201000373 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種發光二極體組合’特別係指一種可有 效保護發光二極體之發光二極體、纟且合。 【先前技術】 隨著發光效率之提升，發光二極體已被越來越廣 泛地 應用到各個領域當中，如住宅照明燈、工業照明燈及交通 指不燈等等。在該等應用當中，通常將複數發光二極體串 接到多塊電路板上組成多個發光二極體模組，以便將電流 同時輸入進該等發光二極體内，進而驅動其向外輸出光線。 在完成發光二極體與電路板間之組裝之後，需將該等 f極體模組包裝起來以方便下—步之運輸。傳統之發 "極體模組之包装方法係將每一發光二極體模組封入一 對叙塑：包裳袋之内，然後再將該等塑膠包裝袋統一裝 2化内。藉由該種方法’可將大量之發光二極體模 、、 使之分別封裝於複數個包裝箱内，當需要運 發光二極體模組時，只須逐個地搬運該等包裝箱即 ^ 發光二極體模組之運輸提供了極大之便利。 ㈣ϋ &於發光二極體模組係採用塑勝袋進行包裝，而 塑膠袋之袋壁較薄，邋 ,, 導致其不能有效地缓衝外界之衝擊。 撞整r = ㈣顛簸’將會導致發光二極體模組間相互 ，為劇烈，容易造成發光二極體損壞。 【發明内容】 6 201000373 有馨於此，實有必要提供一種可有效保護發光二極體 之發光二極體組合。 一種發光二極體組合，其包括—發光二極體模組及一 包裝盒，該包裝盒包括一容置發光二極體模組之框體及一 固定至框體上並覆蓋住發光二極體模組之蓋板。 與習知技術相比，本發明之發光二極體組合採用包裝 盒對發光二極體模組進行包裝，其較厚之盒壁可有效地緩 衝來自外部之衝冑’確保發光二極體模組在運輸過程中不 會受到外界之撞擊以至於損壞。 【實施方式】 凊參閱圖1及圖2,本發明之發光二極體組合包括一發 光一極體模組10、一貼設於發光二極體模組1〇下方之導熱 膠帶20及一包封發光二極體模組1〇及導熱膠帶2〇之包裝 盒50。 發光二極體模組1〇包括一電路板12及複數安裝於電 路板12上之發光二極體14。該電路板12呈矩形之長條狀， 其頂面等距地固設該等發光二極體14，以將發光二極體14 所產生之光線均勻地輻射出去。 導熱膠帶20設置於發光二極體模組下方，其與電 路板12等長。該導熱膠帶2〇之面積小於電路板12之面積， 其用於貼設於電路板12之底面，以將發光二極體模組1〇 固定至相應之結構（圖未示）上。 包裝盒50包括一收容發光二極體模組10及導熱膠帶 7 201000373 2〇之框體30及一覆蓋住發光二極體模組10及導熱膠帶20 之蓋板40。在本發明當中，該框體3〇及蓋板4〇之厚度均 控制在0.5毫米至5毫米之範圍内，以對容置於其中之發光 一極體模組10起到一良好之保護作用，防止其受外界之撞 擊而損壞。 —請一併參閱圖3-4,框體30包括一容置部32、分別自 容置部32四周緣垂直向上延伸之二相對之第一侧壁％及 二相對之第二側壁36、38 (如圖2)及自二第—側壁別頂 4水平向内形成之二折邊39。該容置部％由一矩形之底板 32〇、分別自絲320相對兩側傾斜向外延伸之二狐型之 接部3U及分別水平連接於二連接部322末端之二支撐邻 同形成。容置部32與二第二侧壁％、 共同圍設出一口徑自下至上逐漸增大之溝槽326，1且有 =:弧形之内壁面（圖未標)及二相對之平坦：二 (圖未標該溝槽326之深度大於導熱膠帶2 面 以將導熱膠帶20完全收容於其中（如圖4)。 =度’ 付於底板320,其用於與電路板12之底面相接觸〇 = 接發光二極體模組1〇。所述二第一侧壁％八 7 324之最外端賢直向上延伸而出，其高度略1於發；支= 模組H)之整體厚度，以將發光二極體模《且1〇 ^-極體 框體30内；二第二側壁36、38分別自底板於 端豎直向上延伸而出，其中_第二側壁3 相對兩 34及二折邊39,從而將框體3〇之一入要一弟一側壁 另-第二側壁3 8則僅連接二第_側壁主（如圖2 ) ’ ▲料之中下部區域並 8 201000373 與二折邊39隔_離，以在其與二折邊％ 板师設之間隙（如圖3)。二折邊39分別水平形成：二 第一侧壁34頂部，每-折邊39之寬度與支撐部324之寬 度=上如，4)’以對蓋板4〇進行限位，防止其從框體 30内脫落。 之長度相等，寬度略小於框 其沿折邊39與第二侧壁38 ’以覆蓋住發光二極體模組 蓋板40之長度與框體3〇 體30二第一側壁34間之距離， 間之間隙水平插設入框體3〇内 10 ° 組裝該發光二極體細人技 、'、口夺將底面貼有導熱膠帶20之 發光二極體模組10置於栢妒如★ .r ^ ^ ^ ^ 、杧體30内，使導熱膠帶20收容於 框體30之溝槽326中，此拖辦 ,^ A Τ此時框體30之支撐部324抵靠於 么光一極體模組10之底面。缺後 - “、、傻再將盍板40穿過折邊39 與弟一側壁38間之間隙，蚀甘 …一 U+、使其—端滑動至抵靠於框體30 之弟二側壁36 ’從而將發光-炻 竹赞尤一極體模組10完全收容於包裝 盒50内。 與習知技術相比，本發明夕旅止 不七Θ之發光二極體組合採用包裝 盒50對發光二極體模纟 俱組1U進仃包裝，其較厚之盒壁可對 外界之衝擊起到一良好之绥徐 氏邶之級衝作用，從而防止因相互撞擊 而造成發光二極體模組1〇之損壞。 可以理解地，為在保護發光二極體模組忉之同時可對 發光一極體14進行靜電防導 4 砰电丨万A，包裴盒5〇可採用習知技術中 已知之防靜電材料製成，如臂斟 取如水對本二甲酸乙二醇酯（pet ) 〇 9 201000373 综上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例， 自不能以此限制本案之中請專利範圍。舉凡熟悉本案技敲 =人士援依本發明之精神所作之等效修飾或變化，皆應 盍於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明發光二極體 體組合之立體組裝圖。 圖2係圖1之分解圖。 圖3係圖1之部分分解圖， 部分開啟。 此時發光二極體組合之蓋板 圖4係圖1之截面圖。 主要元件符號說明 ] 發光二極體模組 10 發光二極體 14 框體 30 底板 320 支撐部 324 第一侧壁 34 折邊 39 包裝盒 50 電路板 12 導熱膠帶 20 &置部 32 連接部 322 溝槽 326 第二側壁 36、38 蓋板 40201000373 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode assembly, particularly to a light-emitting diode that effectively protects a light-emitting diode. [Prior Art] With the improvement of luminous efficiency, light-emitting diodes have been more and more widely used in various fields, such as residential lighting, industrial lighting, and traffic light. In these applications, a plurality of light-emitting diodes are usually connected in series to a plurality of circuit boards to form a plurality of light-emitting diode modules, so that current is simultaneously input into the light-emitting diodes, thereby driving the light-emitting diodes outward. Output light. After the assembly between the light-emitting diode and the circuit board is completed, the f-pole modules are packaged to facilitate the transportation of the next step. The traditional method of packaging the polar body module is to seal each of the light-emitting diode modules into a pair of plastic products: inside the bag, and then the plastic packaging bags are uniformly installed. With this method, a large number of light-emitting diodes can be molded and packaged in a plurality of packages. When the light-emitting diode modules are required to be transported, the packages need to be transported one by one. The transportation of the LED module provides great convenience. (4) ϋ & The LED module is packaged in a plastic bag, and the wall of the bag is thin and sturdy, which prevents it from effectively buffering the impact of the outside world. Colliding r = (four) bumps will cause the light-emitting diode modules to be mutually violent and easily cause damage to the light-emitting diodes. SUMMARY OF THE INVENTION 6 201000373 It is necessary to provide a combination of light-emitting diodes that can effectively protect the light-emitting diodes. A light emitting diode assembly comprising: a light emitting diode module and a package, the package comprising a frame for accommodating the light emitting diode module and a frame fixed to the frame and covering the light emitting diode The cover of the body module. Compared with the prior art, the light-emitting diode assembly of the present invention uses a packaging box to package the light-emitting diode module, and the thicker wall of the box can effectively buffer the punch from the outside to ensure the light-emitting diode mold. The group is not damaged by the outside world during transportation and is damaged. [Embodiment] Referring to FIG. 1 and FIG. 2, the LED assembly of the present invention comprises a light-emitting diode module 10, a thermal conductive tape 20 attached to the underside of the LED module, and a package. The package of the light-emitting diode module 1 and the thermal conductive tape 2 is sealed. The LED module 1 includes a circuit board 12 and a plurality of LEDs 14 mounted on the circuit board 12. The circuit board 12 has a rectangular strip shape, and the light emitting diodes 14 are fixed at equal intervals on the top surface thereof to uniformly radiate the light generated by the light emitting diodes 14. The thermal conductive tape 20 is disposed under the light emitting diode module and is as long as the circuit board 12. The area of the thermal conductive tape 2 is smaller than the area of the circuit board 12, and is used for attaching to the bottom surface of the circuit board 12 to fix the LED module 1 to the corresponding structure (not shown). The package 50 includes a frame 30 for housing the LED module 10 and the thermal conductive tape 7 201000373 2 , and a cover 40 covering the LED module 10 and the thermal tape 20 . In the present invention, the thickness of the frame 3〇 and the cover 4〇 are controlled within a range of 0.5 mm to 5 mm to provide a good protection for the light-emitting monopole module 10 accommodated therein. To prevent it from being damaged by external impact. - Referring to FIG. 3-4 together, the frame body 30 includes a receiving portion 32, two opposite first sidewalls and two opposite sidewalls 36 and 38 extending from the peripheral edge of the receiving portion 32. (Fig. 2) and the two folds 39 formed horizontally inward from the top of the second side wall. The accommodating portion is formed by a rectangular bottom plate 32, two fox-shaped connecting portions 3U extending obliquely outward from opposite sides of the wire 320, and two supporting portions horizontally connected to the ends of the two connecting portions 322, respectively. The accommodating portion 32 and the second second side wall % together define a groove 326, 1 which gradually increases from bottom to top, and has a curved inner wall surface (not shown) and two opposite flat surfaces: (The depth of the groove 326 is not shown to be larger than the surface of the thermal conductive tape 2 to completely accommodate the thermal conductive tape 20 therein (Fig. 4). The degree = is applied to the bottom plate 320 for contact with the bottom surface of the circuit board 12. = connected to the LED module 1 〇. The outermost ends of the two first side walls % 八 7 324 extend straight upwards, the height of which is slightly less than the hair; the total thickness of the support = module H) The light-emitting diode mold "and the inside of the body frame 30; the second side walls 36, 38 respectively extend vertically upward from the bottom plate at the end, wherein the second side wall 3 is opposite to the two 34 and two folds The edge 39, so that one of the frame 3〇 is to be a younger side, the second side wall 38 is connected only to the second side wall (Fig. 2) ' ▲ middle and lower area and 8 201000373 and 20% off Edge 39 is separated from _ to the gap between it and the two-folder (see Figure 3). The two folded edges 39 are respectively formed horizontally: the tops of the two first side walls 34, the width of each of the folded edges 39 and the width of the support portion 324 = as shown, 4) 'to limit the cover 4 , to prevent it from the frame The body 30 falls off. The lengths are equal, and the width is slightly smaller than the distance between the frame along the flange 39 and the second side wall 38' to cover the length of the LED module cover 40 and the first side wall 34 of the frame 3 body 30 and the second side wall 34. The gap between the gaps is horizontally inserted into the frame body 3〇 10 ° to assemble the light-emitting diodes, and the light-emitting diode module 10 with the thermal conductive tape 20 on the bottom surface is placed in the cypress. r ^ ^ ^ ^ , in the body 30, the thermal tape 20 is received in the groove 326 of the frame 30, and the support portion 324 of the frame 30 abuts against the light-polar one. The bottom of the group 10. After the lack - ",, silly, then the seesaw 40 through the gap between the flange 39 and the side wall 38 of the brother, eclipse... a U+, so that the end slides against the side wall 36' of the frame 30 Therefore, the illuminating-炻竹赞尤一极体 module 10 is completely housed in the package 50. Compared with the prior art, the luminous illuminating diode assembly of the present invention is packaged with 50 pairs of light-emitting diodes. The 1U-in-one package of the pole-shaped module is made of thicker ones, which can play a good role in the impact of the outside world on the impact of the outside, thus preventing the LED module 1 from colliding with each other.损坏 损坏 。 。 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以 可以Known as anti-static materials, such as arm extraction such as water to the ethylene glycol diester (pet) 〇9 201000373 In summary, the present invention has indeed met the requirements of the invention patent, and filed a patent application according to law. The description is only a preferred embodiment of the present invention, and it is not possible to limit the case in this case. The equivalent modifications or variations made by the person skilled in the art and in accordance with the spirit of the present invention are all within the scope of the following patent application. [Simplified Schematic] FIG. 1 is a light-emitting diode body of the present invention. Fig. 2 is an exploded view of Fig. 1. Fig. 3 is a partial exploded view of Fig. 1, partially opened. At this time, the cover plate of the light emitting diode assembly is shown in Fig. 1. The main component symbol Description] Light-emitting diode module 10 Light-emitting diode 14 Frame 30 Base plate 320 Support portion 324 First side wall 34 Folding 39 Package 50 Circuit board 12 Thermal tape 20 & Part 32 Connection portion 322 Groove 326 Second side wall 36, 38 cover 40