與散熱器20之間，可防止鎖固件丨丨鬆動；該 彈性連接片15的主體部152受其中部的突出部153向下的 擠壓及兩側的鎖固件11向下的拉動而向下抵壓該散熱器 2〇的散熱鰭片23，從而給該散熱器2〇的鄰近中部處受到 該彈性連接片15向下的壓力，從而使得該散熱器.2〇的兩 端及中部受力較均勻，該散熱器2 〇的底部^散熱膏可以 均勻接觸該電子元件，進而使得讓被熱器2〇可以充分地 給該電子元件進行散熱。 [0010] 在其他實施方式中，該彈性連接片15的主體部152的突出 部153的長度可以減小，從而使得該主體部152與散熱器 20的散熱鰭月23的接觸面積增大，進而使得該散熱器2〇 的中部可以受到更多的力，散熱膏可以更均勻地接觸該 電子元件。 [0011] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 098118489 表單編號A0101 0982031342-0 201044958 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士爰依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0012] [0013] 圖1係本發明散熱器固定裝置較佳實施方式與一散熱器的 立體組裝圖。 圖2係圖1的立體分解圖。 【主要元件符號說明】 [0014] 散熱器固定裝置 10 鎖固件 11 固定部 112 凸柱 114 板體 115 彈性卡扣 116 卡扣片 117 彈簧 13 彈性連接片 15 主體部 152 突出部 153 連接部 155 散熱器 20 底板 21 通孔 212 散熱鰭片 23 098118489 表單編號A0101 第6頁/共9頁 0982031342-0201044958 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a heat sink fixing device. [Prior Art] [0002] In electronic products such as computers, heat sinks are usually mounted on some of the heat-generating electronic components on the motherboard to dissipate heat from the electronic components. Some elongated heat sinks, such as those used to dissipate heat from the CPU voltage regulator, typically have two fasteners attached to the ends of the heat sink to secure the heat sink to the motherboard. However, in this process, the two ends of the heat sink are subjected to a large force, the middle portion is less stressed, and the heat sink is unevenly applied, resulting in uneven contact between the heat-dissipating paste at the bottom of the heat sink and the surface of the electronic component, thereby affecting heat radiation. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a heat sink fixing device that can ensure uniform force of a heat sink during installation. [0004] A heat sink fixing device includes two locking fasteners, and a top connecting portion of the two locking members is connected with an elastic connecting piece, and the elastic connecting piece includes an elongated main body portion, and the central portion of the main body portion is bent upward. A protruding portion, the two ends of the main body portion are bent downward to form a connecting portion, and the two connecting portions are respectively connected to the top of the two locking members. [0005] Compared with the prior art, when the heat sink is used to mount the heat sink, the two fasteners can apply force to both ends of the heat sink, and the body portion of the elastic connecting piece can be adjacent to the middle of the heat sink. Applying force, so that the heat sink is evenly stressed during the installation process, so that the heat-dissipating paste at the bottom of the heat sink is in uniform contact with the surface of the electronic component, thereby improving heat dissipation performance. 098118489 Form No. A0101 Page 3 of 9 0982031342-0 201044958 [Embodiment] [0006] Please refer to FIG. 1 and FIG. 2 'Bare Embodiment of the heat sink fixing device 1' of the present invention for cooling a heat sink The device 20 is closely attached to an electronic component and is fixed to a circuit board (not shown). The heat sink 20 includes an elongated bottom plate 21 coated with a thermal grease at the bottom. A through hole 212 is defined in each of the two ends of the bottom plate 21. A plurality of heat dissipation fins 23 are disposed on the bottom plate 21 and located between the two through holes 212. The heat sink fixing device 10 includes two locking members 11, two springs 13 and an elastic connecting piece 15. Each of the fasteners 11 includes a fixing portion 2 and a boss 4 extending downward from a central portion of the fixing portion 112. The cylindrical surface of the protrusion 114 is cut away from the opposite sides of the fixing portion 112 to form a plate body 115. The end of the plate body 115 away from the fixing portion 112 extends to the two cutting sides respectively. Buckle 116. The upper portions of the two elastic buckles 116 are outwardly expanded, and the top of each of the elastic buckles 116 extends upwardly from the plate body H5. The elastic connecting piece 15 includes an elongated main body portion 152, and a central portion of the main body portion 152 is bent upward to form a "door"-shaped protruding portion 153. Both ends of the main body portion 152 are downward and outward. The connecting portions 155 of the L-shaped portions are respectively formed by bending. The two connecting portions 155 of the elastic connecting piece 15 are respectively connected to the tops of the fixing portions 112 of the two locking pieces. In the embodiment, the elastic connecting piece 15 is The two lock fasteners 11 are integrally formed. [0009] When the five-seat heat sink fixing device 10 is used, first, the two springs 13 are respectively disposed on the end of the two lock fasteners 11 provided with the elastic snap fasteners 16 The two fixing bolts 11 are on the bosses 114. The heat sink fixing device 1 is pressed downward from the top of the heat sink 20, so that the elastic buckles 16 of the two locking members 11 pass through the 098118489 Form No. A0101 0982031342- 0 201044958 The two through holes 212 of the heat sink 20, the main body portion 152 of the elastic connecting piece 15 abuts against the top of the heat dissipating fin 23 of the heat sink 20, and the two ends of the two springs 13 respectively abut against the heat sink 20 The bottom plate 21 and the fixing portion 112 corresponding to the locking member U. Then, the heat sink 2 The heat sink fixing device 1 is placed on an electronic component (not shown) of a circuit board, and the protruding portion 153 of the elastic connecting piece 5 of the heat sink fixing device 1 and the two locking members 11 are pressed downward. The elastic buckles 116 of the two locking fasteners 11 are passed through the corresponding through holes on the main board, and the elastic buckles 116 are elastically restored to the locking pieces 11 7 on the same, and are placed on the main board, thereby the radiator 2〇 is fixed on the motherboard. In the process, the two zen springs 3 are deformed by pressure and elastically abut against the lock 11 and the heat sink 20 to prevent the lock 丨丨 from loosening; the elastic connecting piece The main body portion 152 of the first portion 152 is pressed downward by the protruding portion 153 of the middle portion and the downwardly pulling of the locking members 11 on both sides to press down the heat radiating fins 23 of the heat sink 2〇, thereby giving the heat sink 2 The adjacent middle portion of the crucible is subjected to the downward pressure of the elastic connecting piece 15, so that the two ends of the heat sink and the middle portion of the heat sink are relatively evenly distributed, and the bottom portion of the heat sink 2 can uniformly contact the electronic component. , so that the heater 2 can be fully given to the electron element [0010] In other embodiments, the length of the protrusion 153 of the main body portion 152 of the elastic connecting piece 15 may be reduced, so that the contact area of the main body portion 152 with the heat dissipation fin 23 of the heat sink 20 Increasing, so that the middle portion of the heat sink 2 can receive more force, and the thermal grease can more uniformly contact the electronic component. [0011] In summary, the present invention has indeed met the requirements of the invention patent, Patent application is filed. However, the above is only the preferred embodiment of the present invention 098118489 Form No. A0101 0982031342-0 201044958, which cannot limit the scope of patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0013] FIG. 1 is a perspective assembled view of a preferred embodiment of a heat sink fixture of the present invention and a heat sink. 2 is an exploded perspective view of FIG. 1. [Main component symbol description] [0014] Heat sink fixing device 10 Locking member 11 Fixing portion 112 Bump 114 Plate 115 Elastic snap 116 Clip piece 117 Spring 13 Elastic connecting piece 15 Main body portion 152 Projection portion 153 Connection portion 155 Heat dissipation 20 bottom plate 21 through hole 212 heat sink fin 23 098118489 form number A0101 page 6 / 9 page 0982031342-0