1360625 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種燈具，尤其是一種確保外界氣流 可順利流通於其内部之燈具。 【先前技術】 請參照第1圖所示，習知燈具9係包含一殼體91、 一發光元件92、一散熱模組93及一電路板94。該彀體 91之外周壁設有一進風部9Π及一出風部912 ;該發光元 件92、散熱模組93及電路板94組裝於該殼體％之内 部’其中該發光元件92係結合該散熱模組叼，該電路板 94則電性連接該發光元件92。藉此，當該發光元件％於 實際使用過程t產生熱轉，财洲錄_組％之 作動，以便經由該進風部911引入外界氣流，並進一 用該散熱模組93使該外界氣流經由該出風部叱二旦 傳遞至外界”，輯咖定之散熱絲，進延;^ 燈具9之使用壽命。 長該 然而’習知燈具9之電路板94上另設有數個電子元 5 ’當該電路板94組裝於該殼體91内部時，各 子元件95係位於該殼體91靠近進風部9ιι之—端盘= 之間’導致該電路板94與該殼體二; ::該電子元件95容置的空間，且由於各該： =9㊣具有—轴向高度⑻，故造成該電路板％與該殼 之間的距離過大，使該電路板94的實際組裝位置大 立於該殼體91之進風部911與該散熱模組％之間。因 4 — 1360625 此’如第2圖所示’當該散熱模組93欲經由該進風部 911引入外界氣流的過程中，該電路板94係會對該殼體 91内部之氣流通路形成莫大的阻礙，導致外界氣流無法 順利流通於該殼體91内部，造成該散熱模組93之散熱效 果降低，進而減少該發光元件92之使用壽命。 為解決上述習知燈具9之缺點，亦有相關業者研發 出如中華民國公告第M339780號「LED燈具之電路板改 良結構」新型專利案。該新型專利案主要係於LED燈具 内部之電路板上形成至少一透氣孔，該透氣孔位於該電路 板上未設有電子元件及電路之區域，且該透氣孔係貫穿該 電路板之二側表面。藉此，使該LED燈具導入外界氣流 時，該外界氣流可利用該透氣孔之設計，而順利流通於該 LED燈具之内部，進而可確保該LED燈具具有較佳的散 熱效果。 該LED燈具之電路板改良結構雖可藉由該透氣孔之 設計，以確保外界氣流可順暢地流通於該LED燈具之内 部；然而，亦由於該電路板必須額外形成該透氣孔，使該 電路板之製作步驟過於繁瑣；另外，該透氣孔必須位於該 電路板上未設有電子元件及電路之區域，故欲在該電路板 上形成該透氣孔時，針對該透氣孔的製作步驟亦相當的困 難，因此，造成該電路板製作上的諸多不便。再者，即使 於該電路板上形成該透氣孔，該電路板仍會對該LED燈 具内部之氣流通路形成一定程度的阻礙，導致該燈 具之散熱效果不佳。 —5 — 【發明内容】 本發月係提供#燈具，以確保電路㈣至於對燈 具内部之氣流通路形成阻礙，為其主要之發明目的。 為達到前述發明目的，本㈣所運用之技術手段及 错由該技術手段所能達到之功效包含有： 種燈具，包含-外殼、一電路板、一散熱模組及 二發光元件。該外殼具有—第—端及—第二端，該第一端 二有電連接和該第二端設有—透光部，該外殼形成自 夕側周土貫牙至内侧周壁的—進風部及—出風部；該電路 板係結合賊外如部且紐連接耗連料，該電路板 ^含有-基板及數個電子元件，該基板具有—第—表面及 -第二表面，各該電子元件設置於該基板之第—表面及第 二表，之其中至少-表面上’且各該電子元件分別具有一 軸向南度’其巾具有最大軸向高度之電子元件位於該第一 表面並以該基板之第—表面朝向該殼體之第二端，該第 二表面朝向該殼體之第-端；該散熱模組設置於該外殼内 部且位於魏卿城―部n發統件結合該散 =模組且電性連接該電路板^藉此，可使該基板貼近該外 成之第4 ’以便該基板不會過度遮擋該外殼之進風部， 進而確保該散減崎引人之外界氣流可順概通於該外 殼内部，以達到提升散熱效果之功效。 所述各該電子元件皆結合於該基板之第一表面。藉 此’各該電子元件不會位於該外殼之第一端與該基板之 間丄令該餘可it-步貼近料殼之H使該基板更 不♦易遮擋住該外殼之進風部，以達卿保外界氣流可順 —6 — 丄 JOUOZ：) 利經由該進風部而流通於該外殼内部之功效。 所述各該電子元件分別結合於該基板之第一表面及 第二表面。藉此’由於其中具有最大軸向高度之電子元件 仍朝向該外殼之第二端，因此，不至於導致該外殼與該基 板之間的距離過度擴大，使得本㈣亦可適用於其他不同 型式之電路板結構，以制提物裝減之功效。 所述外4之内側周壁設有—定位部，該定位部接鄰 該第了端’該電路板之第二表面結合該定位部且該定位 部可為形餘料殼之_周㈣數侧餘另具有數 個固定元件’各侧定元件貫穿該f路板以結合該固定 柱藉此該電路板可確實HJ定於該外殼内部以達到提 升結合穩固性之功效。 【實施方式】 為讓本發明之上述及其他目的、特徵及優點能更明 顯易懂’下文特舉本發明之較佳實施例，並配合所附圖 式，作詳細說明如下： 明參照第3圖所示，本發明燈具至少包含一外殼 W、一電路板20、一散熱模組30及一發光元件4〇。該電 路板20、散熱模組30及發光元件4〇可組裝於該外殼1〇 内部，其中該電路板20係電性逹接該發光元件40，使該 發光元件40可藉由該電路板20通電而產生燈光，該散熱 模組30則結合該發光元件40，以提供一散熱效果，進而 可延長本發明燈具之使用壽命。 本發明燈具之外殼10可為一中空殼體或以數個殼體 一 7 一 相互對組所構成，該殼體數量選定及組裝方式，主要係以 可供如電路板20、散熱模組30及發光元件40等構件順 利組裝於該外殼10内部為原則，例如：於本實施例中， 該外殼10係由一第一殼體及一第二殼體1 〇b所組 成，且該第一殼體10a及第二殼體l〇b可採用如卡扣 '鎖 掣、黏合或焊接等方式相互結合。 該外殼10係具有一第一端11及一第二端12，該第 一端11設有一電連接部13，該第二端12設有一透光部 14 ;該外殼1〇另形成一進風部15及一出風部16，該進 風部15及出風部16自該外殼10之外側周壁貫穿至内側 周壁’且該進風部15及出風部16可分別由數個進風口及 數個出風口（未標示）所構成，各該進風口及出風口可徑 向環繞設置於該外殼1〇上，其中該進風部15較佳鄰近於 該電連接部13，該出風部16較佳鄰近於該透光部14。 該外殼10之内侧周壁設有一定位部17,該定位部 Π之位置可接鄰該第一端u ;另外，該定位部17之主要 功能為提健電路板2〇結合於驗體1G内部之用途，因 此’該定位部17可選自任何可供該電路板20 13定結合之 、’、。構’如圖所示之實施例中，财位部17係為形成 於該外:又10之内側周壁的數個固定柱⑺，以便利用數 個固疋兀件（如螺絲或螺栓等）貫穿該電路板後，進 而將該電路板2G_結合於顧定柱m上。1360625 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a luminaire, and more particularly to a luminaire for ensuring that an external airflow can be smoothly circulated inside. [Prior Art] As shown in FIG. 1, the conventional lamp 9 includes a housing 91, a light-emitting element 92, a heat dissipation module 93, and a circuit board 94. The outer peripheral wall of the body 91 is provided with an air inlet portion 9 and an air outlet portion 912. The light-emitting element 92, the heat dissipation module 93 and the circuit board 94 are assembled inside the casing %, wherein the light-emitting element 92 is coupled to the light-emitting element 92. The circuit board 94 is electrically connected to the light emitting element 92. Thereby, when the light-emitting element generates a heat transfer in the actual use process t, the operation of the fiscal unit is performed to introduce an external airflow through the air inlet portion 911, and the external airflow is further used by the heat dissipation module 93. The ventilating part is transmitted to the outside world twice, and the heat-dissipating wire of the coffee set is extended; ^ The service life of the luminaire 9 is long. However, the circuit board 94 of the conventional luminaire 9 is provided with several electronic elements 5 'When When the circuit board 94 is assembled inside the housing 91, each sub-element 95 is located between the end 91 of the housing 91 adjacent to the air inlet portion 9 to cause the circuit board 94 and the housing 2; The space occupied by the electronic component 95, and since each: =9 has an axial height (8), the distance between the circuit board % and the casing is too large, so that the actual assembly position of the circuit board 94 is large. Between the air inlet portion 911 of the housing 91 and the heat dissipation module %. Because 4 - 1360625, as shown in Fig. 2, when the heat dissipation module 93 is to introduce an external airflow through the air inlet portion 911 The circuit board 94 forms a great obstacle to the air flow path inside the housing 91, resulting in The boundary airflow cannot be smoothly circulated inside the casing 91, so that the heat dissipation effect of the heat dissipation module 93 is reduced, thereby reducing the service life of the light-emitting element 92. In order to solve the above-mentioned shortcomings of the conventional lamp 9, the related industry has developed The Republic of China Announcement No. M339780 "New Circuit Board Improvement Structure for LED Lamps". The novel patent is mainly formed on the circuit board inside the LED lamp to form at least one vent hole, the vent hole is located in an area of the circuit board where no electronic component and circuit are provided, and the vent hole penetrates through two sides of the circuit board surface. Therefore, when the LED lamp is introduced into the external airflow, the external airflow can be smoothly circulated inside the LED lamp by using the design of the vent hole, thereby ensuring the LED lamp has better heat dissipation effect. The circuit board improved structure of the LED lamp can be designed by the vent hole to ensure that the outside airflow can smoothly flow inside the LED lamp; however, since the circuit board must additionally form the vent hole, the circuit The manufacturing step of the board is too cumbersome; in addition, the vent hole must be located in an area on the circuit board where no electronic components and circuits are provided, so when the vent hole is to be formed on the circuit board, the manufacturing steps for the vent hole are also equivalent. The difficulty, therefore, caused a lot of inconvenience in the manufacture of the board. Moreover, even if the vent hole is formed on the circuit board, the circuit board will form a certain degree of obstruction to the air flow path inside the LED lamp, resulting in poor heat dissipation of the lamp. — 5 — [Summary of the Invention] This issue provides the # luminaire to ensure that the circuit (4) forms an obstruction to the airflow path inside the lamp for its main purpose. In order to achieve the above object, the technical means and the effects that can be achieved by the technical means include: a lamp, a casing, a circuit board, a heat dissipation module and two light-emitting elements. The outer casing has a first end and a second end, the first end has an electrical connection, and the second end is provided with a light transmitting portion, and the outer casing forms an air inlet portion from the outer side of the outer side to the inner peripheral wall - an air outlet portion; the circuit board is combined with a thief and a new connection, and the circuit board includes a substrate and a plurality of electronic components, the substrate having a first surface and a second surface, each of the electrons The component is disposed on the first surface of the substrate and the second surface, at least on the surface, and each of the electronic components has an axial south degree, wherein the electronic component whose towel has the largest axial height is located on the first surface and The first surface of the substrate faces the second end of the housing, the second surface faces the first end of the housing; the heat dissipation module is disposed inside the housing and is located in the Weiqing City The module is electrically connected to the circuit board, so that the substrate can be brought close to the fourth portion of the outer casing so that the substrate does not excessively block the air inlet portion of the outer casing, thereby ensuring the dissipation of the substrate. The external airflow can pass through the inside of the casing to achieve the lifting The efficacy results. Each of the electronic components is coupled to the first surface of the substrate. Thereby, each of the electronic components is not located between the first end of the outer casing and the substrate, so that the remaining portion can be close to the H of the casing, so that the substrate is less likely to block the air inlet portion of the casing. The external airflow of Daqingbao can be smoothed. 6) 丄JOUOZ:) The effect of circulating inside the casing through the air inlet portion. Each of the electronic components is respectively coupled to the first surface and the second surface of the substrate. Thereby, because the electronic component having the largest axial height therein still faces the second end of the outer casing, the distance between the outer casing and the substrate is not excessively enlarged, so that the fourth (4) can also be applied to other different types. The structure of the circuit board is used to reduce the effect of the preparation. The inner peripheral wall of the outer 4 is provided with a positioning portion, the positioning portion is adjacent to the first end. The second surface of the circuit board is coupled to the positioning portion, and the positioning portion can be the side of the circumference of the shape of the residual material shell. The other has a plurality of fixing members' each side member passing through the f-plate to bond the fixing column, whereby the circuit board can be surely HJ is fixed inside the casing to achieve the effect of improving the bonding stability. The above and other objects, features and advantages of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; As shown, the lamp of the present invention comprises at least a housing W, a circuit board 20, a heat dissipation module 30 and a light-emitting element 4A. The circuit board 20, the heat dissipation module 30, and the light-emitting component 4 can be assembled inside the casing 1 , wherein the circuit board 20 electrically connects the light-emitting component 40 so that the light-emitting component 40 can pass through the circuit board 20 When the light is generated to generate light, the heat dissipation module 30 is combined with the light-emitting element 40 to provide a heat dissipation effect, thereby prolonging the service life of the lamp of the present invention. The outer casing 10 of the lamp of the present invention may be a hollow casing or a plurality of casings 7 to 7 pairs. The number of the casings is selected and assembled, and is mainly used for the circuit board 20 and the heat dissipation module. For example, in the present embodiment, the housing 10 is composed of a first housing and a second housing 1 〇b, and the first housing and the second housing 1 〇b A casing 10a and a second casing 10b may be combined with each other by means of snapping, locking or welding. The outer casing 10 has a first end 11 and a second end 12. The first end 11 is provided with an electrical connection portion 13. The second end 12 is provided with a light transmitting portion 14; a portion 15 and an air outlet portion 16, wherein the air inlet portion 15 and the air outlet portion 16 penetrate from the outer peripheral wall of the outer casing 10 to the inner peripheral wall ', and the air inlet portion 15 and the air outlet portion 16 are respectively provided by a plurality of air inlets and a plurality of air outlets (not shown), wherein the air inlet and the air outlet are radially disposed on the outer casing 1 , wherein the air inlet portion 15 is preferably adjacent to the electrical connection portion 13 , and the air outlet portion 16 is preferably adjacent to the light transmitting portion 14. The inner peripheral wall of the outer casing 10 is provided with a positioning portion 17, and the position of the positioning portion 可 can be adjacent to the first end u. In addition, the main function of the positioning portion 17 is to connect the health circuit board 2 to the inside of the test body 1G. Use, therefore, the positioning portion 17 can be selected from any of the boards 20 13 that can be combined. In the embodiment shown in the figure, the financial position portion 17 is a plurality of fixing columns (7) formed on the outer peripheral wall of the outer wall 10 to be penetrated by a plurality of fixing members (such as screws or bolts). After the circuit board, the circuit board 2G_ is further coupled to the Guding column m.
“電路板2〇可H由電源接線（未繪*)電性連接該 外设10之電連接Λβ U ^ _钱°卩13，且該電路板20包含有一基板21 固子凡件22，該基板21具有一第一表面211及一 1360625 « 第二表面212，各該電子元件22可為電阻、電容、電感 或運算晶片等’並將各該電子元件22設置於該基板21之 第一表面211及第二表面212之其中至少一表面上。另 外’依該電子元件22設置方式之不同，本發明之電路板 20較佳可區分為以下之二種實施型式："The circuit board 2 is electrically connected to the electrical connection Λβ U ^ _ 卩 卩 13 of the peripheral device 10 by a power supply wiring (not shown), and the circuit board 20 includes a substrate 21 and a solid member 22, which The substrate 21 has a first surface 211 and a 1360625 «second surface 212, each of the electronic components 22 can be a resistor, a capacitor, an inductor or a computing chip, etc., and each of the electronic components 22 is disposed on the first surface of the substrate 21. The circuit board 20 of the present invention is preferably divided into the following two implementation forms: Depending on the manner in which the electronic component 22 is disposed.
請配合參照第4圖所示，係揭示一種將各電子元件 22設置於該基板21之一側表面的電路板20結構。如圖 所示之實施例，各該電子元件22皆結合於該基板21之第 一表面211，且各該電子元件22分別具有一轴向高度 (h);另外，該基板21之第一表面211朝向該外殼1〇之 第二端12，該第二表面212則直接結合該外殼1〇之定位 部17。藉由前揭該電路板20與該外殼1〇彼此之間的結 合關係，各該電子元件22皆可朝向該外殼10之第二端 12，使該基板21結合於該定位部17時，各該電子元件 22不會位於該外殼10之第一端η與該基板21之間，以 便適當縮小該外殼10之第一端U與該基板21之間的距 離（D)，使該基板21可更為貼近該外殼1〇之第一端 11，進而確保該基板21不會過度遮擋該外殼1〇之進風部 15 0 請配合參照第5圖所示，係揭示一種將各電子元 22分別設置於該基板21之二侧表面的電路板2〇，結構。 如圖所示之實施例，各該電子元件22係分別結合於該 板21之第-表面211及第二表面212，且各該電子= 22亦分別具有-軸向高度⑴，其中具有最大轴 (h)之電子元件22位於該第一表面211 ;另外，該基^ —9 — 1360625 21之第一表面211同樣朝向該外殼；[〇之第二端i2，該第 二表面212則直接結合該外殼10之定位部17。藉由前揭 該電路板20’與該外殼1〇彼此之間的結合關係，雖然該 外殼10與該基板21之間具有數個電子元件22 ,惟由於 其中具有最大軸向高度（h)之電子元件22仍朝向該外殼 10之第一端12，因此，位於該外殼之第一端η與該 基板21之間的電子元件22，將不至於導致該外殼1〇之 第一端11與該基板21之間的距離（D)過度擴大，而同 樣可使該基板21較為貼近該外殼10之第一端u，以確 保該基板21不會過度遮擋該外殼1〇之進風部15 ^ 該散熱模組30係設置於該外殼10之内部且位於該 外殼10之進風部15及出風部16之間，該散熱模組邓較 佳包含一散熱鰭片31及一散熱風扇32。該散熱鰭片 係由可導熱之材質所製成；該散熱風扇32則結合於該散 熱鰭片31之一侧端。 該發光元件40較佳係選自發光二極體（LED)、燈泡 或其他可通電後產生燈光之構件。該發光元件4〇與該散 熱模組30之散熱鰭片31相互結合，且該發光元件4〇相 對该散熱風扇32而位於該散熱鰭片31之另一側端，又， 該發光元件40係與該電路板2〇呈電性連接。 本發明燈具於實際使用時，可藉由該電連接部13連 接於如牆壁、天花板或桌上等地點之燈座（未繪示），以 便利用—般供電系統使該發光元件40通電產生燈光，並 經由該透光部14將燈光投射至外界。另外，當該發光元 牛0因通電產生熱源時，則可利用該散熱模組之作動 —10 — ，以便經由該進風部15引入外界氣流，並進一步利用該 散熱模組30使外界氣流可經由各該出風部16將熱量傳^ 至外界空間，以達到預定之散熱效果，進而可延長該發光 元件40之使用壽命。 請參照第4至6圖所示，本發明燈具更進一步藉由 該電路板20、20’與該外殼1〇相互結合後，令具有最少 轴向高度（h)之電子元件22朝向該外殼丨〇之第二端 ，因此，可使該基板21更為貼近該外殼10之第—端u ，以便該基板21不會過度遮擋該外殼1〇之進風部μ， 並使外界氣流可更容易經由該進風部15而進入至該外殼 10内部。藉此，該散熱模組30於進行散熱作業的過程中 ，可避免該電路板20之基板21對該外殼10内部之氣流 通路形成阻礙，以確保該散熱模組3〇所引入之外界氣= 可順利流通於該外殼10内部，故可有效提升該散熱 30之散熱效果。 如上所述，本發明燈具確實可改善習知燈具之電路 板容易對燈具内部之氣流通路形成阻礙的缺點；以確保該 散熱模組30所引入之外界氣流可無阻礙地通過該進風部 15，進而可順利流通於該外殼1〇内部，用以使該散熱模 組30可提供該發光元件40更佳的散熱效果，以有效延'長 本發明燈具之產品品質。 雖然本發明已利用上述較佳實施例揭示，然其並非 用以限林㈣’任何熟胃此技藝者在賴離本發明之精 砷和範圍之内，相對上述實施例進行各種更動與修改仍屬 本發明所保護之技術範疇，因此本發明之保護範圍當視後 1360625 附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖：習知燈具之組合剖視圖。 第2圖：習知燈具於導入外界氣流以進行散熱作業的 參考示意圖。 第3圖：本發明燈具之立體分解圖。 第4圖：本發明燈具之組合剖視圖。 第5圖：本發明燈具之另一組合剖視圖。 第6圖：本發明燈具於導入外界氣流以進行散熱作業 的參考示意圖。 【主要元件符號說明】 〔本發明〕 10 外殼 10a 第一殼體 10b 第二殼體 11 第一端 12 第二端 13 電連接部 14 透光部 15 進風部 16 出風部 17 定位部 171 固定柱 20、 20’電路板 21 基板 211 第一表面 212 第二表面 22 電子元件 30 散熱模組 31 散熱鰭片， 32 散熱風扇 40 發光元件 —12 — 1360625 〔習知〕 9 燈具 91 殼體 911 912 出風部 92 93 散熱模組 94 r\ r 電子元件 進風部 發光元件 電路板Referring to Fig. 4, a structure of a circuit board 20 in which each electronic component 22 is provided on one side surface of the substrate 21 is disclosed. In the embodiment shown, each of the electronic components 22 is coupled to the first surface 211 of the substrate 21, and each of the electronic components 22 has an axial height (h); in addition, the first surface of the substrate 21 The second end 212 of the outer casing 1 is directly coupled to the positioning portion 17 of the outer casing 1 . Each of the electronic components 22 can face the second end 12 of the outer casing 10 so that the substrate 21 is coupled to the positioning portion 17 when the circuit board 20 and the outer casing 1 are coupled to each other. The electronic component 22 is not located between the first end η of the outer casing 10 and the substrate 21, so as to appropriately reduce the distance (D) between the first end U of the outer casing 10 and the substrate 21, so that the substrate 21 can be The first end 11 of the outer casing 1 is further disposed to ensure that the substrate 21 does not excessively block the air inlet portion 15 of the outer casing 1 . Referring to FIG. 5 , a plurality of electronic components 22 are respectively disclosed. The circuit board 2 is disposed on the two side surfaces of the substrate 21 and has a structure. In the embodiment shown, each of the electronic components 22 is respectively coupled to the first surface 211 and the second surface 212 of the board 21, and each of the electrons 22 has an axial height (1), respectively, having a maximum axis. The electronic component 22 of (h) is located on the first surface 211; in addition, the first surface 211 of the base 9-9306625 21 is also oriented toward the outer casing; [the second end i2 of the crucible, the second surface 212 is directly coupled The positioning portion 17 of the outer casing 10. By combining the relationship between the circuit board 20' and the outer casing 1b, although there are several electronic components 22 between the outer casing 10 and the substrate 21, due to the maximum axial height (h) therein. The electronic component 22 is still facing the first end 12 of the housing 10, so that the electronic component 22 between the first end η of the housing and the substrate 21 will not cause the first end 11 of the housing 1 to The distance (D) between the substrates 21 is excessively enlarged, and the substrate 21 can also be relatively close to the first end u of the outer casing 10 to ensure that the substrate 21 does not excessively block the air inlet portion 15 of the outer casing 1 ^ The heat dissipation module 30 is disposed between the air inlet portion 15 and the air outlet portion 16 of the outer casing 10. The heat dissipation module Deng preferably includes a heat dissipation fin 31 and a heat dissipation fan 32. The heat dissipation fin is made of a heat conductive material; the heat dissipation fan 32 is coupled to one side end of the heat dissipation fin 31. The light-emitting element 40 is preferably selected from the group consisting of a light-emitting diode (LED), a light bulb, or other member that generates light when energized. The light-emitting element 4 is coupled to the heat-dissipating fin 31 of the heat-dissipating module 30, and the light-emitting element 4 is located at the other end of the heat-dissipating fin 31 with respect to the heat-dissipating fan 32. It is electrically connected to the circuit board 2〇. When the lamp of the present invention is actually used, the electrical connection portion 13 can be connected to a lamp holder (not shown) such as a wall, a ceiling or a table, so that the light-emitting element 40 can be energized to generate light by using a general power supply system. And projecting the light to the outside through the light transmitting portion 14. In addition, when the illuminating element 0 generates a heat source due to energization, the heat dissipation module can be used to introduce an external airflow through the air inlet portion 15, and further use the heat dissipation module 30 to make the external airflow The heat is transmitted to the external space through each of the air outlet portions 16 to achieve a predetermined heat dissipation effect, thereby prolonging the service life of the light-emitting element 40. Referring to Figures 4 to 6, the lamp of the present invention further integrates the electronic component 22 having the minimum axial height (h) toward the casing by the circuit board 20, 20' and the casing 1〇. The second end of the crucible can thereby make the substrate 21 closer to the first end u of the outer casing 10, so that the substrate 21 does not excessively block the air inlet portion μ of the outer casing 1 and makes the external airflow easier. The inside of the casing 10 is entered via the air inlet portion 15. Therefore, in the process of performing the heat dissipation operation, the heat dissipation module 30 can prevent the substrate 21 of the circuit board 20 from forming an obstruction to the air flow path inside the outer casing 10 to ensure the outer boundary of the heat dissipation module 3 The air can be smoothly circulated inside the outer casing 10, so that the heat dissipation effect of the heat dissipation 30 can be effectively improved. As described above, the luminaire of the present invention can improve the disadvantage that the circuit board of the conventional luminaire can easily hinder the airflow path inside the luminaire; to ensure that the outer airflow introduced by the heat dissipation module 30 can pass through the air inlet portion 15 without hindrance. The heat dissipation module 30 can provide a better heat dissipation effect of the light-emitting component 40 to effectively extend the product quality of the lamp of the present invention. Although the present invention has been disclosed by the above-described preferred embodiments, it is not intended to limit the scope of the invention. However, it is still within the scope of the invention, and various modifications and modifications are made to the above embodiments. It is within the technical scope of the present invention, and therefore the scope of the present invention is defined by the scope of the patent application. [Simple description of the diagram] Figure 1: A cross-sectional view of a combination of conventional lamps. Figure 2: A schematic diagram of a conventional luminaire in which an external airflow is introduced for heat dissipation. Figure 3: An exploded perspective view of the luminaire of the present invention. Figure 4: A cross-sectional view of the combination of the lamps of the present invention. Figure 5: A cross-sectional view of another combination of the lamps of the present invention. Fig. 6 is a schematic view showing the introduction of the external airflow for the heat dissipation operation of the lamp of the present invention. [Main component symbol description] [Invention] 10 Housing 10a First housing 10b Second housing 11 First end 12 Second end 13 Electrical connection portion 14 Light transmitting portion 15 Air inlet portion 16 Air outlet portion 17 Positioning portion 171 Fixing post 20, 20' circuit board 21 substrate 211 first surface 212 second surface 22 electronic component 30 heat dissipation module 31 heat sink fin, 32 heat sink fan 40 light-emitting element - 12 - 1360625 [conventional] 9 lamp 91 housing 911 912 air outlet 92 93 heat dissipation module 94 r\ r electronic component air inlet light component circuit board
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