201017782 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種導電粒子之製作方法及其結 構’特別係有關於一種銅-錫核殼型導電粒子之製作方法及 其結構。 【先前技術】. 習知封裝晶片與電路板之間大都是透過錫球或錫凸 ❹塊進行電性連接，其封裝晶片上必須先形成錫凸塊或錫 球，再結合於電路板，然而，習知封裝晶片上形成錫凸塊 或錫球之製程（如電鍍、無電鍍製程）相當繁複，其製作成 本相對較高，此外，習知錫球之尺寸較大，並無法應用於 高密度/細間距之封裝產品的電性連接。 【發明内容】 有鑑於上述習知缺失，本發明之主要目的係在於提供 一種銅-錫核殼型導電粒子之製作方法及其結構，其製作方 ° 法包含提供複數個銅粒子；去除該些銅粒子之表面氧化 物；以及將該些銅粒子置於一含錫酸性溶液中，以進行一 錫銅置換反應，當該些銅粒子表面形成有一錫包覆層時， 即形成複數個銅-錫核般型導電粒子，本發明係可透過控制 t程參數調整該些銅-錫核殼型導電粒子之尺寸，且所製成 之該些銅-錫核殼型導電粒子之尺寸可僅有數微米因此， 可取代習知錫球應用於高密度/細間距之封裝產品的電性 ^接’此外’本發明之製作方法具有製程簡單及高量產性 等優點，其功效上可大幅降低製作成本，。 5 201017782 【實施方式】 請參閱第1及2A至2D圖，甘及丄 圖其係本發明之一較佳實施 例’一種銅-錫核殼型導電粒 之製作方法，其步驟係詳述 如下：首先，請參閱第〗圖之 步驟（a)及第2A圖，提供複 數個銅粒子11，在本實施例 s玄些銅粒+11係置於一 槽體90内，且該些銅粒子丨丨 <十岣粒徑係可介於1微米 至100微米之間；接著，請春[Technical Field] The present invention relates to a method for producing conductive particles and a structure thereof, and particularly relates to a method for fabricating a copper-tin core-shell type conductive particle and a structure thereof. [Prior Art] Conventional packaged wafers and circuit boards are mostly electrically connected through solder balls or tin bumps. On the package wafers, tin bumps or solder balls must be formed first, and then bonded to the circuit board. The process of forming tin bumps or solder balls on a conventional packaged wafer (such as electroplating or electroless plating) is quite complicated, and the manufacturing cost thereof is relatively high. Moreover, the size of the conventional solder ball is large and cannot be applied to high density. / Electrical connection of fine pitch packaged products. SUMMARY OF THE INVENTION In view of the above-mentioned conventional deficiencies, the main object of the present invention is to provide a method for fabricating a copper-tin core-shell type conductive particle and a structure thereof, the method of which comprises providing a plurality of copper particles; removing the a surface oxide of the copper particles; and the copper particles are placed in a tin-containing acidic solution to perform a tin-copper displacement reaction, and when a tin coating layer is formed on the surface of the copper particles, a plurality of copper is formed. Tin-nuclear-type conductive particles, the present invention can adjust the size of the copper-tin core-shell conductive particles by controlling the t-path parameter, and the size of the copper-tin core-shell conductive particles can be made only Therefore, it can replace the conventional solder ball for the high-density/fine-pitch package product. The manufacturing method of the present invention has the advantages of simple process and high mass productivity, and the effect can be greatly reduced. cost,. 5 201017782 [Embodiment] Please refer to Figures 1 and 2A to 2D, and a preferred embodiment of the present invention, a method for fabricating a copper-tin core-shell type conductive particle, the steps of which are detailed below First, referring to steps (a) and 2A of the figure, a plurality of copper particles 11 are provided. In this embodiment, the copper particles +11 are placed in a tank 90, and the copper particles are丨丨<Ten 岣 particle size can range from 1 micron to 100 microns; then, please spring
月翏閱第1圖之步驟及第2B ❹ ❹ 圖’去除該些銅粒子U之砉 4表面氧化物，在本實施例中， 其係將-酸性溶液80倒入該槽體90内，以利用該酸性溶 液80微蚀該些銅粒子11之表面，進而去除表面氧化物， 在本實施例中，控制微蚀的時間即可控制該些銅粒子U 之粒徑’且微蝕的時間越長該些鋼粒子u的粒徑就越小， 較佳地，去除表面氧化物後之該些銅粒子u的粒徑係介 於0.1微米至1〇微米之間；之後，請參閱第i圖之步驟⑷ 及第2C圖，在去除該些銅粒子u之表面氧化物後，另包 含對該些銅粒子U進行一清洗步驟，其係先清除該酸性 洛液80，再以一去離子水7〇清洗該些銅粒子1丨，以去除 殘留酸性溶液；接著，請參閱第丨圖之步驟及第2d圖， 將該些銅粒子11置於一含錫酸性溶液中，以進行一錫 銅置換反應，在本實施例中，其係將該含錫酸性溶液2〇 倒入該槽體90内，以使該含錫酸性溶液2〇與該些銅粒子 U混合，並進行該錫銅置換反應，較佳地，該含錫酸性溶 液2 0係為硫酸亞錫溶液（s n S Ο4 )，且該含錫酸性溶液2 q 之溫度係介於6(TC至8(TC之間，此外，當該些銅粒子u 201017782 之表面因該錫鋼置換反應而形成有一錫包 :成複數個鋼·錫核殼型導電粒+ 1Q，在本實施^ -錫匕覆^ 12之平均厚度係介於〇 〇ι微米至2微米之 Ο ❹ 間’另外，請參閱第i圖之步驟⑷，在形成該些銅-锡 殼型導電粒子1〇後，另包含對該些銅-錫核殼型導電料 1 〇進仃清洗步驟，其係先清除該含錫酸性溶液2〇，再 以去離子水清洗該些銅-錫核殼型導電粒子10，又，嗜參 閱第1圖之步驟⑴，在完成該清洗步驟後，另包含對：此 錫核殼型導電粒子10進行一乾燥步驟，以去除殘留： 刀，印參閱第3圖，其係為該些銅·錫核殼型導電粒子 乾燥後之電子顯微鏡照片圖。 請再參閱第2D圖，依據本發明之製作方法所製成之 該銅-錫核殼型導電粒子結構1〇係具有一銅粒子u及一包 覆該銅粒子U之錫包覆層12，在本實施例中，該銅粒： 11之粒徑係介於(M微米至10微米之間，而該錫包覆層 12之平均厚度係介於ο.ίη微米至2微米之間，本發明所 製成之該銅-錫核殼型導電粒子10之尺寸係介於〇丨微米 至12微米之間，且可透過控制製程參數（如微蝕的時間') 使該些銅-錫核殼型導電粒子1 〇之尺寸僅有數微米，因 此，可取代習知錫球應用於高密度/細間距之封裝產品的電 性連接，此外，本發明之製作方法具有製程簡單及高量產 性等優點’其功效上可大幅降低製作成本。 本發明之保護範圍當視後附之申請專利範圍所界定 者為準’任何熟知此項技藝者，在不脫離本發明之精神和 201017782 範圍内所作之任何變化斑修；^心 艾G興修改均屬於本發明之保護範 圍。【圖式簡單說明】 第 圖 ❹ ❹ 依據本發明之一較佳實施例，一種銅-錫 核殼型導電粒子之製作方法流程圖。 依據本發明之一較佳實施例，該銅-錫核 殼型導電粒子之製作方法示意圖。 依據本發明之一較佳實施例，銅-錫核殼 導電粒子之電子顯微鏡照片圖。 【主要元件符號說明】 10銅-錫核般型導電粒子 11銅粒子 丨2錫包覆層 70去離子水 80酸性溶液 (a) 提供複數個銅粒子 (b) 去除該些銅粒子之表面氧化物 (c) 對該些銅粒子進行一清洗步驟 ⑷將該些銅粒子置於一含錫酸 my，以進行一錫| 置換反應，當該些銅粒子表面 a 取有—錫包覆層時， P形成複數個銅-錫核殼型導電粒子 (e) 對該些銅-錫核殼型導電粒子 ,,,^ 仃一清洗步驟 (f) 對該些銅-錫核殼型導電粒子 <W —乾燥步驟 第2A至2D圖 第 3 圖 20含錫酸性溶液 90槽體The steps of Figure 1 and Figure 2B are omitted to remove the surface oxide of the copper particles U. In this embodiment, the acidic solution 80 is poured into the tank 90 to The surface of the copper particles 11 is microetched by the acidic solution 80 to remove the surface oxide. In this embodiment, the particle size of the copper particles U can be controlled by controlling the time of micro-etching, and the time of micro-etching is increased. The smaller the particle size of the steel particles u is, the better the particle size of the copper particles u after removing the surface oxide is between 0.1 μm and 1 μm; after that, please refer to the i-th image Steps (4) and 2C, after removing the surface oxides of the copper particles u, further comprising performing a cleaning step on the copper particles U, which first removes the acid solution 80 and then uses a deionized water. 7〇cleaning the copper particles 1丨 to remove the residual acidic solution; then, referring to the steps of FIG. 2 and FIG. 2d, the copper particles 11 are placed in a tin-containing acidic solution to perform a tin-copper solution. The displacement reaction, in this embodiment, is to pour the tin-containing acidic solution 2 into the tank 90, The tin-containing acidic solution 2〇 is mixed with the copper particles U, and the tin-copper substitution reaction is performed. Preferably, the tin-containing acidic solution 20 is a stannous sulfate solution (sn S Ο 4 ), and the The temperature of the tin acidic solution 2 q is between 6 (TC and 8 (TC). In addition, when the surface of the copper particles u 201017782 is replaced by the tin steel, a tin package is formed: a plurality of steel tin cores Shell-type conductive particles + 1Q, in the present embodiment, the average thickness of the tin-coated layer 12 is between 〇〇ι μm and 2 μm. 另外In addition, please refer to step (4) of Figure i, in forming these After the copper-tin-shell type conductive particles are further entangled, the copper-tin core-shell type conductive material 1 is further subjected to a cleaning step of removing the tin-containing acidic solution 2 〇, and then washing the solution with deionized water. The copper-tin core-shell type conductive particles 10, in addition, refer to the step (1) of FIG. 1 , after completing the cleaning step, further comprising: performing a drying step on the tin core-shell conductive particles 10 to remove residues: Knife and printing refer to Figure 3, which is an electron micrograph of the copper-tin core-shell conductive particles after drying. Referring to FIG. 2D, the copper-tin core-shell type conductive particle structure 1 according to the manufacturing method of the present invention has a copper particle u and a tin coating layer 12 covering the copper particle U. In this embodiment, the copper particles: 11 have a particle size ranging from (M micrometer to 10 micrometers), and the tin cladding layer 12 has an average thickness of between ο. ίη micrometers to 2 micrometers. The copper-tin core-shell type conductive particles 10 produced by the invention have a size ranging from 〇丨 micrometers to 12 micrometers, and the copper-tin can be made by controlling process parameters (such as time of microetching). The size of the core-shell conductive particles 1 仅有 is only a few micrometers, so that it can replace the electrical connection of the conventional solder balls for high-density/fine-pitch package products. Moreover, the manufacturing method of the present invention has a simple process and high mass production. Advantages such as sex's ability to significantly reduce production costs. The scope of the present invention is defined by the scope of the appended claims. Anyone skilled in the art will be able to make any changes without departing from the spirit of the invention and in the scope of 201017782; All belong to the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart of a method for fabricating copper-tin core-shell conductive particles according to a preferred embodiment of the present invention. According to a preferred embodiment of the present invention, a schematic diagram of a method for fabricating the copper-tin core-shell type conductive particles. According to a preferred embodiment of the present invention, an electron micrograph of a copper-tin core-shell conductive particle is shown. [Major component symbol description] 10 copper-tin core-like conductive particles 11 copper particles 丨 2 tin coating layer 70 deionized water 80 acidic solution (a) provides a plurality of copper particles (b) removes the surface oxidation of the copper particles (c) performing a cleaning step on the copper particles (4) placing the copper particles in a stannic acid containing a tin-doping reaction, when the surface of the copper particles is a tin-coated layer , P forms a plurality of copper-tin core-shell type conductive particles (e) for the copper-tin core-shell type conductive particles, and, a cleaning step (f) for the copper-tin core-shell type conductive particles <;W—drying step 2A to 2DFig. 3 Fig. 20 tin solution containing tin acid solution