200951165 九、發明說明： 【發明所屬之技術領域】 • 本發明係有關於一種樹脂預浸體組成膠液、散熱膠片 及其製造方法，尤指一種具有高導熱效率的樹脂預浸體組 成膠液、散熱膠片及其製造方法。 【先前技術】 目前電路板所應用的層面及領域相當廣泛，一般電子 ❹ 產品内的電子元件都插設在電路板中，而現今的電路板為 了符合高功率及尚熱量之元件的應用範圍，故在電路板的 散熱功效上進行開發及研究，以提高電路板的散熱效率及 高功率。 在傳統的電路板構造上，由於插設於其上的電子元件 數量及消耗功率較低，電子元件所產生的熱量大都可藉由 電路板中的銅箔層進行熱傳導並向外散熱，將熱直接散逸 ^ 至環境，利用空氣的對流達成電子元件溫度的控制。然而 9 隨著資訊量及運算速度的提高，現今電路板上所佈設的電 子元件功率高且數量又多，伴隨而來的問題便是所消耗的 電功率增加，導致在局部耗電元件上產生大量的熱’致使 電路板溫度升高，直接或間接影響元件的功能及產品的可 : 靠度。 為了避免電路板的聚熱現象使元件功能無法正常運 作，電路板的製作技術不斷演進，例如提升耐熱性及高熱 傳導等議題之發展，其中一種廣為應用之電路板散熱技術 6 200951165 果以散逸電藉⑽板的良好散熱效 熱金二提供印刷電路板與散 ,w σ固疋之外，更重要需提供良好的埶傳導之 ΐ利Π緣散熱貼合層可以是—種半固化環氧樹脂膠 =j用熱壓合程序將印刷電路板、絕緣散熱貼合層與散200951165 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a resin prepreg composition glue, a heat dissipating film and a method of manufacturing the same, and more particularly to a resin prepreg composition glue having high thermal conductivity , thermal film and its manufacturing method. [Prior Art] At present, the level and field of application of the circuit board are quite extensive. Generally, electronic components in the electronic ❹ product are inserted in the circuit board, and today's circuit boards are suitable for the application range of components with high power and heat. Therefore, the development and research on the heat dissipation efficiency of the circuit board is carried out to improve the heat dissipation efficiency and high power of the circuit board. In the conventional circuit board structure, due to the low number of electronic components and power consumption, the heat generated by the electronic components can be thermally conducted by the copper foil layer in the circuit board and radiated outward. Directly dissipate ^ to the environment, using air convection to achieve electronic component temperature control. However, with the increase in the amount of information and the speed of operation, the electronic components deployed on today's boards are high in power and quantity, and the attendant problem is that the power consumed is increased, resulting in a large amount of power consumption on the local power components. The heat's cause the temperature of the board to rise, directly or indirectly affecting the function of the component and the product's reliability: In order to avoid the phenomenon of heat accumulation on the board, the function of the board is not functioning properly, and the manufacturing technology of the board is evolving, such as the improvement of heat resistance and high heat conduction. One of the widely used circuit board heat dissipation technologies 6 200951165 The good heat dissipation effect of the (10) board provides the printed circuit board and the bulk, w σ solid, and more importantly, it needs to provide a good 埶 conduction. The heat-dissipating layer can be a kind of semi-cured epoxy. Resin adhesive = j using a thermal compression process to print the printed circuit board, insulation heat bonding layer and dispersion
板充份貼合，而該半固化環氧樹脂膠片係將玻璃纖 維布浸潰於一環氧樹脂預浸體組成膠液，並 續製程而形成-㈣型散_片。 饤乾综專後 習用的環氧樹脂預浸體組成膠液，例如中華民國專利 公開號第2_11927號，利用高比例成份的無機散熱填充 料混入上述環氧樹脂預浸體組成膠液，故使玻璃纖維布在 經過浸潰之後所製成的薄型散熱膠片具有良好的散埶效 果’然而對於㈣的環氧樹脂材料及與其配合的硬化劑、 促進劑、添加劑等調配組成需加以調整，才得以應用於該 高比例含量的無機散熱填充料，否則將導致所製成之薄型 散熱膠片產生易剝落及耐熱性不佳的問題，上述問題的發 生原因大部分均在於硬化劑的選用不當所導致。舉例來 說，習用的環氧樹脂預浸體組成膠液中之環氧樹脂一般採 用本酴或驗酸類環氧樹脂，如雙紛A型環氧樹脂，因此搭 配的硬化劑多會採二氰胺類(DiCy)或苯酚(pN phen〇Uc)類 硬化劑。然而為了提升散熱薄型膠片的散熱功能，該環氧 樹月曰預改體組成膠液成分採用大量的無機散熱填充料粉 7 200951165The board is fully bonded, and the semi-cured epoxy film is obtained by dipping a glass fiber cloth into an epoxy resin prepreg to form a glue, and continuing the process to form a - (four) type dispersion sheet. The epoxy resin prepreg composition glued after the dry specialization, for example, the Republic of China Patent Publication No. 2_11927, the inorganic heat-dissipating filler of a high proportion of components is mixed into the epoxy resin prepreg to form a glue, so that The thin heat-dissipating film made of glass fiber cloth after being impregnated has a good diverging effect. However, it is necessary to adjust the composition of the epoxy resin material and the hardener, accelerator, additive, etc. The application of the high proportion of the inorganic heat-dissipating filler, otherwise the thin heat-dissipating film produced may cause problems of easy peeling and poor heat resistance, and the above-mentioned problems are mostly caused by improper selection of the hardener. For example, the epoxy resin in the epoxy resin prepreg composition is generally made of epoxy resin or acid-based epoxy resin, such as double-type A-type epoxy resin, so the hardener used will be dicyandiline. An amine (DiCy) or phenol (pN phen〇Uc) type hardener. However, in order to improve the heat dissipation function of the heat-dissipating thin film, the epoxy resin moon-shaped pre-formed composition of the glue component uses a large amount of inorganic heat-dissipating filler powder 7 200951165
降低，估迨成相對單位内的交聯樹脂成分用量將被大幅地 :使所浸潰形叙散熱薄_片部分樹㈣特性造成 液二：如採用二氰胺類硬化劑的環氧樹脂預浸體組成膠 題^•的散熱薄型膠片的耐熱性降低，易產生爆板的問 成牒、&彳面採用祕環氧脂硬化劑的環氧樹脂預浸體組 較:1所製成的散熱薄型膠片的附著能力降低，因此添加 瓿广更化劑含量的環氧樹脂預浸體組成膠液所製成的散 片=型勝>1之㈣性會降低，反之若添加孩，散熱薄型膠 產難以固化，亦即上述之硬化劑可能導致散熱薄型膠片 生易爆板或附著性不佳的問題，故均不適用於散熱薄型 膠片的製作。 緣 δ十合理 是，本發明人有感上述缺失之可改善，提出一種設 且有效改善上述缺失之本發明。 【發明内容】 本發明之主要目的，在於提供一種硬化劑及具有該硬 化劑的環氧樹脂預浸體組成膠液，該硬化劑的添加，可使 所製成的散熱膠片 兼顧财熱性及附著性，且該硬化劑的結 構具有極性’故可將混入該膠液中的無機粉體均勻地分散 於該環氣樹脂預浸體組成膠液中。 本發明之再一目的，係對上述的環氧樹脂預浸體組成 膠液加以改良以提升玻璃纖維布浸潰於該環氧樹脂預浸 體組成膠液所製成之散熱膠片可以有更佳的散熱效果及 良好的加工性。 8 200951165 為了達成上述之目的，本發明係提供一種樹脂預浸體 組成勝液’係由組份⑷：環氧樹脂；以及組份⑻：如 式（I )所示之硬化劑所組成。 式（I )Decrease, it is estimated that the amount of cross-linking resin component in the relative unit will be greatly reduced: the impregnation of the heat-dissipating thin film part of the tree (four) characteristics caused by liquid two: such as epoxy resin with dicyandiamide hardener The heat-dissipation of the heat-dissipating thin film of the immersion body is reduced, and the epoxy resin prepreg group which is easy to produce the blasting plate and the enamel surface is made of epoxy resin hardener. The heat-dissipating thin film has a reduced adhesion capability, so that the epoxy resin prepared by adding the epoxy resin prepreg to the glue composition can reduce the (4) property of the film, and if it is added, The heat-dissipating thin-type adhesive is difficult to cure, that is, the above-mentioned hardener may cause the problem that the heat-dissipating thin film is explosive or poorly adhered, and therefore it is not suitable for the production of the heat-dissipating thin film. The reason is that the inventors feel that the above-mentioned deficiency can be improved, and the present invention which is effective in improving the above-mentioned deficiency is proposed. SUMMARY OF THE INVENTION The main object of the present invention is to provide a hardener and an epoxy resin prepreg composition glue having the same, and the addition of the hardener can make the heat-dissipating film prepared into both heat and adhesion. And the structure of the hardener has a polarity, so that the inorganic powder mixed into the glue can be uniformly dispersed in the epoxy resin prepreg composition. A further object of the present invention is to improve the above-mentioned epoxy resin prepreg composition glue to improve the heat dissipation film prepared by impregnating the glass fiber cloth with the epoxy resin prepreg composition glue. Heat dissipation and good processability. 8 200951165 In order to achieve the above object, the present invention provides a resin prepreg composition liquid composition comprising a component (4): an epoxy resin; and a component (8): a hardener represented by the formula (I). Formula (I)
其中R為ch2、〇或so2。 ❹ 本發明亦提供一種散熱膠片的製作方法，包括如下步 驟：步驟一：提供一玻璃纖維布；以及步驟二：浸潰 (dipping )該玻璃纖維布於上述的樹脂預浸體組成膠液 中，並經固化、乾燥等步驟後，即可形成一種具有高耐熱 性、高附著性及高導熱效率的散熱膠片。 本發明具有以下有益的效果：本發明提出之硬化劑， _ 可使生產的散熱膠片兼顧耐熱性及附著性，同時該硬化劑 的結構具有極性，故可將無機粉體均勻地分散於該具有該 硬化劑之環氧樹脂預浸體組成膠液中，故應用上述之環氧 樹脂預浸體組成膠液所製作之散熱膠片能具有更佳的樹 脂特性，且在散熱的功效上更具有較佳的導熱效率。 為使能更進一步瞭解本發明之特徵及技術内容，請參 閱以下有關本發明之詳細說明與附圖，然而所附圖式僅提 供參考與說明用，並非用來對本發明加以限制者。 200951165 【實施方式】 請參閱式（ 本發明係提供—種硬化 劑 H2N{}~rO~nhWhere R is ch2, 〇 or so2. The present invention also provides a method for fabricating a heat-dissipating film, comprising the steps of: step one: providing a glass fiber cloth; and step two: dipping the glass fiber cloth into the resin prepreg composition glue layer, After curing, drying and the like, a heat dissipating film having high heat resistance, high adhesion and high thermal conductivity can be formed. The present invention has the following beneficial effects: the hardener proposed by the present invention, the heat-dissipating film produced can achieve heat resistance and adhesion, and the structure of the hardener has polarity, so that the inorganic powder can be uniformly dispersed in the The epoxy resin prepreg of the hardener is composed of a glue, so the heat-dissipating film made by using the above-mentioned epoxy resin prepreg composition glue can have better resin characteristics and is more effective in heat dissipation. Good thermal conductivity. The detailed description of the present invention and the accompanying drawings are to be understood as the 200951165 [Embodiment] Please refer to the formula (The present invention provides a kind of hardener H2N{}~rO~nh
nh~^3~r—C^3~nh2 式（I ) 其中R可為ch2、ο或S02。 該硬化劑之主成分結構分別含兩個酿亞胺（imide)和 胺（amine)的結構。一般來說，imide系硬化劑因含有imide 結構，且成雜環結構，因此具有耐軟化，耐熱衝擊的功效， 亦即其耐熱性佳；再搭配上末端有胺官能基，故抗剝離能 力strength)也符合-般使用的規範，故上述的硬化 $所具，的混成結構可以同時兼具耐熱與抗剝離的特 ^。此外雜構亦具備不少C=C)基，或R可㈣㈤、q 或S02使該硬化劑具備一定程度的極性，可 度無機粉體較佳的分散效果。 i、對於同/辰 另外’本發明更進一步提出一鍤庙 箱-雜"、咖 7捉出種應用式（I )的樹脂 預况體、錢驗’亦即利用環氧樹脂與上述之硬化劑所組 成的聚合物膠液。換句話說，本發明提出一種由組严（A). 環氧樹脂；以及組份⑻··<⑴所示之硬化劑”所组成 的^脂組合物之膠液，而該環氧難係為—種選自雙盼A 1¼氧樹脂（Bi_em>l-A)、祕型環氧樹脂（N(m>iac)、 雙紛A 3L盼酸j衣氧樹脂、》臭化環氧樹脂及無齒環氧樹脂中 之樹脂。再者，上述之膠液中的組份（Β)更進一步包括 200951165Nh~^3~r-C^3~nh2 Formula (I) wherein R can be ch2, ο or S02. The main component structure of the hardener contains two structures of imide and amine, respectively. In general, the imide-based hardener has an imide structure and has a heterocyclic structure, so it has the effects of softening resistance and thermal shock resistance, that is, its heat resistance is good; and it has an amine functional group at the end, so the peeling resistance is strong. ) It also conforms to the general-purpose specification, so the above-mentioned hardened structure has a combination of heat resistance and peeling resistance. In addition, the heterostructure also has a plurality of C=C) groups, or R (4) (5), q or S02 to impart a certain degree of polarity to the hardener, and to better disperse the inorganic powder. i. For the same/chen, the present invention further proposes that a temple box-hetery", coffee 7 captures the application of the resin type (I), and the use of epoxy resin and the above A polymer glue composed of a hardener. In other words, the present invention proposes a glue composition consisting of a group of (A). epoxy resin; and a hardener represented by the component (8)·(1), and the epoxy is difficult The system is selected from the group consisting of a double-president A 11⁄4 oxyresin (Bi_em>1A), a secret epoxy resin (N(m>iac), a double A 3L pro-acid, a odorized epoxy resin and no The resin in the tooth epoxy resin. Furthermore, the component (Β) in the above glue further includes 200951165
二氰胺_iey)或苯_N phenGlie)類硬化劑，亦即上述式 (I )的硬化劑可以摻混二氰胺類⑴々）或苯盼（pN _ —。⑽類魏㈣娜上狀_旨預舰組成膠液；且 該膠液中更可進一步含有組份（c)，其中組份（c)係為 無機粉體’該無機粉體係均句的分散於該膠液之中。 本發明更進一步提出一種使用上述膠液以製造散熱 朦片的方法。該方法係應用上述膠液係由組份（A ):環氧 樹脂；以及組份⑻：式⑴所示之硬化劑所組成的樹 ⑩脂組合物之膠液，並將一玻璃纖維布浸潰（dipping)於該 膠液中:且該膠液中更可進一步含有組份（c)，其中組份 (c)係為無機粉體，例如碳化矽粉體（sic)、氧化鋁粉 體、氮化硼粉體、氮化鋁粉體、或上述任兩種或兩種以上 混合而成的粉體等，但不以上述為限，該無機粉體可視為 一種無機散熱填充料，其可附著於玻璃纖維布上，而在後 縯壓合的層合板中即可做為一快速導熱的媒介，尤其該膠 液中所含有之式（I )所示的硬化劑，藉由〇=0基，或R 可以為CH2、0或S02之結構所提供的極性可以使上述之 無機粉體均勻分散於膠液之中，故當玻璃纖維布含浸於該 膠液中時可以均勻的將該無機粉體均勻地披覆於玻璃纖 維布之上。另外’該膠液的黏度則控制在2〇〇〇厘泊 (centi-poise ’ cps)以下，以使該膠液更符合應用於浸潰 該玻璃纖維布的上膠機構。而在上述步驟之後更進一步包 括一固化乾燥步驟。另外在玻璃纖維布浸潰（dipping)於 該膠液的步驟中，最佳地提供—均勻步驟，以使無機粉體 11 200951165 能更加均勻的分佈於樹脂預浸體組成膠液之中。 綜上所述，本發明所提出的由組份（A):環 以及組份式⑴所示之硬化劑所組成 曰浸 體組成膠液係可應用在浸潰玻璃纖維布以形成散熱^ 的製造方法，而該膠液可以根據實際應用的情況力”二 整’如該組份（B)除了式⑴所示之硬化劑 混 合二氰胺類(Dicy)或苯酚(PN phenolic)類硬化劑，或是加二 調整黏度等等參數。 ❿ 以下，本發明將針對玻璃纖維布浸漬於上述之樹脂預 浸體組成膠液所製成的散熱膠片進行特性測試。請參^表 表 ❹ 本發 環氧# 脂 雙酚A型環氧樹脂 (固含量90%) 25.9% 47.3% 29.4% 硬化劑1 本發明（固含量70%) 24% - : 膠液配 硬化劑2 Dicy(固含量 9.09%) - 2.6% 硬化劑3 PN(固含量60%) - - 20.5% 万(單 促進劑 二曱基咪唑(10%) 0.2% 0.2% 0.1% 1立•董量 百分比) 填充料 SiC 50% 50% 50% 溶劑 DMForMEK 稀釋至固 含量70% 稀釋至固含 量70% 稀釋至固含 量75% 分散劑 BYK-W9010 -0.1% -0.1% -0.1% 分散態 分鐘（min) 60 40 30 所製膠 漂錫(288°C，分） >10 5 >10 片特性 P/S(l/1, lb/in) 7.97 8.59 6.22 12 200951165 由表1可知’本具體實施例是利用雙酚A型環氧樹脂 (固含量90%)你25.9%、上述之式（I )所示之硬化劑佔 24%與50%的無機碳化矽粉體（sic)以及其他組份 之添加物’如促進劑、溶劑及分散劑等所組成之樹脂預浸 體組成膠液進行玻璃纖維布之浸潰步驟。雙酚A型環氧樹 脂係由雙紛A (Bisphenol A)與環氧氣丙烧(Epichlorohydrin) 在氫氧化鈉(NaOH)的環境中反應而得，其結構上具有的特 性在於該分子末端的環氧基具有高反應性，雙酚主鏈的對 β 稱性高’具剛直結構，故強韌性及高溫特性優良；主鏈上 的醚結合，可適度地旋轉，故具可撓性。從上表可得到以 下結果： 1、 漂錫結果：耐熱實驗係依據產業標準ipc_tm_650 Method 2.4.13.1，將散熱膠片浸泡於288°c錫爐至爆板所 需時間（分），其中可得知藉由本發明所提出的膠液進行玻 璃纖維布浸潰作業之後製造的散熱膠片具有較高的耐熱 φ 性’故爆板所需的時間較長且符合測試規範。 2、 p/s結果：剝離實驗係依據IPC_TM_650 Method 2.4.8，雙面貼覆i盎司（〇z)銅箔熱壓合後，拉伸銅箔一端 提供一向上拉力，判斷斷裂程度，數值越大則表示散熱膠 片對銅箔附著力越好。故上述實驗可得知藉由本發明所提 出的樹脂預浸體組成膠液進行玻璃纖維布浸潰作業之後 所製造的散熱膠片對於銅箔具有較佳的附著能力。 3熬體分散態：係調製表1所述組成之樹脂預浸體 組成膠液，量測每一組成之樹脂預浸體組成膠液靜置至澄 200951165 清所需的時間’時間越長表示無機粉體的懸浮分散性越 佳。從上j實驗可得知本發明所提出的樹脂預浸體組成膠 液具有最南的無機粉體之懸浮分散性，可以解決無機粉體 於上膠槽内沉積的問題，進而提高浸潰玻璃纖維布所製成 之散熱膠片上的無機粉體的成膜均勻性。 換句居》兒，從表丨可以得知本發明所提出的硬化劑、 含有該硬化劑的樹脂預浸體組成膠液可應用於玻璃纖維 度的浸潰製程，而由該浸潰製程所製作的散熱膠片可以解 ❿決使用二氰胺類硬化劑所生產的散熱膠片的耐熱性低的 問題，同時解決採用酚醛環氧脂硬化劑，如苯酚類硬化劑 所生產的散熱膠片的附著能力低的問題，而該硬化劑更為 一種具有極性的分子結構，使得無機粉體可以相當均勻的 分散於樹脂預浸體組成膠液之中，使最終的散熱膠片的表 面彼覆有均勻的無機粉體膜層。 而表2則顯示本發明所製作的散熱膠片與其他膠片進 行散熱效率的評估。 本發明之散熱膠片 Arlon-99 series 一般膠片（非散熱） 升溫時間 (秒） 42 43 80 表2主要是進行熱傳導效率的實驗數據，將上述三種 膠片之一側接觸一個wot:的固定熱源，並量測膠片的另 一側表面從45°c升溫至65°c所需時間，時間越短表示熱 傳導效率越好。其中可得知利用本發明所提出之硬化劑所 200951165 短的升溫時間，亦即其可在最快的時間 月…、J力，而此一結果亦說明本發明的硬化劑之 液m機㈣均自时餘該難㈣體紐成膠 綜上所述，本發明具有下列諸優點·· 膠片二=二=之=二改善其所製成的散熱A sulphate _iey or benzene_N phenGlie) hardener, that is, a hardener of the above formula (I) may be blended with dicyanamide (1) hydrazine or phenyl (pN _ - (10) class Wei (four) The pre-ship consists of a glue; and the glue further contains component (c), wherein component (c) is an inorganic powder, and the inorganic powder system is dispersed in the glue. The present invention further provides a method for manufacturing a heat-dissipating sheet using the above-mentioned glue. The method uses the above-mentioned glue system component (A): epoxy resin; and component (8): hardener represented by formula (1). Forming a glue of the tree 10 fat composition, and dipping a glass fiber cloth into the glue: and the glue further contains the component (c), wherein the component (c) The inorganic powder is, for example, a tantalum carbide powder (sic), an alumina powder, a boron nitride powder, an aluminum nitride powder, or a powder obtained by mixing two or more of the above, but Not limited to the above, the inorganic powder can be regarded as an inorganic heat-dissipating filler, which can be attached to the glass fiber cloth, and laminated on the back-pressed laminate. It can be used as a medium for rapid thermal conductivity, especially the hardener represented by formula (I) contained in the glue, and the polarity provided by the structure of CH2, 0 or S02 by 〇=0 base, or R The above inorganic powder can be uniformly dispersed in the glue liquid, so that when the glass fiber cloth is impregnated in the glue liquid, the inorganic powder can be evenly coated on the glass fiber cloth uniformly. The viscosity of the liquid is controlled to be less than 2 centipoise (centi-poise 'cps), so that the glue is more suitable for the gluing mechanism for impregnating the glass fiber cloth, and further includes a step after the above steps. Curing and drying step. In addition, in the step of dipping the glass fiber cloth to the glue, an optimum uniform step is provided to make the inorganic powder 11 200951165 more uniformly distributed in the resin prepreg composition glue In summary, the present invention proposes a immersion composition composed of a component (A): a ring and a hardener represented by the formula (1), which can be applied to impregnate a glass fiber cloth to form Heat sink ^ manufacturing method, and the glue can be rooted The actual application of the situation "two whole" as the component (B) in addition to the hardener shown in formula (1) mixed with dicyandiamide (Dicy) or phenol (PN phenolic) hardener, or add two adjustment viscosity, etc. ❿ In the following, the present invention will perform a characteristic test on a heat-dissipating film made of a glass fiber cloth immersed in the above-mentioned resin prepreg composition glue. Please refer to Table ❹ This Epoxy# Lipid Bisphenol A Ring Oxygen resin (solid content 90%) 25.9% 47.3% 29.4% Hardener 1 The present invention (solid content 70%) 24% - : Glue with hardener 2 Dicy (solid content 9.09%) - 2.6% Hardener 3 PN ( Solid content 60%) - - 20.5% 10,000 (single accelerator dimercaptoimidazole (10%) 0.2% 0.2% 0.1% 1 Li · percentage of Dong) Filler SiC 50% 50% 50% Solvent DMForMEK Dilute to solid content 70% diluted to a solid content of 70% diluted to a solid content of 75% Dispersant BYK-W9010 -0.1% -0.1% -0.1% Dispersed state minutes (min) 60 40 30 Made of plastic bleaching tin (288 ° C, min) > 10 5 > 10 piece characteristics P/S (l/1, lb/in) 7.97 8.59 6.22 12 200951165 It can be seen from Table 1 'This embodiment uses bisphenol A type epoxy resin (solid content 90%) You 25.9%, the hardener represented by the above formula (I) accounts for 24% and 50% of the inorganic strontium carbide powder (sic) and other components of additives such as accelerators, solvents and A resin prepreg composed of a dispersant or the like constitutes a glue liquid to perform a glass fiber cloth impregnation step. The bisphenol A type epoxy resin is obtained by reacting Bisphenol A with Epichlorohydrin in the environment of sodium hydroxide (NaOH), and has a structural characteristic of a ring at the end of the molecule. The oxy group has high reactivity, and the bisphenol main chain has a high β-thickness structure, so it has excellent toughness and high temperature characteristics; the ether bond on the main chain can be appropriately rotated, so that it has flexibility. The following results can be obtained from the above table: 1. Bleaching tin results: The heat-resistant experiment is based on the industry standard ipc_tm_650 Method 2.4.13.1, and the time required to soak the heat-dissipating film in the 288°c tin furnace to the blasting plate (minutes) The heat-dissipating film manufactured by the glass fiber cloth dipping operation by the glue proposed by the present invention has a high heat resistance φ property, so that the time required for the blasting plate is long and conforms to the test specification. 2, p / s results: peeling test according to IPC_TM_650 Method 2.4.8, double-sided paste i ounce (〇z) copper foil thermocompression, the end of the stretched copper foil provides an upward pulling force to determine the degree of fracture, the value Larger means that the heat-dissipating film has better adhesion to the copper foil. Therefore, in the above experiment, it was found that the heat-dissipating film produced by the glass fiber cloth dipping operation by the resin prepreg composition glue proposed by the present invention has a better adhesion ability to the copper foil. 3 分散 dispersed state: the resin prepreg composition of the composition described in Table 1 is composed of the glue, and the time required for the resin prepreg composition of each composition to be settled until the time is clear to 200951165 is clear. The suspension dispersion of the inorganic powder is better. It can be seen from the above experiment that the resin prepreg composition glue of the present invention has the suspension dispersibility of the southernmost inorganic powder, can solve the problem of deposition of inorganic powder in the gluing tank, and further improve the impregnated glass. The film formation uniformity of the inorganic powder on the heat-dissipating film made of the fiber cloth. In other words, it can be seen from the table that the hardener proposed by the present invention and the resin prepreg composition containing the hardener can be applied to the glass fiber degree impregnation process, and the impregnation process is The heat-dissipating film can solve the problem of low heat resistance of the heat-dissipating film produced by using the dicyandiamide-based hardener, and at the same time solve the adhesion ability of the heat-dissipating film produced by the phenolic epoxy resin hardener, such as a phenolic hardener. Low problem, and the hardener is more polar molecular structure, so that the inorganic powder can be dispersed fairly uniformly in the resin prepreg composition, so that the surface of the final heat-dissipating film is covered with a uniform inorganic Powder film layer. Table 2 shows the evaluation of the heat dissipation efficiency of the heat-dissipating film produced by the present invention and other films. Thermal film of the present invention Arlon-99 series General film (non-heat dissipation) Heating time (seconds) 42 43 80 Table 2 is mainly for experimental data of heat conduction efficiency, and one side of the above three films is contacted with a fixed heat source of wot: Measuring the time required for the other side surface of the film to rise from 45 ° C to 65 ° C, the shorter the time, the better the heat transfer efficiency. It can be known that the short heating time of the hardener used in the present invention is 200951165, that is, it can be in the fastest time... J force, and this result also shows the liquid machine of the hardener of the present invention (4) It is difficult to make the four (4) body into a rubber. The invention has the following advantages: · Film 2 = 2 = = 2 to improve the heat dissipation
魯 “、、炫謂者m外該硬化劑的結構具有極性， 故可將無機粉體均勻地分散於該具有該硬 脂預浸體組絲液巾。 |㈣ 2、另-方面’本發明之環氧樹脂預浸體組成膠液可 應用於散熱膠片的製作，以上述式（Σ)所示之硬化劑所 =配的環氧樹脂預浸體組成膠液可以提升玻璃纖維布浸 潰於該壤氧樹脂預浸體組成膠液所製成之散熱膠片的散 熱性及加工性。 惟以上所述縣本發日狀較佳實_，非意欲偈限本 發明之專㈣護·，故舉凡利本發明說明書及圖式内 容所為之等效變化，均同理皆包含於本發明之權利保護範 圍内，合予陳明。 【圖式簡單說明】 Μ 4**\ 【主要元件符號說明】 無 15Lu ",, Hyun said that the structure of the hardener has polarity, so the inorganic powder can be uniformly dispersed in the liquid towel with the hard fat prepreg. | (4) 2, another - aspect 'the invention The epoxy resin prepreg composition glue can be applied to the production of heat dissipating film, and the epoxy resin prepreg composed of the hardener represented by the above formula (Σ) can be used to enhance the impregnation of the glass fiber cloth. The heat dissipating film and the processability of the heat dissipating film made of the composition of the pre-impregnated body of the oxygen resin prepreg. However, the above-mentioned county has a better shape, and it is not intended to limit the special (four) protection of the present invention. The equivalent changes of the present specification and the contents of the drawings are all included in the scope of protection of the present invention and are combined with Chen Ming. [Simple description of the drawing] Μ 4**\ [Main component symbol description 】 no 15