TWI393664B - Led assembly - Google Patents
Led assembly Download PDFInfo
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- TWI393664B TWI393664B TW97124086A TW97124086A TWI393664B TW I393664 B TWI393664 B TW I393664B TW 97124086 A TW97124086 A TW 97124086A TW 97124086 A TW97124086 A TW 97124086A TW I393664 B TWI393664 B TW I393664B
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- emitting diode
- light
- frame
- light emitting
- side wall
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
本發明涉及一種發光二極體組合,特別係指一種可有效保護發光二極體之發光二極體組合。 The invention relates to a light emitting diode combination, in particular to a light emitting diode combination which can effectively protect a light emitting diode.
隨著發光效率之提升,發光二極體已被越來越廣泛地應用到各個領域當中,如住宅照明燈、工業照明燈及交通指示燈等等。在該等應用當中,通常將複數發光二極體串接到多塊電路板上組成多個發光二極體模組,以便將電流同時輸入進該等發光二極體內,進而驅動其向外輸出光線。 With the improvement of luminous efficiency, light-emitting diodes have been more and more widely used in various fields, such as residential lighting, industrial lighting and traffic lights. In these applications, a plurality of light-emitting diodes are usually connected in series to a plurality of circuit boards to form a plurality of light-emitting diode modules, so that current is simultaneously input into the light-emitting diodes, thereby driving the external output. Light.
在完成發光二極體與電路板間之組裝之後,需將該等發光二極體模組包裝起來以方便下一步之運輸。傳統之發光二極體模組之包裝方法係將每一發光二極體模組封入一對應之塑膠包裝袋之內,然後再將該等塑膠包裝袋統一裝入一包裝箱內。藉由該種方法,可將大量之發光二極體模組化零為整,使之分別封裝於複數個包裝箱內,當需要運送該等發光二極體模組時,只須逐個地搬運該等包裝箱即可,為發光二極體模組之運輸提供了極大之便利。 After the assembly between the light-emitting diode and the circuit board is completed, the light-emitting diode modules are packaged to facilitate the next transportation. The conventional LED module packaging method encloses each LED module into a corresponding plastic packaging bag, and then uniformly packs the plastic packaging bags into a package. According to this method, a large number of the light-emitting diodes can be modularized into a plurality of packages, and are respectively packaged in a plurality of packages. When the light-emitting diode modules need to be transported, they need to be transported one by one. These boxes can be used to provide great convenience for the transportation of the LED module.
惟,由於發光二極體模組係採用塑膠袋進行包裝,而塑膠袋之袋壁較薄,導致其不能有效地緩衝外界之衝擊。如若運輸過程較為顛簸,將會導致發光二極體模組間相互撞擊較為劇烈,容易造成發光二極體損壞。 However, since the LED module is packaged in a plastic bag, and the bag wall of the plastic bag is thin, it cannot effectively buffer the external impact. If the transportation process is bumpy, it will cause the LED modules to collide with each other more severely, which may cause damage to the LED.
有鑒於此,實有必要提供一種可有效保護發光二極體之發光二極體組合。 In view of this, it is necessary to provide a light emitting diode combination that can effectively protect the light emitting diode.
一種發光二極體組合,其包括一發光二極體模組及一包裝盒,該包裝盒包括一容置發光二極體模組之框體及一固定至框體上並覆蓋住發光二極體模組之蓋板。 A light emitting diode assembly comprising a light emitting diode module and a package, the package comprising a frame for accommodating the LED module and being fixed to the frame and covering the light emitting diode The cover of the body module.
與習知技術相比,本發明之發光二極體組合採用包裝盒對發光二極體模組進行包裝,其較厚之盒壁可有效地緩衝來自外部之衝擊,確保發光二極體模組在運輸過程中不會受到外界之撞擊以至於損壞。 Compared with the prior art, the LED assembly of the present invention uses a packaging box to package the LED module, and the thicker wall can effectively buffer the impact from the outside to ensure the LED module. It is not damaged by the outside world during transportation and is damaged.
10‧‧‧發光二極體模組 10‧‧‧Lighting diode module
12‧‧‧電路板 12‧‧‧ boards
14‧‧‧發光二極體 14‧‧‧Lighting diode
20‧‧‧導熱膠帶 20‧‧‧ Thermal Tape
30‧‧‧框體 30‧‧‧ frame
32‧‧‧容置部 32‧‧‧ 容部
320‧‧‧底板 320‧‧‧floor
322‧‧‧連接部 322‧‧‧Connecting Department
324‧‧‧支撐部 324‧‧‧Support
326‧‧‧溝槽 326‧‧‧ trench
34‧‧‧第一側壁 34‧‧‧First side wall
36、38‧‧‧第二側壁 36, 38‧‧‧ second side wall
39‧‧‧折邊 39‧‧‧Folding
40‧‧‧蓋板 40‧‧‧ Cover
50‧‧‧包裝盒 50‧‧‧Package box
圖1係本發明發光二極體組合之立體組裝圖。 1 is a perspective assembled view of a light emitting diode assembly of the present invention.
圖2係圖1之分解圖。 Figure 2 is an exploded view of Figure 1.
圖3係圖1之部分分解圖,此時發光二極體組合之蓋板部分開啟。 Figure 3 is a partially exploded view of Figure 1 with the cover portion of the LED assembly turned on.
圖4係圖1之截面圖。 Figure 4 is a cross-sectional view of Figure 1.
請參閱圖1及圖2,本發明之發光二極體組合包括一發光二極體模組10、一貼設於發光二極體模組10下方之導熱膠帶20及一包封發光二極體模組10及導熱膠帶20之包裝盒50。 Referring to FIG. 1 and FIG. 2 , the LED assembly of the present invention comprises a light emitting diode module 10 , a thermal conductive tape 20 attached to the lower portion of the LED module 10 , and an encapsulated LED. The module 10 and the package 50 of the thermal tape 20.
發光二極體模組10包括一電路板12及複數安裝於電路板12上之發光二極體14。該電路板12呈矩形之長條狀,其頂面等距地固設該等發光二極體14,以將發光二極體14所產生之光線均勻地輻射出去。 The LED module 10 includes a circuit board 12 and a plurality of LEDs 14 mounted on the circuit board 12. The circuit board 12 has a rectangular strip shape, and the light emitting diodes 14 are fixed on the top surface thereof equidistantly to uniformly radiate the light generated by the light emitting diodes 14.
導熱膠帶20設置於發光二極體模組10下方,其與電路板12等長。該導熱膠帶20之面積小於電路板12之面積,其用於貼設於電路板12之底面,以將發光二極體模組10固定至相應之結構(圖未示)上。 The thermal conductive tape 20 is disposed under the LED module 10 and is equal to the circuit board 12 . The area of the thermal conductive tape 20 is smaller than the area of the circuit board 12, and is applied to the bottom surface of the circuit board 12 to fix the LED module 10 to a corresponding structure (not shown).
包裝盒50包括一收容發光二極體模組10及導熱膠帶20之框體30及一覆蓋住 發光二極體模組10及導熱膠帶20之蓋板40。在本發明當中,該框體30及蓋板40之厚度均控制在0.5毫米至5毫米之範圍內,以對容置於其中之發光二極體模組10起到一良好之保護作用,防止其受外界之撞擊而損壞。 The package 50 includes a frame 30 for housing the LED module 10 and the thermal tape 20, and a cover 30 The light emitting diode module 10 and the cover 40 of the thermal conductive tape 20 are provided. In the present invention, the thickness of the frame 30 and the cover 40 are controlled within a range of 0.5 mm to 5 mm to provide a good protection against the LED module 10 accommodated therein. It is damaged by the impact of the outside world.
請一併參閱圖3-4,框體30包括一容置部32、分別自容置部32四周緣垂直向上延伸之二相對之第一側壁34及二相對之第二側壁36、38(如圖2)及自二第一側壁34頂部水平向內形成之二折邊39。該容置部32由一矩形之底板320、分別自底板320相對兩側傾斜向外延伸之二弧型之連接部322及分別水平連接於二連接部322末端之二支撐部324共同形成。容置部32與二第二側壁36、38之下部區域共同圍設出一口徑自下至上逐漸增大之溝槽326,其具有二相對之弧形之內壁面(圖未標)及二相對之平坦之內壁面(圖未標)。該溝槽326之深度大於導熱膠帶20之厚度,以將導熱膠帶20完全收容於其中(如圖4)。二支撐部324平行於底板320,其用於與電路板12之底面相接觸,以承接發光二極體模組10。所述二第一側壁34分別自二支撐部324之最外端豎直向上延伸而出,其高度略大於發光二極體模組10之整體厚度,以將發光二極體模組10完全收容於框體30內;二第二側壁36、38分別自底板320之相對兩端豎直向上延伸而出,其中一第二側壁36連接二第一側壁34及二折邊39,從而將框體30之一端完全封住(如圖2),另一第二側壁38則僅連接二第一側壁34之中下部區域並與二折邊39隔開距離,以在其與二折邊39間形成一供蓋板40插設之間隙(如圖3)。二折邊39分別水平形成於二第一側壁34頂部,每一折邊39之寬度與支撐部324之寬度相等(如圖4),以對蓋板40進行限位,防止其從框體30內脫落。 Referring to FIG. 3-4, the frame body 30 includes a receiving portion 32, and two opposite first sidewalls 34 and two opposite sidewalls 36 and 38 extending from the peripheral edge of the receiving portion 32. 2) and a two-folded edge 39 formed horizontally inward from the top of the two first side walls 34. The accommodating portion 32 is formed by a rectangular bottom plate 320, a two-arc connection portion 322 extending obliquely outward from opposite sides of the bottom plate 320, and two support portions 324 horizontally connected to the ends of the two connecting portions 322, respectively. The accommodating portion 32 and the lower portion of the second side walls 36, 38 together define a groove 326 which gradually increases from bottom to top, and has two opposite curved inner wall surfaces (not shown) and two opposite sides. Flat inner wall (not shown). The depth of the groove 326 is greater than the thickness of the thermal tape 20 to completely receive the thermal tape 20 therein (see FIG. 4). The two supporting portions 324 are parallel to the bottom plate 320 for contacting the bottom surface of the circuit board 12 to receive the LED module 10. The two first side walls 34 extend vertically upward from the outermost ends of the two supporting portions 324 respectively, and the height thereof is slightly larger than the overall thickness of the LED module 10 to completely accommodate the LED module 10 . The second sidewalls 36 and 38 extend vertically upward from opposite ends of the bottom plate 320. One of the second sidewalls 36 connects the first sidewall 34 and the two flanges 39 to form the frame. 30 is completely sealed at one end (as shown in FIG. 2), and the other second side wall 38 is connected only to the lower middle portion of the two first side walls 34 and spaced apart from the two folded edges 39 to form between the two folded edges 39. A gap for the cover plate 40 is inserted (as shown in Fig. 3). The two folded edges 39 are horizontally formed on the top of the two first side walls 34, and the width of each of the folded edges 39 is equal to the width of the support portion 324 (as shown in FIG. 4) to limit the cover 40 to prevent it from the frame 30. Falling inside.
蓋板40之長度與框體30之長度相等,寬度略小於框體30二第一側壁34間之距離,其沿折邊39與第二側壁38間之間隙水平插設入框體30內,以覆蓋住發光二極體模組10。 The length of the cover 40 is equal to the length of the frame 30, and the width is slightly smaller than the distance between the first side walls 34 of the frame 30. The gap between the flanges 39 and the second side walls 38 is horizontally inserted into the frame 30. To cover the LED module 10 .
組裝該發光二極體組合時,將底面貼有導熱膠帶20之發光二極體模組10置於框體30內,使導熱膠帶20收容於框體30之溝槽326中,此時框體30之支撐部324抵靠於發光二極體模組10之底面。然後再將蓋板40穿過折邊39與第二側壁38間之間隙,使其一端滑動至抵靠於框體30之第二側壁36,從而將發光二極體模組10完全收容於包裝盒50內。 When the LED assembly is assembled, the LED module 10 with the thermal conductive tape 20 on the bottom surface is placed in the frame 30, and the thermal tape 20 is received in the groove 326 of the frame 30. The support portion 324 of the 30 is abutted against the bottom surface of the LED module 10. Then, the cover 40 is passed through the gap between the flange 39 and the second side wall 38, and one end is slid to abut against the second side wall 36 of the frame 30, thereby completely accommodating the LED module 10 in the package. Inside the box 50.
與習知技術相比,本發明之發光二極體組合採用包裝盒50對發光二極體模組10進行包裝,其較厚之盒壁可對外界之衝擊起到一良好之緩衝作用,從而防止因相互撞擊而造成發光二極體模組10之損壞。 Compared with the prior art, the LED assembly of the present invention uses the package 50 to package the LED module 10, and the thicker wall can provide a good buffering effect on the external impact. Prevent damage to the LED module 10 due to mutual impact.
可以理解地,為在保護發光二極體模組10之同時可對發光二極體14進行靜電防護,包裝盒50可採用習知技術中已知之防靜電材料製成,如聚對苯二甲酸乙二醇酯(PET)。 It can be understood that the LEDs 14 can be electrostatically protected while protecting the LED module 10. The package 50 can be made of an antistatic material known in the prior art, such as polyterephthalic acid. Ethylene glycol ester (PET).
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
30‧‧‧框體 30‧‧‧ frame
40‧‧‧蓋板 40‧‧‧ Cover
50‧‧‧包裝盒 50‧‧‧Package box
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW97124086A TWI393664B (en) | 2008-06-27 | 2008-06-27 | Led assembly |
Applications Claiming Priority (1)
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TW97124086A TWI393664B (en) | 2008-06-27 | 2008-06-27 | Led assembly |
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TW201000373A TW201000373A (en) | 2010-01-01 |
TWI393664B true TWI393664B (en) | 2013-04-21 |
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Citations (1)
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CN100387919C (en) * | 2004-06-25 | 2008-05-14 | 株式会社东芝 | Refrigerator |
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CN100387919C (en) * | 2004-06-25 | 2008-05-14 | 株式会社东芝 | Refrigerator |
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