201011886 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種對位結合方法與裝置，尤其是指 一種應用於元件對位結合之元件結合方法與裝置。 【先前技術】 隨著行動電話及其内部元件逐漸地縮小，電子產業也 不斷的尋找最佳的方式來整合所有的微型化技術。因此， 為了能達到更高的封裝密度、進一步縮減尺寸及縮短訊號 傳輸的距離，垂直堆疊數顆晶片的三維（3D)封裝或者是 CISP封裝技術因此因應而生。一般而言，這類型的技術通 常是利用系統級封裝元件整合為一，例如：將記憶體晶片 與微處理器結合以形成一整合模組。然後再將這些元件以 垂直的方式堆豐在晶圓或者是另一晶片上’進而進行封 裝。透過垂直方向的晶片堆疊以增加封裝密度，並經由整 合而增加封裝體的功能。 雖然堆疊晶片之模組具有很多功效與優點，但是還是 具有相當多的問題有待克服，其中之一的問題就在於由於 晶片的尺寸都是微米級的大小’因此如何能夠將晶片與晶 片結合的誤差減至最低是一個相當重要的技術關鍵。請參 閱圖一所示，該圖係為習用技術晶片堆疊結合示意圖。在 該技術中具有第一影像擷取裝置10、一第二影像擷取裝置 11、一承載台12以及一吸嘴13。該第一影像擷取裝置10 係設置於該承載台12之一侧，該承載台12可以承載晶圓 201011886 9(其上具有複數個第—曰 該吸嘴13可吸取待結合曰之—第f者是單—之第一晶片。 件91移動至與該第〜元件9〇相對疋件91 ’並將該第二元 二元件91與該第一元件90相結* Γ之位f ’然後將該第 圖一之運作方式如下， 該第二影像操取裝置11分別像棟:裝置10以及 =件並經由判斷“dtr 第—70件91之間的相對位 麸 兀件90與該 該第一元件90與第二元株Q/後再藉由該吸嘴13根據 第一元件90上並與之結人之相對位置差異，移動至該 點，第-，利用兩缸影像擷取-之，術:有幾個缺 第二，取像完成後，第基準不同’容易產生誤差。 移動的過程，由於吸嘴13 .經過吸嘴13傳遞與橫向 鲁 產生誤差，而使it件結、f藉由移動機構之故因此會 點，使得s件結合之精i降=度料侷限。綜合前述之缺 示二外如：一所不該圖係為習用之元件結合方式 移二少，為了避免吸嘴之橫向移動所造成之位 …、，’係將一影像掏取單元15設置於第一元件9〇與第 广件91之間，该影像操取單元15 *有兩影像擁取裝置 5〇與15卜分別操取第—林9()以及第二元件91之影 象。然後，吸嘴13先將第二元件91大概移動至第一元件 υ上方。由於該影像擷取單元15可分別擷取該第一元件 」與該第二元件91之影像’因此可以經過判斷調整該第 疋件9G與該第二元件91之相對位置（除了 ζ袖高度之 201011886 外）°當前後左右之相對位置調整完畢後’再移動該影像擷 取單元=，使其離開該第一元件9〇與該第二元件 此％•該吸嘴13僅需進行2軸方向的移動將第二元件 移動至°亥第元件90上使其結合。雖然前述之技術可 以減少吸嘴因橫向位移，但是因為第-元件9。4= =具有，影_取單幻5，_於該第 =一;件間90尚有—段距離。所以吸㈣在進行。 °之移動時’還是容易造成對位上之誤差。 用技之=亟需-種元件結合方法㈣解決習 【發明内容】 社人—種70件結合方法與裝置’其係將要對位 、-口之7G件移動至對應之位 要對位 ，位置誤差，然後調整後將兩 別兩元件 ❹ 為移動元件所造成之對位誤差。 互^5，以減少因 影像種70件結合方法與裳置，其係利用單 取像時造成之誤差，而影響到對位結d;像掏取襄置 本發明提供—種元件結合方法與^ 設計之元件夾持元件，使得影像掏取裝^糸利用特殊 元件;作為後續影像處理操取到 在實施例令，本發明提供一種 包括有下列步驟:擷取一第一元件c第2 201011886 像U二元件移動至對應該第—元件上方之位置 取S亥第一元件之影像以形成一第二影 σ 該第二影像進行比對程序，並根據比對之;與 -元件相結合。 及使料二元件與該第 在:::施：中，本發明提供一種元件結合裝 Φ 參 承載一第一元件，該第-元件 n-第-對位記號夾取元件，其係可提供爽取 H二對位記號之第二元件，失取元件上開設有至少 一第一對位記號相對應；一影像擷取裝置，其係 設置=承載台上方，該影像棘裝置係可娜該第一元 件之影像以及於該爽取元件夾持該第二元件至1第一元 上方時擷取該第二^件之影像；以及1制單=，其係可 將該影像操取裝置所擷取關於該第一元件與該第二元件之 影像進行比對’並根據比對之結果產生—控制訊號給該承 載台或者是該夾取元件以調整該第一元件與該第二元件之 相對位置並相互結合。 【實施方式】 為使貴審查委員能對本發明之特徵、目的及功能有 更進-步的認知與瞭解，下文特將本發明之系統的相關細 部結構以及設什的理念原由進行說明，以使得審查委員可 以了解本發明之特點，詳細說明陳述如下： 一 請參閱圖二所示’▲圖係為本發明之元件結合方法實 施例流程示意圖。該元件結合方法包括有下列步驟，首先 201011886 進行步驟20，擷取一第一元件之影像以形成一第一影像。 該第一元件可以為一單一之晶片、玻璃基板、PCB基板或 者是陶兗基板，除此之外，亦可以指如圖四中之晶圓上之 ‘任一個晶片。如圖五所示般而言’該第一元件9〇上可 以形成有可以提供對位判別之對位記號901，所以該第一 影像上也會具有對應該標記之影像。 接著進行步驟21，將〆第二元件移動至對應該第一元 件上方之位置。步驟21之目的在於，避免習用技術因為移 φ 動第二元件時所造成之移動誤差’進而影響對位之精度， 因此先將第二元件大致移動至對應第一元件之位置。在本 步驟中，因為第一元件與第二元件中並無任何障礙物，因 此可以將第二元件移動至相當靠近該第一元件之位置。至 於要靠近多少，可以是移動機構可能造成之機械誤差而 定。這是熟悉此項技術之人，可以根據移動機構之特性而 決定。另外’該第二元件係為晶片。 接下來，進行步驟22，擷取該第二元件之影像以形成 % 一第二影像。該第二元件上同樣也形成有對應該第一元件 上之對位記號。接著進行步驟23，將該第一影像與該第二 影像進行比對程序’並根據比對之結果調整該第一元件與 該第二元件之相對位置。其中，調整該第一元件與該第二 元件之相對位置之方式係可選擇移動該第一元件以及該第 二元件其中之一。在此需提到的是，為了結合第一元件與 第二元件’通常會有加熱元件，以提供加熱的能量於該第 —元件上，以利第一元件與第二元件相結合。而加熱元件 所提供之熱量會增加第一元件上方空氣的溫度，而產生熱 201011886 波紋，進而干擾影像擷取的效果。一旦影像擷取效果不理 想，就會影響到對位判別的效果。 接下來利用圖六來說明步驟23之程序，其中圖六之標 記93代表第一影像，而標記94代表第二影像。由於該第 一影像93與第二影像94上亦分別具有對位記號930、931 與940、941，因此將該第二影像94與該第一影像93疊合 之後，可以發現第一影像93之對位記號930與931與該第 二影像94之對位記號940與941間之相對位置關係。由圖 _ 六可以發現第二影像94上之對位記號940與941與第一影 像93上之對位記號930與931位置上具有差異，因此可以 藉由步驟23調整讓第一影像93上之對位記號930與931 與第二影像94上之對位記號940與941重疊，使得第一元 件與該第二元件在水平面上幾乎沒有任何之偏差。最後， 再進行步驟24使該第二元件與該第一元件相結合。在本步 驟中，可以是移動第一元件或者是移動第二元件進行Z軸 方向之運動使得第一元件與第二元件相互結合。由於在步 驟22中第一元件與第二元件間之垂直距離已經相當靠 ® 近，因此雖然在步驟24中還是要進行Z軸方向之移動，但 是移動之距離很少，因此可以減少因為移動所造成之誤 差，進而維持第一元件與第二元件元件結合之精度。另外， 圖三之實施例流程中，更可以包括一步驟25，提供一壓力 於該第二元件上，以加強第二元件與第一元件元件結合之 穩定性與平整性。 請參閱圖七A所示，該圖係為本發明之元件結合裝置 示意圖。該元件結合裝置具有一承載台30、一夾取元件 11 201011886 3卜一影像擷取裝置32以及一控制單元33。該承載台30， • 其係可提供承載一第一元件90，該第一元件90上係具有 一第一對位記號900(圖中之對位記號9〇〇僅為標示，實際 上對位§己號之配置可參閱圖五所示）。該承载台係可進 ' 灯至少一維度之位移運動，在本實施例t，該承載台30係 可進灯X、Y、Z轴方向之位移運動，以及z轴方向之旋轉 運動。該第-元件90係可為單―晶片，但也可以如圖七6 所示’屬於-晶圓9上之晶片。再回到圖七A所示，該夾 瘳取兀件3卜其係可提供夾取具有一第二對位記號91〇之第 -το件9卜夾取το件31上開設有至少一結構31〇可提供 f到該第二對位記號91G (圖中之對位記號_僅為標示， 記號之配置可參閱圖五所示）。在本實施例中， =構31^糸為通孔，其數量為至少一個。此外，如圖七 透光:元ίΠΓ為透0月元件’例如玻璃’或者是其他可 ::。該爽取元件31係可進行至 動’在本♦施财，該失取聽W斜 向之位移運動，以β7红士丄^ Υ Ζ軸方 ❹ #可利用習用姑〜轴方向之疑轉運動。該夾取元件31 叮=¾用技術可夾取晶片之元件 ： 中’錢取元件31係為吸嘴。該第二元件例 兀件放置盤34或者是其他之承载装 屬=於 技術在此不作贅述。 具係屬於習用之 該影置於該承戴台如上方， 該爽取元件^之影像以及於 線取該第二元件心影像。該影像= ===時 12 201011886 CCD影像擷取裝置或一 CM〇s影像擷取襞置 限，例如··亦可根據需要選擇紅外線影像_取裝：以= 制單=汐係可將該影像擷取裝置32所-取關二第工 生二件91之影像進行比對，並根據比對 給該㈣自3G料衫爽取元件 31以調整該弟一兀件9〇與該第二元件91之相對位置。 ❹ 接下來朗本發日_七A之財結合裝置之動作流 程二Si至圖八D所示。首先如圖八A所示，提供-元3，其詳細結構如前所述，在此不作贅述。 然後利用該影像擷取|置32對該第—元件9()進行取像。 接著如圖人B所示，該夾取元件31將該第二元件91移動 至對應該第-元件9〇上方，並調整該第二元件91在2轴 方向之位置使該第二元件91靠近該第—元件9Q。接著利 用同一個影像擷取裝置32擷取該第二元件91之影像。另 外，該第二對位記號係朝向該第一元件或者是背對該第一 元件。例如_九所示，在本實施例中，該第二對位記號Θ10 ❷係形成於該第二元件91之頂面與該影像擷取裝置32相對 應。由於該失取元件31上之結構310與該第二對位記號 910相對應’應此該影像擷取裝置32可以透過該結構310 擷取到該第二對位記號910之影像。但是在圖九中，亦顯 示另一種貫施態樣’係為該第二對位記號91〇a設置於該第 二元件91之底面而與該第一元件90頂面相對應。在這種 情況下，並無法直接利用傳統之影像擷取裝置201011886 IX. Description of the Invention: [Technical Field] The present invention relates to a method and apparatus for aligning a position, and more particularly to a method and apparatus for combining components for aligning components. [Prior Art] As mobile phones and their internal components gradually shrink, the electronics industry is constantly looking for the best way to integrate all miniaturization technologies. Therefore, in order to achieve higher packing density, further downsizing, and shortening the distance of signal transmission, a three-dimensional (3D) package in which a plurality of wafers are vertically stacked or a CISP package technology is thus produced. In general, this type of technology typically integrates system-level package components into one, for example, combining a memory chip with a microprocessor to form an integrated module. These components are then stacked vertically on the wafer or on another wafer' to be packaged. Wafer stacking in the vertical direction increases the packing density and increases the functionality of the package via integration. Although the module for stacking wafers has many functions and advantages, there are still quite a few problems to be overcome. One of the problems is that the size of the wafer is micron-sized, so how to combine the wafer with the wafer. Minimizing is a very important technical key. Please refer to FIG. 1 , which is a schematic diagram of a conventional technology wafer stacking. In the art, there is a first image capturing device 10, a second image capturing device 11, a carrier 12 and a nozzle 13. The first image capturing device 10 is disposed on one side of the carrying platform 12, and the carrying platform 12 can carry a wafer 201011886 9 (there are a plurality of the first nozzles - the nozzle 13 can be sucked to be combined - the first f is the first wafer of the single - the piece 91 is moved to the opposite element 91 ' with the first element 9 并将 and the second element two element 91 is connected with the first element 90 * Γ bit f 'then The operation mode of the first figure is as follows. The second image manipulation device 11 is respectively like a device: the device 10 and the device, and determines that the relative position bran member 90 between the dtr and the 70th member 91 is the same. An element 90 and a second element Q/ are then moved to the point by the nozzle 13 according to the relative position difference between the first element 90 and the person connected thereto, and the second is captured by the two-cylinder image. , surgery: there are a few missing second, after the image is completed, the first reference is different 'easy to produce errors. The moving process, due to the suction nozzle 13. The error is transmitted through the nozzle 13 and the transverse direction, so that the piece is knotted, f By moving the mechanism, it will be so that the combination of the s-pieces will be limited to the limit of the material. In order to avoid the position caused by the lateral movement of the nozzle, the image capturing unit 15 is disposed on the first component 9〇 and the wide member. Between 91, the image capturing unit 15* has two image capturing devices 5〇 and 15b respectively capturing images of the first forest 9() and the second component 91. Then, the nozzle 13 firstly uses the second component 91 is moved to the top of the first component 。. Since the image capturing unit 15 can respectively capture the image of the first component and the second component 91, the second component 9G and the second component can be adjusted through judgment. 91 relative position (except for the height of the sleeves 201011886) ° After the relative position of the current rear left and right is adjusted, 'removing the image capturing unit=, leaving the first component 9〇 and the second component. The nozzle 13 only needs to move in the 2-axis direction to move the second member to the HF element 90 for bonding. Although the aforementioned technique can reduce the lateral displacement of the nozzle, the first element is 9. 4 == Have, shadow_take single magic 5, _ in the first = one; - Segment distance. So suction (four) is in progress. °When moving, it is still easy to cause errors in the alignment. Use technique = need - type of component combination method (4) to solve the problem [invention content] Community - 70 combinations of methods And the device 'the system will be aligned, the 7G piece of the port is moved to the corresponding position to be aligned, the position error, and then the two parts and two components are adjusted to be the alignment error caused by the moving element. Reducing the 70-piece combination method and skirting of the image type, which utilizes the error caused by single image acquisition, and affects the alignment node d; like the capture device, the present invention provides a component combination method and a component component of the design Holding the component, the image capturing device utilizes a special component; as a subsequent image processing operation, in an embodiment, the present invention provides a method comprising: capturing a first component c 2nd 201011886 like U two component moving The image of the first component is taken to the position above the first component to form a second image σ. The second image is subjected to an alignment process, and is combined with the component. And the second component of the device and the first:::, the present invention provides a component bonding device Φ to carry a first component, the first component n-first-alignment marker clamping component, which is provided Cooling the second component of the H-alignment mark, the missing component is provided with at least one first alignment mark; an image capture device, the system is set to be above the carrier, and the image-spinning device is An image of the first component and an image of the second component when the refreshing component clamps the second component to above the first component; and a system of the image control device Taking a comparison between the image of the first component and the second component and generating a control signal according to the result of the comparison to the carrier or the clamping component to adjust the first component and the second component Relative position and combination with each other. [Embodiment] In order to enable the reviewing committee to have a more advanced understanding and understanding of the features, objects and functions of the present invention, the following detailed description of the detailed structure of the system of the present invention and the idea of the concept are made to The reviewer can understand the characteristics of the present invention, and the detailed description is as follows: 1. Please refer to FIG. 2 for a schematic diagram of the embodiment of the component combining method of the present invention. The component bonding method includes the following steps. First, in step 201010, step 20 is performed to capture an image of the first component to form a first image. The first component may be a single wafer, a glass substrate, a PCB substrate or a ceramic substrate, and may also refer to any of the wafers on the wafer as shown in FIG. As shown in Fig. 5, the first element 9 can be formed with a registration mark 901 which can provide alignment discrimination, so that the first image also has an image corresponding to the mark. Next, step 21 is performed to move the second member to a position corresponding to the upper portion of the first member. The purpose of step 21 is to avoid the shifting error caused by the conventional technique when moving the second component, thereby affecting the accuracy of the alignment, so that the second component is first moved substantially to the position corresponding to the first component. In this step, since there is no obstacle in the first member and the second member, the second member can be moved to a position relatively close to the first member. As for how close, it may be due to mechanical errors that may be caused by the mobile mechanism. This is a person familiar with the technology and can be determined based on the characteristics of the mobile organization. Further, the second component is a wafer. Next, step 22 is performed to capture an image of the second component to form a second image. The second component is also formed with a registration mark corresponding to the first component. Next, in step 23, the first image and the second image are compared with each other and the relative position of the first element and the second element is adjusted according to the result of the comparison. The manner in which the relative position of the first component and the second component are adjusted is such that one of the first component and the second component can be selectively moved. It is to be noted here that in order to combine the first element with the second element 'there is usually a heating element to provide heating energy to the first element, so that the first element is combined with the second element. The heat provided by the heating element increases the temperature of the air above the first element, which generates heat 201011886 ripple, which interferes with image capture. Once the image capture effect is not ideal, it will affect the effect of the alignment. Next, the procedure of step 23 will be described using FIG. 6, in which the mark 93 of FIG. 6 represents the first image and the mark 94 represents the second image. Since the first image 93 and the second image 94 also have alignment marks 930, 931 and 940, 941 respectively, after the second image 94 is overlapped with the first image 93, the first image 93 can be found. The relative positional relationship between the alignment marks 930 and 931 and the alignment marks 940 and 941 of the second image 94. It can be seen from FIG. 6 that the alignment marks 940 and 941 on the second image 94 are different from the alignment marks 930 and 931 on the first image 93, so that the first image 93 can be adjusted by step 23. The alignment marks 930 and 931 overlap with the alignment marks 940 and 941 on the second image 94 such that the first element and the second element have almost no deviation in the horizontal plane. Finally, step 24 is performed to combine the second component with the first component. In this step, the movement of the first member or the movement of the second member in the Z-axis direction may be performed such that the first member and the second member are coupled to each other. Since the vertical distance between the first element and the second element is already relatively close to ® in step 22, although the movement in the Z-axis direction is still performed in step 24, the distance of movement is small, so that it can be reduced because of the movement The resulting error, in turn, maintains the accuracy of the combination of the first component and the second component component. In addition, in the embodiment of FIG. 3, a step 25 may be further included to provide a pressure on the second component to enhance the stability and flatness of the combination of the second component and the first component component. Please refer to FIG. 7A, which is a schematic diagram of the component bonding device of the present invention. The component bonding device has a carrying platform 30, a clamping component 11 201011886 3 - an image capturing device 32 and a control unit 33. The carrier 30 can be provided with a first component 90. The first component 90 has a first alignment mark 900 (the alignment mark 9 in the figure is only an indication, actually alignment) § The configuration of the number can be seen in Figure 5). The stage can be moved in at least one dimension of the lamp. In the embodiment t, the stage 30 can be moved in the X, Y, and Z directions of the lamp, and the z-axis direction. The first element 90 can be a single wafer, but it can also be a wafer on the wafer 9 as shown in Fig. 7-6. Returning to FIG. 7A, the clip picking member 3 can provide a gripping portion having a second alignment mark 91〇, and a member having at least one structure. 31〇 can provide f to the second alignment mark 91G (the alignment mark in the figure is only the indication, and the configuration of the symbol can be seen in FIG. 5). In this embodiment, the = structure is a through hole, and the number thereof is at least one. In addition, as shown in Figure 7, light transmission: Yuan ΠΓ is a component of the month of October, such as glass, or other can be ::. The refreshing element 31 can be moved to the virtual 'in this ♦ wealth, the loss of listening to the oblique movement of the oblique direction, to the β7 red 丄 Υ Υ Ζ ❹ ❹ ❹ 可 可 可 可 可 可 可 可 可motion. The gripping element 31 叮=3⁄4 uses a technique to grip the components of the wafer: The middle 'money picking element 31 is a nozzle. The second component is exemplified by the component placement disk 34 or other carrier device = the technology is not described herein. The image is conventionally placed on the top of the receiving table, and the image of the component is taken and the second component image is taken. When the image ==== 12 201011886 CCD image capture device or a CM 〇 s image capture limit, for example, · can also select infrared image as needed _ fetch: use = system = 汐 can The image capturing device 32 compares the images of the two working pieces of the second working piece of the second working piece 32, and according to the comparison, gives the (4) self-made 3G material to the component 31 to adjust the first piece of the device and the second piece. The relative position of the elements 91. ❹ Next, the action process of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ First, as shown in FIG. 8A, a - element 3 is provided, the detailed structure of which is as described above, and will not be described herein. The first element 9() is then imaged by the image capture unit 32. Next, as shown in FIG. B, the gripping member 31 moves the second member 91 above the corresponding first member 9〇, and adjusts the position of the second member 91 in the 2-axis direction to bring the second member 91 closer. The first element 9Q. The image of the second component 91 is then captured by the same image capture device 32. Additionally, the second alignment mark is toward the first element or is opposite the first element. For example, in the present embodiment, the second alignment mark Θ10 形成 is formed on the top surface of the second component 91 and corresponds to the image capturing device 32. Since the structure 310 on the missing component 31 corresponds to the second alignment mark 910, the image capturing device 32 can capture the image of the second alignment mark 910 through the structure 310. However, in Fig. 9, another embodiment is shown in which the second alignment mark 91〇a is disposed on the bottom surface of the second member 91 to correspond to the top surface of the first member 90. In this case, it is not possible to directly use the conventional image capture device.
’例如：CMOS 或者是CCD影像擷取裝置來擷取影像，因此在這種情況 下，該影像操取裝置32必須選擇紅外線影像擷取裝置或其 13 201011886 他類似之影像擷取裝置來擷取第二元件91上關於該第二 對位記號910a之影像。 該控制單元33，在收到該第一元件90之影像與該第 二元件91之影像後，會將此兩影像進行比對，尋找出相對 位置之差異。然後根據差異調整該第二元件91之位置，以 使該第一元件90與該第二元件91相對齊（X與Y方向）。 最後，如圖八C所示，該控制單元33發出控制訊號，使該 夾取元件31進行Z轴方向的移動使該第二元件91與該第 0 —元件9 0相結合。除了前述移動爽取元件31外，也可以 移動承載台30來使第一元件90與第二元件91相結合。如 圖八D所示，為了強化第一元件90與第二元件91結合之 穩定性與平整性，更可以利用一處理裝置35對第二元件進 行製程處理。其中該處理裝置係可為一加壓頭以提供壓力 於該第二元件91上。此外，該處理裝置35更可以為預熱 單元36以提供熱量於該第二元件上91。當然該處理裝置 亦可為加壓與加熱元件的組合。 A 請參閱圖十所示，該圖係為本發明之元件結合裝置另'For example: CMOS or CCD image capture device to capture images, so in this case, the image manipulation device 32 must select an infrared image capture device or its similar image capture device. The image of the second alignment mark 910a on the second component 91. The control unit 33, after receiving the image of the first component 90 and the image of the second component 91, compares the two images to find a difference in relative position. The position of the second member 91 is then adjusted based on the difference such that the first member 90 is aligned with the second member 91 (X and Y directions). Finally, as shown in Fig. 8C, the control unit 33 sends a control signal to cause the gripping member 31 to move in the Z-axis direction to combine the second member 91 with the 0-th member 90. In addition to the aforementioned moving take-up element 31, the stage 30 can be moved to combine the first element 90 with the second element 91. As shown in FIG. 8D, in order to enhance the stability and flatness of the combination of the first component 90 and the second component 91, a processing device 35 can be used to process the second component. Wherein the processing device is a pressurizing head to provide pressure on the second member 91. Additionally, the processing device 35 can be a preheating unit 36 to provide heat to the second component 91. Of course, the treatment device can also be a combination of pressurization and heating elements. A Please refer to FIG. 10, which is a component combination device of the present invention.
A 一實施例示意圖。在本實施例中，其使用場合是在於如果 同一元件上的對位記號（如圖五之兩個對位記號9 01)相距 太遠，無法以單一影像擷取裝置32同時擷取影像時，可以 在該影像擷取裝置32與對位元件90與91之間設置一光學 模組36，其主要是由反射鏡360所構成，可以每一個對位 記號之光路導引至影像擷取裝置3上，如此便可同步進行 取像。請參閱圖十一所示，該圖係為本發明之元件結合裝 置另一實施例示意圖。在本實施例中，其使用場合是在於 14 201011886 如果同一元件上的對位記號（如圖五之兩個對位記號901) 相距太遠，無法以單一影像擷取裝置32同時擷取影像時而 且又需要有高的影像解析度時，可以利用具有兩個CCD影 像感測元件320與321的影像擷取裝置32，每一個CCD影 像感測元件320與321分別對應到對位元件之一的對位記 號上。例如：（可參閱圖十三A與十三B所示）CCD影像感 測元件320則負責擷取第一元件80以及第二元件81上相 互對應之對位記號850與852，而CCD影像感測元件321 則負責第一元件80以及第二元件81上另一個相互對應之 ®對位記號851與853。 利用圖十一之裝置，請參閱圖十二所示，該圖係為本 發明之元件結合方法另一實施例流程示意圖。在本實施例 中，該結合方法4包括有下列步驟，可參閱圖十一、十三 A與十三B所示，首先進行步驟40提供一影像擷取裝置 32，其係具有一第一影像擷取元件320以及一第二影像擷 取元件321。接著進行步驟41，以第一影像擷取元件320 擷取一第一元件80之第一對位記號850影像以形成一第一 ❹ 影像860以及以一第二影像擷取元件321擷取該第一元件 80上之第二對位記號851以形成一第二影像861。然後進 行步驟42，將一第二元件91移動至對應該第一元件90上 方之位置，形成如圖十一之狀態。接著進行步驟43，以該 第一影像擷取元件320擷取該第二元件81之一第三對位記 號852影像以形成一第三影像862以及以該第二影像擷取 元件321擷取該第二元件81上之第四對位記號853以形成 一第四影像863。然後進行步驟44，分別將該第一影像與 15 201011886 該第三影像進行比對程序以及將該第二影像與第四影像進 行比對程序，並根據比對之結果調整該第一元件80與該第 二元件81之相對位置。最後，在進行步驟45使該第二元 件80與該第二元件81相結合。 綜合上述，本發明之元件結合方法與裝置，可以減少 因為移動元件所造成之對位誤差。此外，其利用單一影像 擷取裝置來擷取元件的影像，避免多支影像擷取裝置取像 時造成之誤差，而影響到對位結合之精度。 ©唯以上所述者，僅為本發明之實施例，當不能以之限 制本發明範圍。即大凡依本發明申請專利範圍所做之均等 變化及修飾，仍將不失本發明之要義所在，故都應視為本 發明的進一步實施狀況。 201011886 【圖式簡單說明】 圖一與圖二係為習用之晶片對位裝置示意圖。 圖三係為本發明之元件結合方法實施例流程示意圖。 圖四係為晶圓示意圖。 圖五元件上之對位記號示意圖。 圖六係為第一元件與第二元件對位示意圖。 圖七A係為本發明之元件結合裝置示意圖。 # 圖七B係為本發明之第一元件另一實施例示意圖。 圖七C係為本發明之區域内之結構另一實施例示意圖。 圖八A至圖八D係為本發明之元件結合裝置動作示意圖。 圖九係為第二對位記號位置示意圖。 圖十係為本發明之元件結合裝置另一實施例示意圖。 圖十一係為本發明之元件結合裝置又一實施例示意圖。 .圖十二係為本發明之元件結合方法另一實施例流程示意 圖。 ⑩ 圖十三A與十三B係為本發明之第一元件與第二元件擷取 影像示意圖。 【主要元件符號說明】 10-第一影像擷取裝置 11-第二影像擷取裝置 13-吸嘴 15-影像擷取單元 17 201011886 150、151-影像擷取裝置 2 _元件結合方法 20〜25-步驟 3-元件結合裝置 30-承載台 31 -夾取元件 310- 結構A schematic diagram of an embodiment. In this embodiment, the use case is that if the alignment mark on the same component (the two alignment marks 9 01 in FIG. 5) is too far apart, the image capturing device 32 cannot simultaneously capture the image. An optical module 36 can be disposed between the image capturing device 32 and the alignment elements 90 and 91. The optical module 36 is mainly composed of a mirror 360, and can be guided to the image capturing device 3 by an optical path of each alignment mark. On the top, you can synchronize the image capture. Referring to Figure 11, there is shown a schematic view of another embodiment of the component bonding apparatus of the present invention. In this embodiment, the use case is 14 201011886. If the alignment mark on the same component (the two alignment marks 901 in FIG. 5) is too far apart, the image capturing device 32 cannot capture the image at the same time. Moreover, when high image resolution is required, the image capturing device 32 having two CCD image sensing elements 320 and 321 can be utilized, and each of the CCD image sensing elements 320 and 321 respectively corresponds to one of the alignment elements. On the registration mark. For example, (see FIGS. 13A and 13B), the CCD image sensing component 320 is responsible for capturing the alignment marks 850 and 852 corresponding to each other on the first component 80 and the second component 81, and the CCD image sense. The measuring element 321 is responsible for the other corresponding aligning marks 851 and 853 of the first element 80 and the second element 81. Referring to FIG. 12, FIG. 12 is a schematic flow chart of another embodiment of the component bonding method of the present invention. In this embodiment, the bonding method 4 includes the following steps. Referring to FIG. 11 , FIG. 13A and FIG. 13B , the first step 40 is to provide an image capturing device 32 having a first image. The component 320 is captured and a second image capturing component 321 is selected. Then, in step 41, the first image capturing component 320 captures a first alignment mark 850 image of the first component 80 to form a first image 860 and captures the image by a second image capturing component 321 A second alignment mark 851 on an element 80 forms a second image 861. Then, in step 42, a second element 91 is moved to a position corresponding to the upper side of the first element 90 to form a state as shown in Fig. 11. Then, the first image capturing component 320 captures a third alignment mark 852 image of the second component 81 to form a third image 862, and the second image capturing component 321 captures the image. The fourth alignment mark 853 on the second component 81 forms a fourth image 863. Then, in step 44, the first image is compared with the third image of 15 201011886, and the second image and the fourth image are compared, and the first component 80 is adjusted according to the result of the comparison. The relative position of the second element 81. Finally, step 45 is performed to combine the second component 80 with the second component 81. In summary, the component bonding method and apparatus of the present invention can reduce the alignment error caused by the moving component. In addition, the single image capturing device is used to capture the image of the component, thereby avoiding the error caused by the image capturing device, and affecting the accuracy of the alignment. The above is only the embodiments of the present invention, and the scope of the present invention is not limited thereto. That is, the equivalent changes and modifications made by the present invention in the scope of the present invention will remain as the further embodiment of the present invention. 201011886 [Simple description of the diagram] Figure 1 and Figure 2 are schematic diagrams of the conventional wafer alignment device. FIG. 3 is a schematic flow chart of an embodiment of a component bonding method of the present invention. Figure 4 is a schematic diagram of the wafer. Schematic diagram of the alignment mark on the component of Figure 5. Figure 6 is a schematic diagram of the alignment of the first component and the second component. Figure 7A is a schematic view of the component bonding device of the present invention. #图七B is a schematic diagram of another embodiment of the first component of the present invention. Figure 7C is a schematic view of another embodiment of the structure within the area of the present invention. 8A to 8D are schematic views showing the operation of the component bonding device of the present invention. Figure 9 is a schematic diagram of the position of the second alignment mark. Figure 10 is a schematic view of another embodiment of the component bonding apparatus of the present invention. Figure 11 is a schematic view showing still another embodiment of the component bonding device of the present invention. Fig. 12 is a schematic flow chart showing another embodiment of the component joining method of the present invention. 10 Figures 13A and 13B are schematic views of the first component and the second component captured by the present invention. [Description of main component symbols] 10-first image capturing device 11 - second image capturing device 13 - nozzle 15 - image capturing unit 17 201011886 150, 151 - image capturing device 2 - component bonding method 20 to 25 - Step 3 - Component bonding device 30 - Carrier 31 - Clamping component 310 - Structure
311- 透明元件 32- 影像擷取裝置 320- 第一影像擷取元件 321- 第二影像擷取元件 33- 控制單元 34_元件放置盤 35- 處理裝置 36- 光學模組 360-反射鏡 80- 第一元件 81- 第二元件 850- 第一對位記號 851- 第二對位記號 852- 第三對位記號 853- 第四對位記號 860-第一影像 18 201011886 861- 第二影像 862- 第三影像 863- 第四影像 9-晶圓 90- 第一元件 900-第一對位記號 91- 第二元件 ® 910、910a-第二對位記號 93- 第一影像 930、931-對位記號 94- 第二影像 940、941-對位記號 19311- Transparent element 32 - Image capturing device 320 - First image capturing element 321 - Second image capturing element 33 - Control unit 34_ Component placement disk 35 - Processing device 36 - Optical module 360 - Mirror 80 - First element 81 - second element 850 - first alignment mark 851 - second alignment mark 852 - third alignment mark 853 - fourth alignment mark 860 - first image 18 201011886 861 - second image 862- Third image 863 - fourth image 9 - wafer 90 - first component 900 - first alignment mark 91 - second component ® 910, 910a - second alignment mark 93 - first image 930, 931 - alignment Symbol 94 - second image 940, 941 - alignment mark 19