TW200940654A - Thermal conductive silicone lubricating grease composition - Google Patents
Thermal conductive silicone lubricating grease composition Download PDFInfo
- Publication number
- TW200940654A TW200940654A TW098106693A TW98106693A TW200940654A TW 200940654 A TW200940654 A TW 200940654A TW 098106693 A TW098106693 A TW 098106693A TW 98106693 A TW98106693 A TW 98106693A TW 200940654 A TW200940654 A TW 200940654A
- Authority
- TW
- Taiwan
- Prior art keywords
- thermal conductive
- lubricating grease
- grease composition
- conductive silicone
- compound
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
- C10M107/50—Lubricating compositions characterised by the base-material being a macromolecular compound containing silicon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
- B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
- B01J23/42—Platinum
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Lubricants (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a thermal conductive silicone lubricating grease composition. The liquid thermal conductive silicone lubricating grease composition is cured after flowing between a heating body and a heat releasing body so that thermal conductivity can be improved and on the other hand the distribution performance can be kept. The thermal conductive silicone lubricating grease composition of the invention contains the following components: (A) organic polysiloxane having two or more alkenyl groups in every molecule; (B) organic hydrogen polysiloxane represented by the general formula (1); (C) organic hydrogen polysiloxane represented by the general formula (2); (D) thermal conductive filler with thermal conductivity of above 10W/ m degree Celsius; (E) catalyst selected from the group consisting of platinum and platinum compounds; (F) regulator selected from acetylene compound, nitrogen compound, organophosphorus compound, oxime compound and organic chloride compound; and (G) volatile solvent having a boiling point of 80 to 360 degrees Celsius, capable of dispersing or dissolving the foregoing components. The viscosity of the composition at 25 degrees Celsius is between 50 and 1,000 Pa.s.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008051926A JP4656340B2 (en) | 2008-03-03 | 2008-03-03 | Thermally conductive silicone grease composition |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200940654A true TW200940654A (en) | 2009-10-01 |
TWI437049B TWI437049B (en) | 2014-05-11 |
Family
ID=41093565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098106693A TWI437049B (en) | 2008-03-03 | 2009-03-02 | Thermal conductive silicone grease composition |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4656340B2 (en) |
KR (1) | KR20090094761A (en) |
CN (1) | CN101525489A (en) |
TW (1) | TWI437049B (en) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5365572B2 (en) * | 2010-04-13 | 2013-12-11 | 信越化学工業株式会社 | Room temperature moisture thickening type thermally conductive silicone grease composition |
JP5434795B2 (en) * | 2010-05-25 | 2014-03-05 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
CN101880578B (en) * | 2010-06-24 | 2012-11-28 | 福州三辰新材料有限公司 | Grease special for plastic and preparation method thereof |
JP5553006B2 (en) * | 2010-11-12 | 2014-07-16 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
JP5640945B2 (en) * | 2011-10-11 | 2014-12-17 | 信越化学工業株式会社 | Curable organopolysiloxane composition and semiconductor device |
JP5621819B2 (en) * | 2011-12-20 | 2014-11-12 | Jsr株式会社 | Curable composition, cured product, and optical semiconductor device |
JP5783128B2 (en) * | 2012-04-24 | 2015-09-24 | 信越化学工業株式会社 | Heat curing type heat conductive silicone grease composition |
JP5943071B2 (en) | 2012-05-11 | 2016-06-29 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
MY170487A (en) | 2013-01-22 | 2019-08-07 | Shinetsu Chemical Co | Heat conductive silicone composition, heat conductive layer, and semiconductor device |
JP2014201627A (en) * | 2013-04-02 | 2014-10-27 | 三菱化学株式会社 | Thermosetting silicone resin composition, production method of silicone resin molded article, and silicone resin molded article |
JP5843368B2 (en) * | 2013-05-07 | 2016-01-13 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product thereof |
JP5898139B2 (en) | 2013-05-24 | 2016-04-06 | 信越化学工業株式会社 | Thermally conductive silicone composition |
JP5947267B2 (en) | 2013-09-20 | 2016-07-06 | 信越化学工業株式会社 | Silicone composition and method for producing thermally conductive silicone composition |
JP2015212318A (en) * | 2014-05-01 | 2015-11-26 | 信越化学工業株式会社 | Thermal conductive silicone composition |
JP6149831B2 (en) | 2014-09-04 | 2017-06-21 | 信越化学工業株式会社 | Silicone composition |
JP6260519B2 (en) | 2014-11-25 | 2018-01-17 | 信越化学工業株式会社 | Method for storing and curing one-component addition-curable silicone composition |
JP6323398B2 (en) * | 2015-06-10 | 2018-05-16 | 信越化学工業株式会社 | Thermally conductive silicone putty composition |
EP3426746B1 (en) | 2016-03-08 | 2021-07-14 | Honeywell International Inc. | Phase change material |
JP6879690B2 (en) | 2016-08-05 | 2021-06-02 | スリーエム イノベイティブ プロパティズ カンパニー | Resin composition for heat dissipation, its cured product, and how to use them |
CN109890900B (en) | 2016-10-31 | 2022-01-14 | 陶氏东丽株式会社 | One-component curable heat-conductive silicone grease composition and electronic/electrical component |
KR102625362B1 (en) * | 2017-07-24 | 2024-01-18 | 다우 도레이 캄파니 리미티드 | Thermal conductive silicone gel composition, thermally conductive member and heat dissipation structure |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
JP2019077845A (en) * | 2017-10-27 | 2019-05-23 | 信越化学工業株式会社 | Thermally conductive silicone potting composition |
WO2019138991A1 (en) | 2018-01-15 | 2019-07-18 | 信越化学工業株式会社 | Silicone composition |
US11072706B2 (en) * | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
KR20200135992A (en) | 2018-03-23 | 2020-12-04 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicone composition |
EP3778835B1 (en) * | 2018-04-13 | 2024-01-10 | Moresco Corporation | Lubricating oil composition and lubricating agent using same |
US20210388207A1 (en) | 2018-10-12 | 2021-12-16 | Shin-Etsu Chemical Co., Ltd. | Addition curing silicone composition and method for manufacturing same |
JP6959950B2 (en) | 2019-03-04 | 2021-11-05 | 信越化学工業株式会社 | Non-curable thermally conductive silicone composition |
CN110128830A (en) * | 2019-03-22 | 2019-08-16 | 中国科学院工程热物理研究所 | A kind of high heat conductance heat conductive silica gel gasket and preparation method thereof |
JP7027368B2 (en) | 2019-04-01 | 2022-03-01 | 信越化学工業株式会社 | Thermally conductive silicone composition, its manufacturing method and semiconductor device |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
EP4036964A4 (en) | 2019-09-27 | 2023-10-18 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone composition, production method thereof, and semiconductor device |
JP7325324B2 (en) | 2019-12-23 | 2023-08-14 | 信越化学工業株式会社 | Thermally conductive silicone composition |
JP7388550B2 (en) | 2020-05-22 | 2023-11-29 | 信越化学工業株式会社 | Thermally conductive silicone composition, method for producing the same, and semiconductor device |
CN117098797A (en) | 2021-03-31 | 2023-11-21 | 积水化学工业株式会社 | Side chain type alkyl modified organic silicon resin |
EP4317255A1 (en) | 2021-03-31 | 2024-02-07 | Sekisui Chemical Co., Ltd. | Side chain-type alkyl-modified silicone resin |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001139818A (en) * | 1999-11-12 | 2001-05-22 | Dow Corning Toray Silicone Co Ltd | Thermally conductive silicone rubber composition |
JP4646357B2 (en) * | 2000-06-08 | 2011-03-09 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone rubber composition |
US6448329B1 (en) * | 2001-02-28 | 2002-09-10 | Dow Corning Corporation | Silicone composition and thermally conductive cured silicone product |
JP3580366B2 (en) * | 2001-05-01 | 2004-10-20 | 信越化学工業株式会社 | Thermal conductive silicone composition and semiconductor device |
JP3999994B2 (en) * | 2002-04-03 | 2007-10-31 | 東レ・ダウコーニング株式会社 | Conductive silicone rubber composition |
JP2004176016A (en) * | 2002-11-29 | 2004-06-24 | Shin Etsu Chem Co Ltd | Thermal conductive silicone composition and molding therefrom |
JP2005035264A (en) * | 2003-06-27 | 2005-02-10 | Shin Etsu Chem Co Ltd | Heat conductive silicone shaped body and its manufacturing process |
JP4460433B2 (en) * | 2004-12-15 | 2010-05-12 | 信越化学工業株式会社 | Method for producing heat-dissipating silicone grease composition |
JP4634891B2 (en) * | 2005-08-18 | 2011-02-16 | 信越化学工業株式会社 | Thermally conductive silicone grease composition and cured product thereof |
JP4933094B2 (en) * | 2005-12-27 | 2012-05-16 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
JP2007277387A (en) * | 2006-04-06 | 2007-10-25 | Shin Etsu Chem Co Ltd | Heat-conductive silicone grease composition |
JP4495749B2 (en) * | 2006-06-16 | 2010-07-07 | 信越化学工業株式会社 | Thermally conductive silicone grease composition |
JP2009138036A (en) * | 2007-12-04 | 2009-06-25 | Momentive Performance Materials Japan Kk | Thermally-conductive silicone grease composition |
-
2008
- 2008-03-03 JP JP2008051926A patent/JP4656340B2/en not_active Expired - Fee Related
-
2009
- 2009-03-02 KR KR1020090017475A patent/KR20090094761A/en not_active Application Discontinuation
- 2009-03-02 TW TW098106693A patent/TWI437049B/en not_active IP Right Cessation
- 2009-03-03 CN CN200910118234A patent/CN101525489A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN101525489A (en) | 2009-09-09 |
TWI437049B (en) | 2014-05-11 |
JP2009209230A (en) | 2009-09-17 |
KR20090094761A (en) | 2009-09-08 |
JP4656340B2 (en) | 2011-03-23 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |