201024613 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明關於一種照明裝置，特別是一種用於高功率發光 [0002] 二極體之照明裝置，該照明裝置之發光二極體同時跨設 於印刷電路板及散熱基板之上表面。 【先前技術】 高效率與高亮度之發光二極體（LED)在作動時會散發熱量 ，累積的熱量將使得溫度的升高而對發光二極體之發光 參 [0003] 效率與使用壽命造成不良之影響。 圖1為習知高亮度發光二極體之照明裝置之剖面圖。該照 明裝置1包括金屬電路板11、發光二極體12設置在金屬電 路板11上以及散熱器（heat sink)13設置在金屬電路板 下。金屬電路板11包括一利於散熱的金屬基板11丨，在金 屬基板111上依序形成絕緣層112以及猶刷電路113。發 光二極體12為了散熱在封裝底部設有备屬散熱墊 (pad)123，金屬散熱墊123藉由散熱f 14與金屬電路板 G 11之絕緣層112緊密結合，發光二極體12更包括正、負電 極121、122 ’焊接在金屬電路板11之印刷電路u3上， 以驅動發光二極體12。發光二極體12之金屬散熱塾123將 發光二極體12產生的熱經由金屬電路板11傳遞至散熱器 13。 [0004] 然而，上述之照明裝置1之金屬電路板11價格昂責。發光 二極體12藉由金屬散熱墊123向外漸次傳遞，且越遠離金 屬散熱墊123，散熱功能越有限。 【發明内容】 097151551 表單編號A0101 第3頁/共26頁 0972084103-0 201024613 [0005] [0006] [0007] ❿ [0008] 0 [0009] 有鑑於上述課題，本發明之一目的為提供一種照明裝置 ’藉由將散熱基板設置於印刷電路板之穿孔内，使發光 二極體同時跨設於印刷電路板及散熱基板之上表面，達 到散熱佳、成本低的優點》 本發明之另一目的為提供一種照明燈具，應用本發明之 照明裝置製成之燈具同樣具有散熱佳、成本低的優點。 為達上述目的，本發明提供一種照明裝置，其包括：一 印刷電路板’具有至少一穿孔；至少一散熱基板設置於 印刷電路板之穿孔内；至少一發光二極體，同時跨設於 該散熱基板以及該散熱基紙之上表面；以及一散熱器， 設置於該印刷電路板以及該_熱基板之下表海。 印刷電路板包括一絕緣基板及一第一印刺電路形成在絕 緣基板上。照明裝置更包括一導熱接著唐，設置於散熱 基板及散熱器之間，用以緊密連接散熱基板及散熱器。 導熱接著層為散熱膏或散熱勝（t;hermal pad)。散熱器 為鋁擠或壓鑄成型之散熱器或由:數片散熱鰭片組接之散 熱器。散熱基板藉由緊配合與印刷電路板結合為一體。 當散熱基板為非導電散熱基板或金屬基印刷電路板 (Metal Core Printed Circuit Board， MCPCB)時 .，散熱基板之上表面包括一第二印刷電路。發光二極體 包括一第一電極以及一第二電極。當發光二極體為熱電 不分離型發米二極體時，第二電極同時具有散熱墊及導 電電極的功能。發光二極體之第一電極與印刷電路板之 第一印刷電路電性連接，發光二極體之第二電極與散熱 097151551 表單煸號A0101 第4頁/共26頁 0972084103-0 201024613 [0010] 基板的第二印刷電路電性連接。 當發光二極體為熱電分離型發光二極體時，散熱塾與第 二電極並不電性連接，第一電極與印刷電路板一側之第 一印刷電路電性連接，第二電極與印刷電路板另一側之 第一印刷電路電性連接。 [0011] 承上所述，本發明之照明裝置，藉由將散熱基板設置於 印刷電路板之穿孔内，使發光二極體同時跨設於印刷電 路板及散熱基板之上表面，散熱器設置於印刷電路板以 ❹ 及散熱基板之下表面，達到散熱佳、成本低的優點。 [0012] 【實施方式】 以下將參照相關圖式，說明依據本發明較佳實施例之一 種照明裝置。 [0013] _ —奮施例 [0014] 圖2A為本發明第一實施例之照明，裝置$立體圖，圖2B為 ❿ 圖2 A之局部刮面圖。如圖2A及興#所示，該照明裝置2包 括印刷電路板21、至少一散熱基板22、至少一發光二極 體（LED)24 以及散熱器（heat sink)23。 [0015] 印刷電路板21具有至少一穿孔，印刷電路板21包括一絕 緣基板211及形成在絕緣基板211上的第一印刷電路212 ，絕緣基板211較佳為玻璃纖維膠片FR-4 (Flame-Retardant Substrate)。印刷電路板21 之每 一穿孔内設置一散熱基板22，散熱基板22可藉由緊配或 其他方式與印刷電路板21結合成一體，散熱基板22在本 實施例中可為非導電散熱基板、陶瓷基板或金屬基印刷 097151551 表單編號A0101 第5頁/共26頁 0972084103-0 201024613 電路板（Metal core printed circuit board， MCPCB)，散熱基板22之上表面包括一第二印刷電路222 。至少一發光二極體24跨設於印刷電路板21以及散熱基 板22之上表面，發光二極體24為高功率發光二極體，發 光二極體24包括一第一電極241和第二電極242，本實施 例之發光二極體24為熱電不分離型發光二極體，該第一 電極241為正電極，第二電極242同時具有散熱墊及負電 極的功能，散熱塾係用以傳導發光二極體24所產生的熱 ，其中第一電極241藉由焊錫焊接在印刷電路板21之第一 印刷電路212上’使第一電極241與第一印刷電路212電 性連接，第二電極242藉甴焊錫焊接.在散熱基板22的第二 印刷電路222上’使第二電極242與第二印刷電路222電 性連接。散熱器23設置在印刷電路板21及散熱基板22之 下表面，散熱器23可為鋁擠或壓鑄成型之散熱器或由數 片散熱鰭片組接之散熱器，散熱器23之材質為銅、鋁、 鐵、鎮合金、金屬或高熱傳導材質、照甩.裝置2更包括導 熱接著層26 ’設置於該散熱墓板及該散熱器之間，用以 緊密連接該散熱基板及該散熱器，導熱接著層26可為散 熱管或散熱膝，但不以此為限。所以發光二極體24產生 的熱可由第二電極242傳遞到散熱基板22再傳遞到散熱器 23，達到降低成本及有效散熱的效果。 [0016]照明裝置2更包括一導電元件25，以零歐姆電阻或導線為 較隹，導電元件25之一端藉由焊錫焊接至傲熱基板22的 第二印刷電路222，另一端藉由焊錫焊接至印刷電路板21 的第一印刷電路212。因此’藉由上述結構可將複數個發 097151551 表單編號A0101 第6頁/共26頁 0972084103-0 201024613 光二極體24串聯’如圖2A所示。 [0017] 竿-實施例- [0018] 圖3A為本發明第二實施例之照明裝置之立體圖，圖犯為 圖3A之局部剖面圖。如圖3几及抓所示’照明裝置2a與第 一實施例之照明裝置2不同之處在照明裝置2a包括另一發 光二極體24’ ，跨設在兩相鄰散熱基板22之上表面，其 中該發光二極體24’之第一電極24Γ藉由焊錫焊接至一 散熱基板22之第二印刷電路222,第二電極242’藉由焊 〇 錫焊接至另一散熱基板22之第二印刷t路222 »藉由上述 結構彳將複數俩發光二極體24串聯，如圖3A所示。照明 裝置2a之其餘結構與第一實施例之照明裝置2相同，不再 另為贅述。 [0019] 竿=實施创 [0020] 圖4為本發明第三實施例之照明裝置之剖面圖。如圖4所 示，該照明裝置2b與第一實施例之照明裝;置2不同之處在 • L" '~ 1 ||"' '.3 ί / ❹ 於照明裝置2b之散藏秦板22b為一金屬基板，發光二極體 24之第二電極242藉由焊錫焊接至散熱基板22b。導電元 件25之一端藉由焊錫焊接至散熱基板22b表面，另一端藉 由焊錫焊接至印刷電路板21的第一印刷電路212。藉由導 熱接著層26(如散熱膏或導熱膠’但不以此為限）使散熱 基板22b與散熱器23緊密連接，同時達到絕緣與散熱的功 效。因此，發光二極體24產生的熱可由第二電極242傳遞 到散熱基板22b再傳遞到散熱器23。該照明裝置2b之其餘 、结構與第一實施例之照明裝置2相同，不再另為贅述。 0972084103-0 097151551 表單編號A0101 第7頁/共26頁 201024613201024613 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a lighting device, and more particularly to a lighting device for a high power lighting [0002] diode, the light emitting diode of the lighting device simultaneously It is placed across the upper surface of the printed circuit board and the heat dissipation substrate. [Prior Art] High-efficiency and high-brightness LEDs emit heat when they are activated. The accumulated heat will cause the temperature to rise and cause the efficiency and service life of the LEDs [0003]. Bad influence. 1 is a cross-sectional view of a conventional high brightness light emitting diode illumination device. The illumination device 1 comprises a metal circuit board 11, a light-emitting diode 12 is disposed on the metal circuit board 11, and a heat sink 13 is disposed under the metal circuit board. The metal circuit board 11 includes a metal substrate 11 for heat dissipation, and an insulating layer 112 and a brush circuit 113 are sequentially formed on the metal substrate 111. The light-emitting diode 12 is provided with a heat-dissipating pad 123 at the bottom of the package for heat dissipation. The metal heat-dissipating pad 123 is tightly coupled to the insulating layer 112 of the metal circuit board G 11 by the heat dissipation f 14 , and the light-emitting diode 12 further includes The positive and negative electrodes 121, 122' are soldered to the printed circuit u3 of the metal circuit board 11 to drive the light-emitting diode 12. The metal heat sink 123 of the light-emitting diode 12 transfers the heat generated by the light-emitting diode 12 to the heat sink 13 via the metal circuit board 11. [0004] However, the metal circuit board 11 of the lighting device 1 described above is expensive. The light-emitting diode 12 is gradually radiated outward by the metal heat-dissipating pad 123, and the further away from the metal heat-dissipating pad 123, the more limited the heat-dissipating function. SUMMARY OF THE INVENTION 097151551 Form No. A0101 Page 3/26 Page 0972084103-0 201024613 [0005] [0007] [0008] In view of the above problems, an object of the present invention is to provide an illumination. The device has the advantages of good heat dissipation and low cost by providing the heat dissipation substrate in the perforation of the printed circuit board so that the light emitting diodes are simultaneously disposed on the upper surface of the printed circuit board and the heat dissipation substrate. In order to provide a lighting fixture, the lamp made by applying the lighting device of the invention also has the advantages of good heat dissipation and low cost. In order to achieve the above object, the present invention provides a lighting device, comprising: a printed circuit board having at least one through hole; at least one heat dissipation substrate disposed in a through hole of the printed circuit board; at least one light emitting diode disposed at the same time a heat dissipating substrate and an upper surface of the heat dissipating base paper; and a heat sink disposed on the printed circuit board and the surface of the heat substrate. The printed circuit board includes an insulative substrate and a first stray circuit formed on the insulating substrate. The illuminating device further comprises a heat conducting layer disposed between the heat dissipating substrate and the heat sink for closely connecting the heat dissipating substrate and the heat sink. The thermal conductive layer is a thermal paste or a hermal pad. The heat sink is a heat sink for aluminum extrusion or die casting or a heat sink that is assembled by several heat sink fins. The heat dissipation substrate is integrated with the printed circuit board by a tight fit. When the heat dissipation substrate is a non-conductive heat dissipation substrate or a metal core printed circuit board (MCPCB), the upper surface of the heat dissipation substrate includes a second printed circuit. The light emitting diode includes a first electrode and a second electrode. When the light-emitting diode is a thermoelectric non-separating type of rice-emitting diode, the second electrode has the functions of a heat-dissipating pad and a conductive electrode. The first electrode of the light-emitting diode is electrically connected to the first printed circuit of the printed circuit board, and the second electrode of the light-emitting diode and the heat-dissipating 097151551 form number A0101 page 4 / 26 pages 0972084103-0 201024613 [0010] The second printed circuit of the substrate is electrically connected. When the light emitting diode is a thermoelectric separation type light emitting diode, the heat sink is not electrically connected to the second electrode, and the first electrode is electrically connected to the first printed circuit on one side of the printed circuit board, and the second electrode is printed. The first printed circuit on the other side of the circuit board is electrically connected. [0011] According to the above, the illumination device of the present invention has the heat dissipation substrate disposed in the perforation of the printed circuit board, so that the light emitting diode is simultaneously disposed on the upper surface of the printed circuit board and the heat dissipation substrate, and the heat sink is disposed. In the printed circuit board, the lower surface of the substrate and the heat sink substrate achieve the advantages of good heat dissipation and low cost. [Embodiment] Hereinafter, a lighting device according to a preferred embodiment of the present invention will be described with reference to the related drawings. [0014] FIG. 2A is a perspective view of a lighting apparatus according to a first embodiment of the present invention, and FIG. 2B is a partial scraping view of FIG. 2A. As shown in Figs. 2A and #, the illumination device 2 includes a printed circuit board 21, at least one heat dissipation substrate 22, at least one light emitting diode (LED) 24, and a heat sink 23. [0015] The printed circuit board 21 has at least one through hole. The printed circuit board 21 includes an insulating substrate 211 and a first printed circuit 212 formed on the insulating substrate 211. The insulating substrate 211 is preferably a fiberglass film FR-4 (Flame- Retardant Substrate). A heat dissipating substrate 22 is disposed in each of the perforations of the printed circuit board 21, and the heat dissipating substrate 22 can be integrated with the printed circuit board 21 by a tight fit or other means. The heat dissipating substrate 22 can be a non-conductive heat dissipating substrate in this embodiment. Ceramic substrate or metal-based printing 097151551 Form No. A0101 Page 5 / 26 pages 0972084103-0 201024613 Circuit board (Metal core printed circuit board, MCPCB), the upper surface of the heat dissipation substrate 22 includes a second printed circuit 222. At least one light-emitting diode 24 is disposed on the upper surface of the printed circuit board 21 and the heat dissipation substrate 22, the light-emitting diode 24 is a high-power light-emitting diode, and the light-emitting diode 24 includes a first electrode 241 and a second electrode. 242, the light-emitting diode 24 of the embodiment is a thermoelectric non-separating type light-emitting diode, the first electrode 241 is a positive electrode, and the second electrode 242 has the functions of a heat-dissipating pad and a negative electrode, and the heat-dissipating system is used for conducting The heat generated by the light-emitting diodes 24, wherein the first electrode 241 is soldered to the first printed circuit 212 of the printed circuit board 21 to electrically connect the first electrode 241 and the first printed circuit 212, the second electrode The second electrode 242 is electrically connected to the second printed circuit 222 on the second printed circuit 222 of the heat dissipation substrate 22 by solder soldering. The heat sink 23 is disposed on the lower surface of the printed circuit board 21 and the heat dissipation substrate 22. The heat sink 23 may be a heat sink formed by aluminum extrusion or die casting or a heat sink assembled by a plurality of heat dissipation fins. The heat sink 23 is made of copper. , aluminum, iron, town alloy, metal or high heat conductive material, according to the device. The device 2 further comprises a thermal conductive layer 26 ' disposed between the heat dissipation tomb and the heat sink for tightly connecting the heat dissipation substrate and the heat sink The thermal conductive adhesive layer 26 can be a heat pipe or a heat dissipating knee, but is not limited thereto. Therefore, the heat generated by the LEDs 24 can be transmitted from the second electrode 242 to the heat dissipation substrate 22 and then transferred to the heat sink 23, thereby achieving the effect of reducing cost and effectively dissipating heat. [0016] The illuminating device 2 further includes a conductive element 25 with a zero ohm resistor or wire as the 隹, one end of the conductive element 25 is soldered to the second printed circuit 222 of the sizzling substrate 22, and the other end is soldered by soldering. To the first printed circuit 212 of the printed circuit board 21. Therefore, by the above structure, a plurality of 097151551 form numbers A0101, page 6 of 26 pages 0972084103-0 201024613, photodiodes 24 are connected in series as shown in Fig. 2A. [0018] FIG. 3A is a perspective view of a lighting device according to a second embodiment of the present invention, and is a partial cross-sectional view of FIG. 3A. 3, and the illumination device 2a is different from the illumination device 2 of the first embodiment, the illumination device 2a includes another light-emitting diode 24' spanning the upper surface of the two adjacent heat dissipation substrates 22. The first electrode 24 of the LED body 24' is soldered to the second printed circuit 222 of a heat dissipation substrate 22, and the second electrode 242' is soldered to the second of the other heat dissipation substrate 22 by soldering tin. The printed t-channel 222 » connects the plurality of light-emitting diodes 24 in series by the above structure, as shown in FIG. 3A. The rest of the structure of the lighting device 2a is the same as that of the lighting device 2 of the first embodiment, and will not be further described. 4 is a cross-sectional view of a lighting device according to a third embodiment of the present invention. [0020] FIG. As shown in FIG. 4, the lighting device 2b differs from the lighting device of the first embodiment in that L" '~ 1 ||"' '.3 ί / ❹ is scattered in the lighting device 2b. The plate 22b is a metal substrate, and the second electrode 242 of the light-emitting diode 24 is soldered to the heat dissipation substrate 22b. One end of the conductive member 25 is soldered to the surface of the heat dissipation substrate 22b, and the other end is soldered to the first printed circuit 212 of the printed circuit board 21. The heat-dissipating substrate 22b is tightly connected to the heat sink 23 by the heat-conducting adhesive layer 26 (e.g., heat-dissipating paste or thermal conductive paste), while achieving the effects of insulation and heat dissipation. Therefore, the heat generated by the light-emitting diodes 24 can be transferred from the second electrode 242 to the heat dissipation substrate 22b and then to the heat sink 23. The rest and structure of the illuminating device 2b are the same as those of the illuminating device 2 of the first embodiment, and will not be further described. 0972084103-0 097151551 Form No. A0101 Page 7 of 26 201024613
[0021] 篦四竇祐.你I[0021] 篦四窦佑. You I
[0022] 圖5A為本發明第四實施例之照明裝置之立體圖，圓5B為 圖5A之局部剖面圖。該照明裝置2c與第二實施例之照明 裝置2a不同之處在於照明裝置2c之散熱基板22b為一金屬 基板’另一發光二極體24’之第一電極24Γ藉由焊錫焊 接至散熱基板22b，其第二電極242’藉由焊錫焊接至相 鄰之另一散熱基板22b。藉由導熱接著層26使散熱基板 22b與散熱器23緊密連接，以達到散熱的效果。該照明裝 ❹ 置2c之其餘部份與第二實施例之照明裝置2a相同，不再 另為贅述。 [0023] 篦五會施射 [0024] 圖6為本發明第五實施例之照明裝置之剖面圖。照明裝置 2d與第一實施例之照明裝置2不同之處在於照明裝置2d之 散熱基板22b為一金屬基板’發光二極體24之第一電極 241藉由焊錫焊接至印刷電路杈21的第一印刷電路212， ❹ 發光二極體24之第C電極242藉$焊錫同時焊接至散熱基 ； i：j 吨 板2仏及相鄰的印刷電路板21的秦一印刷電路212上’不 須藉由導電單元與相鄰之印刷電路板之第一印刷電路連 接。照明裝置2d之其餘部份與第一實施例之照明裝置2相 同，不再另為贅述。 [0025] 第一至第五實施例之照明裝置所使用的發光二極體為熱 電不分離型發光二極體。以下第六實施例之照明襄置係 應用於熱電分離型發光二極體° [0026] 篦六宭偷例 097151551 表單編號A0101 第8頁/共26頁 0972084103-0 201024613 [0027] 圖7為本發明第六實施例照明裝置之剖面圖，該照明裝置 3與第五實施例之照明裝置2d不同之處在於照明裝置3使 用熱電分離型發光二極體34，發光二極體34包括一第一 電極341、一散熱塾343以及一第二電極342，散熱整343 與第二電極342並不電性連接，散熱墊343藉由焊錫焊接 、散熱膏或散熱膠與散熱基板22b緊密連接。發光二極體 34之第一電極341與印刷電路板21—侧之第一印刷電路 212電性連接，第二電極342與印刷電路板21另一側之第 一印刷電路212電性連接，藉由上迷結構可將複數個發光 ® 二極體34串聯。照明裝置3之其餘部份與第五實施例之照 明裝置2d相同，不再另為贅述*> [0028] 圖8為應用第一實施例照明裝置2之燈管式燈具之立體圖 ，上述之第一至第六實施例之照明裝置皆可應用於燈管 式燈具4 ’不再逐一繪示。圖9為應用第一實施例照明裝 置2之方形燈具之立體圖’弟方形燈具5包括至少一如第 一實施例所述之照明裝置2以及金屬框體51，散熱器為一 q 片狀金屬，與金屬框體51連锋成一體，形成一具容置室 之金屬殼體，以容置至少一照明裝置2，金屬殼體同時具 有散熱及容置照明裝置2之功能’上述之第二至第六實施 例之照明裝置皆可應用於方形燈具5，不再逐一繪示。 [0029] 綜上所述，本發明之照明裝置藉由將散熱基板設置於印 刷電路板之穿孔内，使發光二極體同時跨設於印刷電路 板及散熱基板之上表面，散熱器設置於印刷電路板以及 散熱基板之下表面，達到散熱佳、成本低的優點。 [0030] 以上所述僅為舉例性，而非為限制性者。任何未脫離本 0972084103-0 097151551 表單編號A0101 第g頁/共26頁 201024613 發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 [0031] ❹ ❹ [0032] 圖1為習知高亮度發光二極體之照明裝置之剖面圖； 圖2A為本發明第一實施例之照明裝置之立體圖； 圖2B為圖2A之局部剖面圖； 圖3A為本發明第二實施例之照明裝置之立體圖； 圖3B為圖3A之局部剖面圖； 圖4為本發明第三實施例之照明裝置之剖面圖； 圖5A為本發明第四實施例之照明裝置之立體圖； 圖5B為圖5A之局部剖面圖： 圖6為本發明第五實施例之照明裝置之剖面圖； 圖7為本發明第六實施例照明裝置之剖面圖； 圖8為應用第一實施例照明裝置2之燈管式燈具之立體圖 :以及 圖9為應用第一實施例照明裝置2之方形燈具之立體圖。 【主要元件符號說明】 1、2、2a、2b、2c、2d、3 :照明裝置 4:燈管式燈具 5:方形燈具 11 :金屬電路板 111 :金屬基板 112 :絕緣層 113 :印刷電路 12、24、24’ 、34 :發光二極體 121:正電極 122:負電極 123 :金屬散熱墊 13、23 :散熱器 14 :散熱膏 21 :印刷電路板 097151551 表單編號A0101 第10頁/共26頁 0972084103-0 201024613 211 :絕緣基板 212 :第一印刷電路 22、2_2b :散熱基板 222 :第二印刷電路 241、 241’ 、341 :第一電極 242、 242’ 、342 :第二電極 26 :導熱接著層 51 :金屬框體 25 :導電元件 343 :散熱墊 ma“e:c.iua Γ': ΧΦκΓίγ !* '' :户”.” <5A is a perspective view of a lighting device according to a fourth embodiment of the present invention, and a circle 5B is a partial cross-sectional view of FIG. 5A. The illumination device 2c is different from the illumination device 2a of the second embodiment in that the heat dissipation substrate 22b of the illumination device 2c is a metal substrate, and the first electrode 24 of the other light-emitting diode 24' is soldered to the heat dissipation substrate 22b. The second electrode 242' is soldered to the adjacent another heat dissipation substrate 22b. The heat-dissipating substrate 22b is closely connected to the heat sink 23 by the heat-conductive adhesive layer 26 to achieve the effect of heat dissipation. The rest of the lighting device 2c is the same as that of the lighting device 2a of the second embodiment, and will not be further described. [0023] FIG. 6 is a cross-sectional view of a lighting device according to a fifth embodiment of the present invention. The illumination device 2d is different from the illumination device 2 of the first embodiment in that the heat dissipation substrate 22b of the illumination device 2d is the first of the metal substrate 'the first electrode 241 of the light-emitting diode 24 is solder-welded to the printed circuit board 21 The printed circuit 212, 第 the second electrode 242 of the light-emitting diode 24 is soldered to the heat-dissipating base by the solder; the i:j-ton board 2仏 and the adjacent printed circuit board 21 on the Qinyi printed circuit 212 are not required to be borrowed. The conductive unit is connected to the first printed circuit of the adjacent printed circuit board. The rest of the illuminating device 2d is the same as that of the illuminating device 2 of the first embodiment, and will not be further described. [0025] The light-emitting diodes used in the illumination devices of the first to fifth embodiments are thermoelectric non-separating type light-emitting diodes. The illumination device of the sixth embodiment is applied to a thermoelectric separation type light-emitting diode. [0026] 篦 宭 宭 097151551 Form No. A0101 Page 8 / Total 26 pages 0972084103-0 201024613 [0027] FIG. A cross-sectional view of a lighting device according to a sixth embodiment of the present invention, the lighting device 3 is different from the lighting device 2d of the fifth embodiment in that the lighting device 3 uses a thermoelectric separation type light-emitting diode 34, and the light-emitting diode 34 includes a first The heat dissipation pad 343 is not electrically connected to the second electrode 342, and the heat dissipation pad 343 is tightly connected to the heat dissipation substrate 22b by soldering, heat dissipation paste or heat dissipation adhesive. The first electrode 341 of the light-emitting diode 34 is electrically connected to the first printed circuit 212 on the side of the printed circuit board 21, and the second electrode 342 is electrically connected to the first printed circuit 212 on the other side of the printed circuit board 21. A plurality of illuminating® diodes 34 can be connected in series by the above structure. The rest of the illuminating device 3 is the same as the illuminating device 2d of the fifth embodiment, and is not described again. [0028] FIG. 8 is a perspective view of the lamp tube type lamp to which the illuminating device 2 of the first embodiment is applied. The illumination devices of the first to sixth embodiments can be applied to the tube-type lamps 4' no longer shown one by one. 9 is a perspective view of a square lamp 5 of the lighting device 2 of the first embodiment. The square lamp 5 includes at least one illumination device 2 and a metal frame 51 as described in the first embodiment. The heat sink is a q-shaped metal. Forming a metal housing with the metal frame 51 to form a metal housing for accommodating the chamber to accommodate at least one illuminating device 2, the metal housing simultaneously having the function of dissipating heat and accommodating the illuminating device 2 The lighting device of the sixth embodiment can be applied to the square lamp 5, and is not illustrated one by one. [0029] In summary, the illuminating device of the present invention is disposed on the upper surface of the printed circuit board and the heat dissipating substrate by disposing the heat dissipating substrate in the through hole of the printed circuit board, and the heat sink is disposed on the illuminating device. The printed circuit board and the lower surface of the heat dissipation substrate have the advantages of good heat dissipation and low cost. [0030] The foregoing is illustrative only and not limiting. Any changes or modifications to the spirit and scope of the invention shall be included in the scope of the appended patent application, without departing from the scope of the invention, which is incorporated herein by reference. BRIEF DESCRIPTION OF THE DRAWINGS [0032] FIG. 1 is a cross-sectional view of a lighting device of a conventional high-brightness light-emitting diode; FIG. 2A is a perspective view of a lighting device according to a first embodiment of the present invention; Figure 2A is a perspective view of a lighting device in accordance with a second embodiment of the present invention; Figure 3B is a partial cross-sectional view of Figure 3A; Figure 4 is a cross-sectional view of a lighting device in accordance with a third embodiment of the present invention; Figure 5B is a partial cross-sectional view of the lighting device of the fifth embodiment of the present invention; Figure 7 is a lighting device of a sixth embodiment of the present invention; Fig. 8 is a perspective view of a lamp type lamp to which the lighting device 2 of the first embodiment is applied: and Fig. 9 is a perspective view of a square lamp to which the lighting device 2 of the first embodiment is applied. [Description of main component symbols] 1, 2, 2a, 2b, 2c, 2d, 3: Lighting device 4: Lamp type lamp 5: Square lamp 11: Metal circuit board 111: Metal substrate 112: Insulation layer 113: Printed circuit 12 24, 24', 34: Light-emitting diode 121: Positive electrode 122: Negative electrode 123: Metal heat-dissipating pad 13, 23: Heat sink 14: Thermal grease 21: Printed circuit board 097151551 Form No. A0101 Page 10 of 26 Page 0972084103-0 201024613 211: Insulating substrate 212: First printed circuit 22, 2_2b: Heat-dissipating substrate 222: Second printed circuit 241, 241', 341: First electrode 242, 242', 342: Second electrode 26: Heat conduction Next layer 51: metal frame 25: conductive member 343: heat sink mat "e: c.iua Γ': ΧΦκΓίγ !* '': household"." <
0972084103-0 097151551 表單編號A0101 第11頁/共26頁0972084103-0 097151551 Form No. A0101 Page 11 of 26