TW201034849A - Multilayer body, method for producing same, electronic device member, and electronic device - Google Patents

Multilayer body, method for producing same, electronic device member, and electronic device Download PDF

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TW201034849A
TW201034849A TW99104318A TW99104318A TW201034849A TW 201034849 A TW201034849 A TW 201034849A TW 99104318 A TW99104318 A TW 99104318A TW 99104318 A TW99104318 A TW 99104318A TW 201034849 A TW201034849 A TW 201034849A
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Taiwan
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layer
gas barrier
compound
oxygen
group
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TW99104318A
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Chinese (zh)
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TWI491500B (en
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Shinichi Hoshi
Takeshi Kondo
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Lintec Corp
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • H10K50/8445Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • C08J7/123Treatment by wave energy or particle radiation
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04Polysiloxanes
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133305Flexible substrates, e.g. plastics, organic film
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50Protective arrangements
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)

Abstract

Disclosed is a multilayer body which comprises at least a conductor layer and a gas barrier layer that is configured from a material containing oxygen atoms, carbon atoms and silicon atoms. The multilayer body is characterized in that the present ratio of oxygen atoms in the gas barrier layer gradually decreases from the surface of the gas barrier layer to the depth direction, while the present ratio of carbon atoms gradually increases. Also disclosed are a method for producing the multilayer body, an electronic device member which is composed of the multilayer body, and an electronic device which comprises the electronic device member. The multilayer body exhibits excellent gas barrier properties and excellent interlayer adhesion, while comprising a conductor layer with high surface smoothness. Since the multilayer body can be flexible and light-weighted, the multilayer body is suitable for use as an electronic device member for an organic EL display, a solar cell and the like. In addition, since the multilayer body can be produced by a roll-to-roll mass production process, the multilayer body can be produced at low cost.

Description

201034849 六、發明說明: 【發明所屬之技術領域】 本發明關於具有優異的阻氣性,而且層間密接性優显 ,具有阻氣層及導電體層之層積體及其製造方法,由此層 積體所成的電子裝罟田拔_、Α 用構1^,以及包括該電子裝置用構造 之電子裝置。 Ο 〇 【先前技術】 年來,於液晶顯示器或電致發光叫顯示器等的顯 Ζ ’為了實現薄型化、輕量化、可撓化等,作為具有 玉的基板’檢討使用透明塑膠薄膜來代替玻璃。然而, 〃璃相比,塑膠薄膜由於水蒸氣或氧容易透過等,故易 引起顯示器内部的 題。 心件之劣卩,而且有表面平滑性低的問 上,2 了解決此問題’專利文獻卜2等中提案在輯基材 積表面平滑層與無機障㈣,在 性電極層之導電性電極基材。 成有導電 能不:”而:此等文獻中所記載的導電性電極基材之阻氣性 由此β兄疋可令人充分滿足,而要求進-步的改良。又, 層層與無機障壁層’此等層與電極(導電性電極 在接性,故必須設置機能性薄膜,以用於在各層之 2㈣接性,製程變煩雜,有違反薄膜化 撓化的問題。 m匕、可 與本發明有關聯,專利文獻3中記裁在塑膠薄膜的一 3 201034849 面上,藉由在以使用稀有氣體、氫、 一種類當作雷嗜、、® a a ι之中的至少 禋類田卞冤忑源之氣體的電漿離子注 注入岸上,彤杰女 去而形成之離子 層上开/成有阻氣層及透明電極廣 薄膜》 θ導電性阻氣 先前技術文獻 專利文獻 [專利文獻1]特開2003-1 54596號公報 [專利文獻2]特開2006-2641 18號公報 [專利文獻3]特開2008-2701 1 5號公報 【發明内容】 發明所欲解決的問題 本發明係鑒於上述先前技術而完成者, 具有優異的阻氣性,而且層間密接性優異 = 導電體層之層積體,盆製 礼層及 子护番田搂1 方法,由則述層積體所成的電 " 每以及包括該電子裝置用構造之 解決問題的手段 电卞衮置。 本發明者們為了解、灰μ ,社 、相4 ’進行專心致力的檢討 、、-口果發現由至少含有氧原 ’、 厌原子及矽原子的材料所 冓成,具有自表面起朝 松 如分、丨 &朝门冰度方向,虱原子之存在比例逐 ^咸少、碳原子的存在_逐漸增加的層(阻氣層)、與導 。'體層之層積體’係具有優異的阻氣性及層間密接性。 又,本發明者們發現藉由在表面部具有含聚有機石夕氧 以化合物的層之成形物的前述含聚有機石夕氧炫系化合物 201034849 的層之表面中注入離子,可簡便且高效率地形成前述阻氣 層’以此等知識為基礎,終於完成本發明。 如此地,依照本發明的第】點,提供下述(1)〜(7)之 層積體。 )一種層積體,其係具有由至少含有氧原子、碳原子 f矽原子的材料所構成的阻氣層與導電體層之層積體,其 粉徵在於:自前述阻氣層的表面起朝向深度方向m ❹ 〇 層中的氧原子之存在比例係逐漸減少,碳原子的存在比例 係逐漸增加。 ()如⑴。己载的層積體’其中於前述阻氣層的表層部 尸中,相對於氧原子、竣原子及㈣子的存在量全體而言, '原子的存在比例為i。〜70%、碳原子的存在比例為】。〜 (U,矽原子的存在比例為5〜3 5 %。 (3) 如(1)記載的層積體, T剛述阻軋層在該阻氣層 的表層部之X射線光電子分 測疋中,矽原子的2ρ 電子執域之鍵能的尖峰位置係102〜i〇4eV。 (4) 如(1)記栽的層積體, 甲更具有無機化合物層。 ⑸如⑴記载的層積體’其中前述阻氣層係於含聚有 機矽氧烷系化合物的層中,注 、" 曰丫 /王入離子而得之層。 ⑹如⑸:栽的層積體’其中前述離子係由氮、氧、201034849 6. TECHNOLOGICAL FIELD OF THE INVENTION [Technical Field] The present invention relates to a laminate having excellent gas barrier properties and excellent interlayer adhesion, a gas barrier layer and a conductor layer, and a method for producing the same, thereby laminating The electronic device is made up of a body, and an electronic device including the structure for the electronic device.先前 〇 [Prior Art] In the past, in order to achieve thinness, light weight, flexibility, etc., it has been used as a substrate with jade. However, compared with glass, plastic film is easily transmitted through water vapor or oxygen, which is liable to cause problems inside the display. In the case of the inferiority of the heart, and the problem of low surface smoothness, 2 solve the problem. [Patent Document 2, etc. proposes the surface layer smoothing layer and the inorganic barrier (4), and the conductive electrode base of the electrode layer. material. The conductive energy is not:" and: the gas barrier properties of the conductive electrode substrate described in these documents are sufficiently satisfactory, and the improvement is required. Further, the layer and the inorganic layer are required. The barrier layer 'these layers and the electrode (the conductive electrode is in contact with each other, so a functional film must be provided for the bonding between the layers (2) in each layer, the process becomes cumbersome, and there is a problem that the filming is violated. In connection with the present invention, in Patent Document 3, it is recorded on a surface of a plastic film of 3, 2010, 34, 849, by using at least a rare gas, hydrogen, a kind of scorpion, and aa ι. The plasma ion injection of the gas from the source of the source is injected into the shore, and the ion layer formed by the 彤Jie female is opened/formed with a gas barrier layer and a transparent film. θ Conductive gas barrier Previous technical literature Patent literature [Patent Literature [Patent Document 2] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Excellent in view of the above prior art Gas, and excellent interlayer adhesion = laminated body of conductor layer, potted layer and sub-protection of Fan Tianyi 1 method, the electricity formed by the layered body " each and including the structure of the electronic device The inventors of the present invention conducted an intensive review for understanding, ash, society, and phase 4', and found that it is composed of materials containing at least oxygen, 'anode and cesium atoms. In the direction of the surface, the ratio of the presence of cesium atoms to the salty degree, the presence of carbon atoms, the gradual increase of the layer (gas barrier layer), and the conductance. The present invention has been found to have excellent gas barrier properties and interlayer adhesion. Further, the inventors of the present invention have found that the above-mentioned polyorganism-containing stone has a molded article of a layer containing a compound of polyorganisms in the surface portion. The invention is finally completed by implanting ions into the surface of the layer of the oxygen-based compound 201034849, and the gas barrier layer can be formed simply and efficiently. Thus, according to the first aspect of the present invention, the following is provided. Said (1) ~ (7) a laminate comprising a laminate of a gas barrier layer and a conductor layer composed of a material containing at least an oxygen atom and a carbon atom of a carbon atom, the powder being derived from the gas barrier layer The surface of the surface is oriented toward the depth direction m 存在 The proportion of oxygen atoms in the ruthenium layer is gradually reduced, and the proportion of carbon atoms is gradually increased. () as in (1). The layered body contained in the surface layer of the gas barrier layer In the corpse, the ratio of the existence of the atom to the oxygen atom, the cesium atom, and the (tetra) atom is i. ~70%, the ratio of the presence of the carbon atom is . 5 to 3 5 %. (3) The laminate described in (1), T just described in the X-ray photoelectron enthalpy of the surface layer of the gas barrier layer, the 2ρ electron domain of the germanium atom The peak position of the bond energy is 102~i〇4eV. (4) As in (1) the laminated body of the plant, the nail has an inorganic compound layer. (5) The layered body according to (1), wherein the gas barrier layer is in a layer containing a polyorganosiloxane compound, and is a layer obtained by "injecting ions" into the layer. (6) (5): a laminated body in which the aforementioned ion system is composed of nitrogen, oxygen,

氬、氦所組成%群所選出的至—A 種乳體經離子化者。 (7)如(5) c栽的層積體’复 ^ . -c 中m述聚有機矽氧烷系化 石夕氧烧: )所不的重複單位之聚有機 5 201034849The to-A type of milk selected by the % group consisting of argon and helium is ionized. (7) If the laminate of (5) c is planted, the compound is a compound of the polyorganotazoline, and the polyorganism of the repeating unit is not included.

(8)

各自獨立地表示氫原子、無取代或具有 恶取代或具有取代基的烯基、無取代或具 式中,Rx、 取代基的烷基、 有取代基的芳基等之非士 ω # , 非水解性基。尚且,式(a)的複數之Each of which independently represents a hydrogen atom, an unsubstituted or alkenyl group having a mute substitution or a substituent, an unsubstituted or a formula, an alkyl group of a Rx, a substituent, an aryl group having a substituent, etc., Hydrolyzable group. Still, the plural of formula (a)

Rx、式(b)的複數之&丄 y 了各自相同或不同。惟,前述式(a) 的Rx係不2個皆為氫原子。 (11)記载的層積體之 依照本發明的第2點,提供(8) 製造方法。 (8) —種層積體之製造方法’其係具有阻氣層與導電體 層的層積體之製造方法,其具有藉由在表面部具有含聚有 機矽氧烷系化合物的層之成形物的前述含聚有機矽氧烷系 化合物的層中注入離子而形成前述阻氣層之步驟(I)。 其中前述步驟(I) (9)如(8)記載的層積體之製造方法 的至少一種之氣 係將由氮、氧、氬及氦所組成族群所選出 體離子化及注入之步驟。 201034849 (1 0)如(8 )記載的製造方法,並中 兵τ刖述步驟(I)係雷游 離子注入。 ⑴)如前述⑻記載的製造方法,其中前述步驟⑴係 邊在一定方向中搬送表面部具有含聚有機彻系化合物 的層之長條狀成形物,邊將雜;、+ χ & . ㈣離子注入前述含聚有機矽氧烷 系化合物的層中之步驟。 Ο 造 依照本發明的第3點,提供(丨2)記載 的電子裴置用構 (12)—種電子裝置用構-你田則述(1)〜(7)中 項記載的層積體所成。 依照本發明的第4點,提供下述(13)記載 的電子裝置 (13) —種電子裝¥ 盆 a 用構造 發明效果 、生 ϋ其具有_(12)記载的電子農置 本發明的層積體具有#異的ρ且氣性 氣層盥導雷駚a θ間岔接性(阻 导電體層之間的密接性)。 性 又本發明的層積件之導電體層具有 高的表面平滑 依照本發明的製造方法,可高 積體。 千也衣造本發明的層 本發月的層積體,由於可撓化 適用作Λ古地 化·里化係可能’故可 …、有機EL·等的顯示器、太陽電 造。再者,由於w +电池等的電子裝置用構 田於Μ輥對輥方式來大量製 k係可能,故可實 201034849 現低成本化。本發明的電子裝置用構造,由於係由本發明 的層積體所成,而具有優異的阻氣性、層間密接性,故可 適用於顯示器'太陽電池等的電子裝置。 【實施方式】 以下分項為(1)層積體及其製造方法、(2)電子裝置用 構造及(3)電子裝置來詳細說明本發明。 (1)層積體及其製造方法 本發明的層積體係具有由至少含有氧原子、碳原子及 矽原子的材料所構成的阻氣層與導電體層之層積體,其特 徵在於.自别述阻氣層的表面起朝向深度方向,該阻氣層 中的乳原子之存在比例係逐漸減少’碳原子的存在比例係 逐漸增加。尚且,力「阻氣層的表面」,在阻氣層中亦含 有與導電體層等的其它層之界面 (阻氣層) 本發明的層積體之阻氣層(以下亦稱為「A層」)的特 二'、,、至夕3有氧原子、碳原子及矽原子的材料所構成, :自層的表面起朝向深度方向,層中的氧原子之存在比 、:漸減少’碳原子的存在比例係逐漸增加。 至小人^ ^ ^ 3有乳原子、碳原子及碎原子的材料,若為 的限制’:原子、碳原子及矽原子的高分子,貝沒有特別 的表居/發揮更優異的阻氣性之觀點來看,前述阻氣層 的表層部中,相對於氧 體而言(即以氧原子夕原子的存在量全 ’、 妷原子及矽原子的存在量之合計當作 201034849 100%時)s文原子的存在比例較佳為丨卜谓,碳原子的存 在比例較佳為10〜7〇% 1原子的存在比例較佳為5〜_ =原子的存在比例更佳為i 5〜㈣、碳原子的存在比例 為1 5 65% ’矽原子的存在比例更佳為10〜30%。氧原 子&原子及石夕原子的存在比例之測定係以實施例中所說 明的方法來進行。Rx, the plural of the formula (b) & y are the same or different. However, none of the Rx systems of the above formula (a) are hydrogen atoms. (11) The laminated body according to the second aspect of the present invention provides (8) a manufacturing method. (8) A method for producing a laminate having a gas barrier layer and a conductor layer, which has a molded article having a layer containing a polyorganosiloxane compound at a surface portion The step (I) of injecting ions into the layer containing the polyorganosiloxane compound to form the gas barrier layer. The gas of at least one of the methods for producing a laminate according to the above (1), (9), wherein the gas is selected from the group consisting of nitrogen, oxygen, argon and helium, is ionized and injected. 201034849 (1 0) The manufacturing method described in (8), and the step (I) of the sequel to the sequel is the ion implantation. (1) The production method according to the above (8), wherein the step (1) is carried out by transporting a long strip-shaped molded article having a layer containing a polyorgano compound in a surface in a predetermined direction, and is mixed with a compound; The step of ion-implanting into the layer containing the polyorganosiloxane compound. According to a third aspect of the present invention, there is provided a structure for an electronic device according to (2) (12), a structure for an electronic device, and a laminate according to the item (1) to (7) Made into. According to a fourth aspect of the present invention, there is provided an electronic device (13) according to the above (13), which is characterized in that the electronic device has the structure effect of the invention, and the electronic device according to the invention has the invention described in (12) The laminate has a different ρ and the gas layer 盥 leads the 岔 a θ 岔 ( (the adhesion between the conductor layers). Further, the conductor layer of the laminate of the present invention has high surface smoothness. According to the manufacturing method of the present invention, it is possible to form a high volume.千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千 千In addition, since an electronic device such as a w+ battery is used in a roll-to-roll method to form a large number of k-systems, it is possible to reduce the cost of 201034849. Since the structure for an electronic device of the present invention is formed of the laminate of the present invention and has excellent gas barrier properties and interlayer adhesion, it can be applied to an electronic device such as a display solar cell. [Embodiment] The following sub-items describe the present invention in detail by (1) a laminate, a method for producing the same, (2) a structure for an electronic device, and (3) an electronic device. (1) Laminate and method for producing the same The laminated system of the present invention has a laminate of a gas barrier layer and a conductor layer composed of a material containing at least an oxygen atom, a carbon atom and a ruthenium atom, and is characterized in that The surface of the gas barrier layer is oriented in the depth direction, and the ratio of the presence of the milk atoms in the gas barrier layer is gradually decreased, and the ratio of the presence of carbon atoms is gradually increased. Further, the force "the surface of the gas barrier layer" also includes an interface with another layer such as a conductor layer in the gas barrier layer (gas barrier layer). The gas barrier layer of the laminate of the present invention (hereinafter also referred to as "A layer" """,", "Eight-day" consists of a material having an oxygen atom, a carbon atom, and a helium atom. From the surface of the layer toward the depth direction, the ratio of oxygen atoms in the layer is: The proportion of atoms present is gradually increasing. To the villain ^ ^ ^ 3 materials with milk atoms, carbon atoms and broken atoms, if the limit of ': atoms, carbon atoms and cesium atoms of the polymer, shell has no special appearance / play more excellent gas barrier In the surface layer portion of the gas barrier layer, the total amount of the oxygen atom (the total amount of the atomic atoms of the oxygen atom, the total amount of the germanium atom and the germanium atom) is regarded as 201034849 100%. The ratio of the existence of the s atom is preferably ,, the ratio of the presence of the carbon atom is preferably 10 to 7 〇%. The ratio of the presence of 1 atom is preferably 5 _ _ = the ratio of the existence of the atom is preferably i 5 〜 (4), The proportion of carbon atoms present is 1655%. The proportion of ruthenium atoms is preferably from 10 to 30%. The ratio of the existence of the oxygen atom & atom and the stone atom was determined by the method described in the examples.

自表面起朝向深度方向,氧原子的存在比例逐漸減少 I原子的存在比例逐漸增加的區域,係相當於阻氣層的 區域’厚度通常為5〜1〇〇nm’較佳為】。〜5〇·。作為如此 的阻氣層’例如像後述地’可舉出於含聚有機矽氧烷系化 合物的層中注入離子而得之層(以下亦稱$「注人層」), 或對含聚有機矽氧烷系化合物的層施予電漿處理而得之層 又,則述阻氣層在該阻氣層的表層部之χ射線光電子 分光(XPS)測定中,矽原子的2ρ電子軌域之鍵能的尖峰位 〇 置較佳為102〜104eV。 例如’聚二甲基矽氧烷的層在X射線光電子分光(XPS) 疋中相對於矽原子的2p電子軌域之鍵能的尖峰位置係 101.5eV,在此聚二甲基石夕氧院的層中離子注入氬而得 之離子注入層(阻氣層),在表層部的义射線光電子分光 )測疋中,石夕原子的2 p電子執域之鍵能的尖峰位置係 約1 03eV。此值係與玻璃或二氧化矽膜等習知的具有阻氣 性之含矽高分子中所含有的矽原子之2p電子軌域之鍵能 的大峰位置大致相同程度(χ射線光電子分光(xps)測定中 9 201034849 :子…子軌域之鍵能的尖峰位置,在玻瑪的情況約 ' 在—虱化矽膜的情況約103eV)。因此 的表層部中矽原早沾9 + 阻孔盾 〜 ’、勺4電子軌域之鍵能的尖峰位置為102 〇4eV的本發明之層 , 膜相鬥W <層積體,由於具有與玻璃或二氧化矽 =__的構造’故推測阻氣性能優異。再者,石夕原 所二Π軌域之鍵能的尖峰位置之測定係以實施例中 所忒明的方法來進行。 本發明的層積體之阻氣層係形 2〇〇μιη的含子没馬30nm至 P的“κ有機石夕氧i系化合物的層之表面部 氣層的深度較佳立^ π亥阻 又車又佳為5⑽至100nm,更佳為3〇随至5〇⑽。 又,本發明的層積體係具有阻氣層與 體,前述阻氣岸开或t丄 祖增的層積 化合物的層之面部具有含聚有機彻系 中注入離子而Γ 前述含聚有㈣氧燒系化合物的層 入離子而形成的步驟(I)所得之層。 藉由在含聚有機矽氧烷系化合物 容易形成由至少含有氧原子、碳原子及二=子,可 成,具有自層表面的表面起朝向深度方向,所構 之存在比例逐漸減少、碳原子的存在比例逐二=子 的阻氣層。 啊增加之構造 本發明的層積體中所用的聚有機矽氧 鏈構造係沒有限制, 、化s物之主 例如,作為前、f吉’'、· 、龍狀的任—者。 W马則述直鏈狀的主鏈構造,可 所示的構造’作為梯狀的主鏈構造,可舉 下述式U) 的構造’作為蘢狀的主鏈構造,可例示 Kb)所示 义式(c)所示的堪 201034849 造。The ratio of the presence of oxygen atoms gradually decreases from the surface toward the depth direction, and the region where the ratio of the presence of the I atoms gradually increases is a thickness of the region corresponding to the gas barrier layer, which is usually 5 to 1 nm. ~5〇·. As such a gas barrier layer, for example, as will be described later, a layer obtained by injecting ions into a layer containing a polyorganosiloxane compound (hereinafter also referred to as a "injection layer") may be used, or a polyorganism may be included. The layer of the oxoxane compound is subjected to a plasma treatment to obtain a layer, and the gas barrier layer is in the XPS measurement of the surface layer portion of the gas barrier layer, and the 2ρ electronic domain of the ruthenium atom The peak position of the bond energy is preferably 102 to 104 eV. For example, the layer of 'polydimethyloxane' is 101.5 eV in the X-ray photoelectron spectroscopy (XPS) 相对 relative to the bond energy of the 2p electron domain of the ruthenium atom. In the ion implantation layer (gas barrier layer) obtained by ion implantation of argon in the layer, in the surface layer of the ray photoelectron spectroscopy, the peak position of the bond energy of the 2 p electron domain of the Shi Xi atom is about 1 03 eV. . This value is approximately the same as the large peak position of the bond energy of the 2p electron orbital of the ruthenium atom contained in the conventional gas barrier ruthenium-containing polymer such as glass or ruthenium dioxide film (X-ray photoelectron spectroscopy (xps) In the measurement of 9 201034849: the peak position of the bond energy of the sub-orbital domain, in the case of Boma, about 'in the case of 虱 虱 矽 约 约 about 103eV). Therefore, in the surface layer portion, the original layer of 9 + barrier Shield ~ ', the key position of the spoon 4 electronic rail has a peak position of 102 〇 4 eV of the layer of the invention, the film phase bucket W < laminate, due to It is estimated that the gas barrier performance is excellent with the structure of glass or cerium oxide = __. Further, the measurement of the peak position of the bond energy of the second orbital domain of Shi Xiyuan was carried out by the method exemplified in the examples. The gas barrier layer of the laminate of the present invention has a depth of 表面 π 表面 表面 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 Further, the vehicle is preferably 5 (10) to 100 nm, more preferably 3 〇 to 5 〇 (10). Further, the laminated system of the present invention has a gas barrier layer and a body, and the aforementioned gas barrier layered or t granules are laminated compounds. The surface of the layer has a layer obtained by the step (I) comprising a polyorgano-incorporated ion implanted in the polyorganosystem and a layered ion containing the (tetra)oxygen-based compound. The polyorganosiloxane-containing compound is easily used. A gas barrier layer is formed which is formed of at least an oxygen atom, a carbon atom, and a di-substrate, and which has a surface from the surface of the layer toward the depth direction, and has a gradually decreasing ratio of the existence ratio of the carbon atoms. ADDITIONAL STRUCTURE The structure of the polyorganooxygen chain used in the laminate of the present invention is not limited, and the main character of the s object is, for example, the former, the f-ji, the dragon, or the dragon. The linear main chain structure is described, and the structure shown can be constructed as a ladder-like main chain structure. For the following formula U) configuration 'as a main chain structure like Tiffany, exemplified Kb) FIG sense formula (c) worthy 201,034,849 made as shown.

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(8)

C式中,ΚΧ、Ky、ΚΖ各自獨立地表示氫原子、無取代或且 有取代基的烷基、無取代或具有取代基的烯基、無取代或 具有取代基的芳基等之非水解性基;尚且,式u)的複數之 Rx、式(b)的複數之Ry及式(c)的複數之Rz可各自相同或 不同,惟,前述式(a)的Rx係不2個皆為氫原子)。 201034849 為…、取代或具有取代基的烷基之烷基,例如 甲基'乙基、正牛出 正丙基、異丙基、正丁基、異丁基、第二丁 基、第二丁基、正戊基、異戊基、新戊基、正己基、 基、正辛基等之碳數1〜10的烧基。 作為晞基,例如可舉出乙烯基、卜丙烯基、2-兩埽基 1 丁烯基、2-丁烯基、3_ 丁烯基等之碳數2〜1〇的烯基 作為前述烷基及烯基的取代基,可舉出氟原子、氯原 子^原子、蛾原子等的_素原子;經基;硫醇基;環氧 基;環氧丙氧基;(甲基)丙稀醯氧基;苯基、4—甲基= 4風本基等之無取代或具有取代基的芳基等。 作為無取代或具有取代基的芳基之芳基,❹ 本基、1-萘基、2-萘基等之碳數6〜1G的芳基。 ‘ 作為前述芳基的取代基’可舉出氟原子、氯原子、9 原子、峨原子等之 烧A.… ®素原子’甲基、乙基等之碳數1〜“ 二 乙氧基等之碳數1〜6的烷氧基;硝基;# 土歹工基,硫醇基;環氧基;環氧丙氧二 氧基;苯基、4-甲其n . 〔甲基)丙烯&amp; 甲基本基、4-虱苯基等盔 代基的芳基等。 …、取代或具有取 具有取L之I ’ RX、R” RZ各自獨立地較佳為無取代或 、丙A灰數1〜6之炫基或笨基,特佳為甲基、乙基 土、3-環氧丙氧基丙基或苯基。 土 於本發明巾,作為聚有機 述式(a)辦-λλ 士 ± 于化合物’較佳為前 (a)所不的直鏈狀化合物或前 武(b)所不的梯狀化合 201034849 物從取知谷易性及可形成具有優異的阻氣性之注入層的 觀點來看’特佳為前述式(a)中的2個係曱基或苯基的 直鏈狀化合物,前述式(b)中的2個Ry係甲基、丙基、3_ 環氧丙氧基丙基或苯基的梯狀化合物。 聚有機石夕氧烧系化合物係可藉由將具有水解性官能基 的矽烷化合物聚縮合的眾所周知之製造方法來獲得。 所用的石夕院化合物,係可按照目的之聚有機石夕氧烧系 Ο Ο 口物的構以來適且選擇。作為較佳的具體例,可舉出二 甲基二曱氧基石夕院、二曱基二乙氧基石夕烧、二乙基二甲氧 基秒院、二f 其 -7 ^ 一 ^ 基一乙虱基矽烷等的2官能矽烷化合物;甲 土甲氧基石夕院、甲基三乙氧基石夕烧、乙基三甲氧基石夕烧 、乙基三乙氧基矽烷、正丙基三甲氧基矽烷、正丁基三乙 乳基石夕院、3-環氧丙氧基丙基三甲氧基石夕烧、苯基三甲氧 二:*基—乙乳基矽烷、苯基二乙氧基甲氧基矽烷等 石夕烧化合物;四甲氧基石夕院、四乙氧基我、四 正丙氧基石夕燒、四显系於 一丁異丙虱基矽烷、四正丁氧基矽烷、四第 —丁氧基矽貌、四第—^ 、二甲气A — 丁軋基矽烷、甲氧基三乙氧基矽烷 能钱化^等乙氧基錢、三甲氧基乙氧基錢等的4官 劑、二系化合物係可將作為剝離劑、接著 人平女 4而市售的市售。口口照原樣使用。 31有機矽氧烷系 系化合物,亦可人右物的層’係除了聚有機石夕氧燒 。作為1它成八3有不阻礙本發明目的之範圍的其它成分 成刀,可舉出硬化劑、其它高分子、防老化劑 13 201034849 、光安定劑、難燃劑等。 尚且’含聚有機矽氧烷系化合物的 烷系化合物的含# % s中之聚有機矽氧 幻3置’從可形成具有優異 的觀點來看,較估 阻氣性之注入層 較佳為50重量%以上,f佔达 ,特佳為9〇重量%以上。 為7。重量%以上 作為形成含聚有機石夕氧院系化合 有特別的限制,如l ®之方法’並沒 制例如可舉出將含有聚有機p 的至少一種、 ,機矽氣烷系化合物 、^種依所欲的其它成分及溶劑、 塗佈在適當的基材 、曰形成用溶液 熱等而形成的方法。 钇各,視需要進行加 所形成之含聚有機石夕氧燒系化 特別的限制,、s a * 物的層之厚度係沒有 制通常為3〇咖至200_,較 。 佳為 50nm 至 ΙΟΟμιη 則述;主入層係在含聚有機石夕氧 離子而成者。 系化合物的層中注入 離子的注入量係可配合 必要的阻氣性^ ΗΒ 7成的層積體之使用目的( 魏、相性等)來適宜決定。 作為所注入的離子,可舉出&amp; 稀有氣體;碳氟化合物、氫 虱:氦、氖、氪、氙等的 、硫等的離子氧、二氧化碳、氣、氟 寸㈣子,金、銀、銅、麵 鈀、釦、Μ、笙AA、# 、鈀、鉻、鈦、鉬、 -鶴料料電性金屬之離子f。 其中,從可更簡便地注入, 透明性的注入層來看,較 ,、可得到具有阻氣性與 千乂住马由齑、 碳氟化合物所组成族# 虱、氬、稀有氣體及 奶Μ、且成麵群所選出的至小^ 耵至夕—種之離子,特佳為 14 201034849 氮、氧、氬或氦的離子。 注入離子的方法係力 成含聚有機 ’、又寺別的限定,例如可舉出在形 戚3ι有機矽乳烷系化合物的 出在开/ 機矽氧烷系化合物的層中之方‘等。 ,Α含該聚有 作為離子注入法, 離子束)之方法、將電漿中2照射經電場所加速的離子( 本發明中’從可簡便地 子’主入之方法等。特別地, Ο ❹ 佳為後者之電漿離子注入方法。 、體來看,較 電漿離子注入係可藉由在含 氣體之環境下使產生 有乳體等的電漿生成 兄Μ更屋生電漿,對含聚 層施加負的高電歷脈衝 乳烷系化合物的 w 將該電漿中的離子 含聚有機彻系化合物 (%離子)注入 之表面。卩而進行。 供Γ 可藉由使用x射線光電子分光(XPS)八 〈導電體層〉…素分析測定來確認。 本發明的層積體更具有導 )。 有導電體層(以下亦稱為「B層」 作為構成B層的材料,可舉 物、導電性化合物、此等的混合:屬=、金屬氧化 雜有銻的氧化錫(AT0);摻# 了舉出摻 贷雜有氟的虱化錫( 虱化鋅、氧化銦、氧化麵锡π 導電性金屬負彳(物.&amp; 虱化鋅銦(ΙΖ0)等的 等“生金屬乳化物,金、銀、鉻、 與導雷枓冬厘畜# &amp; 1 食屬,此等金屬 4電丨生金屬减物的混合物;料銅、 導電性物曾.中贫此 s 爪化銅等的無機 胃’聚本^㈣吩H各等的有機導電性材 15 201034849 料等。B,亦可為由此等材料所成的層以複數層積而成的 層積體。 又,B層可為透明或不透明,當β層為逯明時,可得 到透明性優異的層積體。從透明性之點來看,作為形成b 層的材料’較佳為導電性金屬氧化物,特佳為η。。 作為B層的形成方法,例如可舉出蒸鍛法 '滅鍵法、 離子錢法、熱CVD法、« 法等。於此等之中,從可 簡便地形成B層來看,本發明中較佳為減鍍法。 踐鍍法係在真空槽内導入放電氣體(氬等),在標把與 基板(本發明中為A層 曰1 %加商頻電壓或直流電壓而將 放電氣體電漿化,以該電裝 电聚衡扣靶而使標靶材料飛濺, 使附著在基板上而得到薄膜 a 左作為標靶’使用由形 成則述B層的材料所成者。 V電體層的厚度係可按昭1 、…、用途等來適宜選擇。通常 為10⑽〜50_,較佳為2〇nm〜2〇_。 所得之導電體層的表 電阻率通常為1 000Ω/□以下。 對所形成之導電體層, Η - 視而要亦可進行圖案化。作為 圖案化的方法,可舉屮料&amp; ^ 微影術等的化學蝕刻、用#射笤A 物理蝕刻等、用光罩的直一以肖雷射寺的 (Iift ,、二瘵鍍法或濺鍍法、掀離 法、印刷法等。 啷 (層積體) 本發明的層積體係具有俞 馬η 、有則述人層與Β層者,可僅由八In the formula C, hydrazine, Ky, and fluorene each independently represent a non-hydrolysis of a hydrogen atom, an unsubstituted or substituted alkyl group, an unsubstituted or substituted alkenyl group, an unsubstituted or substituted aryl group, and the like. Further, Rx of the plural of the formula u), Ry of the plural of the formula (b) and Rz of the plural of the formula (c) may be the same or different, but the Rx of the above formula (a) is not two Is a hydrogen atom). 201034849 is an alkyl group of a substituted, substituted or substituted alkyl group, such as methyl 'ethyl, n-n-propyl, isopropyl, n-butyl, isobutyl, second butyl, second butyl A group having a carbon number of 1 to 10, such as a group, a n-pentyl group, an isopentyl group, a neopentyl group, a n-hexyl group, a group or an n-octyl group. Examples of the fluorenyl group include an alkenyl group having 2 to 1 Å carbon atoms such as a vinyl group, a propylene group, a 2-dimercapto-1-butenyl group, a 2-butenyl group or a 3-butenyl group. Examples of the substituent of the alkenyl group include a fluorine atom, a chlorine atom, a molybdenum atom, a thiol atom, a mercapto group, a thiol group, an epoxy group, a glycidoxy group, and a (meth) acetonium group. An oxy group; an unsubstituted or substituted aryl group such as a phenyl group or a 4-methyl group; As the aryl group of the unsubstituted or substituted aryl group, an aryl group having a carbon number of 6 to 1 G such as a decyl group, a 1-naphthyl group or a 2-naphthyl group. 'The substituent of the above-mentioned aryl group' may be a fluorine atom, a chlorine atom, a 9 atom or a ruthenium atom, etc. The carbon number of the methyl group, the ethyl group, etc. Alkoxy group having a carbon number of 1 to 6; nitro; #土歹基, thiol group; epoxy group; glycidoxydioxy group; phenyl group, 4-methyl group n. [Methyl) propylene And an aryl group such as a methyl group or a 4-fluorenylphenyl group, etc., a substituent or a group having an R of 1 ' RX, R" RZ each independently preferably an unsubstituted or a C ash It is preferably a methyl group, a ethyl group, a 3-glycidoxypropyl group or a phenyl group. The soil of the present invention, as a polyorganic formula (a) - λλ ± ± in the compound 'preferably the first (a) of the linear compound or the former (b) of the ladder-like compound 201034849 From the viewpoint of obtaining the barrier property and forming an injection layer having excellent gas barrier properties, it is particularly preferable to be a linear compound of two fluorenyl groups or a phenyl group in the above formula (a), and the above formula ( Two Ry-based ladder compounds of methyl, propyl, 3-glycidoxypropyl or phenyl. The polyorgano-oxygen compound can be obtained by a known production method in which a decane compound having a hydrolyzable functional group is polycondensed. The Shixiyuan compound used can be selected according to the purpose of the structure of the polyorganisms of the organic radix. Preferred examples thereof include dimethyl dimethoxy oxy shi xiyuan, dimercapto diethoxy oxysalicum, diethyl dimethoxy sec., and two f -7 ^ a 2-functional decane compound such as ethionyl decane; methoxy methoxy shi xiyuan, methyl triethoxy zephyr, ethyl trimethoxy sulfonate, ethyl triethoxy decane, n-propyl trimethoxy矽, n-butyltriethyl sulphate, 3-glycidoxypropyltrimethoxy sulphur, phenyltrimethoxydi:*yl-ethyllacyl decane, phenyldiethoxymethoxy矽 等 等 石 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Butanoxymorph, tetrazole-^, dimethyl-gas A-butadiene-based decane, methoxytriethoxy decane can be used to devise ethoxyl money, trimethoxy ethoxy money, etc. The agent and the secondary compound are commercially available as a release agent and are then commercially available. The mouth is used as it is. 31 organic oxane system, or a layer of the human right, except for polyorganisms. Further, it may be a hardener, another polymer, an anti-aging agent 13 201034849, a light stabilizer, a flame retardant, or the like, as an additional component which does not inhibit the object of the present invention. Further, it is preferable that the "inorganic compound containing a polyorganosiloxane compound has a polyorganophthalocene in the #% s", and the injection layer which is superior in gas barrier properties is preferably formed from the viewpoint of being excellent in formation. 50% by weight or more, f is up to, and particularly preferably 9% by weight or more. Is 7. The weight % or more is particularly limited as a method for forming a polyorganism-containing compound, and a method such as l ® does not include, for example, at least one compound containing a polyorgano p, a sulfonium-based compound, A method of forming other desired components and solvents, coating a suitable substrate, and heat of a solution for forming a ruthenium.钇 , , , , , 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别 特别The best is 50nm to ΙΟΟμιη; the main intrusion layer is composed of polyorganismite ions. The amount of the implanted ions in the layer of the compound can be appropriately determined in accordance with the purpose of use (wei, phase, etc.) of the laminate having the necessary gas barrier properties. Examples of the ions to be implanted include &amp; rare gases; fluorocarbons, hydroquinones: cesium, krypton, xenon, krypton, etc., ionic oxygen such as sulfur, carbon dioxide, gas, fluorine, and gold, silver, Copper, palladium, deduction, ruthenium, 笙AA, #, palladium, chromium, titanium, molybdenum, - ion material electrical metal ion f. Among them, from the point of view of the injection layer which can be more easily injected and transparent, it is possible to obtain a gas barrier property and a group consisting of a fluorocarbon compound, a argon, a rare gas, and a milk emulsion. And the ions selected from the group to the small group of ^ 耵 夕 夕 种 特 特 , 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 The method of injecting ions is limited to a polyorganism-containing, and a temple, and the like, for example, in the layer of the open-organic oxane-based compound of the organic sulfonamide compound of the form '3, etc. . In the present invention, the method of accumulating the plasma in the plasma to accelerate the ions in the electric field (in the present invention, the method of 'sending from the simple one'), etc., in particular, Ο佳 佳 is the plasma ion implantation method of the latter. In fact, compared with the plasma ion implantation system, the plasma generated by the emulsion can be generated by the plasma generated in the gas-containing environment. The poly layer containing a negative high electric pulsed lactane compound is applied to the surface of the plasma containing the polyorgano compound (% ion). The enthalpy can be carried out by using x-ray photoelectrons. The spectroscopic (XPS) VIII <conductor layer> was confirmed by measurement analysis. The laminate of the present invention is more conductive. There is a conductor layer (hereinafter also referred to as "B layer" as a material constituting the B layer, and it can be mentioned as a material, a conductive compound, or a mixture of these: genus =, metal oxide oxidized tin oxide (AT0); For example, a raw metal emulsion such as zinc telluride (zinc telluride, indium oxide, oxidized surface tin π conductive metal negative ruthenium (such as & zinc di-n-indium telluride) can be added. , silver, chrome, and guide 枓 厘 厘 厘 # # # # # # # # 1 1 1 1 1 1 1 1 1 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物 混合物The stomach 'poly" ^ (4), the organic conductive material 15 such as H, etc. 201034849 materials, etc. B, may be a layer formed by a plurality of layers formed by such materials, and the layer B may be It is transparent or opaque, and when the β layer is a bright one, a laminate having excellent transparency can be obtained. From the viewpoint of transparency, the material forming the b layer is preferably a conductive metal oxide, and particularly preferably η. Examples of the method for forming the layer B include a steaming forging method, a de-bonding method, an ion-money method, a thermal CVD method, a «method, and the like. In the case of forming the B layer in a simple manner, in the present invention, the plating method is preferably used. The plating method introduces a discharge gas (argon or the like) in a vacuum chamber, and the substrate and the substrate (in the present invention, A layer 曰 1% plus The discharge frequency is plasmad by the commercial frequency voltage or the direct current voltage, and the target material is splashed by the electric charge and the target material is splashed, and the film is attached to the substrate to obtain the film a. The left side is used as a target. The thickness of the layer of the layer can be suitably selected according to the description of the composition, etc., usually 10 (10) to 50 Å, preferably 2 〇 nm to 2 〇 _. The surface resistance of the obtained conductor layer The rate is usually 1 000 Ω / □ or less. For the formed conductor layer, Η - can also be patterned. As a method of patterning, chemical etching, such as lithography, etc.笤 A physical etching, etc., using a straight mask of the ray to the temple (Iift, two-coating or sputtering, detachment, printing, etc. 啷 (layered body) layer of the invention The product system has Yuma η, and there are people who say the layer and the layer, which can only be eight

層、B層所構成者,也曰者了僅由A ^ . $再匕層。其它層可Λ蕈層, 也可為同種或異種的2層以卜。 Τ為早 201034849 作為其它層,可舉出基材層或無機化合物層等。 本發明的層積體,從Μ @交 ’較佳為含有基材層。 木“性等來看 :為構成基材層的材料,可舉出與形成前述含高分子 化口物的層時所用的基材 昍认s 柯之材科所例不者同樣者。當本發 月的層積體含有基材層時, 隔荽矣&amp; τ 了糟由在基材上設置Λ層,由於 #表面平滑性比基材層 表面優異的A層來形成b層,故 Ο 〇 提T5J B層表面的平滑性。 本發明的層積體亦可更含有無機化合物層。 無::合物層係由無機化合物的一種或二種以 的層’具有阻氣性。 作為構成無機化合物層的盔 的無機化合物,可舉出一般可 真工成膜且具有阻裹降! . 有乳性者,例如氧化矽、氧化鋁、氧化鎂 、氧化銦、氧化趟、氧化并 、 乳化錯、氧化鈦、氧化硼、氧化 氧化鋇等的無機氧化物;氮 α _ ^ ’鼠化紹、IL化蝴、氡介 鎂等的無機氮化物;碳化矽茸 . 夕等的無機碳化物;無機硫化物 ,此等的複合體等。作為士梦 為等複合體,可舉出無機氧化 氮化物、無機氧化碳化物、盔 &gt; ,,,、機虱化碳化物、無機氧化氮 化碳化物等。 於本發明的此等之中,軔 較佺為無機氧化物、無機氮化 物、無機氧化氮化物、無機氮 乳化杈化物、無機氧化氮化碳 化物’更佳為無機氮化物。 作為無機氮化物,可舉出斗.u λΙ 出通式:MNy所示的金屬氮化 物。式中,Μ表示金屬元素, y係ο · 1〜1 · 3的範圍之值。 201034849 於此等之中,從透明性等優異來看,Μ較佳為石夕(Si) 、鋁(A1)、鈥(Ti)、錫(Sn)的氮化物,M更佳為矽的氮化 物。再者,作為y的值,若Μ為石夕(Sl)的話y = 〇i〜i3, 若為鋁(A1)的話π0.1〜丨.1,若為鈦(Ti)的話y=0.1〜1.3 ’若為錫(Sn)的話y = 0. 1〜I 3之範圍為佳。 無機化合物層的形成方法係沒有特別的限制,例如可 舉出蒸鏡法、賤鍍法、離子鍍法、熱CVD法、電衆⑽法 專,較佳為歲鍍法,更佳為磁控濺鍵法。 無機化合物層的厚度通常為1〇nm〜1〇〇〇nm,較佳為 〜500_ ’更佳為2〇〜1〇〇ηιη的範圍。 本發明的層積體較佳為前述A層與Μ直接層 的層積體。此處的「直接層積」係意味Α層的表面側鱼Β 層不經由其它層而直接層積。前述A層與B層所直接層 而成的層積體係阻氣性及層間密接性優異。 、 又,當本發明的層積體具有無機化合物層時,益機化 合物層的配置位置係沒有特別的限定,從得到具有優里 密接性與阻氣性之層積體的觀點來看,較佳為設在 B層之間。 曰” 圖1中顯示本發明的層積體之較佳 增構成之例。惟, 本發明的層積體不受此等所限定。 圖1中,S表示基材層,Al、A2分別声-Λ a 表不A層,Bl、 刀別表示B層’ C表示無機化合物層。 圖1⑷表示由A層-B層所成的2層之層積體,圖^ 表不由基材層—A層-B層所成的3層之層積體,目Kc)表 18 201034849 不由Α層-基材層—Α層-Β層所成的4層之層積體,圖Κ 表示由Β層條基材層坏Β層所成的5層之層積體, 圖Ue)表不由基材層-Α層—無機化合物層—β層所成的4層 之二積體’目1⑴表示由…基材層-Α層-無機化合物層 層所成的5層之層積體。 本發明的層積體之全體厚度係沒有特別 照目的之電子裝置的用途來適宜決定。 了按 Ο Ο &lt;層積體的製造&gt; 可舉=Γ積體之製造方法係沒有特別的限定。例如 昭此方去形成&quot;層’於其上形成β層之方法等。依 ',、、:,可連續地製造長條的薄膜狀層積體而較佳。 例如’Α層為由含有平古她 之1¾ &gt; a Λ機石夕氧烧系化合物的層所得 之阻氣層的層積體係可如以下地製造。 的層所仔 首先,於作為基材層的長條狀基材薄膜之 含有聚有機石夕氧烧系化合物的岸。例如 形 定方向中搬送長條狀基材薄膜,材=由邊在一 ’以塗佈裝置來塗佈含有聚有機二:相的-面上 :、依所欲的其它成分及溶劑之 ;物的至少- 使用刀塗機凹=:等而形成。作為塗佈裝置,可 :機、凹槽輥塗佈機等眾所周知的裝置。 進二對該高分子層,使用前述 進仃電漿離子注入。 水雕于左入裝 圖2係顯示包括前述 子注入裝置之概要的圖。 ,入裝置的連續電漿離 19 201034849 圖2(a)中,Ua係室,2〇a係渦輪分子泵,仏係送出 離子注人前的薄膜la之捲出輥,5a係將經離子注入的層 積薄膜ib捲繞成親狀的捲取輥,2a係高電壓施加旋轉罐 (can) ’ 10a係氣體導入口,7係高電屢脈衝電源,4係電 漿放電用電極(外部電場)。圓2(b)係前述高電魏加旋轉 罐2a的斜視圓,係高電壓導入端子(饋通)。 …闯4尸/]·不的連續電 ^ 1 矸朕i a保在 室山内,由捲出輥3a往圖2中箭號又方向搬送,通過高 電壓施加旋轉罐2a,橡螓右换c 捲繞在捲取輥53上。薄膜ia的捲繞 方法或搬送薄膜la的方法等俜沒右胜 ^ /広寺货W又有特別的限制, 形態中,藉由以一定祙译估刺於本實靶 ^使㈣施加旋轉罐2a旋轉,以進 灯薄膜la的搬送。又,离兩 ^ ^ 壓施加旋轉罐2a的旋轉传萨 由馬達使高電料人端子15的中心轴13旋轉而進行轉係藉 &quot;二:?入端子15及薄“所接觸的複數之送出用 = 絕緣體所構成,例如氧化料表面經聚四氟乙 烯4的树脂所被覆而形成。又,古 人 间電壓施加旋韓線9。/么丄 導體所構成,例如可 疋轉罐2a係由 — J如了由不銹鋼等所形成。 薄膜的搬送速度係可適宜 i矣屮董〇又&amp; 在由捲出輥3a搬 达出薄膜la到捲繞在捲取輥 裩允搬 表面部進行離子注入 為止之間’於薄膜13的 注入層的時間,則沒有^又只要是能確保形成所欲之離子 線速度)亦取決於:加;的:制。薄膜lb的捲繞速度( 2一較佳為。2〜〇7一。 …(M〜 百先’糟由連接於旋轉 nr明刀于泵2〇a,將室Ua 201034849 内排氣、減壓。減壓度通常為lxl〇-4Pa〜1Pa,較佳為 lxl(T3Pa〜lxl(T2Pa。 其次,經由氣體導入口 1〇a在室Ua内導入離子注入 用的氣體(以下亦稱為「離子導入用氣體」),而使室lu 内成為減壓離子注入用氣體環境。再者,離子注入用氣體 亦為電漿生成氣體。 接著藉由電漿放電用電極4(外部電場)使產生電漿 Ο ❹ 。作為使產生電漿的方法,可舉出藉由微波或RF等的高頻 電力源等之眾所周知的方法。 面、丄由同電壓導入端子Ϊ5,由連接於高電壓 她加方疋轉罐2a的高電麼脈 g。若料&amp; 衝電,原7來鈀加負的高電壓脈衝 發電聚中的離;轉罐2“也加負的高電屋脈衝,則誘 la的表面⑷,,主入_施加旋轉罐2a的周圍之薄膜 的表面(圖2(a)中箭號γ)。結 有人層的層積薄膜lb。 传到在基材層上形成 層的二V,在::之層積薄膜_ A層(形成有離子注入 藉由濺鍍來形成B層。 B層例如可使用圖3 於圖3张_ 扪運、,濺鍍裝置來形成。 八? 斤不的連續濺鍍裝置中, 分子果,3b俜逆+爲 1中Ub係室,20b係渦輪 n a 糸k出層積薄膜1 b的捲屮韧Γ 層的薄_ le M h W心’ 5b係將形成有 故斤 捲繞成輥狀的捲取鎔,βκ〆 係氧體導入口。 輥6b係送出用輥,1〇b 2b係旋轉罐,8 層積薄膣! Κ ^ T艰鍍松靶。 往hi ο ' 仿、藉由使旋轉罐2b旋赫 圖3中箭號Y+ %轉,而由捲出輥 破Χ方向搬送,捲繞b 21 201034849 —首先’與圖2中所示的電跋離子注入裝置同樣地,在 至Ub内設置薄膜1b’以便在A層上形成B層,藉由連接 於旋轉泵的渦輪分子爷9nk收 精虫運接 %刀子I 20b’將室llb内排氣、減麼。 對該處,藉由氣體導 1〇 ^ _ 〒八在至lib内,例如一邊 導入iL及氧氣,一邊料押 透對‘靶把加向頻電力而使電漿放電。 如此的話,氬及氧H推)雜 礼進仃離子化,而衝撞標靶。藉由該衝 撃’構成標乾的ΙΤΟ耸推/^/Λγ'ιΛα 二糸§作濺射粒子而飛出,堆積在 積薄膜lb的Α層之表面上。 如以上地,可得到在層積薄獏lb的A層上形成有μ 的層積薄膜lc(本發明的層積體)。 在A層上具有無機化合物層且再於其上具有b層 的層積體’係可藉由在盥上述同媒 /、上江Π樣地侍到之層積薄膜η的 A層(形成有離子注人層的面)上,例如使用磁控滅鑛裝置 ^形成無機化合物層後’在所形成的無機化合物層上,與 前述同樣地形成B層而獲得。 於此情況下,當層積薄膜lb亦為長條時,可邊在一定 /向中搬达4層積薄膜lb,邊使用磁控濺鍍I置來連續地 形成無機化合物層,再邊在—定方向中搬送附有無機化合 物層的層積薄膜,邊在該無機化合物層的表面上,與前述 同樣地連續形成B層。 ^依照如此的本發明之層構件的製造方法,可容易製造 $述(1)〜(7)的層積體。 如以上所得之本發明的層積體’係具有優異的阻氣性 及密接性。本發明的層積體具有優異的阻氣性,此可由本 22 201034849 發明的層積體之水蒸氣等氣體的透過率小來確認。本發明 的層積體之水蒸氣透過率較佳為l.〇g/W.day)以下,更 佳為 〇. 6g/(m2 · day)以下,特佳為 〇. Ig/On2 . day)以下。 層積體的水蒸氣等之透過率,係可使用眾所周知的氣體透 過率測定裝置來測定。 本發明的層積體係層間密接性優異,此例如可黏貼依 照JIS - Η 8 5 0 4的黏著性朦黑 ..^ . ㈣者轉帶,朴㈣旧驗,由其評價為 ❹ ❹ 良好來確認。 本發明的層積體之導電體層係表面平滑性優異。本發 明的層積體之導電體層的表面粗糙度(Ra)通常為2如以 I’較佳為以下’更佳為〇5nm以下。導電體層的 表面粗糖度係可使用原子力顯微鏡(則)來測定。 (2)電子裝置用構造及電子裝置 ^發明的電子裝置用構造之特徵為由本發明的層積體 ^的因此’本發明的電子裳置用構造具有導電性,具 阻氣性及層間密接性’為可棱性,而且由於可成 :顯有透:性的構件及輕量化,故適合作為液晶顯示器、 / 專的顯示器或太陽電池等的構件,例如電極基板 體例=的電子裝置包括本發明的電子裝置用構造。具 出液晶顯示器、有機EL顯示器、無機豇顯示器 冤子紙、太陽電池等。 的電的電子裝置’由於包括由本發明的層積體所成 的電子裝置用構造’故具有優異的阻氣性。 23 201034849 【實施例】 以下,舉出實施例來更詳細說明本發明,惟本發明完 全不受以下的實施例所限定。 所用的電漿離子注入裝置、X射線光電子分光測定裝 置(XPS)及測定條件、導電體層的表面粗糖度(Ra)之測定方 法、用於測定成型體的水蒸氣透過率之水蒸氣透過率測定 裝置與測定條件、導電體層的表面電阻率之測定裝置、可 見光透過率測定裝置及密接性試驗的方法係如以下。尚且 ’所用的電漿離子注入裝置係使用外部電場進行離子注入 的裝置。 (電漿離子注入裝置) RF電源:型號「RF56000」,日本電子公司製 高電壓脈衝電源:「PV-3-HSHV-0835」,栗田製作所公 司製 (X射線光電子分光測定裝置) 測定裝置:「PHI Quantera SXM」Ulvac-Phi 公司製 X射線光束直徑:1〇〇μιη 電力值:25W 電壓:15Κν 取出角度:45。 於此測定條件下進行下述的測定。 氧原子、碳原子及石夕原子的存在比例,及矽原子的 電子軌域之鍵能的尖峰位置之測定 測定實施例1 5所得的成形體之電漿離子注入面及比 201034849 較:列1的成形體之含聚二甲基矽氧烷的層之表面的氧原子 、碳原子切原子之存在比例以及碎原子的2p電子軌域之 鍵能的尖峰位置。然後’對於各自的成形體,自電漿離子 注入面(實施例卜⑸、含聚二甲基石夕氧院的層之表面(比 較例1)朝向深度方向,使用氬氣進行賤鍍,藉由重複測定 經濺鍍所露出的表面中之存在比例的操作,以測定深度方 向的原子之存在比例及石夕原子的2p電子軌域 二 峰位置。 大The layer and the layer B are also composed of only A ^ . $ and then layer. Other layers may be layered, or may be of the same or different types of layers. Τ is early 201034849 As another layer, a base material layer, an inorganic compound layer, etc. are mentioned. The laminate of the present invention preferably contains a substrate layer from Μ@交. In view of the nature of the wood, the material constituting the base material layer is the same as the base material used in the formation of the layer containing the polymerized mouth material. When the laminate includes a base material layer, the barrier layer is provided with a ruthenium layer on the substrate, and since the surface layer is smoother than the surface layer of the base material layer to form the b layer, the b 〇 The smoothness of the surface of the B5 layer of the T5J. The laminate of the present invention may further contain an inorganic compound layer. No: the layer of the compound is composed of one or two of the inorganic compounds, and has a gas barrier property. The inorganic compound of the helmet of the layer can be generally made into a film and has a barrier to fall down! There are milky people such as cerium oxide, aluminum oxide, magnesium oxide, indium oxide, cerium oxide, oxidation, emulsification, Inorganic oxides such as titanium oxide, boron oxide, oxidized cerium oxide; inorganic nitrides such as nitrogen α _ ^ 'rats, IL, and magnesium; carbonized velvet; inorganic carbides such as ceram; inorganic sulfide Things, such complexes, etc. as a dream complex, Examples of the inorganic oxynitride, the inorganic oxidized carbide, the helmet, the carburetor, the inorganic oxycarbide carbide, and the like. Among the above, the ruthenium is an inorganic oxide. The inorganic nitride, the inorganic oxynitride, the inorganic nitrogen emulsified bismuth compound, and the inorganic oxynitride carbide are more preferably inorganic nitrides. The inorganic nitride may be a metal represented by the formula: MNy. In the formula, Μ represents a metal element, and the value of the range of y is · 1 to 1 · 3. 201034849 Among these, from the viewpoint of excellent transparency and the like, Μ is preferably Si Xi (Si), Aluminum (A1), bismuth (Ti), tin (Sn) nitride, M is more preferably yttrium nitride. Further, as the value of y, if Μ is Shi Xi (Sl), y = 〇i~i3 If it is aluminum (A1), π0.1~丨.1, if it is titanium (Ti), y=0.1~1.3 'If it is tin (Sn), then y = 0. 1~I 3 is preferable. The method for forming the compound layer is not particularly limited, and examples thereof include a vapor deposition method, a ruthenium plating method, an ion plating method, a thermal CVD method, and a radio frequency (10) method, and preferably an age plating method. More preferably, it is a magnetron sputtering method. The thickness of the inorganic compound layer is usually from 1 〇 nm to 1 〇〇〇 nm, preferably from 〜500 _ 'more preferably from 2 〇 to 1 〇〇 ηιη. The body is preferably a laminate of the above A layer and the bismuth direct layer. Here, "direct lamination" means that the surface side surimi layer of the enamel layer is directly laminated without passing through other layers. The laminated system in which the layer A and the layer B are directly layered is excellent in gas barrier properties and interlayer adhesion. Further, when the laminate of the present invention has an inorganic compound layer, the arrangement position of the probiotic compound layer is not particularly limited, and from the viewpoint of obtaining a laminate having excellent adhesion and gas barrier properties, it is preferred. It is located between the B floors. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows an example of a preferred constitution of a laminate of the present invention. However, the laminate of the present invention is not limited thereto. In Fig. 1, S denotes a substrate layer, and Al and A2 respectively sound. - Λ a indicates A layer, B1, knives indicate B layer 'C indicates inorganic compound layer. Fig. 1(4) shows a two-layer laminate formed by layer A-B, and Fig. 1 is not represented by substrate layer-A The layered body of the three layers formed by the layer-B layer, Table Kc) Table 18 201034849 The layered body of the four layers which is not formed by the layer of the layer of the base layer - the layer of the base layer - the layer of the layer of tantalum The layered body of the five layers formed by the gangrene layer of the base material layer, Figure Ue) shows the four-layered product of the base layer-Α layer-inorganic compound layer-β layer, which is represented by 1(1) A layered layer of a layer of a layer of a layer of an inorganic compound. The thickness of the layered body of the present invention is suitably determined without the use of an electronic device that is particularly conspicuous. The production method of the integrated body is not particularly limited. For example, a method of forming a layer of a layer on the layer may be formed by ",", ": Manufacturing A film-like laminate of the strip is preferred. For example, a layered system in which the tantalum layer is a gas barrier layer obtained from a layer containing a flat organic compound of the earth is prepared as follows. First, the layer containing the polyorgano-oxygen compound in the long-length base film as the base material layer, for example, transporting the long-length base film in the direction of the material, the material is A coating device comprising a polyorganic two: phase-coated surface, an optional other component and a solvent; at least - formed by using a knife coating concave =:, etc. as a coating device It can be: a well-known device such as a machine, a gravure roll coater, etc. The second polymer layer is implanted with the above-mentioned plasma ion implantation. The water engraving is applied to the left side of the drawing, and the outline of the sub-injection device is shown. The continuous plasma of the device is separated from the 19 201034849. In Figure 2(a), the Ua system, the 2〇a series turbomolecular pump, the tanning system sends out the film before the ion injection, and the 5a system will pass through The ion-implanted laminated film ib is wound into a parent-shaped take-up roll, and the 2a is a high-voltage application rotary can (can ) '10a gas inlet, 7 series high-voltage pulsed power supply, 4 series electrode for plasma discharge (external electric field). Circle 2 (b) is a squint circle of the high-power Weijia rotary can 2a, high voltage introduction Terminal (feedthrough). ...闯4 corpse/]·No continuous power ^ 1 矸朕ia is kept in the mountain, and is carried by the take-up roll 3a to the arrow in Fig. 2, and the rotating can 2a is applied by high voltage. The rubber is replaced by the right winding c on the take-up roller 53. The winding method of the film ia or the method of transporting the film la is not particularly limited, and there is a special limitation in the form, in the form, by祙 估 于 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本Further, the rotation of the rotating can 2a is applied from the two ^ ^ pressures, and the central axis 13 of the high-electric feeder terminal 15 is rotated by the motor to perform the transfer. &quot;Two:? The terminal 15 and the thin terminal are connected to the plurality of contacts for the feeding of the insulator. For example, the surface of the oxidized material is formed by coating the resin of the polytetrafluoroethylene 4. Further, the voltage of the ancient human is applied to the Korean wire 9. For example, the transfer can 2a is formed of stainless steel or the like. The transfer speed of the film is suitable for the transfer of the film la to the winding by the take-up roll 3a. The time between the injection layer of the film 13 and the implantation of the film 13 is not as long as it can ensure the formation of the desired ion linear velocity. The winding speed of the film lb (2 is preferably 2. 2~〇7一. ...(M~ 百先' is connected by the rotating nr knife to the pump 2〇a, the chamber Ua 201034849 is exhausted, minus The pressure is usually lxl〇-4Pa~1Pa, preferably lxl (T3Pa~lxl (T2Pa. Next, a gas for ion implantation is introduced into the chamber Ua via the gas introduction port 1〇a (hereinafter also referred to as " The gas for ion introduction ") is used to make the inside of the chamber lu a gas environment for decompressed ion implantation. The gas for ion implantation is also a plasma generating gas. Next, the plasma discharge electrode 4 (external electric field) is used to generate plasma Ο. As a method for generating plasma, microwave or RF may be used. A well-known method such as a high-frequency power source, etc. The surface and the cymbal are introduced into the terminal Ϊ5 by the same voltage, and the high-voltage gyro-g is connected to the high-voltage side of the gyrotron 2a. If the material is &amp; Adding a negative high-voltage pulse to generate electricity in the cluster; the canister 2 "also adds a negative high-voltage house pulse, then the surface of the induced (4), the main inlet _ applies the surface of the film around the rotating can 2a (Figure 2 ( a) Medium arrow γ). The laminated film lb of the human layer is transferred to the second V which forms a layer on the substrate layer, and the laminated film _ A layer (formed with ion implantation by sputtering) Form B. The B layer can be formed, for example, by using a sputtering device as shown in Fig. 3 in Fig. 3. In the continuous sputtering device of eight pounds, the molecular fruit, 3b hiccup + is a Ub room of 1 , 20b series turbine na 糸k out laminated film 1 b of the torn tread layer thin layer _ le M h W heart '5b system will be formed into a roll of roll , βκ〆 oxygen source introduction port. Roller 6b is a roller for delivery, 1〇b 2b is a rotating can, 8 layers of thin 膣! Κ ^ T difficult to plate loose target. To hi ο ' imitation, by making the rotating can 2b In the rotation of Fig. 3, the arrow Y+% turns, and is conveyed by the winding roller in the direction of breaking, and winding b 21 201034849 - firstly, in the same manner as the electric ion ion implantation device shown in Fig. 2, a film is placed in Ub. 1b' to form the B layer on the A layer, and exhaust the chamber llb by the turbol genus 9nk connected to the rotary pump. In this case, the gas is guided by 〇 〒 在 in the lib, for example, while introducing iL and oxygen, the plasmon is applied to the target to apply the directional electric power to discharge the plasma. In this case, the argon and oxygen H pushes into the ionization and collides with the target. The ruthenium 构成 构成 构成 构成 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射 溅射As described above, a laminated film lc (layered body of the present invention) in which μ is formed on the layer A of the laminated thin layer lb can be obtained. A layered body having an inorganic compound layer on the layer A and having a layer b on the layer A can be formed by layer A of the laminated film η which is served by the above-mentioned same medium/upper river sample. On the surface of the ion-implanted layer, for example, after forming an inorganic compound layer using a magnetron-exchanging device, a B layer is formed on the formed inorganic compound layer in the same manner as described above. In this case, when the laminated film lb is also elongated, the four-layer film lb can be transferred in a certain/direction, and the inorganic compound layer is continuously formed by using magnetron sputtering I, and then - A laminated film with an inorganic compound layer is conveyed in a predetermined direction, and a B layer is continuously formed on the surface of the inorganic compound layer in the same manner as described above. According to the method for producing a layer member of the present invention, the laminate of (1) to (7) can be easily produced. The laminate body of the present invention obtained as above has excellent gas barrier properties and adhesion. The laminate of the present invention has excellent gas barrier properties, and this can be confirmed by a small transmittance of a gas such as water vapor in the laminate of the invention of 2010. The water vapor transmission rate of the laminate of the present invention is preferably 1. 〇g/W.day or less, more preferably 〇. 6g/(m2 · day) or less, particularly preferably 〇. Ig/On2. day) the following. The transmittance of water vapor or the like of the laminate can be measured using a well-known gas permeability measuring device. The layered system of the present invention is excellent in adhesion between layers, and for example, it can be adhered according to JIS - Η 8 5 4 4, which is an adhesive tape, which is a tape transfer, and a (4) old test, which is evaluated as ❹ 良好 good. confirm. The conductor layer of the laminate of the present invention is excellent in surface smoothness. The surface roughness (Ra) of the conductor layer of the laminate of the present invention is usually 2, preferably I' or less, and more preferably 〇 5 nm or less. The surface roughness of the conductor layer can be measured using an atomic force microscope (then). (2) Structure for electronic device and electronic device. The structure for an electronic device of the invention is characterized by the layered body of the present invention. Therefore, the structure for the electronic device of the present invention has conductivity, gas barrier property and interlayer adhesion. 'It is ribbed, and it can be used as a member of a liquid crystal display, a dedicated display, or a solar cell, etc., for example, an electronic device including an electrode substrate system includes the present invention. The structure of the electronic device. It has a liquid crystal display, an organic EL display, an inorganic germanium display, a paper, a solar cell, and the like. The electric electronic device 'has excellent gas barrier properties because it includes a structure for an electronic device formed by the laminate of the present invention. [Examples] Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited by the following examples. Plasma ion implantation apparatus, X-ray photoelectron spectroscopy apparatus (XPS), measurement conditions, measurement method of surface roughness (Ra) of a conductor layer, and water vapor transmission rate for measuring water vapor transmission rate of a molded object The apparatus, the measurement conditions, the apparatus for measuring the surface resistivity of the conductor layer, the visible light transmittance measuring apparatus, and the method of the adhesion test are as follows. Still, the plasma ion implantation apparatus used is an apparatus for performing ion implantation using an external electric field. (plasma ion implantation device) RF power supply: model "RF56000", high voltage pulse power supply manufactured by JEOL Ltd.: "PV-3-HSHV-0835", manufactured by Kurida Co., Ltd. (X-ray photoelectron spectroscopy device) Measuring device: " PHI Quantera SXM" Ulvac-Phi company X-ray beam diameter: 1 〇〇 μιη Power value: 25W Voltage: 15 Κ ν Take-out angle: 45. The measurement described below was carried out under the measurement conditions. The ratio of the presence of oxygen atoms, carbon atoms, and lithium atoms, and the peak position of the bond energy of the electron domains of the ruthenium atom were measured. The plasma ion implantation surface of the molded body obtained in Example 15 was compared with 201034849: column 1 The oxygen atom on the surface of the polydimethylsiloxane-containing layer of the formed body, the ratio of the presence of the carbon atom to the cleavage atom, and the peak position of the bond energy of the 2p electron domain of the fragmented atom. Then, for the respective molded bodies, the surface of the plasma ion implantation surface (Example (5), the surface of the layer containing polydimethyl oxalate (Comparative Example 1) was oriented in the depth direction, and argon gas was used for ruthenium plating. The operation of repeating the ratio of the presence of the surface exposed by the sputtering is measured to determine the ratio of the presence of atoms in the depth direction and the two-peak position of the 2p electronic domain of the Shixia atom.

於上述測定中,氬氣的濺鍍之施加電壓為Mb,!次 的滅鍵時間為12秒,⑽速率在實施例卜6、實施例u 1 5及比較例1中係1 〇〇nm/分鐘,在實施例?、8中係 分鐘,在實施例9、1〇中係3〇nm/分鐘。 (導電體層的表面粗糖度之測定) 導電體層的表面粗糙度係使用原子力顯微鏡 (AFM)(SII奈米科技公司製「spA3〇〇HV」)來測定。 (密接性試驗) 進行拉剥十字切 以完成1邊2mm 黏貼依照JIS-H8504的黏著性膠帶 割試驗。試驗係預先在B層中導入切槽 的正方形,目視觀察B層的形狀,以6個等級進行評價。 評價係依照川K56()()_5-6的分類(表}試驗結果的分類 (水蒸氣透過率的測定) 水瘵虱透過率係使用透過率測定器(lyssy公司製「 L80-5_」)’於相對濕度9()%、4()t的測定條件下進行測 25 201034849 定。 (導電體層的表面電阻率之測定) 1:1 體層的表面電阻率係使用表面電阻率測定裝置( 一菱子么司製「Loresta GP」)來進行。 (可見光透過率的測定) 可見光線透過率(全光線透 ,日丨—壯班, 不设、千M糸使用可見光透過率 測疋衣置(曰本電色工業公製 J ^ Hazemeter NDH2000」) 來測疋。再者,對成形體 ⑷當作::=::,、係在實施例1〜 有含聚二甲基矽氧烷的層之面。 的成形體中當作具 (實施例1 ) 於當作基材的聚對苯二甲 ^ PETS8T ^on ± _乙一酯薄膜(「 PET38T-300」,東麗公司製,In the above measurement, the applied voltage of the argon sputtering is Mb,! The secondary deactivation time was 12 seconds, and the (10) rate was 1 〇〇nm/min in Example 6, Example u 15 and Comparative Example 1, in the examples? 8 is a minute, and in Example 9, 1 〇 is 3 〇 nm / min. (Measurement of Surface Roughness of Conductor Layer) The surface roughness of the conductor layer was measured using an atomic force microscope (AFM) ("spA3〇〇HV" manufactured by SII Nanotechnology Co., Ltd.). (Adhesion test) Perform a peeling and cross cutting to complete a 1 mm 2 mm adhesion test in accordance with JIS-H8504 adhesive tape cutting test. In the test system, a square of the slit was introduced into the layer B in advance, and the shape of the layer B was visually observed and evaluated in six levels. The evaluation is based on the classification of the K56 () () _5-6 (Table) test results (measurement of water vapor transmission rate). The water permeability is based on the transmittance tester ("L80-5_" manufactured by Lyssy). 'Measurement under the conditions of relative humidity 9 ()%, 4 () t 25 201034849. (Measurement of surface resistivity of conductor layer) 1:1 Surface resistivity of bulk layer using surface resistivity measuring device (1) (Loresta GP) made by Ryoko Koji. (Measurement of visible light transmittance) Visible light transmittance (full light penetration, sundial - Zhuangban, no setting, thousand M糸 using visible light transmittance to measure clothing (曰本电色工业工制J ^ Hazemeter NDH2000") to measure 疋. Furthermore, the shaped body (4) is treated as::=::, in the embodiment 1~ having a layer containing polydimethyl siloxane The formed body is made of (polyethylene terephthalate) PETS8T ^on ± _ ethyl ester film ("PET38T-300", manufactured by Toray Industries, Inc.).

薄膜J)上,使用美亞尸淨德38_)(以下稱為「PET 物的以聚-甲,上布當作聚有機石夕氧燒系化合 物的以聚一甲基矽氧烷當作主 石夕氧剝離劑「KS835 j作……氣樹脂⑴(聚 加熱2分鐘,形成厚度⑽⑽之 而得到成形物。接著,使 :夕乳剝離劑A的層, ,在含聚二甲基”院=Γ示的電聚離子注入裝置 製作成形體i。的層之表面,電衆離子注入氮,以 以下顯示電漿離子注入的條件。 •電漿生成氣體:N2 •負載(Duty)比:0.5% •重複頻率:l〇〇〇Hz 26 201034849On the film J), the use of Meiya corpse 38_) (hereinafter referred to as "the PET material with poly-methyl, the upper cloth as a polyorgano oxy-oxygenated compound with polymethyl methoxide as the main stone" The oxygen stripping agent "KS835 j is used as a gas resin (1) (poly heating for 2 minutes to form a thickness (10) (10) to obtain a molded product. Next, a layer of the::::::::: The electro-polyion implantation apparatus of the present invention produces a surface of the layer of the formed body i, and ions are implanted into the plasma to indicate the conditions of plasma ion implantation. • Plasma generated gas: N2 • Duty ratio: 0.5% • Repeat frequency: l〇〇〇Hz 26 201034849

•外加電壓:-1 OkV .RF電源:頻率13.56MHz,外加電力1〇〇㈣ •室内壓:0. 2Pa •脈衝寬:5μ sec .處理時間(離子注入時間):5分鐘 •搬送速度:0.4m/min —其次,在成形體1的經離子注入之聚有機矽氧烷系化 〇 口物層上’藉由磁控濺鍍法’形成當作導電體層的厚度50nm 之IT〇m,以製作具有基材層(PET薄膜)H (經氣離子注 入的聚有機矽氧烷系化合物層)_B層⑽膜)的層構成之 層積體1。 以下顯示濺鍍的條件。 •電漿生成氣體:氬、氧 •氣體流量:氬l00sccm,氧5sccin •電力值:1 500W 〇 •室内壓:0. 2Pa •線速度:0. 2m/min •濺鍍標靶:IT〇 (貫施例2) 除了使用氬(Ar)當作電漿生成氣體以外,與實施例1 同樣地製作成形體2。• Applied voltage: -1 OkV .RF power supply: Frequency 13.56MHz, plus power 1〇〇 (4) • Indoor pressure: 0. 2Pa • Pulse width: 5μ sec. Processing time (ion injection time): 5 minutes • Transfer speed: 0.4 m/min—Secondly, an IT〇m having a thickness of 50 nm as a conductor layer is formed by magnetron sputtering on the ion-implanted polyorganosiloxane-based layer of the formed body 1 A layered body 1 having a layer structure of a base material layer (PET film) H (a polyorganosiloxane containing a gas ion-implanted layer) and a layer B film (10) was produced. The conditions for sputtering are shown below. • Plasma generated gas: argon, oxygen, gas flow: argon l00sccm, oxygen 5sccin • Power value: 1 500W 室内 • Indoor pressure: 0. 2Pa • Line speed: 0. 2m/min • Sputter target: IT〇 ( Example 2) A molded article 2 was produced in the same manner as in Example 1 except that argon (Ar) was used as the plasma generating gas.

其次,與實施例1同樣地,在成形體2之經離子注入 的^有機石夕氧燒系化合物層上,藉由磁控濺鍍法,形成當 作導電體層的厚度5〇nm之IT0膜,以製作具有基材層(PET 27 201034849Then, in the same manner as in Example 1, an IT0 film having a thickness of 5 〇 nm as a conductor layer was formed on the ion-implanted organic oxy-oxygen compound layer of the formed body 2 by magnetron sputtering. To make a substrate layer (PET 27 201034849

氣院系化合物層)—B 薄膜)-A層(經氬離子注入的聚有機石夕 層α το膜)的層構成之層積體2。 (實施例3) 除了使用氦(He)當作電漿生成氣 同樣地製作成形體3。 ,、貫施例1 其次,與實施例1同樣地,在成形體3之經離子注入 的聚有.機石夕氧院系化合物層上,鞋士 ^ 二.· 藉由磁控濺鍍法,形成當 作導電體層的厚度5〇ηιη之ιτο膜A layer 2 composed of a layer of a gas system compound layer)-B film)-A layer (a polyorganism layer of a polyorganismite layered with argon ions). (Example 3) A molded article 3 was produced in the same manner except that helium (He) was used as the plasma generating gas. Example 1 Next, in the same manner as in Example 1, on the layer of the ion-implanted compound of the molded body 3, the shoe was made by magnetron sputtering. , forming a thickness of 5 〇ηιη as a conductor layer

... . a ^ 、 乂製作具有基材層(PET 溥膜)-A層(經氬離子注入的聚有 κ负機矽虱烷系化合物層)_b 層(ΙΤ0膜)的層構成之層積體3。 (實施例4) 除了使用氧(〇2)當作電漿生成 取礼體以外,與實施例1 同樣地製作成形體4。 其次,與實施例1同樣地, J π ^ 在成形體4之經離子注入 的聚有機矽氧烷系化合物層上,笋 稽由磁控錢鑛法,形成當 作導電體層的厚度W之™膜,以製作具有基材層(ΡΕΤ 缚膜)-A層(經氧離子注人的聚有㈣氧^、化合物層)—β 層(I TO膜)的層構成之層積體4。 (實施例5) 於與實施例1所用者相同的pET薄膜上,制美亞桿 塗佈以具有聚二甲基矽氧烷的甲基之一部分被取代成苯 ,的構造之聚有機矽氧烷系化合物當作主成分的聚矽氧樹 月曰(B)(商品名「X62-920 1 B」,信越化學公司製),在12(rc 力…2刀鐘,形成厚度100 nm的具有苯基之含聚有機矽氧 28 201034849 烷的層,而得到成形物。接著’於含聚矽氧樹脂(B)的層之 表面上’與實施例1同樣地’電漿離子注入氮,而得到成 形體5。 其次’與實施例1同樣地,在成形體5之經離子注入 的聚有機矽氧烷系化合物層上,藉由磁控濺鑛,形成當作 導電體層的厚度50nm之IT0犋’以製作具有基材層(pET 薄膜)-A層(經氮離子注入的聚有機矽氧烷系化合物層) 層(ΙΤ0膜)的層構成之層積體5。 〇 (實施例6) 除了使用氬(Ar)當作電漿生成氣體以外,與實施例5 同樣地製作成形體6。 其次’與實施例1同樣地,在成形體6之經離子注入 的聚有機矽氧烧系化合物層上,藉由磁控濺鑛法,形成當 作導電體層的厚度50nm之IT0膜,以製作具有基材層(pet 薄膜)-A層(經氬離子注入的聚有機;ε夕氧院系化合物層)一b ◎ 層(ΙΤ0膜)的層構成之層積體6。 (實施例7) 混合3· 29克(20mmol)正丙基三曱氧基矽烷(東京化成 工業公司製)、4·73克(20mmol )3-環氧丙氧基丙基三甲氧 基矽烷(東京化成工業公司製)、20ml的曱苯、i〇mi的蒸餾 水及0. 10克(lmmol)磷酸(關東化學公司製),在室溫使反 應24小時。反應結束後,於反應混合物中添加飽和碳酸氫 鈉水溶液,於其中添加1 〇〇ml的醋酸乙酯,進行分液,分 離取得有機層。以蒸餾水來洗淨有機層2次後,用無水硫 29 201034849 _進行乾燥,過渡分離硫酸鎮。將所得之渡液滴下到大 =的:己燒中以使沈殿。藉由傾析來分離正己貌後,使沈 歲物洛解在四氫呋喃(THF)中,... . a ^ , 乂 a layer composed of a layer of a substrate layer (PET ruthenium film)-A layer (a layer of a κ-negative decane-based compound which is implanted by argon ion implantation) _b layer (ΙΤ0 film) Integral 3. (Example 4) A molded article 4 was produced in the same manner as in Example 1 except that oxygen (?2) was used as a plasma-generating body. Next, in the same manner as in the first embodiment, J π ^ is formed on the ion-implanted polyorganosiloxane compound layer of the formed body 4, and the thickness of the conductor layer is formed by the magnetron control method. The film was formed into a laminate 4 having a layer of a substrate layer (linking film)-A layer (a group of oxygen-incorporated (tetra)oxygen, compound layer)-β layer (I TO film). (Example 5) On the same pET film as that used in Example 1, a UH bar was coated with a polyorganosiloxane having a structure in which a part of a methyl group having polydimethyl methoxy alkane was substituted with benzene. The compound is a main component of polyoxynium tree (B) (trade name "X62-920 1 B", manufactured by Shin-Etsu Chemical Co., Ltd.), and has a benzene at a thickness of 100 nm at 12 rc...2 knives. A layer of a polyorganophthalocyanine 28 201034849 alkane was obtained to obtain a molded product. Then, 'on the surface of the layer containing the polyoxyxylene resin (B), 'the same as in the first embodiment' was plasma ion-implanted with nitrogen to obtain a molded article. Next, in the same manner as in the first embodiment, on the ion-implanted polyorganosiloxane compound layer of the molded body 5, by magnetron sputtering, an IT0 having a thickness of 50 nm as a conductor layer was formed. 'Layer 5 made of a layer having a base layer (pET film)-A layer (a polyorganosiloxane containing compound layer implanted with nitrogen ions) layer (ΙΤ0 film). 〇 (Example 6) A molded body 6 was produced in the same manner as in Example 5 except that argon (Ar) was used as the plasma generating gas. In the same manner as in the first embodiment, an IT0 film having a thickness of 50 nm as a conductor layer was formed on the ion-implanted polyorganosiloxane compound layer on the ion-implanted polyorganosiloxane compound layer of the molded body 6 to prepare a base. A layer (pet film)-A layer (polyorganic ion-implanted polyorganic; ε oxime compound layer)-b ◎ layer (ΙΤ0 film) layered laminate 6. (Example 7) Mix 3 29 g (20 mmol) of n-propyltrimethoxy decane (manufactured by Tokyo Chemical Industry Co., Ltd.), 4.73 g (20 mmol) of 3-glycidoxypropyltrimethoxydecane (manufactured by Tokyo Chemical Industry Co., Ltd.), 20 ml of toluene, distilled water of i〇mi, and 0.1 g of (lmmol) phosphoric acid (manufactured by Kanto Chemical Co., Ltd.), and the reaction was allowed to proceed for 24 hours at room temperature. After the reaction was completed, a saturated aqueous solution of sodium hydrogencarbonate was added to the reaction mixture. 1 〇〇ml of ethyl acetate was added thereto, and liquid separation was carried out to obtain an organic layer. The organic layer was washed twice with distilled water, and then dried with anhydrous sulfur 29 201034849 _ to separate the sulfuric acid town. Drop to the big =: burned to make the temple. By decanting N-hexyl appearance after leaving the sink was years Los solution in tetrahydrofuran (THF),

〜 仃口收由沈澱物的THF 洛液中’❹蒸發器來㈣館去THF,對殘留物進行真* 二=得到具有梯狀構造的聚倍半錢燒(聚編氧: 系化。物)。此物的重量平均分子量為2, 〇〇〇。 其次,使所得之聚倍半石夕氧貌溶解在甲笨中,使用美 亞桿,將所得之溶液(固體成分濃度2質量%)塗佈在盥實施 例1所用者相同的ΡΕΤ薄膜上,纟125t加熱6小時以使 硬化’而得到具有厚度1QGnm的聚倍切氧院之層之成形 物。於硬化後的倍切氧烧之層的表面,冑用電漿離子^ 入裝置’與實施例i同樣地,電漿離子注入氮,以 形體7。尚且’重量平均分子量係藉由凝膠滲透層析法 所測定的聚苯乙烯換算值。再者,電漿離子注入前的成形 物之水蒸氣透過率為12.1(g/(m2.day)),全光線透 89.10% 〇 接著,與實施例1同樣地,在成形體7之經離子注入 的聚有機石夕氧烧系化合物層1,藉由磁控濺鍍法,形成當 作導電體層的厚度5()11111之ITG膜,以製作具有基材層⑽ 薄膜)-A層(經氮離子注入的聚有機矽氧烷系化合物— B 層(IT0膜)的層構成之層積體7。 (實施例8) 除了使用氬(Ar)當作電漿生成氣體以外,與實施例7 同樣地製作成形體8。 30 201034849 其次,與實施例1同樣地’在成形體8之經離子注入 的聚有機石夕氧烧系化合物層上’藉由磁控濺鐘法,形成♦ 作導電體層的厚度50nm之ΙΤ0膜,以製作具有基材層(ρΕτ 薄膜)-Α層(經氬離子注入的聚有機矽氧烷系化合物層)_β 層(I TO膜)的層構成之層積體8。 (實施例9) 〇 〇 混合7.94克UOnrnol)苯基三甲氧基矽氧烷(東京化成 工業公司製)、20ml的甲苯、i〇mi的蒸餾水及克 (lmmol)磷酸(關東化學公司製),在室溫使反應24小時。 反應結束後,於反應混合物中添加飽和碳酸氫鈉水溶液, 於其中添加100ml的醋酸乙酯,進行分液,分離取得有機 層。以蒸德水來洗淨有機層2次後’用無水硫酸鎮進行乾 燥,過濾分離硫酸鎂。將所得之濾液滴下到大量的正己烷 中以使沈殿。藉由傾析來分離正己烧後,使沈澱物溶解^ THF中,進行回收。藉由蒸發器來減壓餾去thf,進行真空 乾燥’而得到具有梯狀構造的聚倍半石夕氧燒(聚有機石夕氧: 系化合物)。此物的重量平均分子量為16〇〇。接著,使用 美亞桿,將所得之聚倍半矽裊六# ’軋庇/合解在曱本中的溶液(固體 成分濃度2質量%)塗佈在愈竇 甘”貫施例1所用者相同的PET薄 膜上’在12 5 C加敎6小味iv …b】知以使硬化,而得到具有厚度1〇〇nm 的聚倍半矽氧烷之層的成 J战形物。於硬化後的聚倍半矽氧烷 之層的表面’使用電漿離 于左入裝置’與實施例1同樣地 ,電漿離子注入氮,以劁从上 1作成形體9。尚且,電漿離子注 入前的成形物之水蒗翁读、a , ,、、'軋透過率為11. 7(g/(m2· day)),全光 31 201034849 線透過率為86. 05%。~ 仃 收 收 收 收 收 收 收 收 收 收 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的). This material has a weight average molecular weight of 2, 〇〇〇. Next, the obtained poly-half-stone oxidized solution was dissolved in a scorpion, and the obtained solution (solid content concentration: 2% by mass) was applied onto the same ruthenium film as that used in Example 1 using a Meyer rod. Heating at 125 t for 6 hours to harden 'to obtain a shaped article having a layer of polyoxo oxide having a thickness of 1 QGnm. On the surface of the layer of the double-cut oxygen-fired layer after the hardening, the plasma ionization device was used. In the same manner as in the example i, the plasma was ion-implanted with nitrogen to form the body 7. Further, the weight average molecular weight is a value in terms of polystyrene measured by gel permeation chromatography. Further, the water vapor transmission rate of the molded article before plasma ion implantation was 12.1 (g/(m2.day)), and the total light was transmitted through 89.10%. Then, in the same manner as in Example 1, the ion in the molded body 7 was passed. The injected polyorgano-oxygen compound layer 1 is formed by a magnetron sputtering method to form an ITG film having a thickness of 5 (11111) as a conductor layer to form a film having a substrate layer (10)-A layer. A layered body 7 composed of a layer of a nitrogen-implanted polyorganosiloxane compound-B layer (IT0 film). (Example 8) Example 7 was used except that argon (Ar) was used as the plasma generating gas. Similarly, the molded body 8 was produced. 30 201034849 Next, in the same manner as in the first embodiment, 'on the ion-implanted polyorgano-oxygen compound layer of the molded body 8', a magnetically controlled sputtering method was used to form a conductive layer. A film of a thickness of 50 nm in the bulk layer is formed to form a laminate of a layer having a base layer (ρΕτ film)-Α layer (a polyorganosiloxane containing compound layer of argon ion implantation)_β layer (I TO film). 8. (Example 9) 〇〇 mixed with 7.94 g of UOnrnol) phenyl trimethoxy decane (Tokyo Chemicals Co., Ltd.) Corporation), 20ml of toluene, and distilled water i〇mi g (lmmol) phosphoric acid (Kanto Chemical Co., Ltd.), so at room temperature for 24 hours. After completion of the reaction, a saturated aqueous solution of sodium hydrogencarbonate was added to the mixture, and ethyl acetate (100 ml) was added to the mixture, and the organic layer was separated. After washing the organic layer twice with steamed water, it was dried with anhydrous sulfuric acid, and magnesium sulfate was separated by filtration. The resulting filtrate was dropped into a large amount of n-hexane to make it sink. After the separation was completed by decantation, the precipitate was dissolved in THF and recovered. The thf was distilled off under reduced pressure by an evaporator, and vacuum-dried was carried out to obtain a polyepitazepine (polyorgano-oxygen: compound) having a ladder-like structure. This material had a weight average molecular weight of 16 Å. Next, using the Meiya rod, the obtained solution of the polyp-semiconductor 6 'sampling/recombining in the sputum (solid content concentration: 2% by mass) was applied to the sinus sinus. On the PET film, 'at 12 5 C plus 6 small iv ... b] is known to harden, and a layer of polytetramethylene oxide having a thickness of 1 〇〇 nm is obtained. After hardening The surface of the layer of polysilsesquioxane was separated from the left-input device by using a plasma. In the same manner as in Example 1, the plasma was ion-implanted with nitrogen, and the formed body 9 was made from the top. Further, before plasma ion implantation 05%。 The formation of the water 蒗 蒗 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、

其次,與實施例1同樣地,在成形體9之經離子注入 的聚有機矽氧烷系化合物層上,藉由磁控濺鍍法,形成當 作導電體層的厚度5〇mn之ΙΤ0膜,以製作具有基材層(pET 薄膜)-A層(經氮離子注入的聚有機矽氧烷系化合物層)_b 層(I TO膜)的層構成之層積體9。 (實施例10) 除了使用氬(Ar)當作電漿生成氣體以外,與實施例9 同樣地製作成形體1 〇。Then, in the same manner as in the first embodiment, a 〇0 film having a thickness of 5 〇 is formed as a conductor layer on the ion-implanted polyorganosiloxane compound layer of the molded body 9 by a magnetron sputtering method. A laminate 9 having a layer of a base layer (pET film)-A layer (a polyorganosiloxane containing compound layer of nitrogen ion implantation) _b layer (I TO film) was produced. (Example 10) A molded article 1 was produced in the same manner as in Example 9 except that argon (Ar) was used as the plasma generating gas.

其次,與實施例1同樣地,在成形體10之經離子注入 的I有機石夕氧燒系化合物層上,藉由磁控濺鑛法,形成當 作導電體層的厚度5〇nm之ΙΤ0膜,以製作具有基材層(pET 薄臈)-A層(經氬離子注入的聚有機矽氧烷系化合物層)_b 層(ITO膜)的層構成之層積體。 (實施例1 1 ) 於聚對苯二曱酸乙二酯薄膜(三菱樹脂公司製,「 PET38T 300」,厚度38/zm)(以下稱為「pET薄膜」)上, k佈聚有機矽氧烷系化合物(信越化學工業公司製,以聚 二甲胃基矽氧烷當作主成分的聚矽氧樹脂,「KS835」),將 所:之塗膜在120。。加# 2分鐘’而在pET薄膜上形成含 有厚度lOOnrn的聚二曱基矽氧烷之層(以下稱為「聚有機矽 氧烷系化合物層」)。接著,使用電聚離子注入裝置,於聚 有機石夕氧烧系化合物層的表面,離子注入氨。 以下顯示離子注入的條件。 32 201034849 •電漿生成氣體:氩 •負載(Duty)比:1%Then, in the same manner as in the example 1, a 〇0 film having a thickness of 5 〇 nm as a conductor layer was formed on the ion-implanted I-organo-oxygen compound layer of the formed body 10 by magnetron sputtering. A laminate having a layer of a base layer (pET thin layer)-A layer (polyorganosiloxane containing compound layer of argon ion implantation)_b layer (ITO film) was produced. (Example 1 1 ) On a polyethylene terephthalate film ("PET38T 300", thickness 38/zm) (hereinafter referred to as "pET film") manufactured by Mitsubishi Plastics Co., Ltd. The alkane-based compound (a polyoxyxylene resin having a polydimethyl methoxy oxane as a main component, "KS835") manufactured by Shin-Etsu Chemical Co., Ltd., has a coating film of 120. . A layer of polydidecyloxyne having a thickness of 100 nrn (hereinafter referred to as "polyorganosiloxane compound layer") was formed on the pET film by adding #2 minutes. Next, ammonia was ion-implanted on the surface of the polyorgano-oxygen compound layer using an electro-polyion implantation apparatus. The conditions for ion implantation are shown below. 32 201034849 • Plasma generated gas: argon • Duty ratio: 1%

•重複頻率:1 00 0Hz •外加電壓·· -l〇kV RF電源·頻率ΐ3· 56MHz,外加電力1〇〇〇评 •室内壓:0. 2Pa •脈衝寬:5 μ s e c •處理時間:5分鐘 •速度· 0.2m /分鐘 其次,在經離子注入的聚有機矽氧烷系化合物層上, 與實地例1同樣地’藉由磁控濺鍍法,形成當作導電體層 的厚度50ηπι之IT0膜,以盤你目士甘 作具有基材層(PET薄膜)_α層 (經鼠離子注入的聚有機發羞ρ备几人 y乳院糸化合物層)-Β層(ΙΤ0膜) 的層構成之層積體11。 以下顯示濺鍍的條件。 ❹ •電漿生成氣體:氬、氧 •氣體流量;氬lOOsccm,氧5sccm •電力值;1500W •室内壓:0. 2Pa •線速度:0. 2m/min •濺鍍標靶:IT0 (實施例12) 入所用的電漿生成氣體 11同樣地,製作具有基 除了以實施例11中,將離子注 由氬氣改變成氮氣以外,與實施例 33 201034849 材層(PET薄膜)—A層(經氮離子注入的聚有機矽氧烷系4 合物層)-B層(ΙΤ0膜)之層構成的層積體12。 糸化 (實施例13) 於實施例11所製作的層積體11之PET薄 付联的不形成 聚有機矽氧烷系化合物層之面側,與實施例丨丨同樣地开,、 聚有機矽氧烷系化合物層,對該聚有機矽氧烷系化人物= 進行離子注入,以製作A層(經氬離子注入的聚有機矽2二 系化合物層)-基材層(PET薄膜)_A層(經氬離子注入的= 有機矽氧烷系化合物層)-B層(1了〇膜)的層構成 , j 2 \ &lt;臂積體 (貫施例14) 除了於實施例11中,濺鍍標靶為鋁,濺鍍中的電漿生 成氣體為氬(lOOsccm)以外,進行與實施例u同樣的操作 ’代替ITO膜’形成厚度50nm的鋁膜,以製作具有基材層 (PET薄膜)-A層(經氬電漿離子注入的聚有機碎氧统系^匕 合物層)-B層(鋁膜)的層構成之層積體14。 (實施例1 5 ) 與實施例11同樣地,在PET薄膜上形成聚有機矽氧烷 系化合物層,離子注入氬。於經離子注入的聚有機矽氧烷 系化合物層上,藉由磁控濺鍍法,形成當作無機化合物層 的厚度50nm之氮化矽膜。以下顯示濺鍍的條件。 •電漿生成氣體:氬、氮 •氣體流量:氬lOOsccm,氮60sccm• Repeat frequency: 1 00 0Hz • Applied voltage ···l〇kV RF power supply · Frequency ΐ3· 56MHz, plus power 1 • • Indoor pressure: 0. 2Pa • Pulse width: 5 μ sec • Processing time: 5 Minutes, speed, and 0.2 m / min. Next, on the ion-implanted polyorganosiloxane compound layer, in the same manner as in the case of the example 1, the thickness of the conductor layer was formed by the magnetron sputtering method. Membrane, the layer of your layer is composed of a substrate layer (PET film) _α layer (poly-organic shim ρ prepared by rat ion implantation) Β layer (ΙΤ0 film) layer composition The layered body 11 is. The conditions for sputtering are shown below. ❹ • Plasma generated gas: argon, oxygen, gas flow; argon lOOsccm, oxygen 5sccm • power value; 1500W • Indoor pressure: 0. 2Pa • Line speed: 0. 2m/min • Sputter target: IT0 (Example 12) The plasma generating gas 11 used for the same was prepared in the same manner as in Example 11, except that the ion implantation was changed from argon gas to nitrogen gas, and Example 33 201034849 material layer (PET film)-A layer (via A layered body 12 composed of a layer of a nitrogen-ion-implanted polyorganosiloxane derivative layer)-B layer (ΙΤ0 film). In the same manner as in Example ,, the organic layer of the laminate 11 produced in Example 11 was thinly formed on the surface side of the non-polyorganosiloxane compound layer. A siloxane-based compound layer is ion-implanted to the polyorganosiloxane-based person to produce an A layer (polyorganofluorene 2 bis compound layer argon ion-implanted)-substrate layer (PET film)_A Layer (layer of argon ion-implanted = organooxane-based compound layer) - layer of layer B (1 ruthenium film), j 2 \ &lt; arm assembly (Example 14) Except in Example 11, The sputtering target was aluminum, and the plasma generation gas in the sputtering was argon (100 sccm), and the same operation as in Example u was performed, instead of the ITO film, to form an aluminum film having a thickness of 50 nm to prepare a substrate layer (PET). A laminate 14 composed of a layer of a film A layer (a layer of a polyorganic oxide system ion-implanted with an argon plasma ion) and a layer B (aluminum film). (Example 1 5) A polyorganosiloxane compound layer was formed on a PET film in the same manner as in Example 11, and argon was ion-implanted. On the ion-implanted polyorganosiloxane compound layer, a tantalum nitride film having a thickness of 50 nm as an inorganic compound layer was formed by magnetron sputtering. The conditions for sputtering are shown below. • Plasma generated gas: argon, nitrogen • Gas flow: argon lOOsccm, nitrogen 60sccm

•電力值:2500W 34 201034849 •室内壓:0. 2Pa •線速度:0. 2m/mi η •濺鑛標乾:S i 其次,於所形成的氮化石夕膜表面上,與實施例11同樣 地,藉由磁控濺鍍法,形成厚度50nm的1忉層,以製作具 有基材層(PET薄膜)-A層(經氬離子注入的聚有機秒氧烧 層)-無機化合物層-B層(ITO膜)的層構成之層積體15。 (比較例1 ) Ο 除了不進行離子注入以外,與實施例丨同樣地製作成 形體。即,在PET薄膜上形成含聚二曱基矽氧烷的層,而 成為成形體16。藉由磁控濺鍍法,形成當作導.電體層的厚 度50nm之ΙΤ0膜,以製作具有基材層(PET薄膜含聚二 曱基石夕氧院的層-B層(I T0膜)的層構成之層積體16。 (比較例2) 於實施例11所用的PET薄膜上,藉由磁控濺鍍法,形 Ο 成當作導電體層的厚度50mn之ΙΤ0膜,以製作具有基材層 (PET薄膜)—B層(I TO膜)的層構成之層積體π。濺鍍的條 件係與實施例1 1同樣。 (比較例3) 除了於實施例11中,在PET薄膜上,不形成聚有機石夕 氧院系化合物層,而藉由磁控濺鍍法形成厚度5〇nm的氮化 石夕膜以外’進行與實施例11同樣的操作,以製作具有基材 (PET薄膜無機化合物層(氮化矽膜)-B層(IT0膜)的層構 成之層積體18。以下顯示氮化矽膜形成中的濺鍍條件。 35 201034849 •電漿生成氣體:氬、氮 •氣體流量:氬1 OOsccm ’氮60sccm •電力值:25〇〇f •室内壓:〇. 2pa •線速度,Q. 2m/mi π •濺鐘標乾:S i 圖4〜14 +顯示由實施例卜1〇及比較例丨之成形體 1〜1 〇、16的XPS的元素分析測定所得之氧原子碳原子 及矽原子的存在比例之分析結果。 〜14中,縱軸表示當氧原子、碳原子及矽原子# 存在量之合計為⑽時的原子之存在比雜),橫軸表示滅 ㈣累計時間(sputterTime,分鐘)。由於騰鑛的速度係 固疋’故濺鍍的累計時間(Sputter Time)係對應於深度。 圖4 :4中’ a係碳原子的存在比例’ b係氧原子的存在比 例’ c係梦原子的存在比例。 如圖4〜1 3所示地 表面起朝向深度方向, 子的存在比例逐漸增加 1 4所示地,於比較例J 存在。 ’在成形體1〜1〇中,確認具有自 氧原子的存在比例逐漸減少、碳原 的區域(阻氣層)。另一方面,如圖 的成形體1中,如上述的區域係不 β硕不,但是在成 ’一^ 7|&gt; ^ 1 i 〜1。 ψ ,; 與成形體1〜1 0同樣地, ‘ 確 &lt; 自表面起朝向深度方向,| 原子的存在比例逐漸減少、 厌原子存在比例逐漸增加的届 域(阻氣層)係存在。 36 201034849 表1中顯不測定實施例1〜1 〇的成形體之阻氣層(自表 面起朝向深度方向,層中的氧原子之存在逐漸減少、碳原 子的存在比例逐漸增加的區域)表層部中的氧原子、碳原子 及矽原子之存在比例,以及矽原子的2ρ電子軌域之鍵量的 尖峰位置之結果。• Power value: 2500W 34 201034849 • Indoor pressure: 0. 2Pa • Line speed: 0. 2m/mi η • Sputtered dry: S i Next, on the surface of the formed nitride film, the same as in the eleventh embodiment To form a 1 忉 layer having a thickness of 50 nm by magnetron sputtering to form a substrate layer (PET film)-A layer (polyorganic oxy-oxygen layer by argon ion implantation)-inorganic compound layer-B A laminate 15 composed of a layer of a layer (ITO film). (Comparative Example 1) 形成 A shaped body was produced in the same manner as in Example Ο except that ion implantation was not performed. That is, a layer containing polydiindenyl alkane is formed on the PET film to form a molded body 16. A 50 nm-thick ΙΤ0 film was formed as a conductive layer by a magnetron sputtering method to fabricate a substrate layer (a PET film containing a layer-B layer (I T0 film) of a polydimethyl sulfoxide compound). The layered body 16 was laminated. (Comparative Example 2) On the PET film used in Example 11, a film of 50 mm thick as a conductor layer was formed by magnetron sputtering to prepare a substrate. Layer (PET film) - layered body π composed of layers of layer B (I TO film). The conditions of sputtering were the same as in Example 11. (Comparative Example 3) In addition to Example 11, on PET film The same procedure as in Example 11 was carried out except that a polyorganismite compound layer was not formed, and a nitride film having a thickness of 5 〇 nm was formed by magnetron sputtering to prepare a substrate (PET film). A layered body 18 composed of a layer of an inorganic compound layer (yttrium nitride film)-B layer (IT0 film). The sputtering conditions in the formation of a tantalum nitride film are shown below. 35 201034849 • Plasma generating gas: argon, nitrogen • Gas flow rate: argon 1 OOsccm 'nitrogen 60sccm • Power value: 25〇〇f • Indoor pressure: 〇. 2pa • Line speed, Q. 2m/mi π • Splashing clock dry: S i Fig. 4 to 14 + shows the oxygen atom carbon atom and germanium atom determined by elemental analysis of XPS of the molded article 1 to 1 of the example and the comparative example In the case of ~14, the vertical axis represents the existence ratio of atoms when the total amount of oxygen atoms, carbon atoms, and helium atoms # is (10), and the horizontal axis represents the cumulative time of (four) cumulative time (sputterTime, minutes). Since the velocity of the ore deposit is fixed, the cumulative time of sputtering is corresponding to the depth. Figure 4: The ratio of the presence of 'a carbon atoms' in 'B' is the ratio of the existence of oxygen atoms' c dream As shown in Fig. 4 to Fig. 3, the surface is oriented in the depth direction, and the existence ratio of the sub-section is gradually increased by 14 as shown in Comparative Example J. 'In the molded body 1 to 1〇, it is confirmed that The ratio of the presence of oxygen atoms is gradually reduced, and the area of the carbon atoms (gas barrier layer). On the other hand, in the molded body 1 as shown in the figure, the above-mentioned region is not β, but it is in the form of 'a ^ 7| ^ 1 i 〜1. ψ ,; Same as the molded body 1 to 1 0, 'definitely &lt; From the surface toward the depth direction, the existence ratio of the atoms gradually decreases, and the domain in which the proportion of anatomical atoms gradually increases (gas barrier layer) exists. 36 201034849 The molded bodies of Examples 1 to 1 are not shown in Table 1. a gas barrier layer (a region in which the presence of oxygen atoms in the layer gradually decreases from the surface toward the depth direction, and the proportion of carbon atoms gradually increases), the proportion of oxygen atoms, carbon atoms, and germanium atoms in the surface layer portion, and germanium atoms The result of the peak position of the bond amount of the 2ρ electronic domain.

再者貝施例1〜1〇的成形體之阻氣層的經電漿離子 注入面係表面,經電漿離子注入的面之以前述方法的測定 值,係阻氣層表層部的氧原子、碳原子及矽原子之存在比 例’以及矽原子的2Ρ電子執域之鍵量的尖峰位置。 又,原子的存在比例,係以測定所得的氧原子、浐原 子及;5夕原子之尖峰面積的合計值為1 田各原子的尖峰 面積所算出的值。Further, the surface of the gas barrier layer of the molded body of the molded article of Example 1 to 1 is subjected to the plasma ion implantation surface, and the surface of the plasma ion implanted surface is measured by the above method, and the oxygen atom of the surface layer of the gas barrier layer is The ratio of the existence of carbon atoms and helium atoms, and the peak position of the bond amount of the two electrons of the helium atom. Further, the ratio of the atomic existence is a value obtained by measuring the total area of the peaks of the obtained oxygen atom, the sulfonium atom, and the cerium atom of the cerium atom.

[表1][Table 1]

37 201034849 根據表1 ’成形體1〜10的阻氣層表面之矽原子的2p 電子軌域之鍵能的尖峰位置係1〇29eV〜l〇33eV。 又圖15中顯示對於實施例2所製作的成形體2,藉 由xps分析’測定石夕原子的2p電子軌域之鍵能的結果。圖 15中,縱軸表示尖峰強度’橫軸表示鍵能(eV)。根據圖15 ,成形體2的矽原子之2p電子執域的鍵能(B)之尖峰位置 係103· 3eV。此成形體2的矽原子之2p電子執域的鍵能之 尖峰位置,在離子注入前以,相當於比較例丨)係1〇1.5“ ,在離子注入後確認係位移到丨〇3. 3eV的高能量側。 ❹ 其次,對於實施例1〜15及比較例丨〜3所得之層積體 1〜18,測定表面粗糙度Ra(nm)、水蒸氣透過率、表面電 阻率、可見光透過率,而且進行密接性試驗。下述表2中 顯示測定結果及評價結果。 [表2] 層積體 Ra (nm) 水蒸氣透過率 [g/(mz*day)] 表面電阻率· (Ω/Π) __實施例1 1 1 0.31 0.08 83.5 實施例2 ------ 2 0.28 0.06 82.8 實施例3 3 0. 33 0.51 81.4 一 施例4 4 0.25 0.09 82.1 5 5 0.41 0.28 81.1 列 6 6 0.38 0.21 83.2 _^施例7 7 0.29 0.12 83.4 __^施例8 8 0.31 &lt;0. 01 83.2 實施例9 9 0.42 &lt;0.01 81.1 密接性試驗 (良0〜5差) 38 201034849 81.5 78.2 0 82.7 75.0 0 83.5 74.6 0 83.7 68.9 0 5. 5 0 0 84.0 82.0 1 85.2 82.7 0 75.0 80.4 0 一 _ 84.3 78.1 0 _37 201034849 According to Table 1, the peak position of the bond energy of the 2p electron domain of the germanium atom on the surface of the gas barrier layer of the molded bodies 1 to 10 is 1〇29eV to l〇33eV. Further, Fig. 15 shows the results of measuring the bond energy of the 2p electron domain of the Shixia atom by the xps analysis of the molded body 2 produced in the second embodiment. In Fig. 15, the vertical axis represents the peak intensity and the horizontal axis represents the bond energy (eV). According to Fig. 15, the peak position of the bond energy (B) of the 2p electron domain of the germanium atom of the molded body 2 is 103·3 eV. The peak position of the bond energy of the 2p electron region of the bismuth atom of the molded body 2 is 1〇1.5" before the ion implantation, and the strain is shifted to 丨〇3. 3eV after the ion implantation. Next, the laminates 1 to 18 obtained in Examples 1 to 15 and Comparative Examples 丨 to 3 were measured for surface roughness Ra (nm), water vapor transmission rate, surface resistivity, and visible light transmittance. The adhesion test was carried out. The measurement results and evaluation results are shown in Table 2. [Table 2] Laminated body Ra (nm) Water vapor transmission rate [g/(mz*day)] Surface resistivity · (Ω/ Π) __Example 1 1 1 0.31 0.08 83.5 Example 2 ------ 2 0.28 0.06 82.8 Example 3 3 0. 33 0.51 81.4 One Example 4 4 0.25 0.09 82.1 5 5 0.41 0.28 81.1 Column 6 6 0.38 0.21 83.2 _^Example 7 7 0.29 0.12 83.4 __^ Example 8 8 0.31 &lt; 0. 01 83.2 Example 9 9 0.42 &lt; 0.01 81.1 Adhesion test (good 0 to 5 difference) 38 201034849 81.5 78.2 0 82.7 75.0 0 83.5 74.6 0 83.7 68.9 0 5. 5 0 0 84.0 82.0 1 85.2 82.7 0 75.0 80.4 0 A _ 84.3 78.1 0 _

❹ 〇 L ^ 1 ,N、叫付硎疋極限[0.01gAm、day)j。 根據表1 ’實施例1〜1 ^s n 5的層積體係阻氣性優異(水蒸 氣透過率的值小),而且透 還月〖生(層積體14除外)優異。又 ’實施例1〜1 5的層積妒夕道$ 、之v电體層係表面平滑,導電性 亦優異-【圖式簡單說明】 的層積體之層積構造的圖。 中所使用的電漿離子注入裝 圖1 (a )〜(f )係顯示本發明 圖2(a)、(b)係顯示本發明 置之概略構成的圖。 圖 1尔顯 不本發明中所使用 圖 的濺鍍裝置之概略構成 山圖“系表示實施例i的成形體i之阻氣層中,氧原子 碳原子及矽原子的存在比例(%)之圖。 山圖5係表示實施例2的成形體2之阻氣層中,氧原子 炭原子及石夕原子的存在比例(% )之圖。 圖6係表示實施例3的成形體3之阻氣層中氧原子 39 201034849 、碳原子及矽原子的存在比例(%)之圖。 圖7係表示實施例4的成形體4之阻氣層中,氧原子 '碳原子及矽原子的存在比例(%)之圖。 圖8係表示實施例5的成形體5之阻氣層 山 H 1 乳原子 、石炭原子及矽原子的存在比例(%)之圖。 圖9係表示實施例6的成形體6之阻氣層中,氧原子 、碳原子及矽原子的存在比例(%)之圖。 圖1 〇係表示實施例7的成形體7之阻氣層中,氧原子 '石厌原子及矽原子的存在比例(%)之圖。 圖11係表示實施例8的成形體8之阻氣層中,氧原子 、石厌原子及矽原子的存在比例(%)之圖。 圖12係表示實施例9的成形體9之阻氣層中,氧原子 灭原子及石夕原子的存在比例(%)之圖。 、 圖1 3係表示實施例i 〇的成形體丨〇之阻氣層中,氧原 子、碳原子及矽原子的存在比例(%)之圖。 圖14係表示比較例i的成形體丨9之阻氣 j、2:山広7 W Τ ίΐ原 反原子及矽原子的存在比例(%)之圖。 圖15係表示實施例2的成形體2之阻氣層的分析 中,矽原子的2p電子軌域之鍵能分布的圖。 【主要元件符號說明】 1 薄膜狀層積體 2a、2b旋轉罐 3a、3b捲出幸昆 40 201034849 4 電漿放電用電極 5 a、5 b捲取親 6a、6b送出用輥 7 脈衝電源 8 標乾 9 南電堡脈衝 10a、10b氣體導入口 11a 、 lib 室❹ 〇 L ^ 1 , N, called the limit [0.01gAm, day) j. According to Table 1, the laminated system of Examples 1 to 1 ^s n 5 is excellent in gas barrier properties (the value of the water vapor transmission rate is small), and it is excellent in the release of the moon (except for the laminate 14). Further, in the first to fifth embodiments, the layer of the electric layer is smooth, and the electric conductivity is excellent, and the electroconductivity is also excellent - a simple structure of the laminated structure of the laminate. Plasma ion implantation apparatus used in the drawings Fig. 1 (a) to (f) show the present invention. Fig. 2 (a) and (b) are views showing a schematic configuration of the present invention. Fig. 1 is a schematic view showing a schematic diagram of a sputtering apparatus used in the drawing of the present invention. "The ratio (%) of oxygen atomic carbon atoms and germanium atoms in the gas barrier layer of the molded body i of the example i is shown. Fig. 5 is a view showing the ratio (%) of the oxygen atomic carbon atoms and the cerium atoms in the gas barrier layer of the molded article 2 of Example 2. Fig. 6 is a view showing the formation of the molded body 3 of Example 3. Fig. 7 is a graph showing the ratio of the presence of oxygen atoms 'carbon atoms and germanium atoms in the gas barrier layer of the molded body 4 of Example 4 in the gas layer. Fig. 8 is a view showing the ratio (%) of the gas barrier layer H 1 milk atom, the carboniferous atom and the ruthenium atom of the molded article 5 of the fifth embodiment. Fig. 9 shows the formation of the embodiment 6. A graph showing the ratio (%) of oxygen atoms, carbon atoms, and ruthenium atoms in the gas barrier layer of the body 6. Fig. 1 shows that the oxygen atom of the molded body 7 of the seventh embodiment has an oxygen atom Fig. 11 is a view showing the oxygen generation in the gas barrier layer of the molded body 8 of Example 8. Fig. 12 is a view showing the ratio (%) of the atomic atoms of the oxygen atom and the presence of the cerium atom in the gas barrier layer of the molded article 9 of the ninth embodiment. Fig. 13 is a view showing the ratio (%) of oxygen atoms, carbon atoms, and germanium atoms in the gas barrier layer of the molded article of Example i. Fig. 14 is a view showing a molded body of Comparative Example i. The gas barrier j, 2: Hawthorn 7 W Τ ΐ 之 之 图 图 图 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Diagram of bond energy distribution of 2p electronic rail domain [Description of main component symbols] 1 Film-like laminate 2a, 2b Rotating tanks 3a, 3b rolled out of Yukun 40 201034849 4 Electrode discharge electrodes 5 a, 5 b Pro 6a, 6b send roller 7 pulse power supply 8 standard dry 9 Nandian Fort 10a, 10b gas inlet 11a, lib room

4141

Claims (1)

201034849 七申明專利範圍: I-種層積體,具有由至少含有氧原+、破原子及石夕 原子的材料所構成的阻氣層與導電體層, 其特徵在於: &amp;自前述阻氣層的表面起朝向深度方向,該阻氣層中的 氧原子之存在比例係逐漸減少,碳原子的存在比例係逐漸 .如甲請專利範圍第i項之層積體,其中於前述阻氣 入的表層部中,相對於氧原子、碳原子及石夕原子的存在量 王體:言,氧原子的存在比例為1q〜7q%、碳原子的存在 歹·'·、10〜70% ’矽原子的存在比例為5〜35%。 請專利範圍第!項之層積體,其中前述阻氣層 在Ο亥阻氣層的表声邱夕γ &amp; # | 原子的a電子㈣ 分光(as)測定中,石夕 電子執域之鍵能的尖峰位置係1〇2〜 4. 如申請專利範圍第!項之層積 化合物層。 、甲更具有無機 5. 如申請專利範圍第!項之層積體, 係於含聚有機矽氣ρ /、中則述阻氣層 。 機夕氧坑系化合物的層中,注入離子而得之層 6·如申請專利範圍第5項之層積體, 由氮、ϋ、与 &gt; '、T則述離子# 虱、虱所組成族群所選出的至 ’、 子化者。 種氣體經離 #7.如申μ專利範圍第5項之層積體,其、、 石夕氧燒系化合物传呈右 則述聚有機 、有下返所示的⑷或⑻所示的重複單 42 201034849 位之聚有機石夕氧^&gt; · /Rx \ 一 -S201034849 Qi Shenming Patent Range: I-layered laminate having a gas barrier layer and a conductor layer composed of a material containing at least an oxygen source +, a broken atom and a stone atom, characterized in that: &amp; The surface is oriented in the depth direction, the proportion of oxygen atoms in the gas barrier layer is gradually reduced, and the proportion of carbon atoms is gradually increased. For example, the layered body of the i-th aspect of the patent scope is included in the gas barrier. In the surface layer, the amount of oxygen atoms, carbon atoms, and Shixia atoms is present. The ratio of the presence of oxygen atoms is 1q to 7q%, and the presence of carbon atoms 歹·'·, 10~70% '矽 atoms The ratio of existence is 5 to 35%. Please patent scope! a layered body in which the aforementioned gas barrier layer is in the surface of the gas barrier layer of the Ο 邱 γ γ γ γ γ γ γ γ γ γ γ γ 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 测定 石 石 石 石 石 石 石 石 石 石 石Department 1〇2~ 4. Apply for patent scope! The layer of the compound layer. A, more inorganic. 5. For example, the scope of patent application! The layered body of the term is composed of a polyorganic helium gas ρ /, and a gas barrier layer. In the layer of the compound of the oxygen-oxygen system, the layer is implanted with ions. The laminate of the fifth aspect of the patent application is composed of nitrogen, helium, and &gt;, T, and ions #虱, 虱. The group selected by the group to the ', child. The gas is separated from the #7., as in the layered body of the fifth item of the patent application scope, the compound of the shixi oxygen-burning compound is distributed to the right, and the repeating is shown in (4) or (8). Single 42 201034849 Poly Organic Stone Oxygen ^&gt; · /Rx \ 一-S ^ τ ,κχ Ry各自獨立地表矛 取代基的烷基、I取代u亡、i原子、無取代或具有 右敌μ 代或具有取代基的烯基、盎取代或且 有取代基的芳基等之非 …取代飞” ❹ t式尚且,式⑷的複數之 的Rx係不2個皆為氫原子。目η或不同,惟,前述式(a) 8. 一種層積體之製造方法, 的層積體之製造方法,1且古“ 孔層”導電體層 石夕氧燒系化合物的層之成开;错由在表面部具有含聚有機 合物的層中注入離子而带成1前述含聚有機石夕氧境系化 少成則述阻氣層之步驟(I )。 乂 9.如申請專利範圍第8項之層積體之製造方法 則述步驟(I)係將由氮、 — 其中 乳、虱及氦所組成族群所選屮从 少一種之氣體離子化及注人之步驟。 選出的至 10.如争請專利範圍第8項之製造方法 (ο係電漿離子注入。 r引述步驟 43 201034849 11. 如申請專利範圍第8項之製造方法,其中前述步驟 (I)係邊在一定方向中搬送表面部具有含聚有機矽氧烷系 化合物的層之長條狀成形物,邊將離子注入前述含聚有機 石夕氧烧系化合物的層中之步驟。 12. —種電子裝置用構造,由申請專利範圍第1至7項 中任一項之層積體所成。 13. —種電子裝置,包括申請專利範圍第12項之電子 裝置用構造。 44^ τ , κ χ Ry each independently an alkyl group of a spear substituent, an I substituted u, an i atom, an unsubstituted or an alkenyl group having a right enemy or a substituent, an aryl group substituted with an or substituted group, and the like In addition, the Rx system of the plural of the formula (4) is not a hydrogen atom. The η or the difference, except the above formula (a) 8. A method of manufacturing a laminate, a method for producing a laminate, wherein the layer of the ancient "hole layer" conductor layer is formed by opening a layer; the layer is formed by injecting ions into a layer having a polyorganic compound at the surface portion. Step (I) of the method for producing a gas barrier layer according to the eighth aspect of the patent application, wherein the step (I) is carried out by nitrogen, wherein The group consisting of milk, sputum and sputum is selected from a small number of gas ionization and injection steps. Selected to 10. The manufacturing method of claim 8 of the patent scope (o plasma ion implantation. r quote) Step 43 201034849 11. The manufacturing method of claim 8, wherein the aforementioned step (I) A step of transferring ions into a layer containing the polyorgano-oxygen-based compound while carrying a long strip-shaped molded article having a layer containing a polyorganosiloxane compound in a certain direction. 12. A structure for an electronic device, which is formed by a laminate of any one of claims 1 to 7. 13. An electronic device comprising the structure for an electronic device of claim 12 of the patent application.
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EP2397324A4 (en) 2013-08-07
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