201003637 九、發明說明： 【發明所屬之技術領域】 一種電路板光學取像方法’尤指使用於電路板製程中檢測或 量測設備所使用之光學取像方法。 【先前技術】 電子產業是台灣目前最重要的產業之一，近年來隨著製造生 產技術不斷的進步，毛利相對提高，而以印刷電路板（printed Circuit Board)為例，是電子相關產品產出重要的—環，而在 印刷電路板的製作或組裝測試上，自動光學檢測（Aut〇matic Optical Inspection，Α0Ι)或量測設備雖被廣泛的運用於製程 中，但辨識的過程仍存有許多應被檢出卻未被檢測出的瑕疵（不 良品）或無法執行自動光學量測之現象’請參閱第一圖及第二圖 所示，由圖中可清楚看出，其主要原因在於，檢測設備為利用三 原色光（紅色、綠色、藍色）或白光來照射印刷電路板A，再取 得待測物之影像，而此種作法所取得之影像較不清晰，原因在於 (以防焊油墨製程為例），印刷電路板A外層導線八2上為會使用 防焊油墨（Solder Mask)覆蓋形成絕緣層A丄（大多為綠漆），而 使印刷電路板A上導線A 2的邊緣，因可見光的穿透力較弱，於 光學取像下，色階太接近，進而造成檢測或量測設備於自動辨識 的過程中產生誤判或是應被檢出卻未被檢測出的瑕疵，量測設備 則無法做到自動量測之目的（請參閱附件一）。 所以，因為上述原因，俾使目前檢測或量測方式，皆為在印 201003637 刷電路板A塗佈防焊油墨前， 彦口㈣子導線A 2作檢測或量測，再將 乾膜或溼膜製裎，比么縣私也疋如此，然而，防焊油墨、 靶腰次冱膜裂転，皆無法以製 n曰於射b 料月』之^戈夏測來替代製程後之 狀仏測或_後必須經過搬運、前處理等才可執行後續製 程，且防厚油墨塗佈後必須 了執灯後教 而在搬運過程中導峻A ? ：：：：；；^ ，而種種會發生損壞之問題，使印刷電路板a ^後，都無法以塗佈前之檢測做取代，尺寸量測也是 如此。 。疋以’要如何顧上述_，即為相_者職欲改善之課 【發明内容】 、本U之主要目的乃在於，彻紅外線辆、之穿透力，來穿 ，，⑽之_墨或乾膜，’使檢測或量測設備可取 付防诨紐或輔所覆蓋下的清_像，關檢測或量測 設備自影像上判讀出電路板是否有缺陷或做尺寸量測。 【實施方式】 b閱第一圖所不’由圖中可清楚得知，當本發明利用紅外 線光源照射電路板1時，會因紅外線比可見光具有更強的穿透 力，所以會穿透電路板U面之防焊油墨U，使防焊油墨1 1 下的導線1 2再反射紅外_來雜測裝置接收，如此檢測裝置 即可π疋的觸料線i 2是否有瑕疵（不良品）或可量測其尺 寸是否符合規格，且因此種作法為在祕板丨塗鑛焊油墨Η 201003637 後進行’因此更能符合製程檢測或量測之需求。 再者’該電路板1可為剛性印刷電路板（Rigid printed boards)、繞性印刷電路板(Flexible Printed boards)、分立導 線電路板(DESCRETE WIRING BOARD)或陶瓷基板(Ce譲ic b〇ards)。 “ \該紅外線可為近紅外線（波長0 · 7 5至1 . 5微米）、 =紅外線（波長1·5至5.6微米）或遠 6 至1 0 0 0 微米)。 * 【圖式簡單說明】 第一圖係為習知電路板之剖面圖。 第二圖係為習知檢測設備取像後之影像示意圖 第三圖係為電路板之剖面圖。 附件一係為習知可見光照射後所拍攝之影像。 附件二係為本發明之紅外線照射後所拍攝之影俨 【主要元件符號說明】 心冬 A、印刷電路板 A 1、絕緣層 A 2、導線 1、電路板 1 1、防焊油墨 1 2、導線201003637 IX. Description of the Invention: [Technical Field of the Invention] A circuit board optical imaging method </ RTI> particularly refers to an optical imaging method used in a detection or measurement device in a circuit board process. [Prior Art] The electronics industry is one of the most important industries in Taiwan. In recent years, with the continuous improvement of manufacturing technology, the gross profit has increased relatively. The printed circuit board (LED), for example, is the output of electronic related products. Important - the ring, but in the production or assembly test of printed circuit boards, automatic optical inspection (Aut〇matic Optical Inspection, Α0Ι) or measuring equipment is widely used in the process, but the identification process still has many瑕疵 (defective) that should be detected but not detected or the phenomenon that automatic optical measurement cannot be performed'. Please refer to the first and second figures. As can be clearly seen from the figure, the main reason is that The detecting device uses the three primary colors of light (red, green, blue) or white light to illuminate the printed circuit board A, and then obtains the image of the object to be tested, and the image obtained by such a method is relatively unclear because (with the anti-welding ink For example, the outer layer of the printed circuit board A is covered with a solder mask (Solder Mask) to form an insulating layer A (mostly green paint), and the printing is made. The edge of the wire A 2 on the road board A is weak due to the penetration of visible light. Under the optical image, the color gradation is too close, which causes the detection or measurement equipment to be misjudged or should be inspected during the automatic identification process. However, the measurement equipment cannot be used for automatic measurement (see Annex 1). Therefore, for the above reasons, the current detection or measurement method is to test or measure the Yankou (four) sub-wire A 2 before printing the welding circuit board A on the printing 201003637, and then dry film or wet. Membrane-made enamel, this is also the case than the county private, however, the solder-proof ink, the target waist 冱 転 転 転 転 転 転 転 転 転 皆 皆 皆 皆 皆 皆 皆 皆 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ After the test or _ must be carried, pre-treatment, etc. can be used to carry out the subsequent process, and after the anti-thick ink coating must be taught after the light and in the handling process to guide the A? ::::;; ^, and various The problem of damage occurs, so that after the printed circuit board a ^, it can not be replaced by the test before coating, and the size measurement is also the same. .疋 ' 要 要 要 要 要 要 要 要 要 要 要 要 要 要 要 要 要 要 要 者 者 者 者 者 者 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 Dry film, 'to enable the detection or measurement equipment to take care of the _ 诨 或 或 或 或 或 或 或 或 或 , , , , , 关 关 关 关 关 关 关 关 关 关 关 关 关 关 关 关 关 关 关 关 关 关 关 。 [Embodiment] b is not shown in the first figure. It can be clearly seen from the figure that when the present invention uses the infrared light source to illuminate the circuit board 1, the infrared light has a stronger penetrating power than the visible light, so it penetrates the circuit. The solder mask ink U on the U surface of the board causes the wire 1 2 under the solder resist ink 1 to reflect the infrared _ to be received by the noise measuring device, so that the detecting device can 疋 the contact line i 2 of the π 是否 (defective product) Or it can be measured whether the size meets the specifications, and therefore the method is to carry out the welding ink Η 201003637 after the 丨 board, so it is more suitable for the process inspection or measurement. Furthermore, the circuit board 1 can be a rigid printed circuit board, a flexible printed board, a discrete conductor board (DESCRETE WIRING BOARD) or a ceramic substrate (Ce譲ic b〇ards). . " \The infrared can be near infrared (wavelength 0 · 7 5 to 1.5 μm), = infrared (wavelength 1. 5 to 5.6 μm) or far 6 to 1 0 0 micron). * [Simple description] The first figure is a cross-sectional view of a conventional circuit board. The second picture is a schematic view of the image taken after the image is taken by a conventional detecting device. The third picture is a sectional view of the circuit board. The second part is the image taken after the infrared irradiation of the present invention. [Main component symbol description] Xin Dong A, printed circuit board A 1, insulating layer A 2, wire 1, circuit board 1 1, solder mask ink 1 2, wire