TW201013371A - Modular electronic system - Google Patents

Modular electronic system Download PDF

Info

Publication number
TW201013371A
TW201013371A TW098120114A TW98120114A TW201013371A TW 201013371 A TW201013371 A TW 201013371A TW 098120114 A TW098120114 A TW 098120114A TW 98120114 A TW98120114 A TW 98120114A TW 201013371 A TW201013371 A TW 201013371A
Authority
TW
Taiwan
Prior art keywords
board
module
component
control module
common
Prior art date
Application number
TW098120114A
Other languages
English (en)
Inventor
Daniel P Ross
Greg T Mrozek
Christopher M Lange
William C Scherer
Original Assignee
Graco Minnesota Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graco Minnesota Inc filed Critical Graco Minnesota Inc
Publication of TW201013371A publication Critical patent/TW201013371A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0004Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
    • H05K5/0008Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by screws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0065Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units wherein modules are associated together, e.g. electromechanical assemblies, modular structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/023Stackable modules

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

201013371 六、發明說明: • 【發明所屬之技術領域】 本發明係關於模組化電子系統。 【先前技術】 在流體處理及分配系統的控制中以及類似的相關控制 系統中,傳統的此類系統使用訂製的控制器以用於各別的 Φ 特定產品或系統,但這證明是昂貴的,特別是對低產量的 產品而言。 【發明內容】 本發明的基礎是具有現成的電子套裝以免除「共同」 硬體設計之需求。這也將增加這些模組的共用「共同」元 件的數量,藉以整體地降低電子套裝的成本。模組化平台 是根據這些元件。基本單元具有基本塑膠殼以及功率/通 9 訊板。元件模組包括中央塑膠殼、共同板、元件板、具有 連接器的面板及機殻蓋。元件板對每一平台是獨一的板, 以及,舉例而言,可爲流體控制模組、低功率溫度控制模 組、閘道模組、USB模組、等等。 此設計將不必佈局通訊、功率、共同元件,或者不必 發展新的套裝以使新的電子板適合,藉以加速未來電子方 面的發展時間。用於這些元件的佈局約爲電子元件的發展 時間的6 0 %。 此設計也將降低導因於故障板的停工時間。元件板與 201013371 共同電子板(具有最高故障風險的板)一起在它們自己的 模組中是隔離的,以及,可以由另一模組快速地取代。終 端使用者所需的唯一工具是用以更換模組的L形板手。 從配合附圖的下述說明,將更完整地瞭解發明的這些 及其它目的和優點,其中,在多個視圖中,類似的代號代 表相同或類似的構件。 【實施方式】 本發明的基礎是具有現成的電子套裝以免除「共同」 W 硬體設計之需求。這也將增加這些模組的共用「共同」元 件的數量,藉以整體地降低電子套裝的成本。模組化平台 是根據這些元件。基本單元22具有基本塑膠殼24以及功 率/通訊板26。元件模組10包括中央塑膠殻12、共同板 14、元件板16、具有連接器的面板18及機殼蓋20。元件 板16對每一平台是獨一的板,以及,舉例而言,可爲流 體控制模組、低功率溫度控制模組、閘道模組、USB模組 _ 、等等。 此設計將不必佈局通訊、功率、共同元件,或者不必 發展新的套裝以使新的電子板適合,藉以加速未來電子方 面的發展時間。用於這些元件的佈局約爲電子元件的發展 時間的60%。 此設計也將降低導因於故障板的停工時間。元件板與 共同電子板(具有最高故障風險的板)一起在它們自己的 模組中是隔離的,以及,可以由另一模組快速地取代。終 -6- 201013371 - 端使用者所需的唯一工具是用以更換模組的L形板手。 . 在不悖離後附申請專利範圍所界定的本發明的精神及 範圍之下,可以思及對模組化系統作不同的改變及修改。 【圖式簡單說明】 圖1是本發明的元件模組之爆炸視圖。 圖2是本發明的組合元件模組的立體視圖。 φ 圖3是本發明的組合基本模組的立體視圖。 【主要元件符號說明】 1 〇 :元件模組 12 :中央塑膠殼 14 :共同板 1 6 :元件板 18 :面板 Φ 2〇 :機殻蓋 22 :基本單元 24 :基本塑膠殼 26 :功率/通訊板

Claims (1)

  1. 201013371 七、申請專利範面: 1 · 一種控制模組,包括: 基本單元’包括殼及功率/通訊板;以及 元件模組’連接至該基本單元以及包括殻、共间板、 元件板、及殻蓋。 2.如申請專利範圍第1項之控制模組,其中該元件板 是選自流體控制模組、低功率溫度控制模組、閘道模組及 USB模組所組成的族群之獨一板。 參 -8 -
TW098120114A 2008-07-01 2009-06-16 Modular electronic system TW201013371A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7732808P 2008-07-01 2008-07-01

Publications (1)

Publication Number Publication Date
TW201013371A true TW201013371A (en) 2010-04-01

Family

ID=41466275

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098120114A TW201013371A (en) 2008-07-01 2009-06-16 Modular electronic system

Country Status (8)

Country Link
US (1) US20110103025A1 (zh)
EP (1) EP2298050A4 (zh)
JP (1) JP2011527042A (zh)
KR (1) KR20110039306A (zh)
CN (1) CN102077703A (zh)
AU (1) AU2009265022A1 (zh)
TW (1) TW201013371A (zh)
WO (1) WO2010002564A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU340169S (en) 2011-12-09 2012-01-06 Hunter Pacific Int Pty Ltd Ball joint
AU340167S (en) 2011-12-09 2012-01-06 Hunter Pacific Int Pty Ltd Electrical connector
AU340165S (en) 2011-12-09 2012-01-06 Hunter Pacific Int Pty Ltd Electrical connector
AU340682S (en) 2011-12-09 2012-01-30 Hunter Pacific Int Pty Ltd Mounting plate
AU340168S (en) 2011-12-09 2012-01-06 Hunter Pacific Int Pty Ltd Ceiling fan blade
AU340171S (en) 2011-12-09 2012-01-06 Hunter Pacific Int Pty Ltd Ceiling fan hub
US11202378B1 (en) * 2020-07-30 2021-12-14 Baidu Usa Llc Modular infrastructure for compute and storage clusters

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3467892A (en) * 1968-01-25 1969-09-16 Burroughs Corp Electrical module and system
US4918572A (en) * 1988-12-27 1990-04-17 Motorola Computer X, Inc. Modular electronic package
EP0476322B1 (en) * 1990-09-10 1996-04-17 Yokogawa Electric Corporation Casing assembly for electronic equipment.
US5375040A (en) * 1992-09-29 1994-12-20 Eldec Corporation Modular electronic circuit housing and wiring board
JPH11289142A (ja) * 1998-04-01 1999-10-19 Toshiba Corp 回路モジュール実装構造およびこの回路モジュールを有する電子機器
US6388563B1 (en) * 1999-09-28 2002-05-14 Rockwell Automation Technologies, Inc. Modular relay with network communications
EP1222402A1 (en) * 1999-10-20 2002-07-17 Parker Hannifin Plc Fluid control system
US6272016B1 (en) * 2000-05-31 2001-08-07 Trw Inc Avionics rack with external electronics module
RU2183884C1 (ru) * 2000-12-21 2002-06-20 СИНЕРДЖЕСТИК КОМПЬЮТИНГ СИСТЕМС (СИКС) АпС Гибридный многоуровневый электронный модуль
JP2002202803A (ja) * 2000-12-28 2002-07-19 Omron Corp プログラマブルコントローラ、およびプログラマブルコントローラ用ユニット
US7184272B1 (en) * 2002-04-05 2007-02-27 Itt Manufacturing Enterprises, Inc. Modular RF terminal having integrated bus structure
US6741466B1 (en) * 2002-07-18 2004-05-25 Rockwell Collins Modular electronics system chassis
US6795318B2 (en) * 2002-11-27 2004-09-21 Hewlett-Packard Development Company, Lp. Portable modular electronic system
US6678163B1 (en) * 2002-12-19 2004-01-13 Westcode Semiconductors Limited Housing for semiconductor chips
US7243005B1 (en) * 2003-05-05 2007-07-10 Hunter Industries, Inc. Modular irrigation controller
US7126820B2 (en) * 2003-11-11 2006-10-24 Intel Corporation Modular platform system and apparatus
US7068516B2 (en) * 2004-02-06 2006-06-27 Chan Eric K D Enclosure with pre-formed interchangeable panels
US7307855B2 (en) * 2004-10-05 2007-12-11 Honeywell International Inc. Enclosure for printed wiring board assemblies
US7245497B2 (en) * 2005-05-17 2007-07-17 Itt Manufacturing Enterprises, Inc. Modular electronics enclosure
US20070133155A1 (en) * 2005-12-12 2007-06-14 Norgren, Inc. Alignment ramp for a PC board in an operator for a valve

Also Published As

Publication number Publication date
JP2011527042A (ja) 2011-10-20
AU2009265022A1 (en) 2010-01-07
CN102077703A (zh) 2011-05-25
EP2298050A4 (en) 2013-01-23
US20110103025A1 (en) 2011-05-05
KR20110039306A (ko) 2011-04-15
EP2298050A1 (en) 2011-03-23
WO2010002564A1 (en) 2010-01-07

Similar Documents

Publication Publication Date Title
TW201013371A (en) Modular electronic system
US9888605B2 (en) Electronic device
ATE485599T1 (de) Anschlussdose für ein solarpaneel
JP2014160512A5 (zh)
JP2004178585A5 (zh)
WO2012011978A3 (en) Printed circuit board module enclosure and apparatus using same
JP2003317851A (ja) モジュール式のコネクタ
WO2020136010A3 (de) Basismodul und funktionsmodul für ein schaltschranksystem und schaltschranksystem
TWM302144U (en) Front-to-back stack device for modulized circuit board
US8717763B2 (en) Cooling system for electronic device and electronic device having same
CN207380964U (zh) 一种电子积木
US6659803B1 (en) Power supply arrangement for server
WO2015031293A1 (en) U form-factor intelligent electronic device (ied) hardware platform with matching of ied wiring, from a non u form-factor ied hardware platform using adapter structure
US20200214151A1 (en) Connector pins for multiple printed circuit boards
JP1649258S (ja) 半導体モジュール
WO2007050989A3 (en) System and method for modular electronics design
TW200726369A (en) Computer arrangement and computer plug-in module
CN103677152A (zh) 存储服务器及其机架系统
JP4609518B2 (ja) 多軸用サーボアンプモジュールの実装方法とこれを用いた多軸用サーボアンプ装置
CN205540087U (zh) 一种组合分布式io模块
TW200801920A (en) Computer server module with a hot- pluggable function
TWI510885B (zh) 存儲伺服器及其機架系統
JP7063795B2 (ja) 光照射器用電源装置及び光照射システム
CN104812168B (zh) 电子板卡系统及电子设备
TW201345337A (zh) 印刷電路板