TWI393664B - Led assembly - Google Patents

Description

Light-emitting diode combination

The invention relates to a light emitting diode combination, in particular to a light emitting diode combination which can effectively protect a light emitting diode.

With the improvement of luminous efficiency, light-emitting diodes have been more and more widely used in various fields, such as residential lighting, industrial lighting and traffic lights. In these applications, a plurality of light-emitting diodes are usually connected in series to a plurality of circuit boards to form a plurality of light-emitting diode modules, so that current is simultaneously input into the light-emitting diodes, thereby driving the external output. Light.

After the assembly between the light-emitting diode and the circuit board is completed, the light-emitting diode modules are packaged to facilitate the next transportation. The conventional LED module packaging method encloses each LED module into a corresponding plastic packaging bag, and then uniformly packs the plastic packaging bags into a package. According to this method, a large number of the light-emitting diodes can be modularized into a plurality of packages, and are respectively packaged in a plurality of packages. When the light-emitting diode modules need to be transported, they need to be transported one by one. These boxes can be used to provide great convenience for the transportation of the LED module.

However, since the LED module is packaged in a plastic bag, and the bag wall of the plastic bag is thin, it cannot effectively buffer the external impact. If the transportation process is bumpy, it will cause the LED modules to collide with each other more severely, which may cause damage to the LED.

In view of this, it is necessary to provide a light emitting diode combination that can effectively protect the light emitting diode.

A light emitting diode assembly comprising a light emitting diode module and a package, the package comprising a frame for accommodating the LED module and being fixed to the frame and covering the light emitting diode The cover of the body module.

Compared with the prior art, the LED assembly of the present invention uses a packaging box to package the LED module, and the thicker wall can effectively buffer the impact from the outside to ensure the LED module. It is not damaged by the outside world during transportation and is damaged.

10‧‧‧Lighting diode module

12‧‧‧ boards

14‧‧‧Lighting diode

20‧‧‧ Thermal Tape

30‧‧‧ frame

32‧‧‧ 容部

320‧‧‧floor

322‧‧‧Connecting Department

324‧‧‧Support

326‧‧‧ trench

34‧‧‧First side wall

36, 38‧‧‧ second side wall

39‧‧‧Folding

40‧‧‧ Cover

50‧‧‧Package box

1 is a perspective assembled view of a light emitting diode assembly of the present invention.

Figure 2 is an exploded view of Figure 1.

Figure 3 is a partially exploded view of Figure 1 with the cover portion of the LED assembly turned on.

Figure 4 is a cross-sectional view of Figure 1.

Referring to FIG. 1 and FIG. 2 , the LED assembly of the present invention comprises a light emitting diode module 10 , a thermal conductive tape 20 attached to the lower portion of the LED module 10 , and an encapsulated LED. The module 10 and the package 50 of the thermal tape 20.

The LED module 10 includes a circuit board 12 and a plurality of LEDs 14 mounted on the circuit board 12. The circuit board 12 has a rectangular strip shape, and the light emitting diodes 14 are fixed on the top surface thereof equidistantly to uniformly radiate the light generated by the light emitting diodes 14.

The thermal conductive tape 20 is disposed under the LED module 10 and is equal to the circuit board 12 . The area of the thermal conductive tape 20 is smaller than the area of the circuit board 12, and is applied to the bottom surface of the circuit board 12 to fix the LED module 10 to a corresponding structure (not shown).

The package 50 includes a frame 30 for housing the LED module 10 and the thermal tape 20, and a cover 30 The light emitting diode module 10 and the cover 40 of the thermal conductive tape 20 are provided. In the present invention, the thickness of the frame 30 and the cover 40 are controlled within a range of 0.5 mm to 5 mm to provide a good protection against the LED module 10 accommodated therein. It is damaged by the impact of the outside world.

Referring to FIG. 3-4, the frame body 30 includes a receiving portion 32, and two opposite first sidewalls 34 and two opposite sidewalls 36 and 38 extending from the peripheral edge of the receiving portion 32. 2) and a two-folded edge 39 formed horizontally inward from the top of the two first side walls 34. The accommodating portion 32 is formed by a rectangular bottom plate 320, a two-arc connection portion 322 extending obliquely outward from opposite sides of the bottom plate 320, and two support portions 324 horizontally connected to the ends of the two connecting portions 322, respectively. The accommodating portion 32 and the lower portion of the second side walls 36, 38 together define a groove 326 which gradually increases from bottom to top, and has two opposite curved inner wall surfaces (not shown) and two opposite sides. Flat inner wall (not shown). The depth of the groove 326 is greater than the thickness of the thermal tape 20 to completely receive the thermal tape 20 therein (see FIG. 4). The two supporting portions 324 are parallel to the bottom plate 320 for contacting the bottom surface of the circuit board 12 to receive the LED module 10. The two first side walls 34 extend vertically upward from the outermost ends of the two supporting portions 324 respectively, and the height thereof is slightly larger than the overall thickness of the LED module 10 to completely accommodate the LED module 10 . The second sidewalls 36 and 38 extend vertically upward from opposite ends of the bottom plate 320. One of the second sidewalls 36 connects the first sidewall 34 and the two flanges 39 to form the frame. 30 is completely sealed at one end (as shown in FIG. 2), and the other second side wall 38 is connected only to the lower middle portion of the two first side walls 34 and spaced apart from the two folded edges 39 to form between the two folded edges 39. A gap for the cover plate 40 is inserted (as shown in Fig. 3). The two folded edges 39 are horizontally formed on the top of the two first side walls 34, and the width of each of the folded edges 39 is equal to the width of the support portion 324 (as shown in FIG. 4) to limit the cover 40 to prevent it from the frame 30. Falling inside.

The length of the cover 40 is equal to the length of the frame 30, and the width is slightly smaller than the distance between the first side walls 34 of the frame 30. The gap between the flanges 39 and the second side walls 38 is horizontally inserted into the frame 30. To cover the LED module 10 .

When the LED assembly is assembled, the LED module 10 with the thermal conductive tape 20 on the bottom surface is placed in the frame 30, and the thermal tape 20 is received in the groove 326 of the frame 30. The support portion 324 of the 30 is abutted against the bottom surface of the LED module 10. Then, the cover 40 is passed through the gap between the flange 39 and the second side wall 38, and one end is slid to abut against the second side wall 36 of the frame 30, thereby completely accommodating the LED module 10 in the package. Inside the box 50.

Compared with the prior art, the LED assembly of the present invention uses the package 50 to package the LED module 10, and the thicker wall can provide a good buffering effect on the external impact. Prevent damage to the LED module 10 due to mutual impact.

It can be understood that the LEDs 14 can be electrostatically protected while protecting the LED module 10. The package 50 can be made of an antistatic material known in the prior art, such as polyterephthalic acid. Ethylene glycol ester (PET).

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

30‧‧‧ frame

40‧‧‧ Cover

50‧‧‧Package box

Claims (6)

A light emitting diode assembly comprising a light emitting diode module, wherein the light emitting diode assembly further comprises a package, the package comprising a frame for accommodating the light emitting diode module and a frame The cover is fixed to the frame and covers the cover of the LED module. One end of the frame is closed, and the other end defines a gap for inserting the cover. The frame includes a receiving portion and a self-receiving portion. The peripheral edge forms four side walls and two folded edges extending from opposite sides of the opposite side walls, and the light emitting diode module abuts against the accommodating portion, and the side wall of the frame body includes two opposite first side walls and two opposite second portions. The side wall and the light emitting diode module are disposed between the first side wall and the second side wall, and the receiving portion and the second side wall jointly define a groove with a diameter increasing from bottom to top, and the light emitting diode The body module rests above the groove. The light-emitting diode assembly of claim 1, wherein the cover plate is slidably inserted into the casing. The light emitting diode assembly of claim 1, wherein a second side wall connects the two first side walls and the two folded sides to close one end of the frame body, and the other second side wall connects the partial areas of the two first side walls. And separated from the flange. The light-emitting diode assembly of claim 1, wherein the groove has two opposite curved inner wall faces and the other two opposite flat inner wall faces. The light-emitting diode assembly of claim 1, wherein the light-emitting diode assembly further comprises a thermal conductive tape attached to the light-emitting diode module, which is received in the trench of the frame. The light-emitting diode assembly of claim 1, wherein the package is made of an electrostatic protection material.