201038869 六、發明說明： 【發明所屬之技術領域】 本發明係涉及一種半導體照明裝置，尤係關於 一種發光二極體燈具。 【先前技術】 _人們由於長期過度依賴石化燃料，除造成能源 紐缺及石油價格高漲而牽綷經濟發展，更使全球二 ❹*i化⑯與有害氣體的排放濃度日益增加，導致地球 暖化所引起的氣候反常、生態環境的破壞、以及對 人類生存的危害日益顯現，為永續經營人類賴以生 存的地球生,4環境，必須同時解決能源危機與環境 污㈣題’開發新能源及再生能源是推動節約能源 及馬效率使用能源最重要的策略，而傳統照明所消 :的能源極為可觀，發展照明節能將是最重要的新 能源科技’而半導體照明採用高功率高亮度的發光 [極體(^ED)為光源，該新光源以其高發光效率、節 此長可、裱保（不含汞）、啟動快、指向性、耐衝 擊、耐震動等優點’具有廣泛取代傳統照明光源的 潛力。 田LEr>由於將輸入電能的8〇%〜9〇%轉變成為熱 畺、有10%〜2〇%轉化為光能，且由於LED晶片面 積小發熱密度高，因此發展LED照明的_必須先 解決散熱問題’·優良的LED燈散熱系統可在同等輸 4 201038869 入功率下得到較低的工作溫度，延長LED的使用壽 命，或在同樣的溫度限制範圍内，增加輸入功率或 晶片密度，從而增加led燈的亮度；結點溫度 (Junction temperature)是衡量LED燈散熱性能的重 要技術指標，由於散熱不良導致的結點溫度升高， 將嚴重衫響到發光波長、光強、光效和使用壽命。 應用高功率高亮度LED在照明的新光源上，必 ❹ 須配合高效率的散熱機構以儘量降低LED的結點溫 度’才能發揮上述諸多優點，否則照明裝置的發光 亮度、使用壽命將大打折扣，影響所及將使該照明 裝置的節能效果不彰，並直接衝擊該照明裝置的可 靠度，引發嚴重的光衰甚至使照明裝置失效。 習知半導體照明裝置雖嘗試將LED光源發光時 釋出的熱量藉由增加散熱面積並將光源的發熱面與 散熱器的吸熱面緊密熱接觸，來達到強化照明裝置 散熱效率之目的，例如直接將複數LED光源貼覆於 散熱器中的散熱基座之吸熱面上；惟，在實際應用 中，受制於較小的光源發熱面積通常須搭配較大散 熱面積之幾何分配需求，以降低散熱負荷；在此狀 況下為使結點溫度不致過熱，佈設該複數LED光源 的最佳方式是將各個LED光源的較小發熱面積分別 平均貼設在對應於較大的各個局部吸熱面積上；顯 然，即便如此，在上述局部吸熱面上仍然會因幾何 5 201038869 分配的不均勻特性而造成散熱面積的熱負荷不均勻 現象，從而產生分配熱阻（spreading thermal resistance) ’將直接降低照明裝置的整體散熱效率。 由於分配熱阻源自導熱材料本身有限的導熱係 數’以致在熱傳輸過程中會沿導熱路徑產生一定的 溫度梯度（temperature gradient)，在光源的發熱面積 與散熱器的吸熱面積相差懸殊的狀況下尤其明顯， ❹ 因此除非採用超導熱材料否則難以達到較佳的均勻 熱傳輸效果。 習知半導體照明裝置中亦有採用具有熱超導體 特性的熱管，將光源的熱量導引至較大的吸熱面積 或散熱面積上；惟，所述熱管亦僅能將熱量以線接 觸的方式分配至數個較小吸熱面積或散熱面積上， 2在所述較小的LED光源發熱面積狀況下使熱管能 3 安二的數目受限，以致由熱管導引至散熱面積上的 、里仍然党制於散熱材料的分配熱阻（spreading stance)而無法達到高效率的均勻散熱；因此，如 可配:政熱器二維或三維散熱面需求，將[ED光源 的熱置快速而均句的傳輸到所述散熱面上，以及如 ^ 輸到所述散熱面上的熱量快速移除，成為降 、麵結點溫度必須關注的重要指標；為此， 無須外加動Λ 1成本低廉、效率高、長期穩定、 ’且可隨光源的發熱量或温度變化而 6 201038869 自發產生不_騰程度的均⑲ 續將光源的熱量快速導離，成、“確保能持 質高可靠性的半導體照明裝置相^業界製造高品 戰。 置必而克服的重要挑 【發明内容】 有鑒於此’有必要提供 發光二極體燈具。 種 具有高散熱效率 之 ❹201038869 VI. Description of the Invention: [Technical Field] The present invention relates to a semiconductor lighting device, and more particularly to a light emitting diode lamp. [Prior Art] _ Due to long-term excessive dependence on fossil fuels, in addition to causing energy shortages and high oil prices, the economic development is hindered, and the global concentration of harmful gases is increasing, resulting in global warming. The resulting climate anomalies, the destruction of the ecological environment, and the harm to human survival are increasingly manifested. For the sustainable operation of the earth on which humans depend for survival, 4 environments must simultaneously address the energy crisis and environmental pollution (4) title 'Developing new energy and recycling Energy is the most important strategy to promote energy conservation and horse efficiency. The traditional lighting eliminates: the energy is very impressive, the development of lighting energy saving will be the most important new energy technology' and the semiconductor lighting uses high power and high brightness. The body (^ED) is a light source, and the new light source has a wide replacement for the traditional illumination source because of its high luminous efficiency, long growth, protection (without mercury), fast start, directivity, impact resistance, vibration resistance and the like. potential. Tian LEr> converts 8〇%~9〇% of input power into hot 畺, 10%~2〇% into light energy, and because LED wafer area is small, the heat density is high, so the development of LED lighting must first Solve heat dissipation problems'·Excellent LED lamp cooling system can achieve lower operating temperature, extend LED life, or increase input power or wafer density within the same temperature limit, at the same input speed, 201038869 Increase the brightness of the led lamp; Junction temperature is an important technical indicator to measure the heat dissipation performance of the LED lamp. The temperature of the junction is increased due to poor heat dissipation, and the brightness of the lamp will be loud, the light intensity, the light effect and the use. life. The application of high-power high-brightness LEDs in the new light source of illumination must be combined with a high-efficiency heat-dissipating mechanism to minimize the junction temperature of the LEDs. In order to exert the above advantages, the illumination brightness and service life of the lighting device will be greatly reduced. The impact will make the lighting device less energy-efficient, and directly impact the reliability of the lighting device, causing severe light decay or even invalidating the lighting device. The conventional semiconductor lighting device attempts to enhance the heat dissipation efficiency of the lighting device by increasing the heat dissipation area by increasing the heat dissipation area of the LED light source, for example, to directly enhance the heat dissipation efficiency of the lighting device, for example, directly The plurality of LED light sources are attached to the heat absorbing surface of the heat sink base in the heat sink; however, in practical applications, the heat source area of the light source is usually required to be matched with the geometrical distribution requirement of the large heat sink area to reduce the heat dissipation load; In this case, in order to prevent the junction temperature from being overheated, the best way to arrange the plurality of LED light sources is to respectively affix the smaller heat-generating areas of the respective LED light sources to the respective partial heat absorption areas corresponding to each other; obviously, even In this way, the above-mentioned local heat absorbing surface still causes the uneven heat load of the heat dissipation area due to the uneven distribution of the geometry 5 201038869, thereby generating a spreading thermal resistance, which will directly reduce the overall heat dissipation efficiency of the lighting device. . Since the heat transfer resistance is derived from the limited thermal conductivity of the heat-conducting material itself, a certain temperature gradient is generated along the heat-conducting path during heat transfer, and the difference between the heat-generating area of the light source and the heat-absorbing area of the heat sink is large. In particular, it is difficult to achieve a better uniform heat transfer effect unless a superconducting material is used. In the conventional semiconductor lighting device, a heat pipe having the characteristics of a hot superconductor is also used, and the heat of the light source is guided to a larger heat absorption area or a heat dissipation area; however, the heat pipe can only distribute heat to the line contact manner. On a small heat absorption area or heat dissipation area, 2 the number of heat pipes can be limited to 3 amps in the heat-generating area of the smaller LED light source, so that the heat pipe is guided to the heat dissipation area, and still in the party system. The heat dissipation of the heat dissipating material does not achieve high efficiency and uniform heat dissipation; therefore, if it can be matched with the requirements of the two-dimensional or three-dimensional heat dissipating surface of the e-heater, the [ED light source is quickly set and transmitted uniformly. The heat dissipating surface and the heat removed to the heat dissipating surface are quickly removed, which is an important indicator that the temperature of the falling and the junction temperature must be paid attention to; for this reason, no external force is required. 1 The cost is low and the efficiency is high. Long-term stability, 'and can vary with the heat or temperature of the light source. 6 201038869 Spontaneously produced the degree of non-toning. Continued to quickly divert the heat of the light source, "ensure that the quality can be maintained with high reliability. The conductor lighting device is manufactured in the high-quality industry. It is an important challenge to overcome. [Inventive content] In view of this, it is necessary to provide a light-emitting diode lamp.
-種發光二極體燈具，包括一散熱部、一光學 部及-電氣部。該散熱部包括—殼體及設於該殼體 上的-散熱器’並由該殼體與散熱器合圍形成一密 封的腔體’該腔體之内賴置有毛細結構並於毛細 結構内填充有可隨溫度變化而産生不同沸騰程度的 工作流體，該殼體具有朝向散熱器的一蒸發面及與 該蒸發面相對的一吸熱面，該散熱器包括一散熱基 座及複數鰭片，該散熱基座具有朝向殼體的一内表 面及與該内表面相對的一外表面，所述鰭片設於散 熱基座之外表面上。該光學部設於散熱部之前方， 包括一發光二極體光源模組及一燈罩’用以提供所 需的,¾明梵度與發光特性及對發光二極體光源模組 保護’該發光二極體光源模組設於殼體之吸熱面 上，該燈罩設於殼體上並將發光二極體光源模組罩 設於内。該電氣部包括一電路板，用以提供發光二 極體光源模組所需要之驅動電源、控制電路及電源 7 201038869 管理。 本發明具有如下優點： 二一 1T作流體相變進行潛熱交換的高效 =:: ，結合具有極低分配熱阻的均 二特性二確保該發光二極體燈具發揮高光效、長壽 命、穩定出光之功效。 ❹- A light-emitting diode lamp comprising a heat sink, an optics section and an electrical section. The heat dissipating portion includes a casing and a heat sink disposed on the casing and a cavity formed by the casing and the radiator to form a sealed cavity. The cavity has a capillary structure and is disposed in the capillary structure. Filled with a working fluid that can produce different boiling degrees with temperature change, the housing has an evaporation surface facing the heat sink and a heat absorbing surface opposite to the evaporation surface, the heat sink includes a heat dissipation base and a plurality of fins. The heat dissipation base has an inner surface facing the housing and an outer surface opposite to the inner surface, and the fins are disposed on an outer surface of the heat dissipation base. The optical portion is disposed in front of the heat dissipating portion, and includes a light emitting diode light source module and a light cover 'to provide the required, 3⁄4 明梵度 and light emitting characteristics and to protect the light emitting diode light source module. The diode light source module is disposed on the heat absorbing surface of the casing, and the lamp cover is disposed on the casing and the light emitting diode light source module is disposed inside. The electrical part includes a circuit board for providing driving power, control circuit and power supply required for the light emitting diode light source module. The invention has the following advantages: the efficiency of the latent heat exchange of the fluid phase change of the 1st 1T is reduced to: =:: combined with the uniformity characteristic of the extremely low distribution heat resistance, the light-emitting diode lamp ensures high luminous efficiency, long life and stable light output. The effect. ❹
提供-種安靜無聲、無須外加動力，且可隨發 先一極體光源模組釋出的熱量或呈現的溫度變化而 自發產生不同沸騰程度的高效散熱發光二極體燈 具’將發光二極體光源模組的熱量快速導離。 提供一種高散熱效率的發光二極體燈具，藉由 在散熱器與發光：極體光源模組之間設置—内壁設 f毛細結構的腔體’在腔體内部形成不同程度的液 汽相變（Phase change)之動態平衡，以及毛細力與重 力的共同作用’將吸人毛細結構_的冷凝液順利回 流至底部的蒸發面，從而有效防止因乾化現象 (dryout)造成燈具的過熱損毀。 k供一種尚散熱效率的發光二極體燈具，藉由 能直接將液、汽兩相自然循環轉換的散熱腔體，使 冷凝過程釋出的蒸發潛熱（latent heat of evaporation) 直接均勻地在大面積的散熱基座内表面進行高效率 的熱交換，確保發光二極體燈具發揮高散熱效率之 8 201038869 均勻散熱功效。 【實施方式】 以下參照圖1至圖8,對本發明發光二極體燈具 予以進一步說明。 圖1係本發明發光二極體燈具100第一實施例 之立體組裝示意圖；圖2係圖1所示發光二極體燈 具100之立體分解圖，其中未示出毛細結構；圖3 © 係圖1所示發光二極體燈具1〇〇沿ΙΙΙ-ΙΠ線之剖視 圖，其中未示出燈罩及電路板。該發光二極體燈具 100主要包括一光學部10、一散熱部20及一電氣部 30 ° 光學部10係設置於散熱部20前方，包括一發 光一極體光源模組U及一燈罩12。本實施例中， 所述發光二極體光源模組η由複數光條nl組成， 所述光條111包括一長條形的導熱基板mi以及設 於該導熱基板1111上的複數發光體1112與複數電 極（圖未示），其中所述發光體1112係由至少一發 光一極體晶片經透明封裝所形成。所述光條nl之 導熱基板1111與散熱部20的一吸熱面224之間的 緊密熱接觸可先在兩者之間塗抹一層熱界面材料 (TIM) ’再將已套裝電絕緣墊片的複數螺絲（圖未示） 分別通過光條111上所設的複數固定孔（圖未示），以 便鎖固於該吸熱面224上所設對應螺孔（圖未示）； 201038869 該發光二極體光源模組11的發光可藉電線電性連 接光條111之電極（圖未示）與電氣部30的一電路板 31以及藉由電線電性連接該電路板31與外部電源 (圖未不）達成。 燈罩12為包括至少一光學鏡片的罩蓋，設於散 熱部20之前方，以提供發光二極體燈具100所需的 照明分佈、發光特性及對發光二極體光源模組11保 ^ 護的功能。上述光學鏡片亦可分別罩蓋於各個光條 〇 111上，亦可將光學鏡片在封裝過程中直接與所述發 光體1112 —體成型，以避免二次光學造成的光損耗。 散熱部20設於該光學部10的後方，包括一殼 體22及設於該殼體22上的一散熱器23，並由所述 殼體22、散熱器23及發光二極體光源模組11構成 一光引擎。該殼體22由導熱性佳的材質製成，包括 一吸熱底板221及由該吸熱底板221之周緣向上延 ❹ 仲的一封閉的侧牆222。所述吸熱面224位於吸熱 底板221之下側，該發光二極體光源模組11之光條 111平行地設置於該吸熱底板221之吸熱面224上並 與該吸熱面224緊密熱接觸。該吸熱底板221還具 有位於上侧的一蒸發面223，該吸熱底板221之蒸 發面223上設有向上延伸之複數支撐元件，本實施 例中支撐元件為支撐柱225。 散熱器23設於該殼體22上，包括一散熱基座 201038869 231及呈間隔設置於散熱基座231上的複數片狀鰭 片232,該散熱基座231具有位於下側並朝向殼體 22的一内表面233及位於上側的一外表面234，所 述鰭片232係設於散熱基座231之外表面234上並 沿縱向延伸，相鄰兩鰭片232之間形成一氣流通道 237。該散熱器23之散熱基座231 <蓋設於殼體22之 側牆222上，從而由散熱器23與殼體22合圍形成 一腔體24，所述腔體24的剖面呈矩形。該腔體24 之内壁鋪設有數層緊實排列的金屬網，以構成多微 流通道（multi-microchannel)的毛細結構25，並將 該腔體24内的空氣抽出使達到一定的真空度，以及 在該毛細結構25内填充工作流體（圖未示）並將腔 體24密封。所述工作流體可隨發光二極體光源模組 11的發熱量或溫度變化而在腔體24内部形成不同 程度的液汽相變之動態平衡。其中所述毛細結構25 包括設於殼體22之蒸發面223上的第一部分251、 設於散熱器23之散熱基座231的内表面233上的第 二部分252、以及設於殼體22之侧壁的内表面上的 第三部分253。所述毛細結構25的第一部分251與 第二部分252相間隔並在兩者之間形成有一蒸汽通 道241，該第三部分253之兩端分別與第一部分251 之周緣及第二部分252之周緣連接。支撐柱225之 頂端抵靠於散熱基座231的内表面233以支撐該散 熱基座231。 11 201038869 當開啟發光二極體光源模組11使發光二極體燈 具100正常運作時，發光二極體光源模組11的發熱 量係由所述殼體22之吸熱面224傳入腔體24内， 由於散熱器23之散熱基座231的外表面234上設有 與冷空氣接觸的複數鰭片232,使該散熱基座231 之内表面233成為一較低溫的冷凝面；傳入腔體24 内的熱量促使佈設於殼體22之蒸發面223上的毛細 結構25的第一部分251中所蘊含的液相工作流體吸 收潛熱而急速汽化（蒸發）膨脹，並將高熱給（enthalpy) 的蒸汽經低流阻的蒸汽通道241快速向上傳送，使 該蒸汽與冷凝面（即散熱基座231之内表面233) 發生直接接觸冷凝而釋放出潛熱的高效率熱交換， 致使蒸汽重新凝結成為液體，再藉由腔體24内壁所 設毛細結構25所產生的毛細力與重力的共同作 用，使冷凝液能夠快速地被吸入似海綿般的毛細結 構25内，並藉由毛細結構25回流至底部的蒸發面 223，以持續進行吸收潛熱而蒸發，從而有效防止蒸 發面223乾化（dryout)所導致的吸熱面224急速升溫 而使散熱器23的最大散熱能力受到限制；如此週而 復始，藉由所述工作流體在蒸發面223與冷凝面引 發的相變化潛熱交換過程，可在腔體24内部自發 (passive)產生液、汽相變循環的動態平衡，並能隨 著發光二極體光源模組Π之高、低功率變化而自行 調變，發揮全方位的解熱功能，持續以吸收及釋放 12 .201038869 f熱的方式進行高效率散熱，將發光二極體光源模 組11發光時所釋出的熱量均勾移除。 另外由於工作流體的蒸發與凝結過程係發生 在相同的飽和溫度，因此可在極小的溫度差異下進 行吸收及釋放大！潛熱的熱交換，顯示所述散熱部 20的傳熱性⑨遠優於銘、_、金、銀等導熱金屬材 料’從而使所述散熱部20結合具有極低分配熱阻的 0 均熱純、以相變進行潛熱交換的高效熱傳、安靜 無聲且^需任何外加動力，以及可在很薄的腔體24 内進行等夕重優點，確保該發光二極體燈具的 輕巧並發揮高光效’長壽命及穩定的光輸出效果。 該散熱器23的腔體24内填充的工作流體可採 =具有低4騰溫度或易汽化的流體及高蒸發潛熱的 "u·體例如酒精、冷柬劑、水等，配合將該腔體 ❹ 抽至適當的真空度，可使其中的工作流體在高或低 的操作溫度範圍内均能產生不同程度的彿騰，從而 使該腔體24内的工作流體可隨發光二極體光源模 組11溫度變化而自發地產生對應的蒸汽量，藉由相 變化的潛熱交換達到高效熱傳的功效；另外 ，所述 毛細、纟。構25除可藉由鋪設數層緊實排列的金屬網 達成外，亦可採用粉洙燒結、金屬絲、微細溝槽以 及上述方式的組合型式達成；再則，為克服腔體24 内外的壓差以防止腔體24壁面的凹陷，在腔體24 13 201038869 内設置有連接蒸發面223與冷凝面（即散熱基座231 之内表面233)的支撐柱225，以強化腔體以的結 構；所述散熱器23之鰭片232亦可以其他型式達 到，例如由散熱基座231之外表面234向上凸伸的 複數柱狀體。 散熱益23的散熱係透過氣流溫差導致的密度差 而產生熱*力’並藉由熱空氣向上漂浮的慣性趨勢 〇 引導鰭片232外的冷空氣進入相鄰鰭片232之間； 使進入相鄰鰭片232之間的冷空氣吸收由發光二極 體光源模組11傳至韓4 232的熱量而升溫並上浮， 同時、，新的冷空氣會自動填補已上浮的熱空氣空 間’並同樣經吸熱升溫上浮而發揮縛片232散熱的 效果；所述鰭片232上開設複數分隔槽236，以使 冷空氣更易由分隔槽236進入其他相鄰鰭片232之 間的氣流通道237，並與上浮的熱空氣形成紊流的 〇 擾動而強化散熱效率；上述冷熱氣流交替進出鰭片 232之間形成對自然循環最有利於低流阻的垂直冷 卻通道，從而使發光二極體燈具1〇〇具有高散熱效 率，達到有效移除發光二極體光源模組U發光時釋 出的熱量。 電氣部30包括設於殼體22之吸熱面224上的 電路板31，燈罩12設於殼體22的前方並將電路板 31及發光二極體光源模組u罩設於内。該電路板 14 .201038869 31係與發光二極體光源模組11之光條ill的電極 (圖未不）及與電源電連接，所述電源除可為電池或 電瓶等直流電源外，亦可透過電源轉換器將交流市 電轉換為適合該發光二極體光源模組u的直流電 源，该電路板31提供該發光二極體光源模組n之 驅動電源、控制電路及電源管理。 圖4係本發明發光二極體燈具第二實施例中散 ❹ 熱。卩20a之立體示意圖，其中未顯示毛細結構。散 熱部20a包括一殼體22a及一散熱器23&，該散熱器 23a.包括一散熱基座23u與設於該散熱基座 之上表面234a上的複數鰭片232a。該散熱部2〇a 與第一實施例中的散熱部20的主要區別如下。本實 施例中，殼體22a呈U形，包括一吸熱底板221a 及分別設於吸熱底板221a之相對兩端並朝向殼體 22a的兩第側板222a，該殼體22a之兩側板222a 0 係由吸熱底板221a之前後兩端邊緣分別朝向散熱器 23a延伸开》成。散熱器23a還包括分別設於散熱基座 231a之相對兩端並朝向殼體22a的兩第二側板 以及設於該兩第二側板239之間的至少一支撐板 238。該政熱态23a之兩第二侧板239對應設於第一 側板222a之兩端，係由散熱基座23U之左右兩端 邊緣分別朝向殼體22a延伸形成。所述支撐板238 與第二側板239平行，係由散熱基座23u之内表面 233a朝向设體22a延伸形成。該殼體22a之吸熱底 15 201038869 板221a及側板222a上對應散熱器23a之兩第二側 板239設有卡槽227以容置散熱器23a之兩第二側 板239的端部。其中該散熱器23a為由擠形製程製 作的一體成型件，該殼體22a為由擠形或衝壓製程 製作的一體成型件。該散熱器23a與殼體22a合圍 形成一腔體24a，並由殼體22a之兩第一側板222a 及散熱器23a之兩第二側板229構成腔體24a之側 壁，在將散熱器23a與殼體22a接合之前，在所述 腔體24a的内壁已完成毛細結構的佈設，該殼體22a 上所設卡槽227可方便將散熱器23a與殼體22a嵌 裝接合及進一步密封；另外，採用與散熱基座231a 一體的支撐板238作為腔體24a的支撐元件，使支 撐板238之另一端與殼體22a的吸熱底板221a相 接，並在支撐板238上開設有連通支撐板238兩侧 的連通口 2381，如此不但使腔體24a内注入的工作 流體得以互相連通，且由於支撐板238的接觸面較 支撐柱225 (圖2所示）大，從而增強腔體24a的抗 壓能力；相較於第一實施例，本實施例提供一種簡 化製程、適合大量生產、易於組裴、降低成本且適 用於通用發光二極體燈具的散熱部20a。 圖5係本發明發光二極體燈具100b第三實施例 之立體組裝示意圖，圖6係圖5之立體分解圖，其 中未示出毛細結構。該發光二極體燈具l〇〇b與第一 實施例之發光二極體燈具100的主要區別如下。本 16 201038869 實施例中，散熱部20b還包括至少一風扇26及一頂 蓋27。所述風扇26設於散熱器23之鰭片232的頂 端，頂蓋27設於散熱器23上，並將風扇26及鰭片 232罩設於内。本實施例除可藉由密封腔體24中工 作流體的相變化持續以潛熱交換將高功率發光二極 體光源模組11發光時所釋出的熱量快速而均勻的 傳輸到散熱器23，並藉由散熱器23頂端所設風扇 26將傳輸到所述散熱器23上的熱量快速移除。為 使風扇26的氣流竄流於鰭片232之間以發揮強化散 熱的功效，在該風扇26的頂部還設置有罩蓋散熱器 23之鰭片232的頂蓋27，並在該頂蓋27的側面設 有外凸並朝下開口的複數防塵氣孔271 ;當風扇26 面向鰭片232吹拂時，由於朝鰭片232延伸方向的 高壓氣流之導引慣性，使在該方向的防塵氣孔271 用來排風；反之，在橫越鰭片232延伸方向的防塵 氣孔271呈現低壓而將外界的較冷空氣吸入頂蓋27 内，以用來進風，並透過沿鰭片232橫向的分隔槽 236將該較冷空氣導入沿鰭片232延伸方向的冷卻 氣流通道237，且在該較冷空氣流經橫向的分隔槽 236而與在所述冷卻氣流通道237中的氣流交會時 形成高熱傳效率的交錯流（cross flow)及紊流 (turbulent flow) ’從而進一步強化所設韓片232的散 熱能力，使該發光二極體燈具100b在啟用中恆常維 持在高效率的穩定發光狀態。本發明的其他實施例 17 201038869 中同樣也可包括風扇26及頂蓋27。 圖7係本發明發光二極體燈具第四實施例中光 引擎之組裝剖面示意圖；散熱部20c包括一殼體22c 及設於殼體22c上的一散熱器23c，並由該殼體22c 與散熱器23c合圍形成一密封的腔體24c。該光引擎 與第一實施例之發光二極燈具100中光引擎的主要 區別如下。散熱部20c之腔體24c的剖面呈倒V形， ^ 該腔體24c的内壁佈滿毛細結構25c，並於腔體24c 内填充有可隨發光二極體光源模組11的發熱量或 溫度變化而產生不同沸騰程度的工作流體；散熱器 23c包括一呈倒V形的散熱基座231c及設於該散熱 基座231c之外表面234c上的複數鰭片232c，該散 熱器23c之外表面234c呈倒V形且向外凸出，所述 鰭片232c係沿該散熱基座231c的橫向排列，以實 現較圖3所示平面式散熱器23具更大的散熱面積； 〇 殼體22c包括一呈倒V形的吸熱底板221c，該吸熱 底板221c的下側具有一呈倒V形且向内凹的吸熱面 224c，發光二極體光源模組11設於該吸熱面224c 上以構成使光線匯聚之立體光源。 圖8係本發明發光二極體燈具第五實施例中光 引擎之組裝剖面示意圖；散熱部20d包括一殼體22d 及設於殼體22d上的一散熱器23d，並由該殼體22d 與散熱器23d合圍形成一密封的腔體24d。該光引 18 201038869 擎與第一實施例之發光二極燈具100中光引擎的主 要區別如下。散熱部20d之腔體24d的剖面呈V形， 該腔體24d的内壁佈滿毛細結構25d，並於腔體24d 内填充有可隨發光二極體光源模組11的發熱量或 溫度變化而產生不同沸騰程度的工作流體；散熱器 23d包括一呈V形的散熱基座231d及設於該散熱基 座231d之外表面234d上的複數鰭片232d，該散熱 器23d之外表面234d呈V形且向内凹，所述鰭片 ^ 232d係沿該散熱基座231d的橫向排列，以實現較 圖3所示平面式散熱器23具更大的散熱面積；殼體 22d包括一呈V形的吸熱底板221d，該吸熱底板 221d的下侧具有一呈V形且向外凸出的吸熱面 224d，發光二極體光源模組11設於該吸熱面224d 上以構成使光線擴散之立體光源。 由上述的實施方式已進一步清楚說明本發明的 〇 技術特徵及達成之功效，包括： (1) 提供一種以工作流體相變進行潛熱交換的高 效散熱發光二極體燈具，結合具有極低分配熱阻的 均熱特性，確保該發光二極體燈具發揮高光效、長 壽命、穩定出光之功效。 (2) 提供一種安靜無聲、無須外加動力，且可隨 發光二極體光源模組釋出的熱量或呈現的溫度變化 而自發產生不同沸騰程度的高效散熱發光二極體燈 19 201038869 具’將發光二極體光源模組的熱量快速導離。 (3) 提供一種高散熱效率的發光二極體燈具，夢 由在散熱器與發光二極體光源模組之間設置一内壁 設置毛細結構的腔體’在腔體内部形成不同程度的 液汽相變之動態平衡，以及毛細力與重力的共同作 用，將吸入毛細結構中的冷凝液順利回流至底部的 蒸發面，從而有效防止因乾化現象（dry〇ut)造成燈具 Q 的過熱損毁。 (4) 提供一種高散熱效率的發光二極體燈具，藉 由《b直接將液、&兩相自然循環轉換的散熱腔體， 使冷凝過程釋出的蒸發潛熱直接均勻地在大面積的 散熱基座内表面進行高效率的熱交換，確保發光二 極體燈具發揮高散熱效率之均勻散熱功效。 綜上所述，本發明確已符合發明專利之要件， ❹ 遂依法提出專利申請。惟，以上所述者僅為本發明 之較佳實施例，自不能以此限制本案之申請專利範 圍。舉凡熟悉本案技藝之人士援依本發明之精神所 作之等效修飾或變化，皆應涵蓋於以下申請專利 圍内。 【圖式簡單說明】 圖1係本發明發光二極體燈具第一實施例之立 體組裝示意圖。 20 201038869 圖2係圖1所示發光二極體燈具之立體分解 圖，其中未示出毛細結構。 圖3係圖1所示發光二極體燈具沿III-III線之 剖視圖，其中未示出燈罩及電路板。 圖4係本發明發光二極體燈具第二實施例中散 熱部之立體示意圖，其中未顯示毛細結構。 圖5係本發明發光二極體燈具第三實施例之立 〇 體組裝不意圖。 圖6係圖5之立體分解圖，其中未示出毛細結 構。 圖7係本發明發光二極體燈具第四實施例中光 引擎之組裝剖面示意圖。 圖8係本發明發光二極體燈具第五實施例中光 引擎之組裝剖面示意圖。 〇 【主要元件符號說明】 燈具 100、100b 光學部 10 光源模組 11 光條 111 導熱基板 1111 發光體 1112 燈罩 12 散熱部 20、20a、20b、20c、20d 殼體 22、22a、22c、22d 吸熱底板 221、221a 側牆 222 21 223201038869Provides a kind of quiet, silent, no additional power, and can generate different boiling levels of high-efficiency heat-dissipating diodes with the heat released by the first-pole light source module or the temperature change that appears. The heat of the light source module is quickly guided away. A light-emitting diode lamp with high heat dissipation efficiency is provided, and a liquid-vapor phase change in the cavity is formed in the cavity by providing a cavity with a capillary structure of the inner wall between the heat sink and the light-emitting body module. The dynamic balance of (Phase change) and the combined action of capillary force and gravity 'flow the condensate of the capillary structure _ to the evaporation surface of the bottom, thus effectively preventing the overheating of the luminaire due to dryout. For a light-emitting diode lamp with heat dissipation efficiency, the latent heat of evaporation released by the condensation process is directly and evenly large by a heat dissipation cavity capable of directly converting the liquid and vapor phases into a natural cycle. The inner surface of the heat-dissipating base of the area is highly efficient in heat exchange, ensuring that the light-emitting diode lamp can achieve high heat dissipation efficiency. [Embodiment] Hereinafter, a light-emitting diode lamp of the present invention will be further described with reference to Figs. 1 to 8 . 1 is a perspective assembled view of a first embodiment of a light-emitting diode lamp 100 of the present invention; FIG. 2 is an exploded perspective view of the light-emitting diode lamp 100 of FIG. 1 , wherein the capillary structure is not shown; 1 is a cross-sectional view of a light-emitting diode lamp 1 along a ΙΙΙ-ΙΠ line, in which a lamp cover and a circuit board are not shown. The light-emitting diode lamp 100 mainly includes an optical portion 10, a heat dissipating portion 20, and an electric portion 30. The optical portion 10 is disposed in front of the heat dissipating portion 20, and includes a light-emitting one-pole light source module U and a lamp cover 12. In this embodiment, the light-emitting diode light source module η is composed of a plurality of light strips n1, and the light strip 111 includes an elongated heat-conducting substrate mi and a plurality of light-emitting bodies 1112 disposed on the heat-conductive substrate 1111. A plurality of electrodes (not shown), wherein the illuminant 1112 is formed by transparently packaging at least one illuminating body wafer. The close thermal contact between the heat conducting substrate 1111 of the light strip n1 and a heat absorbing surface 224 of the heat dissipating portion 20 may be first applied with a layer of thermal interface material (TIM) between the two, and then the plurality of electrically insulating spacers are assembled. Screws (not shown) pass through a plurality of fixing holes (not shown) provided on the light strips 111 to lock corresponding screw holes (not shown) on the heat absorbing surface 224; 201038869 The light emitting diode The light source module 11 can be electrically connected to the electrode of the light strip 111 (not shown) and a circuit board 31 of the electrical part 30 by wires, and electrically connected to the circuit board 31 and the external power source by wires (not shown). Achieved. The lamp cover 12 is a cover including at least one optical lens, which is disposed in front of the heat dissipating portion 20 to provide illumination distribution, illuminating characteristics, and protection for the illuminating diode light source module 11 of the illuminating diode lamp 100. Features. The optical lenses may also be respectively covered on the respective light strips 111, or the optical lenses may be directly molded with the light emitting body 1112 during the packaging process to avoid optical loss caused by secondary optics. The heat dissipating portion 20 is disposed at the rear of the optical portion 10, and includes a casing 22 and a heat sink 23 disposed on the casing 22, and the casing 22, the radiator 23, and the light emitting diode light source module 11 constitutes a light engine. The housing 22 is made of a material having good thermal conductivity, and includes a heat absorption base 221 and a closed side wall 222 extending upward from the periphery of the heat absorption base 221 . The heat absorbing surface 224 is located on the lower side of the heat absorbing substrate 221, and the light strips 111 of the light emitting diode module 11 are disposed in parallel on the heat absorbing surface 224 of the heat absorbing substrate 221 and are in close thermal contact with the heat absorbing surface 224. The heat absorption base 221 further has an evaporation surface 223 on the upper side. The evaporation surface 223 of the heat absorption base 221 is provided with a plurality of support members extending upward. In this embodiment, the support member is a support column 225. The heat sink 23 is disposed on the housing 22 and includes a heat dissipation base 201038869 231 and a plurality of fins 232 spaced apart from the heat dissipation base 231. The heat dissipation base 231 has a lower side and faces the housing 22 . An inner surface 233 and an outer surface 234 are disposed on the outer surface 234 of the heat dissipation base 231 and extend in the longitudinal direction. An air flow passage 237 is formed between the adjacent fins 232. The heat sink base 231 of the heat sink 23 is covered on the side wall 222 of the housing 22, so that the heat sink 23 and the housing 22 are enclosed to form a cavity 24. The cavity 24 has a rectangular cross section. The inner wall of the cavity 24 is provided with a plurality of tightly arranged metal meshes to form a multi-microchannel capillary structure 25, and the air in the cavity 24 is extracted to achieve a certain degree of vacuum, and A working fluid (not shown) is filled in the capillary structure 25 and the cavity 24 is sealed. The working fluid can form a dynamic balance of different degrees of liquid-vapor phase transition inside the cavity 24 according to the heat generation or temperature change of the LED light source module 11. The capillary structure 25 includes a first portion 251 disposed on the evaporation surface 223 of the housing 22, a second portion 252 disposed on the inner surface 233 of the heat dissipation base 231 of the heat sink 23, and a housing portion 22 disposed thereon. A third portion 253 on the inner surface of the side wall. The first portion 251 of the capillary structure 25 is spaced apart from the second portion 252 and defines a vapor passage 241 therebetween. The two ends of the third portion 253 are respectively spaced from the periphery of the first portion 251 and the periphery of the second portion 252. connection. The top end of the support post 225 abuts against the inner surface 233 of the heat dissipation base 231 to support the heat dissipation base 231. 11 201038869 When the light-emitting diode light source module 11 is turned on to enable the light-emitting diode lamp 100 to operate normally, the heat generated by the light-emitting diode light source module 11 is introduced into the cavity 24 by the heat-absorbing surface 224 of the casing 22 In the inner surface 234 of the heat dissipation base 231 of the heat sink 23, a plurality of fins 232 are formed in contact with the cold air, so that the inner surface 233 of the heat dissipation base 231 becomes a lower temperature condensation surface; The heat in the 24 causes the liquid phase working fluid contained in the first portion 251 of the capillary structure 25 disposed on the evaporation surface 223 of the casing 22 to absorb latent heat and rapidly vaporize (evaporate) and expand the enthalpy of steam. The low flow resistance steam passage 241 is rapidly upwardly conveyed, and the steam is directly contacted with the condensation surface (ie, the inner surface 233 of the heat dissipation base 231) to release a high-efficiency heat exchange of latent heat, causing the steam to recondense into a liquid. The capillary force generated by the capillary structure 25 on the inner wall of the cavity 24 cooperates with the gravity to enable the condensate to be quickly sucked into the sponge-like capillary structure 25 and recirculated by the capillary structure 25. The evaporation surface 223 of the bottom portion evaporates to continuously absorb the latent heat, thereby effectively preventing the rapid increase of the heat absorption surface 224 due to the dryout of the evaporation surface 223, thereby limiting the maximum heat dissipation capability of the heat sink 23; The phase change latent heat exchange process of the working fluid on the evaporation surface 223 and the condensation surface can spontaneously generate a dynamic balance of liquid and vapor phase change cycles inside the cavity 24, and can follow the light emitting diode light source mode. The group's high and low power changes are self-modulating, and the full-scale anti-heating function is exerted. The high-efficiency heat dissipation is continuously absorbed and released by the method of heat absorption, and the light-emitting diode light source module 11 emits light. The heat is removed. In addition, since the evaporation and coagulation processes of the working fluid occur at the same saturation temperature, absorption and release can be performed with extremely small temperature differences! The heat exchange of the latent heat shows that the heat transfer property of the heat dissipating portion 20 is far superior to that of the heat conductive metal material such as 铭, _, gold, silver, etc., so that the heat dissipating portion 20 is combined with a zero soaking heat having a very low distribution heat resistance. The high-efficiency heat transfer of the latent heat exchange with phase change, quiet and silent, and the need for any external power, and the advantages of being able to be carried out in a very thin cavity 24, ensuring the lightness and high luminous efficiency of the light-emitting diode lamp. 'Long life and stable light output. The working fluid filled in the cavity 24 of the radiator 23 can be used to have a low-temperature or easily vaporized fluid and a high-evaporation latent heat such as alcohol, cold agent, water, etc. The body is pumped to a suitable degree of vacuum, so that the working fluid therein can produce different degrees of Fotten in the high or low operating temperature range, so that the working fluid in the cavity 24 can follow the light emitting diode light source. The temperature of the module 11 spontaneously generates a corresponding amount of steam, and the effect of efficient heat transfer is achieved by the phase change latent heat exchange; in addition, the capillary and the enthalpy. The structure 25 can be achieved by laying a plurality of tightly arranged metal meshes, and can also be achieved by using a powder compaction, a wire, a fine groove, and a combination of the above; in addition, in order to overcome the pressure inside and outside the cavity 24 Poorly preventing the recess of the wall surface of the cavity 24, and a support post 225 connecting the evaporation surface 223 and the condensation surface (ie, the inner surface 233 of the heat dissipation base 231) is disposed in the cavity 24 13 201038869 to strengthen the structure of the cavity; The fins 232 of the heat sink 23 can also be achieved in other types, such as a plurality of columns that protrude upward from the outer surface 234 of the heat dissipation base 231. The heat dissipation of the heat dissipation 23 generates a heat* force through the density difference caused by the temperature difference of the airflow and causes the cold air outside the fin 232 to enter between the adjacent fins 232 by the inertia tendency of the hot air to float upward; The cold air absorption between the adjacent fins 232 is raised and floated by the heat transmitted from the LED light source module 11 to the Han 4 232. At the same time, the new cold air automatically fills the hot air space that has been floated' and The heat dissipation of the heat sink is performed to increase the heat dissipation of the tab 232. The plurality of partition grooves 236 are defined in the fin 232 to make the cold air more easily enter the air flow passage 237 between the other adjacent fins 232 by the partition groove 236, and The floating hot air forms a turbulent turbulent disturbance to enhance the heat dissipation efficiency; the above-mentioned hot and cold airflow alternately enters and exits the fins 232 to form a vertical cooling passage which is most favorable to the low flow resistance of the natural circulation, thereby making the light-emitting diode lamp 1〇〇 The utility model has the advantages of high heat dissipation efficiency, and effectively removes heat released when the light-emitting diode light source module U emits light. The electrical unit 30 includes a circuit board 31 disposed on the heat absorbing surface 224 of the casing 22. The lamp cover 12 is disposed in front of the casing 22 and covers the circuit board 31 and the light-emitting diode light source module u. The circuit board 14 .201038869 31 is electrically connected to the electrode of the light bar ill of the light emitting diode light source module 11 (not shown) and to the power source, and the power source may be a DC power source such as a battery or a battery. The AC mains is converted into a DC power supply suitable for the LED light source module u through a power converter. The circuit board 31 provides driving power, control circuit and power management of the LED light source module n. Fig. 4 is a view showing the heat dissipation in the second embodiment of the light-emitting diode lamp of the present invention. A schematic view of the crucible 20a in which the capillary structure is not shown. The heat radiating portion 20a includes a casing 22a and a heat sink 23a. The heat sink 23a. includes a heat radiating base 23u and a plurality of fins 232a provided on the heat radiating base upper surface 234a. The main difference between the heat radiating portion 2A and the heat radiating portion 20 in the first embodiment is as follows. In this embodiment, the housing 22a is U-shaped, and includes a heat absorption bottom plate 221a and two first side plates 222a respectively disposed at opposite ends of the heat absorption base plate 221a and facing the housing 22a. The two side plates 222a 0 of the housing 22a are The front and rear end edges of the heat absorption base plate 221a are respectively extended toward the heat sink 23a. The heat sink 23a further includes two second side plates respectively disposed at opposite ends of the heat dissipation base 231a and facing the housing 22a, and at least one support plate 238 disposed between the two side plates 239. The second side plates 239 of the thermal state 23a are disposed at opposite ends of the first side plate 222a, and are formed by extending the left and right end edges of the heat dissipation base 23U toward the casing 22a. The support plate 238 is parallel to the second side plate 239 and is formed by extending from the inner surface 233a of the heat dissipation base 23u toward the installation body 22a. The heat-absorbing bottom 15 of the casing 22a and the two second side plates 239 of the side plate 222a corresponding to the heat sink 23a are provided with a card slot 227 for receiving the ends of the two second side plates 239 of the heat sink 23a. The heat sink 23a is an integrally formed member which is formed by an extrusion process, and the casing 22a is an integrally formed member which is formed by an extrusion or stamping process. The heat sink 23a and the housing 22a are formed to form a cavity 24a, and the first side plate 222a of the housing 22a and the two second side plates 229 of the heat sink 23a form a side wall of the cavity 24a, and the heat sink 23a and the case are Before the body 22a is joined, the capillary structure is disposed on the inner wall of the cavity 24a, and the slot 227 is disposed on the housing 22a to facilitate the engagement and further sealing of the heat sink 23a with the housing 22a; The support plate 238 integrated with the heat dissipation base 231a serves as a supporting member of the cavity 24a, and the other end of the support plate 238 is in contact with the heat absorption bottom plate 221a of the casing 22a, and both sides of the communication support plate 238 are opened on the support plate 238. The communication port 2381 not only allows the working fluid injected into the cavity 24a to communicate with each other, but also enhances the pressure resistance of the cavity 24a because the contact surface of the support plate 238 is larger than the support post 225 (shown in FIG. 2); Compared with the first embodiment, the present embodiment provides a heat dissipating portion 20a which is simplified in process, suitable for mass production, easy to assemble, and cost-reducing, and is suitable for a general-purpose light-emitting diode lamp. Fig. 5 is a perspective assembled view of a third embodiment of the light-emitting diode lamp 100b of the present invention, and Fig. 6 is an exploded perspective view of Fig. 5, in which the capillary structure is not shown. The main difference between the light-emitting diode lamp 10b and the light-emitting diode lamp 100 of the first embodiment is as follows. In the embodiment of the present invention, the heat dissipating portion 20b further includes at least one fan 26 and a top cover 27. The fan 26 is disposed at the top end of the fin 232 of the heat sink 23, and the top cover 27 is disposed on the heat sink 23, and the fan 26 and the fin 232 are covered. In this embodiment, the heat released by the high-power light-emitting diode light source module 11 can be quickly and uniformly transmitted to the heat sink 23 by the phase change of the working fluid in the sealed cavity 24 and the latent heat exchange. The heat transferred to the heat sink 23 is quickly removed by the fan 26 provided at the top end of the heat sink 23. In order to circulate the airflow of the fan 26 between the fins 232 to enhance the heat dissipation effect, a top cover 27 of the fin 232 of the cover heat sink 23 is further disposed on the top of the fan 26, and the top cover 27 is provided on the top cover 27 The side surface is provided with a plurality of dust-proof air holes 271 which are convexly and downwardly opened; when the fan 26 is blown toward the fins 232, the dust-proof air holes 271 in the direction are used due to the inertia of the high-pressure airflow toward the extending direction of the fins 232. To eliminate the air, the dust-proof air holes 271 extending in the direction across the fins 232 exhibit a low pressure and draw cold outside air into the top cover 27 for air intake and through the partitioning grooves 236 along the lateral direction of the fins 232. The cooler air is introduced into the cooling airflow passage 237 in the direction in which the fins 232 extend, and forms a high heat transfer efficiency when the cooler air flows through the lateral partitioning grooves 236 to intersect the airflow in the cooling airflow passages 237. The cross flow and the turbulent flow ' further enhance the heat dissipation capability of the Korean 232 provided, so that the LED luminaire 100b is maintained at a high efficiency and stable illumination state during the activation. Other embodiments of the invention 17 201038869 may also include a fan 26 and a top cover 27. 7 is a schematic cross-sectional view showing the assembly of the light engine in the fourth embodiment of the light-emitting diode lamp of the present invention; the heat dissipating portion 20c includes a casing 22c and a heat sink 23c disposed on the casing 22c, and the casing 22c is The heat sink 23c is enclosed to form a sealed cavity 24c. The main difference between the light engine and the light engine in the light-emitting diode lamp 100 of the first embodiment is as follows. The cavity 24c of the heat dissipating portion 20c has an inverted V shape. The inner wall of the cavity 24c is covered with the capillary structure 25c, and the cavity 24c is filled with the heat or temperature of the light source diode module 11 The heat sink 23c includes a heat sink base 231c having an inverted V shape and a plurality of fins 232c disposed on the outer surface 234c of the heat dissipation base 231c, the outer surface of the heat sink 23c 234c is inverted V-shaped and protrudes outwardly, and the fins 232c are arranged along the lateral direction of the heat dissipation base 231c to achieve a larger heat dissipation area than the planar heat sink 23 shown in FIG. 3; The heat absorbing bottom plate 221c is formed in an inverted V shape, and the lower side of the heat absorbing bottom plate 221c has an inverted V-shaped and inwardly concave heat absorbing surface 224c. The light emitting diode light source module 11 is disposed on the heat absorbing surface 224c to form a heat absorbing surface 221c. A stereo light source that converges light. 8 is a schematic cross-sectional view showing the assembly of the light engine in the fifth embodiment of the light-emitting diode lamp of the present invention; the heat dissipating portion 20d includes a casing 22d and a heat sink 23d disposed on the casing 22d, and the casing 22d is The heat sink 23d is enclosed to form a sealed cavity 24d. The main difference between the light guide 18 201038869 and the light engine of the light-emitting diode luminaire 100 of the first embodiment is as follows. The cavity 24d of the heat dissipation portion 20d has a V-shaped cross section, and the inner wall of the cavity 24d is covered with the capillary structure 25d, and the cavity 24d is filled with the heat generation or temperature change of the light-emitting diode light source module 11. The heat sink 23d includes a V-shaped heat dissipation base 231d and a plurality of fins 232d disposed on the outer surface 234d of the heat dissipation base 231d. The outer surface 234d of the heat sink 23d is V. Formed and recessed, the fins 232d are arranged along the lateral direction of the heat dissipation base 231d to achieve a larger heat dissipation area than the planar heat sink 23 shown in FIG. 3; the housing 22d includes a V shape. The heat absorbing bottom plate 221d has a heat absorbing surface 224d which is V-shaped and protrudes outwardly. The light emitting diode light source module 11 is disposed on the heat absorbing surface 224d to form a three-dimensional light source for diffusing light. . The technical features and the achieved effects of the present invention are further clarified by the above embodiments, including: (1) Providing a high-efficiency heat-dissipating light-emitting diode lamp for latent heat exchange with a working fluid phase change, combined with extremely low heat of distribution The uniform heat resistance of the resistor ensures that the LED lamp exhibits high luminous efficiency, long life and stable light output. (2) Providing a high-efficiency heat-dissipating diode lamp that is quiet and silent, does not require external power, and can spontaneously generate different boiling degrees according to the heat released by the light-emitting diode light source module or the temperature change exhibited. The heat of the LED light source module is quickly guided away. (3) Providing a high-efficiency light-emitting diode lamp, the dream is to provide a cavity with a capillary structure between the heat sink and the light-emitting diode light source module to form different degrees of liquid vapor inside the cavity The dynamic balance of phase change, as well as the interaction of capillary force and gravity, smoothly condenses the condensate sucked into the capillary structure to the evaporation surface at the bottom, thereby effectively preventing the overheating of the lamp Q due to dryness. (4) Providing a high-efficiency light-emitting diode lamp, by directly transferring the liquid and the two-phase natural circulation heat-dissipating cavity, the latent heat of vaporization released by the condensation process is directly and uniformly in a large area. High-efficiency heat exchange is performed on the inner surface of the heat-dissipating base to ensure uniform heat dissipation of the light-emitting diode lamp with high heat dissipation efficiency. In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations in accordance with the spirit of the present invention by those skilled in the art should be covered by the following patent applications. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the vertical assembly of a first embodiment of a light-emitting diode lamp of the present invention. 20 201038869 FIG. 2 is an exploded perspective view of the light-emitting diode lamp of FIG. 1 in which the capillary structure is not shown. Figure 3 is a cross-sectional view of the light-emitting diode lamp of Figure 1 taken along line III-III, wherein the lamp cover and the circuit board are not shown. Fig. 4 is a perspective view showing the heat radiating portion of the second embodiment of the light-emitting diode lamp of the present invention, in which the capillary structure is not shown. Fig. 5 is a schematic view showing the assembly of the third embodiment of the light-emitting diode lamp of the present invention. Figure 6 is an exploded perspective view of Figure 5, in which the capillary structure is not shown. Fig. 7 is a cross-sectional view showing the assembly of the light engine in the fourth embodiment of the light-emitting diode lamp of the present invention. Fig. 8 is a schematic cross-sectional view showing the assembly of the light engine in the fifth embodiment of the light-emitting diode lamp of the present invention. 〇【Main component symbol description】 Lamp 100, 100b Optical part 10 Light source module 11 Light bar 111 Thermal substrate 1111 Illuminant 1112 Lamp cover 12 Heat sink 20, 20a, 20b, 20c, 20d Housing 22, 22a, 22c, 22d Heat absorption Bottom plate 221, 221a side wall 222 21 223201038869
第一側板 222a 蒸發面 吸熱面 224 、 224c 、224d 支撐柱 225 卡槽 散熱器 23 、 23a 、 23c ' 23d 散熱基座 231 > 231a 、231c ' 231d 鰭片 232 ' 232a 、232c ' 232d 内表面 233 、 233a 外表面 234 、 234c 、234d 分隔槽 236 氣流通道 支撐板 238 連通口 第二侧板 239 腔體 24 ' 24a > 24c ' 24d 蒸汽通道 241 第一部分 毛細結構 25、25c、 25d 第二部分 252 第三部分 風扇 26 頂蓋 防塵氣孔 271 電氣部 電路板 31 227 237 2381 251 253 27 30 22First side plate 222a evaporation surface heat absorbing surface 224, 224c, 224d support column 225 card slot heatsink 23, 23a, 23c' 23d heat sink base 231 > 231a, 231c '231d fin 232 ' 232a, 232c ' 232d inner surface 233 233a outer surface 234, 234c, 234d partition groove 236 air flow channel support plate 238 communication port second side plate 239 cavity 24' 24a > 24c ' 24d steam passage 241 first portion capillary structure 25, 25c, 25d second portion 252 Part III Fan 26 Top cover dust vent 271 Electrical circuit board 31 227 237 2381 251 253 27 30 22