TW201028351A - Method of making a component carrier tape - Google Patents

Method of making a component carrier tape Download PDF

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Publication number
TW201028351A
TW201028351A TW98141189A TW98141189A TW201028351A TW 201028351 A TW201028351 A TW 201028351A TW 98141189 A TW98141189 A TW 98141189A TW 98141189 A TW98141189 A TW 98141189A TW 201028351 A TW201028351 A TW 201028351A
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TW
Taiwan
Prior art keywords
carrier tape
cutting tool
recesses
recess
vacuum
Prior art date
Application number
TW98141189A
Other languages
Chinese (zh)
Inventor
Shiow Shya Ling
Anthonius
Kam Poi Chia
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201028351A publication Critical patent/TW201028351A/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips
    • H01L21/67336Trays for chips characterized by a material, a roughness, a coating or the like
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)

Abstract

Provided is a flexible carrier tape having multiple pockets for storage and delivery of components, the carrier tape being made by providing a web of a flexible thermoplastic polymer formed into the shape of a carrier tape having multiple pockets and exposing the bottom wall of each pocket to a cutting tool to form a vacuum slit in the bottom wall.

Description

201028351 六、發明說明: 【發明所屬之技術領域】 本發明大致上係關於—制於將組件從—組件製造機輸 送至-另-將組件裝配成新產品之製造機之承載帶。 【先前技術】 大致上’用於將組件從—組件製造機輸駐—另一將組 件裝配成新產品之製造機之承載帶係眾所周知。例如,在 t子電路總成領域中,電子組件通常係從一此等組件之源 傳送至一電路板上之一特定位置以附接其上。 .通常用-熱成型作業製造承載帶,其卜熱塑性聚合物 被運送至-形成該等組件凹部之模具内。該熱成型薄片通 常被冷卻至環境溫度。 組件有彈出或跳出該凹部的趨勢,因此在該凹部之底部 併入真工孔。此真空孔係用於在藉由向該孔施加一負壓 力而固定該承載帶時壓住組件,其將該組件保持頂住該凹 部之底部。 9 二而隨著組件變得越小且越輕,即便該凹部包含一真 二孔組件彈出及跳出該凹部之情況仍越來越多。 產生此真空孔之習知#法係藉由機械地打穿該承載帶之 。隨著電子組件日趨微型化,現有打孔方法面臨其製 切·月b力之限制。另外,打孔產生可能污染組件之廢物(廢 液)及灰塵’其在製造精密電子零件時,特別受關注。另 外該熱塑性薄片可為—難以打孔之勤性、彈性材料。因 此’打孔機磨損或損壞且必須經常更換。精密打孔機係 144903.doc 201028351 貴且將其等更換係一耗時程序,該程序需要對新打孔機進 行精密對準及重新定時。 【發明内容】 本發明之一態樣係關於一種製作一用於儲存及運送組件 之撓性承載帶之方法,該承載帶包括複數個用於承载組件 之凹部,該方法包括: ⑷提供-撓性熱塑性聚合物薄片,該薄片係形成為一 具有多個凹部之承載帶之形狀; ❹ ⑻將各凹部之底料露至—刀割工具以在該底壁中形 成一真空狹縫。 本發明之另—態樣係關於—種承載帶,該承載帶包括一 系列凹部’各凹部具有至少一前側壁、背側壁及一底壁, 其中该底壁含有一真空狹縫。 本發明之至少一實施例之一偻 馒點係在使組件由於該等真 二開口之高寬高比及大的洎面 士 1 Μ Μ面積而受到高真空牽拉力的同 時,提供能夠容納小組件之承載帶。 ❿ 本發明之至少一眚祐彳S,丨·> ,ε 一優點係其在諸承載帶中提供 精雄、形成之諸真空開口。 本發明之至少一眚祐β丨4 _ 一優點係其使承載帶製造方法 的產量增加。 h執常表政乃次 +發明之至少 韵癱* π々斗士 叹和丨尔丹提供一用於在諸承 载帶中形成諸真空開口之 fc卜係具私眘# 其與—些先前技術方法相 比係易於實施、易於維持且產生較少之碎屑。 如此申請案中所使用 「 具二孔」意指在一承載帶凹 144903.doc 201028351 部之底壁中具有一 1:1之寬高比之一開口。 如此申請案中所使用的,「真空狹缝」意指在一承載帶 凹部之底壁中具有一大於1:1之寬高比之一開口。 如此申請案中所使用的,「寬高比」意指寬與高之比 率’寬為最長尺寸,不管該真空狭縫在該承載帶凹部之底 壁之定位。 【實施方式】 φ 包含隨附圖式以提供對實施例之進一步理解,且隨附圖 式被併入並構成本說明書之一部分。圖式繪示實施例,且 與描述起用於解釋實施例之原則。由於參考下列詳細描 述使其他實施例及實施例之預期優點變得更好理解,因此 可谷易地瞭解其。圖式之元件無需相對於彼此按比例進行 調整。相同的組件符號代表對應的類似部分。 在下列詳細描述令,參考隨附圖式,其等構成本文之一 底部 前部 背 厂 部分,且顯示為其令實踐本發明之閣釋專用實施例。在此 φ 方面,方向術語(例如「頂部 部」、「最前端」、「最末端」等)係相對於正在描述之該(等) 圖^之疋向而使用。由於實施例之組件可定位為許多不同 之定向’因此方向術語係用於闡釋之目的,且絕非限制。 月解在不脫離本發明之範圍之情況下可使用其他實施例 限制意義,且本發二二下列詳細描述不能理解為 之範圍係由附加申請專利範圍定義。 先圖式’圖1A及圖1特示-具有—真空孔⑴之 j技術之承载帶。所緣示之承載帶_具有一帶狀部分 144903.doc 201028351 102 7帶狀部分界定—頂部表面及—與該頂部表面相對 之底°P表面。帶狀部分102包含諸縱向邊緣表面104及 1〇6 ’及—列對齊的前進結構⑽及11G,其等形成於-(且 較佳為兩個)邊緣表面中並沿著該(等)邊緣表㈣伸。諸前 進結構108及11〇提供—用於嚙合地容納一前進機構之構 件。 如圖1 A所不,一系列凹部112係形成於帶狀部分1〇2中, 且…者”亥帶狀部分被分隔開,該等凹部之開口穿透該帶狀 部分之該頂部表面。在料示之實施射,各凹部包含四 個側壁114 ’每_者相對於各鄰接壁成大致直角。諸側壁 114鄰接該帶狀部分之該頂部表面且從該帶狀部分之該頂 部表面向下延伸並鄰接底壁116以形成凹部112。底壁116 大致上係平坦且與帶狀部分102之平面平行。如圖酬 不,底壁116包含一直办?丨110 _ . ^ 具工孔118,該真空孔係用於向該凹部 施加一真空以使該等凹部更有效率地裝載組件。 大致上,諸凹部112係經設計以符合其等所旨在容納之 該等組件之大小與形狀。雖然未明料示,但是該等凹部 與較佳實施例中所顯示之四個側壁相比可具有更多或更少 之側壁。大致上’各凹部包含至少一側壁,該側壁鄰接帶 狀部分Η)2並從該帶狀部分向下延伸;及—底壁,該底壁 鄰接該侧壁以形成該凹部。因此’該等凹部可為圓形、橢 圓形、三角形、五角形或具有其他形狀之外形。各側壁亦 可形成為具有-小斜度(即—朝向或遠離該凹部之中心之 2。至12。之傾斜)以促進該組件之插入,並在製造該承載帶 144903.doc * 6 - 201028351 期間協助將該凹部從—且 之深度亦可依據該凹部所二容離:來。該凹部 部…可形成為具有變:座另 才干、轨條、附件及发你翻 土座 特定組件。雖缺圈切 徵以更好地容納或支揮 以上之針/ 一單行之凹部,但是兩行或兩行 個组件亦可沿著該帶狀部分之長度形成以促進多 個·.且件之同時運送。· _該等仃之凹部經配置為彼此平201028351 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention generally relates to a carrier tape for a manufacturing machine that transports components from a component manufacturing machine to another assembly component into a new product. [Prior Art] A carrier tape of a manufacturing machine for substantially assembling a component from a component manufacturing machine - another assembly of a component into a new product is known. For example, in the field of t-sub-circuit assemblies, electronic components are typically transferred from a source of such components to a particular location on a circuit board for attachment thereto. Carrier tapes are typically produced by a thermoforming operation in which the thermoplastic polymer is carried into a mold that forms the recesses of the components. The thermoformed sheet is typically cooled to ambient temperature. The component has a tendency to pop out or jump out of the recess, thus incorporating a coin hole at the bottom of the recess. The vacuum port is for pressing the assembly when the carrier tape is secured by applying a negative pressure to the hole, which holds the assembly against the bottom of the recess. 9 and as the components become smaller and lighter, even though the recess contains a true two-hole assembly that pops up and jumps out of the recess. The conventional method of creating such a vacuum hole is to mechanically penetrate the carrier tape. As electronic components become more and more miniaturized, existing punching methods are limited by their cutting and monthly force. In addition, drilling creates waste (waste) and dust that can contaminate components. It is of particular concern when manufacturing precision electronic components. In addition, the thermoplastic sheet can be a flexible, elastic material that is difficult to punch. Therefore, the puncher is worn or damaged and must be replaced frequently. Precision Punch Machine 144903.doc 201028351 It is expensive and replaces it with a time-consuming program that requires precise alignment and retiming of the new puncher. SUMMARY OF THE INVENTION One aspect of the present invention is directed to a method of making a flexible carrier tape for storing and transporting components, the carrier tape comprising a plurality of recesses for carrying components, the method comprising: (4) providing - scratching A thermoplastic polymer sheet formed into a shape of a carrier tape having a plurality of recesses; ❹ (8) exposing the bottoms of the recesses to a knife cutting tool to form a vacuum slit in the bottom wall. A further aspect of the invention relates to a carrier tape comprising a series of recesses. Each recess has at least one front side wall, a back side wall and a bottom wall, wherein the bottom wall contains a vacuum slit. One of the embodiments of at least one embodiment of the present invention provides for accommodating the assembly to be subjected to a high vacuum pulling force due to the aspect ratio of the true two openings and the large 洎 1 Μ Μ area. Carrier tape for small components.至少 At least one of the inventions S, 丨·>, ε has the advantage of providing a vacuum opening in the carrier tape. An advantage of at least one of the present invention is that it increases the yield of the carrier tape manufacturing process. h 执 表 乃 + + + 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供It is easier to implement, easier to maintain, and produces less debris. The term "two-hole" as used in this application means that there is a 1:1 aspect ratio opening in the bottom wall of a portion 144903.doc 201028351. As used in this application, "vacuum slit" means an opening having a width to height ratio greater than 1:1 in the bottom wall of a recess of a carrier tape. As used in this application, "aspect ratio" means that the ratio of width to height is the widest dimension, regardless of the positioning of the vacuum slit in the bottom wall of the recess of the carrier tape. [Embodiment] φ is included to provide a further understanding of the embodiments, and is incorporated in and constitutes a part of the specification. The drawings illustrate embodiments and, together with the description, the principles of the embodiments. The advantages of the other embodiments and examples are better understood by reference to the following detailed description. The elements of the drawings need not be scaled relative to each other. The same component symbols represent corresponding similar parts. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following detailed description, reference is made to the accompanying drawings in which: In terms of φ, directional terms (such as "top part", "front end", "end end", etc.) are used with respect to the orientation of the (etc.) figure being described. Since the components of the embodiments can be positioned in many different orientations, the directional terminology is used for purposes of explanation and is in no way limiting. Other embodiments may be used without departing from the scope of the invention, and the following detailed description is not to be construed as limited by the scope of the appended claims. Fig. 1A and Fig. 1 show a carrier tape having a vacuum hole (1). The carrier tape as shown has a strip portion 144903.doc 201028351 102 7 The strip portion defines a top surface and a bottom surface P opposite the top surface. The strip portion 102 includes longitudinal edge surfaces 104 and 1 〇 6 ′ and column aligned advancement structures (10) and 11G formed in the (and preferably two) edge surfaces along the (equal) edge Table (4) Extension. The advancement structures 108 and 11 are provided with means for engagingly receiving an advancement mechanism. As shown in FIG. 1A, a series of recesses 112 are formed in the strip portion 1〇2, and the "black strip portions are separated, and the openings of the recess portions penetrate the top surface of the strip portion. In the illustrated embodiment, each recess includes four side walls 114' each at substantially right angles to each adjacent wall. The side walls 114 abut the top surface of the strip portion and from the top surface of the strip portion The bottom wall 116 extends downwardly and abuts the bottom wall 116 to form a recess 112. The bottom wall 116 is substantially flat and parallel to the plane of the strip portion 102. As shown in the figure, the bottom wall 116 contains a plurality of holes 丨 110 _ . 118. The vacuum aperture is for applying a vacuum to the recess to cause the recesses to load the assembly more efficiently. Generally, the recesses 112 are designed to conform to the size of the components that they are intended to accommodate. Shapes. Although not explicitly shown, the recesses may have more or fewer side walls than the four side walls shown in the preferred embodiment. The substantially 'each recess includes at least one side wall that abuts the strip Partially)) 2 and descending from the strip portion And a bottom wall, the bottom wall abutting the side wall to form the recess. Therefore, the recesses may be circular, elliptical, triangular, pentagonal or have other shapes. The side walls may also be formed with - a small slope (i.e., 2 to 12 degrees from the center of the recess) to facilitate insertion of the assembly and assist in the removal of the recess during manufacture of the carrier tape 144903.doc * 6 - 201028351 - and The depth can also be based on the two recesses of the recess: the recess can be formed to have a variable: the other components, the rails, the attachments and the specific components of the tiller. The upper needle/one-row recess is accommodated or supported, but two or two rows of components may be formed along the length of the strip portion to facilitate the simultaneous transport of the plurality of pieces. _The same The recesses are configured to be flat with each other

於-對^行令之諸凹部與該(等)相鄰行中之該等凹部處 :狀部分102可由任何具有一足夠厚度及撓性以使其可 繞者一儲存捲筒之輪較捲繞之聚合材料形成。可使用多種 聚合材料,包含但不限於聚醋(例如乙二醇改性聚對苯二 甲酸乙二醋)、聚碳酸醋、聚丙烯、聚苯乙稀、聚氯乙稀 及丙稀腈丁 —烯苯乙烯聚合物。帶狀部分iG2可為光學上 透明、經染色或經更改為電耗散。在後—種情況中,該帶 狀物可包含-導電性材料(例如碳黑或五氧化二鈒),其散 佈於該聚合材料内或隨後塗佈至該帶狀H導電性材 料使彳于一電荷可消散於整個承載帶及較佳地消散至地面。 此特徵可防止由於-累積之靜電荷而破土裒包含於該承載帶 内之組件。 承載帶100通常進一步包含一長型蓋子12〇,雖然其存在 係視需要。在該承載帶之該等凹部上方施加蓋子12〇以固 持其中之該等組件。如圖1A及圖1]8最佳所示,蓋子120係 可撓’疊加於部分或(更佳地)所有凹部丨i 2上,且沿著帶狀 144903.doc 201028351 部分i〇2之長度方向安裝於諸前進結構⑽及iiq列之間。 蓋子12〇係可脫離地以於帶狀部分1Q2之該頂部表面從而 可隨後將其移除以接達所儲存之組件。㈣示,蓋子120 包含諸平行縱向結合部分122及124,其等係各自接合至帶 狀部分102之諸縱向邊緣表面1〇4及1〇6。例如,可使用一 壓敏黏著劑(例如一丙烯酸酯材料)或一熱活化黏著劑將該 蓋子黏者至諸邊緣表面1〇4及1〇6。 圖2A繪不以承載帶200形式之本發明之一實施例。除了 本發明之承載帶200包括諸凹部212之該底部216中之諸真 空狹縫228,而非諸凹部112之該等底壁116中之諸真空孔 118之外,其與先如技術之承載帶100類似。雖然圖2A中之 該等真空狹縫延伸至諸凹部212之整個長度(前面至背面)且 亦部分地延伸入前側及背侧壁214,但是在其他實施例 中,諸真空狹縫228可為更小,使得其等僅在凹部212長度 之一部分上方延伸。圖2B及圖2C顯示具有部分真空狹縫 之本發明之實施例之實例。在圖2B中,真空狹縫228延伸 穿過部分底壁21 6並穿過一側壁214(該前側壁或背側壁可 包含真空狹縫228)。在圖2C中,真空狹縫228僅延伸穿過 部分底壁2 16且未延伸穿過該前側壁或背側壁214。此外, 諸真空狹縫228可在該等凹部212之該底壁216上定向為任 何方向。為方便生產’通常較佳地將諸狹縫定向為該承载 帶1 0 0之縱向方向。 根據先前技術之方法,使用一打孔工具在該等承載帶 100之該等底壁116中機械地打出諸真空孔118。該打孔工 I44903.doc 201028351 具具有一系列相鄰的打孔銷,該等打孔銷同時在幾個相鄰 凹部t打孔。該等打孔銷必須精密地分隔開使得各打孔銷 在—合適位置打穿一凹部112之該底壁116。將各打孔銷手 動對齊以確保與該承載帶之關鍵特徵之適當對齊。需要定 期維護及磨光以確保工具的銳利以提供整齊的穿孔。 Ο Φ 根據本發明之一方法,可使用一單個旋轉或靜止工具以 在—承載帶之該等凹部底部中連續地產生諸開口。該方法 可更快地實施且亦可使該等所形成 該切割工具的更佳性能,僅需要最小的維護及寺磨光。:: 明之方法包含將-㈣工具與該等承载帶凹部之底部對 齊,並連續地將該切心具帶至與各接續的凹部底部相接 觸。此可以許多方式完成。該切割工具可為直線或圓形, 且可為'止或可移動。在該帶保持靜止時可移動該切割 :,在忒切割工具保持靜止時,可移動該帶;或移動該 刀口彳工具與該帶兩者。諸直办 諸1在一批量製程中形成 部之該等底壁中,即諸真空開口可同時形成 直口=鄰凹部中,隨後連續承載帶薄片被推進且諸 —開口叫形成於—第二群組之相鄰 或者,且更佳祕叫士 Τ汉寻寻 更佳地,绪真空開口係連續地前 -凹部底部中,即,當各隨後 "成於 工具相接觸時,……一…破帶至與該切割 連續承載帶薄片(或切割工且 一恆定速度移動。 /、)連續地以 在本發明之一實施例中,可將一直線 拉動穿越-靜止承载 、’(例如-刀片) 承栽帶之-糸列凹部底部以在各凹部中產 144903.doc 201028351 生諸狹縫。在另一眘始& 、士“ 财…承㈣之該等凹部底部可 被拉動至一靜止圓形刀 丨原。P可 在又-4上方以在細部巾形成諸狹縫。 在又一貫施例中,在— 纟载帶之該等凹部穿過該旋轉㈣ 工具之該旋轉圓形刀片上方時,可操 轉切割 刀片之旋轉切割工具(例如_ ^ 、圓形移動 〃(例如一用於切割半導體晶圓之工 八 l虽旋轉切割工具係-切割鋸(例如可購自曰本 DISCO公司型號為〇1?£>634〇之切割鋸)。 當該等凹部被帶至與該切割工具接觸時,該 持平坦或可保持為-彎曲姿態。若該承載帶係保 曲姿態,則與該承載帶保持一平坦姿態時相比’該等 凹部之該底部表面216可被分隔為距離彼此更遠。該彎曲 妾態之弧度以及該切割工具之大小及形狀將部分地決定同 時有多少凹部與該切割工具接觸。若該弧度係大,則許多 凹部可同時與該切割工具接觸。若該弧度係小,則可妒一 次將-單個凹部帶至與該切割工具接觸。為達成圖=圖 2C中所示之該等部分真空狹縫’需要一次將—單個凹部帶 至與該切割工具接觸。若如圖3所示,該切割工具係一具 有—大體小於該承載帶200之該弧度之弧度之該旋轉工具 5〇〇,則亦可達成圖2B及圖2C之該等部分真空狹縫。該等 部分真空狹縫之好處係該凹部在提供一真空特徵的同時, 保留一大體數量之結構支撐。 本發明之該等承載帶在電子產業用於輸送及運送電子組 件(例如記憶體晶片、積體電路晶片、電阻器、連接器、 雙列直插式處理器、電容器、閘極陣列等)係特別有用。 144903.doc •10- 201028351 雖然本發明之該等承載帶亦可心輸送其他通常被運送至 精密佈置機器之小組件(例如手錶彈簧、小螺絲、表面安 裝電組件遮罩及類似物)。 現在已經參考其中數個實施例描述本發明。熟習此項技 術者應瞭解在不脫離本發明之範圍的情況下,可對實施例 進行許多更改。因此本發明之範圍應不受限於本文所描述 之結構’但僅受限於申請專利 月寻利範圍語言所描述的結構及該 等結構的等效物。 【圖式簡單說明】 ㈣係-先前技術之承栽帶之—部分俯視透視圖,該承 載帶之-蓋子已被部分移除以顯示儲存於該承载帶内之諸 組件; 圖1Β係圖1Α之該承載帶之一部分仰視透視圖; 圖2A-2C係本發明之一承载帶之各種實施例之部分仰視 透視圖;及 φ 圖3係本發明之一方法之一圖解。 【主要元件符號說明】 100 承載帶 102 帶狀部分 104 縱向邊緣表面 106 縱向邊緣表面 108 前進結構 110 前進結構 112 凹部 144903.doc 201028351 114 側壁 116 底壁 118 120 122 124 200 212 214 216 228 500 真空孔 蓋子 平行縱向結合部分 平行縱向結合部分 承載帶 凹部 側壁 底部 真空狹缝 旋轉工具 -12- 144903.docThe recesses in the row and the recesses in the adjacent row: the portion 102 can be any roll having a sufficient thickness and flexibility to allow it to be wrapped around a roll Formed around the polymeric material. A variety of polymeric materials can be used, including but not limited to polyester (eg, ethylene glycol modified polyethylene terephthalate), polycarbonate, polypropylene, polystyrene, polyvinyl chloride, and acrylonitrile - an olefinic styrene polymer. The strip portion iG2 can be optically transparent, dyed or altered to electrical dissipation. In the latter case, the ribbon may comprise a conductive material (eg, carbon black or tantalum pentoxide) dispersed within the polymeric material or subsequently applied to the ribbon H conductive material to cause A charge can be dissipated throughout the carrier tape and preferably dissipated to the surface. This feature prevents the inclusion of components contained within the carrier tape due to the accumulated static charge. Carrier tape 100 typically further includes an elongated cover 12, although it is present as desired. A cover 12 is applied over the recesses of the carrier tape to hold the components therein. As best seen in Figures 1A and 1], the cover 120 is flexibly 'superimposed' on a portion or (more preferably) all of the recesses 丨i 2 and along the length of the strip 144903.doc 201028351 portion i〇2 The direction is mounted between the advancement structures (10) and the iiq columns. The cover 12 is detachably attached to the top surface of the strip portion 1Q2 so that it can be subsequently removed for access to the stored components. (d) The cover 120 includes parallel longitudinal joint portions 122 and 124 which are each joined to the longitudinal edge surfaces 1〇4 and 1〇6 of the strip portion 102. For example, the cover may be adhered to the edge surfaces 1〇4 and 1〇6 using a pressure sensitive adhesive such as an acrylate material or a heat activated adhesive. 2A depicts an embodiment of the invention not in the form of a carrier tape 200. In addition to the vacuum tape slits 228 in the bottom portion 216 of the recesses 212 of the present invention, rather than the vacuum holes 118 in the bottom walls 116 of the recesses 112, it is loaded with the prior art. The belt 100 is similar. Although the vacuum slits in FIG. 2A extend to the entire length (front to back) of the recesses 212 and also partially into the front and back sidewalls 214, in other embodiments, the vacuum slits 228 may be It is smaller such that it extends only over a portion of the length of the recess 212. 2B and 2C show an example of an embodiment of the invention having a partial vacuum slit. In Figure 2B, vacuum slit 228 extends through a portion of bottom wall 216 and through a side wall 214 (which may include vacuum slit 228). In Figure 2C, vacuum slit 228 extends only through a portion of bottom wall 2 16 and does not extend through the front or back sidewall 214. Additionally, vacuum slits 228 may be oriented in any direction on the bottom wall 216 of the recesses 212. For ease of production, the slits are typically preferably oriented in the longitudinal direction of the carrier tape 100. Vacuum holes 118 are mechanically punched in the bottom walls 116 of the carrier strips 100 using a perforating tool in accordance with prior art methods. The puncturing machine I44903.doc 201028351 has a series of adjacent perforating pins which are simultaneously perforated in several adjacent recesses t. The perforated pins must be precisely spaced such that each of the perforated pins penetrates the bottom wall 116 of a recess 112 in a suitable position. Manually align the perforated pins to ensure proper alignment with the key features of the carrier tape. Regular maintenance and polishing are required to ensure the sharpness of the tool to provide neat perforations. Φ Φ According to one of the methods of the present invention, a single rotating or stationary tool can be used to continuously create openings in the bottom of the recesses of the carrier tape. This method can be implemented faster and can also result in better performance of the cutting tool that is formed, requiring minimal maintenance and temple polishing. The method of illuminating comprises aligning the - (iv) tool with the bottom of the recess of the carrier tape and continuously bringing the centring device into contact with the bottom of each successive recess. This can be done in a number of ways. The cutting tool can be straight or circular and can be 'stop or moveable. The cutting can be moved while the belt remains stationary: the belt can be moved while the cutting tool remains stationary; or the knife edge tool and the belt can be moved. Each of the bottom walls of the forming portion in a batch process, that is, the vacuum openings can simultaneously form a straight mouth = adjacent recesses, and then the continuous carrier strip is advanced and the openings are formed in - second Adjacent to the group or, more preferably, the singer is looking for a better place, and the vacuum opening is continuously in the front-recess bottom, that is, when each subsequent "in contact with the tool, ... ...breaking to the cutting continuous carrier strip sheet (or cutter and moving at a constant speed. /,) continuously in one embodiment of the invention, the straight line can be pulled across the stationary bearing, '(eg - blade The bearing belt - the bottom of the recessed portion to produce 144903.doc 201028351 in each recess. At the bottom of the recesses of the other discretion & 士, 财... (4), the bottom of the recesses can be pulled to a stationary circular knife. P can be formed above the -4 to form slits in the thin towel. In the embodiment, when the recesses of the carrier tape pass over the rotating circular blade of the rotating (four) tool, the rotary cutting tool of the cutting blade can be operated (for example, _ ^, circular movement 〃 (for example, one) For the cutting of semiconductor wafers, although the rotary cutting tool-cutting saw (for example, a cutting saw that can be purchased from the DISCO company model 〇1?£>634〇), when the recesses are brought to When the cutting tool is in contact, it is flat or can be maintained in a curved posture. If the carrier belt is in a buckling posture, the bottom surface 216 of the recesses can be separated as compared to when the carrier belt maintains a flat posture. Farther from each other. The curvature of the curved state and the size and shape of the cutting tool will determine in part how many recesses are in contact with the cutting tool. If the curvature is large, a plurality of recesses can simultaneously contact the cutting tool. If the arc is small, then妒 Bringing a single recess to the cutting tool at a time. To achieve the partial vacuum slits shown in Figure 2C, it is necessary to bring a single recess into contact with the cutting tool. It is shown that the cutting tool has a rotating tool 5 that is substantially smaller than the arc of the arc of the carrier tape 200, and the partial vacuum slits of FIGS. 2B and 2C can also be achieved. The advantage of the seam is that the recess provides a vacuum feature while retaining a substantial amount of structural support. The carrier tapes of the present invention are used in the electronics industry for transporting and transporting electronic components (eg, memory chips, integrated circuit chips, Resistors, connectors, dual in-line processors, capacitors, gate arrays, etc. are particularly useful. 144903.doc •10- 201028351 Although the carrier tapes of the present invention can also be transported by others, they are usually transported to precision. Arranging small components of the machine (such as watch springs, small screws, surface mount electrical component covers, and the like). The invention has now been described with reference to a few embodiments thereof. It will be appreciated by those skilled in the art that many modifications may be made to the embodiments without departing from the scope of the invention. The scope of the invention should therefore not be limited to the structure described herein. The structure described by the language and the equivalent of the structure. [Simple description of the diagram] (4) The system-previous perspective view of the bearing belt, the carrier-the cover has been partially removed to show the storage Figure 1A-2C is a partial bottom perspective view of various embodiments of a carrier tape of the present invention; and φ Figure 3 is a perspective view of a portion of the carrier tape of Figure 1A; One of the methods of the present invention is illustrated. [Main element symbol description] 100 carrier tape 102 strip portion 104 longitudinal edge surface 106 longitudinal edge surface 108 advancing structure 110 advancing structure 112 recess 144903.doc 201028351 114 side wall 116 bottom wall 118 120 122 124 200 212 214 216 228 500 vacuum hole cover parallel longitudinal joint part parallel longitudinal joint part bearing belt recess side wall bottom vacuum slit rotation tool - 12- 144903.doc

Claims (1)

201028351 七、申請專利範圍: 種製作-用於儲存及運送諸組件之撓性承載帶之方 λ表载帶包括複數個用於承載該等組件之凹部,該 方法包括: ⑷提供-撓性熱塑性聚合物薄片,該薄片經成形為一 具有多個凹部之承載帶之形狀; ()將各凹部之底壁暴露至一切割工具以在該底壁中形 _ 成—真空狹縫。 2·如請求们之方法,其中該切割工具係一旋轉工具。 3.如凊求項1之方法,其中該切割工具係一直線工具。 如明求項1之方法,其中在將該等凹部之該等底壁暴露 至該切割工具時,該承載帶被彎成一弧形。 士吻求項1之方法,其中該切割工具係保持靜止,且該 承載π係抵靠著該切割工具而移動。 6. 如4求項!之方法,其中該承載帶係保持靜止,且該切 φ 。丨工具係抵靠著該承載帶而移動。 7. 如吻求項1之方法,其中該切割工具與該承載帶兩者係 彼此抵靠而移動。 8·如π求項7之方法,其中該切割工具及承載帶係彼此抵 靠而朝相反方向移動。 9. 如吻求項2之方法,其中該旋轉切割工具係一旋轉圓形 刀片。 10. 如吻求項3之方法,其中該直線切割工具係一直邊刀 片。 144903.doc 201028351201028351 VII. Scope of Application: Production - The λ strap of a flexible carrier for storing and transporting components includes a plurality of recesses for carrying the components, the method comprising: (4) providing - flexible thermoplastic a polymer sheet formed into a shape of a carrier tape having a plurality of recesses; () exposing the bottom wall of each recess to a cutting tool to form a vacuum slit in the bottom wall. 2. The method of claimants, wherein the cutting tool is a rotary tool. 3. The method of claim 1, wherein the cutting tool is a linear tool. The method of claim 1, wherein the carrier tape is bent into an arc shape when the bottom walls of the recesses are exposed to the cutting tool. The method of claim 1, wherein the cutting tool remains stationary and the carrier π is moved against the cutting tool. 6. Such as 4 items! The method wherein the carrier tape remains stationary and the cut is φ. The 丨 tool is moved against the carrier tape. 7. The method of claim 1, wherein the cutting tool and the carrier tape move against each other. 8. The method of claim 7, wherein the cutting tool and the carrier tape abut each other to move in opposite directions. 9. The method of claim 2, wherein the rotary cutting tool rotates a circular blade. 10. The method of claim 3, wherein the linear cutting tool is a side blade. 144903.doc 201028351 如請求項11之承栽帶, 呑一系列凹部,各凹部具有至少一 一底壁’其中該底壁含有一直办 真空狹 一部分上方延伸, 帶,其中該真空狹縫在該背壁之至少 且部分地延伸入該前側壁及該背侧壁 之至少一者。 13-如請求項11之承栽帶,其中該真空狹縫在該背壁之整個 長度上方延伸’且部分地延伸入該前側壁及該背側壁兩 者。 14.如請求項11之承載帶,其中該真空狹縫在該背壁之僅一 部分上方延伸’且未延伸入該前侧壁或該背側壁。 144903.docThe tape of claim 11, wherein the recess has a plurality of recesses, each recess having at least one bottom wall ′ wherein the bottom wall includes a portion extending upwardly from the vacuum, wherein the vacuum slit is at least Partially extending into at least one of the front side wall and the back side wall. 13- The carrier tape of claim 11, wherein the vacuum slit extends over the entire length of the back wall and extends partially into both the front side wall and the back side wall. 14. The carrier tape of claim 11, wherein the vacuum slit extends over only a portion of the back wall and does not extend into the front side wall or the back side wall. 144903.doc
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