TW201036507A - Automatic riveting machine for multi-layer circuit board - Google Patents

Automatic riveting machine for multi-layer circuit board Download PDF

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TW201036507A
TW201036507A TW98108901A TW98108901A TW201036507A TW 201036507 A TW201036507 A TW 201036507A TW 98108901 A TW98108901 A TW 98108901A TW 98108901 A TW98108901 A TW 98108901A TW 201036507 A TW201036507 A TW 201036507A
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platform
machine
combined
circuit board
coupled
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TW98108901A
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Chinese (zh)
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TWI380755B (en
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fu-xiang Li
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fu-xiang Li
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Abstract

Disclosed is an automatic riveting machine for a multi-layer circuit board, which is composed of a machine table, a conveying mechanism, a grabbing mechanism, a two-way sliding mechanism, and a drill riveting mechanism. A plurality of circuit board substrates can be placed on a support disk, which is then fixed to the conveying platform of the conveying mechanism. The conveying platform transports the plurality of circuit board substrates to the drill riveting mechanism at the other end of the conveying platform to allow it to move and feed automatically and bi-directionally for the drilling and riveting processes on the edges of the plurality of circuit board substrates. The conveying platform then returns the riveted plurality of circuit board substrates to the bottom of the grabbing mechanism to allow it to hook the plurality of circuit board substrates and the support disk to complete the manufacturing process of fully automatic drilling and riveting.

Description

201036507 六、發明說明: 【發明所屬之技術領域】 本發明係有關一種多層電路板之自動鉚接機,尤指一 種應用在多層電路板之鑽孔及鉚合製程的自動鉚接機。 【先前技術】 傳統的多層電路板製程,先分別製成數片線路基板, 當線路基板表面分別製作電路完成後,必需將多片線路基 〇 板疊放在一起,然後使用沖孔機或鑽孔機在邊緣製作鉚合 基準孔,再使用鉚釘機成對的將多片線路基板鉚合。其後 將多片線路基板放置於鏡面鋼板或銅板之間,送入真空壓 合機中以適當之溫度及壓力使膠片硬化黏合,即能初步製 成多層電路板。 習知應用在多層電路板的自動鉚接機,其包含一結構 磁檯,於機檯前端上面設有一輸送平台,後端二側分別結 合一鑽孔及鉚接複合機。藉此將疊放在一起的多片線路基 〇 板放在輸送平台上,由輸送平台將多片線路基板送達鑽孔 及鉚接複合機處,再控制該鑽孔及鉚接複合機縱向前進, 分別進行鑽孔及鉚合的作業;每當完成一次鑽孔及鉚合作 業後,該鑽孔及鉚接複合機必需完全後退,然後該輸送平 台再移動一段距離,再使該鑽孔及鉚接複合機縱向前進, 進行另一孔的鑽孔及鉚合的作業。由此可見,習知的鑽孔 及鉚接複合機只能縱向進退,完全靠輸送平台使多片線路 基板換位,如此將導致鑽孔及鉚合作業緩慢,而且輸送平 台的行程較大,不易進行微調,要達成精密的鑽孔及鉚接 3 201036507 作業,必需使用更複雜的技術,導致整部機器價格高昂, 其設備成本將影響到產品的市場競爭力。 【發明内容】 本發明主要目的,係在提供一種多層電路板之自動鉚 接機,其藉著全自動的多層電路板之鉚接機設計,使多層 電路板移動到位後,即由可雙向移動的鑽孔鉚接機構自動 完成整排的鑽孔及鉚合作業,達成高精密及高效率的鑽孔 與鉚合之目的。 本發明次要目的,係在提供一種多層電路板之自動鉚 接機,其藉著全自動的多層電路板之鉚接機各部位結構改 良設計,達成更臻實用及降低成本之目的。 依上述目的,本發明之實施内容係包含:一機檯,其 前端的檯面上結合二支的升降軌道。一輸送機構,其具有 二組結合於機檯檯面上的橫向軌道,一結合在機檯檯面上 的橫向傳動皮帶組,及一結合在二轨道上的輸送平台,並 使輸送平台的底部與該傳動皮帶組結合。一抓取機構,其 具有一結合在機檯升降軌道上的升降台,一結合於升降台 下面的鉤取裝置,鉤取裝置四周結合複數個可活動的鉤爪 ,及一可與鉤取裝置結合或脫離的壓板。一雙向滑動機構 ,其具有一平台,平台底部設有數個縱向執道,該縱向軌 道結合於機檯後端的檯面上,平台頂部結合複數個橫向執 道,及一橫向的驅動裝置,其結合於平台的頂部,驅動下 述的鑽孔鉚接機構。一鑽孔鉚接機構,其具有一縱向滑動 平台,一結合於縱向滑動平台前端的自動鑽孔機,及一結 合於縱向滑動平台上面的自動鉚接機,該縱向滑動平台更 201036507 ,'結合在雙向滑動機構的平台上。 【實施方式】 茲依附圖實施例,將本發明方法特徵及其他作用、目 的詳細說明如下: 如附圖所示,本發明多層電路板之自動鉚接機,其較 佳實施例包含一機檯1、一輸送機構2、一抓取機構3、 一雙向滑動機構4及至少一鑽孔鉚接機構5組成,其中: 機檯1,如第一圖及第二圖所示,其係為一結構機檯 0 ,於上端構成一檯面11,於前端的檯面11上結合二支的升 降軌道12 ;該機檯1内部設有一氣壓缸,該氣壓缸的活塞 軸13伸出檯面11,該活塞軸13並與抓取機構3的升降台31 結合。 輸送機構2,如第一圖至第三圖所示,其具有二組結 合於機檯1檯面11上的橫向執道21,一結合在機檯1檯面 11上的橫向傳動皮帶組22,及一結合在二軌道21上的輸送 平台23,該輸送平台23上面設有複數個電路板定位柱231 ❹ 及壓板定位柱232,並使輸送平台23的底部與該傳動皮帶組 22結合。 抓取機構3,如第一圖至第三圖所示,其具有一結合 在機檯1升降執道12上的升降台31,一結合於升降台31下 面的鉤取裝置32,該鉤取裝置32四周結合複數個可活動的 鉤爪321,及一可與鉤取裝置32結合或脫離的壓板33。其中 ,如第四圖及第七圖所示,該升降台31係構成一平板,於 升降台31上結合二組倒立的氣壓缸311,該氣壓缸311的活 塞軸312結合在鉤取裝置32上面。該鉤取裝置32如第五圖所 5 201036507 示,係具有一平板322,該平板322的二端分別枢接二支鉤 爪321,各鉤爪321上端分別樞接在一氣壓缸323的活塞軸, 各氣壓缸323固定在平板322上面。又如第五圖及第六圖所 示,該鉤取裝置32的平板322板面係設有二道延伸到前端的 溝槽324,而該壓板33設有複數個T形的凸柱331及定位孔 332,使該凸柱331可與溝槽324結合或脫離,該定位孔332 與輸送平台23的壓板定位柱232結合或脫離。 雙向滑動機構4,如第一圖及第二圖所示,其具有一 平台41,平台41底部設有數個縱向執道42,該縱向軌道42 結合於機檯1後端的檯面11上,平台41頂部結合複數個橫 向軌道43,及一橫向的驅動裝置44,該驅動裝置44結合於 平台41的頂部,用以驅動下述的鑽孔鉚接機構5。其中, 該縱向軌道42包含結合於平台41底面的滑塊421,及結合於 機檯1檯面11上的滑執422組成,並使該滑塊421與滑軌422 結合;該橫向軌道43包含結合於平台41上面的滑軌432,及 結合於滑軌432上的滑塊431組成組成,該滑塊431並與下述 鑽孔鉚接機構5的縱向滑動平台51結合。而該驅動裝置44 包含一伺服馬達441驅轉一導螺桿442組成,該導螺桿442 結合在平台41的上面。復如如第一圖及第二圖所示,本發 明較佳的實施例包含該雙向滑動機構4係為二組,分別結 合在傳動皮帶組22二側的機檯1上,各雙向滑動機構4上 面結合一部或二部下述的鑽孔鉚接機構5。 鑽孔鉚接機構5,如第一圖及第二圖所示,其具有一 縱向滑動平台51,一結合於縱向滑動平台51前端的自動鑽 孔機52,及一結合於縱向滑動平台51上的自動鉚接機53, 201036507 ,該縱向滑動平台51更結合在雙向滑動機構4的平台41上, 可進行縱向及橫向移動。 另如第三圖及第六圖所示,本發明該輸送機構2的輸 送平台23上面可設有複數個定位溝槽233,各定位溝槽233 中結合可伸縮調整的一延伸臂234,於延伸臂234結合一下 輔助壓板235。該抓取機構3的壓板33亦設有複數個定位溝 槽333,各定位溝槽333中結合可伸縮調整的一延伸臂334 ,於延伸臂334結合一上輔助壓板335。藉此利用該下輔助 〇壓板235及上輔助壓板335夾住多片電路基板β的最邊緣, 防止多片電路基板6凸伸過長而在被加工時彎曲,並可因 應多片電路基板6的尺寸,調整該延伸臂234、334,使下 輔助壓板235及上輔助壓板335正好能夾住多片電路基板6 〇 藉上述機檯1、輸送機構2、抓取機構3、雙向滑動 機構4及鑽孔鉚接機構5組成本發明多層電路板之自動鉚 接機。其應用實施時如第三圖所示,由作業人員先將多片 ❹電路基板6疊放在一載盤7上,再將載盤7放在該輸送機 構2的輸送平台23上面,利用電路板定位柱231將多片電路 基板6及載盤7定位。然後如第七圖所示,啟動自動鉚接 機後,該抓取機構3將自動下降,使壓板33壓住多片電路 基板6及載盤7,並藉壓板定位柱232與定位孔332結合, 固定住壓板33的位置。 如第八圖所示,其後該輸送機構2的傳動皮帶組22將 帶動輸送平台23、壓板33及多片電路基板6往機檯i後端 移動,當移動到達預定位置之後,正好位在多部鑽孔鉚接 7 201036507 機構5之間。若此,再協調的啟動該雙向滑動機構4及鐵 孔鉚接機構5,使鑽孔鉚接機構5進行縱向及橫向移動, 調整到多片電路基板6的定位點’藉此作好鑽孔及斜卩合的 準備動作。如第九圖所示’該鑽孔鉚接機構5啟動後,將 先下降自動鑽孔機52的一支撐裝置521 ’使支撐裝置521端 部抵押多片電路基板6上面,再使一鑽頭522由下往上鑽出 鉚合基準孔。其後如第十圖所示’再自動控制該鑽孔卿接 機構5的自動鉚接機53縱向前進,使自動鉚接機53對準柳 合基準孔’即可進行多片電路基板6的鉚合作業。當—在印 合基準孔鉚合完成後,該雙向滑動機構4將帶動鑽孔柳接 機構5橫向移動’再進行另一鑽孔及鉚合動作,如此可贫 序將多片電路基板6邊緣成對的鉚合在一起。 、 當多片電路基板6邊緣全部完成鉚合製程後,該該輸 送機構2的傳動皮帶組22將帶動輸送平台23、壓板33 片電路基板6及載盤7往機檯1前端移動,並移動到抓^ 機構3下方,同時使該壓板33上的凸柱331可與鉤取袈置μ 的溝槽324結合(如第七圖所示)。若此,如第十一圖所示 ,該鉤取裝置32二端的鉤爪321將往下轉動,勾住該多片 路基板6及載盤7,再控制該抓取機構3的升降台31上升 ,使升降台31帶動鈞料践及壓板33脫離多片電路 6,當該鉤爪321鬆開時,正好讓作業人員接住載盤7, 外將另-健7及多片電路基板6放置於輸送平台23上面 ,準備另一多片電路基板Θ的鑽孔及鉚合製程。 综上所述,本發明多層電路板之自動鉚接機,使多片 電路基板6移動到位後,即由可雙向移動的鑽孔鉚接機構 201036507 I ' 5自動完成整排的鑽孔及鉚合作業,達成高精密及高效率 的鑽孔與鉚合之效果。其已確具實用性與進步性,技術手 段之運用亦出於新穎無疑,且功效與設計目的誠然符合, 已稱合理進步至明。為此,依法提出發明專利申請,惟懇 請鈞局惠予詳審,並賜准專利為禱,至感德便。 【圖式簡單說明】 第一圖為本發明實施例之組合立體圖。 第二圖為本發明實施例之分解立體圖一。 〇 第三圖為本發明實施例之分解立體圖二。 第四圖為本發明實施例之後視立體圖。 '第五圖為本發明實施例之鉤取裝置立體圖。 第六圖為本發明實施例之壓板及輸送平台立體圖。 第七圖為本發明實施例之抓取機構動作示意圖。 第八圖為本發明實施例之輸送機構動作示意圖。 第九圖為本發明實施例之自動鑽孔機動作示意圖。 第十圖為本發明實施例之自動鉚接機動作示意圖。 ❹ 第十一圖為本發明作實施例之抓取機構動作示意圖。 201036507 【主要元件符號說明】 1 機棱 11 檯面 12 升降軌道 13 活塞軸 2 輸送機構 21 橫向軌道 22 傳動皮帶組 23 輸送平台 231 電路板定位枉 232 壓板定位柱 233 定位溝槽 234 延伸臂 235 下輔助壓板 3 抓取機構 31 升降台 311 氣壓缸 312 活塞軸 32 鉤取裝置 321 鉤爪 322 平板 323 氣壓缸 324 溝槽 33 壓板 331 凸柱 332 定位孔 333 定位溝槽 334 延伸臂 335 上輔助壓板 4 雙向滑動機構 41 平台 42 縱向軌道 421 滑塊 422 滑軌 43 橫向軌道 431 滑塊 432 滑軌 44 驅動裝置 441 伺服馬達 442 導螺桿 5 鑽孔鉚接機構 51 縱向滑動平台 52 自動鑽孔機 521 支撐裝置 522 鑽頭 53 自動鉚接機 6 多片電路基板 7 載盤BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic riveting machine for a multilayer circuit board, and more particularly to an automatic riveting machine for use in a drilling and riveting process of a multilayer circuit board. [Prior Art] In the conventional multilayer circuit board process, several circuit boards are separately fabricated. After the circuit board surface is separately fabricated, it is necessary to stack a plurality of line substrate boards together, and then use a punching machine or a drill. The hole machine is made to rive the reference holes at the edges, and the plurality of circuit boards are riveted in pairs using a rivet machine. Thereafter, a plurality of circuit boards are placed between the mirror steel plates or the copper plates, and sent to a vacuum press machine to harden and bond the film at an appropriate temperature and pressure to form a multilayer circuit board. The automatic riveting machine applied to a multi-layer circuit board comprises a structural magnetic table, a conveying platform is arranged on the front end of the machine table, and a drilling and riveting compounding machine is respectively combined on the two sides of the rear end. Thereby, the plurality of line foundation plates stacked on each other are placed on the conveying platform, and the plurality of circuit substrates are sent to the drilling and riveting compound machine by the conveying platform, and then the drilling and riveting compound machine are controlled to advance longitudinally, respectively Drilling and riveting operations; each time a drilling and riveting operation is completed, the drilling and riveting compound machine must be completely retracted, and then the conveying platform is moved a further distance, and then the drilling and riveting compound machine Longitudinal advancement, drilling and riveting of another hole. It can be seen that the conventional drilling and riveting compound machine can only advance and retreat vertically, and the plurality of circuit boards are replaced by the conveying platform. This will result in slow drilling and riveting, and the travel platform has a large stroke and is difficult to be used. Fine-tuning, to achieve precision drilling and riveting 3 201036507 operations, the use of more complex technology, resulting in high prices of the entire machine, its equipment costs will affect the market competitiveness of the product. SUMMARY OF THE INVENTION The main object of the present invention is to provide an automatic riveting machine for a multi-layer circuit board, which is designed by a riveting machine of a fully automatic multi-layer circuit board, so that after the multi-layer circuit board is moved into position, the drill can be moved in both directions. The hole riveting mechanism automatically completes the drilling and riveting of the entire row, achieving high precision and high efficiency drilling and riveting. A secondary object of the present invention is to provide an automatic riveting machine for a multi-layer circuit board, which is designed to be more practical and cost-effective by the structural improvement of various parts of the riveting machine of the fully automatic multi-layer circuit board. According to the above object, the implementation of the present invention comprises: a machine table, the front surface of which is combined with two lifting rails. a conveying mechanism having two sets of transverse rails coupled to the table top, a transverse drive belt set coupled to the machine table, and a transport platform coupled to the two rails, and the bottom of the transport platform The drive belt set is combined. a gripping mechanism having a lifting platform coupled to the lifting rail of the machine, a hooking device coupled to the underside of the lifting platform, the hooking device is coupled with a plurality of movable hooks around the hooking device, and a hooking device can be combined with the hooking device Or detached platen. a two-way sliding mechanism having a platform, the bottom of the platform is provided with a plurality of longitudinal tracks, the longitudinal track is coupled to the table surface at the rear end of the machine platform, the top of the platform is combined with a plurality of horizontal tracks, and a lateral driving device is coupled to The top of the platform drives the drilling riveting mechanism described below. a drilling riveting mechanism having a longitudinal sliding platform, an automatic drilling machine coupled to the front end of the longitudinal sliding platform, and an automatic riveting machine coupled to the longitudinal sliding platform, the longitudinal sliding platform further 201036507, 'in combination with two-way On the platform of the sliding mechanism. [Embodiment] The features and other functions and purposes of the present invention are described in detail below with reference to the accompanying drawings. As shown in the accompanying drawings, the preferred embodiment of the automatic riveting machine of the multilayer circuit board of the present invention comprises a machine 1 a conveying mechanism 2, a gripping mechanism 3, a two-way sliding mechanism 4 and at least one drilling riveting mechanism 5, wherein: the machine table 1, as shown in the first figure and the second figure, is a structural machine The table 0 constitutes a surface 11 at the upper end, and two lifting rails 12 are coupled to the front surface 11; the air table is provided inside the machine 1, and the piston shaft 13 of the pneumatic cylinder projects out of the table 11, the piston shaft 13 And combined with the lifting platform 31 of the gripping mechanism 3. The conveying mechanism 2, as shown in the first to third figures, has two sets of transverse lanes 21 coupled to the table 1 of the machine table 1, a transverse transmission belt set 22 coupled to the table 11 of the machine table, and A transport platform 23 coupled to the two rails 21 is provided with a plurality of circuit board positioning posts 231 ❹ and a press plate positioning post 232 on the transport platform 23, and the bottom of the transport platform 23 is coupled to the drive belt set 22. The grasping mechanism 3, as shown in the first to third figures, has a lifting platform 31 coupled to the lifting platform 12 of the machine table 1, and a hooking device 32 coupled to the lower surface of the lifting platform 31. The device 32 is surrounded by a plurality of movable hooks 321 and a pressure plate 33 that can be coupled or detached from the hooking device 32. As shown in the fourth and seventh figures, the lifting platform 31 constitutes a flat plate, and two sets of inverted pneumatic cylinders 311 are coupled to the lifting platform 31, and the piston shaft 312 of the pneumatic cylinder 311 is coupled to the hooking device 32. Above. The hooking device 32 has a flat plate 322, which is pivotally connected to the two ends of the claws 321 respectively. The upper ends of the hooks 321 are respectively pivotally connected to the piston shaft of a pneumatic cylinder 323. Each pneumatic cylinder 323 is fixed to the upper surface of the flat plate 322. As shown in the fifth and sixth figures, the flat surface of the flat plate 322 of the hooking device 32 is provided with two grooves 324 extending to the front end, and the pressure plate 33 is provided with a plurality of T-shaped protrusions 331 and The positioning hole 332 is configured to be coupled to or detached from the groove 324. The positioning hole 332 is coupled to or detached from the platen positioning post 232 of the conveying platform 23. The two-way sliding mechanism 4 has a platform 41 as shown in the first figure and the second figure. The bottom of the platform 41 is provided with a plurality of longitudinal lanes 42 which are coupled to the table 11 at the rear end of the machine table 1. The platform 41 The top portion incorporates a plurality of transverse rails 43, and a transverse drive unit 44 that is coupled to the top of the platform 41 for driving the drill staking mechanism 5 described below. The longitudinal rail 42 includes a slider 421 coupled to the bottom surface of the platform 41, and a slider 422 coupled to the table 11 of the machine table 1 and the slider 421 is coupled to the slide rail 422; the lateral rail 43 includes a combination The slide rail 432 above the platform 41 and the slider 431 coupled to the slide rail 432 are combined with the longitudinal sliding platform 51 of the drilling riveting mechanism 5 described below. The drive unit 44 includes a servo motor 441 that drives a lead screw 442 that is coupled to the upper surface of the platform 41. As shown in the first figure and the second figure, the preferred embodiment of the present invention comprises the two-way sliding mechanism 4 being two sets, respectively coupled to the machine table 1 on both sides of the transmission belt set 22, and the two-way sliding mechanism. 4 The upper part is combined with one or two of the following drilling riveting mechanisms 5. The drilling riveting mechanism 5, as shown in the first and second figures, has a longitudinal sliding platform 51, an automatic drilling machine 52 coupled to the front end of the longitudinal sliding platform 51, and a combined with the longitudinal sliding platform 51. The automatic staking machine 53, 201036507, is further integrated on the platform 41 of the two-way sliding mechanism 4 for longitudinal and lateral movement. As shown in the third and sixth figures, the transport platform 23 of the transport mechanism 2 of the present invention may be provided with a plurality of positioning grooves 233, and each of the positioning grooves 233 is combined with an extension arm 234 which is telescopically adjustable. The extension arm 234 is coupled to the auxiliary pressure plate 235. The pressing plate 33 of the grasping mechanism 3 is also provided with a plurality of positioning grooves 333. Each of the positioning grooves 333 is combined with an extension arm 334 which is telescopically adjustable, and an upper auxiliary plate 335 is coupled to the extending arm 334. Thereby, the lower auxiliary squeezing plate 235 and the upper auxiliary platen 335 are used to sandwich the outermost edges of the plurality of circuit boards β, thereby preventing the plurality of circuit boards 6 from being overstretched and being bent during processing, and in response to the plurality of circuit boards 6 The extension arm 234, 334 is adjusted so that the lower auxiliary pressure plate 235 and the upper auxiliary pressure plate 335 can just clamp the plurality of circuit boards 6 by the above-mentioned machine 1, the conveying mechanism 2, the grasping mechanism 3, and the two-way sliding mechanism 4 And the drilling riveting mechanism 5 constitutes an automatic riveting machine of the multilayer circuit board of the present invention. When the application is implemented, as shown in the third figure, the operator first stacks the plurality of germanium circuit boards 6 on a carrier tray 7, and then places the carrier tray 7 on the transport platform 23 of the transport mechanism 2, using the circuit. The board positioning post 231 positions the plurality of circuit boards 6 and the carrier pads 7. Then, as shown in the seventh figure, after the automatic riveting machine is started, the grasping mechanism 3 will automatically descend, so that the pressing plate 33 presses the plurality of circuit boards 6 and the carrier plates 7, and the positioning plate 232 is combined with the positioning holes 332 by the pressing plate. The position of the pressure plate 33 is fixed. As shown in the eighth figure, the transmission belt set 22 of the conveying mechanism 2 will drive the conveying platform 23, the pressing plate 33 and the plurality of circuit boards 6 to the rear end of the machine table i. When the movement reaches the predetermined position, it is just at the position. Multiple bore riveting 7 between 201036507 and mechanism 5. If so, the two-way sliding mechanism 4 and the iron hole riveting mechanism 5 are re-coordinated, and the drilling and riveting mechanism 5 is moved longitudinally and laterally, and is adjusted to the positioning point of the plurality of circuit boards 6 to thereby drill and slant The preparation of the match. As shown in the ninth figure, after the drilling riveting mechanism 5 is started, a supporting device 521 ' of the automatic drilling machine 52 is lowered first to cause the end of the supporting device 521 to be mortgaged on the plurality of circuit boards 6, and then a drill bit 522 is The riveted reference hole is drilled up and down. Then, as shown in the tenth figure, the automatic riveting machine 53 of the drilling and splicing mechanism 5 is automatically advanced, and the automatic riveting machine 53 is aligned with the splicing reference hole to perform riveting of the plurality of circuit boards 6. industry. When the riveting of the printing reference hole is completed, the two-way sliding mechanism 4 will drive the drilling and splicing mechanism 5 to move laterally and perform another drilling and riveting operation, so that the edge of the plurality of circuit boards 6 can be omitted. Paired riveted together. After the edge of the plurality of circuit boards 6 has completed the riveting process, the drive belt set 22 of the transport mechanism 2 drives the transport platform 23, the platen 33 circuit board 6 and the carrier 7 to move toward the front end of the machine 1, and moves. Under the grasping mechanism 3, the studs 331 on the pressing plate 33 can be combined with the grooves 324 of the hooking device μ (as shown in the seventh figure). If so, as shown in FIG. 11 , the hook claws 321 at the two ends of the hooking device 32 will rotate downward, hook the multi-path substrate 6 and the carrier 7 , and then control the lifting platform 31 of the grasping mechanism 3 to rise. The lifting platform 31 is driven to move the pressing plate 33 away from the multi-chip circuit 6. When the hook 321 is released, the operator is allowed to catch the carrier 7 and the other 7 and the plurality of circuit boards 6 are placed on the outside. On the top of the transport platform 23, a drilling and riveting process for another plurality of circuit boards is prepared. In summary, the automatic riveting machine of the multi-layer circuit board of the present invention automatically completes the whole row of drilling and riveting work after the multi-chip circuit board 6 is moved into position, that is, the bi-directionally movable drilling riveting mechanism 201036507 I ' 5 To achieve high precision and high efficiency drilling and riveting effects. It has been practical and progressive, and the use of technical means is also novel and undoubted, and the efficacy and design purpose are in line with the fact that it has been reasonably improved. To this end, the invention patent application is filed according to law, but the bureau is invited to give a detailed examination, and the patent is granted as a prayer. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a combined perspective view of an embodiment of the present invention. The second figure is an exploded perspective view 1 of an embodiment of the present invention. 〇 The third figure is an exploded perspective view 2 of an embodiment of the present invention. The fourth figure is a rear perspective view of an embodiment of the present invention. The fifth figure is a perspective view of the hooking device of the embodiment of the present invention. Figure 6 is a perspective view of a pressure plate and a conveying platform according to an embodiment of the present invention. The seventh figure is a schematic diagram of the action of the grasping mechanism according to the embodiment of the present invention. The eighth figure is a schematic view of the operation of the conveying mechanism according to the embodiment of the present invention. Figure 9 is a schematic view showing the operation of the automatic drilling machine according to the embodiment of the present invention. FIG. 10 is a schematic view showing the operation of the automatic riveting machine according to an embodiment of the present invention. ❹ Eleventh is a schematic view showing the action of the grasping mechanism of the embodiment of the present invention. 201036507 [Main component symbol description] 1 Machine edge 11 Table 12 12 Lifting rail 13 Piston shaft 2 Conveying mechanism 21 Transverse rail 22 Transmission belt set 23 Conveying platform 231 Board positioning 232 Platen positioning column 233 Positioning groove 234 Extension arm 235 Lower auxiliary Pressure plate 3 Grab mechanism 31 Elevator 311 Pneumatic cylinder 312 Piston shaft 32 Hook device 321 Hook 322 Plate 323 Pneumatic cylinder 324 Groove 33 Platen 331 Post 332 Positioning hole 333 Positioning groove 334 Extension arm 335 Upper auxiliary plate 4 Bidirectional sliding Mechanism 41 Platform 42 Longitudinal track 421 Slider 422 Slide rail 43 Lateral track 431 Slider 432 Slide 44 Drive 441 Servo motor 442 Lead screw 5 Drilling riveting mechanism 51 Longitudinal sliding platform 52 Automatic drilling machine 521 Supporting device 522 Drill bit 53 Automatic riveting machine 6 multi-chip circuit board 7 carrier

Claims (1)

201036507 七、申請專利範圍: 1、 一種多層電路板之自動鉚接機,包含: 一機檯,其前端的檯面上結合二支的升降軌道; 一輸送機構,其具有二組結合於機檯檯面上的橫 向執道,一結合在機檯檯面上的橫向傳動皮帶組,及 一結合在二執道上的輸送平台,並使輸送平台的底部 與該傳動皮帶組結合; 一抓取機構,其具有一結合在機檯升降執道上的 〇 升降台,一結合於升降台下面的鉤取裝置,鉤取裝置 四周結合複數個可活動的鉤爪,及一可與鉤取裝置結 合或脫離的壓板; 至少一雙向滑動機構,其具有一平台,平台底部 設有數個縱向軌道,該縱向軌道結合於機檯後端的檯 面上,平台頂部結合複數個橫向軌道,及一橫向的驅 動裝置,其結合於平台的頂部,驅動下述的鑽孔鉚接 機構; ❿ 至少一鑽孔鉚接機構,其具有一縱向滑動平台, 一結合於縱向滑動平台前端的自動鑽孔機,及一結合 於縱向滑動平台上面的自動鉚接機,該縱向滑動平台 更結合在雙向滑動機構的平台上。 2、 如申請專利範圍第1項所述多層電路板之自動鉚接機 ,其中,該機檯内部設有一氣壓缸,該氣壓缸的活塞 軸伸出機檯的檯面,該活塞軸並與抓取機構的升降台 結合。 3、 如申請專利範圍第1項所述多層電路板之自動鉚接機 11 201036507 ,其中,該輸送機構的輸送平台上面設有複數個電路 板定位柱及壓板定位柱。 4、 如申請專利範圍第1項所述多層電路板之自動鉚接機 ,其中,該抓取機構的升降台結合二組倒立的氣壓缸 ,該氣壓缸的活塞軸結合在鉤取裝置。 5、 如申請專利範圍第1項所述多層電路板之自動鉚接機 ,其中,該抓取機構的鉤取裝置係具有一平板,該平 板的二端分別樞接二支鉤爪,各鉤爪上端分別樞接在 一氣壓缸的活塞軸,各氣壓缸固定在平板上面。 6、 如申請專利範圍第1項所述多層電路板之自動鉚接機 ,其中,該抓取機構的鉤取裝置係具有一平板,該平 板的板面設有溝槽,該壓板的上面設有複數個凸柱, 該凸柱可與溝槽結合或脫離。 7、 如申請專利範圍第1項所述多層電路板之自動鉚接機 ,其中,該輸送機構的輸送平台上面設有複數個定位 溝槽,各定位溝槽中結合一延伸臂,於延伸臂結合一 下輔助壓板;該抓取機構的壓板亦設有複數個定位溝 槽,各定位溝槽中結合一延伸臂,於延伸臂結合一上 輔助壓板。 8、 如申請專利範圍第1項所述多層電路板之自動鉚接機 ,其中,該雙向滑動機構的縱向執道包含結合於平台 底面的滑塊,及結合於機檯檯面上的滑執組成,並使 該滑塊與滑軌結合;該橫向執道包含結合於平台上面 的滑軌,及結合於滑軌上的滑塊組成組成,該滑塊並 與鑽孔鉚接機構的縱向滑動平台結合。 12 201036507 9、 如申請專利範圍第1項所述多層電路板之自動鉚接機 ,其中,該雙向滑動機構的驅動裝置包含一伺服馬達 驅轉一導螺桿組成,該導螺桿結合在平台的上面。 10、 如申請專利範圍第1項所述多層電路板之自動鉚接機 ,其中,該雙向滑動機構係為二組,分別結合在傳動 皮帶組二側的機檯上,各雙向滑動機構上面結合至少 一部鑽孔鉚接機構。 11、 如申請專利範圍第10項所述多層電路板之自動鉚接機 ,其中,各雙向滑動機構上面結合二部鑽孔鉚接機構 13201036507 VII. Patent application scope: 1. An automatic riveting machine for multi-layer circuit boards, comprising: a machine platform, the front surface of which is combined with two lifting rails; a conveying mechanism having two groups combined with the machine table The transverse drive, a transverse drive belt set combined with the machine table, and a transport platform combined with the second way, and the bottom of the transport platform is combined with the drive belt set; a gripping mechanism having a a hooking device coupled to the lifting platform of the machine, a hooking device coupled to the underside of the lifting platform, the hooking device is surrounded by a plurality of movable hooks, and a pressing plate which can be combined with or disengaged from the hooking device; at least one a two-way sliding mechanism having a platform, the bottom of the platform is provided with a plurality of longitudinal rails, the longitudinal rail is coupled to the countertop of the machine table, the top of the platform is combined with a plurality of transverse rails, and a transverse driving device is coupled to the top of the platform Driving the following riveting mechanism; 至少 at least one drilling riveting mechanism having a longitudinal sliding platform, one coupled to An automatic drilling machine at the front end of the longitudinal sliding platform, and an automatic riveting machine coupled to the longitudinal sliding platform, the longitudinal sliding platform is further integrated on the platform of the two-way sliding mechanism. 2. The automatic riveting machine for a multi-layer circuit board according to claim 1, wherein a pneumatic cylinder is arranged inside the machine, and a piston shaft of the pneumatic cylinder protrudes from a table surface of the machine table, and the piston shaft is grasped and grasped. The platform of the mechanism is combined. 3. The automatic riveting machine 11 201036507 of the multi-layer circuit board according to the first aspect of the patent application, wherein the conveying platform of the conveying mechanism is provided with a plurality of circuit board positioning columns and a pressing plate positioning column. 4. The automatic riveting machine for a multi-layer circuit board according to claim 1, wherein the lifting platform of the gripping mechanism is combined with two sets of inverted pneumatic cylinders, and the piston shaft of the pneumatic cylinder is coupled to the hooking device. 5. The automatic riveting machine of the multi-layer circuit board according to the first aspect of the invention, wherein the hooking device of the grasping mechanism has a flat plate, and the two ends of the flat plate are respectively pivotally connected with two hook claws, and the upper ends of the respective claws are respectively respectively The piston shaft is pivotally connected to a pneumatic cylinder, and each pneumatic cylinder is fixed on the flat plate. 6. The automatic riveting machine of the multi-layer circuit board according to claim 1, wherein the hooking device of the gripping mechanism has a flat plate, and the plate surface of the flat plate is provided with a groove, and the upper surface of the pressing plate is provided A plurality of studs that can be joined or disengaged from the grooves. 7. The automatic riveting machine for a multi-layer circuit board according to the first aspect of the invention, wherein the conveying platform of the conveying mechanism is provided with a plurality of positioning grooves, and each of the positioning grooves is combined with an extending arm and is coupled to the extending arm. The auxiliary pressure plate is also arranged; the pressure plate of the grasping mechanism is also provided with a plurality of positioning grooves, and an extension arm is coupled to each of the positioning grooves, and an auxiliary pressure plate is coupled to the extension arm. 8. The automatic riveting machine for a multi-layer circuit board according to claim 1, wherein the longitudinal obstruction of the two-way sliding mechanism comprises a slider coupled to a bottom surface of the platform, and a sliding joint combined with the surface of the machine platform. And the slider is combined with the slide rail; the transverse rail comprises a slide rail coupled to the upper surface of the platform, and a slider combined with the slide rail, and the slider is combined with the longitudinal sliding platform of the drill riveting mechanism. The invention relates to an automatic riveting machine for a multi-layer circuit board according to claim 1, wherein the driving device of the two-way sliding mechanism comprises a servo motor driven by a lead screw, and the lead screw is coupled on the platform. 10. The automatic riveting machine for a multi-layer circuit board according to claim 1, wherein the two-way sliding mechanism is two sets, which are respectively combined on the machine side of the two sides of the transmission belt set, and the two-way sliding mechanism is combined with at least A drilling riveting mechanism. 11. The automatic riveting machine for a multi-layer circuit board according to claim 10, wherein the two-way sliding mechanism is combined with two drilling riveting mechanisms.
TW98108901A 2009-03-19 2009-03-19 Automatic riveting machine for multi-layer circuit board TW201036507A (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112087870A (en) * 2020-09-22 2020-12-15 湖南中科光电有限公司 Molding bending device for producing flexible circuit board for optical device
CN115279066A (en) * 2022-09-28 2022-11-01 四川英创力电子科技股份有限公司 Automatic riveting device and method for multilayer printed board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112087870A (en) * 2020-09-22 2020-12-15 湖南中科光电有限公司 Molding bending device for producing flexible circuit board for optical device
CN112087870B (en) * 2020-09-22 2022-10-25 江苏鑫迈迪电子有限公司 Molding and bending device for producing flexible circuit board for optical device
CN115279066A (en) * 2022-09-28 2022-11-01 四川英创力电子科技股份有限公司 Automatic riveting device and method for multilayer printed board
CN115279066B (en) * 2022-09-28 2022-12-27 四川英创力电子科技股份有限公司 Automatic riveting device and method for multilayer printed board

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