200939412 九、發明說明： 【發明所屬之技術領域】 本發明係有關-種晶>{封裝結構，m加騎裝 之晶片封裝結構。 ^ 【先前技術】 Ο 發光二極體(Light-Emitting Diode，LED)係為一種固態發光元件，利用施 加正電壓於-半導體晶片進行電致發光效應，而產生單色且不連續的光。 初期的發光二極體多作為指示燈或顯示板使用，之後，由於白光發光二極 體的發展突破’亦可應用於照I隨著材_及技術的進步，使得發光二 極體無論於製造上以及使用上都得以與傳統發光物件(如白織燈泡光燈 或冷陰極射線管等)相互競爭，並有逐漸取代之趨勢。 習知發光二極體的結構，如美國專利第us 6,975,513號以及S 20〇—7咖87號等所示，發光晶片係利用錫料置於一散熱基座上，除了可 觸晶二卜2發光晶片所產生的熱能亦可藉由與該娜座相接 及㈣的晶片與基座倾進行封裝製程，以保護該晶片以 峨一般而言，封裝娜使用環氧樹卿阿） ^雜(Sd職e㈣等透明物質，除了可兼顧固定以及透光的需求之外， 令易固化產生弧面以控制光線散射方向與角 ❹ =τ:屬兩種不同材質的構件接著效果差，且其 者材料絲座之間料脱麵失去封㈣效果，甚 者故成晶片的損壞而降低產品良率。 再請參照美國專利第us 6,943,433號 供以與該封裝材料相互接合，然而該凸出二= 封裝材料中，當該封裝材料與該散熱基座相對旋轉時，列 晴，w蝴娜。 【發明内容】 本發明之主要目的，在於料可_⑼封裝體中，塊材料與基座 200939412 :=構:=上述，本發明提供二== 基座本體上凸設有-供設該發光树裝設之林座，以及至‘ =承載座以及_光树位置之封膠體，該承载座之 第-限位平面以及二第-限位件，該第—_## ===面與該第-限位件交錯設置於該承=上： 雜第限位千面與該些第—限位件分概置於相對位置上， ❹ 與該«座接觸面之位置則分別對應該第一限位平面與該第一限位^ 至少二第二限位平面以及二第二限位件。該第一 = 第：限餅與該第二限位件嵌合後，則二===33座二該 限定該封膠體沿著背離該基座本體方向移動。 、 本發7_型晶片封裝結觀由設置於縣载座上的第—限 件分顺合於該封賴之第二_料 』 承載體與該封膠體彼此呈緊密固接關係。 限位件传以使该 【實施方式】 配合圖式說明如下： 外觀立體、从結構剖面H結===係較佳實施例之 種固強型晶片封裝結構，係用以對一半導體發光元件i =封^二為— 於本說明中該發光元件10係包含發*二極體、雷射=装\定者， 電致發光效應之半導體穿置，而+體專其他侍以進行 :==f 二 ;f r 211，且該容置槽2n 由铋命分恭出_ 卞1u谷"又之各置槽 罝糟2U之内緣與擔光轉1〇之外緣係呈對應形狀，使該 6 200939412 發光元件1〇洽可裝設於該容置槽211内：該 一體高溫射出、熱壓或打印的方式成形。於本可為該錢座21 該容置槽211皆呈四方形，仍可因應需要而改製先太元^10與 限定該發光元件10及該容製槽211之 製t絲狀，本發明並不 作時，會產生谁能，狀。當該發光元相導電工 光元件㈣㈣失效細1G㈣會使該發 製成，如金屬(如鋼、鋁U = 體可選用導熱性較佳之材料 ΓΙ 鐵、鶴、翻或其所形成的合d 體(，矽)或其複合材料所形成終本僅 二2 ❹ 酬他達咖功效_本發賴範^ 成形等方法固化後所形成，該封膠體3〇-體包覆至 發先兀件Η)之位置設有一透鏡部31，該透鏡部 :於》亥 以，整^發光，1G所散發出光線的角度或方向。該透鏡部31 矽氧樹脂、環氧樹脂或石夕膝等透明材料製成，此外，該些透明材料更可捧 ^㈣酱^《，_聽。纟賊封膠體30 輻身ί :‘氣"Tk之外部，使該發光元件⑴與外部隔離’以避免外部 輻射欠乳、氧氟或外力等侵害對該發光元件1〇造成損傷。 之外=:再參：『圖k『圖2·1』及『圖3』所示，該承載座21 周面上”有至〉、二第—限位平面22以及二第一限位件Μ，該第一限位 们3係分別設置於該第一限位平面22之間，使該第一限位平面a與該第 =件23父錯設置於該承載座U之外周面。本實施例中，該承載座幻 1此I四方㈣態，包含有四個第—限位平面22以及四個第—限位件23， 趟第一限位平面22與該些第一限位件23分別設置於相對位置上，該第 :限位平面22之下緣係呈一曲弧面22】，而該第一限位件23係呈弧形凸 出，其截面係為底緣231絲緣232逐漸增大(如『圖Μ』所示）；此外， =第-限位件23柯改設為-弧伽溝。該娜體3G上無承載座21接 觸面之位制分騎舰第—限位平面η無第—限位件23形成至少二 第-限位平面32以及二第二限位件33，由於該封賴3()係崎態封膠材 7 200939412 料固化後形成’因此該第二限位平面32及該第二限位件 位平面22及該第-限位件23緊密接合。該第一限位平面22 第-限 平面32接合後，使得該封膠體30無法以該承載座η :第立 =第-限位件23與該第二限位件33相互嵌合後，得以限 著背離该基座本體20之方向脫離於該承載座21。 A ' 综上所述，由於本發明固強型晶片封裝結構分別於 封膠體30上設有相互緊密接合的第—限位平面22與第二 〇 ^第-限位件23與第二限位件33，有效限制該封膠體3Q與該承載座a之 曰HI!修X及縱向雌轉，__ 3G咖接合機基座本體 人^，確_發光元件1G輯於縣狀财。因此本發.具進步性及符 二便了發明專利之要件，爰依法提出申請，析釣局早曰賜准專利，實感 以上已將本發明做—詳細朗’惟以上所述者，僅爲本發明之一較佳 2列而已’當不能限定本發明實施之棚。即凡依本發明帽範圍所作 U等變&與修飾等’皆應⑽本發明之專稿蓋範圍内。 200939412 【圖式簡單說明】 圖1，係本發明固強型晶片封裝結構一較佳實施例之外觀立體示意圖 圖2-1，係本發明固強型晶片封裝結構一較佳實施例之A-A結構剖面示 意圖 圖2-2，為圖2-1局部放大圖 圖3，係本發明固強型晶片封裝結構一較佳實施例之B-B結構剖面示 意圖 圖4，係本發明固強型晶片封裝結構一較佳實施例基座本體之結構俯視 示意圖200939412 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a seed crystal structure, a package structure, and a chip package structure. ^ [Prior Art] Light Light-Emitting Diode (LED) is a solid-state light-emitting element that produces a monochromatic and discontinuous light by applying a positive voltage to a semiconductor wafer for electroluminescence. The initial light-emitting diodes are mostly used as indicator lights or display panels. After that, due to the development of white light-emitting diodes, the light-emitting diodes can be used in manufacturing. Both the upper and the lower sides can compete with traditional illuminating objects (such as white woven bulbs or cold cathode ray tubes) and gradually replace them. The structure of the conventional light-emitting diode is as shown in U.S. Patent No. 6,975,513 and S 20〇-7, No. 87, etc., and the light-emitting chip is placed on a heat-dissipating base by using tin material, except that it can be touched. The thermal energy generated by the illuminating wafer can also be encapsulated by the wafer and the pedestal connected to the pedestal and (4) to protect the wafer. In general, the package is made of epoxy sapphire. Sd job e (four) and other transparent materials, in addition to the need for both fixed and light-transmissive, easy to cure the arc to control the direction of light scattering and angle ❹ = τ: components of two different materials, followed by poor results, and The material between the wire holders loses the sealing effect (4), and even the damage of the wafer is reduced to reduce the yield of the product. Please refer to US Pat. No. 6,943,433 for interfacing with the packaging material, however, the convex two = In the encapsulating material, when the encapsulating material rotates relative to the heat dissipating susceptor, it is clear, and the main purpose of the present invention is to provide a block material and a pedestal 200939412 in the _(9) package: = configuration: = above, the present invention For the second == the base body is convexly provided - the forest seat for the illumination tree installation, and the seal body to the '= carrier and the light tree position, the first-limit plane of the carrier and the second - a limit member, the first -_## === face is interleaved with the first limit member on the bearing =: the miscellaneous limit thousand face and the first - limit member are placed in relative positions Upper, ❹ and the position of the contact surface respectively correspond to the first limit plane and the first limit ^ at least two second limit planes and two second limit pieces. The first =: limit cake After being engaged with the second limiting member, the second ===33 seat 2 defines the sealing body to move away from the base body. The present invention is provided in the county seat. The first-limit member is compliant with the second material of the seal. The carrier and the sealant are in a tightly fixed relationship with each other. The limit member is transmitted so that the embodiment is as follows: Stereoscopic, cross-sectional structure H-junction === is a kind of solid-state type chip package structure of a preferred embodiment, which is used for a semiconductor light-emitting element i = sealing two - as described The light-emitting element 10 includes a semiconductor diode, a laser device, a semiconductor light-emitting effect, and a + body dedicated to perform: ==f 2; fr 211, and the capacitor The groove 2n is divided by the 铋 分 _ u u u u u u u u u u u u 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 It is installed in the accommodating groove 211: the integral high-temperature injection, hot pressing or printing is formed. The accommodating groove 211 of the money seat 21 is square, and can still be modified according to the need. ^10 and the t-shaped shape defining the light-emitting element 10 and the receiving groove 211, and the present invention does not take place, and it is possible to produce a shape. When the illuminating element phase conductive optical component (4) (4) failure fine 1G (4) will make the hair, such as metal (such as steel, aluminum U = body can choose the material with better thermal conductivity ΓΙ iron, crane, turn or its formed d The body (, 矽) or its composite material is formed by only two or two ❹ 他 达 达 达 达 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The position of the Η) is provided with a lens portion 31 which is illuminating and illuminating, and the angle or direction of the light emitted by the 1G. The lens portion 31 is made of a transparent material such as a silicone resin, an epoxy resin or a stone knee, and further, the transparent materials are more capable of holding a (four) sauce. The thief sealant body 30 spoke body ί: ‘the air" outside the Tk, the light-emitting element (1) is isolated from the outside to avoid damage to the light-emitting element 1 due to external radiation, such as under-milk, oxyfluoride or external force. Outside =: Refer again: "Fig. k "Fig. 2·1" and "Fig. 3", the circumference of the carrier 21 has "to", two first - limit plane 22 and two first limit members The first limit 3 is disposed between the first limit planes 22, so that the first limit plane a and the first member 23 are disposed on the outer circumference of the carrier U. In an embodiment, the I-square (four) state of the bearing block includes four first-limit planes 22 and four first-limit members 23, and the first limiting plane 22 and the first limiting members 23 is respectively disposed at a relative position, the lower edge of the limiting surface 22 is a curved surface 22], and the first limiting member 23 is curved and protruded, and the cross section is the bottom edge 231 wire The edge 232 is gradually increased (as shown in the figure); in addition, the =-limit member 23 is changed to - arc gutter. The body 3G has no bearing seat 21 contact surface. The first-restricted plane η has no first-restricting member 23 to form at least two first-restricted planes 32 and two second limiting members 33, which are formed after the curing of the sealing material 3 () 'So the second limit plane 32 and the first The second limiting member plane 22 and the first limiting member 23 are tightly joined. After the first limiting plane 22 is joined to the first limiting surface 32, the sealing body 30 cannot be used with the bearing seat η: the first = first - After the limiting member 23 and the second limiting member 33 are fitted to each other, the positioning member 21 is restrained from being detached from the carrier body 21 in a direction away from the base body 20. A' In summary, the solid-state chip package of the present invention The structure is respectively provided with a first limiting surface 22 and a second limiting member 23 and a second limiting member 33 which are closely coupled to each other on the sealing body 30, thereby effectively limiting the sealing body 3Q and the bearing seat a.曰 HI! Repair X and portrait female turn, __ 3G coffee joint machine base body ^, indeed _ light-emitting components 1G series in the county-like wealth. Therefore, this hair. Progressive and Fu II will be the requirements of the invention patent, 爰Applying in accordance with the law, the analysis of the fishing bureau has given the patent as early as possible, and the above has already made the present invention - the detailed description of the above is only one of the preferred two columns of the present invention. That is, the U-equivalent & and the modification etc. according to the scope of the present invention should be within the scope of the special cover of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a preferred embodiment of a solid-state chip package structure of the present invention. FIG. 2-1 is a perspective view of a preferred embodiment of the solid-state chip package structure of the present invention. 2 is a partial enlarged view of FIG. 2-1, FIG. 3 is a schematic cross-sectional view of a BB structure of a preferred embodiment of the solid-state chip package structure of the present invention, and is a solid-state chip package structure of the present invention. The top view of the structure of the base body of the preferred embodiment
【主要元件符號說明】 10.............發光元件 20 .............基座本體 21 .............承載座 211.............容置槽 22 .............第一限位平面 221.............曲弧面 23 .............第一限位件 231 .............底緣 232 .............頂緣 30 .............封膠體 31 .............透鏡部 32 .............第二限位平面 33 .............第二限位件[Description of main component symbols] 10.............Light-emitting elements 20..................Base body 21 .......... ...bearing seat 211............. accommodating groove 22..................first limit plane 221........ ..... curved surface 23 ............. first limiting member 231 ............. bottom edge 232 ... ....... top edge 30............. sealing body 31.............lens part 32........ ..... second limit plane 33 .............second limiter