201029556 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置’尤其涉及一種用於對 電子元件散熱之散熱裝置。 【先前技術】 隨著電子產業之快速發展，電子元件（如中央處 理器）之高速、高頻以及集成化使其發熱量劇增， 為在有限之空間内高效地帶走電子元件所產生之熱 量，業界通常係在電子元件上加裝一散熱裝置。 該散熱裝置通常包括一散熱器以及與該散熱器 =合之一熱管，該熱管設置成多段彎折，以增加熱 管與散熱器之接觸面積，提高該散熱裝置之熱傳導 效率，然而，上述散熱裝置組裝時，由於該熱管設 置成多段彎折，其很難與散熱器結合，造成散熱裝 置組裝困難。因此，需加以改進。 ， 【發明内容】 有鑒於此，有必要提供一種組裝方便之散熱裝 置。 一政…、裝置，包括一底座、放置在底座上之一 第一縛片組、結合於第一轉片、板頂面之一第二鰭片 組、導熱連接底座與第一、二鰭片組之二熱管和一 風扇，每一熱管包括與底座連接之一蒸發段、一冷 3 201029556 凝段和連接冷凝段及蒸發段之一連接段，該等冷凝 段夾置在第一鰭片組之頂面及第二鰭片組之底面之 間’該等冷凝段及第一、二鰭片組環繞在風扇之周 圍。201029556 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art] With the rapid development of the electronics industry, the high-speed, high-frequency and integration of electronic components (such as central processing units) has caused a sudden increase in heat generation, resulting in the efficient removal of electronic components in a limited space. Heat, the industry usually installs a heat sink on the electronic components. The heat dissipating device generally comprises a heat sink and a heat pipe combined with the heat sink, the heat pipe is arranged in a plurality of stages to increase the contact area between the heat pipe and the heat sink, and improve the heat conduction efficiency of the heat dissipating device. During assembly, since the heat pipe is set to be bent in multiple stages, it is difficult to combine with the heat sink, which makes assembly of the heat sink difficult. Therefore, it needs to be improved. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device that is easy to assemble. a device, a device, comprising a base, a first set of tabs placed on the base, a first flip, a second fin set on the top surface of the board, a thermally conductive connection base and first and second fins The second heat pipe and a fan, each heat pipe includes an evaporation section connected to the base, a cold 3 201029556 condensation section, and a connection section connecting the condensation section and the evaporation section, the condensation sections being sandwiched in the first fin group The condensing section and the first and second fin sets are surrounded by the fan between the top surface and the bottom surface of the second fin set.
上述散熱裝置熱管之冷凝段夾置在第一、二鰭片 組之間’其安裝過程只需將這些塗抹好錫膏之相關 元件逐一放置好，再進行高溫烘烤既完成鰭片組與 熱管之組裝’還可避免因為穿插熱管造成錫膏溢 出，有利於第一、二鰭片組與熱管之間間隙之填錫， &向產品之焊接品質’能夠有效保證產品性能。 【實施方式】 圖1與圖2所示為本發明一實施例中之散熱裝 置，其用來對一發熱電子元件（圖未示）如中^處 理器進行散熱。該散熱裝置包括一底座1〇、與該底 座10結合之一熱管組20、與該熱管組2〇結合之一 散熱器30、設於該散熱器3〇中間之一風扇4〇和罩 叹於散熱器30及風扇40頂部之一風扇罩5〇。 上述底座H)包括-第-基板12和結合於第一美 板12底面之一第二基板14。該第-基板12由密； 較小之導熱性材料製成’以在不影響底座^ ς 能之情況下減輕底座10之重量。 “、、疋 王 *茨弟一基拓 1 9念 面中部開設有：相互平行間隔之凹槽12()， 其 板12具有四邊緣，其中三邊緣 人 土 深為向内凹陷形成彎曲 4 201029556 邊緣，剩下之一邊緣為垂直於凹槽120之平直邊緣。 - 該第二基板14尺寸小於第一基板12,由導熱性能較 __ 第一基板12好之金屬板材料製成，如銅等。該第一 基板12之各個角落均開設有一安裝孔122，以供固 定件（圖未示）穿過而將散熱裝置固定到發熱電子 元件上。該第二基板12之底面用以與該發熱電子元 件熱接觸，該第二基板14之頂面中部上設有二凹槽 140，所述凹槽140相互間隔且與第二基板14之相 ® 對兩側平行，以在結合於第一基板12底部時與第二 基板12之凹槽120配合形成容置熱管組20之通孔 (未標號）。 上述熱管組合20包括二彎曲熱管22。每一熱管 22包括一蒸發段222、一冷凝段224以及將該蒸發 .段222與冷凝段224連接之一連接段226。該蒸發段 222呈平直狀，夾置於底座10第一、二基板12、14 G 之間並收容於第一、二基板12、14之凹槽120、140 形成之通孔内。該連接段226由該蒸發段222之一 端傾斜向上一體延伸形成。該冷凝段224呈圓弧形， 優選地，其呈半圓弧形，且冷凝段224由該連接段 224之上端向一侧沿圓周方向延伸形成。該冷凝段 224所在之平面平行於底座10。 請一併參閱圖3和4，上述散熱器30呈環狀， 其包括一第一鰭片組32以及一第二鰭片組34。該第 201029556 一錯片组32呈JL戶r n 中心角為" 圓環形’該扇形缺口之 中“角為銳角，該扇 很小一部分。Μ心/弟韓片组Μ圓環之 緣”…Ϊ 在其頂面靠近其外周 置熱管22冷凝段224之—第_容置槽 护頂面1置槽324形成在第—鰭片組％之環 鰭片組32之；緣延伸。該第一 324,且塞： 陷形成-圓形容置部 ❹ Φ 並盘2^片組&之環形頂面高出該容置部似 、〜、a奋置槽322 —起將該容置部324環繞其 内。該第一鰭片組32在容置部324之中心處開⑼有 大致呈圓形之通風口 326。該第^ 處開叹有 楚-W… 該第-鰭片組32由複數 第叫片320相互扣接而成，所述第 大致呈L形片狀，所述第一 句 珩释月320由第一鰭片組 中心之通風孔326向外呈放射狀延伸，且第 片320之外端處向上凸起延伸而形成第—鰭片缸32 之環形頂面。所述第一籍片320關於第一鰭片电32 之中轴線中心對稱排列’所述第一鯖4 320對摩第 一鰭片組32之環形頂面及第一容置槽似處之邊緣 垂直延伸有折邊，以增加第一鰭片32〇與熱管以之 接觸面積從而提高熱交換率。所述第一續#畑之 外側緣及對應形成第一鰭片組32中心通風口 3%之 内侧緣形成有扣合結構（未標號），以將第一鰭片 320相互扣接在一起。所述第一鰭片32〇靠近内侧之 底端緣承接在底座1〇第一基板12頂面上。 6 201029556 相互扣接而成=，由複數第二鰭片柳 鰭片钽32之产：—鰭片組34底面形成有與第-:32之㈣頂面對應接合之環形底 ;片组34之環形底面上開設有第二容置槽342 ;The condensation section of the heat pipe of the heat dissipating device is sandwiched between the first and second fin sets. In the installation process, only the components of the solder paste are placed one by one, and the high temperature baking is performed to complete the fin group and the heat pipe. The assembly 'can also avoid the solder paste overflow caused by the insertion of the heat pipe, which is beneficial to the filling of the gap between the first and second fin sets and the heat pipe, and the welding quality of the product can effectively ensure the product performance. [Embodiment] Figs. 1 and 2 show a heat dissipating device according to an embodiment of the present invention for dissipating heat from a heat-generating electronic component (not shown) such as a processor. The heat dissipating device comprises a base 1〇, a heat pipe group 20 combined with the base 10, a heat sink 30 combined with the heat pipe group 2〇, a fan 4〇 disposed between the heat sink 3〇, and a cover sigh The heat sink 30 and one of the tops of the fan 40 are fan covers 5 〇. The base H) includes a -first substrate 12 and a second substrate 14 bonded to one of the bottom surfaces of the first slab 12. The first substrate 12 is made of a dense, less thermally conductive material to reduce the weight of the base 10 without affecting the performance of the base. ",, 疋王*茨弟一基拓1 9 The face is opened in the middle: the grooves 12 () are parallel to each other, and the plate 12 has four edges, wherein the three edges of the human body are deep inwardly concave to form a bend 4 201029556 The edge, one of the remaining edges is a straight edge perpendicular to the groove 120. - The second substrate 14 is smaller in size than the first substrate 12, and is made of a metal plate material having better thermal conductivity than the first substrate 12, such as A mounting hole 122 is defined in each corner of the first substrate 12 for fixing a fixing member (not shown) to fix the heat sink to the heat-generating electronic component. The bottom surface of the second substrate 12 is used for The heat-generating electronic component is in thermal contact, and the second substrate 14 is provided with two grooves 140 in the middle of the top surface thereof. The grooves 140 are spaced apart from each other and are parallel to the sides of the second substrate 14 to be combined with The bottom of a substrate 12 cooperates with the recess 120 of the second substrate 12 to form a through hole (not labeled) for accommodating the heat pipe group 20. The heat pipe assembly 20 includes two curved heat pipes 22. Each heat pipe 22 includes an evaporation section 222, a Condensation section 224 and the evaporation section 222 and condensation section 224 One of the connecting segments 226 is connected. The evaporating portion 222 is formed in a straight shape and is sandwiched between the first and second substrates 12 and 14 G of the base 10 and received in the grooves 120 and 140 of the first and second substrates 12 and 14. The connecting section 226 is formed by extending one end of the evaporation section 222 obliquely upward. The condensation section 224 has a circular arc shape, preferably, it has a semicircular arc shape, and the condensation section 224 is formed by the connection section 224. The upper end is formed in a circumferential direction toward one side. The plane of the condensation section 224 is parallel to the base 10. Referring to Figures 3 and 4 together, the heat sink 30 is annular and includes a first fin set 32 and a The second fin set 34. The 201029556 one wrong piece set 32 has a central angle of the JL household rn as " a circular ring. The "corner" is an acute angle, and the fan is a small part. Μ心/弟韩片组Μ环缘”...Ϊ The top surface is close to the outer circumference of the heat pipe 22 condensation section 224—the _ accommodating groove top surface 1 groove 324 is formed in the first fin group % The ring fin group 32; the edge extends. The first 324, and the plug: the trap forming-circular receiving portion Φ Φ and the annular top surface of the disc 2^ sheet group & is higher than the receiving portion, ~, The abutment groove 322 surrounds the accommodating portion 324. The first fin group 32 opens (9) at the center of the accommodating portion 324 with a substantially circular vent 326. The sigh is sighed There is a Chu-W... The first fin group 32 is formed by interlocking a plurality of first calling pieces 320, the first substantially L-shaped sheet shape, and the first sentence release 320 is centered by the first fin group The venting opening 326 extends radially outwardly, and the outer end of the first piece 320 extends upwardly to form an annular top surface of the first fin cylinder 32. The first piece 320 is electrically connected to the first fin 32. The central axis of the central axis is symmetrically arranged. The first top 4 320 is opposite to the annular top surface of the first fin set 32 and the edge of the first receiving groove is vertically extended with a flange to increase the first fin 32. 〇 and heat pipe The contact area increases the heat exchange rate. The outer edge of the first continuation and the inner edge of the central vent corresponding to the first fin group 32 are formed with a fastening structure (not labeled) to be the first The fins 320 are fastened to each other. The bottom fins of the first fins 32 are received on the top surface of the first substrate 12 of the base 1 . 6 201029556 The fin-shaped fins 32 are produced: the bottom surface of the fin group 34 is formed with an annular bottom corresponding to the top surface of the -: 32 (four) top surface; the annular bottom surface of the wafer group 34 is provided with a second receiving groove 342;
::容置槽，裏形’沿第二鳍片組3:之環形5 容第二容置槽342與第'韓片組32之第-:槽：配合容置所述熱管22之蒸發段224。所 第340為大致呈梯形之片體，由第二鰭片 之環形内緣向外發散延伸，所述第二鰭片340 4成第二藉片組34底面之底端緣垂直延伸有折 丄以增加第與熱管22之接觸面積從而 f尚熱交換率。所述第m40頂端緣及其底端 立於第二容置槽342兩側之折邊設置有扣合結構， 以將第一鰭片340扣接在一起。 、上述風扇40容置於第一鰭片組32之容置部324 内並壤繞在第一鰭片、组32 <環形頂面及第-容置槽 324内’該風扇40包括葉輪組42和連接於葉輪組 42頂部之一固定基板44。上述風扇罩50包括一圓 %<形固定框52和形成與固定框52頂端之一網罩 54。該網罩54之底面與固定基板44之頂面接合， 可通過卡扣或鎖螺釘等方式固定。 凊一併參閱圖5，上述散熱裝置處於組合狀態 時，第一鰭片組32放置在底座第一基板12頂面 7 201029556 上，二熱管22之蒸發段222夾置在底座10之第一、 第二基板12、14之間，二熱管22之連接段226由 第一基板12平直邊緣一側向上延伸並收容在第一鰭 片組32之扇形缺口内，二熱管22之二冷凝段224 由連接段226頂端向兩側延伸並同時容置在第一鰭 片組32環形頂面之第一容置槽322内，第二鰭片組 34之環形底面與第一鰭片組32之環形底面接合，使 熱管22之二冷凝段224同時容置在第二鰭片組34 環形底面之第二容置槽342内，從而使底座10、熱 管組20與散熱器30兩兩充分導熱連接。所述熱管 22冷凝段224容置在第一、二鰭片組32、34之第一、 第二容置槽322、342形成之圓環形通道内，且二熱 管22之二冷凝段224之末端相互對接在一起。該風 扇40安裝在第一鰭片組32中央之容置部324内， 且環繞在第二鰭片組34及熱管22之冷凝段224内。 該風扇罩50覆蓋在散熱器30頂面，且風扇50固定 框52包裹在第二鰭片組34之外周緣上並與第二鰭 片組34扣接固定，該風扇罩50覆蓋在熱管22之連 接段226上方，且連接段226向上伸入風扇罩50内。 上述散熱裝置處於使用狀態時，發熱電子元件工 產生之熱量被第一基板12直接吸收，通過熱管22 均勻分佈到散熱器30之第一、第二鰭片組32、34 上，最終再由風扇40產生之低溫氣流散發至周圍之 空氣中，從實現高效、快速冷卻發熱電子元件之功 201029556 效。 上述散熱裝置熱管22之蒸發段222和冷凝段 ‘ 224分別夾置在第-、二基板U、14與第一、二，鰭 ^組32、34之間’其安裝過程只需將這些塗抹好錫 貧之相關元件逐一放置好’再進行高溫烘烤既完成 散熱益30與熱管組20及底座10之組裝。此外。還 Z避免因為穿插熱管22造成料溢出，有利於第 ❿—、二鰭片組12、14與熱管22之間間隙之填錫， 提高產品之焊接品質，能夠有效保證產品性能。 綜上所述，本發明確已符合發明專利之要件，遂 依法提出專利申請。，准，以上所述者僅為本發明之 較佳實施方式’自不能以此限制本案之中請專利範 圍。舉凡熟悉本案技藝之人士援依本發明之精神所 作之等效修飾或變化，皆應涵蓋於以下申請專利範 圍内。 & 【圖式簡單說明】 圖1為本發明一實施例之散熱裝置之立體組裝 圖。 圖2為圖1所示散熱裝置之分解圖。 圖3為圖2所示散熱裝置之一部分組裝圖。 圖4為圖2所示散熱裝置另一部分組裝圖。 圖5為圖1所示散熱裝置之正視圖。 201029556 【主要元件符號說明】 底座 10 第一基板 12 凹槽 120 、 140 安裝孔 122 第二基板 14 熱管組合 20 熱管 22 蒸發段 222 冷凝段 224 連接段 226 散熱器 30 第一縛片組 32 第一縛片 320 第一容置槽 322 容置部 324 通風孔 326 第二鰭片組34 第二鰭片 340 第二容置槽342 風扇 40 葉輪組 42 固定基板 44 風扇罩 50 固定框 52 網罩 54 鲁容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容224. The 340 is a substantially trapezoidal sheet body, and is extended outwardly from the annular inner edge of the second fin. The second fin 340 4 is formed as a bottom edge of the bottom surface of the second borrowing sheet group 34. In order to increase the contact area of the first heat pipe 22, the heat exchange rate is still f. The m40 top edge and the bottom edge of the m40 end edge and the bottom end of the second receiving groove 342 are provided with a fastening structure to fasten the first fins 340 together. The fan 40 is received in the receiving portion 324 of the first fin set 32 and is wound around the first fin, the group 32 <the annular top surface and the first receiving groove 324. The fan 40 includes the impeller group 42 and a base plate 44 attached to one of the tops of the impeller group 42. The fan cover 50 includes a circle % < a fixed frame 52 and a mesh cover 54 formed at the top end of the fixed frame 52. The bottom surface of the mesh cover 54 is joined to the top surface of the fixed substrate 44, and can be fixed by a snap or a lock screw. Referring to FIG. 5, when the heat dissipating device is in the combined state, the first fin set 32 is placed on the top surface 7201029556 of the first substrate 12 of the base, and the evaporation section 222 of the second heat pipe 22 is placed at the first of the base 10. Between the second substrates 12 and 14, the connecting portion 226 of the two heat pipes 22 extends upward from the straight edge side of the first substrate 12 and is received in the fan-shaped notch of the first fin group 32. The end surface of the connecting portion 226 extends to the two sides and is accommodated in the first receiving groove 322 of the annular top surface of the first fin group 32. The annular bottom surface of the second fin group 34 and the first fin group 32 are annular. The bottom surface is joined, so that the two condensation sections 224 of the heat pipe 22 are simultaneously accommodated in the second receiving groove 342 of the annular bottom surface of the second fin set 34, so that the base 10, the heat pipe group 20 and the heat sink 30 are sufficiently thermally connected. The heat pipe 22 condensation section 224 is received in the annular passage formed by the first and second receiving grooves 322, 342 of the first and second fin sets 32, 34, and the two heat pipes 22 and the two condensation sections 224 The ends are butted together. The fan 40 is mounted in the central portion 324 of the first fin set 32 and surrounds the second fin set 34 and the condensation section 224 of the heat pipe 22. The fan cover 50 covers the top surface of the heat sink 30 , and the fan 50 fixing frame 52 is wrapped around the outer periphery of the second fin set 34 and fastened to the second fin set 34 . The fan cover 50 covers the heat pipe 22 . The connecting section 226 is above and the connecting section 226 extends upward into the fan cover 50. When the heat dissipating device is in use, the heat generated by the heat-generating electronic component is directly absorbed by the first substrate 12, uniformly distributed to the first and second fin sets 32, 34 of the heat sink 30 through the heat pipe 22, and finally by the fan. 40 The generated low-temperature airflow is radiated into the surrounding air, from the effect of achieving efficient and rapid cooling of the electronic components of the heat-generating 201029556. The evaporation section 222 and the condensation section '224 of the heat sink heat pipe 22 are respectively sandwiched between the first and second substrates U, 14 and the first and second, and the fins 32, 34. The installation process only needs to apply these. The components related to tin lean are placed one by one, and then the high temperature baking is performed to complete the assembly of the heat dissipation 30 and the heat pipe group 20 and the base 10. Also. Also, Z avoids material overflow due to the insertion of the heat pipe 22, which is beneficial to the filling of the gap between the second and second fin groups 12 and 14 and the heat pipe 22, thereby improving the welding quality of the product and effectively ensuring product performance. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent in this case. Equivalent modifications or variations made by those skilled in the art to the spirit of the invention are intended to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat sink according to an embodiment of the present invention. 2 is an exploded view of the heat sink shown in FIG. 1. FIG. 3 is a partially assembled view of the heat sink shown in FIG. 2. FIG. 4 is an assembled view of another part of the heat sink shown in FIG. 2. Figure 5 is a front elevational view of the heat sink of Figure 1. 201029556 [Description of main component symbols] Base 10 First substrate 12 Groove 120, 140 Mounting hole 122 Second substrate 14 Heat pipe combination 20 Heat pipe 22 Evaporation section 222 Condensation section 224 Connection section 226 Heat sink 30 First die set 32 First Baffle 320 First accommodating groove 322 accommodating portion 324 Ventilation hole 326 Second fin group 34 Second fin 340 Second accommodating groove 342 Fan 40 Impeller group 42 Fixed substrate 44 Fan cover 50 Fixed frame 52 NET cover 54 Lu