TW201300719A - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
TW201300719A
TW201300719A TW100121722A TW100121722A TW201300719A TW 201300719 A TW201300719 A TW 201300719A TW 100121722 A TW100121722 A TW 100121722A TW 100121722 A TW100121722 A TW 100121722A TW 201300719 A TW201300719 A TW 201300719A
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Taiwan
Prior art keywords
heat sink
heat
folded edge
flange
fin
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TW100121722A
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Chinese (zh)
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TWI507655B (en
Inventor
Ben-Fan Xia
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Foxconn Tech Co Ltd
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Publication of TW201300719A publication Critical patent/TW201300719A/en
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Publication of TWI507655B publication Critical patent/TWI507655B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a fin assembly, a flat heat pipe soldered on the fin assembly. The heat pipe includes a main body and an end portion smaller than the main body. The fin assembly includes at least a first fin and a second fin. Each of the first fin and the second fin extends a flange from the same side thereof and along a same direction. The flange of the first fin defines a plurality of through holes thereon. The flange of the first fin covers on the flange of the second fin whereby the end portion of the heat pipe is soldered with the flange of the first fin and the flange of the second fins by the through holes of the flange of the first fin.

Description

散熱裝置Heat sink

本發明涉及一種散熱裝置，特別是指一種對電子元件散熱的散熱裝置。The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat from an electronic component.

隨著筆記本電腦追求快速處理器，及裝置輕、薄、小化所衍生高熱量及內部空間問題越來越嚴重，如何有效地利用散熱空間變的越來越重要。習知技術中往往通過熱管的良好的熱傳導性，將電子元件的熱量傳遞至遠離電子元件的散熱片上。As notebook computers pursue fast processors, and the high heat and internal space problems derived from the light, thin, and small devices are becoming more and more serious, how to effectively utilize the heat dissipation space becomes more and more important. In the prior art, the heat of the electronic component is often transferred to the heat sink away from the electronic component by the good thermal conductivity of the heat pipe.

然而，由於製造的需要，熱管頭尾端必須密封，密封處會存在尖角和圓弧，從而使得散熱片的最後一塊散熱片與熱管的尾端焊接面過小而脫落，而造成系統短路，影響使用者安全。如果將熱管尾端超出最後一塊散熱片，避開熱管尖角和圓弧端與熱管焊接，卻會造成熱管超出的部分佔據了一定的系統空間，熱管下部的空間，也會集聚系統熱量，造成局部熱量上升。However, due to the need of manufacturing, the end of the heat pipe must be sealed, and there will be sharp corners and arcs at the seal, so that the last heat sink of the heat sink and the end of the heat pipe are too small to fall off, which causes the system to be short-circuited. User safety. If the end of the heat pipe exceeds the last heat sink, avoiding the hot pipe tip and the arc end and the heat pipe welding, but the part that the heat pipe exceeds occupies a certain system space, and the space under the heat pipe will also accumulate system heat, resulting in Local heat rises.

有鑒於此，實有必要提供一種熱管與散熱片焊接牢固、且能有效利用散熱空間的散熱裝置。In view of this, it is necessary to provide a heat dissipating device in which the heat pipe and the heat sink are firmly welded and the heat dissipating space can be effectively utilized.

一種散熱裝置，包括散熱片組、與所述散熱片組焊接的至少一扁平的熱管，該熱管具有一本體部及一相對本體部收縮的端部，所述散熱片組包括第一散熱片及第二散熱片，該第一散熱片與第二散熱片同側邊緣同向彎折延伸一折邊，所述第一散熱片的折邊上設有複數穿孔並覆蓋在相鄰的第二散熱片的折邊上，以使所述熱管的端部與第一散熱片的折邊焊接同時通過該第一散熱片的折邊的穿孔與第二折邊焊接。A heat dissipating device includes a heat sink group and at least one flat heat pipe welded to the heat sink group, the heat pipe having a body portion and an end portion that is contracted with respect to the body portion, the heat sink group including a first heat sink and a second heat sink, the first heat sink and the same side edge of the second heat sink are bent in the same direction to extend a folded edge, and the folded edge of the first heat sink is provided with a plurality of perforations and covers the adjacent second heat dissipation The hem of the sheet is such that the end of the heat pipe is welded to the hem of the first fin while being welded to the second hem by the perforation of the hem of the first fin.

與習知技術相比，本發明的散熱裝置通過對對應熱管端部的散熱片的設置，保證了散熱片組外側的第一散熱片、第二散熱片不容易脫落，優化散熱裝置的結構。Compared with the prior art, the heat dissipating device of the present invention ensures that the first heat sink and the second heat sink outside the heat sink group are not easily detached by the arrangement of the heat sink corresponding to the end of the heat pipe, and the structure of the heat sink is optimized.

下面將結合附圖對本發明實施例作進一步之詳細說明。The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

如圖1所示，本發明的第一實施方式的散熱裝置100用於對發熱電子元件（圖未示）散熱，該散熱裝置100其包括一散熱片組10及一焊接至散熱片組10上的熱管20。As shown in FIG. 1 , the heat dissipation device 100 of the first embodiment of the present invention is configured to dissipate heat from a heat-generating electronic component (not shown). The heat dissipation device 100 includes a heat sink assembly 10 and a soldering heat sink assembly 10 . Heat pipe 20.

請參閱圖2至圖4，所述熱管20為扁平狀熱管，用於將熱量傳遞至散熱片組10上。該熱管20包括一本體部21及一相對本體部收縮的端部22。該端部22大致呈三角形設置。Referring to FIGS. 2 to 4 , the heat pipe 20 is a flat heat pipe for transferring heat to the heat sink group 10 . The heat pipe 20 includes a body portion 21 and an end portion 22 that is contracted relative to the body portion. The end portion 22 is generally triangular in shape.

所述散熱片組10在本實施例中包括一第一散熱片30、一第二散熱片40及複數第三散熱片50。所述第一散熱片30與第二散熱片40對應與熱管20的端部22焊接。可以理解地，該第一散熱片30與第二散熱片40的組合的數量可以根據熱管20的端部22的長度不同而改變。In the embodiment, the heat sink group 10 includes a first heat sink 30 , a second heat sink 40 , and a plurality of third heat sinks 50 . The first heat sink 30 and the second heat sink 40 are correspondingly welded to the end portion 22 of the heat pipe 20. It can be understood that the number of combinations of the first heat sink 30 and the second heat sink 40 can be changed according to the length of the end portion 22 of the heat pipe 20.

該第一散熱片30、第二散熱片40及第三散熱片50分別由一導熱性能良好的金屬片體衝壓而成。該第一散熱片30呈縱長狀，其相對兩側邊分別同向延伸一折邊31、32。該折邊32呈平面狀，所述折邊31與熱管20的端部22焊接。該折邊31中部具有一低於兩側部分的延伸部33而使折邊31呈凹陷狀設置。該延伸部33的寬度超出折邊31、32的寬度。在本實施例中，所述延伸部33的寬度為所述折邊31的寬度的兩倍。該延伸部33超出折邊31的部分上設有複數穿孔330。The first heat sink 30, the second heat sink 40, and the third heat sink 50 are each stamped from a metal sheet having good thermal conductivity. The first fins 30 are elongated and have opposite sides 31, 32 extending in opposite directions. The flange 32 is planar and the flange 31 is welded to the end 22 of the heat pipe 20. The middle portion of the flange 31 has an extending portion 33 lower than the side portions, so that the flange 31 is disposed in a concave shape. The width of the extension 33 exceeds the width of the flanges 31,32. In the present embodiment, the width of the extending portion 33 is twice the width of the folded edge 31. A plurality of perforations 330 are provided in the portion of the extension portion 33 beyond the flange 31.

所述第二散熱片40的形狀大致對應於第一散熱片30。該第二散熱片40相對兩側邊分別設有一折邊41、42。所述折邊32呈平面狀並對應於第一散熱片30的折邊32。該第二散熱片40的折邊41的中間包括一凹陷部410相對兩側部分凹陷，並且該折邊41的凹陷部410的低於第一散熱片30的延伸部33，以當第一散熱片30與第二散熱片40並排組合時第一散熱片30的延伸部33貼設在第二散熱片40的折邊41的凹陷部410之上。The shape of the second heat sink 40 substantially corresponds to the first heat sink 30. The second fins 40 are respectively provided with a folded edge 41, 42 on opposite sides. The flange 32 is planar and corresponds to the flange 32 of the first fin 30. The middle of the folded edge 41 of the second heat sink 40 includes a recessed portion 410 recessed on opposite sides thereof, and the recessed portion 410 of the folded edge 41 is lower than the extending portion 33 of the first heat sink 30 to be the first heat sink. When the sheet 30 and the second fin 40 are combined side by side, the extending portion 33 of the first fin 30 is attached to the recess 410 of the flange 41 of the second fin 40.

所述第三散熱片50相對兩側邊分別設有一折邊51、52。該第三散熱片50的折邊52呈平面狀並對應於第二散熱片40的折邊42。該第三散熱片的折邊52與第一散熱片的折邊32、第二散熱片40的折邊42共面。該第三散熱片50的折邊51與第一散熱片30的折邊31平齊共面，其中折邊51的中部設有凹陷部510以對應第一散熱片30的延伸部33。在本實施例中，第一、第二、第三散熱片30、40、50的折邊31、32、41、42、51、52自同側邊沿該熱管20的端部22朝向本體部21方向延伸；在其他實施方式中，第一、第二、第三散熱片30、40、50的折邊31、32、41、42、51、52自同側邊沿該熱管20的本體部21朝向端部22方向延伸。The third fins 50 are respectively provided with a folded edge 51, 52 on opposite sides. The folded edge 52 of the third heat sink 50 has a planar shape and corresponds to the folded edge 42 of the second heat sink 40. The folded edge 52 of the third heat sink is coplanar with the flange 32 of the first heat sink and the flange 42 of the second heat sink 40. The folded edge 51 of the third heat sink 50 is flush with the folded edge 31 of the first heat sink 30, wherein the middle portion of the folded edge 51 is provided with a recess 510 to correspond to the extended portion 33 of the first heat sink 30. In this embodiment, the flanges 31, 32, 41, 42, 51, 52 of the first, second, and third fins 30, 40, 50 are from the same side edge toward the body portion of the end portion 22 of the heat pipe 20. 21 direction extension; in other embodiments, the flanges 31, 32, 41, 42, 51, 52 of the first, second, and third heat sinks 30, 40, 50 are from the same side of the body portion of the heat pipe 20 21 extends in the direction of the end 22 .

該散熱裝置100組裝時，將第一、第二、第三散熱片30、40、50並排設置，其中第一散熱片30的延伸部33搭設在第二散熱片40的凹陷部410上，且延伸部33與第三散熱片50的凹陷部510共面。將熱管20設置在第一、第二、第三散熱片30、40、50之上，其中熱管20的端部22對應貼設在第一散熱片30的延伸部33上，熱管20的本體部21對應貼設在第三散熱片50的凹陷部510中。通過錫膏或者其他焊料將熱管20散熱片組10焊接在一起。由於錫膏將處於散熱片組10末端的第一散熱片30、第二散熱片40焊接在一起，並通過面積較大的延伸部33與熱管20的端部22焊接，保證了散熱片組10外側的第一散熱片30、第二散熱片40不容易脫落，優化散熱裝置100的結構。When the heat dissipating device 100 is assembled, the first, second, and third heat sinks 30, 40, 50 are arranged side by side, wherein the extending portion 33 of the first heat sink 30 is disposed on the recess portion 410 of the second heat sink 40, and The extension portion 33 is coplanar with the recessed portion 510 of the third heat sink 50. The heat pipe 20 is disposed on the first, second, and third heat sinks 30, 40, 50, wherein the end portion 22 of the heat pipe 20 is correspondingly disposed on the extending portion 33 of the first heat sink 30, and the body portion of the heat pipe 20 21 corresponds to the recess 510 of the third heat sink 50 . The heat pipe 20 fins 10 are welded together by solder paste or other solder. Since the solder paste solders the first heat sink 30 and the second heat sink 40 at the end of the heat sink group 10 and is welded to the end portion 22 of the heat pipe 20 through the extended portion 33, the heat sink group 10 is ensured. The outer first heat sink 30 and the second heat sink 40 are not easily detached, and the structure of the heat sink 100 is optimized.

請參閱圖5，為本發明的第二實施方式的散熱裝置200。與第一實施方式的散熱裝置100不同，該散熱裝置200用複數相互交錯的第一散熱片30與第二散熱片40取代第三散熱片50；即該散熱裝置200包括複數相互交錯並排的第一散熱片30與第二散熱片40，熱管20焊接在所有第一散熱片30的延伸部33上。Please refer to FIG. 5, which is a heat sink 200 according to a second embodiment of the present invention. Unlike the heat sink 100 of the first embodiment, the heat sink 200 replaces the third heat sink 50 with a plurality of first heat sinks 30 and a second heat sink 40; that is, the heat sink 200 includes a plurality of mutually staggered side by side A heat sink 30 and a second heat sink 40 are welded to the extensions 33 of all the first heat sinks 30.

綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100、200．．．散熱裝置100, 200. . . Heat sink

10．．．散熱片組10. . . Heat sink set

20．．．熱管20. . . Heat pipe

21．．．本體部twenty one. . . Body part

22．．．端部twenty two. . . Ends

30．．．第一散熱片30. . . First heat sink

31、32、41、42、51、52．．．折邊31, 32, 41, 42, 51, 52. . . Folding

33．．．延伸部33. . . Extension

330．．．穿孔330. . . perforation

40．．．第二散熱片40. . . Second heat sink

50．．．第三散熱片50. . . Third heat sink

410、510．．．凹陷部410, 510. . . Depression

圖1係本發明第一實施方式的散熱裝置的組裝圖。Fig. 1 is an assembled view of a heat sink according to a first embodiment of the present invention.

圖2係圖1的散熱裝置的局部分解圖。2 is a partial exploded view of the heat sink of FIG. 1.

圖3係圖2的散熱裝置的另一視角的分解圖。3 is an exploded view of another perspective view of the heat sink of FIG. 2.

圖4係圖1的散熱裝置的第一散熱片與第二散熱片的分解圖。4 is an exploded view of the first heat sink and the second heat sink of the heat sink of FIG. 1.

圖5係本發明圖1的第一實施方式的散熱裝置的分解圖。Figure 5 is an exploded view of the heat sink of the first embodiment of Figure 1 of the present invention.

100．．．散熱裝置100. . . Heat sink

10．．．散熱片組10. . . Heat sink set

20．．．熱管20. . . Heat pipe

21．．．本體部twenty one. . . Body part

22．．．端部twenty two. . . Ends

30．．．第一散熱片30. . . First heat sink

31、32、41、42、51、52．．．折邊31, 32, 41, 42, 51, 52. . . Folding

33．．．延伸部33. . . Extension

330．．．穿孔330. . . perforation

40．．．第二散熱片40. . . Second heat sink

50．．．第三散熱片50. . . Third heat sink

410、510．．．凹陷部410, 510. . . Depression

Claims (10)

一種散熱裝置，包括散熱片組、與所述散熱片組焊接的至少一扁平的熱管，其改進在於：該熱管具有一本體部及一相對本體部收縮的端部，所述散熱片組包括第一散熱片及第二散熱片，該第一散熱片與第二散熱片同側邊緣同向彎折延伸一折邊，所述第一散熱片的折邊上設有複數穿孔並覆蓋在相鄰的第二散熱片的折邊上，以使所述熱管的端部與第一散熱片的折邊焊接同時通過該第一散熱片的折邊的穿孔與第二折邊焊接。A heat dissipating device includes a heat sink group and at least one flat heat pipe welded to the heat sink group, wherein the heat pipe has a body portion and an end portion that is contracted with respect to the body portion, and the heat sink group includes a heat sink and a second heat sink, the first heat sink and the second heat sink are bent in the same direction to extend a fold, and the first heat sink has a plurality of perforations on the folded edge and is covered adjacent to each other The folded edge of the second heat sink is such that the end of the heat pipe is welded to the flange of the first heat sink while being welded by the through hole of the flange of the first heat sink and the second flange. 如申請專利範圍第1項所述之散熱裝置，其中該散熱片組還包括複數第三散熱片，所述第一散熱片的折邊與第三散熱片的折邊平齊。The heat dissipating device of claim 1, wherein the heat sink group further comprises a plurality of third heat sinks, and the folded edge of the first heat sink is flush with the folded edge of the third heat sink. 如申請專利範圍第2項所述之散熱裝置，其中該第一散熱片、第二散熱片、第三散熱片的折邊沿熱管的端部朝向所述本體部方向延伸。The heat dissipating device of claim 2, wherein the folded edge of the first heat sink, the second heat sink, and the third heat sink extend toward the body portion along an end of the heat pipe. 如申請專利範圍第3項所述之散熱裝置，其中該第二散熱片的折邊中部凹陷以對應容置所述第一散熱片的折邊。The heat dissipating device of claim 3, wherein the bottom portion of the second heat sink is recessed to accommodate the folded edge of the first heat sink. 如申請專利範圍第2項所述之散熱裝置，其中該第一散熱片、第二散熱片、第三散熱片的折邊沿熱管的本體部朝向所述端部方向延伸。The heat dissipating device of claim 2, wherein the first heat sink, the second heat sink, and the third heat sink have a folded edge extending along the body portion of the heat pipe toward the end portion. 一種散熱裝置，包括散熱片組、與所述散熱片組焊接的至少一熱管，其改良在於：該熱管具有一本體部及一相對本體部收縮的端部，所述散熱片組包括複數相互間隔第一散熱片及第二散熱片，相鄰的第一散熱片、第二散熱片同側邊緣同向彎折延伸一折邊，所述第一散熱片的折邊上設有複數穿孔並覆蓋在相鄰的第二散熱片的折邊上，以使所述熱管的端部與第一散熱片的折邊焊接同時通過該第一散熱片的折邊的穿孔與第二折邊焊接。A heat dissipating device includes a heat sink group and at least one heat pipe welded to the heat sink group, wherein the heat pipe has a body portion and an end portion that is contracted with respect to the body portion, and the heat sink group includes a plurality of mutually spaced portions The first heat sink and the second heat sink, the adjacent first heat sink and the second heat sink are bent in the same direction to extend a folded edge, and the first heat sink has a plurality of perforations on the folded edge and covered On the folded edge of the adjacent second heat sink, the end of the heat pipe is welded to the flange of the first heat sink while being welded by the through hole of the flange of the first heat sink and the second flange. 如申請專利範圍第6項所述之散熱裝置，其中該第一散熱片、第二散熱片的另外一側邊延伸另一折邊，該第一散熱片、第二散熱片的另一折邊相互共面。The heat dissipating device of claim 6, wherein the other side of the first heat sink and the second heat sink extend another folded edge, and the other heat sink and the other heat sink of the second heat sink Co-existing with each other. 如申請專利範圍第6項所述之散熱裝置，其中該第二散熱片的折邊中部凹陷以對應容置所述第一散熱片的折邊。The heat dissipating device of claim 6, wherein the folded portion of the second fin is recessed to receive the folded edge of the first fin. 如申請專利範圍第6項所述之散熱裝置，其中該第一散熱片、第二散熱片的折邊沿熱管的端部朝向所述本體部方向延伸。The heat dissipating device of claim 6, wherein the folded edge of the first heat sink and the second heat sink extends along an end of the heat pipe toward the body portion. 如申請專利範圍第6項所述之散熱裝置，其中該第一散熱片、第二散熱片的折邊沿熱管的所述本體部朝向端部方向延伸。The heat dissipating device of claim 6, wherein the flange of the first fin and the second fin extends along the body portion of the heat pipe toward the end.
TW100121722A 2011-06-17 2011-06-22 Heat dissipation device TWI507655B (en)

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