201030280 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種燈具，尤其是一種確保外界氣流 可順利流通於其内部之燈具。 & 【先前技術】 請參照第1圖所示’習知燈具9係包含一殼體91、 一發光元件92、一散熱模組93及一電路板94。該殼體 • 91之外周壁設有一進風部911及一出風部912 ;該發光元 件92、散熱模組93及電路板94組裝於該殼體之内 部，其中該發光元件92係結合該散熱模組93，該電路板 94則電性連接該發光元件92。藉此，當該發光元件％於 實際使用過程中產生熱源時，則可利用該散熱模組93之 作動，以便經由該進風部911引入外界氣流，並進一步利 用該散熱模組93使該外界氣流經由該出風部912將熱量 傳遞至外界空間，以達到預定之散熱效果，進而可延長診 ❿ 燈具9之使用壽命。 Λ 然而，習知燈具9之電路板94上另設有數個電子元 件95，當該電路板94組裝於該殼體91内部時，各該電 子元件95係位於該殼體91靠近進風部911之一端與該電 路板94之間’導致該電路板94與該殼體91之間必須維 持可供各該電子元件95容置的空間，且由於各該電子元 件95皆具有一軸向高度（h)，故造成該電路板94與該殼 體91之間的距離過大’使該電路板94的實際組裝位置大 致位於該殼體91之進風部911與該散熱模組93之間。因 201030280 此’如第2圖所示’當該散熱模組93欲經由該進風部 911引入外界氣流的過程中，該電路板94係會對該殼體 91内部之氣流通路形成莫大的阻礙，導致外界氣流無法 順利流通於該殼體91内部，造成該散熱模組93之散熱效 果降低，進而減少該發光元件92之使用壽命。 為解決上述習知燈具9之缺點，亦有相關業者研發 出如中華民國公告第M339780號「LED燈具之電路板改 良結構」新型專利案。該新型專利案主要係於LED燈具 内部之電路板上形成至少一透氣孔，該透氣孔位於該電路 板上未設有電子元件及電路之區域，且該透氣孔係貫穿該 電路板之二侧表面。藉此，使該LED燈具導入外界氣流 時，該外界氣流可利用該透氣孔之設計，而順利流通於該 LED燈具之内部，進而可確保該LED燈具具有較佳的散 熱效果。 該LED燈具之電路板改良結構雖可藉由該透氣孔之 設計，以確保外界氣流可順暢地流通於該LED燈具之内 部，然而，亦由於該電路板必須額外形成該透氣孔，使該 電路板之製作步驟過於繁ί貞；另外，該透氣孔必須位於該 電路板上未設有電子元件及電路之區域，故欲在該電路板 上形成該透氣孔時’針對該透氣孔的製作步驟亦相當的困 難，因此，造成該電路板製作上的諸多不便。再者，即使 於該電路板上形成該透氣孔，該電路板仍會對$ [ED燈 具内部之氣流通路形成一定程度的阻礙，導致該LE〇燈 具之散熱效果不佳。 201030280 【發明内容】 本發明係提供一種燈具，以確保電路板不至於對燈 具内部之風流通路形成阻礙，為其主要之發明目的。 為達到前述發明目的，本發明所運用之技術手段及 藉由該技術手段所能達到之功效包含有： 一種燈具，包含一外殼、一電路板、一散熱模組及 一發光元件。該外殼具有一第一端及一第二端，該第一端 設有-電連接部’該第二端設有—透絲，該外殼形成自 外側周壁貫穿至内侧周壁的一進風部及一出風部；該電路 板係結合於該外殼内部且電性連接該電連接部，該電路板 包含有一基板及數個電子元件，該基板具有一第一表面及 一第二表面，各該電子元件設置於該基板之第一表面及第 一表面之其中至少一表面上，且各該電子元件分別具有一 軸向尚度，其中具有最大軸向高度之電子元件位於該第一 表面，並以該基板之第一表面朝向該殼體之第二端，該第 二表面朝向該殼體之第一端；該散熱模組設置於該外殼内 部且位於該進風部及該出風部之間；該發光元件結合該散 熱模組且電性連接該電路板。藉此，可使該基板貼近該外 殼之第一端，以便該基板不會過度遮擋該外殼之進風部， 進而確保該散熱模組所引入之外界氣流可順利流通於該外 殼内部，以達到提升散熱效果之功效。 所述各該電子元件皆結合於該基板之第一表面。藉 此，各該電子元件不會位於該外殼之第一端與該基板之 間，令該基板可進一步貼近該外殼之第一端，使該基板更 不容易遮擋住該外殼之進風部，以達到確保外界氣流可順 201030280 利經由該進風部而流通於該外殼内部之功效β 所述各該電子元件分別結合於該基板之第一表面及 第二表面。藉此’由於其中具有最大轴向高度之電子元件 仍朝向該外殼之第二端，因此，不至於導致該外殼與該基 板之間的距離過度擴大，使得本發明亦可適用於其他不同 型式之電路板結構，以達到提升紕裝裕度之功效。 所述外殼之内侧周壁設有一定位部，該定位部接鄰 該第-端’該電路板之第二表面結合該錄部，且該定位 部可為形成於該外殼之内侧周壁的數個固定柱，另具有數 個固疋元件，各該固定元件貫穿該電路板以結合該固定 柱。藉此，該電路板可確實固定於該外殼内部，以達到提 升結合穩固性之功效。 【實施方式】 為讓本發明之上述及其他目的、特徵及優點能更明 顯易僅，下文特舉本發明之較佳實施例，並配合所附圖 式，作詳細說明如下： 請參照第3圖所示，本發明燈具至少包含一外殼 10、一電路板20、一散熱模組30及一發光元件4〇。該電 路板20、散熱模組30及發光元件4〇可組裝於該外殻1〇 内部，其中該電路板20係電性連接該發光元件40，使該 發光几件40可藉由該電路板2〇通電而產生燈光，該散熱 模組30則結合該發光元件40，以提供一散熱效果，進而 可延長本發明燈具之使用壽命。 本發明燈具之外殼10可為一中空殼體或以數個殼體 201030280 相互對組所構成，該殼體數量選定及組裝方式，主要係以 可供如電路板20、散熱模組3〇及發光元件40等構件順 利組敦於該外殼1〇内部為原則’例如：於本實施例中， ， 該外殼10係由一第一殼體10a及一第二殼體l〇b所組 成，且該第一殼體l〇a及第二殼體l〇b可採用如卡扣、鎖 掣、黏合或焊接等方式相互結合。 該外殼10係具有一第一端11及一第二端12，該第 一端11設有一電連接部13，該第二端12設有一透光部 ❹ 14 ;該外殼10另形成一進風部15及一出風部16，該進 風部15及出風部16自該外殼1〇之外侧周壁貫穿至内側 周壁，且該進風部15及出風部16可分別由數個進風口及 數個出風口（未標示）所構成，各該進風口及出風口可徑 向環繞設置於該外殼1〇上，其中該進風部15較佳鄰近於 該電連接部13，該出風部16較佳鄰近於該透光部14。 該外殼10之内侧周壁設有一定位部17,該定位部 17之位置可接鄰該第一端11 ;另外，該定位部17之主要 ® 功能為提供該電路板20結合於該殼體1〇内部之用途，因 此，該定位部17可選自任何可供該電路板2〇固定結合之 結構設計；如圖所示之實施例中，該定位部17係為形成 於該外殼10之内侧周壁的數個固定柱171，以便利用數 個固定元件（如螺絲或螺栓等）貫穿該電路板20後，進 而將該電路板20鎖固結合於該固定柱ι71上。 該電路板20可藉由電源接線（未繪示）電性連接該 外殼10之電連接部13，且該電路板2〇包含有一基板21 及數個電子元件22，該基板21具有一第一表面2Π及一 201030280 第二表面212，各該電子元件22可為電阻、電容、電感 或運算晶片等’並將各該電子元件22設置於該基板21之 第一表面211及第二表面212之其中至少一表面上。另 ’ 外，依該電子元件22設置方式之不同，本發明之電路板 20較佳可區分為以下之二種實施型式： 請配合參照第4圖所示，係揭示一種將各電子元件 22設置於該基板21之一側表面的電路板20結構。如圖 _ 所示之實施例，各該電子元件22皆結合於該基板21之第 一表面211，且各該電子元件22分別具有一轴向高度 00 ;另外’該基板21之第一表面211朝向該外殼1〇之 第二端12，該第二表面212則直接結合該外殼1〇之定位 部Π。藉由前揭該電路板20與該外殼10彼此之間的結 合關係，各該電子元件22皆可朝向該外殼10之第二端 12 ’使該基板21結合於該定位部17時，各該電子元件 22不會位於該外殼1〇之第一端u與該基板21之間，以 馨 便適當縮小該外殼10之第一端11與該基板21之間的距 離（D)，使該基板21可更為貼近該外殼1〇之第一端 11 ’進而確保該基板21不會過度遮擋該外殼1〇之進風部 15 〇 ° 請配合參照第5圖所示’係揭示一種將各電子元件 22分別設置於該基板21之二側表面的電路板結構。 如圖所示之實施例，各該電子元件22係分·合於該基 板21之第-表面211及第二表面212，且各該電子元件 22亦分別具有__高度（h) ’其中具有最大轴向高度 00之電子元件22位於該第一表面211 ;另夕卜，該基板 201030280 21之第一表面211同樣朝向該外殼l〇之第二端12，該第 二表面212則直接結合該外殼1〇之定位部17。藉由前揭 該電路板20’與該外殼10彼此之間的結合關係，雖然該 外/λ 10與該基板21之間具有數個電子元件&，惟由於 其中具有最大軸向高度⑴之電子树22仍朝向該外殼 10之第二端12，因此，位於該外殼1〇之第一端Η與該 基板21之間的f子元件22，將不至於導致該外殼之 第端11與該基板21之間的距離（D)過度擴大，而同 樣可使該基板21較為貼近該外殼1〇之第一端^，以確 保該基板21不會過度遮擋該外殼10之進風部15。 該散熱模組30係設置於該外殼10之内部且位於該 外殼10之進風部15及出風部16之間，該散熱模組3〇較 佳包含-散_片^及-散熱風扇η。該散熱鰭片31 係由可導熱之材質所製成；該散熱風扇32則結合於該散 熱籍片31之一侧端。 該發光元件40較佳係選自發光二極體（LED)、燈泡 或其他可通電後產生燈光之構件。該發光元件4〇與該散 熱模組30之散熱鰭片31相互結合，且該發光元件4〇相 對該散熱風扇32而位於該散熱鰭片31之另一側端，又， 該發光元件40係與該電路板2〇呈電性連接。 本發明燈具於實際使用時，可藉由該電連接部13連 接於如牆壁、天花板或桌上等地點之燈座（未繪示），以 便利用一般供電系統使該發光元件4〇通電產生燈光，並 經由該透光部14將燈光投射至外界。另外，當該發光元 件40因通電產生熱源時，則可利用該散熱模組3〇之作動 201030280 ，以便經由該進風部15引入外界氣流’並進一步利用該 散熱模組30使外界氣流可經由各該出風部16將熱量傳遞 至外界空間’以達到預疋之散熱效果，進而可延長該發光 __ 元件40之使用壽命。 . 請參照第4至6圖所示，本發明燈具更進一步藉由 該電路板20、20’與該外殼10相互結合後，令具有最大 轴向高度（h)之電子元件22朝向該外殼1〇之第二端12 ，因此，可使該基板21更為貼近該外殼1〇之第一端η 參 ’以便該基板21不會過度遮擔該外殼1〇之進風部μ， 並使外界氣流可更容易經由該進風部15而進入至該外殼 10内部。藉此，該散熱模組30於進行散熱作業的過程中 ’可避免該電路板20之基板21對該外殼1〇内部之氣流 通路形成阻礙，以確保該散熱模組30所引入之外界氣流 可順利流通於該外殼10内部，故可有效提升該散熱模組 30之散熱效果。 如上所述，本發明燈具確實可改善習知燈具之電路 ® 板谷易對燈具内部之氣流通路形成阻礙的缺點；以碟保該 散熱模組30所引入之外界氣流可無阻礙地通過該進風部 15，進而可順利流通於該外殼10内部，用以使該散熱模 組30可提供該發光元件40更佳的散熱效果，以有效延長 本發明燈具之產品品質。 雖然本發明已利用上述較佳實施例揭示，然其並非 用以限定本發明，任何熟習此技藝者在不脫離本發明之精 神和範圍之内，相對上述實施例進行各種更動與修改仍屬 本發明所保護之技術範疇，因此本發明之保護範圍當視後 —11 — 201030280 附之申請專利範㈣界定者為準。 【圖式簡單說明】 第1圖：習知燈具之組合剖視 第 ， 參考示意圖 圖 :習知燈具於導入外界氣流以進行散熱作業的 第3圖：本發明燈具之立體分解圖。 第4圖：本發明燈具之組合剖視圖。201030280 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a luminaire, and more particularly to a luminaire for ensuring that an external airflow can smoothly circulate inside. <Prior Art> Referring to Figure 1, the conventional lamp 9 includes a housing 91, a light-emitting element 92, a heat dissipation module 93, and a circuit board 94. The outer wall of the housing 91 is provided with an air inlet portion 911 and an air outlet portion 912. The light emitting element 92, the heat dissipation module 93 and the circuit board 94 are assembled inside the housing, wherein the light emitting element 92 is coupled to the housing. The heat dissipation module 93 is electrically connected to the light-emitting element 92. Therefore, when the light source generates a heat source during actual use, the heat dissipation module 93 can be used to introduce an external airflow through the air inlet portion 911, and further use the heat dissipation module 93 to make the outside air. The airflow transmits heat to the external space via the air outlet portion 912 to achieve a predetermined heat dissipation effect, thereby prolonging the service life of the diagnostic lamp 9. However, the circuit board 94 of the conventional lamp 9 is additionally provided with a plurality of electronic components 95. When the circuit board 94 is assembled inside the casing 91, each of the electronic components 95 is located in the casing 91 near the air inlet portion 911. Between one end and the circuit board 94, a space between the circuit board 94 and the housing 91 must be maintained for each of the electronic components 95, and since each of the electronic components 95 has an axial height ( h), so that the distance between the circuit board 94 and the housing 91 is too large, so that the actual assembly position of the circuit board 94 is substantially between the air inlet portion 911 of the housing 91 and the heat dissipation module 93. Because 201030280, as shown in FIG. 2, when the heat dissipation module 93 is to introduce an external airflow through the air inlet portion 911, the circuit board 94 may greatly hinder the airflow path inside the casing 91. As a result, the external airflow cannot be smoothly circulated inside the casing 91, so that the heat dissipation effect of the heat dissipation module 93 is reduced, thereby reducing the service life of the light-emitting element 92. In order to solve the above-mentioned shortcomings of the conventional lamp 9, there is also a related patent case developed by the related industry, such as the Republic of China Announcement No. M339780 "Reform Structure of Circuit Board for LED Lamps". The novel patent is mainly formed on the circuit board inside the LED lamp to form at least one vent hole, the vent hole is located in an area of the circuit board where no electronic component and circuit are provided, and the vent hole penetrates through two sides of the circuit board surface. Therefore, when the LED lamp is introduced into the external airflow, the external airflow can be smoothly circulated inside the LED lamp by using the design of the vent hole, thereby ensuring the LED lamp has better heat dissipation effect. The improved circuit board structure of the LED lamp can be designed by the vent hole to ensure that the outside airflow can smoothly flow inside the LED lamp, however, since the circuit board must additionally form the vent hole, the circuit The manufacturing steps of the board are too complicated; in addition, the venting hole must be located in an area on the circuit board where no electronic components and circuits are provided, so when the vent hole is to be formed on the circuit board, the manufacturing steps for the venting hole It is also quite difficult, and as a result, it causes a lot of inconvenience in the manufacture of the board. Moreover, even if the vent hole is formed on the circuit board, the circuit board will form a certain degree of obstruction to the air flow path inside the ED lamp, resulting in poor heat dissipation of the LE lamp. 201030280 SUMMARY OF THE INVENTION The present invention provides a luminaire to ensure that the circuit board does not form an obstruction to the wind flow path inside the lamp, for its primary object. In order to achieve the foregoing object, the technical means and the functions that can be achieved by the technical method include: a lamp comprising a casing, a circuit board, a heat dissipation module and a light-emitting component. The outer casing has a first end and a second end, the first end is provided with an electrical connection portion, and the second end is provided with a light-transmitting wire, and the outer casing forms an air inlet portion extending from the outer peripheral wall to the inner peripheral wall and An electric outlet portion; the circuit board is coupled to the inner portion of the outer casing and electrically connected to the electrical connection portion, the circuit board includes a substrate and a plurality of electronic components, the substrate has a first surface and a second surface, each of the The electronic component is disposed on at least one of the first surface and the first surface of the substrate, and each of the electronic components has an axial extent, wherein the electronic component having the largest axial height is located on the first surface, and The first surface of the substrate faces the second end of the housing, the second surface faces the first end of the housing; the heat dissipation module is disposed inside the housing and located at the air inlet portion and the air outlet portion The light emitting component is coupled to the heat dissipation module and electrically connected to the circuit board. Thereby, the substrate can be brought close to the first end of the outer casing, so that the substrate does not excessively block the air inlet portion of the outer casing, thereby ensuring that the outer airflow introduced by the heat dissipation module can smoothly flow inside the outer casing to achieve Improve the effectiveness of the heat dissipation effect. Each of the electronic components is coupled to the first surface of the substrate. Thereby, each of the electronic components is not located between the first end of the outer casing and the substrate, so that the substrate can be further adjacent to the first end of the outer casing, so that the substrate is less likely to block the air inlet portion of the outer casing. In order to ensure that the external airflow can flow through the air inlet portion through the air inlet portion, the respective electronic components are respectively coupled to the first surface and the second surface of the substrate. Thereby, since the electronic component having the largest axial height therein still faces the second end of the outer casing, the distance between the outer casing and the substrate is not excessively enlarged, so that the present invention can be applied to other different types. The structure of the board is used to improve the margin of the armor. The inner peripheral wall of the outer casing is provided with a positioning portion, and the positioning portion is adjacent to the first end. The second surface of the circuit board is coupled to the recording portion, and the positioning portion can be a plurality of fixed portions formed on the inner peripheral wall of the outer casing. The column further has a plurality of solid elements, each of which extends through the circuit board to bond the fixed post. Thereby, the circuit board can be surely fixed inside the casing to achieve the effect of improving the bonding stability. The above and other objects, features, and advantages of the present invention will become more apparent. As shown, the lamp of the present invention comprises at least a housing 10, a circuit board 20, a heat dissipation module 30 and a light-emitting element 4A. The circuit board 20, the heat dissipation module 30, and the light-emitting component 4 can be assembled inside the casing 1 , wherein the circuit board 20 is electrically connected to the light-emitting component 40, so that the light-emitting components 40 can be used by the circuit board. 2〇 is energized to generate light, and the heat dissipation module 30 is combined with the light-emitting element 40 to provide a heat dissipation effect, thereby prolonging the service life of the lamp of the present invention. The outer casing 10 of the lamp of the present invention may be a hollow casing or a plurality of casings 201030280. The number of the casings is selected and assembled, and is mainly used for the circuit board 20 and the heat dissipation module. And the light-emitting element 40 and the like are smoothly assembled in the inside of the outer casing 1'. For example, in the embodiment, the outer casing 10 is composed of a first casing 10a and a second casing 10b. The first housing 10a and the second housing 10b can be combined with each other by means such as snapping, locking, bonding or welding. The outer casing 10 has a first end 11 and a second end 12. The first end 11 is provided with an electrical connection portion 13. The second end 12 is provided with a light transmitting portion 14; the outer casing 10 further forms an air inlet. The air inlet portion 15 and the air outlet portion 16 extend from the outer peripheral wall of the outer casing 1 to the inner peripheral wall, and the air inlet portion 15 and the air outlet portion 16 are respectively provided by a plurality of air inlets. And the plurality of air outlets (not shown), wherein the air inlet and the air outlet are radially disposed on the outer casing 1 , wherein the air inlet portion 15 is preferably adjacent to the electrical connection portion 13 The portion 16 is preferably adjacent to the light transmitting portion 14. The inner peripheral wall of the outer casing 10 is provided with a positioning portion 17 which is adjacent to the first end 11; further, the main function of the positioning portion 17 is to provide the circuit board 20 to be coupled to the casing 1 For the internal use, the positioning portion 17 can be selected from any structural design that can be fixedly coupled to the circuit board 2; in the embodiment shown, the positioning portion 17 is formed on the inner peripheral wall of the outer casing 10. The plurality of fixing posts 171 are inserted through the circuit board 20 by a plurality of fixing components (such as screws or bolts) to lock the circuit board 20 to the fixing post ι 71. The circuit board 20 can be electrically connected to the electrical connection portion 13 of the outer casing 10 by a power connection (not shown), and the circuit board 2 includes a substrate 21 and a plurality of electronic components 22, the substrate 21 having a first The surface of the second surface 212 and the second surface 212 of the 201030280, each of the electronic components 22 can be a resistor, a capacitor, an inductor, or an operational wafer, etc., and each of the electronic components 22 is disposed on the first surface 211 and the second surface 212 of the substrate 21. At least one of them is on the surface. In addition, according to the manner in which the electronic component 22 is disposed, the circuit board 20 of the present invention can be preferably divided into the following two types of implementations: Please refer to FIG. 4 to disclose a setting of each electronic component 22. The circuit board 20 is structured on one side surface of the substrate 21. In the embodiment shown in FIG. _, each of the electronic components 22 is coupled to the first surface 211 of the substrate 21, and each of the electronic components 22 has an axial height 00; and the first surface 211 of the substrate 21 Toward the second end 12 of the outer casing 1 , the second surface 212 directly engages the positioning portion 该 of the outer casing 1 . By the combination of the circuit board 20 and the outer casing 10, each of the electronic components 22 can be coupled to the positioning portion 17 toward the second end 12' of the outer casing 10. The electronic component 22 is not located between the first end u of the outer casing 1 and the substrate 21, so as to appropriately reduce the distance (D) between the first end 11 of the outer casing 10 and the substrate 21, so that the substrate 21 can be closer to the first end 11' of the outer casing 1', thereby ensuring that the substrate 21 does not overly block the air inlet portion 15 of the outer casing 1 〇°, please refer to the figure shown in Fig. 5 The elements 22 are respectively disposed on the circuit board structures on both side surfaces of the substrate 21. In the embodiment shown, each of the electronic components 22 is coupled to the first surface 211 and the second surface 212 of the substrate 21, and each of the electronic components 22 also has a __height (h) The electronic component 22 of the maximum axial height 00 is located on the first surface 211; in addition, the first surface 211 of the substrate 201030280 21 is also facing the second end 12 of the outer casing 10, and the second surface 212 directly combines the The positioning portion 17 of the outer casing 1 . By combining the relationship between the circuit board 20' and the outer casing 10, although there are several electronic components & between the outer/λ 10 and the substrate 21, since it has the largest axial height (1) therein The electronic tree 22 is still facing the second end 12 of the outer casing 10, so that the sub-element 22 located between the first end of the outer casing 1 and the substrate 21 will not cause the first end 11 of the outer casing The distance (D) between the substrates 21 is excessively enlarged, and the substrate 21 can also be brought closer to the first end of the outer casing 1 to ensure that the substrate 21 does not excessively block the air inlet portion 15 of the outer casing 10. The heat dissipation module 30 is disposed inside the outer casing 10 and located between the air inlet portion 15 and the air outlet portion 16 of the outer casing 10. The heat dissipation module 3 〇 preferably includes a dispersing film and a cooling fan η. . The heat dissipation fin 31 is made of a heat conductive material; the heat dissipation fan 32 is coupled to one side end of the heat dissipation sheet 31. The light-emitting element 40 is preferably selected from the group consisting of a light-emitting diode (LED), a light bulb, or other member that generates light when energized. The light-emitting element 4 is coupled to the heat-dissipating fin 31 of the heat-dissipating module 30, and the light-emitting element 4 is located at the other end of the heat-dissipating fin 31 with respect to the heat-dissipating fan 32. It is electrically connected to the circuit board 2〇. When the lamp of the present invention is actually used, the electrical connection portion 13 can be connected to a lamp holder (not shown) such as a wall, a ceiling or a table, so that the light-emitting element 4 can be energized to generate light by using a general power supply system. And projecting the light to the outside through the light transmitting portion 14. In addition, when the light-emitting element 40 generates a heat source due to power-on, the heat-dissipating module 3 can be used to actuate the 201030280 to introduce an external airflow through the air inlet portion 15 and further utilize the heat dissipation module 30 to make the external airflow passable. Each of the air outlets 16 transfers heat to the external space to achieve a preheated heat dissipation effect, thereby extending the service life of the light-emitting element 40. Referring to Figures 4 to 6, the lamp of the present invention further integrates the electronic component 22 having the maximum axial height (h) toward the casing 1 by the circuit board 20, 20' being coupled to the casing 10. The second end 12 of the crucible is so that the substrate 21 can be brought closer to the first end η of the outer casing 1 so that the substrate 21 does not excessively cover the air inlet portion μ of the outer casing 1 and the outside The air flow can more easily enter the inside of the outer casing 10 via the air inlet portion 15. Therefore, the heat dissipation module 30 can prevent the substrate 21 of the circuit board 20 from forming an obstruction to the airflow path inside the casing 1 to ensure that the airflow introduced by the heat dissipation module 30 can be The airflow is smoothly circulated inside the outer casing 10, so that the heat dissipation effect of the heat dissipation module 30 can be effectively improved. As described above, the luminaire of the present invention can improve the disadvantage that the circuit of the conventional luminaire is easy to block the air passage inside the luminaire; the outer airflow introduced by the heat dissipation module 30 can pass through the air inlet unimpeded. The portion 15 can be smoothly circulated inside the casing 10, so that the heat dissipation module 30 can provide a better heat dissipation effect of the light-emitting element 40 to effectively extend the product quality of the lamp of the present invention. While the invention has been described in connection with the preferred embodiments described above, it is not intended to limit the scope of the invention. The technical scope of the invention is protected, and therefore the scope of protection of the present invention is subject to the definition of the patent application (4) attached to the following paragraphs - 11 - 201030280. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a sectional view of a conventional lamp. Fig. 3 is a perspective view of a conventional lamp in which an external airflow is introduced for heat dissipation. Figure 4: A cross-sectional view of the combination of the lamps of the present invention.
第5圖：本發明燈具之另一組合剖視圖。 第6圖：本發明燈具於導入外界氣流以進行散熱作業 的參考示意圖。 【主要元件符號說明】 〔本發明〕 10外殼 10b第二殼體 12第二端 14 透光部 16 出風部 171固定柱 211第一表面 22 電子元件 32散熱風扇 第一殼體 11第一端 13電連接部 15 進風部 17定位部 20、20’電路板 21基板 212第二表面 30散熱模組 31散熱鰭片， 40發光元件 —12 — 201030280 〔習知〕 9 燈具 91 殼體 911 912 出風部 92 93 散熱模組 94 95 電子元件 進風部 發光元件 電路板Figure 5: A cross-sectional view of another combination of the lamps of the present invention. Fig. 6 is a schematic view showing the introduction of the external airflow for the heat dissipation operation of the lamp of the present invention. [Main component symbol description] [Invention] 10 housing 10b second housing 12 second end 14 light transmitting portion 16 air outlet portion 171 fixing post 211 first surface 22 electronic component 32 cooling fan first housing 11 first end 13 electrical connection portion 15 air inlet portion 17 positioning portion 20, 20' circuit board 21 substrate 212 second surface 30 heat dissipation module 31 heat sink fins, 40 light-emitting elements - 12 - 201030280 [General] 9 lamps 91 housing 911 912 Outlet part 92 93 Heat dissipation module 94 95 Electronic component air inlet part Light-emitting element circuit board
——13 ———13 —