TW200948248A - Method of drilling holes in a printed circuit board for a drilling machine - Google Patents

Method of drilling holes in a printed circuit board for a drilling machine Download PDF

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Publication number
TW200948248A
TW200948248A TW97116070A TW97116070A TW200948248A TW 200948248 A TW200948248 A TW 200948248A TW 97116070 A TW97116070 A TW 97116070A TW 97116070 A TW97116070 A TW 97116070A TW 200948248 A TW200948248 A TW 200948248A
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Taiwan
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coordinate value
target
new
drilling
circuit board
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TW97116070A
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Chinese (zh)
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Sheng-Yi Cheng
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Prostek Internat Inc
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Abstract

A method of drilling holes in a printed circuit board for a drilling machine obtains respectively a set of setting coordinate values and a set of image coordinate values. An X extension ratio and a Y extension ration are calculated with the setting coordinate values and the image coordinate values. A new constant term is obtained by a linear equation wherein the constant terms of the linear equation plus respectively the X extension ratio and the Y extension ratio equal to the new constant terms. The new constant terms with inverse calculations provides a set of target coordinate values. After the target coordinate values are provided, the coordinate value difference between the center points of the setting coordinate values and the image coordinate values is obtained so as to add the target coordinate values with the coordinate value difference to obtain a set of new target coordinate values. The new target coordinate values are transmitted to a drilling machine so that the drilling device of the drilling machine can drill holes in the printed circuit board at positions in accordance with the new target coordinate values.

Description

200948248 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種印刷電路板的鑽靶機的技術領 域,且特別是有關於一種印刷電路板的標靶孔的鑽孔方 法0 【先前技術】 印刷電路板(PCB)是電子資訊產品中不可或缺的元件 ® 之一,隨著電子資訊產品的應用與需求的多樣化’印刷電 路板也必須隨之在規格以及特性上作提升。 現有的多層印刷電路板必須經過反覆多道製程製 造。多層印刷電路板的各板層經壓合製程後,由於表面銅 箔會遮蓋住板層上原有之定位孔(即標乾孔),因此現有的 技術是使用X-Ray透視並整合影像與電控技術,正確導引 鑽靶機將標靶孔鑽出,以作為後續製程,如鑽孔、成型、 曝光等製程中的定位基準。 Φ 因此,標靶孔的精準性直接影響後續製程的良率。一 般來說’標靶孔的精度要求相當高。同時,隨著印刷電路 板的薄形化’在薄形印刷電路板(如〇.〇5〜0.1mm厚度)的製 程中,標靶孔的精度要求也相對提高。 現有的標把孔鐵孔方式’主要有見無鐵(Image Mode)、定距鑽(Distance Setting Mode)以及四點補償(4 Points Compensation Mode)三種。但是前述三種標無孔鑽 孔方式已經無法提供薄形印刷電路板對標靶孔精度的要 200948248 求。亦即,無法解決印刷電路板的各板層經壓合製程後, 各板層所產生標靶孔的漲縮以及不對稱的問題。 因此,有必要提出一種新的標靶孔鑽孔方式,以解決 或克服現有標把孔鑽孔方式的問題。 【發明内容】 本發明的目的是在提供一種印刷電路板鑽靶機的鑽 孔方法,用以提供精度高的標靶孔,提升印刷電路板製程 的良率。 本發明的另一目的是在提供一種印刷電路板鑽耙機 的鑽孔方法,用以解決現有標靶孔鑽孔方式所造成標靶孔 的漲縮以及不對稱的問題。 依照本發明之一種印刷電路板鑽靶機的鑽孔方法,係 分別取得印刷電路板上標靶孔的一組設定座標值以及一 組靶座標值。使用該設定座標值以及該靶座標值分別計算 X漲縮比以及γ張縮比。接著使用線性方程式來取得新常 數項,其中新常數項係線性方程式的常數項分別加上X張 縮比以及Y满縮比;並藉由使用該些新常數項反計算出目 標座標值。 於算出目標座標值後,分別計算設定座標值以及靶座 標值的中心點的座標值差,並將計算後的座標值差加入目 標座標值’以取得新目標座標值’用以將該些新目標座標 值送至一鑽靶機,使該鑽靶機的鑽孔裝置依據該些新目標 座標值於該印刷電路板上分別鑽出標乾孔。 200948248 在一實施例中,於取得新目標座標值之後,更可包含 旋轉新目標座標值的座標步驟。該步驟係計算設定座標值 以及靶座標值的角度差,以及計算中心點間連線的斜率以 及角度後,將新目標座標值的座標以新目標座標值的中心 點為中心旋轉該角度差,最後將旋轉後的新座標值平移回 其原來位置。 應用本發明所能達成的功效在於: 可以有效地解決現有標靶孔鑽孔方式所造成標靶孔 的漲縮以及不對稱的問題,進而提升後續製程,如鑽孔、 成型、曝光等製程中的良率,使印刷電路板的整體良率獲 得提升,而降低生產成本與提升產品的信賴性。 【實施方式】 請參照第1圖與第2圖所示,依照本發明之一種印刷 電路板鑽靶機的鑽孔方法,係於將印刷電路板送入鑽靶機 (如步驟210所示)後,分別取得印刷電路板上標靶孔的一 組設定座標值以及一組靶座標值(如步驟22〇所示)。使用 該設定座標值以及該靶座標值分別計算χ漲縮比以及γ漲 縮比(如步驟230所示ρ接著,使用線性方程式來取得新 常數項,其中新常數項係線性方程式的常數項分別加上χ 漲縮比以及Υ漲縮比(如步驟240所示);並藉由使用該些 新常數項反计算出目標座標值(如步驟250所示)。 於算出目標座標值後,分別計算設定座標值以及靶座 標值的中心點的座標值差,並將計算後的座標值差加入目 200948248 標座標值,以取得新目標座標值,用以將該些新目標座標 值送至一鑽靶機,使該鑽靶機的鑽孔裝置依據該些新目標 座標值於該印刷電路板上分別鑽出標靶孔(如步驟27〇所 示)。 在一實施例中,於取得新目標座標值之後,更可包含 旋轉新目標座標值的座標步驟(如步驟260所示)^該步驟 係计算設定座標值以及乾座標值的角度差,以及計算中心 點間連線的斜率以及角度後,將新目標座標值的座標以新 目標座標值的中心點為中心旋轉該角度差,最後將旋轉後 的新座標值平移回其原來位置β 請進一步參照第3圖所示,在本實施例中,係以四個 標靶孔為例子作說明。印刷電路板1 〇〇上分別具有四個標 靶孔,包含第一標靶孔110、第二標靶孔120、第三標靶孔 130以及第四標拓孔140 〇 如第1圖中步驟210以及步驟220所示,鑽靶機中具 有四個標把孔預設的設定座標值(Setting Value),此一組設 定座標值即:第一標靶孔110為(Xsl,Ysl)、第二標靶孔12〇 為(XS2,Ys2)、第三標靶孔130為(Xs3,Ys3)以及第四標靶孔 140 為(Xs4,Ys4) 〇 此外,當印刷電路板送入鑽靶機時,透過鑽靶機的影 像影像技術,可以取得一組標靶孔的靶座標值(Image Value),包含第一標靶孔11〇的靶座標值為(xml,Yml)、第 二標靶孔120的靶座標值為(Xm2,Ym2)、第三標靶孔130的 靶座標值為(Xm3,Ym3)以及第四標靶孔140的靶座標值為 200948248 (Xm4,Ym4) 0 由於設定座標值與靶座標值的實際差異並不大,但兩 者間的誤差已經超出標靶孔的精度範圍,因此若按照靶座 標值進行鑽孔,則標靶孔的精度無法維持,因此,須對標 靶孔的靶座標值作補償,以獲得實際加工座標值(即目標座 標值第3圖中係以誇大方式表現出設定座標值與靶座標 值的實際差異’以方便以下本發明實施例的揭露說明。 如第1圖中步驟230所示,在取得設定座標值以及靶 座標值後’分別計算各標靶孔之間的距離。第一標靶孔u〇 與第二標靶孔120間為第一距離,第二標靶孔12〇與第三 標托孔130間為第二距離,第三標靶孔13〇與第四標靶孔 140間為第三距離,第四標靶孔14〇與第一標靶孔11〇間 為第四距離。亦即: 第一距離:ds21=Xsl_Xs2, dm21=xml-xm2 ; 第一距離.ds32=Ys3-Ys2,dm32=Ym3_Ym2 ; 第三距離:ds34=Xs3-Xs4, dm34=xm3-xm4 ; 第四距離:ds41=Ys4-Ysl,dm41=Ym4-Yml。 其中下標S表示為設定座標值,下標m表示為靶座標 值。 使用設定座標值以及靶座標值分別計算X涨縮比以及 Y張縮比。本發明實施例定義漲縮比為: X '廉縮比(X 座標轴向)等於(dm21+dm34)/(ds21+ds34); γ 深縮比(γ 座標軸向)等於((iin32+dm41)/(ds32+ds41) 〇 由於X漲縮比與γ漲縮比的值相當小,因此本發明實 200948248 施例另定義標準差(sigma)為: X標準差等於(X漲縮比-。乘以一第一常數,即X標 準差等於(X漲縮比_υ乘以(ds2丨+ds34)/8,第一常數為 (ds21+ds34)/8與各標靶孔之間的距離有關; γ標準差等於(Y漲縮比-1)乘以一第二常數,即γ標 準差等於(Υ漲縮比-丨)乘以(ds32+ds41)/8,第二常數為 與各標靶孔之間的距離有關。 此一標準差為鑽靶機的誤差調整設定,其中除數8可 以根據鑽靶機的實際使用狀況,與以修正調整》 如第1圖中步驟240所示,使用線性方程式Y=mX+C 來取得新常數項。線性方程式中,m為斜率,C為常數項。 新常數項即為常數項C加上標準差。兩標靶孔間連線的斜 率可定義為: 第一標靶孔110與第二標靶孔120間連線的斜率 mi=(Ys2-Ysi)/(XS2-Xsi) ί 第二標靶孔120與第三標靶孔130間連線的斜率 m2=(Xs3-Xs2)/( Ys3-Ys2); 第三標靶孔130與第四標靶孔140間連線的斜率 m3 = (Ys3-Ys4)/(Xs3-Xs4), 第四標靶孔140與第一標靶孔110間連線的斜率 m4=(Xs4-Xsl)/(Ys4-Ysl)。 其中第二標靶孔120與第三標靶孔130間的連線以及 第四標靶孔140與第一標靶孔11〇間的連線因為垂直方 向,斜率會無限大,因此將X座標值與Y座標值交換。 11 200948248 ,由線性方程式可得:200948248 IX. Description of the Invention: [Technical Field] The present invention relates to the field of drilling target machines for printed circuit boards, and in particular to a method for drilling a target hole of a printed circuit board. Technology] Printed circuit board (PCB) is one of the indispensable components in electronic information products. With the diversification of the application and demand of electronic information products, printed circuit boards must also be improved in terms of specifications and characteristics. Existing multilayer printed circuit boards must be fabricated in a multi-pass process. After the various layers of the multilayer printed circuit board are pressed, the existing copper foil will cover the original positioning holes (ie, the dry holes) on the board layer, so the existing technology uses X-Ray perspective and integrates image and electricity. Control technology, correctly guide the drilling target machine to drill the target hole as a positioning reference in the subsequent process, such as drilling, forming, exposure and other processes. Φ Therefore, the accuracy of the target hole directly affects the yield of subsequent processes. In general, the accuracy of the target hole is quite high. At the same time, with the thinning of the printed circuit board, the accuracy of the target hole is relatively improved in the process of a thin printed circuit board (e.g., 5 to 0.1 mm thickness). The existing standard method of the iron hole of the standard hole is mainly seen in the image mode, the Distance Setting Mode and the 4 Points Compensation Mode. However, the above three types of non-porous drilling methods have been unable to provide a thin printed circuit board for the accuracy of the target hole. That is to say, it is impossible to solve the problem of the expansion and contraction of the target holes generated by the respective layers after the lamination process of the respective layers of the printed circuit board and the asymmetry. Therefore, it is necessary to propose a new method of drilling the target hole to solve or overcome the problem of the drilling method of the existing standard hole. SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of drilling a hole in a printed circuit board drilling target machine for providing a high precision target hole and improving the yield of the printed circuit board process. Another object of the present invention is to provide a method of drilling a drilled circuit board for a printed circuit board to solve the problem of shrinkage and asymmetry of the target hole caused by the drilling method of the existing target hole. A method of drilling a drilled circuit board of a printed circuit board according to the present invention is to obtain a set of set coordinate values of a target hole on a printed circuit board and a set of target coordinate values, respectively. The X expansion ratio and the γ expansion ratio are calculated using the set coordinate value and the target coordinate value, respectively. A linear equation is then used to obtain a new constant term, where the new constant term is the constant term of the linear equation plus the X-zoom ratio and the Y-shrink ratio, respectively; and the target coordinate values are inversely calculated by using the new constant terms. After calculating the target coordinate value, respectively calculate the coordinate value of the set coordinate value and the center point of the target coordinate value, and add the calculated coordinate value difference to the target coordinate value 'to obtain the new target coordinate value' for the new The target coordinate value is sent to a drilling target machine, so that the drilling device of the drilling target machine drills a dry hole on the printed circuit board according to the new target coordinate values. 200948248 In an embodiment, after the new target coordinate value is obtained, a coordinate step of rotating the new target coordinate value may be further included. This step calculates the angular difference between the set coordinate value and the target coordinate value, and calculates the slope and angle of the connection between the center points, and rotates the coordinate of the new target coordinate value around the center point of the new target coordinate value. Finally, the rotated new coordinate value is translated back to its original position. The effect that can be achieved by the application of the invention is that: the problem of the expansion and contraction of the target hole caused by the drilling method of the existing target hole can be effectively solved, thereby improving the subsequent processes, such as drilling, molding, exposure, etc. The yield improves the overall yield of printed circuit boards, reducing production costs and increasing product reliability. [Embodiment] Referring to Figures 1 and 2, a method of drilling a printed circuit board drilling target machine according to the present invention is to feed a printed circuit board into a drilling target machine (as shown in step 210). Thereafter, a set of set coordinate values and a set of target coordinate values of the target holes on the printed circuit board are respectively obtained (as shown in step 22A). Using the set coordinate value and the target coordinate value to calculate the χ contraction ratio and the γ expansion ratio respectively (as shown in step 230, ρ then, using a linear equation to obtain a new constant term, where the constant term of the new constant term linear equation is respectively In addition, the 涨 zoom ratio and the Υ zoom ratio (as shown in step 240) are used; and the target coordinate values are inversely calculated by using the new constant terms (as shown in step 250). After calculating the target coordinate values, respectively Calculate the coordinate value of the set coordinate value and the center point of the target coordinate value, and add the calculated coordinate value difference to the target value of 200948248 to obtain the new target coordinate value, and send the new target coordinate value to one. Drilling the target machine, so that the drilling device of the drilling target machine respectively drills a target hole on the printed circuit board according to the new target coordinate values (as shown in step 27A). In an embodiment, a new one is obtained. After the target coordinate value, the coordinate step of rotating the new target coordinate value may be further included (as shown in step 260). ^ The step is to calculate the angular difference between the set coordinate value and the dry coordinate value, and calculate the connection between the center points. After the rate and the angle, the coordinates of the new target coordinate value are rotated around the center point of the new target coordinate value, and finally the rotated new coordinate value is translated back to its original position. Please refer to FIG. 3 further. In the present embodiment, four target holes are taken as an example. The printed circuit board 1 has four target holes respectively, including a first target hole 110, a second target hole 120, and a third The target hole 130 and the fourth target hole 140 are as shown in step 210 and step 220 in FIG. 1 , and the set target value of the four target holes in the drill target machine is set. The coordinate values are: the first target hole 110 is (Xsl, Ysl), the second target hole 12 is (XS2, Ys2), the third target hole 130 is (Xs3, Ys3), and the fourth target hole 140 is (Xs4, Ys4) 〇 In addition, when the printed circuit board is fed into the drilling target machine, the target image value of the target hole can be obtained through the image imaging technology of the drilling target machine, including the first target. The target coordinate value of the hole 11〇 is (xml, Yml), and the target coordinate value of the second target hole 120 is (Xm2, Ym2), The target coordinate value of the third target hole 130 is (Xm3, Ym3) and the target coordinate value of the fourth target hole 140 is 200948248 (Xm4, Ym4). 0 Since the actual difference between the set coordinate value and the target coordinate value is not large, However, the error between the two has exceeded the accuracy of the target hole. Therefore, if the hole is drilled according to the target coordinate value, the accuracy of the target hole cannot be maintained. Therefore, the target coordinate value of the target hole must be compensated to obtain The actual machining coordinate value (ie, the actual coordinate value of the target coordinate value in FIG. 3 shows the actual difference between the set coordinate value and the target coordinate value in an exaggerated manner) to facilitate the disclosure of the following embodiments of the present invention. As shown in step 230 in FIG. After obtaining the set coordinate value and the target coordinate value, the distance between each target hole is calculated separately. a first distance between the first target aperture u〇 and the second target aperture 120, a second distance between the second target aperture 12〇 and the third reference aperture 130, and a third target aperture 13〇 and fourth A third distance is between the target holes 140, and a fourth distance between the fourth target hole 14〇 and the first target hole 11〇. That is: the first distance: ds21=Xsl_Xs2, dm21=xml-xm2; the first distance.ds32=Ys3-Ys2, dm32=Ym3_Ym2; the third distance: ds34=Xs3-Xs4, dm34=xm3-xm4; the fourth distance :ds41=Ys4-Ysl, dm41=Ym4-Yml. The subscript S is represented as a set coordinate value, and the subscript m is represented as a target coordinate value. The X-roughness ratio and the Y-zoom ratio are calculated using the set coordinate value and the target coordinate value, respectively. The embodiment of the present invention defines the expansion ratio as: X 'induction ratio (X coordinate axis) is equal to (dm21 + dm34) / (ds21 + ds34); γ expansion ratio (γ coordinate axis) is equal to ((iin32 + dm41) /(ds32+ds41) 〇 Since the value of the X-roughness ratio and the γ-ratio is relatively small, the present invention 200948248 additionally defines a standard deviation (sigma) as: X standard deviation is equal to (X-ratio--. Taking a first constant, that is, the X standard deviation is equal to (X expansion ratio _υ multiplied by (ds2丨+ds34)/8, the first constant is (ds21+ds34)/8 is related to the distance between each target hole ; γ standard deviation is equal to (Y expansion ratio -1) multiplied by a second constant, that is, γ standard deviation is equal to (Υ Υ-ratio - 丨) multiplied by (ds32 + ds41) / 8, the second constant is with each standard The distance between the target holes is related. This standard deviation is the error adjustment setting of the drilling target machine, wherein the divisor 8 can be adjusted according to the actual use condition of the drilling target machine, and the correction is adjusted as shown in step 240 in FIG. Use the linear equation Y=mX+C to get the new constant term. In the linear equation, m is the slope and C is the constant term. The new constant term is the constant term C plus the standard deviation. The slope of the line between the two target holes It is defined as: the slope of the line connecting the first target hole 110 and the second target hole 120 mi=(Ys2-Ysi)/(XS2-Xsi) ί the second target hole 120 is connected with the third target hole 130 The slope of the line m2=(Xs3-Xs2)/(Ys3-Ys2); the slope of the line connecting the third target hole 130 and the fourth target hole 140 m3 = (Ys3-Ys4)/(Xs3-Xs4), The slope of the line connecting the four target holes 140 and the first target hole 110 is m4=(Xs4-Xsl)/(Ys4-Ysl), wherein the connection between the second target hole 120 and the third target hole 130 and The line between the fourth target hole 140 and the first target hole 11〇 is infinite due to the vertical direction, so the X coordinate value is exchanged with the Y coordinate value. 11 200948248 , which is obtained by the linear equation:

Ysl~miXsl + C! ’即 c1= YsYS2=m2xs2 + c2,即γ C1= Ysi- miXsl ;Ysl~miXsl + C! ′ ie c1= YsYS2=m2xs2 + c2, ie γ C1= Ysi- miXsl ;

1到C:4為原常數項。將原 成為新常數項,可得新常數項為: 。將原常數項加上標準差 C!(新常數項)=Ci(原常數項χ_γ標準差); C2(新常數項)=C2(原常數項)+x標準差; C3(新常數項)=c:3(原常數項)+(_γ標準差); C4(新常數項)=c:4(原常數項)+χ標準差。 如第1圖中步釋250所示,下—步驟使用前述的新常 數項與斜率計算出目標座標值(Xt,Yt)。以第一標靶孔 iio(xtl,Yu)為例,第一標靶孔11〇與第四標靶孔14〇間的 連線斜率為mi線性方程式為Ytl=m4Xtl+C4。第一標靶孔 110與第二標靶孔12〇間的連線為mi,線性方程式為 G Ytrn^Xn+C! 〇 解 Yti=m4Xtl+C4 以及 YtemiXu+C^,可以得出: Xti=(Yti-Ci)/m1 » Yti=(Ci+miC4)/(l-mim4); 同理:1 to C: 4 is the original constant term. The original constant term is obtained, and the new constant term is: Add the original constant term to the standard deviation C! (new constant term) = Ci (the original constant term χ _ γ standard deviation); C2 (new constant term) = C2 (the original constant term) + x standard deviation; C3 (new constant term) =c: 3 (original constant term) + (_γ standard deviation); C4 (new constant term) = c: 4 (original constant term) + χ standard deviation. As shown in step 250 of Figure 1, the lower-step uses the aforementioned new constant term and slope to calculate the target coordinate value (Xt, Yt). Taking the first target hole iio(xtl, Yu) as an example, the slope of the line between the first target hole 11〇 and the fourth target hole 14〇 is mi. The linear equation is Ytl=m4Xtl+C4. The line connecting the first target hole 110 and the second target hole 12 is mi, and the linear equation is G Ytrn^Xn+C! YYti=m4Xtl+C4 and YtemiXu+C^, which can be obtained: Xti= (Yti-Ci)/m1 » Yti=(Ci+miC4)/(l-mim4); For the same reason:

Xt2 = (C2+m2Ci)/(l-mini2) ’ Yt2=(Xt2-C2)/ni2 ; Xt3=(Yt3-C3)/m3,Yt3=(C3+m3C2)/(l-m2m3); Xt4=(C4+m4C3)/(l-m3ni4),Yt4=(Xt4_C4)/m4。 因此,由於斜率(m)以及新常數項(C)為已知,即可求 12 200948248 出目標座標值(Xt,Yt)。 下一步驟計算座標值差(Delta , De),並將計算座標值 差加入目標座標值(xt,Yt),以取得新目標座標值(Xt,Yt)。 座標值差可以使用下列方式求得: 計算設定座標值以及靶座標值的中心座標值 (XC,YC)。設定座標值的中心座標值(又…^為: Xcs=(Xsl+Xs2+Xs3+Xs4)/4 ; ycs=(ys1+ys2+Ys3+Ys4)/4。 輕座標值的中心座標值(Xcm,Ycm)為: XCm=(Xml+Xm2+Xm3+Xm4)/4 ; Yms=(Yml+Ym2+Ym3+Ym4)/4。 計算設定座標值以及粗座標值的中心座標值(Xc,Yc) 的中心平均值(Avg)。Xt2 = (C2+m2Ci)/(l-mini2) ' Yt2=(Xt2-C2)/ni2 ; Xt3=(Yt3-C3)/m3, Yt3=(C3+m3C2)/(l-m2m3); Xt4= (C4+m4C3)/(l-m3ni4), Yt4=(Xt4_C4)/m4. Therefore, since the slope (m) and the new constant term (C) are known, the target coordinate value (Xt, Yt) can be obtained from 12 200948248. The next step calculates the coordinate value difference (Delta, De) and adds the calculated coordinate value difference to the target coordinate value (xt, Yt) to obtain the new target coordinate value (Xt, Yt). The coordinate value difference can be obtained by: Calculating the set coordinate value and the center coordinate value (XC, YC) of the target coordinate value. Set the center coordinate value of the coordinate value (also...^: Xcs=(Xsl+Xs2+Xs3+Xs4)/4; ycs=(ys1+ys2+Ys3+Ys4)/4. Center coordinate value of the light coordinate value (Xcm , Ycm) is: XCm=(Xml+Xm2+Xm3+Xm4)/4; Yms=(Yml+Ym2+Ym3+Ym4)/4. Calculate the coordinate value of the set coordinate value and the coarse coordinate value (Xc, Yc) Center average (Avg).

Avgx=(Xcs+Xcm)/2 ; Avg广(Ycs+Ycm)/2。 求出座標值差(Delta,De)Avgx = (Xcs + Xcm) / 2; Avg wide (Ycs + Ycm) / 2. Find the coordinate value difference (Delta, De)

Dex=Avgx-Xcs ; Dey=Avgy-Ycs。 即可將計算的座標值差加入目標座標值(Xt,Yt),以取 得新目標座標值(Xt,Yt)。即為:Dex=Avgx-Xcs; Dey=Avgy-Ycs. The calculated coordinate value difference can be added to the target coordinate value (Xt, Yt) to obtain the new target coordinate value (Xt, Yt). That is:

Xtl(新目標座標值)=Xtl(目標座標值)+Dex ;Xtl (new target coordinate value) = Xtl (target coordinate value) + Dex;

Ytl(新目標座標值)=Ytl(目標座標值)+Dey ;Ytl (new target coordinate value) = Ytl (target coordinate value) + Dey;

Xu(新目標座標值)=Xt2(目標座標值)+Dex ;Xu (new target coordinate value) = Xt2 (target coordinate value) + Dex;

Yt2(新目標座標值)=Yt2(目標座標值)+Dey ;Yt2 (new target coordinate value) = Yt2 (target coordinate value) + Dey;

Xt3(新目標座標值)=xt3(目標座標值)+Dex ;Xt3 (new target coordinate value) = xt3 (target coordinate value) + Dex;

Yt3(新目標座標值)=Yt3(目標座標值)+Dey ;Yt3 (new target coordinate value) = Yt3 (target coordinate value) + Dey;

Xt4(新目標座標值)=Xt4(目標座標值)+Dex ;Xt4 (new target coordinate value) = Xt4 (target coordinate value) + Dex;

Yt4(新目標座標值)=Yt4(目標座標值)+Dey。 13 200948248 如第1圖中步驟270所示,將新目標座標值(Xt,Yt)送 至鑽乾機的電控裝置,以驅動鑽_的鑽孔裝置依據新目 標座標值(xt,Yt)”刷電路板上分簡出標乾孔。 如第1圖中步驟260所示,在另一實施例中,可以再 進行新目標座標值(Xt,Yt)的座標旋轉。 計算設定座標值以及靶座標值的角度差。此一步驟包 含分別計算設定座標值以及靶座標值的中心點座標值。 設定座標值的中心點座標值為:Yt4 (new target coordinate value) = Yt4 (target coordinate value) + Dey. 13 200948248 As shown in step 270 of Figure 1, the new target coordinate value (Xt, Yt) is sent to the electronic control unit of the drill dryer to drive the drilling device according to the new target coordinate value (xt, Yt). The brush circuit board is divided into the standard dry holes. As shown in step 260 in Fig. 1, in another embodiment, the coordinate rotation of the new target coordinate value (Xt, Yt) can be performed. The angular difference of the target coordinate value. This step includes calculating the set coordinate value and the center point coordinate value of the target coordinate value. The center point coordinate value of the set coordinate value is:

Xs12=(Xsi+Xs2)/2 ’ Ys12=(Ys1+ys2)/2 ;Xs12=(Xsi+Xs2)/2 ′ Ys12=(Ys1+ys2)/2 ;

Xs23=(XS2+XS3)/2,Ys23=(Ys2+Ys3)/2 ;Xs23=(XS2+XS3)/2, Ys23=(Ys2+Ys3)/2 ;

Xs34=(Xs3+Xs4)/2 > Ys34=(Ys3+Ys4)/2 ;Xs34=(Xs3+Xs4)/2 >Ys34=(Ys3+Ys4)/2;

Xsi4=(Xs1+Xs4)/2 ’ Ysl4=(Ysl+Ys4)/2。 靶座標值的中心點座標值為:Xsi4=(Xs1+Xs4)/2 ’ Ysl4=(Ysl+Ys4)/2. The center point coordinate of the target coordinate value is:

Xml2=(Xml+Xm2)/2,Ymi2=(Ymi+Ym2)/2 ;Xml2=(Xml+Xm2)/2, Ymi2=(Ymi+Ym2)/2 ;

Xm23 = (Xm2+Xm3)/2 ’ Ym23 = (Ym2+Ym3)/2 ;Xm23 = (Xm2+Xm3)/2 ′ Ym23 = (Ym2+Ym3)/2 ;

Xm34=(Xm3+Xm4)/2,Ym34=(Ym3+Ym4)/2 ;Xm34=(Xm3+Xm4)/2, Ym34=(Ym3+Ym4)/2 ;

XxnU^Xrm + XnwOQ,Yml4=(Yml+Ym4)/2。 計算中心點間連線的斜率以及角度(theta)。 計算設定座標值的中心點(Xsl2,Ysl2)與中心點 (XS34,YS34)連線的斜率為: msi=(YS34-Ysi2)/(Xs34_Xsi2) ’ 角度 thetasi=tan (msi), 計算設定座標值的中心點(XS14,YSM)與中心點 (XS23,Ys23)連線的斜率為: ms2=(YS23-Ysi4)/(Xs23-Xsl4),角度 thetasftan'mu)。 200948248 同理,乾座標值中心點間連線的斜率以及角度(theta) 為. mmi=(Ym34-Ymi2)/(Xm34-Xmi2),角度 thetamistarT^mmi); mm2 = (Ym23-Yml4)/(Xm23_Xml4),角度 thetamftairkmn^)。 計算設定座標值的中心點間連線的角度以及靶座標 值中心點間連線的角度的角度差(Delta theta,De_theta)。 先計算設定座標值與靶座標值中心點間連線的角度 平均值(Avg_theta)。 春 Avg_thetas=(thetasl+thetas2)/2(設定座標值);XxnU^Xrm + XnwOQ, Yml4=(Yml+Ym4)/2. Calculate the slope and angle of the line between the center points. Calculate the slope of the line connecting the center point (Xsl2, Ysl2) of the set coordinate value to the center point (XS34, YS34): msi=(YS34-Ysi2)/(Xs34_Xsi2) 'An angle thetasi=tan (msi), calculate the set coordinate value The slope of the line connecting the center point (XS14, YSM) to the center point (XS23, Ys23) is: ms2 = (YS23-Ysi4) / (Xs23 - Xsl4), angle thetasftan 'mu). 200948248 Similarly, the slope and angle (theta) of the line between the center points of the dry coordinate values are . mmi=(Ym34-Ymi2)/(Xm34-Xmi2), the angle thetamistarT^mmi); mm2 = (Ym23-Yml4)/( Xm23_Xml4), angle thetamftairkmn^). Calculate the angle of the line connecting the center point of the set coordinate value and the angle of the angle between the center points of the target coordinate value (Delta theta, De_theta). First calculate the average value (Avg_theta) of the line connecting the set coordinate value to the center point of the target coordinate value. Spring Avg_thetas=(thetasl+thetas2)/2 (set coordinate value);

Avg_thetam=(thetaml+thetam2)/2(靶座標值)。 所以,角度差為:Avg_thetam=(thetaml+thetam2)/2 (target coordinate value). Therefore, the angle difference is:

De_theta=(Avg—thetam-Avg_thetas)/2。 下一步驟,將新目標座標值(Xt,Yt)的座標以新目標座 標值的中心點(Xct,Yct)為中心旋轉角度差,即De theta。 在旋轉前,將新目標座標值(Xt,Yt)平移至中心點 (Xct,Yct) ’移作旋轉。在平移前計算新目標座標值(Xt,Yj Ο 的中心點(xct,Yct)為:De_theta=(Avg—thetam-Avg_thetas)/2. In the next step, the coordinates of the new target coordinate value (Xt, Yt) are rotated by the angular difference of the center point (Xct, Yct) of the new target coordinate value, that is, De theta. Before the rotation, the new target coordinate value (Xt, Yt) is shifted to the center point (Xct, Yct) and moved to rotate. Calculate the new target coordinate value (Xt, Yj Ο center point (xct, Yct) before translation:

Xct=(Xtl+Xt2+Xt3+Xt4)/4 ;Xct=(Xtl+Xt2+Xt3+Xt4)/4 ;

Yct=(Yti+Yt2+Yt3+Yt4)/4。 將新目標座標值(Xt,Yt)平移至中心點(Xct,Yet),即將新 目標座標值(Xt,Yt)減去中心點(xct,Yct)座標值。 關於第一標靶孔110 : 平移後座標值 rXtl=Xtl_xct,rYtl=Ytl_Y t . 關於第二標靶孔120 : 15 200948248 平移後座標值 rXt2=Xt2_Xet ’ rYt2 = Yt2_Yct ; 關於第三標靶孔130 : 平移後座標值 rXt3=Xt3-Xct,rYt3=Yt3-Yct ; 關於第四標靶孔140 : 平移後座標值 rXt4=Xt4-Xet,rYt4=Yt4-Yct。 旋轉平移後座標值角度差(De_theta): 關於第一標靶孔110 : rXtl(新座標值)=rXtl(原座標值)Cos(De_theta)-rYtl(原 ® 座標值)Sin(De_theta); rYti(新座標值)=rYti(原座標值)Cos(De_theta)-rYtl(原 座標值)Sin(De_tlieta); 關於第二標靶孔120 : rXt2(新座標值)=rXt2(原座標值)Cos(De_theta)-rYt2(原 座標值)Sin(De_theta); rYt2(新座標值)=rYt2(原座標值)Cos(De—theta)-rYt2(原 座標值)Sin(De_theta); ❹ 關於第三標靶孔130 : rXt3(新座標值)=rXt3(原座標值)Cos(De_theta)-rYt3(原 座標值)Sin(De_theta); rYt3(新座標值)=rYt3(原座標值)Cos(De_theta)-rYt3(原 座標值)Sin(De_theta); 關於第四標靶孔140 : rXt4(新座標值)=rXt4(原座標值)Cos(De_theta)-rYt4(原 座標值)Sin(De_theta); 16 200948248 rYt4(新座標值)=rYt4(原座標值)Cos(De_theta)-rYt4(原 座標值)Sin(De_theta)。 最後,將旋轉後的新座標值(rXt,rYt)平移回其原來位 置: 關於第一標靶孔110 :Yct=(Yti+Yt2+Yt3+Yt4)/4. Shift the new target coordinate value (Xt, Yt) to the center point (Xct, Yet), which is the new target coordinate value (Xt, Yt) minus the center point (xct, Yct) coordinate value. Regarding the first target hole 110: the post-translational coordinate value rXtl=Xtl_xct, rYtl=Ytl_Y t. Regarding the second target hole 120: 15 200948248 Post-translational coordinate value rXt2=Xt2_Xet ' rYt2 = Yt2_Yct ; Regarding the third target hole 130 : Post-translational coordinate value rXt3=Xt3-Xct, rYt3=Yt3-Yct; Regarding the fourth target hole 140: Post-translational coordinate value rXt4=Xt4-Xet, rYt4=Yt4-Yct. Rotational translational coordinate value angle difference (De_theta): About the first target hole 110: rXtl (new coordinate value) = rXtl (original coordinate value) Cos (De_theta) - rYtl (original ® coordinate value) Sin (De_theta); rYti (new coordinate value) = rYti (original coordinate value) Cos (De_theta) - rYtl (original coordinate value) Sin (De_tlieta); About the second target hole 120: rXt2 (new coordinate value) = rXt2 (original coordinate value) Cos (De_theta)-rYt2 (original coordinate value) Sin(De_theta); rYt2 (new coordinate value)=rYt2 (original coordinate value) Cos(De-theta)-rYt2 (original coordinate value) Sin(De_theta); ❹ About the third Target hole 130: rXt3 (new coordinate value) = rXt3 (original coordinate value) Cos (De_theta) - rYt3 (original coordinate value) Sin (De_theta); rYt3 (new coordinate value) = rYt3 (original coordinate value) Cos (De_theta ) - rYt3 (original coordinate value) Sin (De_theta); Regarding the fourth target hole 140: rXt4 (new coordinate value) = rXt4 (original coordinate value) Cos (De_theta) - rYt4 (original coordinate value) Sin (De_theta); 16 200948248 rYt4 (new coordinate value) = rYt4 (original coordinate value) Cos (De_theta) - rYt4 (original coordinate value) Sin (De_theta). Finally, the rotated new coordinate value (rXt, rYt) is translated back to its original position: Regarding the first target hole 110:

Xtl=rXtl(新原座標值)+Xct; Ytl=rYtl(新原座標值)+Yct; 關於第二標靶孔120 :Xtl=rXtl (new original coordinate value)+Xct; Ytl=rYtl (new original coordinate value)+Yct; Regarding the second target hole 120:

Xt2=rXt2(新原座標值)+Xet; Yt2=rYt2(新原座標值)+Yct; _ 關於第三標靶孔130 :Xt2=rXt2 (new original coordinate value)+Xet; Yt2=rYt2 (new original coordinate value)+Yct; _About the third target hole 130:

Xt3=rXt3(新原座標值)+Xct; Yt3=rYt3(新原座標值)+Yct; 關於第四標靶孔140 :Xt3=rXt3 (new original coordinate value)+Xct; Yt3=rYt3 (new original coordinate value)+Yct; Regarding the fourth target hole 140:

Xt4=rXt4(新原座標值)+Xct; Yt4=rYt4(新原座標值)+ Yct。 將旋轉後的新目標座標值(Xt,Yt)送至鑽靶機的電控裝 置,以驅動鑽靶機的鑽孔裝置依據新目標座標值(Xt,Yt)於 印刷電路板上分別鑽出標靶孔。 雖然本發明已以一較佳實施例揭露如上,然其並非用 〇 以限定本發明,任何熟習此技藝者,在不脫離本發明之精 神和範圍内,當可作各種之更動與潤飾,因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂,所附圖式之詳細說明如下: 17 200948248 第1圖係繪示本發明 機的鑽孔方法的流程圖。 一實施例之一 種印刷電路板鑽靶 第2圖係繪示用於實施本發明實施例之—印刷電路板 的示意圖》 第3圖係繪示第2圖中,印刷電路板的標靶孔之設定 座標值以及靶座標值的位置座標示意圖。 ❿ 【主要元件符號說明】 100 :印刷電路板 130 :第三標靶孔 110 :第一標靶孔 140 :第四標靶孔 120 :第二標靶孔 210-270 :步驟 ❹ 18Xt4=rXt4 (new original coordinate value)+Xct; Yt4=rYt4 (new original coordinate value)+Yct. Sending the rotated new target coordinate value (Xt, Yt) to the electronic control device of the drilling target machine to drive the drilling device of the drilling target machine to drill out on the printed circuit board according to the new target coordinate value (Xt, Yt) Target hole. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and various modifications and changes may be made without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the detailed description of the drawings is as follows: 17 200948248 Figure 1 shows the drill of the machine of the present invention. Flow chart of the hole method. A printed circuit board drill target of an embodiment is a schematic view of a printed circuit board for carrying out an embodiment of the present invention. FIG. 3 is a diagram showing a target hole of the printed circuit board in FIG. Set the coordinate value of the coordinate value and the target coordinate value. ❿ [Main component symbol description] 100: Printed circuit board 130: Third target hole 110: First target hole 140: Fourth target hole 120: Second target hole 210-270: Step ❹ 18

Claims (1)

200948248 十、申請專利範圍: 1. 一種印刷電路板鑽靶機的鑽孔方法,至少包含: 將一印刷電路板送入鑽靶機; 分別取得該印刷電路板上標靶孔的一組設定座標值 以及一組乾座標值; 使用該設定座標值以及該靶座標值分別計算X漲縮 比以及Y漲縮比; 使用線性方程式來取得新常數項,其中.新常數項係線 性方程式的常數項分別加上X漲縮比以及Y漲縮比; 使用該些新常數項反計算出目標座標值; 分別計算該設定座標值以及該靶座標值的中心點的 座標值差’並將計算後的座標值差加入目標座標值,以取 得新目標座標值;以及 將該些新目標座標值送至鑽靶機的電控裝置,以驅動 鑽靶機的鑽孔裝置依據該些新目標座標值於該印刷電路 板上分別鑽出標靶孔。 2·如申請專利範圍第1項所述印刷電路板鑽靶機的 鑽孔方法,其中於取得新目標座標值之後,更包含: 旋轉新目標座標值的座標,包含: 計算設定座標值以及靶座標值的角度差; 計算中心點間連線的斜率以及角度; 將新目標座標值的座標以新目標座標值的中心點 為中心旋轉該角度差;以及 200948248 將旋轉後的新座標值平移回其原來位置β 3·如申請專利範圍第1項所述印刷電路板鑽把機的 鑽孔方法,其中該使用該設定座標值以及該乾座標值分別 計算X漲縮比以及Υ漲縮比的步驟包含: 分別計算各標靶孔之間的距離; 使用各標輕孔之間的距離分別計算X涨縮比以及γ寐 縮比;以及 V 分別計算X標準差以及Υ標準差,其中X標準差等 於(X漲縮比-1)乘以一第一常數,Υ標準差等於(Υ漲縮比 -1)乘以一第二常數,該第一常數與該第二常數係與各標靶 孔之間的距離有關。 4.如申請專利範圍第1項所述印刷電路板錢靶機的 鑽孔方法’其中該使用線性方程式來取得新常數項,其中 新常數項係線性方程式的常數項分別加上X漲縮比以及γ ❿ 漲縮比的步驟包含: 使用線性方程式Y=mX+C來取得新常數項,其中m 為兩標靶孔間連線的斜率,C為原常數項;以及 將原常數項加上標準差成為新常數項,其中新常數項 等於原常數項加上X標準差以及γ標準差兩者其中之一。 5.如申請專利範圍第4項所述印刷電路板鑽靶機的 鑽孔方法’其中該目標座標值係使用該新常數項以及該斜 20 200948248 率表示。 6. 如申請專利範圍第1項所述印刷電路板鑽靶機的 鑽孔方法,其中該分別計算該設定座標值以及該靶座標值 的中心點的座標值差,並將計算後的座標值差加入目標座 標值,以取得新目標座標值的步驟,包含: 計算該設定座標值以及該靶座標值的中心座標值; 計算該設定座標值以及該靶座標值的中心座標值的 中心平均值; 將中心平均值減去中心座標值,求出座標值差;以及 將計算的座標值差加入目標座標值,以取得新目標座 標值。 7. —種印刷電路板鑽靶機的鑽孔方法,至少包含: 分別取得一印刷電路板上標靶孔的一組設定座標值 以及一組靶座標值; 使用該設定座標值以及該靶座標值分別計算χ張縮 比以及Υ漲縮比; 使用線性方程式來取得新常數項,其中新常數項係線 性方程式的常數項分別加上X漲縮比以及γ澡縮比; 使用該些新常數項反計算出目標座標值;以及 分別計算該設定座標值以及該靶座標值的中心點的 座標值差’並將計算後的座標值差加入目標座標值,以取 得新目標座標值’用以將該些新目標座標值送至一鑽無 21 200948248 機’使該鑽靶機的鑽孔裝置依據該些新目標座標值於該印 刷電路板上分別鑽出標靶孔β 8. 如申請專利範圍第7項所述印刷電路板鑽靶機的 鑽孔方法,其中於取得新目標座標值之後,更包含: 旋轉新目標座標值的座標,包含: 計算設定座標值以及靶座標值的角度差; 計算中心點間連線的斜率以及角度; 將新目標座標值的座標以新目標座標值的中心點 為中心旋轉該角度差;以及 將旋轉後的新座標值平移回其原來位置。 9. 如申請專利範圍第7.項所述印刷電路板錢靶機的 鑽孔方法,其中該使用該設定座標值以及該靶座標值分別 °十算X張縮比以及γ寐縮比的步驟包含: 分別計算各標無孔之間的距離; 使用各標靶孔之間的距離分別計算χ漲縮比以及丫漲 縮比;以及 分別計算X標準差以及γ標準差,其中χ標準差等 於(X羅縮比_1)乘H常數,γ標準差等於(γ羅縮比 -1)乘以-第二常數,該第-常數與該第二常數係與各㈣ 孔之間的距離有關。 10.如申請專利範圍第7項所述印刷電路板鑽靶機的 22 200948248 鑽孔方法,其中該使用線性方程式來取得新常數項,其中 常數項係線性方程式的常數項分別加上X激縮比以及γ 漲縮比的步驟包含: 使用線性方程式Y=mX+c來取得新常數項其中m 為兩標靶孔間連線的斜率,C為原常數項;以及 將原常數項加上標準差成為新常數項,其中新常數項 等於原常數項加上X標準差以及Y標準差兩者其中之一。 11.如申S青專利範圍第1 〇項所述印刷電路板鑽乾機 的鑽孔方法’其中該目標座標值係使用該新常數項以及該 斜率表示β 12.如申請專利範圍第7項所述印刷電路板鑽靶機的 錢孔方法’其中該分別計算該設定座標值以及該靶座標值 的中心點的座標值差’並將計算後的座標值差加入目標座 標值’以取得新目標座標值的步驟,包含: 計算該設定座標值以及該靶座標值的中心座標值; 計算該設定座標值以及該靶座標值的中心座標值的 中心平均值; 將中心平均值減去中心座標值,求出座標值差;以及 將計算的座標值差加入目標座標值,以取得新目標座 標值" 十一、圖式: 23200948248 X. Patent application scope: 1. A drilling method for a printed circuit board drilling target machine, comprising at least: feeding a printed circuit board into a drilling target machine; respectively obtaining a set of setting coordinates of the target hole on the printed circuit board a value and a set of dry coordinate values; using the set coordinate value and the target coordinate value to calculate the X expansion ratio and the Y expansion ratio respectively; using a linear equation to obtain a new constant term, wherein the new constant term is a constant term of the linear equation Add X expansion ratio and Y expansion ratio respectively; use these new constant terms to inversely calculate the target coordinate value; calculate the coordinate value of the set coordinate value and the center point of the target coordinate value respectively, and calculate the calculated The coordinate value difference is added to the target coordinate value to obtain the new target coordinate value; and the new target coordinate values are sent to the electronic control device of the drilling target machine to drive the drilling device of the drilling target machine according to the new target coordinate values. A target hole is drilled on the printed circuit board. 2. The drilling method of the printed circuit board drilling target machine according to claim 1, wherein after obtaining the new target coordinate value, the method further comprises: rotating the coordinate of the new target coordinate value, comprising: calculating the set coordinate value and the target The angular difference of the coordinate values; the slope and angle of the line connecting the center points; the coordinates of the new target coordinate value are rotated around the center point of the new target coordinate value; and 200948248 translates the rotated new coordinate value back The original position β 3 · The drilling method of the printed circuit board drill machine according to claim 1 , wherein the set coordinate value and the dry coordinate value are respectively used to calculate the X expansion ratio and the Υ expansion ratio The steps include: separately calculating the distance between each target hole; calculating the X expansion ratio and the γ contraction ratio respectively using the distance between the standard light holes; and calculating the X standard deviation and the Υ standard deviation respectively, wherein the X standard The difference is equal to (X shrinkage ratio -1) multiplied by a first constant, Υ standard deviation is equal to (Υ Υ -1 -1) multiplied by a second constant, the first constant and the second constant are associated with each target Kong Zhi The distance between them is related. 4. The method of drilling a printed circuit board money target machine according to claim 1, wherein the linear equation is used to obtain a new constant term, wherein the constant term of the new constant term linear equation is respectively added to the X expansion ratio. And the step of γ 涨 expansion ratio includes: using a linear equation Y=mX+C to obtain a new constant term, where m is the slope of the line between the two target holes, C is the original constant term; and the original constant term is added The standard deviation becomes a new constant term, where the new constant term is equal to one of the original constant term plus the X standard deviation and the gamma standard deviation. 5. The method of drilling a drilled circuit board of a printed circuit board according to claim 4, wherein the target coordinate value is represented by the new constant term and the slope 20 200948248 rate. 6. The drilling method of a printed circuit board drilling target machine according to claim 1, wherein the coordinate value of the set coordinate value and the center point of the target coordinate value are separately calculated, and the calculated coordinate value is calculated. The step of adding a target coordinate value to obtain a new target coordinate value includes: calculating a set coordinate value and a center coordinate value of the target coordinate value; calculating a center average value of the set coordinate value and a center coordinate value of the target coordinate value ; subtract the center coordinate value from the center average value to find the coordinate value difference; and add the calculated coordinate value difference to the target coordinate value to obtain the new target coordinate value. 7. A method of drilling a printed circuit board drill target machine, comprising: at least: obtaining a set of set coordinate values of a target hole on a printed circuit board and a set of target coordinate values; using the set coordinate value and the target coordinate The values are calculated separately for the χ contraction ratio and the Υ contraction ratio; a linear equation is used to obtain a new constant term, where the new constant term is the constant term of the linear equation plus the X-roughness ratio and the γ bath ratio; using these new constants The item inversely calculates the target coordinate value; and separately calculates the set coordinate value and the coordinate value difference of the center point of the target coordinate value and adds the calculated coordinate value difference to the target coordinate value to obtain the new target coordinate value' Sending the new target coordinate values to a drill without 21 200948248 machine 'make the drilling device of the drill target machine to drill the target hole β on the printed circuit board according to the new target coordinate values. The drilling method of the printed circuit board drilling target machine according to Item 7, wherein after obtaining the new target coordinate value, the method further comprises: rotating the coordinates of the new target coordinate value, including: calculating the setting seat The angle difference between the value and the target coordinate value; the slope and angle of the line connecting the center point; the coordinate of the new target coordinate value is rotated around the center point of the new target coordinate value; and the new coordinate value after the rotation Pan back to its original position. 9. The method of drilling a printed circuit board money target machine according to claim 7, wherein the step of using the set coordinate value and the target coordinate value respectively to calculate an X reduction ratio and a gamma collapse ratio The method comprises: separately calculating the distance between the non-holes of each standard; calculating the χ expansion ratio and the 丫 expansion ratio by using the distance between each target hole; and calculating the X standard deviation and the γ standard deviation respectively, wherein the χ standard deviation is equal to (X-ratio x _1) multiplied by the H constant, the gamma standard deviation is equal to (γ-ratio x-1) multiplied by the -second constant, which is related to the distance between the second constant and each (four) hole . 10. The 22 200948248 drilling method for a printed circuit board drill target machine according to claim 7, wherein the linear equation is used to obtain a new constant term, wherein the constant term is a constant term of the linear equation plus X-shrinkage The ratio and the ratio of gamma expansion and contraction include: using the linear equation Y=mX+c to obtain a new constant term, where m is the slope of the line between the two target holes, C is the original constant term; and the original constant term is added to the standard The difference becomes a new constant term, where the new constant term is equal to one of the original constant term plus the X standard deviation and the Y standard deviation. 11. The method of drilling a printed circuit board driller according to the first aspect of the invention, wherein the target coordinate value uses the new constant term and the slope represents β 12. As claimed in claim 7 The money hole method of the printed circuit board drilling target machine, wherein the coordinate value difference between the set coordinate value and the center point of the target coordinate value is respectively calculated and the calculated coordinate value difference is added to the target coordinate value to obtain a new The step of the target coordinate value includes: calculating the set coordinate value and a central coordinate value of the target coordinate value; calculating a central average value of the set coordinate value and a central coordinate value of the target coordinate value; subtracting the central average value from the central coordinate Value, find the coordinate value difference; and add the calculated coordinate value difference to the target coordinate value to obtain the new target coordinate value " XI, Schema: 23
TW97116070A 2008-05-01 2008-05-01 Method of drilling holes in a printed circuit board for a drilling machine TW200948248A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI644602B (en) * 2017-10-30 2018-12-11 健鼎科技股份有限公司 Circuit board and manufacturing method thereof
CN109699122A (en) * 2017-10-23 2019-04-30 健鼎(无锡)电子有限公司 Circuit board and its manufacturing method
US11341628B2 (en) 2019-12-20 2022-05-24 Industrial Technology Research Institute Method for compensating design image of workpiece and system for processing design image of workpiece
TWI773431B (en) * 2021-07-12 2022-08-01 國立陽明交通大學 Offset Position Compensation System and Compensation Method for Predicting Deformation Error of Circuit Board Using Nonlinear Model

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109699122A (en) * 2017-10-23 2019-04-30 健鼎(无锡)电子有限公司 Circuit board and its manufacturing method
TWI644602B (en) * 2017-10-30 2018-12-11 健鼎科技股份有限公司 Circuit board and manufacturing method thereof
US11341628B2 (en) 2019-12-20 2022-05-24 Industrial Technology Research Institute Method for compensating design image of workpiece and system for processing design image of workpiece
TWI773431B (en) * 2021-07-12 2022-08-01 國立陽明交通大學 Offset Position Compensation System and Compensation Method for Predicting Deformation Error of Circuit Board Using Nonlinear Model

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