TW201032949A - Method of grinding roller - Google Patents

Method of grinding roller Download PDF

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Publication number
TW201032949A
TW201032949A TW098145159A TW98145159A TW201032949A TW 201032949 A TW201032949 A TW 201032949A TW 098145159 A TW098145159 A TW 098145159A TW 98145159 A TW98145159 A TW 98145159A TW 201032949 A TW201032949 A TW 201032949A
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TW
Taiwan
Prior art keywords
roller
drum
grinding
bearing
ground
Prior art date
Application number
TW098145159A
Other languages
Chinese (zh)
Other versions
TWI501836B (en
Inventor
Masafumi Matsunaga
Masayuki Yunoki
Kouki Terao
Original Assignee
Nordson Corp
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Publication of TW201032949A publication Critical patent/TW201032949A/en
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Publication of TWI501836B publication Critical patent/TWI501836B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/36Single-purpose machines or devices
    • B24B5/37Single-purpose machines or devices for grinding rolls, e.g. barrel-shaped rolls
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B28/00Maintaining rolls or rolling equipment in effective condition
    • B21B28/02Maintaining rolls in effective condition, e.g. reconditioning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/04Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/35Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/04Rigid drums for carrying flexible material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention provides a roller grinding method for obtaining a roller with good roundness. The grinding method includes: a first step performing the centering of the first roller (17), which uses a grinding device (31) to grind the outer periphery (17c) and the bearing part (17b) at both ends of the first roller (17) to make the roundness of the first roller (17) within 25 μm at room temperature; a second step, attaching the bearing (19) and bearing bracket (23) to the bearing part (17b); a third step, fixing the bearing bracket (23) to the base (5); a fourth step, rotating the first roller (17); and a fifth step, rotating the second roller (3) with roundness within 3 μm and having a grinding mechanism (29) at outer periphery (3c) thereof, and then pressing the second roller (3) against the outer periphery (17c) of the first roller (17) to grind the outer periphery (17c) of the first roller (17).

Description

201032949 、 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種滾筒研磨方法。 【先前技術】 先前,在壓延機之滾筒研磨中,已有可將工作滾筒在組 入於滾筒轴承座之狀態下進行研磨之滾筒研磨裝置(例如 參照專利文獻1)。 另,已有可研磨組入於壓延機之工作滾筒及支撐滾筒之 在線滾筒修磨機(例如參照專利文獻2)。 該等裝置為防止由於滚筒之替換組裝或在將滾筒運至維 修廠時所導致之生產效率下降,而在滾筒已組入於壓延機 之狀態下研磨滾筒者。 另,有一種滾筒研磨方法,其為了在更短之時間内再研 磨從壓延機取出之壓延滾筒,而以遍及壓延滾筒之本體部 表面全長之方式喷射溫度經控制之研磨劑,藉此使壓延滾 筒保持在比較接近於壓延作業時之溫度,使磨石與壓延滾 筒之本體部表面接觸而進行研磨。(例如參照專利文獻3)。 另,有一種研磨裝置,其藉由調節研磨頭與被加工物間 之接觸面溫度而改變接觸面應力分佈,以抑制被加工物之 平滑度、平面度及平行度產生差異,而具有對研磨頭供給 加熱流體以進行加熱之加熱裝置(例如參照專利文獻4)。 另,有一種設有用以將研磨布紙吸附於表面之多數細 孔、及冷卻水用通路之研磨滾筒(例如參照專利文獻5)。 [專利文獻1]曰本特公平5-32124號公報 145386.doc 201032949 [專利文獻2]曰本特開平5-237521號公報 [專利文獻3]日本特開昭58-4343號公報(第4頁右上棚第9 行〜第17行) [專利文獻4]日本特開2002-83791號公報 [專利文獻5]曰本特開2002-355765號公報 【發明内容】 [發明所欲解決之問題] 圖6係顯示對行進於後輥上之網上塗布流體之槽孔喷嘴 ❹ 之圖。 後輥101係朝箭頭A所示方向旋轉。網1〇3被捲繞於後輥 101上,向箭頭B所示方向搬送。槽孔喷嘴1〇5係與後輥ι〇ι 之間隔開微小間隙G而配置。從槽孔喷嘴丨〇5中噴出之流體 係塗布於網103上。 (幾何學形狀之影響) 爲了以均一厚度在網103上塗布流體,槽孔噴嘴1〇5與後 輥101間之間隙G宜在後輥101之一次旋轉中始終保持一 定。若後輥101之正圓度惡化,則在後輥101之一次旋轉中 間隙G會隨著後輥1 〇 1之旋轉而變化。若間隙G變化,則塗 布於網103上之流體之厚度也會變化。因此爲了以均一的 厚度在網103上塗布流體,宜提高後輥1〇1之正圓度。 另,間隙G宜遍及槽孔噴嘴1〇5之全長而為均—。若後輥 101之圓筒度差,則間隙G會在槽孔噴嘴1〇5之長度方向上 變化。若間隙G變化,則塗布於網1〇3上之流體厚度也會變 化。因此爲了遍及槽孔喷嘴105全長、即遍及後輥ι〇ι之滾 145386.doc 201032949 宜提高後輥101之圓筒 筒面長之整個範圍使間隙G均一, 度。 (安裝誤差之影響) 不)及軸承架(未圖 另方面,後親1〇1係藉由轴承(未圖 示)可旋轉地保持。 軸承有容許誤差。轴承之内輪即使是精度等級良好之小 徑之標稱内徑者,亦有例如約2.5微米(μη1)之容許誤差, 而軸承之外輪即使是精度等級良好之小徑之標料徑者,’ 亦有例如約4〜5微米(㈣之容許誤差。㈣,保持轴承之 軸承架上亦有約3〜5微米(_)之容許誤差 之容許誤差,由爪Β1514所規定之内輪及外輪== 度可知,除圓錐滾動轴承以外之徑向轴承中内輪之標稱 軸承内徑為18〜30時,在精度等級為2級下之平均内徑Ζ寸 差為上0〜下-2.5 μπι,精度等級為5級時為上〇〜下_6 另,標稱軸承内徑為80〜120 mm之情形時,精度等級為2 級之平均内徑尺寸差為上0〜下-5,,精度等級為5級時為 上0〜下-10 μιη。外輪之標稱軸承外徑為5〇〜8〇爪瓜之情形 時,精度等級為2級之平均外徑尺寸差為上〇〜下_4 μιη,精 度等級為5級時為上0〜下-9 μηι ’另’標稱軸承外徑為 150〜180 mm時,精度等級為2級之平均外徑尺寸差為上〇〜 下-7 μιη,精度等級為5級時為上〇〜下_13 μπι。 因此。將後輥101介以軸承安裝於轴承架時,由於該等 谷許誤差,會使後輥101之旋轉產生振動。即使提高後輥 101之正圓度及圓筒度,但由於軸承及軸承架之安裝誤 145386.doc 201032949 差,仍會使後報之旋轉產生振動。後親⑻之振動會使 後輥1〇1與槽孔喷嘴1〇5間之間隙〇變化。因此,間隙〇在 遍及後輥101之滚筒面長之整個範圍内變得不固定導致 塗布於網103上之流體厚度變化。 (溫度所造成之影響)201032949, VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a barrel grinding method. [Prior Art] Conventionally, in the barrel polishing of the calender, there has been a barrel polishing apparatus which can grind the work roll in a state of being incorporated in the roll chock (for example, refer to Patent Document 1). Further, there has been an in-line drum dresser which can be ground into a work roll of a calender and a support roll (for example, refer to Patent Document 2). These devices are used to prevent the production efficiency from degrading due to the replacement of the drum or the transport of the drum to the repair shop, and the drum is ground in a state where the drum has been incorporated into the calender. Further, there is a barrel polishing method for injecting a temperature-controlled abrasive in a manner of re-polishing a calender roll taken out from a calender in a shorter time so as to extend the entire length of the surface of the body portion of the calender roll, thereby causing calendering The roller is held at a temperature relatively close to that of the rolling operation, and the grinding stone is brought into contact with the surface of the body portion of the calender roll to be ground. (For example, refer to Patent Document 3). In addition, there is a polishing apparatus which changes the contact surface stress distribution by adjusting the temperature of the contact surface between the polishing head and the workpiece to suppress the difference in smoothness, flatness, and parallelism of the workpiece, and has a grinding effect. A heating device that supplies a heating fluid to the head for heating (for example, refer to Patent Document 4). Further, there is a polishing drum provided with a plurality of pores for adsorbing the abrasive paper on the surface and a passage for cooling water (see, for example, Patent Document 5). [Patent Document 1] Japanese Patent Laid-Open No. Hei 5-237521 (Patent Document 3) JP-A-58-4343 (P. 4) [Patent Document 4] JP-A-2002-83791 [Patent Document 5] JP-A-2002-355765 [Summary of the Invention] [Problems to be Solved by the Invention] The 6 series shows a view of the slot nozzle 对 for the web coating fluid traveling on the back roll. The rear roller 101 is rotated in the direction indicated by the arrow A. The net 1〇3 is wound around the rear roll 101 and conveyed in the direction indicated by the arrow B. The slot nozzle 1〇5 is disposed with a small gap G between the rear roller and the rear roller ι〇. The fluid ejected from the slot nozzles 5 is applied to the mesh 103. (Influence of geometric shape) In order to apply a fluid to the mesh 103 with a uniform thickness, the gap G between the slot nozzle 1〇5 and the rear roller 101 is preferably kept constant in one rotation of the rear roller 101. If the roundness of the rear roller 101 is deteriorated, the gap G changes with the rotation of the rear roller 1 〇 1 in one rotation of the rear roller 101. If the gap G changes, the thickness of the fluid applied to the mesh 103 also changes. Therefore, in order to apply a fluid to the net 103 with a uniform thickness, it is preferable to increase the roundness of the rear roll 1〇1. In addition, the gap G should be uniform throughout the entire length of the slot nozzle 1〇5. If the cylinder of the rear roller 101 is inferior, the gap G changes in the longitudinal direction of the slot nozzle 1〇5. If the gap G changes, the thickness of the fluid applied to the mesh 1〇3 also changes. Therefore, in order to extend over the entire length of the slot nozzle 105, i.e., over the roll 145386.doc 201032949, it is preferable to increase the entire range of the cylinder length of the rear roller 101 so that the gap G is uniform. (Impact of installation error) No) and the bearing frame (not shown in other aspects, the rear parent 1〇1 is rotatably held by a bearing (not shown). The bearing has a tolerance. The inner wheel of the bearing is of good precision. The nominal inner diameter of the small diameter also has an allowable error of, for example, about 2.5 micrometers (μη1), and the outer diameter of the bearing is even a standard diameter of a small diameter with a good accuracy level, 'for example, about 4 to 5 micrometers ( (4) The allowable error. (4) There is also an allowable error of the tolerance of about 3 to 5 micrometers (_) on the bearing frame of the bearing. The inner and outer wheels defined by the claws 1514 are == degrees, except for the tapered roller bearings. When the inner diameter of the nominal bearing of the inner ring of the radial bearing is 18~30, the average inner diameter Ζ difference under the accuracy level of 2 is upper 0~low-2.5 μπι, and the accuracy grade is 5 when it is upper 〇~下_6 In addition, when the nominal bearing inner diameter is 80~120 mm, the average inner diameter size difference of the accuracy grade is 2 to 0~5, and the accuracy level is 5 to 0~ -10 μιη. When the outer diameter of the nominal bearing of the outer wheel is 5〇~8〇 claws, the accuracy level The average outer diameter difference of level 2 is upper 〇~low _4 μιη, and the accuracy level is 5 when the upper 0~low-9 μηι 'other' nominal bearing outer diameter is 150~180 mm, the accuracy grade is 2 The average outer diameter difference of the level is upper ~ lower ~ 7 μιη, and the upper level is lower than the lower level = 13 μπι. Therefore, when the rear roller 101 is mounted on the bearing frame by the bearing, due to the valley The error will cause the rotation of the rear roller 101 to vibrate. Even if the roundness and the cylinder of the rear roller 101 are increased, the rotation of the bearing and the bearing frame is 145386.doc 201032949, which will cause the subsequent rotation to occur. The vibration of the rear parent (8) changes the gap 后 between the rear roller 1〇1 and the slot nozzle 1〇5. Therefore, the gap 变得 becomes unfixed over the entire length of the drum surface of the rear roller 101, resulting in coating. The thickness of the fluid on the mesh 103 changes. (The effect of temperature)

從槽孔喷嘴1〇5塗布流體時,後輕1〇1有時會被加熱至特 定溫度。即使是在室溫下正圓度與圓筒度良好之後親 101,仍會由於溫度上升使得後輥101產生扭曲之問題在 室溫下研磨之滾筒若被加熱至特定之使用溫度,則有時會 產生正圓度之差異。例如^溫度上升6代,正圓度會產生 多達±30微米之誤差。 特別是後輥101之構造複雜之情形下,溫度上升所造成 之後輥101之變形會變大。若後輥之構造簡單,則溫度之 影響較少,但在後輥構造複雜時,溫度影響較大。 (壓力所造成之影響) 在後輥1 〇 1上η又置用以流通加熱媒體或冷卻媒體之通 路,以調整溫度。 例如以約0.1〜0_7 之壓力向後輥之通路供給熱 媒。通路一旦受到熱媒之壓力,則後輥ι〇ι將會膨脹而變 形。 是以,本發明之目的在於提供一種用以獲得正圓度良好 之滾筒之滾筒研磨方法。 另本發月之目的在於提供一種可使安裝於轴承組立體 之滾筒之振動減小之滾筒研磨方法。 145386.doc 201032949 另,本發明之目的在於提供一種溫度對於滾筒變形之影 響較小之滾筒研磨方法。 另,本發明之目的在於提供一種壓力對於滾筒變形之影 響較少之滾筒研磨方法。 〜 [解決問題之技術手段] 用以解決前述問題之本發明係採如下之研磨方法。 即’在滾筒研磨方法中,設置: 第一步驟’其係進行第一滾筒(17)之定心,以研磨裝置 (31)研磨該第一滾筒(17)之外周面(i7c)與兩端之轴承部 (17b)’使該第丨滾筒(17)在室溫下之正圓度為乃㈣以内;養 第二步驟,其係將軸承(19)及轴承架(23)裝附於該轴 部(17b); 第二步驟,其係將該軸承架(23)固定於基座(5) ; 第四步驟,其係使該第一滾筒(17)旋轉;及 第五步驟,其係使具有3 _以内之正圓度且在外周面 ⑽上具備研磨機構(29)之第二滾筒⑺旋轉將該第二滾 筒⑺魔抵於該第-滾筒(17)之該外周面(i7c)上而研磨該_ 第一滾筒(17)之該外周面(17c)。 藉此’可將第一滾筒(17)安裝於轴承組立體(24),而研 磨處於實際使用狀態下之第一滾筒〇7)。藉此可使第一 · 滾筒(17)之旋轉振動減小。 再者,如前述之抽承,其内輪、外輪會因精度等級而有 尺寸差,當購入並使用精度等級良好,例如與5級相比為2 級之轴承之情形時,雖一般交貨期長且價袼亦高,但本發 I45386.doc -8 - 201032949 明中即使將精度等級低、例如5級之尺寸差較大之轴承(19) 使用於轴承組立體(24),亦可研磨處於實際使用狀態下之 第一滾筒(17) ’因此可以交貨期短且低價之轴承使第一滾 筒(17)之旋轉振動減小。 該第一滾筒(17)之直徑(dl)可為該第二滾筒(3)之直徑 (d2)之2倍以上。 藉由使第二滾筒(3)之直徑(d2)較小,可容易地製作正圓 度良好之第二滾筒。 該第一滚筒(17)之外周面(17c)可藉由加熱機構(27)予以 加熱或藉由冷卻機構(27)予以冷卻。 藉此,可將第一滾筒(17)之外周面(17c)之溫度調整至實 際使用溫度。藉由以實際使用溫度研磨第一滚筒(丨7)之外 周面(17c),可使溫度變化賦予第一滾筒(17)之變形之影響 減小。 該第二滚筒(3)之該外周面(3勹可藉由加熱機構(25)予以 加熱或藉由冷卻機構(25)予以冷卻。 藉此,可使第二滾筒(3)之外周面(3c)之溫度調整至與第 一滾筒(17)之實際使用溫度相同,或比其低2〇<t左右之溫 度。 該第一滚筒(17)及/或該第二滾筒(3)之内部,可藉由使 熱媒在該第一滾筒(17)及/或該第二滾筒内部循環之加 熱機構(25、27)予以加熱,或藉由冷卻機構(25、2乃予以 冷卻。 藉由控制熱媒之溫度,可調整該第一滾筒(17)及/或該第 145386.doc -9· 201032949 二滾筒(3)之溫度。 該第-滾筒(17)之内部可形成層狀(35a、35b、35c)之複 數之流體流路(37、38、39J。 藉由將使用熱媒時之熱媒壓力(例如〇 2 Mpa)施加於第一 滾筒(17)而進行研磨,可使因壓力而變形之影響減少。再 者,藉由將用以吸附網之真空壓力施加於第一滾筒(17)而 進行研磨,可使因壓力而變形之影響減少。 該第一滾筒(17)與該第二滚筒(3)之溫度差可在2〇t以 内0 該第一滾筒(17)之面長(L1)可為該第二滚筒(3)之面長 (L2)之1/2以下。 該研磨機構可以是對該第二滾筒(3)捲繞成螺旋而設置 之研磨帶(29)。 如述第五步驟較佳可包含:最初以粗磨粒之研磨帶研磨 該第一滾筒(17)之該外周面(17c)之步驟,及其後以細磨粒 之研磨帶精加工該第一滾筒(17)之該外周面(17c)之步驟。 前述第五步驟可包含:研磨該第一滾筒(17)之該外周面 (17c) ’直到該第一滾筒(17)之振動為5 μηι以内為止之步 驟。 [發明之效果] 根據本發明之一實施例所研磨之第一滾筒之旋轉振動變 小°藉此,將第一滾筒作為槽孔喷嘴之後輥使用時,可以 均一的膜厚對網上塗布流體。 根據本發明之一實施例’可獲得正圓度良好之滾筒。 145386.doc -10- 201032949 另,根據本發明之一實施例,可使安裝於軸承組立體之 滾筒之旋轉振動減小。 另,根據本發明之一實施例,可使溫度對於滾筒變形之 影響較小。 另’根據本發明之一實施例,可使壓力對於滾筒變形之 影響較小。 另,根據本發明之一實施例,可研磨複雜構造之滾筒。 【實施方式】 以下,基於較佳之實施形態,參照附圖說明本發明。惟 以下之實施形態所記載之構成零件之尺寸、材質、形狀、 其相對配置等只要無特別特定之記載,則非將本發明之範 圍限定於其者。 (研磨裝置) 圖1係顯示研磨裝置1之立體圖。 研磨装置1具備研磨滾筒(第二滾筒)3。研磨滾筒3係能 夠以軸線X為中心而旋轉地設於基台(基座)5上。研磨滾筒 3之兩端部由軸承7予以支持。軸承7由軸承架9予以保持。 轴承架9固定於台丨丨上。台丨丨之兩端部由軌條^予以支 持。軌條13固定於基台台!丨藉由驅動裝置^而沿著轴 線Y於軌條13上滑動。轴線γ相對於研磨滾筒3之軸線Μ垂 直。 ^ 所要研磨之滾筒(第一滾筒)17係能夠以轴線χ2為中心而 旋轉地設於基台5上。所要研磨之滾筒17之轴線&大致平 行於研磨滾筒3之軸線X1而配置。所要研磨之滾筒Η立兩 145386.doc 201032949 端之軸承部17b由轴承19予以支持。軸承19由軸承架23予 以保持。軸承19及軸承架23構成轴承組立體24。將軸承組 立體24安裝於基台5上,所要研磨之滾筒17即為實際使用 狀態。 研磨滾筒3及所要研磨之滾筒17藉由馬達(未圖示)予以 旋轉。 研磨滾筒3與熱媒供給管25連接。熱媒從熱媒供給管25 向研磨滾筒3之内部供給。所要研磨之滾筒17與熱媒供給 管27連接。熱媒從熱媒供給官27向滾筒17之内部供給。 _ 研磨滾筒(第二滾筒)3之正圓度在3微米以内。研磨滾筒 3之研磨帶29捲繞成螺旋狀。 圖2係顯示所要研磨之滾筒(第一滾筒)17之滾筒部分 之直徑dl與研磨滾筒(第二滾筒)3之滾筒部分&之直徑们之 圖。爲了提高研磨滾筒3之正圓度,研磨滾筒3之直徑“最 好為較小。因此,研磨滾筒3之直徑d2最好為小於所要研 f之滾筒17之直徑dl。更佳為,所要研磨之滾筒(第一滾 同)17之直徑dl係研磨滾筒(第二滾筒)3之直徑d2之2倍以 Θ 上。 ° 圖3係顯示所要研磨之滾筒(第一滾筒)ΐ7之面長u與研 磨滾筒(第二滚筒)3之面長L2之圖。此處,滚筒面長是指 不含轴承部(轴頸)3b、17b之滾筒部分3a、Μ之轴方向之 長度實施例中,將所要研磨之滾筒(第一滾筒)17之面 長L1設定為研磨滚筒(第二滾筒)3之面長之m以下。 (研磨方法) 145386.doc 12 201032949 圖4係顯示以圓筒研磨機所研磨之滾筒之圖。如圖4所 示,藉由圓筒研磨機(未圖示)之中心33進行所要研磨之滾 筒(第一滾筒)17之定心。以圓筒研磨機(未圖示)之砂輪31 研磨所要研磨之滾筒17之滾筒部分17a之外周面17c與^端 之軸承部17b。藉此,使滾筒17之外周面17c之正圓度在室 溫下為25微米以内。 如圖1所示,在經圓筒研磨機研磨之滾筒(第一滾筒)Η 之軸承部17b安裝軸承19。 將軸承19裝附於軸承架23上。 將軸承架23安裝於基台5上。藉此,所要研磨之滾筒η 即成為實施使用狀態。 藉由馬達(未圖示)使所要研磨之滾筒(第一滾筒口7旋 轉。 ❹ 在正圓度3 μιη«内之研磨滾筒(第二滾筒)3之外周面氕 上將研磨帶29捲繞成螺旋狀’藉由馬達(未圖示)旋轉研磨 滾筒3。使台η藉由驅動裝置15向所要研磨之滾筒(第一滚 筒)17移動,使旋轉中之研磨滾筒3與旋轉中之滾_之外 周面17c抵接,而研磨外周面17c。 在藉由滾筒U研磨外周面17c之步驟中,可首先以粗磨 粒之研磨帶研磨滾筒17之外周面17c,接著將粗磨粒之研 磨帶交換為細磨粒之研磨帶,以細磨粒之研磨帶精加工滾 筒17之外周面17。。例如,亦可最初以支數⑷為320目或 320目以下之粗粒度(磨粒)之研磨帶進行研磨,接著以彻 目或400目以上之細粒度之研磨帶進行精加工。另,更佳 145386.doc -13- 201032949 為,最初以320目或320目以下之粗粒度之研磨帶進行研 磨,接著以400〜6 00目之細粒度之研磨帶進行中間研磨, 然後以1000目或1 〇〇〇目以上之更細粒度之研磨帶進行精加 工。如此’階段性地使用從粗磨粒至細磨粒之研磨帶而修 復表面彳貝傷’最終可獲得精加工良好之研磨面,可縮短整 體之研磨時間而迅速進行研磨。再者,該支數之數值(目 數)原本表示每1平方英吋(2 5.4 mm)之篩目之數目,為磨粒 (研磨材)之粒度大小之單位’越粗磨粒者數值越少,越細 磨粒者數值越大。作為研磨帶之種類,例如可使用三共理 化(股)公司製之Mirror Film(商品名)系列等。 本實施例中,以研磨滾筒3研磨該滚筒17之外周面丨7e, 直到所要研磨之滾筒(第一滚筒)17之振動在達到5微米以内 為止。此處,滾筒之正圓度係將滾筒定心而以其為基準 者,另一方面’滾筒之振動是指將滾筒組入於軸承組立體 24並介由轴承19使其旋轉時之滚筒表面之振動。 再者’亦可加熱或冷卻所要研磨之滚筒(第一滾筒口7, 將所要研磨之滾筒(第一滾筒)17之外周面17c之溫度調整至 實際之使用溫度。可從熱媒供給管27向滾筒17内部供給加 熱媒體而加熱所要研磨之滾筒(第一滾筒)17。或者可從熱 媒供給管27向滾筒17内部供給冷卻媒體而冷卻滾筒17。藉 此,在研磨所要研磨之滾筒(第一滚筒)17時,可將滾筒口 之外周面17c之溫度調整至實際可使用之溫度。藉由以實 際之使用溫度研磨滾筒17,可使溫度對滾筒17之研磨精度 之影響減小。 又 145386.doc •14- 201032949 另,亦可加熱或冷卻研磨滾筒(第二滾筒)3,而調整滾 筒3之滾筒部分3a之外周面孔之溫度。可從熱媒供給管乃 向滾筒3内部供給加熱媒體而加熱研磨滾筒(第二滾筒”。 或者可從熱媒供給管25向滾筒3内部供給冷卻媒體而冷卻 滾筒3。藉此。研磨所要研磨之滾筒(第一滾筒)17時,可調 整滾筒3之外周面孔之溫度。於研磨時,可將研磨滾筒^之 溫度調整至與所要研磨之滾筒17之溫度相同。研磨滾筒3 之溫度亦可與所要研磨之滾筒17之實際使用溫度之差相同 ® 或低於其20 C左右。即,於研磨時,研磨滾筒3與所要研 磨之滾筒17之溫度差可在〇艺〜20。(:範圍内。 圖5係所要研磨之滾筒(第一滾筒)之滾筒部分之部分剖 面圖。 所要研磨之滾筒(第一滾筒)17之滚筒部分17a之内部,以 層狀形成複數之流體流路。滾筒部分17&之内侧層35a,將 用以通過熱媒之熱媒流路37形成為螺旋狀。向熱媒流路37 參供給加熱媒體或冷卻媒體,而調整所要研磨之滾筒(第一 滾筒)17之溫度。以約oj^jMPa之壓力供給熱媒。若熱 媒對滾筒1 7施加壓力’則滾筒會膨脹而變形。爲了使壓力 對研磨精度之影響減小’將滾筒1 7之使用時之壓力(例如 0.2 MPa)施加於流體流路而研磨滾筒17。 滾筒部分17a之中間層35b形成用以供給真空壓力之吸引 通路38。對吸引通路38供給約-90 kPa之真空壓力。在滾筒 部分17a之外側層35c設有多數之吸引孔39。吸引孔39與吸 引通路38連通❶藉此,在滾筒17上被搬送之網會被吸附於 145386.doc .15- 201032949 滚筒17。 μ者本實施例中,所要研磨之滾筒(第一滾筒)17之圓 t可較Μ ’、要滾筒不會振動’則無需特別注意圓筒 度。 將根據本實施例所研磨之第—滾筒作為槽孔噴嘴之後棍 吏用時彳以均-之膜厚對網上塗布流體。將流體作為熱 溶材料之情形中,可以1〇微米以下之穩定之膜厚將熱溶材 料塗布於網上。 (研磨滾筒3之製作) 研磨滾筒3之製作中,研磨滚筒3之直徑若較小,可以先 前之研磨方法製作正圓度及圓筒度優良之滾筒。但,先前 之方法中,要以優良精度製作直徑大之滾筒製作則有困 難。 但,有時亦需要使用到直徑大之研磨滾筒3。為製作直 徑大之研磨滾筒,首先製作高正圓度之直徑小之原滾筒。 然後將该原滾筒作為研磨滾筒,利用本發明之研磨方法, 研磨直徑大之滾筒。原滚筒之直徑可使用5〇 mm〜2〇〇瓜瓜 者。原滚筒之直徑越小越易控制原滚筒之正圓度之精度。 原滾筒可以是簡單構造,因為其不易熱變形之故。原滾筒 亦可膨脹。原滚筒亦可沿著旋轉軸線設置貫通孔,藉由對 貫通孔流入油而加熱。 使所需研磨之直徑大之滾筒以每分鐘旋轉丨次之旋轉速 度旋轉,使原滾筒以每分鐘旋轉數百次之旋轉速度旋轉。 右要將原滾同之旋轉速度抑制在約2〇〇 rpm以下,原滚筒 145386.doc -16 - 201032949 之直徑不可過小。 之研磨方法 將直徑大之滾筒作為原滚筒,亦可以本發明 研磨更大直徑之滚筒’而製作直後大之原滾筒 如此,可製作成直徑大之研磨滾筒3。 (變形例) 但本發明不限於上 以上參照上述實施例說明了本發明 述實施例。When the fluid is applied from the slot nozzle 1〇5, the rear light 1〇1 is sometimes heated to a specific temperature. Even if the roundness and the cylinder are good at room temperature, the pro-101 will cause the back roll 101 to be distorted due to the temperature rise. If the drum is polished at room temperature, it is sometimes heated to a specific use temperature. Will produce a difference in roundness. For example, if the temperature rises by 6 generations, the roundness will produce an error of up to ±30 μm. In particular, in the case where the structure of the rear roller 101 is complicated, the deformation of the roller 101 becomes large after the temperature rises. If the structure of the rear roller is simple, the influence of temperature is small, but when the structure of the rear roller is complicated, the temperature influence is large. (Impact caused by pressure) η is placed on the rear roller 1 〇 1 to circulate the heating medium or the cooling medium to adjust the temperature. For example, the heat medium is supplied to the passage of the rear roller at a pressure of about 0.1 to 0-7. Once the passage is pressurized by the heat medium, the rear roll ι〇ι will expand and deform. Therefore, it is an object of the present invention to provide a drum grinding method for obtaining a drum having a good roundness. Another object of the present invention is to provide a drum grinding method which can reduce the vibration of a drum mounted on a three-dimensional bearing group. 145386.doc 201032949 In addition, it is an object of the present invention to provide a drum grinding method in which the influence of temperature on the deformation of the drum is small. Further, it is an object of the present invention to provide a drum grinding method in which the influence of pressure on the deformation of the drum is small. ~ [Technical means for solving the problem] The present invention for solving the above problems employs the following grinding method. That is, in the barrel polishing method, the first step is performed to perform centering of the first roller (17), and the outer peripheral surface (i7c) and both ends of the first roller (17) are ground by the grinding device (31). The bearing portion (17b)' makes the roundness of the second roller (17) at room temperature to be (4); in the second step, the bearing (19) and the bearing frame (23) are attached thereto. a shaft portion (17b); a second step of fixing the bearing frame (23) to the base (5); a fourth step of rotating the first roller (17); and a fifth step Rotating the second roller (7) having a roundness of 3 _ and having a grinding mechanism (29) on the outer peripheral surface (10) to the outer circumference (i7c) of the second roller (7) The outer peripheral surface (17c) of the first roller (17) is ground. Thereby, the first roller (17) can be mounted to the bearing set solid (24), and the first roller 〇 7) in the actual use state can be ground. Thereby, the rotational vibration of the first roller (17) can be reduced. Furthermore, as described above, the inner and outer wheels may have a dimensional difference due to the accuracy level, and when the purchase and use accuracy level is good, for example, the case of a class 2 bearing compared to the fifth class, although the general delivery date Long and high price, but this bearing I45386.doc -8 - 201032949 even if the precision level is low, for example, the bearing with a large difference in size of 5 (19) is used in the bearing group three-dimensional (24), can also be ground The first roller (17) in the actual use state can therefore reduce the rotational vibration of the first roller (17) with a short delivery and low cost bearing. The diameter (dl) of the first roller (17) may be more than twice the diameter (d2) of the second roller (3). By making the diameter (d2) of the second roller (3) small, it is possible to easily produce a second roller having a good roundness. The outer peripheral surface (17c) of the first roller (17) can be heated by a heating mechanism (27) or cooled by a cooling mechanism (27). Thereby, the temperature of the outer peripheral surface (17c) of the first roller (17) can be adjusted to the actual use temperature. By grinding the outer peripheral surface (17c) of the first roller (丨7) at the actual use temperature, the influence of the temperature change on the deformation of the first roller (17) can be reduced. The outer peripheral surface of the second roller (3) can be heated by the heating mechanism (25) or cooled by the cooling mechanism (25). Thereby, the outer circumference of the second roller (3) can be made ( The temperature of 3c) is adjusted to be the same as the actual use temperature of the first drum (17), or lower than the temperature of 2 〇 < t. The first drum (17) and/or the second drum (3) The inside can be heated by heating means (25, 27) circulating the heat medium inside the first drum (17) and/or the second drum, or by cooling means (25, 2). The temperature of the heat medium can be adjusted to adjust the temperature of the first roller (17) and/or the second roller (3) of the 145386.doc -9. 201032949. The inside of the first roller (17) can be layered ( a plurality of fluid flow paths (37, 38, 39J) of 35a, 35b, 35c). by applying a heat medium pressure (for example, M2 Mpa) when using a heat medium to the first roller (17), it is possible to perform grinding. The influence of the deformation due to the pressure is reduced. Further, by applying the vacuum pressure for the adsorption net to the first roller (17), the grinding can be performed. The influence of the force and deformation is reduced. The temperature difference between the first roller (17) and the second roller (3) may be within 2 〇t. 0 The face length (L1) of the first roller (17) may be the second The surface length (L2) of the drum (3) is 1/2 or less. The grinding mechanism may be a grinding belt (29) provided by winding the second drum (3) into a spiral. The method comprises the steps of: grinding the outer peripheral surface (17c) of the first roller (17) with a grinding belt of coarse abrasive grains, and then finishing the outer circumference of the first roller (17) with a grinding belt of fine abrasive grains. Step of the surface (17c). The fifth step may include: grinding the outer peripheral surface (17c) of the first roller (17) until the vibration of the first roller (17) is within 5 μηι. Effect] The rotational vibration of the first roller polished according to an embodiment of the present invention becomes smaller. Thereby, when the first roller is used as a roller after the slot nozzle, the fluid can be applied to the mesh with a uniform film thickness. An embodiment of the present invention can obtain a roller having a good roundness. 145386.doc -10- 201032949 In addition, according to the present invention In one embodiment, the rotational vibration of the drum mounted on the three-dimensional bearing set can be reduced. Further, according to an embodiment of the present invention, the influence of temperature on the deformation of the drum can be made small. Further, according to an embodiment of the present invention Further, the influence of the pressure on the deformation of the drum can be made small. Further, according to an embodiment of the present invention, the drum of the complicated structure can be ground. [Embodiment] Hereinafter, the present invention will be described with reference to the drawings based on preferred embodiments. The dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the invention unless otherwise specified. (Grinding Apparatus) FIG. 1 is a perspective view showing the polishing apparatus 1. The polishing apparatus 1 is provided with a polishing drum (second drum) 3. The polishing drum 3 is rotatably provided on the base (base) 5 around the axis X. Both ends of the grinding drum 3 are supported by bearings 7. The bearing 7 is held by the bearing frame 9. The bearing frame 9 is fixed to the table. Both ends of the platform are supported by rails ^. The rail 13 is fixed to the abutment!滑动 slides on the rail 13 along the axis Y by the driving device ^. The axis γ is perpendicular to the axis of the grinding drum 3. The roller (first roller) 17 to be ground can be rotatably provided on the base 5 around the axis χ2. The axis & of the drum 17 to be ground is arranged substantially parallel to the axis X1 of the grinding drum 3. The roller to be ground stands two 145386.doc The bearing portion 17b of the 201032949 end is supported by the bearing 19. The bearing 19 is held by the bearing frame 23. The bearing 19 and the bearing frame 23 constitute a bearing assembly stereo 24 . The bearing set stereo 24 is mounted on the base 5, and the drum 17 to be ground is in actual use. The polishing drum 3 and the drum 17 to be polished are rotated by a motor (not shown). The polishing drum 3 is connected to the heat medium supply pipe 25. The heat medium is supplied from the heat medium supply pipe 25 to the inside of the polishing drum 3. The drum 17 to be ground is connected to the heat medium supply pipe 27. The heat medium is supplied from the heat medium supply official 27 to the inside of the drum 17. _ The grinding roller (second roller) 3 has a roundness of less than 3 microns. The polishing tape 29 of the grinding drum 3 is wound into a spiral shape. Fig. 2 is a view showing the diameter dl of the drum portion of the drum (first drum) 17 to be ground and the diameter of the drum portion & In order to increase the roundness of the grinding drum 3, the diameter of the grinding drum 3 is preferably "small. Therefore, the diameter d2 of the grinding drum 3 is preferably smaller than the diameter dl of the drum 17 to be grounded. More preferably, it is to be ground. The diameter dl of the drum (first rolling) 17 is twice the diameter d2 of the grinding drum (second drum) 3 to Θ. ° Fig. 3 shows the surface length of the drum (first drum) ΐ 7 to be ground. The surface length L2 of the grinding drum (second drum) 3 is used. Here, the drum surface length refers to the length of the drum portion 3a without the bearing portions ( journals 3b, 17b) and the length of the cymbal in the axial direction. The surface length L1 of the drum (first drum) 17 to be ground is set to be m or less of the surface length of the polishing drum (second drum) 3. (Grinding method) 145386.doc 12 201032949 Fig. 4 shows a cylindrical grinding machine A diagram of the ground roller. As shown in Fig. 4, the center of the cylindrical grinding machine (not shown) 33 is used to center the roller (first roller) 17 to be ground. The grinding wheel 31 of the grinding wheel 31 grinds the outer peripheral surface 17c and the end of the drum portion 17a of the drum 17 to be ground. The bearing portion 17b is formed so that the roundness of the outer peripheral surface 17c of the drum 17 is within 25 μm at room temperature. As shown in Fig. 1, the drum (first drum) is ground by a cylindrical grinder. The bearing portion 17b is attached to the bearing 19. The bearing 19 is attached to the bearing frame 23. The bearing frame 23 is attached to the base 5. Thereby, the drum η to be polished is in an operational state. The drum to be ground (the first roller opening 7 is rotated. ❹ The grinding belt 29 is wound into a spiral shape on the outer peripheral surface of the grinding drum (second roller) 3 in the roundness 3 μιη« by the motor (not shown) rotates the polishing drum 3. The table n is moved by the driving device 15 to the drum (first roller) 17 to be polished, and the rotating polishing drum 3 is brought into contact with the rolling outer peripheral surface 17c. The outer peripheral surface 17c is ground. In the step of grinding the outer peripheral surface 17c by the drum U, the outer peripheral surface 17c of the drum 17 may be first ground with a coarse abrasive abrasive belt, and then the abrasive belt of the coarse abrasive grains is exchanged into fine abrasive grains. Grinding tape, finishing the outer circumference of the drum 17 with a fine abrasive abrasive belt 17. For example, it is also possible to initially grind a grinding belt having a coarse particle size (abrasive grain) of 320 mesh or less with a count of (4), and then perform finishing with a fine-grained abrasive tape of 400 mesh or more. In addition, it is better to 145386.doc -13- 201032949, initially grinding with a coarse-grained abrasive belt of 320 mesh or less, followed by intermediate grinding with a fine-grained abrasive belt of 400 to 600 mesh, and then 1000 Finishing of finer-grained abrasive belts with a mesh size of 1 or more. This is a step-by-step use of abrasive belts from coarse abrasive to fine abrasive to repair surface mussel injuries. The polished surface can be quickly ground by shortening the overall grinding time. Furthermore, the value of the count (mesh) originally represents the number of meshes per square inch (2 5.4 mm), which is the unit of the particle size of the abrasive particles (abrasive material). Less, the finer the abrasive, the larger the value. As the type of the polishing tape, for example, a Mirror Film (trade name) series manufactured by Sankyo Co., Ltd., or the like can be used. In the present embodiment, the outer peripheral surface 丨 7e of the drum 17 is ground by the grinding drum 3 until the vibration of the drum (first drum) 17 to be ground reaches within 5 μm. Here, the roundness of the drum is centered on the drum and used as a reference. On the other hand, the vibration of the drum refers to the surface of the drum when the drum is assembled into the bearing group stereo 24 and rotated by the bearing 19. Vibration. Furthermore, it is also possible to heat or cool the drum to be ground (the first roller opening 7 to adjust the temperature of the outer peripheral surface 17c of the drum (first drum) 17 to be ground to the actual use temperature. The heat medium supply pipe 27 can be supplied. The heating medium is supplied to the inside of the drum 17 to heat the drum (first drum) 17 to be ground. Alternatively, the cooling medium can be supplied from the heat medium supply pipe 27 to the inside of the drum 17 to cool the drum 17. Thereby, the drum to be ground is ground ( When the first roller 17 is 17, the temperature of the outer peripheral surface 17c of the drum opening can be adjusted to the temperature which can be actually used. By grinding the drum 17 at the actual use temperature, the influence of the temperature on the polishing accuracy of the drum 17 can be reduced. Further, 145386.doc • 14- 201032949 Alternatively, the grinding drum (second drum) 3 may be heated or cooled, and the temperature of the outer peripheral surface of the drum portion 3a of the drum 3 may be adjusted. The heat medium supply pipe may be supplied to the inside of the drum 3. The polishing drum (the second drum) is heated by heating the medium. Alternatively, the cooling medium can be supplied from the heat medium supply pipe 25 to the inside of the drum 3 to cool the drum 3. Thereby, the drum to be ground is ground. When a roller is 17, the temperature of the outer peripheral surface of the drum 3 can be adjusted. During the grinding, the temperature of the grinding drum can be adjusted to be the same as the temperature of the drum 17 to be ground. The temperature of the grinding drum 3 can also be polished. The difference in the actual use temperature of the drum 17 is the same as or lower than about 20 C. That is, the temperature difference between the grinding drum 3 and the drum 17 to be ground can be in the range of 〜 -20. (: within the range of grinding. Figure 5 A partial cross-sectional view of the drum portion of the drum (first drum) to be ground. The inside of the drum portion 17a of the drum (first drum) 17 to be ground is formed into a plurality of fluid flow paths in a layered manner. The drum portion 17 & The inner layer 35a is formed in a spiral shape by a heat medium flow path 37 through a heat medium, and a heating medium or a cooling medium is supplied to the heat medium flow path 37 to adjust the temperature of the drum (first drum) 17 to be polished. The heat medium is supplied at a pressure of about oj^jMPa. If the heat medium applies pressure to the drum 17, the drum expands and deforms. In order to reduce the influence of pressure on the grinding precision, the pressure of the drum 17 is used (for example, 0.2 MPa) is applied to the fluid flow path to grind the drum 17. The intermediate layer 35b of the drum portion 17a forms a suction passage 38 for supplying vacuum pressure. A vacuum pressure of about -90 kPa is supplied to the suction passage 38. The outer layer is outside the drum portion 17a. 35c is provided with a plurality of suction holes 39. The suction holes 39 communicate with the suction passages 38, whereby the net conveyed on the drum 17 is adsorbed to the drum 145386.doc.15-201032949. In this embodiment, The circle t of the roller (first roller) 17 to be grounded may be lower than ', and the roller is not vibrated', so that no particular attention is paid to the degree of cylinder. The first roller that is ground according to the embodiment is used as a slot nozzle after the roller When used, the fluid is applied to the web at a uniform film thickness. In the case where the fluid is used as a hot-melt material, the hot-melt material can be applied to the web at a stable film thickness of 1 μm or less. (Production of the polishing drum 3) In the production of the polishing drum 3, if the diameter of the polishing drum 3 is small, a drum having excellent roundness and cylindricality can be produced by a prior grinding method. However, in the previous method, it is difficult to produce a drum having a large diameter with excellent precision. However, it is sometimes necessary to use a grinding drum 3 having a large diameter. In order to make a grinding drum with a large diameter, firstly, a raw roller having a small diameter of a small roundness is produced. Then, the original drum was used as a grinding drum, and the drum having a large diameter was ground by the grinding method of the present invention. The diameter of the original roller can be 5 〇 mm~2 〇〇 melon. The smaller the diameter of the original roller, the easier it is to control the accuracy of the roundness of the original roller. The original cylinder can be of a simple construction because it is not susceptible to thermal deformation. The original roller can also expand. The original drum may be provided with a through hole along the rotation axis, and is heated by flowing oil into the through hole. The drum having a large diameter to be ground is rotated at a rotation speed of one revolution per minute, and the original drum is rotated at a rotation speed of several hundred rotations per minute. Right, the original roller should be rotated at about 2 rpm, and the diameter of the original roller 145386.doc -16 - 201032949 should not be too small. Grinding method A large diameter drum can be used as the original drum, and the larger diameter drum can be polished by the present invention to produce a straight rear large drum. Thus, the grinding drum 3 having a large diameter can be produced. (Modifications) However, the present invention is not limited to the above. The embodiments of the present invention have been described above with reference to the above embodiments.

本實施例中,將捲繞著研磨帶之滾筒作為研磨滚筒使 用。-般’要提高通常之研磨滾筒之正圓度較為困難。斑 此相對’本實施例之研磨滾筒3係對滾筒捲繞研磨帶者。 滚筒-般可精度優良地製成。另,由於研磨帶之厚度之差 異主要係從研磨帶之錨材中飛出之磨粒之高度差異所致, 因此研磨帶之厚度之差異在約±1微米之範圍内。將研磨帶 對滚筒捲繞成螺旋狀,與所要研磨之滾筒抵接時,研磨帶 表面之凸部被往下壓,使研磨帶之表面變得更為平坦。藉 此,本實施例之研磨滾筒與通常之研磨滚筒相比,可提高 正圓度。 研磨帶可以黏著帶或條帶將兩端固定於滾筒。 本發明不限於研磨帶,亦可以是在滾筒上塗布研磨材 者。研磨材無需為螺旋狀。 滾筒之加熱可使用熱風。 熱媒為熱風之情形時,為避免軸承部受熱,亦可包圍滚 筒而形成熱風之通路,以使熱風不吹到轴承部。 本實施例中,於滾筒上設有用以吸附網之吸引孔。但滾 145386.doc •17- 201032949 筒亦可具有用以噴射空氣之構造。 本發明不限於以上之實施形態,可以在不脫離其特徵事 項之情況下,以其他各種形態實施。因此,前述實施形態 在各方面僅為示例,不得作限定之意義解釋。本發明之範 圍係根據申請專利範圍而表示者,說明書正文無任何約 束。再者,屬於申請專利範圍之均等範圍之變形或變更, 皆在本發明之範圍内。 【圖式簡單說明】 圖1係顯示研磨裝置之立體圖; 圖係顯示所要研磨之滾筒(第一滚筒)之直徑與研磨滾 筒(第二滾筒)之直徑之圖; 圖3係顯示所要研磨之滾筒(第一滚筒)之面長與研磨滾 筒(第二滾筒)之面長之圖; 圖4係顯示以圓筒研磨機所研磨之滚筒之圖·, 圖5係所要研磨之滾筒(第一滾筒)之滾筒部分之部分剖 面圖;及 圖6係顯示對行進於後輥上之網塗布流體之槽孔喷嘴之眷 圖。 【主要元件符號說明】 1 研磨裝置 3 研磨滾筒(第二滾筒) 3a 滾筒部分 3b 軸承部分 3c 外周面 145386.doc •18* 201032949In this embodiment, a drum wound with a grinding belt is used as a grinding drum. It is difficult to increase the roundness of a conventional grinding drum. This is the opposite of the polishing drum 3 of the present embodiment in which the polishing tape is wound around the drum. The drum can be made with excellent precision. Further, since the difference in the thickness of the polishing tape is mainly caused by the difference in height of the abrasive grains flying out from the anchor material of the polishing tape, the difference in the thickness of the polishing tape is in the range of about ± 1 μm. When the polishing tape is wound into a spiral shape, the convex portion on the surface of the polishing tape is pressed downward to make the surface of the polishing tape flatter. Therefore, the grinding drum of the present embodiment can improve the roundness as compared with the conventional grinding drum. The abrasive tape can be attached to the drum by an adhesive tape or a strip. The present invention is not limited to the polishing tape, and may be a coating of a polishing material on a drum. The abrasive material need not be spiral. Hot air can be used for heating the drum. When the heat medium is hot air, in order to prevent the bearing portion from being heated, the drum may be surrounded to form a hot air passage so that the hot air is not blown to the bearing portion. In this embodiment, a suction hole for adsorbing the net is provided on the drum. However, the roll 145386.doc • 17- 201032949 can also have a configuration for jetting air. The present invention is not limited to the above embodiments, and may be embodied in other various forms without departing from the characteristics thereof. Therefore, the foregoing embodiments are merely examples in various aspects and are not to be construed as limiting. The scope of the invention is expressed in terms of the scope of the patent application, and the text of the specification is not subject to any limitation. Further, variations or modifications of the equivalent scope of the claims are intended to be within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a grinding device; the figure shows a diameter of a roller (first roller) to be ground and a diameter of a grinding roller (second roller); and Fig. 3 shows a roller to be ground. Figure 3 is a view showing the length of the surface of the first roller and the surface of the polishing roller (second roller); Figure 4 is a view showing the roller polished by the cylindrical grinding machine, and Figure 5 is the roller to be ground (the first roller) A partial cross-sectional view of the drum portion; and Figure 6 is a plan view showing the slot nozzle for the web coating fluid traveling on the rear roller. [Description of main component symbols] 1 Grinding device 3 Grinding roller (second roller) 3a Roller section 3b Bearing section 3c Outer peripheral surface 145386.doc •18* 201032949

5 7 9 11 13 15 17 17a 17b 17c 19 23 24 25 27 29 31 33 35a 35b 35c 37 38 39 基台(基座) 軸承 軸承架 台 軌條 驅動裝置 所要研磨之滚筒(第一滾筒) 滾筒部分 軸承部 外周面 轴承 軸承架 軸承組立體 熱媒供給管 熱媒供給管 研磨帶 砂輪 中心 内側層 中間層 外側層 熱媒流路 吸引通路 吸引孔 145386.doc -19· 201032949 101 後輥 103 網 105 槽孔喷嘴 dl 第一滚筒之直徑 d2 第二滚筒之直徑 G 間隙 L1 所要研磨之滚筒之面長 L2 研磨滚筒之面長 XI 研磨滾筒之軸線 X2 所要研磨之滚筒之軸線 145386.doc -20-5 7 9 11 13 15 17 17a 17b 17c 19 23 24 25 27 29 31 33 35a 35b 35c 37 38 39 Abutment (base) Bearing bearing frame rail drive unit to be ground (first roller) roller part bearing Outer surface bearing bearing frame bearing set three-dimensional heat medium supply pipe heat medium supply pipe grinding belt grinding wheel center inner layer intermediate layer outer layer heat medium flow path suction passage suction hole 145386.doc -19· 201032949 101 rear roller 103 mesh 105 slot nozzle Dl The diameter of the first roller d2 The diameter of the second roller G The gap L1 The length of the roller to be ground L2 The length of the grinding roller XI The axis of the grinding roller X2 The axis of the roller to be ground 145386.doc -20-

Claims (1)

201032949 七、申請專利範圍: 1. 一種研磨方法,其特徵為具備: 弟一步_,其係進行第一滾筒之定心, 磨該第-滾筒之外周面與兩端之軸研 a金、田π 尺邊第一滾筒 在至/皿下之正圓度為25 μιη以内; 第二步驟,其係、將轴承及軸承架裝附於該輪承部; 第三步驟,其係將該軸承架固定於基座; 第四步驟,其係使該第一滾筒旋轉;及201032949 VII. Patent application scope: 1. A grinding method, which is characterized in that it has: a step _, which is to perform centering of the first roller, grinding the outer circumference of the first roller and the axis of the two ends to form a gold, field The first roller of the π ruler has a roundness of 25 μm or less under the dish; the second step is to attach the bearing and the bearing frame to the wheel bearing; the third step is to mount the bearing frame Fixed to the base; a fourth step of rotating the first roller; and 第五步驟,其係使具有3 μιη以内之正圓度且在外周面 上具備研磨機構之第二滚筒旋轉,將該第二滚筒壓抵於 该第一滾筒之該外周面上,而研磨該第—滾筒之該外周 2. 如請求項1之研磨方法,其中該第一滾筒之直徑(dl)係該 第二滾筒之直徑(£12)之2倍以上。 3. 如π求項1或2之研磨方法,其中該第一滾筒之該外周面 係藉由加熱機構予以加熱或藉由冷卻機構予以冷卻。 4. 如唄求項1至3中任一項之研磨方法’其中第二滾筒之該 外周面係藉由加熱機構予以加熱或藉由冷卻機構予 卻。 5·如請求項3或4之研磨方法,其中該第一滾筒及/或該第二 衷筒之内部’係藉由使熱媒在該第-滾筒及/或該第二滾 筒之内部循環之該加熱機構予以加熱,或藉由該冷卻機 構予以冷卻。 6.如-月求項1至5中任一項之研磨方法,其中該第一滾筒之 145386.doc 201032949 内部形成有層狀之複數之流體流路。 7·如請求項1至6中任一項之研磨方法,其中該第一滾筒與 該第二滾筒之溫度差係在20。(:以内。 8_如請求項1至7中任一項之研磨方法,其中該第—滾筒之 面長(L1)係該第二滾筒之面長(L2)之1/2以下。 5a fifth step of rotating a second drum having a roundness within 3 μm and having a grinding mechanism on the outer peripheral surface, pressing the second roller against the outer peripheral surface of the first roller, and grinding the The outer circumference of the first drum 2. The grinding method of claim 1, wherein the diameter (dl) of the first roller is more than twice the diameter (£12) of the second roller. 3. The polishing method according to π, wherein the outer peripheral surface of the first roller is heated by a heating mechanism or cooled by a cooling mechanism. 4. The grinding method of any one of clauses 1 to 3 wherein the outer peripheral surface of the second roller is heated by a heating mechanism or by a cooling mechanism. 5. The grinding method of claim 3 or 4, wherein the interior of the first roller and/or the second cylinder is circulated by the heat medium inside the first roller and/or the second roller The heating mechanism is heated or cooled by the cooling mechanism. 6. The grinding method of any one of clauses 1 to 5, wherein the first roller has a layered plurality of fluid flow paths formed inside the 145386.doc 201032949. The method of grinding according to any one of claims 1 to 6, wherein the temperature difference between the first roller and the second roller is 20. The grinding method according to any one of claims 1 to 7, wherein the face length (L1) of the first roller is 1/2 or less of the face length (L2) of the second roller. 9.如請求項⑴中任一項之研磨方法,其中該研磨機播在9. The grinding method of any one of the preceding claims, wherein the grinding machine is broadcasted 以内為止之步驟。 其中前述第五步驟包含: 直到該第一滾筒之振動為 145386.docSteps within. The foregoing fifth step includes: until the vibration of the first roller is 145386.doc
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