TW200940655A - Thermosetting compositions comprising silicone polyethers, their manufacture, and uses - Google Patents

Thermosetting compositions comprising silicone polyethers, their manufacture, and uses Download PDF

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Publication number
TW200940655A
TW200940655A TW098104665A TW98104665A TW200940655A TW 200940655 A TW200940655 A TW 200940655A TW 098104665 A TW098104665 A TW 098104665A TW 98104665 A TW98104665 A TW 98104665A TW 200940655 A TW200940655 A TW 200940655A
Authority
TW
Taiwan
Prior art keywords
manufacture
thermosetting compositions
silicone polyethers
compositions
thermosetting
Prior art date
Application number
TW098104665A
Other languages
English (en)
Inventor
Bernd Hoevel
Valette Ludovic
Patricia L Roberts
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of TW200940655A publication Critical patent/TW200940655A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/331—Polymers modified by chemical after-treatment with organic compounds containing oxygen
    • C08G65/332—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof
    • C08G65/3322—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof acyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/58—Ethylene oxide or propylene oxide copolymers, e.g. pluronics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW098104665A 2008-02-15 2009-02-13 Thermosetting compositions comprising silicone polyethers, their manufacture, and uses TW200940655A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2893208P 2008-02-15 2008-02-15

Publications (1)

Publication Number Publication Date
TW200940655A true TW200940655A (en) 2009-10-01

Family

ID=40427188

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098104665A TW200940655A (en) 2008-02-15 2009-02-13 Thermosetting compositions comprising silicone polyethers, their manufacture, and uses

Country Status (7)

Country Link
US (1) US20110009527A1 (zh)
EP (1) EP2245084A1 (zh)
JP (1) JP2011512441A (zh)
KR (1) KR20100121670A (zh)
CN (1) CN102007167A (zh)
TW (1) TW200940655A (zh)
WO (1) WO2009102566A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5571568B2 (ja) * 2007-12-18 2014-08-13 ダウ グローバル テクノロジーズ エルエルシー シリコーンポリエーテルを含む熱硬化性組成物、それらの製造及び用途
EP3037461A1 (en) * 2008-07-17 2016-06-29 Blue Cube IP LLC Structural composites with improved toughness
CN101870798B (zh) * 2010-06-29 2011-11-30 北京玻钢院复合材料有限公司 一种环氧树脂团状模塑料及其制备方法
JP5723557B2 (ja) * 2010-09-09 2015-05-27 ナミックス株式会社 エポキシ樹脂組成物
KR101309820B1 (ko) * 2010-12-29 2013-09-23 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
KR20130065455A (ko) * 2011-12-09 2013-06-19 제일모직주식회사 친환경 난연성 열가소성 수지 조성물 및 그 성형품
US9590017B2 (en) * 2013-01-18 2017-03-07 Universal Display Corporation High resolution low power consumption OLED display with extended lifetime
CN106916180B (zh) * 2015-12-25 2019-04-30 广东生益科技股份有限公司 多元酚化合物、制备方法及用途
US11968780B2 (en) 2022-06-02 2024-04-23 International Business Machines Corporation Method to manufacture conductive anodic filament-resistant microvias

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5064881A (en) * 1989-01-18 1991-11-12 Mitsui Petrochemical Industries, Ltd. Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica
US5677045A (en) * 1993-09-14 1997-10-14 Hitachi, Ltd. Laminate and multilayer printed circuit board
JP3923542B2 (ja) * 1994-04-08 2007-06-06 株式会社東芝 樹脂モールド品及びそれを用いた重電機器
JPH1045872A (ja) * 1996-05-31 1998-02-17 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPH10158473A (ja) * 1996-12-03 1998-06-16 Hitachi Chem Co Ltd 光半導体素子封止用エポキシ樹脂組成物、及び該エポキシ樹脂組成物を用いて封止された光半導体装置
JP3344261B2 (ja) * 1997-02-24 2002-11-11 松下電工株式会社 積層板用エポキシ樹脂組成物、その製造方法及びプリプレグ
JP2000265037A (ja) * 1999-03-11 2000-09-26 Hitachi Chem Co Ltd フェノール樹脂組成物、フェノール樹脂積層板及びフェノール樹脂金属はく張り積層板
US6429238B1 (en) * 1999-06-10 2002-08-06 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device
JP2001310930A (ja) * 2000-04-27 2001-11-06 Toray Ind Inc エポキシ樹脂組成物及び半導体装置
KR100848434B1 (ko) * 2001-09-25 2008-07-28 히다치 가세고교 가부시끼가이샤 저열팽창성의 열경화성 수지 조성물 및 수지 필름
JP4045827B2 (ja) * 2002-03-27 2008-02-13 大日本インキ化学工業株式会社 水性樹脂組成物
JP4045146B2 (ja) * 2002-08-23 2008-02-13 東レ・ダウコーニング株式会社 エポキシ樹脂組成物および半導体装置
US6887574B2 (en) * 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
JP5571568B2 (ja) * 2007-12-18 2014-08-13 ダウ グローバル テクノロジーズ エルエルシー シリコーンポリエーテルを含む熱硬化性組成物、それらの製造及び用途

Also Published As

Publication number Publication date
KR20100121670A (ko) 2010-11-18
JP2011512441A (ja) 2011-04-21
US20110009527A1 (en) 2011-01-13
EP2245084A1 (en) 2010-11-03
CN102007167A (zh) 2011-04-06
WO2009102566A1 (en) 2009-08-20

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