200950154 六、發明說明： 【發明所屬之技術領域】 本發明是關於一種發光裝置，其包括：至少一發光電光 元件；一光接收元件，其經配置以接收由該至少一發光電 光元件所發射之光；及一導熱材料之散熱器，其經配置以 將熱量傳輸離開該至少一發光電光元件。本發明亦關於一 種散熱器，及一種包括此一散熱器及至少一電光元件之光 源。 【先前技術】 以發光二極體（LED)為基礎之照明設備正作為燈泡及螢 光燈管之引人目光的替代物而快速出現。在近幾年内， LED之壽命及光輸出功率已增加，同時其成本及耗能已降 低。 然而，LED—般為點狀光源及熱源，且是用於照明較大 面積，來自該等LED之光及熱量亦需被散佈到一較大面積 上。 在一種類型的以LED為基礎之發光器中，一或多個LED 經配置以發射光至一波導板中，而光是分佈在該波導板 内，且從該波導板而來的光是從明顯大於該LED之面積或 是該複數個LED之總面積的一面積輸出。 然而，在發射光後，LED散逸熱量。此熱量可導致發熱 問題，尤其是當使用高功率LED例如具有1 W/mm2功率密 度之LED時。 必須將熱量傳輸離開LED及光導。通常，LED之效率隨 137811.doc 200950154 著溫度的增加而降低。此外，為求低重量及低成本，該光 導可由透明塑膠製成，該等塑膠在高溫下會劣化或老化。 因此，通常配置散熱器以將熱量傳輸離開LED及光導。該 散熱器通常係由一導熱材料製成或包括一導熱材料，該導 熱材料通常具有一金屬成分，且通常是配置成與LED及/或 光導板接觸。 ΟBACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a light-emitting device comprising: at least one light-emitting electro-optic element; a light-receiving element configured to receive a light emitted by the at least one light-emitting electro-optic element And a heat sink of a thermally conductive material configured to transfer heat away from the at least one illuminating electro-optic element. The invention also relates to a heat sink, and a light source comprising the heat sink and at least one electro-optic element. [Prior Art] Lighting devices based on light-emitting diodes (LEDs) are rapidly emerging as an attractive alternative to light bulbs and fluorescent tubes. In recent years, LED life and optical output power have increased, while its cost and energy consumption have been reduced. However, LEDs are generally point-like sources and heat sources, and are used to illuminate a large area, and the light and heat from the LEDs need to be spread over a large area. In one type of LED-based illuminator, one or more LEDs are configured to emit light into a waveguide plate, and light is distributed within the waveguide plate, and light from the waveguide plate is from An area output that is significantly larger than the area of the LED or the total area of the plurality of LEDs. However, after emitting light, the LED dissipates heat. This heat can cause heating problems, especially when using high power LEDs such as LEDs with a power density of 1 W/mm2. Heat must be transferred away from the LEDs and light guides. In general, the efficiency of LEDs decreases with increasing temperature. In addition, for low weight and low cost, the light guide can be made of transparent plastic which deteriorates or ages at high temperatures. Therefore, a heat sink is typically configured to transfer heat away from the LEDs and light guides. The heat sink is typically formed from a thermally conductive material or includes a thermally conductive material that typically has a metallic composition and is typically configured to contact the LED and/or light guide. Ο
然而’該光導板及該散熱器通常具有不同的膨脹性、不 同的熱膨脹係數及不同的體積及應力鬆弛。在操作中，該 光導板及該散熱器之溫度增加，其結果是熱膨脹。以上所 述之熱膨脹之差異對LED發光體具有負面影響。若該散熱 器是固定在該光導上，則不同膨脹會造成該光導與該散熱 器之間的接合處之應力。另一方面，若該等LED是配置在 該散熱器上，但該光導卻不是配置在該散熱器上，則在該 等LED與該光導之間將存在一不理想的位置偏移，使得該 等LED從其相對於該光導之最佳位置移走。 在屬於PFU Ltd•之JP 2〇00100866中描述一種在一半導體 裝置中處理熱膨脹差異之方法。在此文獻中描述的是，一 半導體晶片是配置在—包含散熱器之電路板上，而具有溝 渠形式之吸收緩和構件以_該電路板。該等溝渠允許空 氣流向該半導體晶片。 二 然而’隔開該電路板會增加用於建構一袭置所 的數目且使對於該等LED之裝配及配線複雜化。此外，每 將此種隔開的電路板應用於具有—部分透明的 ^ 光體上時，該隔開的電路板在該光導之不同部分之間產生 137811.doc 200950154 可見的接合處’而該接合處之可見性不為人所樂見的。 【發明内容】 本發明之一目的是至少部分克服此等問題中之至少一 者，且提供一種發光裝置，其中該散熱器可作為一單件結 構予以提供，而此從處理及配線兩者的觀點觀之是有利 的。另一目的是提供一種具有一散熱器之發光裝置，其減 少在該散熱器中之任何間隙之可見性。 因此，在一第一態樣中，本發明是關於一種發光裝置， 其匕括至少一發光電光元件；一光接收元件，其經配置以 接收由該至少一發光電光元件所發射之光；及一導熱材料 之散熱器，其經配置以將熱量傳輸離開該至少一發光電 光元件。該散熱器面向該光接收元件之一表面包括至少兩 個相鄰的、空間分離的域，料域是藉由至少一連接部分 而相互連接’而該連接部分為可撓性的，以適於藉由該^ 個相鄰域中之至少一者而移動。 «% 7L· ^ —在W丹咏取热孜平行（例如 距相當短的距離使得利用該光接收元件作為—散敎座而 有效地將熱量傳輸離開該散熱板。該光接收元件經調適 (在-端）減光及（在另-端）輸出光，i因此其係由一 透明材料或光學透明材料製成。 由於該等相鄰域之相鄰部分與將該等域固持在_起之 撓性連接部分之間的分離，本發明之散熱器展現若干 點。-個優點是該散熱器在製造中可被製成單 是因為該散熱器之所有域皆附著在一起。此減少建構本 137811.doc -6 - 200950154 明之一裝置所需之部件數 干歎目，且有助於裝配及放置。 另一個優點是，兮笪π 過寺可撓性連接部分允許相鄰域相 彼此之一特定移動。♦ 、 田例如輕由該等電光元件將該散埶 附接至該錢收元件時，料連接部分之撓性防止該電1 儿件之位置相對於該光接^件之任何明顯偏移。 在本發明之實施例中 ， r 該連接部分可沿著在該兩個相鄰 域之間之一婉蜒路徑。However, the light guide plate and the heat sink generally have different expandability, different coefficients of thermal expansion, and different volume and stress relaxation. In operation, the temperature of the light guide plate and the heat sink increases, and as a result, it thermally expands. The difference in thermal expansion described above has a negative impact on the LED illuminator. If the heat sink is attached to the light guide, different expansions can cause stress at the junction between the light guide and the heat sink. On the other hand, if the LEDs are disposed on the heat sink but the light guides are not disposed on the heat sink, there will be an undesirable positional shift between the LEDs and the light guide. The LED is removed from its optimal position relative to the light guide. A method of treating a difference in thermal expansion in a semiconductor device is described in JP 2 00100866 to PFU Ltd. It is described in this document that a semiconductor wafer is disposed on a circuit board including a heat sink, and has an absorption absorbing member in the form of a trench. The trenches allow an air flow to the semiconductor wafer. Second, 'separating the board increases the number of devices used to construct the installation and complicates the assembly and wiring of the LEDs. Moreover, each time such a separate circuit board is applied to a partially transparent body, the spaced apart circuit board produces a joint 137811.doc 200950154 between different portions of the light guide. The visibility of the joint is not desirable. SUMMARY OF THE INVENTION It is an object of the present invention to at least partially overcome at least one of these problems and to provide a light emitting device wherein the heat sink can be provided as a one-piece construction, both from processing and wiring. The point of view is beneficial. Another object is to provide a lighting device having a heat sink that reduces the visibility of any gaps in the heat sink. Accordingly, in a first aspect, the present invention is directed to a light emitting device comprising at least one light emitting electro-optic element; a light receiving element configured to receive light emitted by the at least one light emitting electro-optical element; A heat spreader of heat conductive material configured to transfer heat away from the at least one light emitting electro-optic element. The surface of the heat sink facing the light receiving element includes at least two adjacent, spatially separated domains, the material domains being interconnected by at least one connecting portion and the connecting portion is flexible to be adapted Moving by at least one of the adjacent fields. «% 7L·^—parallel to the heat in W Dan (for example, a relatively short distance allows the light-receiving element to be used as a heat sink to effectively transfer heat away from the heat sink. The light-receiving element is adapted ( At the end-end) dimming and (at the other end) output light, i is therefore made of a transparent material or an optically transparent material. Since the adjacent parts of the adjacent fields are held at the same The separation between the flexible connecting portions, the heat sink of the present invention exhibits several points. One advantage is that the heat sink can be made in manufacture because all the domains of the heat sink are attached together. This 137811.doc -6 - 200950154 shows that the number of parts required for one of the devices is sighed and contributes to assembly and placement. Another advantage is that the 兮笪π pass temple flexible connection allows adjacent fields to each other a specific movement. ♦, when, for example, lightly attaching the heat sink to the money receiving component by the electro-optical elements, the flexibility of the material connection portion prevents the position of the electrical component relative to the optical connector Significantly offset. In an embodiment of the invention, r The connecting portion may follow a path between one of the two adjacent domains.
-種實現該連接部分之撓性之有吸引力的方式是沿一蜿 蜒路徑配置料接部分。此—婉蜒連接部分為时可捷性 的，通常類似於一彈性彈菁。 在本發明之實施例中’該蜿蜒路徑是蜿蜒於該兩個相鄰 域之平面中。 田-亥連接。|5刀冶著一基本上蜿蜒於該散熱器之該兩個相 鄰域之平面中的路經時’其能夠由一板製造，而且該連接 刀不對该散熱器增加任何額外厚度。舉例而言，此在需 要一薄的發光裝置時是有利的。 通常’該連接部分可組成沿著在該等域之平面中之該婉 蜒路徑的一條帶，該條帶具有與該兩個相鄰域之寬度相關 的一有限寬度。 在本發明之實施例中，該連接部分可包括該散熱器之一 皺褶部分。 藉由使該散熱器之區域起皺，用該等皺褶區域將該散熱 器劃分成若干域，該等皺褶區域作為該等域間之一可撓性 連接。卩刀。此種皺褶連接部分不必具有小於該連接部分所 137811.doc 200950154 分離之該散熱器域的寬度之—寬度。因此，此種敏摺連接 部分對於該散熱器之散熱特性不具有任何顯著負面影響。 在本發明之實施财，料接部分係由與該散熱器 之導熱材料製成。 當該連接部分係由與該散熱器本身相同之材料製成時， 可容易地例如藉由切割、衝壓或鋸切該散熱器以獲得分離 的域且同時保留連接部分而製造該連接部分，或藉由使該 散熱器之-部分起皺以劃分成由皺褶區域分離之域而製造 該連接部分。 在本發明之實施例中，可將一第一發光電光元件及一相 鄰的第二發光電光元件分別配置在該散熱器之一第一域及 一相鄰的第二域上。 一將一電光元件配置於各散熱器域上有效地將每一個此種 兀件放置於其本身的散熱器上。因此，減少在該電光元件 與該光接收元件之間的可能偏移。 在一較佳實施例中，光接收元件（諸如一光導）具有一板 狀，其經配置以具有面向該散熱器之一平坦表面。一板狀 光接收元件之利用賦予該發光裝置一低輪廓，亦即低厚 度。此外，由於在該散熱器與該光接收元件之間實現較大 介面之可能性，此允許在該散熱器與該光接收構件之間的 熱量之一良好傳遞。 在本發明之實施例中，該光接收元件為一光導，其經調 適以接收由該等電光元件所發射之光，且允許所接收的光 在該光接收元件内傳播，通常是藉由全内反射（TIR)傳 137811.doc 200950154 t在該光導内，可將來自各發光電光元件的光分佈在一 、面積上，使得當光離開該光導時，即使光源為一點狀 一源’其會展現為猶如自—大面積放射。該光導通常係由 =學透明材料製成。該光導較佳具有面向該散熱器之一 、’表面，其允許在該散熱器與該光導之間的熱量之一良 好傳遞。 ‘”' 。在一第二態樣中，本發明亦是關於一種導熱材料之散熱An attractive way to achieve the flexibility of the connecting portion is to configure the land portion along a meandering path. This - the connection part is time-stable, usually similar to an elastic elastic. In an embodiment of the invention, the path is in the plane of the two adjacent fields. Tian-Hai connection. The 5 is capable of being fabricated from a plate substantially in the plane of the two adjacent regions of the heat sink, and the connecting blade does not add any additional thickness to the heat sink. For example, this is advantageous when a thin light emitting device is required. Typically the connecting portion may constitute a strip along the path in the plane of the fields, the strip having a finite width associated with the width of the two adjacent fields. In an embodiment of the invention, the connecting portion may comprise a pleated portion of the heat sink. By creping the area of the heat sink, the heat sink is divided into a plurality of domains by the pleated regions, the pleated regions being flexibly connected as one of the domains. Scythe. The pleat joint portion does not have to have a width-width smaller than the width of the heat sink field from which the joint portion is 137811.doc 200950154. Therefore, such a sensitive connection portion does not have any significant negative influence on the heat dissipation characteristics of the heat sink. In the practice of the invention, the material portion is made of a thermally conductive material with the heat sink. When the connecting portion is made of the same material as the heat sink itself, the connecting portion can be easily manufactured, for example, by cutting, stamping or sawing the heat sink to obtain a separate domain while retaining the connecting portion, or The connecting portion is fabricated by creping a portion of the heat sink to be divided into domains separated by the corrugated regions. In an embodiment of the invention, a first illuminating electro-optical component and an adjacent second illuminating electro-optical component are respectively disposed on a first domain of the heat sink and an adjacent second domain. An electro-optic element is disposed on each of the heat sink domains to effectively place each such component on its own heat sink. Therefore, a possible offset between the electro-optical element and the light-receiving element is reduced. In a preferred embodiment, the light receiving element (such as a light guide) has a plate shape configured to have a flat surface facing the heat sink. The use of a plate-shaped light-receiving element imparts a low profile, i.e., low thickness, to the illuminating device. Furthermore, this allows a good transfer of heat between the heat sink and the light receiving member due to the possibility of achieving a larger interface between the heat sink and the light receiving element. In an embodiment of the invention, the light receiving element is a light guide adapted to receive light emitted by the electro-optic elements and to allow the received light to propagate within the light receiving element, typically by Internal reflection (TIR) transmission 137811.doc 200950154 tIn the light guide, the light from each of the illuminating electro-optical elements can be distributed over one area, such that when the light leaves the light guide, even if the light source is a point-like source, It appears as if it is self-radiating. The light guide is usually made of a transparent material. The light guide preferably has a surface facing the heat sink, which allows for a good transfer of heat between the heat sink and the light guide. ‘”'. In a second aspect, the invention also relates to heat dissipation of a thermally conductive material
器’其具有被劃分成至少兩個相鄰的、空間分離的域之一 該等域疋藉由至少—連接部分而相互連接，該連接 部分為可撓性的’以適於藉由該兩個相鄰域中之至少一者 而移動。通常，該連接部分沿著介於該兩個相鄰域之間的 一婉蜒路徑。 在-第三態樣中，本發明亦關於一種光源，其包括本發 明之-散熱器及至少一配置於其上之電光發光裝置。 應注意的是’本發明是關於中請專利範圍中所述之特徵 的所有可能組合。 【實施方式】 圖1示意地說明本發明之一發光裝置之一實施例。 發光裝置100包括複數個發光電光元件，通常為發光二 極體（LED)lOl ’其配置成發射光至一光接收元件1〇2尹， 在此實施例中，該光接收元件是以一光導板1〇2作為例 子。來自該等LED之光在該光導板中傳播且於其中混合。 最終，光透過光導板1〇2之底部表面1〇4從該光導板1〇2離 開。此種LED-光導總成之細節—般為熟習此項技術者所知 137811.doc -9- 200950154 悉，且由於其等非本發明之主題，所以本文不對其等進行 詳細論述。 如本文所使用，術語「發光二極體」或「LED」指的是 為熟習此項技術者所知之任何類型的發光二極體，包含無 機基LED、有機基LED(〇LED)及聚合物基led(聚合物 led)，其等發射從紫外（uv)光經可見光而至紅外（ir)光之 波長範圍内的光。 该光導板102通常係由諸如玻璃、透明陶瓷或透明聚合 材料之一透明的、光學透明材料製成。諸如例如交聯聚节 基丙烯酸甲酯之透明聚合材料為較佳，這是由於其低重 量、低成本及良好的光學性能。 在該光導板102之頂部表面105處，亦即光耦合輸出之相 對側處’配置有一散熱板1 〇3。 在該光導板102内，光在其表面内經歷全内反射（TIR)。 通常’該光導包括一些種類的光提取特徵，使得遇到此等 光提取特徵之光因此或隨後可從該光導板予以取出。此等 光提取特徵已為熟習此項技術者所知，且例如可為在光導 中之斜的反射器，或是在光導表面中之凸出部或微結構。 該光導板102是配置成接近該散熱器，使得其間存在一 熱接觸。為使LED在其長時間地並有效地執行之溫度下操 作LED 101 ’較佳的是使熱能傳輸離開該裝置。一種選擇 是使用該光導板102作為一散熱座，其是藉由周圍環境予 以冷卻。該光導板102通常具有一朝向環境之相對較大的 表面積，且因此適合作為一用於將熱量傳輸離開該裝置之 137811.doc -10- 200950154 構件。 為從該散熱板103傳遞熱量至該光導板i〇2，其間需要良 好的熱傳遞特性。 同時，且為獲得良好的光傳播，較佳的是全内反射可在 • 該光導板102之該等表面（包含頂部表面）發生。 , 藉由配置該光導板1〇2使得其之一主要面積百分比1〇6是 位於距離該散熱板103之一特定、明確界定的距離之處， _ 而獲得從該散熱板1 〇3至該光導板1 〇2之良好的熱傳遞，同 時在該光導板中能夠發生全内反射（TIR)。以上所述之明 確界定的距離通常是在約1微米至約2〇〇微米之範圍内，通 常為約20微米左右。 將該散熱器103劃分成複數個空間分離的域13ι、132， 該等域具有一形成有層片的區段丨33，即連接部分，其是 配置成連接相鄰之域。在此實施例中，將一單一 LED丄〇 i 配置在各域上並且與各域良好熱接觸，其有效地賦予各 • LED—單獨的散熱板。通常，該LED是配置在（例如夾持 於）該等散熱器域之該域之中央位置。然而，對於熟習此 項技術者而言將為顯然的是，本發明不受限於每個散熱板 • 區域中有一個LED，且在其他實施例中，若干個LED可配 k 置在每一散熱器域上。 在本發明之—典型實施例中，LED之間的間距是在i釐 米或數釐米之範圍内，例如在1釐米與20釐米之間，舉例 而言，約5釐米。當每個LED是配置在一單獨的散熱器域 上時’此亦賦予該等域之近似尺寸（寬度）。 137811.doc 200950154 在此實施例中，led 熱板103與該光導板之 中，該散熱板與該光導 接。 :01是連接至該光導板1〇2,在該散 形成一接合處。在其他實施例 板可另外或是或者由其他構件連 该形成有層片的連接部分 域_32之間的一婉挺路徑沿著介於相鄰 婉蜒至(實際上垂直於)相對於實施例中，該路徑是 耵於該荨散熱器域的平面之外。 ，如在本文中所使用，術語「婉蜒路徑」指的是-呈現至 ❹ 少-曲線、彎曲或折叠之非筆直路徑。 =文中所使用，術語「沿著一婉蜒路 /配置使仵該蜿蜒路徑完全位於該 連接H ’且使得該連接部分之錢縣類似於該替 之形狀。通常，沒有可從散熱器的一第一域至 域延伸之直線，該線是完全位於沿著―婉蜒㈣之一= 部分。 逆丧 沿者一蜿蜒路徑之一連接部分本身為可撓性的，且通常 是有彈性的，其與一彈性彈簧類似。如在本文中所使用， ❹ 作為該等連接部分之一特徵之術語「可撓性」是用於表示 在連接部分固持在一起之該等域就相互之間移動，例如相 互進一步分離或朝對方擠壓之情況下，該等連接部分為順 . 從且不斷裂。因此，「可撓性」不受限於意味有彈性或有 ， 彈力。此外，允許該連接部分之塑性變形，只要該連接部 分在該裝置之正常使用期間不斷裂。 該散熱板103之一用途是將熱量傳輸離開該等LED 1〇ι至 137811.doc ·】2· 200950154 周圍環境及至該光導板l〇2 ^在操作中，該等LED主要消 散熱能’其造成LED本身、散熱器及光導板内之一增加的 溫度。在儲存條件與操作條件之間的該裝置溫差可為高到 100〇C。 • 該散熱器103可為一金屬散熱器，但除作為一散熱器外 ‘亦可具有其他用途。舉例而言，該散熱器可為一電絕緣金 屬基板印刷電路板（insulated metal substrate printed circuit board ; IMS PCB)，其容納該等LED 101之驅動電子器件的 部件。 通常’該光導板102及該散熱器i〇3係由具有不同的藉由 水氣附著（從周圍空氣）之膨脹性、不同的熱膨脹係數，及 不同的體積及應力緩和度之不同材料製成。舉例而言，聚 甲基丙烯酸甲酯（一種典型的光導材料）具有2%〇的吸濕膨脹 性、一 80 ppm/Κ之熱膨脹係數，及至多ι%。的體積收縮， 而鋁（一種典型的散熱器材料）具有可忽略的膨脹性及體積 • 收縮，及一23 PPm/K之CTE。環氧樹脂（一種典型的PCB材 料）具有一 15 Ppm/K之CTE。因此，在加熱後，該光導板呈 現一明顯（〜1%)高於該散熱器之長度膨脹。 • 由於該等散熱器域之間的可撓性/彈性連接部分，因不 、同的膨脹性、體積收縮、CTE及溫度變化引起的該散熱器 與光導板之間的任何應變差異基本上可為該等撓性/彈性 連接部分所調節。因此，不管該散熱器與該光導板之間的 熱膨脹差異為多少，基本上不會存在該裝置非不願之熱變 形，及LED相對於該光導板之實際位置與最佳位置之間的 137811.doc 13 200950154 任何非不願之偏移。此外，更佳的是將該散熱器（而非該 光導板）劃分成若干個域，這是因為較佳的是允許光傳播 傳遍整個光導板。 此外，由於該散熱器是在該光導板之背面（非觀察側） 上，且由於在該散熱器内不存在或基本上不存在開口間 隙’所以該裝置具有一均勻外觀。 圖2a及圖2b示意說明本發明之一發光裝置之另一實施 例。亦在此實施例中，將該散熱器1〇3劃分成單獨的域 131、132，每對相鄰域是藉由一或多個連接部分233予以 連接。然而，在此實施例中，該等連接部分233是配置在 該等散熱器域131、132之平面中。因此，其等—般較容易 製造且基本上不對該裝置之厚度有貢獻，其在一些應用中 是有利的。 在此實施例中，相鄰的連接部分是藉由一間隙2〇4予以 分離’該間隙204是藉由由該散熱材料之一窄的條帶組成 之一或多個連接部分233予以橋接。該窄的條帶係沿著介 於該等相鄰散熱器域131、132之間的一蜿蜒路徑。亦在此 實施例中，該連接部分233之蜿蜒形狀意味一本身的可換 性/彈性，其可適於該等相鄰域之間的相互移動。因此， 相鄰域可遠離彼此而伸展或朝向彼此之間推進，同時仍然 為連接的。 如本文所使用之術語「窄的條帶」被視為由形成該連接 部分之材料製成之條帶’其具有明顯小於由該連接部分所 連接之該散熱器域的寬度之一寬度，例如具有一小於該散 137811.doc -14- 200950154 „ 熱器域之寬度的25%之寬度，舉例而言小於10%或甚至更 小’例如5%或更低。 間隙204之寬度取決於該散熱器及該光導板之材料，但 通常可為該散熱器域的寬度之約1%左右。 * 在本發明之實施例中，且如圖2b之細節所示，該等域之 1 侧邊緣為成斜面的’使得在該兩個相鄰域之間的間隙中形 成一重叠’該等域之側面朝向在兩個相鄰散熱器域之間之 一間隙204。 當從與該散熱器之表面垂直的方向觀察該散熱器時，該 等重疊邊緣具有例如「隱藏」該間隙之效果。用於實現重 疊邊緣同時保持該間隙之該等邊緣之一例示性設計是，其 中一第一域131之邊緣205具有該第一域之上三分之一 215,其是沿著該散熱器之厚度計算，延伸為長於該第一 域之下二分之二，同時相對之邊緣形狀存在於該相鄒域 132之邊緣206上，亦即其中該相鄰域之下三分之一 216延 參 #為長於其上二分之二。具有此種邊緣設計，該第-及第 二域邊緣之該等延伸部分可重#，㈣在該等相鄰域之間 保持一間隙204。 •熟習此項技術者瞭解本發明料受限於以上所述之較佳 , f施例。相反地，在所附請求項之範圍内，許多修正及變 更是可能的。舉例而言，一個 個以上連接部分可用於連接兩 個相鄰的散熱器域〇此外，一翩丨、，u τ G外 個以上led可附接至一單一'has one of the domains divided into at least two adjacent, spatially separated domains, which are interconnected by at least a connecting portion that is flexible' to be adapted by the two Move in at least one of the adjacent fields. Typically, the connecting portion follows a path between the two adjacent domains. In a third aspect, the invention also relates to a light source comprising a heat sink of the present invention and at least one electro-optic illumination device disposed thereon. It should be noted that the present invention is all possible combinations of the features described in the scope of the patent application. [Embodiment] Fig. 1 schematically illustrates an embodiment of a light-emitting device of the present invention. The illuminating device 100 includes a plurality of illuminating electro-optical elements, typically a light-emitting diode (LED) 101, which is configured to emit light to a light-receiving element 1 〇 2 Yin. In this embodiment, the light-receiving element is a light guide. Board 1〇2 is taken as an example. Light from the LEDs propagates in the light guide and mixes therein. Finally, the light passes through the bottom surface 1〇4 of the light guiding plate 1〇2 away from the light guiding plate 1〇2. The details of such LED-lightguide assemblies are generally known to those skilled in the art 137811.doc -9- 200950154, and because they are not the subject of the present invention, they are not discussed in detail herein. As used herein, the term "light emitting diode" or "LED" refers to any type of light-emitting diode known to those skilled in the art, including inorganic-based LEDs, organic-based LEDs (LEDs), and polymerizations. A polymer-based led polymer that emits light from ultraviolet (uv) light through visible light to infrared (ir) light. The light guide plate 102 is typically made of a transparent, optically transparent material such as glass, transparent ceramic or a transparent polymeric material. A transparent polymeric material such as, for example, crosslinked poly(methacrylic acid methacrylate) is preferred due to its low weight, low cost and good optical properties. A heat sink 1 〇 3 is disposed at the top surface 105 of the light guiding plate 102, i.e., at the opposite side of the optical coupling output. Within the light guide plate 102, light undergoes total internal reflection (TIR) in its surface. Typically, the light guide includes some type of light extraction features such that light experiencing such light extraction features can or can subsequently be removed from the light guide. Such light extraction features are known to those skilled in the art and may be, for example, a reflector that is oblique in the light guide, or a projection or microstructure in the surface of the light guide. The light guide plate 102 is configured to access the heat sink such that there is a thermal contact therebetween. In order for the LED to operate the LED 101 at its temperature for a long time and efficient execution, it is preferred to transfer thermal energy away from the device. One option is to use the light guide plate 102 as a heat sink that is cooled by the surrounding environment. The light guide plate 102 typically has a relatively large surface area that faces the environment and is therefore suitable as a member for transferring heat away from the device 137811.doc -10- 200950154. In order to transfer heat from the heat sink 103 to the light guide plate i2, good heat transfer characteristics are required therebetween. At the same time, and in order to achieve good light propagation, it is preferred that total internal reflection can occur on the surfaces (including the top surface) of the light guide plate 102. By arranging the light guide plate 1〇2 such that a major area percentage 1〇6 is located at a specific, well-defined distance from one of the heat dissipation plates 103, _ is obtained from the heat dissipation plate 1〇3 Good heat transfer of the light guide plate 1 〇2, while total internal reflection (TIR) can occur in the light guide plate. The well defined distances described above are typically in the range of from about 1 micron to about 2 microns, typically about 20 microns. The heat sink 103 is divided into a plurality of spatially separated domains 13i, 132 having a section 丨 33 formed with a layer, i.e., a connecting portion, which is configured to connect adjacent domains. In this embodiment, a single LED 丄〇 i is placed on each domain and in good thermal contact with the domains, which effectively imparts each LED to a separate heat sink. Typically, the LED is centrally located (e.g., clamped) to the domain of the heat sink domains. However, it will be apparent to those skilled in the art that the present invention is not limited to having one LED in each heat sink area, and in other embodiments, several LEDs can be placed in each On the radiator field. In an exemplary embodiment of the invention, the spacing between the LEDs is in the range of i centimeters or centimeters, such as between 1 centimeter and 20 centimeters, for example, about 5 centimeters. When each LED is placed on a separate heat sink field, this also gives the approximate size (width) of the fields. 137811.doc 200950154 In this embodiment, the led hot plate 103 and the light guide plate are connected to the light. : 01 is connected to the light guide plate 1 〇 2, where a joint is formed. In other embodiments, the board may additionally or alternatively be connected by a member of the connecting portion _32 formed with the slab along a slanting path between adjacent 婉蜒 to (actually perpendicular to) relative to the implementation In the example, the path is outside the plane of the heat sink domain. As used herein, the term "婉蜒 path" refers to a non-straight path that presents to - a curve, bend, or fold. = used in the text, the term "along a route / configuration so that the path is completely at the connection H ' and makes the connection part of the money county similar to the shape of the replacement. Usually, there is no heat sink A line extending from the first domain to the domain, the line is completely located along one of the "婉蜒(4) = part. One of the links of the reverse path is a flexible part, and is usually flexible , which is similar to an elastic spring. As used herein, the term "flexibility" as a feature of one of the connecting portions is used to mean that the domains held together at the connecting portion are mutually When moving, for example, further separating from each other or squeezing toward each other, the connecting portions are compliant and do not break. Therefore, "flexibility" is not limited to meaning elastic or elastic. Further, the plastic deformation of the joint portion is allowed as long as the joint portion does not break during normal use of the device. One of the uses of the heat sink 103 is to transfer heat away from the LEDs 1〇ι to 137811.doc ·] 2· 200950154 ambient environment and to the light guide plate l〇2 ^ In operation, the LEDs mainly dissipate heat energy This causes an increase in the temperature of one of the LED itself, the heat sink, and the light guide. The temperature difference of the device between storage conditions and operating conditions can be as high as 100 〇C. • The heat sink 103 can be a metal heat sink, but can be used for other purposes besides being a heat sink. For example, the heat sink can be an insulated metal substrate printed circuit board (IMS PCB) that houses the components of the drive electronics of the LEDs 101. Generally, the light guide plate 102 and the heat sink i〇3 are made of different materials having different swelling properties by water vapor adhesion (from ambient air), different thermal expansion coefficients, and different volume and stress relaxation degrees. . For example, polymethyl methacrylate (a typical photoconductive material) has a hygroscopic expansion of 2% 、, a coefficient of thermal expansion of 80 ppm/Κ, and at most i.%. The volume shrinks, while aluminum (a typical heat sink material) has negligible expansion and volume • shrinkage, and a CPE of 23 PPm/K. Epoxy (a typical PCB material) has a CTE of 15 Ppm/K. Therefore, after heating, the light guiding plate exhibits an apparent (~1%) expansion above the length of the heat sink. • Due to the flexible/elastic connection between the radiator domains, any strain difference between the heat sink and the light guide plate due to non-uniform expansion, volume shrinkage, CTE and temperature changes is basically Adjusted for these flexible/elastic joints. Therefore, regardless of the difference in thermal expansion between the heat sink and the light guide plate, there is substantially no undesired thermal deformation of the device, and 137811 between the actual position and the optimal position of the LED relative to the light guide plate. .doc 13 200950154 Any undesired shift. Furthermore, it is more preferable to divide the heat sink (rather than the light guide plate) into a plurality of domains because it is preferred to allow light to propagate throughout the light guide plate. Moreover, since the heat sink is on the back side (non-viewing side) of the light guiding plate, and because there is no or substantially no opening gap in the heat sink, the device has a uniform appearance. Fig. 2a and Fig. 2b schematically illustrate another embodiment of a light-emitting device of the present invention. Also in this embodiment, the heat sink 1〇3 is divided into individual domains 131, 132, each pair of adjacent domains being connected by one or more connection portions 233. However, in this embodiment, the connecting portions 233 are disposed in the plane of the heat sink domains 131, 132. Therefore, it is generally easier to manufacture and does not substantially contribute to the thickness of the device, which is advantageous in some applications. In this embodiment, the adjacent connecting portions are separated by a gap 2〇4. The gap 204 is bridged by one or a plurality of connecting portions 233 composed of a narrow strip of the heat dissipating material. The narrow strip is along a meandering path between the adjacent heat sink domains 131,132. Also in this embodiment, the shape of the connecting portion 233 means a change/elasticity of its own, which can be adapted to the mutual movement between the adjacent fields. Thus, adjacent domains can be extended away from each other or toward each other while still being connected. The term "narrow strip" as used herein is considered to be a strip made of a material forming the joint portion which has a width which is significantly smaller than the width of the heat sink field to which the joint portion is joined, for example Having a width less than 25% of the width of the 137811.doc -14-200950154 „heater domain, for example less than 10% or even smaller s, eg 5% or less. The width of the gap 204 depends on the heat dissipation And the material of the light guide plate, but generally may be about 1% of the width of the heat sink field. * In an embodiment of the invention, and as shown in detail in Figure 2b, the side edges of the fields are Beveled 'so that an overlap is formed in the gap between the two adjacent domains' the sides of the domains face a gap 204 between two adjacent heat sink domains. When from the surface with the heat sink When the heat sink is viewed in a vertical direction, the overlapping edges have the effect of, for example, "hiding" the gap. An exemplary design of one of the edges for achieving overlapping edges while maintaining the gap is that an edge 205 of a first domain 131 has a third 215 above the first domain, which is along the heat sink The thickness calculation is extended to be longer than two-thirds of the first domain, and the opposite edge shape exists on the edge 206 of the phase domain 132, that is, one third of the adjacent domain 216 is extended. # is longer than two-thirds of it. With such an edge design, the extensions of the first and second domain edges can be weighted, and (d) a gap 204 is maintained between the adjacent domains. • Those skilled in the art will appreciate that the materials of the present invention are limited to the preferred embodiments described above. On the contrary, many modifications and variations are possible within the scope of the appended claims. For example, more than one connection portion can be used to connect two adjacent heat sink domains. In addition, one 翩丨, u τ G can be attached to a single
散熱器域。該連接部分$ U 愤丨刀之歲何圖形及其橫截面可隨該連接 部分之長度而變化。在以μ私、^ 上所述之實施例中，該等LED通 137811.doc •15- 200950154 常是配置在該光導板與該散熱器之間。然而，在本發明之 發光裝置之其他實施例中，可對該等LED進行不同配置， 例如，舉例而言將其等配置於該光導板之橫向邊緣或將其 等模製於該光導板中。此外’如以上所述，該光接收構件 不限於一光導板。舉例而言，亦期望具有其他幾何形狀之 一光導板，例如具有一朝向散熱器之平坦表面及一用於光 離開之圓頂狀相對表面之一光導板。亦可期望其他形狀以 用於本發明之一發光裝置。 【圖式簡單說明】 圖1示意地說明本發明之一發光裝置的一實施例之橫截 面圖β 圖2a不意地說明本發明之一發光裝置之另一實施例之俯 視圖。 圖2b是圖2a之散熱器之一細節的一橫截面圖。 【主要元件符號說明】 100 發光裝置 101 發光二極體 102 光接收元件/光導板 103 散熱器 104 底部表面 105 頂部表面 106 主要面積百分比 131 空間分離的域 132 空間分離的域 137811.doc 200950154 € V 133 ψ 形成有層片的區段/連接部分 204 間隙 205 邊緣 206 邊緣 - 215 第一域之上三分之一 , 216 相鄰域之下三分之一 233 連接部分 參 137811.doc • 17·Radiator domain. The connection portion $ U of the age of the sorcerer and its cross section may vary with the length of the connection portion. In the embodiment described in μ private, the LED 137811.doc • 15-200950154 is often disposed between the light guide plate and the heat sink. However, in other embodiments of the illuminating device of the present invention, the LEDs may be configured differently, for example, by arranging them on the lateral edges of the light guiding plate or molding them into the light guiding plate. . Further, as described above, the light receiving member is not limited to a light guide plate. For example, a light guide plate having other geometries is also desired, such as having a flat surface facing the heat sink and a light guide plate for a dome-shaped opposing surface for light exit. Other shapes are also contemplated for use in a light emitting device of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an embodiment of a light-emitting device of the present invention. Fig. 2a is a plan view showing another embodiment of a light-emitting device of the present invention. Figure 2b is a cross-sectional view of a detail of one of the heat sinks of Figure 2a. [Main component symbol description] 100 Light-emitting device 101 Light-emitting diode 102 Light-receiving element/light guide plate 103 Heat sink 104 Bottom surface 105 Top surface 106 Main area percentage 131 Space-separated field 132 Space-separated field 137811.doc 200950154 € V 133 区段 Segment/join section 204 with slab formation Clearance 205 Edge 206 Edge - 215 One-third above the first field, 216 One-third below the adjacent field 233 Connection part reference 137811.doc • 17·