CN102077703A - 模块化电子系统 - Google Patents

模块化电子系统 Download PDF

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Publication number
CN102077703A
CN102077703A CN2009801241375A CN200980124137A CN102077703A CN 102077703 A CN102077703 A CN 102077703A CN 2009801241375 A CN2009801241375 A CN 2009801241375A CN 200980124137 A CN200980124137 A CN 200980124137A CN 102077703 A CN102077703 A CN 102077703A
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CN
China
Prior art keywords
module
board
component
control module
elementary cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801241375A
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English (en)
Inventor
丹尼尔·P·罗斯
格雷格·T·姆罗泽克
克里斯托弗·M·朗格
威廉·C·谢勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Graco Minnesota Inc
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Graco Minnesota Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graco Minnesota Inc filed Critical Graco Minnesota Inc
Publication of CN102077703A publication Critical patent/CN102077703A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
    • H05K5/0008—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0065—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units wherein modules are associated together, e.g. electromechanical assemblies, modular structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

现货供应的电子封装消除了大量对每个产品的硬件重新设计的需求。基本单元具有基本塑料外壳和电源/通讯板。组件模块包括中间部分的塑料外壳、通用板、组件板、具有连接器的面板、和外壳盖。所述组件板对于每个平台是独特的板，并且例如可以是流体控制模块、低功耗温度控制模块、网关模块、USB模块等。

Description

模块化电子系统
技术领域
本申请要求2008年7月1日提交的美国申请序列号61/077,328的利益，其内容以此通过参考合并。
背景技术
在流体处理和分配系统以及类似的相关控制系统的控制中，传统上，这样的系统已经针对每个特定的产品或系统使用定做的控制器，这已被证明是昂贵的，特别是对于小批量产品。
发明内容
本发明的基本原理是提供现货供应的电子封装，以消除对“通用”硬件的设计的需求。这还将增加这些模块的共享的“通用”组件数量，从而减少整个电子封装的成本：模块化平台是基于这些组件的。基本单元具有基本塑料外壳和电源/通讯板。组件模块包括中间部分的塑料外壳、通用板、组件板、具有连接器的面板、和外壳盖。组件板对于每个平台是独特的板，并且例如可以是流体控制模块、低功耗温度控制模块、网关模块、USB模块等。
这种设计将不再需要布局通信、电力、通用元件部件，或不再需要开发新的封装来安装进新的电子板，从而加快未来电子产品的开发时间。用于这些组件的布局占电子组件的开发时间的大约60％。
这种设计还将减少由于失效的板所造成的停机时间。组件板连同通用电子板(对失效造成最大风险的板)一起被隔离在它们自己的模块中，并能迅速被另一个模块所替换。终端用户需要的唯一工具将是通用扳手，用以更换模块。
本发明的这些和其它目标以及优点将从与附图相结合的下面的描述中更加充分的体现出来，其中贯穿几个视图中相同的附图标记指代相同的或者相似的部件。
附图说明
图1是本发明的组件模块的分解视图。
图2是本发明的组装好的组件模块的透视图。
图3是本发明的组装好的基本模块的透视图。
具体实施方式
本发明的基本原理是提供现货供应(off-the-shelf)的电子封装，用以消除对“通用”硬件的设计的需求。这还将增加这些模块的共享“通用”组件的数量，从而减少整个电子封装的成本：模块化平台是基于这些组件的。基本单元22具有基本塑料外壳24和电源/通讯板26。组件模块10包括中间部分的塑料外壳12、通用板14、组件板16、具有连接器的面板18、和外壳盖20。组件板16对于每个平台是独特的板，并且例如可以是流体控制模块、低功耗温度控制模块、网关模块、USB模块等。
这种设计将不再需要布局通信、电力、通用元件部件，或不再需要开发新的封装来安装进新的电子板，从而加快未来电子产品的开发时间。这些组件的布局占电子组件的开发时间的大约60％。
这种设计还将减少由于失效的板所造成的停机时间。组件板连同通用电子板(对失效造成最大风险的板)一起被隔离在它们自己的模块中，并能迅速被另一个模块所替换。终端用户需要的唯一工具将是通用扳手用以更换模块。
可以预料的是，在不背离由所附的权利要求所限定的本发明的精神和范围的情形下，可对模块化系统进行各种改变或修改。

Claims (2)

1.一种控制模块，包括：
基本单元，所述基本单元包括外壳和电源/通讯板；和
组件模块，所述组件模块被连接到所述基本单元，并且其包括外壳、通用板、组件板和外壳盖。
2.根据权利要求1所述的控制模块，其中所述组件板是从由流体控制模块、低功耗温度控制模块、网关模块和USB模块构成的组中选出的独特的板。
CN2009801241375A 2008-07-01 2009-06-11 模块化电子系统 Pending CN102077703A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7732808P 2008-07-01 2008-07-01
US61/077,328 2008-07-01
PCT/US2009/047037 WO2010002564A1 (en) 2008-07-01 2009-06-11 Modular electronic system

Publications (1)

Publication Number Publication Date
CN102077703A true CN102077703A (zh) 2011-05-25

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ID=41466275

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801241375A Pending CN102077703A (zh) 2008-07-01 2009-06-11 模块化电子系统

Country Status (8)

Country Link
US (1) US20110103025A1 (zh)
EP (1) EP2298050A4 (zh)
JP (1) JP2011527042A (zh)
KR (1) KR20110039306A (zh)
CN (1) CN102077703A (zh)
AU (1) AU2009265022A1 (zh)
TW (1) TW201013371A (zh)
WO (1) WO2010002564A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114063725A (zh) * 2020-07-30 2022-02-18 百度（美国）有限责任公司 用于计算和存储集群的模块化基础设施

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU340171S (en) 2011-12-09 2012-01-06 Hunter Pacific Int Pty Ltd Ceiling fan hub
AU340165S (en) 2011-12-09 2012-01-06 Hunter Pacific Int Pty Ltd Electrical connector
AU340167S (en) 2011-12-09 2012-01-06 Hunter Pacific Int Pty Ltd Electrical connector
AU340169S (en) 2011-12-09 2012-01-06 Hunter Pacific Int Pty Ltd Ball joint
AU340168S (en) 2011-12-09 2012-01-06 Hunter Pacific Int Pty Ltd Ceiling fan blade
AU340682S (en) 2011-12-09 2012-01-30 Hunter Pacific Int Pty Ltd Mounting plate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6205027B1 (en) * 1998-04-01 2001-03-20 Kabushiki Kaisha Toshiba Structure and method for mounting a circuit module
US20020000257A1 (en) * 1999-10-20 2002-01-03 Marcus Mead Fluid control system
US6388563B1 (en) * 1999-09-28 2002-05-14 Rockwell Automation Technologies, Inc. Modular relay with network communications

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3467892A (en) * 1968-01-25 1969-09-16 Burroughs Corp Electrical module and system
US4918572A (en) * 1988-12-27 1990-04-17 Motorola Computer X, Inc. Modular electronic package
DE476322T1 (de) * 1990-09-10 1992-07-02 Yokogawa Electric Corp., Musashino, Tokio/Tokyo Gehaeusenanordnung fuer eine elektronische anlage.
US5375040A (en) * 1992-09-29 1994-12-20 Eldec Corporation Modular electronic circuit housing and wiring board
US6272016B1 (en) * 2000-05-31 2001-08-07 Trw Inc Avionics rack with external electronics module
RU2183884C1 (ru) * 2000-12-21 2002-06-20 СИНЕРДЖЕСТИК КОМПЬЮТИНГ СИСТЕМС (СИКС) АпС Гибридный многоуровневый электронный модуль
JP2002202803A (ja) * 2000-12-28 2002-07-19 Omron Corp プログラマブルコントローラ、およびプログラマブルコントローラ用ユニット
US7184272B1 (en) * 2002-04-05 2007-02-27 Itt Manufacturing Enterprises, Inc. Modular RF terminal having integrated bus structure
US6741466B1 (en) * 2002-07-18 2004-05-25 Rockwell Collins Modular electronics system chassis
US6795318B2 (en) * 2002-11-27 2004-09-21 Hewlett-Packard Development Company, Lp. Portable modular electronic system
US6678163B1 (en) * 2002-12-19 2004-01-13 Westcode Semiconductors Limited Housing for semiconductor chips
US7243005B1 (en) * 2003-05-05 2007-07-10 Hunter Industries, Inc. Modular irrigation controller
US7126820B2 (en) * 2003-11-11 2006-10-24 Intel Corporation Modular platform system and apparatus
US7068516B2 (en) * 2004-02-06 2006-06-27 Chan Eric K D Enclosure with pre-formed interchangeable panels
US7307855B2 (en) * 2004-10-05 2007-12-11 Honeywell International Inc. Enclosure for printed wiring board assemblies
US7245497B2 (en) * 2005-05-17 2007-07-17 Itt Manufacturing Enterprises, Inc. Modular electronics enclosure
US20070133155A1 (en) * 2005-12-12 2007-06-14 Norgren, Inc. Alignment ramp for a PC board in an operator for a valve

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6205027B1 (en) * 1998-04-01 2001-03-20 Kabushiki Kaisha Toshiba Structure and method for mounting a circuit module
US6388563B1 (en) * 1999-09-28 2002-05-14 Rockwell Automation Technologies, Inc. Modular relay with network communications
US20020000257A1 (en) * 1999-10-20 2002-01-03 Marcus Mead Fluid control system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114063725A (zh) * 2020-07-30 2022-02-18 百度（美国）有限责任公司 用于计算和存储集群的模块化基础设施
CN114063725B (zh) * 2020-07-30 2023-08-01 百度（美国）有限责任公司 用于计算和存储集群的模块化基础设施

Also Published As

Publication number Publication date
JP2011527042A (ja) 2011-10-20
EP2298050A1 (en) 2011-03-23
TW201013371A (en) 2010-04-01
KR20110039306A (ko) 2011-04-15
WO2010002564A1 (en) 2010-01-07
US20110103025A1 (en) 2011-05-05
AU2009265022A1 (en) 2010-01-07
EP2298050A4 (en) 2013-01-23

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