201020565 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種檢測裝置，尤其涉及一種連接器之檢 - 測模組。 【先前技術】 近來，帶有照相功能之手機受到廣泛之應用。隨著人 對手機小型化之要求，安裝於手機内之相機模組亦向小型 ❹化之趨勢發展 。請參見文獻 Challenges of megapixel camera module assembly and test，Chowdhury, A ; Darveaux, R. ;Electronic Components and Technology Conference, 2005. Proceedings. 55th31 May-3 June 2005 Page(s):1390-1401 Vol. 2。相機模組通常與焊接於電路板上之連接器插接，然後將 電路板與手機之主板連接，從而實現相機模組之功能。 於電路板上封裝連接器後，需要檢測電路板線路與連 Ο接器之電氣導通性能。惟，電路板上封裝之連接器較小， 深度亦較大，從而不便於進行檢測。先前技術中，採用仿 真之相機模組進行插接測試，插接後，仿真相機模組不易 拔出，且多次插拔造成仿真之相機模組與連接器損壞，測 試成本高。先前技術中，亦有採用探針接觸測試之方法， 惟這種方法採用點式接觸，測試穩定性不高，測試結果準 確度亦得不到保證。 【發明内容】 7 201020565 有鑑於此，有必要提供一種檢測模組，有效降低連接 器測試之成本，並且具有準確地測試結果。 以下將以實施例說明一種檢測模組。 一種檢測模組，用於對連接器之複數接點進行檢測。 該檢測模組包括仿真板與轉接板。該仿真板與連接器相對 應，其包括複數接觸焊墊與複數與接觸焊墊—對應之第 一連接導線。該轉接板與測試機台相對應，其包括複數轉 接焊墊與複數與轉接焊墊—連接之第二連接導線。該複 數接觸焊墊與連接器之複數接點一一對應，該複數第一連 接導線用於一一連接複數接觸焊墊與複數轉接焊墊。該複 數第二連接導線用於與測試機台相連接，以對連接器之複 數接點進行檢測。 採用該檢測模組可針對不同種類與形狀之連接器，製 作適合於待測試連接器之檢測模組。另外，當反復測試時， 連接器檢測模組造成損壞時，可根據其損壞之部分更換轉 ❺接板或者仿真板，無需更換整個檢測模組，節約之測試之 成本。另外，由於測試時避免採用針點式之接觸方式，提 南連接器測試之穩定性。 【實施方式】 下面結合附圖及實施例對本技術方案提供之一種檢測 模組作進一步說明。 請一併參閱圖1、圖2及圖3,本技術方案施例提供之 一種檢測模組100用於對連接器進行檢測，檢測模組1〇〇 .8 201020565 包括仿真板110、轉接板120及墊塊130。 仿真板110包括基板111、複數接觸焊墊112及複數第 一連接導線113。基板111為長方體，基板111之橫截面形 . 狀與待檢測之連接器之插孔形狀相對應。基板111具有第 • 一表面1111、與第一表面1111相對之第二表面1112及連 接於第一表面Π11與第二表面1112之間之侧壁1113。第 二表面1112用於與連接器接觸，複數接觸焊墊112形成於 第二表面112上。接觸焊墊112之數量與排列方式均與連 ®接器之接點相對應。本實施例中，接觸焊墊112之數量為 24個，且大致成陣列式排布。複數第一連接導線113形成 於基板111内，第一連接導線113之數量與排列方式均與 連接器之接點相對應。每一第一連接導線113均具有相對 之第一端面1131與第二端面1132，第一端面1131從第一 表面1111露出，第二端面1132從第二表面1112露出。每 個第一連接導線113之第二端面1132與一個接觸焊墊112 @接觸並相互連通。仿真板110用於與待檢測之連接器接觸， 以進行連接器之測量。 轉接板120包括基體121、複數轉接焊墊122、與轉接 焊墊122數目相同之接口 123及複數連接於每個轉接焊墊 122與該轉接焊墊122對應之接口 123之間之第二連接線路 124。轉接板120用於與檢測機台進行連接，從而可使仿真 板110之接觸焊墊112藉由第一連接導線113、第二連接導 線124及轉接焊墊122與檢測機台連通。 基體121為平板狀，本實施例中，基體121為矩形平 9 201020565 板。基體121具有相對之第三表面1211與第四表面1212。 為了方便將轉接板120安裝於工作機台，於基體121上， 開設了固定孔1213。本實施例中，自基體121之第三表面 • 1211向第四表面1212開設有3個固定孔1213。 複數轉接焊墊122形成於基體121之第三表面1211 上。焊墊122之個數與排列形式與仿真板110之第一連接 導線113個數與排列形式相同。本實施例中，轉接板120 共設置有24個轉接焊墊122。 ® 本實施例中，轉接板120共設置有24個接口 123。複 數接口 123於轉接板120上規則排布。為使得轉接板120 使用方便，24個接口 123均沿著矩形基體121之一邊排列。 相鄰之兩個接口 123之間留有空隙。複數接口 123用於將 轉接板120與測試機台進行連通。 第二連接導線124形成於基體121之第一表面1211， 為使得轉接板120使用過程中第二連接導線124不易損 φ壞，可將第二連接導線124固定於第三表面1212或者嵌於 基體121内。每一第二連接導線124連接於一個轉接焊墊 122與一個接口 123之間，使得每個轉接焊墊122均與一個 對應之接口 123相互導通。並且，任何兩根第二連接導線 124均不導通。 本實施例中，於仿真板110與轉接板120之間還設置 了墊塊130。墊塊130之橫截面形狀與待檢測之連接器插孔 之橫截面之形狀與大小一致，用於與仿真板110 —起收容 於連接器之插孔内。從而保證進行測試時，仿真板110與 201020565 連接器之複數接點接觸。本實施例中，墊塊130為長方體， 具有第五表面131、與第五表面131相對之第六表面132 及連接於第五表面131與第六表面132之間之側面133。於 . 墊塊130内，嵌設有24根第三連接導線133，24根第三連 接導線134相互平行。每一第三連接導線134均具有相對 之第三端面1341與第四端面1342。每一第三連接導線134 沿垂直第五表面131之方向延伸，並且貫穿墊塊130,即， 每一第三連接導線134之第三端面1341從第五表面131露 ®出，每一第三連接導線134之第四端面1342從第六表面132 露出。 墊塊130設置於仿真板110與轉接板120之間，並且 使得每一第三連接導線134之第三端面1341均與一個轉接 焊墊122接觸並相互連通，每一第三連接導線134之第四 端面1342均與一個第一連接導線113對應連接。 本實施例中，仿真板110貼接於墊塊130之第二表面 ❹132，基板111之侧壁1113與墊塊130之侧面133相互齊 平，並且使得每一第三連接導線134之第四端面1342與一 個第一連接導線113之第一端面1131相接觸並相連通。這 樣，每一接觸焊墊112與對應之一根第一連接導線113、一 根第三連接導線134、一個轉接焊墊122、一個第二連接導 線124與一個接口 123連通，從而可使得檢測之連接器之 每一接點均與一個接口 123電氣導通，如此檢測機台可通 過對接口 123進行檢測從而實現對連接器接點之檢測。 墊塊130與仿真板110之高度之與應大於待檢測之連 11 201020565 接器之插孔之深度。墊塊130之設置可改變仿真板110之 厚度不夠時，接觸焊墊112無法與檢測之連接器之接點接 觸之問題。當待檢測之連接器之插孔之深度小於仿真板110 • 厚度時，亦可不設置墊塊130，而直接將仿真板110貼裝於 ， 轉接板120後進行對連接器之檢測。 請參閱圖4，當檢測模組100檢測連接器200時，包括 如下步驟： 首先，將檢測模組100安裝於測試機台300。測試機台 ® 300具有安裝板310與測試晶片（圖未示）。安裝板310具 有安裝面311，於安裝面311上開設有安裝孔312，每個安 裝孔312均與一個固定孔1213相對應。通過固定件314穿 過固定孔1213並旋入安裝孔312以將檢測模組100固定於 安裝板310,並使得基體121之第四表面1212與安裝面311 緊密接觸，使每個接口 123與測試晶片之對應連接。 其次，將仿真板110與墊塊120伸入連接器200之插 ❿孔210内，使得仿真板110之接觸焊墊112與插孔210内 之接點211接觸，從而測試晶片既可對連接器200内之接 點211進行檢測。 採用該檢測模組100可針對不同種類與形狀之連接 器，製作適合於待測試連接器檢測模組。另外，當反復測 試時，連接器檢測模組造成損壞時，可根據其損壞之部分 更換轉接板、墊塊或者仿真板，無需更換整個檢測模組， 節約之測試之成本。另外，由於測試時避免可測試時採用 針點式之接觸方式，提高了連接器測試之穩定性。 12 201020565 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案實施例提供之檢測模組之分解示意 圖。 圖2係本技術方案實施例提供之檢測模組之立體示意 圖。 圖3係圖1沿III-III線之剖面示意圖 圖4係本技術方案實施例提供之檢測模組使用狀態之 不意圖。 100 110 111 1111 1112 1113 112 113 【主要元件符號說明】 檢測模組 仿真板 基板 第一表面 第二表面 側壁 接觸焊墊 第一連接導線 第一端面 1131 13 201020565 1132 第二端面 轉接板 120 基體 121 第三表面 1211 第四表面 1212 固定孔 1213 一個轉接焊墊 122 接口 123 第二連接導線 124 塾塊 130 第五表面 131 第六表面 132 侧面 133 第三連接導線 134 1341 1342 200 210 211 300 310 311 312 314 第三端面 第四端面 連接器 插孔 接點 測試機台 安裝板 安裝面 安裝孔 固定件 14201020565 IX. Description of the Invention: [Technical Field] The present invention relates to a detecting device, and more particularly to a detecting and testing module for a connector. [Prior Art] Recently, a mobile phone with a camera function has been widely used. With the demand for miniaturization of mobile phones, the camera modules installed in mobile phones have also evolved toward a small-scale trend. See the literature Challenges of megapixel camera module assembly and test, Chowdhury, A; Darveaux, R.; Electronic Components and Technology Conference, 2005. Proceedings. 55th31 May-3 June 2005 Page(s): 1390-1401 Vol. The camera module is usually plugged into a connector soldered to the circuit board, and then connected to the motherboard of the mobile phone to implement the function of the camera module. After the connector is packaged on the board, it is necessary to check the electrical continuity of the board line and the connector. However, the connectors on the board are smaller and have a larger depth, making it inconvenient to detect. In the prior art, the simulation camera module is used for the plug test. After the plug-in, the simulation camera module is not easy to pull out, and the camera module and the connector are damaged due to multiple insertions and removals, and the test cost is high. In the prior art, there is also a method of using a probe contact test, but this method uses point contact, the test stability is not high, and the accuracy of the test result is not guaranteed. SUMMARY OF THE INVENTION 7 201020565 In view of this, it is necessary to provide a detection module that effectively reduces the cost of connector testing and has accurate test results. A detection module will be described below by way of example. A detection module for detecting a plurality of contacts of a connector. The detection module includes a simulation board and an adapter board. The dummy board corresponds to a connector that includes a plurality of contact pads and a plurality of contact pads - corresponding first connection wires. The adapter plate corresponds to the test machine, and includes a plurality of transfer pads and a plurality of connection pads connected to the adapter pads. The plurality of contact pads are in one-to-one correspondence with a plurality of contacts of the connector, and the plurality of first connection wires are used to connect the plurality of contact pads and the plurality of adapter pads one by one. The plurality of second connecting wires are used to connect to the test machine to detect the plurality of contacts of the connector. The detection module can be used to manufacture a detection module suitable for the connector to be tested for different types and shapes of connectors. In addition, when the connector test module is damaged during repeated tests, the switch board or the simulation board can be replaced according to the damaged part, and the entire test module is not required to be replaced, thereby saving the cost of the test. In addition, the stability of the connector test was improved because the pin-point contact method was avoided during the test. [Embodiment] A detection module provided by the technical solution will be further described below with reference to the accompanying drawings and embodiments. Referring to FIG. 1 , FIG. 2 and FIG. 3 , a detection module 100 provided by the embodiment of the technical solution is used for detecting a connector. The detection module 1 2010 .8 201020565 includes a simulation board 110 and an adapter board. 120 and spacer 130. The dummy board 110 includes a substrate 111, a plurality of contact pads 112, and a plurality of first connecting wires 113. The substrate 111 is a rectangular parallelepiped, and the cross-sectional shape of the substrate 111 corresponds to the shape of the receptacle of the connector to be inspected. The substrate 111 has a first surface 1111, a second surface 1112 opposite to the first surface 1111, and a sidewall 1113 connected between the first surface 11 and the second surface 1112. The second surface 1112 is for contact with the connector, and the plurality of contact pads 112 are formed on the second surface 112. The number and arrangement of the contact pads 112 correspond to the contacts of the connector. In this embodiment, the number of contact pads 112 is 24, and is arranged in an array. A plurality of first connecting wires 113 are formed in the substrate 111, and the number and arrangement of the first connecting wires 113 correspond to the contacts of the connector. Each of the first connecting wires 113 has a first end surface 1131 and a second end surface 1132. The first end surface 1131 is exposed from the first surface 1111, and the second end surface 1132 is exposed from the second surface 1112. The second end face 1132 of each of the first connecting wires 113 is in contact with and in communication with a contact pad 112@. The simulation board 110 is used to contact the connector to be tested for the measurement of the connector. The adapter plate 120 includes a base 121, a plurality of transfer pads 122, an interface 123 having the same number as the transfer pads 122, and a plurality of interfaces between each of the transfer pads 122 and the interface 123 corresponding to the transfer pads 122. The second connection line 124. The adapter plate 120 is configured to be coupled to the inspection machine such that the contact pads 112 of the dummy board 110 are in communication with the inspection station by the first connection wires 113, the second connection wires 124, and the transfer pads 122. The base body 121 has a flat plate shape. In this embodiment, the base body 121 is a rectangular flat plate 9 201020565. The base 121 has opposing third and second surfaces 1211, 1212. In order to facilitate the mounting of the adapter plate 120 to the working machine, a fixing hole 1213 is formed in the base 121. In this embodiment, three fixing holes 1213 are opened from the third surface 1211 of the base 121 to the fourth surface 1212. A plurality of transfer pads 122 are formed on the third surface 1211 of the substrate 121. The number and arrangement of the pads 122 are the same as those of the first connection wires 113 of the dummy board 110. In this embodiment, the adapter plate 120 is provided with a total of 24 transfer pads 122. In this embodiment, the adapter plate 120 is provided with a total of 24 interfaces 123. The plurality of interfaces 123 are regularly arranged on the interposer board 120. In order to make the adapter plate 120 easy to use, the 24 interfaces 123 are arranged along one side of the rectangular base 121. A gap is left between the two adjacent interfaces 123. A plurality of interfaces 123 are used to connect the interposer 120 to the test machine. The second connecting wire 124 is formed on the first surface 1211 of the base 121. The second connecting wire 124 is fixed to the third surface 1212 or embedded in the second connecting wire 124 during the use of the adapter plate 120. Inside the base 121. Each of the second connecting wires 124 is connected between an adapter pad 122 and an interface 123 such that each of the via pads 122 is electrically connected to a corresponding interface 123. Also, any two of the second connecting wires 124 are not turned on. In this embodiment, a spacer 130 is further disposed between the dummy board 110 and the adapter board 120. The cross-sectional shape of the spacer 130 conforms to the shape and size of the cross section of the connector receptacle to be inspected for housing with the dummy board 110 in the receptacle of the connector. This ensures that the simulation board 110 is in contact with the multiple contacts of the 201020565 connector when testing. In this embodiment, the spacer 130 is a rectangular parallelepiped having a fifth surface 131, a sixth surface 132 opposite to the fifth surface 131, and a side surface 133 connected between the fifth surface 131 and the sixth surface 132. In the spacer 130, 24 third connecting wires 133 are embedded, and the 24 third connecting wires 134 are parallel to each other. Each of the third connecting wires 134 has a third end surface 1341 and a fourth end surface 1342. Each of the third connecting wires 134 extends in a direction perpendicular to the fifth surface 131 and penetrates the pad 130, that is, the third end surface 1341 of each of the third connecting wires 134 is exposed from the fifth surface 131, and each third The fourth end face 1342 of the connecting wire 134 is exposed from the sixth surface 132. The pad 130 is disposed between the dummy board 110 and the interposer 120, and the third end surface 1341 of each of the third connecting wires 134 is in contact with and communicates with an adapter pad 122, and each of the third connecting wires 134 The fourth end faces 1342 are each connected to a first connecting wire 113. In this embodiment, the dummy board 110 is attached to the second surface ❹ 132 of the spacer 130, and the sidewall 1113 of the substrate 111 and the side 133 of the spacer 130 are flush with each other, and the fourth end surface of each third connecting wire 134 is made. 1342 is in contact with and in communication with the first end face 1131 of a first connecting wire 113. Thus, each contact pad 112 communicates with a corresponding one of the first connecting wires 113, a third connecting wire 134, an adapter pad 122, and a second connecting wire 124 with an interface 123, thereby enabling detection. Each contact of the connector is electrically connected to an interface 123, so that the detecting machine can detect the connector contact by detecting the interface 123. The height of the spacer 130 and the dummy board 110 should be greater than the depth of the jack of the connector to be tested. The arrangement of the spacers 130 can change the problem that the contact pads 112 cannot contact the contacts of the detected connectors when the thickness of the dummy board 110 is insufficient. When the depth of the jack of the connector to be detected is less than the thickness of the dummy board 110, the spacer 130 may not be provided, and the dummy board 110 may be directly mounted on the adapter board 120 to detect the connector. Referring to FIG. 4, when the detecting module 100 detects the connector 200, the following steps are included: First, the detecting module 100 is mounted on the testing machine 300. The test machine ® 300 has a mounting plate 310 and a test wafer (not shown). The mounting plate 310 has a mounting surface 311, and mounting holes 312 are formed in the mounting surface 311, and each mounting hole 312 corresponds to one fixing hole 1213. The fixing module 314 passes through the fixing hole 1213 and is screwed into the mounting hole 312 to fix the detecting module 100 to the mounting board 310, and the fourth surface 1212 of the base 121 is in close contact with the mounting surface 311, so that each interface 123 is tested. Corresponding connections of the wafers. Next, the dummy board 110 and the spacer 120 are inserted into the insertion hole 210 of the connector 200, so that the contact pads 112 of the dummy board 110 are in contact with the contacts 211 in the socket 210, so that the test wafer can be connected to the connector. A contact 211 in 200 performs the detection. The detection module 100 can be used to manufacture a connector detection module suitable for testing for different types and shapes of connectors. In addition, when the connector test module is damaged during repeated tests, the adapter plate, the pad or the dummy board can be replaced according to the damaged part, and the cost of the test can be saved without replacing the entire test module. In addition, the stability of the connector test is improved by avoiding the use of pin-point contact when testing. 12 201020565 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded schematic view of a detection module provided by an embodiment of the present technical solution. FIG. 2 is a perspective view of a detection module provided by an embodiment of the present technical solution. 3 is a schematic cross-sectional view taken along line III-III of FIG. 1. FIG. 4 is a schematic view of the use state of the detecting module provided by the embodiment of the present technical solution. 100 110 111 1111 1112 1113 112 113 [Description of main component symbols] Detecting module emulation board substrate first surface second surface sidewall contact pad first connecting wire first end face 1131 13 201020565 1132 second end face adapter plate 120 base 121 Third surface 1211 fourth surface 1212 fixing hole 1213 one adapter pad 122 interface 123 second connecting wire 124 block 130 fifth surface 131 sixth surface 132 side 133 third connecting wire 134 1341 1342 200 210 211 300 310 311 312 314 Third end face fourth end connector jack contact test machine mounting plate mounting surface mounting hole fixing member 14