201008471 九、發明說明： 【發明所屬的技術領域】 特別係指用於對發熱 本發明涉及一種散熱裝置 電子元件進行散熱的散熱裝置 【先前技術】201008471 IX. Description of the Invention: [Technical Field] The invention relates to a heat dissipating device for dissipating heat of an electronic component of a heat dissipating device. [Prior Art]
，子元件（如中央處理器）運行時產生大量熱量， 而使其本叙純溫度升高，繼㈣致其運行性能的 下^為確保電子元件能正常運行，通常在電子元件 上女裝散熱裝置，排出其所產生的熱量。 —習知散熱裝置一般包括一熱管和複數散熱韓片。 :-散熱鰭片上設有一穿孔’且沿穿孔周緣向外突出 :有-環緣。組裝時，每一散熱鰭片的環緣與相鄰散 …鰭片相抵靠形成-密閉的收容通道，該收容通道的 内表面預先設有錫膏，熱管穿套於該收容通道内通過 所述錫膏與散熱鰭片相互連接。&了能讓熱管容易穿 入且與所述散熱鰭片之間能緊密接觸，該散熱鰭片上 =穿孔的大小一般設置得比熱管的外徑略大，當將熱 瘟從&向另一端穿置於該收容通道内時，預先塗設 於該收容通道内表面的錫膏容易被熱管從收容通道的 另一端帶出，因此，所述散熱鰭片與熱管之間留下的 锡膏杈少，從而導致熱管與散熱鰭片之間焊接不緊 费’進而導致產品性能不穩定。 為了使得熱管的穿套更加方便以及該熱管與散熱 201008471 鰭片之間的結合更加可靠，業界採用將穿孔的孔徑大 . 小設置得與熱管的外徑相等，並在散熱鰭片上於環緣 上方設有一開口，使穿孔通過該開口與外界相連通。 組裝時，首先將熱管穿置於該收容通道内，再通過該 開口加入錫膏。然而，該開口會減小散熱籍片的面積， 且該散熱裝置組裝時操作繁瑣。 【發明内容】 _ 有鑒於此，有必要提供一種焊接效果較好且組裝方便 ◎ 的散熱裝置。 一種散熱裝置，包括一熱管及複數散熱鰭片，每一散 熱鰭片包括一本體及從該本體的端部向一侧彎折延伸形成 的折邊，所述折邊與其相鄰的散熱鰭片的本體相抵觸，每 一散熱鰭片的本體上設有一穿孔，每一本體沿所述穿孔的 周緣向與其相鄰的散熱鰭片的本體所在的方向延伸形成一 環緣，所述各環緣相對應形成一收容熱管的收容通道，所 〇 述環緣沿其圓周方向至少有一部分的高度小於該折邊的寬 度，使該環緣的所述部分與相鄰散熱鰭片的本體之間形成 一間隙，該間隙用於收容填充於熱管與散熱鰭片之間的過 量的錫膏。 一種散熱裝置，包括一熱管及多個散熱鰭片，每一散 熱鰭片包括一本體，每一散熱鰭片的本體上設有一穿孔， 該穿孔的周緣設有一環緣，該熱管收容在各散熱鰭片的穿 孔内且通過錫膏與各散熱鰭片的環緣接觸，所述環緣的圓 201008471 周方向上至少有一部分與相鄰散熱鰭片的本體之間間隔形 . 成一間隙，該間隙用於收容填充於熱管與散熱鰭片的環緣 之間的過量的錫膏。 與習知技術相比，上述散熱裝置通過環緣與相鄰的 散熱鰭片的本體之間形成間隙，在熱管穿設於由穿孔 構成的收容通道時，不至於有過多的錫膏被熱管擠 出，過量的錫膏可保留於該間隙内，有效地利用了鍚 膏，使熱管與散熱鰭片之間焊接緊密，使產品性能穩 ® 定。同時，由於錫膏不會被熱管擠出，避免了清除被 擠出的錫膏的工序，使組裝亦更為方便。 【實施方式】 下面參照圖示，結合實施例詳細說明本發明的散熱裝 置。 如圖1及圖2所示為本發明散熱裝置的第一實施例， 該散熱裝置包括一散熱鰭片組20及穿設於該散熱鰭片組 ❹ 20内的一熱管10。 該熱管10為一扁平熱管。 該散熱鰭片組20由複數散熱鰭片22依次排列而成。 所述散熱鰭片22之間相互平行，且每相鄰的兩個散熱鰭片 22之間相互間隔一相等的距離而形成一氣流通道。每一散 熱鰭片22包括一本體220及分別從本體220的頂端及底端 向一侧彎折形成的兩個折邊222。該折邊222與本體220 相互垂直，每一折邊222包括一與本體220連接的固定端 201008471 及從該固定端向外延伸的自由端，所述兩個折邊222的寬 度相等，每一折邊222於其自由端的左、右兩側分別向外 延伸設有一扣鉤224，且於其固定端的左、右兩側分別設有 一卡槽226。所述卡槽226的位置及大小分別與所述扣鉤 224的位置及大小相對應，每一散熱鰭片22的扣鉤224可 對應地收容於一相鄰散熱鰭片22的卡槽226内從而將所述 散熱鰭片22相互連接。每一散熱鰭片22的本體22〇的中 央設有一穿孔2202,該穿孔2202的形狀與熱管1〇的橫截 面的形狀相同，且其尺寸略大於該熱管1〇的外徑。本實施 例中，散熱鰭片22的本體220上穿孔2202的内徑比該熱 管10的外徑大0.1〜0.2mm。每一散熱鰭片22於穿孔22〇2 的外圍對應設有一環緣2204，該環緣220環設於該穿孔 2202的外周緣’且從本體220向外一體延伸，該環緣22〇4 與該折邊222的延伸方向相同。在本實施例中，所述環緣 2204的局度沿其圓周方向的各個部分相等，且環緣2204 的各個部分的高度均小於所述折邊222的寬度。 組裝該散熱鑛片組20時’每相鄰的兩散熱鰭片22之 間’位於後侧的散熱鰭片22的折邊222與位於其前側的散 熱籍片22的本體220相互抵靠’且該後侧的散熱鰭片22 的扣鉤224對應的收容於該前側的散熱鰭片22的卡槽226 内’藉由所述扣鉤224與卡槽226的扣合作用而相互連接 在一起。所述散熱鰭片22的穿孔2202相互對齊，且每相 鄰的兩散熱鰭片22之間，位於後側的散熱鰭片22的環緣 2204向位於其前側的散熱鰭片22的本體220所在方向延 201008471 伸’所述環緣2204於該散熱鰭片組2〇的中央形成一柱狀 的收备通道2208。如圖3所示，由於環緣2204的高度小於 * 折邊222的寬度，該後側的散熱鰭片22的環緣2204的末 端與讀前侧的散熱鰭片22的本體220之間形成一微小的間 隙2206。該收容通道2208通過所述間隙2206分別與相鄰 兩散熱鰭片22之間形成的氣流通道相立連通，即該間隙 22〇6將該收容通道2208分割成複數段。 0 組裝該熱管10時，首先於該收容通道2208的内表面 或者於熱管10的外表面塗設一層錫膏30，然後將熱管10 從該散熱鰭片組20的收容通道2208的一端穿向另一端， 從而將熱管10收容於該收容通道2208内。如圖4所示， 由於環緣2204的末端與相鄰的散熱鰭片22的本體220間 設有間隙2206 ’在熱管1〇穿設於由穿孔2202構成的 收容通道2208時，不至於有過多的錫膏30被熱管1〇 擠出’過量的錫膏30可保留於該間隙2206内，有效 P 地利用了錫膏30，使熱管1〇與散熱鰭片22之間焊接 緊密，使產品性能穩定。此外，通過該間隙2206使收容 通道2208與外界相通，錫膏3〇的助焊劑中的松香受熱揮 發從間隙2206排出，使焊接面焊合充分，最終形成的成品 性能穩定’傳熱效率高。同時，該散熱裝置中的穿孔2202 設於散熱鰭片22的中央位置，以減小通過熱管1〇傳導至 散熱鰭片組20上的熱量在散熱鰭片22上的傳導路徑，並 能迅速分佈於散熱鰭片22的各處。 圖5為本發明散熱装置第二實施例’其與前述第一實 11 201008471 施例的區別在於：每一環緣2204a沿其圓周方向的不同部 分的高度不相等。本實施例中，每一環緣2204a沿其圓周 方向的最大高度等於折邊222的寬度’且該每一環緣2204a 沿其圓周方向的最小高度小於所述折邊222的寬度。因此，When a sub-component (such as a central processing unit) runs, it generates a large amount of heat, and the temperature of the sub-synthesis is increased. After (4) the performance of the sub-^ is ensured that the electronic components can operate normally, usually in the electronic components. The device discharges the heat generated by it. - Conventional heat sinks generally include a heat pipe and a plurality of heat sinks. : - The heat sink fin is provided with a perforation ' and protrudes outward along the periphery of the perforation: a - rim. When assembled, the rim of each of the heat dissipating fins abuts against the adjacent fins to form a sealed receiving passage, and the inner surface of the receiving passage is preliminarily provided with a solder paste, and the heat pipe is sleeved in the receiving passage through the The solder paste and the heat sink fins are connected to each other. & can make the heat pipe easy to penetrate and can be in close contact with the heat dissipation fin, the size of the perforation on the heat dissipation fin is generally set to be slightly larger than the outer diameter of the heat pipe, when the heat is from the & When one end is placed in the receiving passage, the solder paste previously applied to the inner surface of the receiving passage is easily taken out from the other end of the receiving passage by the heat pipe, and therefore, the solder paste left between the heat radiating fin and the heat pipe Less, resulting in a soldering between the heat pipe and the heat sink fins, which leads to unstable product performance. In order to make the heat pipe wearing the sleeve more convenient and the combination between the heat pipe and the heat dissipation 201008471 fin is more reliable, the industry adopts a hole having a large aperture, which is set to be equal to the outer diameter of the heat pipe, and is above the ring edge on the heat dissipation fin. An opening is provided through which the perforation communicates with the outside. When assembling, the heat pipe is first placed in the receiving passage, and then the solder paste is added through the opening. However, the opening reduces the area of the heat sink, and the heat sink is cumbersome to assemble. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device which has a good welding effect and is easy to assemble. A heat dissipating device includes a heat pipe and a plurality of heat dissipating fins, each of the heat dissipating fins including a body and a flange formed by bending from an end of the body to a side, the folded edge and the adjacent heat dissipating fin The body of the heat dissipating fins is provided with a through hole, and each body extends along a circumference of the through hole to a direction of a body of the heat dissipating fin adjacent thereto to form a ring edge. Corresponding to form a receiving passage for accommodating the heat pipe, the height of at least a portion of the rim in the circumferential direction is smaller than the width of the hem, so that a portion of the rim and a body of the adjacent heat sink fin form a A gap for accommodating an excess of solder paste filled between the heat pipe and the heat sink fin. A heat dissipating device includes a heat pipe and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a body. Each of the heat dissipating fins is provided with a through hole. The periphery of the through hole is provided with a ring edge, and the heat pipe is accommodated in each heat dissipation. The through hole of the fin is in contact with the edge of each of the heat dissipation fins by a solder paste, and at least a portion of the circumference of the circle 201008471 is spaced from the body of the adjacent heat dissipation fin to form a gap. It is used to accommodate an excess of solder paste filled between the heat pipe and the rim of the heat sink fin. Compared with the prior art, the heat dissipating device forms a gap between the body of the adjacent heat dissipating fins through the ring edge, and when the heat pipe is disposed in the receiving passage formed by the perforation, the excess solder paste is not squeezed by the heat pipe. Excessive solder paste can remain in the gap, effectively utilizing the paste, so that the heat pipe and the heat sink fins are tightly welded to ensure stable product performance. At the same time, since the solder paste is not extruded by the heat pipe, the process of removing the solder paste is avoided, which makes the assembly more convenient. [Embodiment] Hereinafter, a heat dissipating device of the present invention will be described in detail with reference to the accompanying drawings. As shown in FIG. 1 and FIG. 2, the first embodiment of the heat dissipation device of the present invention includes a heat dissipation fin assembly 20 and a heat pipe 10 disposed in the heat dissipation fin assembly 20. The heat pipe 10 is a flat heat pipe. The heat dissipation fin group 20 is formed by sequentially arranging a plurality of heat dissipation fins 22 . The heat dissipation fins 22 are parallel to each other, and each adjacent two heat dissipation fins 22 are spaced apart from each other by an equal distance to form an air flow passage. Each of the heat dissipation fins 22 includes a body 220 and two flanges 222 which are respectively bent from one end and the bottom end of the body 220 to one side. The flange 222 and the body 220 are perpendicular to each other. Each of the flanges 222 includes a fixed end 201008471 connected to the body 220 and a free end extending outward from the fixed end. The widths of the two flanges 222 are equal. The hem 222 has a hook 224 extending outwardly from the left and right sides of the free end, and a card slot 226 is respectively disposed on the left and right sides of the fixed end. The position and the size of the slot 226 are respectively corresponding to the position and the size of the hook 224. The hook 224 of each of the heat dissipation fins 22 can be correspondingly received in the slot 226 of an adjacent heat dissipation fin 22 . Thereby, the heat dissipation fins 22 are connected to each other. A center of the body 22 of each of the heat dissipating fins 22 is provided with a through hole 2202 having the same shape as that of the cross section of the heat pipe 1 and having a size slightly larger than the outer diameter of the heat pipe 1 . In this embodiment, the inner diameter of the through hole 2202 in the body 220 of the heat dissipation fin 22 is 0.1 to 0.2 mm larger than the outer diameter of the heat pipe 10. Each of the heat dissipation fins 22 is provided with a ring edge 2204 at a periphery of the through hole 22〇2. The ring edge 220 is disposed at an outer periphery of the through hole 2202 and extends integrally outward from the body 220. The ring edge 22〇4 and The flange 222 extends in the same direction. In the present embodiment, the circumference of the rim 2204 is equal along the circumferential direction, and the height of each portion of the rim 2204 is smaller than the width of the hem 222. When the heat-dissipating chip set 20 is assembled, the hem 222 of the heat-dissipating fins 22 on the rear side between each of the two adjacent heat-dissipating fins 22 abuts against the body 220 of the heat-dissipating chip 22 on the front side thereof The buckles 224 of the heat dissipation fins 22 on the rear side are correspondingly received in the slot 226 of the heat dissipation fins 22 of the front side. The buckles 224 and the card slots 226 are coupled to each other. The through holes 2202 of the heat dissipating fins 22 are aligned with each other, and between the two adjacent heat dissipating fins 22, the rim 2204 of the heat dissipating fins 22 on the rear side faces the body 220 of the heat dissipating fins 22 on the front side thereof. The direction extension 201008471 extends the ring edge 2204 to form a columnar collection channel 2208 in the center of the heat dissipation fin group 2〇. As shown in FIG. 3, since the height of the rim 2204 is smaller than the width of the hem 222, a shape is formed between the end of the rim 2204 of the rear heat dissipation fin 22 and the body 220 of the heat dissipation fin 22 on the front side. Tiny gap 2206. The receiving passage 2208 communicates with the air flow passage formed between the adjacent two heat radiating fins 22 through the gap 2206, that is, the gap 22〇6 divides the receiving passage 2208 into a plurality of sections. 0 When assembling the heat pipe 10, firstly apply a layer of solder paste 30 on the inner surface of the receiving passage 2208 or the outer surface of the heat pipe 10, and then pass the heat pipe 10 from one end of the receiving passage 2208 of the heat radiating fin group 20 to the other. One end of the heat pipe 10 is received in the receiving passage 2208. As shown in FIG. 4, since the end of the rim 2204 and the body 220 of the adjacent heat dissipation fin 22 are provided with a gap 2206', when the heat pipe 1 is bored through the accommodating passage 2208 formed by the hole 2202, there is not too much The solder paste 30 is extruded by the heat pipe 1' excess solder paste 30 can remain in the gap 2206, effectively utilizing the solder paste 30, so that the heat pipe 1〇 and the heat sink fin 22 are tightly welded to make the product performance stable. Further, the accommodating passage 2208 is communicated with the outside through the gap 2206, and the rosin in the flux of the solder paste 3 受 is discharged from the gap 2206 by heat transfer, so that the welding surface is sufficiently welded, and the finished product is stable in performance, and the heat transfer efficiency is high. At the same time, the through hole 2202 in the heat dissipating device is disposed at a central position of the heat dissipating fin 22 to reduce the conduction path of the heat conducted through the heat pipe 1 to the heat dissipating fin group 20 on the heat dissipating fin 22, and can be rapidly distributed. Around the heat sink fins 22 . Fig. 5 is a second embodiment of the heat dissipating device of the present invention. The difference from the first embodiment of the present invention is that the heights of the different portions of each of the rims 2204a along the circumferential direction thereof are not equal. In this embodiment, the maximum height of each of the rims 2204a in the circumferential direction thereof is equal to the width ′ of the hem 222 and the minimum height of each of the rims 2204a in the circumferential direction thereof is smaller than the width of the hem 222. therefore,
该散熱鰭月組20組裝後，每相鄰的兩散熱鰭片22之間， 位於後侧的散熱鰭片22的環緣2204a的末端的一部分與其 月9側的散熱鰭片22的本體220相互抵接，而另一部分與該 前側的散熱鰭片22的本體220之間形成一間隙22〇如。 綜f所述，本發明符合發明專利的要件，爰依法提出 專利申μ准以上所述者僅為本發明的較佳實施例，舉凡 熟悉本案技藝的人士，在爰依太 或變化，皆應涵蓋於以下的中請專利作的等效修飾 【圖式簡單說明】 圖1 圖。 為本發明散熱裝置第 一實施例的立體組合 ❹ 意圖 固的例面剖視圖。 圖3為圖2中iv部分去 m ά „ ^ 未设錫膏的放大示意圖。 圓4為圖2"V部分的放 大丁』 圓5為本發明散熱裝置 圖。 。 罝弟一實施例的部分放大示 【主要元件符號說明】 熱管 10 散熱鰭片 22 本體 220 放熱鳍片組20 福膏 軒邊 30 222 201008471 扣鉤 224 卡槽 226 穿孔 2202 環緣 2204 、 2204a 間隙 2206、2206a收容通道 2208After the heat dissipating fin assembly 20 is assembled, a portion of the end of the rim 2204a of the heat dissipating fin 22 on the rear side and the body 220 of the heat dissipating fin 22 on the side of the month 9 are interposed between each of the two adjacent fins 22. Abutting, and another portion forms a gap 22 with the body 220 of the front side heat sink fin 22, for example. In view of the above, the present invention meets the requirements of the invention patent, and the patent application is based on the above. The above is only a preferred embodiment of the present invention. Anyone who is familiar with the skill of the present invention should Equivalent modification of the patents mentioned below [Simplified illustration] Figure 1 Figure. An exemplary cross-sectional view of a three-dimensional assembly of the first embodiment of the heat sink of the present invention is intended to be solid. Figure 3 is an enlarged view of the portion iv of Figure 2 going to m ά „ ^ without solder paste. Circle 4 is the enlarged view of Figure 2 "V portion. Circle 5 is the heat sink device of the present invention. Enlarged display [Main component symbol description] Heat pipe 10 Heat sink fin 22 Body 220 Heat-dissipating fin set 20 Fortune porch side 30 222 201008471 Buckle 224 Card slot 226 Piercing 2202 Ring edge 2204, 2204a Clearance 2206, 2206a Containment channel 2208
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