201003829 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種晶片般t # & . 曰片盤承載座，尤指一種對應晶圓 承載框架而可直接置於其上的晶片盤承載座。 【先前技術】 半導體製程係於晶圓萝作&忐 & 圆表作凡成之後，將晶圓設置一鐵 框上該鐵框具有—鐘空部可舖設_層膠帶以供晶圓黏附 於該層膠帶上，再將鐵框運送至晶圓切割機上對晶圓進行 切割作業’將晶圓切割成葙砮的曰y j取複歎的晶片’切割完成後，再進 行黏晶製程。 如弟九圖及第十圖所示，將鐵框（8 〇 )設置於一晶 圓承載框帛（5 〇 )以進行黏晶作業，晶圓承載框架（5 0 )係。X方'基台（6 〇 )上，以供黏晶設備取用鐵框（8 0 )上的晶片。 π參考第十一圖所示，係既有—可同樣應用於前述基 口（ 6 0 )的晶片盤承載座（7 〇 )，該晶片盤承載座（7 0 )係規J有複數可供晶片盤對應放置的區域，每個區域 係由複數設於該晶片盤承載座（7 〇 )表面之定位條（7 1 )斤sj刀出來，晶片盤可供放置複數個經過切割後的晶 片’該晶片盤承載座（7 〇 )係與前述晶圓承載框架（5 〇)適用同—基台（60) ’當晶片盤承載座（70)對 應。又置於刖述基台（6 〇 )，即可進行黏晶或其他封裝程 序0 4 201003829 由於前述晶片盤承載座（7〇) 〇 )均共用同一基△ 、日日圓承栽框架（5 使用完畢後欲改對日^ w κ栽框架（5 〇 ) 了日日片盤承載座（7 Q ) 先將晶圓承載框架（^ η ) ό Α 」進行作業，必須 ^50)自基台（6〇) 晶片盤承载座（7 〇 > υ )拆卸下，再將 w υ )鎖固於基台（6 0 ) ^ 即如第十二圖所示 ，鎖©完成後 ;J理’ §必須再改用g 0 )時，亦必須谁t j 日日口承載框架（5 刀乂肩進仃拆裝的動作，此替 的動作將造成制 、戰具而重複拆裝 成^上的不方便而浪費時間成本。 【發明内容】 由上述說明可知，既古 因丑用同一 P 圓承載框架與晶片盤承載座 U同基台，必須重複拆卸與 者：Β , 马71下才月Μ吏用兩 中之，疋以造成相當程度的不方便。 广！鑑於此，本發明之主要目的係提供-種晶片盤承載 座，该晶片盤承載座可直接設於晶圓承載框架上， 去拆裝晶圓承載框架之步驟，節省作業時間。 σ, 载：上述主要—技術;段二該…承 一圓形盤體，其上表面係向内凹 陷形成一平坦的凹陷 心且沿該圓形盤體外環側壁係橫向突伸有一外環凸緣, ▲複數凸塊’係成形於該凹陷部表面，該複數^塊係 遠凹陷部上規劃出複數個晶片盤置放區。 、 、—各晶片盤置放區係用以放置_晶片盤，該晶片盤 馒數置放孔，每一置放孔可供設置一晶片。 201003829 該圓形盤體可進一步包含複數取放孔’係穿透該圓形 盤體而成形於凹陷部之側邊及晶片盤置放區之側邊，以方 便拿持該圓形盤體或拿取置於該晶片盤置放區上的晶片 盤。 再者’該凹陷部係進一步於對應每一晶片盤置放區之 一角落成形有一定向凸塊，且晶片盤對應該晶片盤置放區 之角落形成一斜截角部，當晶片盤欲放置於晶片盤置放區 時’係將晶片盤之斜載角部對應至晶片盤置放區之定向凸 塊’再放置上去，以確保晶片盤之放置方向正確無誤。 該圓形盤體外側之外環凸緣係對應一晶圓承載框架之 上緣，當晶片盤承載座與一設於一基台的晶圓承載框架結 合時’該晶片盤承載座係由上往下置放於晶圓承載框架之 上，其中該外環凸緣係抵於該晶圓承載框架之上緣，使晶 片盤承载座可為該經晶圓承載框架所支撐，於是該基台上 的載具隨即變為晶片盤承载座，而可開始進行其他半導體 i,,' 製程。 有上述說明可知，本發明提供一可直接與晶圓承載框 架結合的晶片盤承載座，可免去於一基台上重複拆卸與安 裝晶圓承載框架以及晶片盤承載座等載具的時間，進而加 速製程速率。 【實施方式】 。月參考第一圖至第三圖所示，本發明一較佳實施例係 包含： 6 201003829 圓形盤體（1 〇 ) ’其上表面係向内凹陷形成—平 坦的凹陷部（i工）’該圓形盤體（丄〇 )並具有—外環 側壁，沿該外環側壁係橫向突伸一外環凸緣（丄2 )，且 該外環側壁係具有複數定位孔（工3 )，各定位孔（工3 : 内可設有定位件（丄4 )，如第四圖所示，該定位件（工 4)内包含有—彈簧（140)及一受彈簧（14〇)頂 持的鋼珠（1 4 1 )，當圓形盤體（χ 〇 )設於一晶圓承 (載框架時，定位#(14)可藉受彈|(14〇)頂持的 鋼珠（1 4 1 )抵於晶圓承載框架上，使其圓形盤體（丄 0 )不易移動； 複數凸塊（2 0 a ) ( 2 〇 b )，係成形於該凹陷部 (1 1 )表面’該些凸塊（2 〇 a ) ( 2 〇 b )係於該凹 陷部（1 1 )上規劃出複數個晶片盤置放區（2 1 a )( 2 1 b );本實施例中’係以四個凸塊（2 〇 a )為一組， 規劃出一個矩形的晶片盤置放區（2la)，該四個凸塊 ( (20a)係分別位於該矩形晶片盤置放區（213)的 四個角落，本實施例中總共以2 0個凸塊（2 〇a) (2 〇 b )規劃出五個晶片盤置放區（2 1 a ) (21b)，其 中四個凸塊（2 0 b )係分別位於靠近其他四個晶片盤置 放區（2 1 a )的中心位置而規劃出一附加的第五個晶片 盤置放區（21b)，因此，該晶片盤置放區（21b) 係位於凹陷部（1 1 )中央位置而與其他晶片盤置放區（2 1 a )部分重豐，進一步參考第五圖所示，各晶片盤置放 區（2 1 a )係供放置一晶片盤（3 〇 )，其中晶片盤（3 7 201003829 〇 )係以其邊框内緣抵靠晶片盤置放區（2 2 a )之凸塊 (20a)的側邊以定位於晶片盤置放區（2 1 a)，該 曰日片盤（30)具有複數置放孔（31)，每一置放孔（3 1 )可供設置一晶片；是以’本實施例可同時放置四個晶 片盤（30)，亦可視製程需求而僅放一晶片盤（3〇) 於中央位置的晶片盤置放區（2 1 b ); 複數取放孔（4 0 a ) (40b)，係貫穿該圓形盤 f 體（10)而位於凹陷部（1 1)之側邊及晶片盤置放區 (2 1 a ) ( 2 1 b )之外圍’成形於凹陷部（1 1 )側 邊的取放孔（4 〇 3 )係方便使用者經由該取放孔（4 〇 a)拿起圓形盤體（10);成形於晶片盤置放區（21 a ) ( 2 1 b )側邊的取放孔（4 0 b )則用以方便使用 者拿取位於晶片盤放置區（2 1 a ) (2 1 b)上的晶片 盤（3 0 )。 此外，本實施例中’該凹陷部（1 1 )係進一步於對 應每一晶片盤置放區（2 1 a )( 2 1 b )其中一角落設 有—定向凸塊（2 2 )’且晶片盤（3 0 )對應該晶片盤 置放區（21a) (21b)之角落形成一斜截角部 2)，當使用者欲放置晶片盤（30)於晶片盤置放區（2 1 a ) ( 2 1 b )時’係先將晶片盤（3 0 )之斜截角部 (3 2 )對應至晶片盤置放區（2 1 a ) ( 2 1 b )之定 向凸塊（2 2 )，再放置上去，以確保晶片盤（3 0 )之 放置方向正確無誤。 請參考第八圖所示’本發明係應用於先前技術中所提 201003829201003829 IX. Description of the Invention: [Technical Field] The present invention relates to a wafer-like t # & 曰 disk carrier, especially a wafer carrier that can be directly placed thereon corresponding to a wafer carrier frame seat. [Prior Art] After the semiconductor process is performed on the wafer, the wafer is placed on an iron frame, and the frame is provided with an empty space for the wafer to be adhered. On the layer of tape, the iron frame is transported to the wafer dicing machine to cut the wafer. The wafer is cut into 葙砮 j 取 取 取 取 取 ' ' ' ' ' ' ' ' ' 切割 切割 切割 切割 切割 切割 切割 切割 切割 切割 切割 切割 切割 切割 切割 切割 切割 切割As shown in the figure of the nine and the tenth figure, the iron frame (8 〇 ) is placed in a wafer carrier frame 5 (5 〇 ) for the die bonding operation, and the wafer carrier frame (50) is used. On the X-square '6' (6 〇), the die-bonding device takes the wafer on the iron frame (80). π refers to the eleventh figure, which is the same as the wafer carrier (7 )) which can be applied to the aforementioned base port (60), and the wafer carrier (70) has a plurality of specifications. The area corresponding to the wafer tray, each of which is provided by a plurality of positioning strips (7 1 ) disposed on the surface of the wafer carrier (7 〇), and the wafer tray can be used to place a plurality of diced wafers. The wafer carrier (7 〇) is the same as the aforementioned wafer carrier frame (5 〇) - the base (60) 'corresponds to the wafer carrier (70). It is placed on the base station (6 〇), and can be bonded or other packaged program. 0 4 201003829 Since the aforementioned wafer carrier (7〇) 共用) all share the same base △, Japanese yen bearing frame (5 use After the completion, I want to change the day ^ w κ planting frame (5 〇). The daily disk carrier (7 Q) first carries the wafer carrier frame (^ η ) ό Α ", must be ^50) from the base station ( 6〇) The wafer carrier (7 〇> υ) is removed, and then w υ ) is locked to the base (60) ^ as shown in Figure 12, after the lock© is completed; J' § When you have to use g 0 ) again, you must also have a tj-day port carrying frame (5 knives, squats, squats, smashing, smashing, smashing, smashing, smashing, smashing, smashing, smashing, smashing, smashing It is a waste of time. [Explanation] From the above description, it can be seen that the same P-circle bearing frame and the wafer carrier U are the same as the base plate, and must be repeatedly disassembled: Β, 马71下月Μ吏In the meantime, the main purpose of the present invention is to provide a wafer carrier. The wafer carrier can be directly disposed on the wafer carrier frame to remove the wafer carrier frame, thereby saving operation time. σ, loading: the above-mentioned main-technical; paragraph two... a circular disk body, The upper surface is recessed inwardly to form a flat concave core and an outer ring flange is laterally protruded along the side wall of the outer surface of the circular disk. ▲A plurality of bumps are formed on the surface of the concave portion, and the plurality of blocks are far away. A plurality of wafer disc placement areas are planned on the recesses, and each wafer tray placement area is used for placing a wafer tray, and the wafer tray has a plurality of placement holes, and each of the placement holes is provided with a wafer. 201003829 The circular disc body may further comprise a plurality of pick-and-place holes formed through the circular disc body and formed on the side of the recess and the side of the wafer disc placement area for conveniently holding the circular disc or Taking the wafer tray placed on the wafer tray placement area. Further, the recess portion further forms an directional bump at a corner corresponding to each wafer disc placement area, and the wafer tray is placed corresponding to the wafer tray The corner of the area forms a diagonal section, when the wafer tray is placed When the wafer tray is placed in the area of the wafer tray, the directional bumps corresponding to the wafer tray placement area are repositioned to ensure that the wafer tray is placed in the correct direction. The outer ring flange corresponds to an upper edge of a wafer carrier frame. When the wafer carrier is coupled to a wafer carrier frame disposed on a substrate, the wafer carrier is placed on the wafer from top to bottom. Above the carrier frame, wherein the outer ring flange is fastened to the upper edge of the wafer carrier frame, so that the wafer carrier can be supported by the wafer carrier frame, and the carrier on the substrate then becomes The wafer carrier can be used to start other semiconductors, 'process. With the above description, the present invention provides a wafer carrier that can be directly bonded to the wafer carrier frame, eliminating the need for repeated removal on a substrate. The time required to mount the wafer carrier frame and the carrier such as the wafer carrier, thereby accelerating the process rate. [Embodiment] Referring to the first to third figures, a preferred embodiment of the present invention comprises: 6 201003829 A circular disk body (1 〇) 'The upper surface thereof is recessed inwardly formed - a flat depressed portion (i) The circular disk body (丄〇) has an outer ring side wall, and an outer ring flange (丄2) protrudes laterally along the outer ring side wall, and the outer ring side wall has a plurality of positioning holes (work 3), Each positioning hole (working 3: can be provided with a positioning member (丄4), as shown in the fourth figure, the positioning member (work 4) includes a spring (140) and a spring (14〇) holding Steel ball (1 4 1 ), when the circular disk body (χ 〇) is set on a wafer carrier (positioning frame # (14) can be supported by the bomb | (14〇) holding steel ball (1 4 1 ) abutting the wafer carrier frame such that the circular disk body (丄0) is not easily moved; the plurality of bumps (20 a) (2 〇b) are formed on the surface of the recessed portion (1 1 ) A bump (2 〇a ) ( 2 〇b ) is arranged on the recess (1 1 ) to form a plurality of wafer disc placement areas ( 2 1 a ) ( 2 1 b ); in this embodiment, the system is four One bump (2 〇a ) is a group, and one is planned. a rectangular wafer disc placement area (2la), the four bumps (20a) are respectively located at four corners of the rectangular wafer disc placement area (213), and in this embodiment, a total of 20 bumps ( 2 〇a) (2 〇b ) Five wafer placement areas (2 1 a ) (21b) are planned, of which four bumps (2 0 b ) are located close to the other four wafer tray placement areas ( An additional fifth wafer placement area (21b) is planned for the center position of 2 1 a ). Therefore, the wafer tray placement area (21b) is located at the center of the recess (1 1 ) and is adjacent to the other wafer. The disk placement area (2 1 a ) is partially heavy. Referring further to the fifth figure, each wafer tray placement area (2 1 a ) is for placing a wafer tray (3 〇), wherein the wafer tray (3 7 201003829) 〇) is positioned on the side of the bump (20a) of the wafer disc placement area (2 2 a ) with its inner edge of the frame to be positioned in the wafer tray placement area (2 1 a), the next day disk (30) Having a plurality of placement holes (31), each of the placement holes (31) can be provided with a wafer; in this embodiment, four wafer trays (30) can be placed at the same time, and only one can be placed according to the process requirements. Chip tray 3〇) a wafer disc placement area (2 1 b ) at a central position; a plurality of pick-and-place holes (40 a) (40b) extending through the circular disc f body (10) and located in the recessed portion (1 1) The side of the side and the periphery of the wafer tray placement area (2 1 a ) ( 2 1 b ) are provided with a receiving hole (4 〇 3 ) formed on the side of the recessed portion (1 1 ) for facilitating the user through the receiving hole (4 〇a) Pick up the circular disc body (10); the pick-and-place hole (4 0 b ) formed on the side of the wafer disc placement area (21 a ) ( 2 1 b ) is convenient for the user to take A wafer tray (30) located on the wafer tray placement area (2 1 a ) (2 1 b). In addition, in the embodiment, the recessed portion (1 1 ) is further provided with a directional bump (2 2 ) in one corner of each of the wafer disc placement regions ( 2 1 a ) ( 2 1 b ) and The wafer tray (30) forms a diagonal portion 2) corresponding to the corner of the wafer tray placement area (21a) (21b), when the user wants to place the wafer tray (30) in the wafer tray placement area (2 1 a) When ( 2 1 b ), the oblique section (3 2 ) of the wafer tray (30) is first mapped to the directional bump of the wafer tray placement area (2 1 a ) ( 2 1 b ) (2 2 ), and then placed up to ensure that the wafer tray (30) is placed in the correct direction. Please refer to the eighth figure. The present invention is applied to the prior art.
及之晶圓承載框架（c； η、 L 3 U )上’該晶圓承載框架（5 ο ) 復設於一基台（6 Π、 I·二 )上而可做晶片切割之製程作業，當 該圓形盤體（1 〇 )盘兮a a ? )/、5亥日日®承載框架（5 0 )結合時， 該圓形盤體（1 〇 )係 田上在下置放於晶圓承載框架（5 〇 八中°亥外％凸緣（1 2 )係抵於該晶圓承載框 架（5〇)之内緣上’使該圓形盤體（1〇)可為該經晶 圓承載框架（5 〇 )所* # 分π J所支撐，该圓形盤體（1 〇 )盥晶圓 承載框架（5 〇 )結合後即可用以、鱼〜甘 ）曰圓 俊I7 J用以進仃其他半導體制， 且其高度剛好等於先前枯術s 等體裝私 无則技術所棱及之晶片盤承 0)裝設於基台（6〇)的高度，故先前 又无别技術所對應使用 的機械吸嘴或手臂可直接適用於本發明， " M此，本發明可 直接取代先前技術的晶片盤承載座（7 〇、 u )，不需調整機 械手臂之昇降高度。 清參閱弟六圖所示，係本發明另—較任眷 貫施例，與前 述實施例不同處在於，該凹陷部（1 1 )上夕6 7〈弋向凸塊(2 2 a )係以偏心樞設的方式設置，且僅於靠β办 非迎各定向凸塊 (2 2 a )之角落設有一凸塊（2 0 c )，而以各凸塊（2 〇c)構成各晶片盤置放區，且該定向凸塊（9 、乙2 a )係 以偏心樞設的方式設於凹陷部（1 1 )上 七圖所示，當晶片盤（3 0 )置放於各晶 進—步參考第 盤置放區時， 該偏心樞設的定向凸塊（2 2 a )將樞轉至與晶片盤 〇 )之斜戴角部（3 2 )緊抵，加強晶片盤（3 〇 )之^ 位效果。 綜上所述，本發明係提供一可直接設於晶圓承載框架 201003829 上的晶片盤承載座，益# 係以其圓形盤體外側之外产 應抵設於該晶圓承栽框架之上緣，可免去於—二=緣係對 拆卸與安裝晶圓承載框架以及晶片盤承載座上重複 間’加速製程速率；再者，本發明進一步於圓形：：的時 成取放孔以方便拿取晶片盤或圓形盤體本身，又體f形 晶片盤置放區之一角形成有定向凸塊以做為放置：應每〜 防呆構造，減少放置錯誤之情事 aa片盤的 的進展。 又生白有助於加迷製裎 【圖式簡單說明] 第-圖.係本發明一較佳實施例之立體示意圖。 第二圖·係第—圖之俯視圖。 第三圖·係第一圖之剖視圖。 第四圖：係本發明一較佳實施例之定位件剖視圖。 第五圖.係第一圖與承載盤結合之立體示意圖。 第六圖·係本發明另一較佳實施例之立體示意圖。 第七圖·係第六圖與承載盤結合之立體示意圖。 第八圖.係本發明一較佳實施例與一晶圓承載框架結 合之立體示意圖。 第九圖：係既有一晶圓承載框架之立體示意圖。 第十圖.係第九圖之晶圓承載框架設於一晶圓切割基 台之側面示意圖。 第十一圖.係既有一晶片盤承載座之立體示意圖。 第十二圖：係第十一圖之晶片盤承載座設於一晶圓切 10 201003829 割基台之側面示意圖。 【主要元件符號說明】 (10)圓形盤體 （11) (1 2 )外環凸緣 （13) (1 4 )定位件 （14 0 (1 4 1 )鋼珠 （20a) (20b)凸塊 （20c (21 a)晶片盤置放區 (2 1 b )晶片盤置放區 (22)定向凸塊 （22a (3 0 )晶片盤 （31) (32)斜截角部 （40a (40b)取放孔 （50) (5 1 )鏤空部 （60) (7 0 )晶片盤承載座（7 1 ) (80)鐵框 （81) 凹陷部 定位孔 )彈簧 凸塊 )凸塊 )定向凸塊 置放孔 )取放孔 晶圓承載框架 基台 定位條 鏤空部 11And the wafer carrying frame (c; η, L 3 U ) on the wafer carrier frame (5 ο ) is disposed on a base (6 Π, I· 2) for wafer cutting process, When the circular disk body (1 〇) disk 兮aa ? )/, 5 日 日 日 bearing frame (50) is combined, the circular disk body (1 〇) is placed on the wafer carrier frame under the field. (5 中8°°°% outside flange (1 2 ) is on the inner edge of the wafer carrier frame (5〇) so that the circular disk body (1〇) can be the wafer-bearing frame (5 〇)** Supported by π J, the circular disc body (1 〇) 盥 wafer carrying frame (5 〇) can be used together, fish ~ Gan) 曰 俊 俊 I7 J for access Other semiconductor systems, and their height is just equal to the height of the previous package, such as the singularity of the singularity of the singularity of the slab, which is installed on the base (6 〇), so there is no previous technology. The mechanical nozzle or arm can be directly applied to the present invention, and the present invention can directly replace the prior art wafer carrier (7 〇, u) without adjusting the lifting height of the robot arm. . As shown in the sixth drawing of the present invention, the present invention is different from the above-described embodiment, and the difference from the foregoing embodiment is that the depressed portion (1 1 ) is 6 6 7 弋 弋 凸 (2 2 a ) It is arranged in an eccentric pivoting manner, and only one bump (2 0 c ) is disposed at a corner of each of the directional bumps (2 2 a ), and each of the bumps is formed by each bump (2 〇c) a disc placement area, and the directional bumps (9, B 2 a ) are eccentrically disposed on the recessed portion (1 1 ) as shown in FIG. 7 when the wafer disc (30) is placed in each crystal When referring to the disc placement area, the eccentrically pivoted directional bumps (2 2 a ) will be pivoted to the oblique corners (32) of the wafer tray to strengthen the wafer tray (3) 〇) The effect of the position. In summary, the present invention provides a wafer carrier carrier that can be directly disposed on the wafer carrier frame 201003829, which is disposed outside the circular disk body and is disposed on the wafer carrier frame. The upper edge can be removed from the two-edge pair to disassemble and mount the wafer carrier frame and the repeating process between the wafer carrier and the 'acceleration process rate; further, the present invention further adopts a round:: In order to conveniently take the wafer disc or the circular disc body itself, a corner of the f-shaped wafer disc placement area is formed with directional bumps for placement: each should be made of a foolproof structure to reduce the misplacement of the aa disc. Progress. Further, whitening is helpful for confusing. [Simplified illustration of the drawings] Fig. is a perspective view of a preferred embodiment of the present invention. The second picture is a top view of the figure. The third figure is a cross-sectional view of the first figure. Figure 4 is a cross-sectional view of a positioning member in accordance with a preferred embodiment of the present invention. Fig. 5 is a perspective view showing the combination of the first figure and the carrier. Figure 6 is a perspective view of another preferred embodiment of the present invention. The seventh figure is a three-dimensional diagram of the sixth figure combined with the carrier disk. Figure 8 is a perspective view of a preferred embodiment of the present invention in combination with a wafer carrier frame. Figure IX: A perspective view of a wafer carrier frame. Fig. 10 is a side view of the wafer carrying frame of the ninth drawing on a wafer cutting base. Figure 11 is a perspective view of a wafer carrier. Twelfth figure: The wafer carrier of the eleventh figure is arranged on a wafer. 10 201003829 The side view of the cutting abutment. [Explanation of main component symbols] (10) Round disk body (11) (1 2 ) Outer ring flange (13) (1 4 ) Positioning piece (14 0 (1 4 1 ) ball (20a) (20b) bump (20c (21 a) wafer tray placement area (2 1 b) wafer tray placement area (22) directional bump (22a (30) wafer tray (31) (32) oblique section (40a (40b) Pick-and-place hole (50) (5 1 ) hollow part (60) (7 0 ) wafer carrier (7 1 ) (80) iron frame (81) recessed positioning hole) spring bump) bump) directional bump Placement hole) pick and place hole wafer bearing frame base station positioning bar hollow portion 11