201007077 v-«i i.8841twf.doc/n. 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種發光二極體照明裝置 (light-emitting diode illumination apparatus) ’ 且特別是有關 於一種具有良好的散熱效能之發光二極體照明裝置。 【先前技術】The present invention relates to a light-emitting diode illumination apparatus and particularly A light-emitting diode lighting device with good heat dissipation performance. [Prior Art]
發光二極體（light-emitting diode，LED)屬於半導體 凡件，其發光晶片之材料主要使用m_v族化學元素，如： 磷化鎵(GaP)、砷化鎵(GaAs)等化合物半導體，其發光原理 係將電能轉換為光，也就是對化合物半導體施加電流，透 過迅子與電洞的結合，將過剩的能量以光的形式釋出，而 達成發光的效杲。由於發光二極體的發光現象不是藉由加 熱發光或放電發光’目此發光二極體的壽命長達十萬小時 以上，且無須暖燈時間（idling time )。此外，發光二極體 更具有反應速度快（約為，秒）、體積小、用電省、污 染低、高可靠度、適合量產等優點，所以發光 # =的領域十分廣泛如大型看板、交職辦、手機、斤ς 田器、傳真機之光源以及照明裝置等。 近來，砂發光二鋪的發光亮度·光效率持續地 =同時⑥亮度的白光發光二極體也被成功地量產，所 ^漸有白光發光二極體被使用於照明裝置中，如室 及戶外的路燈照明等。-般而言，高功率的發 “白面臨了散熱方面的問題，若發光二極體在過高 201007077 oru ίΖΛ} ^〇〇^itwf.d〇c/n 的溫度情況下操作，將有可能導致發光二極體照明裝置所 能提供的光線亮度衰減，对壽命下降等問題。因此 光-極體=明裝置的散熱設計已成為研發人員關注的議題 之:。在習知的發光二極體照明裝置中，光源與電源的散 熱汉5十t使光源與電源在幾乎相同的溫度下操作，然而， 光源的最佳操作溫度以及電源的最佳操作溫度是不相同 的’因此習知的散熱設計無法兼顧光源與電源的操作溫 又使者S無法在表適條件下操作，進而影響到發本一 極體照明裝置的使用壽命。 【發明内容】 本發明提供-種發光二極體照明裝置，其具有良好 政熱效症與車父長的使用壽命。 本發明提出-種發光二極體照明裝置，其包括一殼 體、-發光二極體辆以及—電源供應單元。殼體具 光源容納空間、-電源容納空間以及—與外界連通之第一 熱阻隔通道’其巾第—熱阻隔通道位於光源容納空間與電 源容納空間之間。發光二極體光源配置於光源容納空間 内’而電源供應單it配置於電源容敏間内。 在本發明之一實施例中，上述之殼體包括一燈泡外殼。 在本發明之一實施例中，上述之燈泡外殼包括—上殼 體三一電極部、—下殼體以及—透光部。上殼體定義出電 源谷納空間以容納電源供應單元。電極部與上殼體的一端 ，接’其巾電極部與㈣供鱗元電性連接。下殼體的一 端與上殼體的另一端連接，其中下殼體定義出第一熱阻隔 201007077 8411wf.doc/ii 通道。透光部與下殼體的另一端連接，其中下殼體與透光 部共同定義出光源容納空間以容納發光二極體光源。 鰭片。 在本發明之一實施例中 部或一透明透光部。 在本發明之一實施例中 在本發明之一實施例中 罩、一下燈罩以及一透光部 在本發明之一實施例中’上述之上殼體為一絕緣殼體。 在本發明之一實施例中，上述之下殼體為一導熱殼體。 在本發明之一實施例中’上述之下殼體具有多個散熱 上述之透光部為一霧面透光 上述之殼體為一路燈外殼。 上述之路燈外殼包括一上燈 上燈罩定義出電源容納空間 o 以备納％源供應單元，其巾上燈罩具有多個氣體對流孔 =燈罩的端與上燈罩的另一端連接，其中第一熱阻隔通 t於上燈罩與下料之間，域雜流孔與第一熱阻隔 相連通。透光部與下殼體的另一端連接，其中下燈罩 ς透光邛共同疋義出光源容納空間以容納發光二極體光 源、0 把明之—實施例中，上述之路燈外殼更包括一邊 八二板與上燈罩連接，且遮板位於電源供應單元的 上万0 熱阻=明ΐ:實施例中，上述之路燈外殼具有-第二 弟—熱阻隔通道位於遮板與上燈罩之間。 一路+ 實施例中，上述之發光二極體光源包招 配置於带路板：固：光二極體晶片。多個發光二極體晶片 置於'路板上’並與電路板電性連接。 201007077 oru/zu ^oo^itwf.doc/n 更包括-連接線，其通過第二體照明裝置 源供應單元與發光二極體光源。、W l錢性連接電 在本發明之-實施例中，上述之第一孰阻 :隔熱材質，使得電源供應單元與發光二極 糸統不互相干擾。 九源的政熱 由於本發明之發光二極體照明褒置利用 ，阻隔通道增進散熱效能，因此發光二極體昭 極體光源以及電源供應U分财』 為讓本發明之上述特徵和優點能更明顯易懂 舉貫施例，並配合所附圖式，作詳細說明如下。 心 【實施方式】 第一實施例 圖1A為本發明第一實施例之發光二極體照明裝置 立體示意圖。圖1B為圖1A之發光二極體照明裝置的刊面 不意圖。請同時參照圖1A與1B，本實施例之發光二 照明裝置100包括一殼體110、一發光二極體光源12〇以 及-電源供應單元13G。殼體11G具有—光源容納空間 112、一電源容納空間114以及一與外界連通之熱阻隔通道 116’其中第一熱阻隔通道116位於光源容納空間112與電 源容納空間114之間。發光二極體光源12〇與電源供應單 元130分別配置於光源容納空間112内以及電源容納空間 -S841twf.doc/n 201007077 114 内。 / 上述之殼體n〇、發光二極體光源120以及電源供應 單元130的型態可以有多種變化，而圖1八與1B所繪示^ • 的結構設堇是用以舉例說明，以讓此領域具有通常知識 ^能夠據以實施本發明，然其並非用以限定本發明所欲^ 蓋之範_。 ' 由圖1A與1B可知，本實施例之發光二極體照明裝置 ❹ 1〇〇為一發光二極體燈泡(LED light bulb)，而此發光二極 體=泡例如是E27 I泡、E26燈泡、E14燈泡或其他規格 之燈泡。詳言之，本實施例之殼體110包括一燈泡外殼 14〇，其包括一上殼體142、一電極部144、一下殼體146 以透光部148。上殼體142定義出電源容納空間114 #、内電源供應單元。電極部144與上殼體142的一 接，其中電極部144與電源供應單元13〇電性連接。 體:^6的一端與上殼體142的另一端連接，其中下殼 粵 146、疋義出第一熱阻隔通道116。透光部148與下殼體 義出的另—端連接，其中下殼體146與透光部148共同定 透源容納空間112以容納發光二極體光源Ho/另外， 出之=I48為一霧面透光部，使發光二極體光源120所發 實扩先線可以穿過霧面透光材質產生照明之功效。在其他 發2例中，透光部148也可以是一透明的透光部。同樣地， ΐ而先源12G所發出之光線可以穿過透明的透光材 如是ρΐ照明之功效。承上述，本實施例之電極部144例 一燈頭、Ε26燈頭、Ε14燈頭或其他規格之燈頭。 〜〜 叙而言’為了確保使用者在使用上的安全性，通常 201007077 V-ΙΛ. / t twf.doc/n 會採用絕緣材質（如塑膠）來製作上殼體142，以避免觸 電的情況發生。在本發明的一較佳實施例中，上殼體142 之材質例如是摻雜有氧化鋅之絕緣材質。由於摻雜有氧化 辞之絕緣材質具有遮蔽電磁波干擾(Electr〇_MagneticA light-emitting diode (LED) belongs to a semiconductor device. The material of the light-emitting chip mainly uses m_v group chemical elements, such as: compound semiconductors such as gallium phosphide (GaP) and gallium arsenide (GaAs). The principle is to convert electric energy into light, that is, to apply current to the compound semiconductor, and through the combination of the spin and the hole, the excess energy is released in the form of light, and the effect of illuminating is achieved. Since the illuminating phenomenon of the light-emitting diode is not by heating or discharging, the life of the light-emitting diode is as long as 100,000 hours or more, and the idling time is not required. In addition, the light-emitting diode has the advantages of fast reaction speed (about, second), small volume, low power consumption, low pollution, high reliability, and suitable for mass production, so the field of illuminating # = is very broad, such as large billboards. Handover office, mobile phone, battery, light source and lighting device. Recently, the illuminating brightness and light efficiency of the sand illuminating two shop are continuously = simultaneously, the white light emitting diode of 6 brightness is also successfully mass-produced, and the white light emitting diode is gradually used in the lighting device, such as the room and Outdoor street lighting, etc. In general, the high-powered hair "white faces the problem of heat dissipation. If the LED is operated at a temperature of too high 201007077 oru ίΖΛ} ^〇〇wit.d〇c/n, it is possible The result is that the brightness of the light provided by the light-emitting diode illumination device is attenuated, and the life is reduced. Therefore, the heat dissipation design of the light-polar body=ming device has become a topic of concern for researchers: in the conventional light-emitting diode In the illuminating device, the heat dissipation of the light source and the power source makes the light source and the power source operate at almost the same temperature. However, the optimal operating temperature of the light source and the optimal operating temperature of the power source are different, so the conventional heat dissipation is performed. The design cannot balance the operating temperature of the light source and the power source, and the operator S cannot operate under the appropriate conditions, thereby affecting the service life of the emitter-type lighting device. [Invention] The present invention provides a light-emitting diode lighting device. The utility model has the advantages of good thermal efficiency and the service life of the car owner. The invention provides a light-emitting diode lighting device, which comprises a casing, a light-emitting diode vehicle and a power supply unit. The housing has a light source accommodating space, a power source accommodating space, and a first heat blocking channel that communicates with the outside. The towel-thermal blocking channel is located between the light source accommodating space and the power source accommodating space. The light emitting diode light source is disposed at the light source accommodating space. In an embodiment of the invention, the housing comprises a bulb housing. In one embodiment of the invention, the bulb housing comprises - The housing has a three-in-one electrode portion, a lower housing, and a light-transmitting portion. The upper housing defines a power supply valley space for accommodating the power supply unit. The electrode portion and one end of the upper housing are connected to the "the electrode portion of the towel and (4) The scale is electrically connected. One end of the lower case is connected to the other end of the upper case, wherein the lower case defines a first thermal barrier 201007077 8411wf.doc/ii channel. The light transmitting portion is connected to the other end of the lower case, The lower casing and the light transmitting portion together define a light source accommodating space for accommodating the light emitting diode light source. The fin is a central portion or a transparent light transmitting portion in one embodiment of the present invention. In an embodiment of the invention, the cover, the lower lamp cover and the light transmitting portion are in the embodiment of the invention, wherein the upper housing is an insulating housing. In an embodiment of the invention, the lower housing In one embodiment of the present invention, the housing has a plurality of heat dissipation portions, and the light transmissive portion is a matte surface. The housing is a street lamp housing. The street lamp housing includes A lamp upper cover defines a power supply space o to prepare a % source supply unit, and the towel cover has a plurality of gas convection holes = the end of the lamp cover is connected to the other end of the upper lamp cover, wherein the first thermal barrier is connected to Between the lamp cover and the blanking, the domain spoiler is in communication with the first thermal barrier. The light transmitting portion is connected to the other end of the lower casing, wherein the lower lampshade is transparent to the light source receiving space to accommodate the light emitting diode In the embodiment, the street lamp housing further includes an eight-two board connected to the upper lamp cover, and the shutter is located at a power supply unit of tens of thousands of thermal resistance = alum: in the embodiment, the street lamp described above The shell has - the second brother - The thermal barrier channel is located between the shutter and the upper shade. In one way, in the embodiment, the above-mentioned light-emitting diode light source package is disposed on the circuit board: solid: photodiode wafer. A plurality of light emitting diode chips are placed on the 'road board' and electrically connected to the circuit board. 201007077 oru/zu ^oo^itwf.doc/n further includes a connection line that passes through the second body illumination device source supply unit and the light emitting diode source. In the embodiment of the present invention, the first resistance is an insulating material, so that the power supply unit and the light-emitting diode do not interfere with each other. Because of the use of the light-emitting diode lighting device of the present invention, the barrier channel enhances the heat dissipation performance, so that the light-emitting diode body light source and the power supply U-divided can make the above features and advantages of the present invention A more obvious and easy-to-understand example, and in conjunction with the drawings, is described in detail below. [Embodiment] First Embodiment Fig. 1A is a perspective view showing a light-emitting diode lighting device according to a first embodiment of the present invention. Fig. 1B is a perspective view of the illumination LED lighting device of Fig. 1A. Referring to FIGS. 1A and 1B, the illuminating device illuminating device 100 of the present embodiment includes a housing 110, a light emitting diode light source 12A, and a power supply unit 13G. The housing 11G has a light source accommodating space 112, a power receiving space 114, and a heat blocking passage 116' communicating with the outside, wherein the first heat blocking passage 116 is located between the light source accommodating space 112 and the power receiving space 114. The light-emitting diode light source 12A and the power supply unit 130 are disposed in the light source housing space 112 and the power source housing space -S841twf.doc/n 201007077 114, respectively. / The above-mentioned housing n〇, the light emitting diode light source 120, and the power supply unit 130 may have various types of changes, and the structural design of the first and the first embodiment is illustrated by way of example. This field has the general knowledge that the invention can be practiced, but it is not intended to limit the scope of the invention. As can be seen from FIGS. 1A and 1B, the illuminating diode illuminating device of the present embodiment is an LED light bulb, and the illuminating diode = for example, E27 I bubble, E26 Light bulb, E14 bulb or other size bulb. In detail, the housing 110 of the present embodiment includes a bulb housing 14A including an upper housing 142, an electrode portion 144, and a lower housing 146 for the light transmitting portion 148. The upper housing 142 defines a power supply accommodation space 114 # and an internal power supply unit. The electrode portion 144 is in contact with the upper casing 142, wherein the electrode portion 144 is electrically connected to the power supply unit 13. One end of the body: ^6 is connected to the other end of the upper casing 142, wherein the lower casing is 146, and the first thermal barrier passage 116 is defined. The light transmitting portion 148 is connected to the other end of the lower casing, wherein the lower casing 146 and the light transmitting portion 148 are fixed to the source receiving space 112 to accommodate the light emitting diode light source Ho/in addition, the output = I48 is one. The matte light transmitting portion enables the solid front line of the light emitting diode light source 120 to pass through the matte light transmitting material to produce illumination effect. In the other two cases, the light transmitting portion 148 may be a transparent light transmitting portion. Similarly, the light emitted by the first source 12G can pass through the transparent transparent material such as the effect of ΐ illumination. In the above, the electrode portion 144 of the present embodiment is a lamp cap, a Ε26 lamp cap, a Ε14 lamp cap or a lamp cap of other specifications. ~~ 〗 〖In order to ensure the safety of users in use, usually 201007077 V-ΙΛ. / t twf.doc/n will use insulating materials (such as plastic) to make the upper casing 142 to avoid electric shock occur. In a preferred embodiment of the present invention, the material of the upper casing 142 is, for example, an insulating material doped with zinc oxide. Insulating material doped with oxidized words has shielding electromagnetic interference (Electr〇_Magnetic
Interference shielding，EMI shielding)的功能，因此具有氧化 辞成分的上殼體142可以有效遮蔽從發光二極體照明裝置 100所產生的電磁波，以降低電磁波對於使用者的傷害。 此外，上殼體142可以採用射出成型技術進行製作，而摻 雜有氧化鋅之絕緣材質在所製作出的上殼體142在脫膜之 _ 後較不易產生嚴重的形變(deformati〇n)，故上殼體m2的 製造良率可以獲得提升，同時提升上殼體142之散熱效 果。此外，在本實施例中，是以一件式的上殼體142為例 示’在其他實施例中，上殼體142也可以是二件式的型態。 由圖1A與1B可知’下殼體146具有多個散熱鰭片 147’而第一熱阻隔通道116的兩端例如是位於二相鄰之散 熱縛片147之間，沿著圖1B中之氣體對流路徑p流入第 -熱阻隔通道116内的空氣有助於發光二極體照明裝置 ❹ 1〇〇的散熱。存在於光源容納空間112與電源容納空間ιΐ4 之間的第-熱阻隔通道116除了可增加與外界之執交換面 積以幫助照明裝置100散熱之外，更可以避免電源供應單 7L 130以及發光一極體光源12〇所發出的熱能透過埶傳導 的方式相互影響’進而達到阻隔熱能之功效。此外，當· 源供應單元13G與發光二極體光源12Q電性連接時，^ 接線通過第-熱阻隔通道116的部份可施以防水處理’，、以 8 s»41twf.doc/a 201007077 避^發生漏電的情形。在本實施例中，下殼體146可以採 用單:材質或是多種材質進行製作。一般而言，下殼體146 的材貝包括銅、銘、金屬合金或其他例如是陶瓷等導熱特 性良好的材質。另外，上殼體142及下殼體146亦可塗佈 散熱漆，以提升殼體的散熱效果。 由圖1B可知，發光二極體光源12〇例如是一個已經 過封裝之發光二極體封裝體，而此封裝體例如是晶粒-電路 ❹ 板接合封裝體(ChlP 0n Board type package)或是其他型態 之封裝體。詳言之’發光二極體光源12〇包括一電路板d 以及多個發光二極體晶片124。其中，發光二極體晶片 配置於電路板122上並與電路板122電性連接，以形成一 發光二極體陣列（array)，而電路板122例如是具有單層 線路或是多層線路且導熱良好的電路板。此外，為使電^ 板122具有良好的導熱特性，其可採用例如是銅、鋁及陶 瓷等材質的電路基板。在其他實施例中，發光二極體照明 _ 裝置100亦可使用單一發光二極體模組作為發光二極體光 源120。在本實施例中，發光二極體光源12〇可藉由烊錫 (solder material)焊接於下殼體146上，以使得發光二核體 光源120所產生的熱能夠有效地傳遞至下殼體Mg上。术 然，本實施例亦可採用導熱膠(thermal paste)或其他類型: 導熱材料配合螺絲鎖固的方式來進行發光二極體光源12〇 與下殼體146之間的接合。 第二實施例 201007077 …itwf.doc/n 圖2為本發明第二實施例之發光二極體照明裝置的剖 面示意圖。請參照圖2，本實施例之發光二極體照明裝置 100b與第一實施例類似，其包括一殼體11〇、一發光二極 體光源120以及一電源供應單元130。在本實施例中，殼 體110為一路燈外殼140b，而此路燈外殼140b包括一上 燈罩142b、一下燈罩146b以及一透光部148b。 詳言之’上燈罩142b定義出電源容納空間114以容 納電源供應單元130’其中上燈罩142b具有多個氣體對流 孔149b。下燈罩146b的一端與上燈罩142b的另一端連 接’其中第一熱阻隔通道116位於上燈罩i42b與下燈罩 146b之間，且氣體對流孔149b與第一熱阻隔通道116相 連通。透光部148b與下燈罩146b的另一端連接，其中下 燈罩146b與透光部i48b共同定義出光源容納空間H2以 容納發光二極體光源12〇。 值得注意的是，由於上燈罩142b具有第一熱阻隔通 道116以及多個氣體對流孔14%，因此外界的氣體適於從 第/熱阻隔通道116的兩端流入上燈罩142b與下燈罩 146b之間，並經由多個氣體對流孔14%離開發光二極體 照明裝置100b，即氣體對流路徑p，。本實施例可有效地將 發光二極體光源120以及電源供應單元13〇所發出的熱量 帶走，有助於發光二極體照明裝置1〇〇b的散熱。另外，下 燈罩146b於第一熱阻隔通道116的表面118也可以製作為 具有弧度的曲面’以增加下燈罩146b於戶外使用時的排水 能力。 由圖2可知，發光二極體光源120包括一電路板122 -〇S4itWfdoc/n 201007077 以及多個發光二極體晶片124。其中，發光 配置於電路板m上麵祕板m電_體=124 車列(，)。電路板122例 122 Ϊί^ΐί熱良好的電路板。此外，為使電路板 22，、有良好的導熱特性，其可採用例如是銅、銘及 荨材質的電路基板。當然，照日錄置刚b亦可以使一 發光二極體模組作為發光二極體光源12〇。 ，外’本實關之發光二極體_裝置祕可設計 為由夕個彼此獨立的部件所組合而成。因此，合.二 裝置驅的部份元件損毁時，例如電:絲：元 30因過熱而無法正常運作，使用者僅須將損毀的部份元 仃置換即可’不f要將整個酬裝置汰換，以節省维 護成本。 ' 第三實施例 一圖3為本發明第三實施例之發光二極體照明裝置的剖 面不忍圖。睛參照圖3，本實施例之發考二極體照明裝置 100c與第二實簡之發光二極體照置嶋類似，惟 一者主要差異之處在於.本實施例之路燈外殼14此進一步 包括一配置於電源供應單元13〇上方之遮板s，其中遮& S與上燈罩142b連接，並形成一第二熱阻隔通道116，於遮 板S與上燈罩142b之間。 當發光二極體照明裝置l00c應用於室外時，遮板s 可遮蔽烈日艷陽的強光照射，以避免電源供應單元13〇直 接曝曬於陽—光之下，造成電源供應單元丨3〇過熱而損毀。 11 201007077 ----------.twf doc/n 1 外^熱二馬通道n6,之功能類似於第—熱阻隔通道 6，，、可絮助電源供應單元13〇散熱及隔熱。— 的材f包括銅、銘、金屬合金或其他導熱特性^好 承上述，本發明之發光二極體照明裝置内的各個元件 尚可採用其他種排列方式，本發明上述實施例 定各個元件的排列方式。 卜用乂限 综上所述，本發明之發光二極體照明裝置具有熱阻隔 通道，可幫助照明裝置散熱。在本發明之部分實施例'中二 由於發光二極體照明裝置具有氣體對流孔以及熱阻隔通 道，故可有效地將照明裝置的操作溫度維持在可容忍的範 圍内。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何所屬技術領域中具有通常知識者，在不脫離 本發明之精神和範圍内，當可作些許之更動與潤飾，因此 本發明之保護範圍當視後附之申請專利範圍 定者為 準0 【圖式簡單說明】 圖1Α為本發明第一實施例之發光二極體昭明裝置的 立體示意圖。 …、 圖1Β為圖1Α之發光二極體照明裝置的剖面示意圖。 一圖2為本發明第二實施例之發光二極體照明裝置的剖 面示意圖。 、 一圖3為本發明第三實施例之發光二極體照明裝置的剖 面示意圖。 、 12 201007077 Mltwf.doc/n 【主要元件符號說明】 100、100b、100c :發光二極體照明裝置 110 :殼體 112 :光源容納空間 114 :電源容納空間 116 :第一熱阻隔通道 116’ ：第二熱阻隔通道 118 :表面The function of the interference shielding (EMI shielding), therefore, the upper housing 142 having an oxidizing component can effectively shield the electromagnetic waves generated from the LED illumination device 100 to reduce the electromagnetic wave damage to the user. In addition, the upper casing 142 can be fabricated by injection molding technology, and the insulating material doped with zinc oxide is less likely to be severely deformed after the formed upper casing 142 is released. Therefore, the manufacturing yield of the upper casing m2 can be improved while the heat dissipation effect of the upper casing 142 is improved. Further, in the present embodiment, the one-piece upper casing 142 is exemplified. In other embodiments, the upper casing 142 may also be of a two-piece type. 1A and 1B, the lower housing 146 has a plurality of heat dissipation fins 147', and both ends of the first thermal barrier passage 116 are located between two adjacent heat dissipation tabs 147, along the gas in FIG. 1B. The air flowing into the first heat blocking passage 116 by the convection path p contributes to the heat dissipation of the light-emitting diode lighting device. The first heat blocking channel 116 existing between the light source accommodating space 112 and the power receiving space ι 4 can increase the exchange area with the outside to help the illuminating device 100 to dissipate heat, and can avoid the power supply unit 7L 130 and the light emitting pole. The heat energy emitted by the body light source 12 相互 interacts with each other through the way of conduction, thereby achieving the effect of blocking heat insulation. In addition, when the source supply unit 13G is electrically connected to the light-emitting diode light source 12Q, the portion of the wiring through the first-thermal blocking channel 116 can be subjected to a water-repellent treatment, to 8 s»41 twf.doc/a 201007077 Avoid the occurrence of leakage. In the present embodiment, the lower casing 146 can be made of a single material or a plurality of materials. In general, the material of the lower casing 146 includes copper, metal, metal alloy or other materials having good thermal conductivity such as ceramics. In addition, the upper casing 142 and the lower casing 146 may also be coated with a heat-dissipating paint to enhance the heat dissipation effect of the casing. As can be seen from FIG. 1B, the LED light source 12 is, for example, a packaged LED package, and the package is, for example, a chip-circuit board package (ChlP 0n Board type package) or Other types of packages. In detail, the 'light emitting diode light source 12' includes a circuit board d and a plurality of light emitting diode chips 124. The light emitting diode chip is disposed on the circuit board 122 and electrically connected to the circuit board 122 to form an array of light emitting diodes, and the circuit board 122 has a single layer line or a multilayer line, for example, and conducts heat. Good circuit board. Further, in order to make the electric board 122 have good heat conduction characteristics, a circuit board made of a material such as copper, aluminum or ceramic can be used. In other embodiments, the LED illumination device 100 can also use a single LED module as the LED source 120. In this embodiment, the light emitting diode light source 12 can be soldered to the lower case 146 by a solder material, so that the heat generated by the light emitting dinuclear light source 120 can be efficiently transmitted to the lower case. On the Mg. Of course, in this embodiment, a thermal paste or other type of thermal conductive material can be used to engage the light-emitting diode light source 12 〇 and the lower casing 146 in a screw-locking manner. Second Embodiment 201007077 ...itwf.doc/n Figure 2 is a cross-sectional view showing a light-emitting diode lighting device according to a second embodiment of the present invention. Referring to FIG. 2, the LED lighting device 100b of the present embodiment is similar to the first embodiment, and includes a housing 11A, a light emitting diode light source 120, and a power supply unit 130. In the present embodiment, the housing 110 is a street lamp housing 140b, and the street lamp housing 140b includes an upper lamp cover 142b, a lower lamp cover 146b, and a light transmitting portion 148b. In detail, the upper lamp cover 142b defines a power supply accommodating space 114 for accommodating the power supply unit 130', wherein the upper lamp cover 142b has a plurality of gas convection holes 149b. One end of the lower lamp cover 146b is coupled to the other end of the upper lamp cover 142b' wherein the first thermal barrier channel 116 is located between the upper lamp cover i42b and the lower lamp cover 146b, and the gas convection hole 149b is in communication with the first thermal barrier channel 116. The light transmitting portion 148b is connected to the other end of the lower lamp cover 146b, wherein the lower lamp cover 146b and the light transmitting portion i48b together define a light source accommodating space H2 to accommodate the light emitting diode light source 12A. It should be noted that since the upper lamp cover 142b has the first thermal blocking channel 116 and the plurality of gas convection holes 14%, the external gas is adapted to flow from the both ends of the first/thermal blocking channel 116 into the upper lamp cover 142b and the lower lamp cover 146b. And exiting the light-emitting diode illumination device 100b, that is, the gas convection path p, via a plurality of gas convection holes 14%. In this embodiment, the heat emitted by the light-emitting diode light source 120 and the power supply unit 13〇 can be effectively carried away, which contributes to heat dissipation of the light-emitting diode lighting device 1〇〇b. In addition, the lower cover 146b can also be formed as a curved curved surface on the surface 118 of the first thermal barrier channel 116 to increase the drainage capacity of the lower cover 146b when used outdoors. As can be seen from FIG. 2, the light emitting diode light source 120 includes a circuit board 122 - 〇 S4itWfdoc / n 201007077 and a plurality of light emitting diode chips 124. Among them, the light is arranged on the circuit board m above the secret board m electric_body=124 train (,). 122 board examples 122 Ϊί^ΐί Thermally good board. Further, in order to provide the circuit board 22 with good heat conduction characteristics, it is possible to use a circuit board made of, for example, copper, indium or tantalum. Of course, it is also possible to use a light-emitting diode module as the light-emitting diode light source 12〇. The external light-emitting diodes can be designed to be composed of separate components from each other. Therefore, when some components of the combined device are damaged, for example, the electricity: wire: 30 is unable to operate normally due to overheating, and the user only needs to replace the damaged part of the elementary device. Replacement to save maintenance costs. Third Embodiment Fig. 3 is a cross-sectional view of a light-emitting diode lighting device according to a third embodiment of the present invention. Referring to FIG. 3, the test diode illuminating device 100c of the present embodiment is similar to the second illuminating diode illuminating device. The only difference is that the street lamp housing 14 of the present embodiment further includes A shutter s disposed above the power supply unit 13A, wherein the cover & S is coupled to the upper cover 142b and forms a second thermal barrier 116 between the shutter S and the upper cover 142b. When the light-emitting diode lighting device 100c is applied to the outdoor, the shutter s can shield the strong light of the sun, so as to prevent the power supply unit 13 from directly exposing under the sunlight, causing the power supply unit to be overheated. Damaged. 11 201007077 ----------.twf doc/n 1 External ^ hot two-horse channel n6, the function is similar to the first - thermal barrier channel 6,, can help the power supply unit 13 heat dissipation and separation heat. — The material f includes copper, metal, metal alloy or other thermal conductive properties. In view of the above, the various components in the light-emitting diode lighting device of the present invention may adopt other arrangements, and the above embodiments of the present invention define various components. Arrangement. In summary, the light-emitting diode lighting device of the present invention has a thermal barrier channel to help the lighting device to dissipate heat. In some embodiments of the present invention, since the light-emitting diode lighting device has a gas convection hole and a heat blocking passage, the operating temperature of the lighting device can be effectively maintained within a tolerable range. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the present invention is defined by the scope of the appended claims. [FIG. 1A] FIG. 1 is a perspective view of a light-emitting diode display device according to a first embodiment of the present invention. ..., Fig. 1 is a schematic cross-sectional view of the light-emitting diode lighting device of Fig. 1. Figure 2 is a cross-sectional view showing a light-emitting diode lighting device in accordance with a second embodiment of the present invention. 3 is a schematic cross-sectional view showing a light-emitting diode lighting device according to a third embodiment of the present invention. 12 201007077 Mltwf.doc/n [Description of main component symbols] 100, 100b, 100c: LED illumination device 110: housing 112: light source accommodation space 114: power supply accommodation space 116: first thermal barrier channel 116': Second thermal barrier channel 118: surface
120 :發光二極體光源 122 :電路板 124 :發光二極體晶片 130 :電源供應單元 140 :燈泡外殼 142 :上殼體 144 :電極部 146 :下殼體 147 :散熱鰭片120: Light-emitting diode light source 122: Circuit board 124: Light-emitting diode wafer 130: Power supply unit 140: Light bulb housing 142: Upper housing 144: Electrode portion 146: Lower housing 147: Heat-dissipating fin
148、148b :透光部 149b :氣體對流孔 140b :路燈外殼 142b :上燈罩 146b :下燈罩 S :遮板 P、P’ ：氣體對流路徑 13148, 148b: light transmitting portion 149b: gas convection hole 140b: street lamp housing 142b: upper lamp cover 146b: lower lamp cover S: shutter P, P': gas convection path 13