201001129 九、發明說明： 【發明所屬之技術領域】 種用於電子發熱 本叙明係有關於一種均溫板，尤指 兀件之均溫板製作方法及其製成品。 【先前技術】 越來❹現料技產業快速的發展，令電腦在運算執行上 (快，尤其是當中央處理器之運算速度越高時，其運 ，時所產生之發熱量亦愈來愈高，為能將此密集敎量有效 ::於主機外之環境’以維持中央處理器在許可溫度下能 運作’通常會在中央處理器上設有散熱裝置，用以協助中 :處理15散熱’以增加散熱能力。但隨著中央處理器之運 算速度越高，所產生之發熱量亦愈來愈高的情況下，一般 的散熱裝置若仍由铭擠型散熱器及散熱風扇所構成時，其 對中央處理器之散熱根本無法負荷。 因此，遂有提供一種均溫板之設計，如第一圖所示， 該均溫板10a具有一中空殼體1&，殼體la由頂殼na及底 殼12a所構成，於殼體la四周邊的内壁面處設置有毛細組 織3a，且在該殼體la内設有一呈皺折狀的支撐構件知，令 冗又體la内抽真空後，由該支撐構件2a予以支推住；當中央 處理器運轉後所產生之熱源會被殼體1 a内之工作流體所吸 收並作熱交換，而熱交換後所產生之熱氣會往上散發，由 於殼體la頂端遠離發熱處，溫度較低，故可使熱氣在殼體 la頂端冷卻成液體，液體再由毛細組織如導引至殼體底 5 201001129 部處，而持續的進行熱交換。 板^====予以強化其結構強度須在均溫 避免均溫板！如在牙j ^ ’猎由该支樓構件2a的支撐 殼12a的凹陷。惟，空作業時而造成頂殼…及底 組織，導致工从件以上並未設置有任何的毛細 f塑工作、_流體僅能在殼體la内壁關處回流，嚴重 Ά工作流體的回流效率。 【發明内容】 本發明之一目的，在於 製成品，其鮮由種均-板製作方法及其 之支撐強度，而可r L主的设置’以強化均溫板内部 、厌而可侍一溥形化均溫板者。 包括二第Si述：i '，本發明係提供一種均溫板，其 體，、―第—板體、複數毛細核及-工作产 “中該内壁面披覆有一層毛 w 合連接於該第—板體上，並於該第」體及係封 間形成有一蒸汽容腔；該等毛細支柱係5凰 ' 反體之 而成，其佈設於該蒸汽容腔内部，該毛^粉末所燒結 貼接於該毛細組織及該第二板體之内壁面：兩端分別 填注於該蒸汽容腔内部。 ，该工作流體 為了達成上述之目的，本發明俜招 方法，其步驟包括: ”士供-種均溫板製作 二)在-第一板體的内壁面被覆有—層毛 ，· 於一第二板體的内壁面結合有複數毛細支柱. 201001129 内部形成有一 d)將 瘵Η容腔；以及 第=板體及該第二板體相互疊接封合，而於其 工作流體填入該蒸汽容腔内部並進行除氣及封 細支柱此以在第一或第二板體上燒結出複數個毛 有縫_孔等微之具 度，並得一薄开=^=支標結構，而可降低整體厚 【實施方式】 :二:發明之詳細說明及技術内容，配 :::圖式僅提供參考與說明用，並非用來對本發 昭第本::係提！ 一種均溫板製作方法及其製成品，料 本發明均溫板(細一 a)在-第-板體】的内壁面披覆有一層毛細 12(如第三圖所示）；在此步驟令，係 :β 結方式直接成型於第-板體！的内壁面上：二曰：：以燒 組織12;同理，亦可將—金屬編織 二2細 合於第-板體】的内壁面上。 干接專黏者方式結 b)於-第二板體2的内壁面結合有複數毛細支柱 201001129 :2(如第四圖所示）；在此步驟中 2的内壁面，以金屬 、直接在第二板體 金屬粉末所燒心==後數毛細侧；或是將 方式結合於第I二 以焊接或緊迫璧合等 板體1的内壁面上。 :)將該第—板體i及該第二板 於其内部形成右—兮…—A/ 7兄且按對合，而 m飞谷腔A(如第五圖所示）；以及 及封口 ^工作流體3填入該蒸汽容腔A内部並進行卜-及封口（如第六圖所示）。 除瑕* 徵，：：讓編亥項技術之人士能更加瞭解本發明之特 特舉-貫施例並配合各圖式加以說明: :示:該均溫板10係由-第-板體1及-第二板體= 々下^接逸、封而成。其中，第—板體1上形成有一向下 陷的容置空間11，容置处門彳 σ下凹 古“ 4置工間11的内壁面利用金屬粉末燒,士 有一層毛細組織12，但不此種型態為限 ： :網’另在第-板體！的四周邊並形成有下凸== 第-板體2上亦形成有一向下凹陷的容置空間21，此 ::⑽與前述第一板體！之容置空間u共同組成均溫㈣ 之心容腔A ’·第二板體2内壁為一光滑表面，在此内壁 利用金屬粉末燒結出具有等間距相間隔且由毛細組織所構 成的複數個毛細支柱22，本實施例之毛細支柱如系由一圓 形柱體221及從柱體221之根部所延伸出並與第二板體2 的内壁面相接的一圓錐環222所構成q旦不以此種型^為 限；此圓錐環222周緣直徑大於柱體221之周緣直徑，藉 以增加接觸面積及提高流體回流速度；另在第二板_ 2的 201001129 四周邊亦形成有下凸緣23。 山，垂此外’本發明亦可在第—板體1的毛細組織]2上燒結 出夕數毛細支柱 ,,^ 00 , 2(如弟十一圖所示）。或者，將該等毛 二二U焊接或緊迫壓合等方式結合於毛細組織12或第 一板體2内壁面上（如第十二圖所示）。 凊參照第五圖至筮士圖 , 二板體2相互…：：起二合Γ將第-板體1及第 起打，第二板體2上的複數個 / 2 端面會貼合在第-板體1之毛細組織12 二匕由毛細支柱22以作為均溫板10的支撐構件。第-以焊接板體2四周邊的所形成的下、上凸緣13、23 部开：封合，而於第—板體1及第二板體2之内 :…腔A;最後’將-工作流體3從第一板體 體2之除氣填注管（圖未示）中注入蒸汽容腔 成品。 除乳及封口，即可完成一薄型均溫板10的製 請續參照第八圖所示，本發 即可將該均溫板1◦安置在中央處理器:上，再二： 有散熱?片組5〇，即可針對中央處理器= 為' 乍進仃散熱時，中央處理器40執行運算所產 二;、、：會向上傳遞至均溫板1()内，利用均溫板_第一板 ^的毛細組織12、第二板體2的毛細支柱22與毛細 的、及工作流體3進行熱交換’以快速及有效； 的對中央處理器40進行散熱工作。 ’政羊 睛參照第九圖所示，當本發明的均溫板1〇對單 ^//g> 201001129 進行散熱，如中央處理㈣進行散熱時， 均溫板的中間處’由於該等由毛細 成的毛細支柱22係等間距的佈置， "霉 均的與中央處理器4〇相接觸。請參照第十 :月：均溫板10針對兩個或兩個以上的熱源進行散孰= Ϊ=°及電子元件6。進行散熱時，該中央處理器4。： 子π件60即可安裝在均溫板1Q的中兩側處 =所構成的毛細支柱22係間隔佈置，該毛細= 亦此平均的與中央處理器4〇及電子元件6〇相接觸。柱以 體二述==說明後可知，由在第-板 :::=支擇強度，藉以使均溫板”被i::: 内壁為-光滑面與魏等微結構、及第二板體2 度。 』均溫板10内工作流體的回流速 綜上所述，本發明之「 品」’的確能藉由上述所揭露:構造，達到：：成 且本發明申料未見於刊物 34之功效。 專利之新穎、進步等要件。 開使用，喊已符合發明 【圖式簡單說明】 =係習知均溫板的剖面示意圖。 料發明均溫板的製作流程圖。 —係本發明之第一板體的立體外觀圖。 201001129 第四圖係本發明之第二板體的立體外觀圖。 第五圖係本發明之各板體相互蓋合密封前剖示圖。 第六圖係本發明之各板體密封後並填入工作流體 圖0 不 第七圖 第八圖 第九圖 第十圖 弟十一圖 第十二圖 固之部份放大 係本發明均溫板實施應用情形 係本發明均溫板 源/意 係本發明均温板安裝在二c ::::明均溫板另一實施:: 係本發明均溫板又-實施一= 【主要元件符號說明〔習知〕201001129 IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to electronic heating. The present invention relates to a temperature equalizing plate, in particular to a method for producing a uniform temperature plate and a finished product thereof. [Prior Art] The rapid development of the technology industry has made the computer perform in computing (fast, especially when the computing speed of the central processing unit is higher, the heat generated by it is getting more and more.) High, in order to be able to effectively use this dense amount:: Outside the host environment 'to maintain the CPU can operate at the licensed temperature' usually has a heat sink on the central processor to assist in: processing 15 heat 'To increase the heat dissipation capacity. However, as the calculation speed of the central processing unit is higher and the generated heat is higher and higher, the general heat dissipation device is still composed of the inferior heat sink and the cooling fan. The heat dissipation to the central processing unit cannot be loaded at all. Therefore, there is no design of a temperature equalizing plate. As shown in the first figure, the temperature equalizing plate 10a has a hollow casing 1& The shell na and the bottom case 12a are formed, and a capillary structure 3a is disposed at an inner wall surface of the periphery of the casing la, and a wrinkle-shaped supporting member is disposed in the casing la, so that the redundant body is pumped After the vacuum, it is supported by the support member 2a Pushing; when the central processor is running, the heat source generated by the working fluid in the housing 1a is absorbed and exchanged for heat, and the hot air generated after the heat exchange is emitted upwards, because the top end of the housing la is far away from heat. Where the temperature is lower, the hot gas can be cooled to a liquid at the top end of the casing la, and the liquid is then guided by the capillary structure to the bottom of the casing 5 201001129, and the heat exchange is continued. The plate ^==== To strengthen the structural strength, it is necessary to avoid the uniform temperature plate at the temperature uniformity; for example, in the tooth j ^ 'hunting the depression of the support shell 12a of the branch member 2a. However, the empty shell causes the top shell... and the bottom structure, resulting in workmanship The above is not provided with any capillary f-plastic work, the fluid can only be recirculated at the inner wall of the casing la, and the reflow efficiency of the working fluid is severe. [Invention] One of the objects of the present invention is that the finished product is fresh. The seed-average-plate making method and its supporting strength, and the r L main setting can be used to strengthen the inside of the uniform temperature plate, and it can be used to shape the uniform temperature plate. Including the second Si: i ', The invention provides a temperature equalizing plate, the body thereof, and the first The body, the plurality of capillary cores, and the "work product" are provided with a layer of hairs attached to the first plate body, and a vapor chamber is formed between the body and the seal; the capillary columns The body is disposed in the interior of the steam chamber, and the powder is sintered and adhered to the inner wall surface of the capillary structure and the second plate body: two ends are respectively filled in the steam capacity In order to achieve the above-mentioned purpose, the working fluid of the present invention comprises the following steps: "The production of the steel plate of the first plate is coated with a layer of wool," The inner wall surface of a second plate body is combined with a plurality of capillary struts. 201001129 is internally formed with a d) a cavity; and a plate body and the second plate body are overlapped and sealed with each other, and the working fluid is filled therein. Inserting into the interior of the steam chamber and performing degassing and sealing of the pillars to sinter the plurality of hairs on the first or second plate body, such as slits and holes, and obtain a thin opening = ^ = Structure, but can reduce the overall thickness [Embodiment]: 2: Detailed description and technical content of the invention, With ::: The drawing is for reference and explanation only, not for the original version of this book:: The method for preparing a uniform temperature plate and the finished product thereof, the inner wall surface of the uniform temperature plate (fine one a) in the -first plate body is covered with a capillary 12 (as shown in the third figure); Order, the system: β-junction directly formed in the first plate! On the inner wall surface: two 曰:: to burn the structure 12; similarly, the metal woven two 2 is welded to the inner wall surface of the first plate body. The dry joint special-purpose method is b) the inner wall surface of the second plate body 2 is combined with a plurality of capillary struts 201001129:2 (as shown in the fourth figure); in this step, the inner wall surface of 2 is made of metal, directly The core of the second plate metal powder is == the number of the capillary side; or the mode is bonded to the inner wall surface of the plate 1 such as welding or pressing. :) The first plate body i and the second plate form a right-兮...-A/7 brother in the interior thereof and press the opposite, and the m-flying chamber A (as shown in the fifth figure); and the sealing ^ Working fluid 3 is filled into the interior of the steam chamber A and is sealed and sealed (as shown in Figure 6). In addition to 瑕*,:: Let the person who edits the technology of the syllabus can better understand the special features of the present invention and explain it with the following figures: : Show: The temperature equalizing plate 10 is made of - the first plate 1 and - the second plate body = under the arm ^ joint, sealed. Wherein, the first plate body 1 is formed with a downwardly accommodating accommodating space 11 , and the accommodating portion 彳 σ is recessed and the ancient “4 inner working surface of the working chamber 11 is burned with metal powder, and the layer has a capillary structure 12, but not The type is limited to: the net is additionally formed on the four sides of the first plate body and has a lower convexity == the first plate body 2 is also formed with a downwardly recessed accommodating space 21, which: (10) and The accommodating space u of the first plate body constituting the uniform temperature (4) of the core cavity A'. The inner wall of the second plate body 2 is a smooth surface, and the inner wall is sintered by the metal powder with equal spacing and by capillary The plurality of capillary struts 22 formed by the tissue, the capillary struts of the present embodiment are a circular cylinder 221 and a cone extending from the root of the cylinder 221 and contacting the inner wall surface of the second plate 2 The ring 222 is not limited to this type; the diameter of the circumference of the cone ring 222 is larger than the diameter of the circumference of the cylinder 221, thereby increasing the contact area and increasing the fluid return speed; and in the periphery of the second plate _ 2 201001129 A lower flange 23 is also formed. The mountain, the vertical is further 'the invention can also be in the first plate body 1 The tissue] 2 is sintered on the eve of the capillary struts, ^ 00, 2 (as shown in the eleventh figure). Alternatively, the hair is welded or pressed tightly to the capillary structure 12 or the first The inner wall surface of the plate body 2 (as shown in Fig. 12). 凊 Refer to the fifth figure to the gentleman figure, the two plates 2 mutual...:: the two-in-one will be the first plate body 1 and the first hit, the first The plurality of / 2 end faces on the second plate body 2 are attached to the capillary structure 12 of the first plate body 1 and the capillary support 22 is used as the support member of the temperature equalizing plate 10. The first is to weld the periphery of the plate body 2 The formed lower and upper flanges 13, 23 are opened: sealed, and within the first plate body 1 and the second plate body 2: ... cavity A; finally - the working fluid 3 is from the first plate body The degassing filling pipe (not shown) is filled with the steam cavity. After removing the milk and sealing, the system of a thin type uniform temperature plate 10 can be completed. Referring to the eighth figure, the present invention can The temperature equalization board is placed on the central processor: on the top, and then on the other side: there is heat dissipation. The chip group is 5〇, which can be used for the central processor = when the heat is dissipated, the central processing unit 40 performs the calculation and produces two; ,:meeting The upper part is transferred to the temperature equalizing plate 1 (), and the capillary structure 12 of the first temperature plate 12 and the capillary support 22 of the second plate body 2 are exchanged with the capillary and the working fluid 3 for rapid and effective use. The heat dissipation work is performed on the central processing unit 40. As shown in the ninth figure, when the temperature equalizing plate of the present invention dissipates heat to a single ^//g> 201001129, such as central processing (four) for heat dissipation, In the middle of the temperature equalizing plate, 'the arrangement of the capillary struts 22 made of capillary is equidistant, and the mildew is in contact with the central processing unit 4。. Please refer to the tenth: month: the temperature equalizing plate 10 for two One or more heat sources are used for divergence = Ϊ = ° and electronic component 6. The central processing unit 4 performs heat dissipation. The sub-π pieces 60 can be mounted on the middle sides of the temperature equalizing plate 1Q. The formed capillary legs 22 are spaced apart, and the capillary is also in contact with the central processing unit 4 and the electronic component 6A. After the column is described by the body == description, the intensity is determined by the first plate:::=, so that the temperature equalization plate is made of i::: inner wall is - smooth surface and Wei and other microstructures, and the second plate 2 degrees. The return flow rate of the working fluid in the temperature equalizing plate 10, in summary, the "product" of the present invention can be achieved by the above-mentioned disclosure: the structure is: and the invention is not found in the publication 34 The effect. The novelty, progress and other requirements of the patent. Open use, shouting has been in line with the invention [Simple description of the diagram] = is a schematic diagram of the profile of the conventional uniform temperature plate. The flow chart of the invention of the invention of the uniform temperature plate is proposed. - A stereoscopic appearance of the first plate of the present invention. 201001129 The fourth figure is a perspective view of the second plate body of the present invention. The fifth drawing is a cross-sectional front view of each of the plates of the present invention which are sealed to each other. The sixth figure is the sealing of the plates of the present invention and is filled with the working fluid. FIG. 0 is not the seventh figure, the eighth drawing, the ninth drawing, the tenth drawing, the eleventh drawing, the twelfth figure, the partial amplification, the temperature equalization of the present invention. The application of the plate is the temperature plate source/intention of the present invention. The temperature plate of the present invention is installed on the second c:::: the average temperature plate. Another embodiment of the present invention:: the temperature plate of the invention is further implemented - one main component Symbolic description
均溫板 10a 頂殼 11a 支撐構件 〔本發明〕 2a 均溫板 10 容置空間 u、21 下凸緣 13 毛細支柱 22 圓錐環 222 工作流體 3 蒸汽容腔 A 殼體底毅 毛細纟且織 第一板體 毛細組織 第一'板體 柱體 上凸緣 la12a 3a 112 2221 23 201001129 中央處理器 40 散熱鰭片組 50 電子元件 60Temperature equalizing plate 10a Top case 11a Support member [Invention] 2a Temperature equalizing plate 10 accommodating space u, 21 Lower flange 13 Capillary struts 22 Conical ring 222 Working fluid 3 Steam chamber A Shell bottom capillary and weaving A plate capillary structure first 'plate body cylinder upper flange la12a 3a 112 2221 23 201001129 central processor 40 heat sink fin set 50 electronic component 60
步驟 a 12Step a 12