TW200934804A - Thermoset coating forming polyester composition - Google Patents

Abstract

To provide a material which can be formed into a cured film having high solvent resistance, liquid crystal-aligning properties, heat resistance, high transparency and high planarization, and which can be dissolved in a glycol-type solvent and a lactic acid ester-type solvent (which are solvents applicable in the production line for a planarized film of a color filter) in the formation of a cured film from the material. Disclosed is a polyester composition for the production of a thermally cured film, which comprises the following components (A) and (B): (A) a polyester having a constituent unit represented by the formula (1); and (B) an epoxy compound having two or more epoxy groups. (1) wherein A and B independently represent an organic group containing a ring structure.

Description

[Technical Field] The present invention relates to a polyester composition for forming a thermosetting film and a cured film obtained thereafter. More specifically, it relates to a polyester composition for forming a thermosetting film having high transparency and flatness, and having liquid crystal alignment energy and high solvent resistance, and a cured film thereof, and a cured film. The polyester composition for forming a thermosetting film is particularly suitable for a color filter protective film which has a liquid crystal alignment function in a liquid crystal display. [Prior Art] Generally, in an optical device such as a liquid crystal display element, an organic EL (electroluminescent) element, or a solid-state imaging element, a protective film is provided in order to prevent the surface of the element from being exposed to a solvent or heat in a manufacturing step. This protective film is not only highly adhesive to the substrate to be protected, but also has high solvent resistance, and is required to have properties such as transparency and heat resistance. When such a protective film is used as a protective film for a color filter to be used in a color liquid crystal display device or a solid-state imaging device, it is generally required to have a color filter or a black matrix resin having a bottom substrate thereof. The performance of flattening means that it has the property as a planarizing film. In particular, when a color liquid crystal display device of the STN type or the TFT type is manufactured, the bonding precision between the color filter substrate and the opposite substrate must be very strictly performed, and the gap between the substrates must be uniform. Further, in order to maintain the transmittance of light transmitted through the color filter, it is necessary to have high transparency in the planarization of the protective film. -5- 200934804 In addition, in recent years, in the chamber of a liquid crystal display, in addition to reviewing the introduction of a phase difference material to reduce cost and weight, such a phase difference material is generally used for coating and aligning liquid crystal monomers. a material that hardens its light. In order to align the phase difference material, it is necessary to honing the underlying film to have an aligning material. Therefore, the phase difference material is formed after the liquid crystal alignment film is formed on the protective film of the color filter (refer to Fig. 2 (a)). If the film having the protective film of the liquid crystal alignment film and the color filter can be formed (refer to FIG. 2(b)), since the cost can be reduced and the number of steps of the process d can be reduced, the material is so People look forward to it. In general, in the protective film of the color filter, an acrylic resin having high transparency can be used. Among these acrylic resins, a glycol-based solvent such as propylene glycol monomethyl ether or propylene glycol monomethyl ether acetate or ethyl lactate or butyl lactate is used from the viewpoint of safety and workability. Ester solvents are more widely used. Such an acrylic resin can be thermally cured or photohardened to impart heat resistance or solvent resistance (Patent Documents 1 and 2). However, in the past, the thermosetting or photocurable acrylic resin exhibits sufficient transparency or flatness, and even if such a flattened film is honed, it does not exhibit sufficient alignment. Further, a material made of a solvent-soluble polyimine or polyamic acid is usually used in the liquid crystal alignment film. These materials have been reported to exhibit solvent resistance by imidization of ruthenium in the case of post-baking, and sufficient alignability by honing treatment (Patent Document 3). However, when the color filter is a flattened film, there is a problem that flatness and transparency are greatly lowered. Further, although the polyimine or polylysine is soluble in a solvent such as N-methylpyrrolidine-6-200934804 ketone or γ-butyrolactone, it is a solvent for a diol-based solvent or an ester-based solvent. Low solubility is difficult to apply to a flat film production line. [Patent Document 1] JP-A-2000-119472 [Patent Document 3] JP-A-2005-03792A SUMMARY The present invention is based on the above-mentioned circumstances, and the problem to be solved is to provide a high solvent resistance, liquid crystal alignment property, heat resistance, high transparency, and high planarization property after formation of a cured film, and hardening. When the film is formed, it may be a material which can be dissolved in a glycol solvent or a lactic acid ester solvent in a production line for a flattening film of a color filter. [Means for Solving the Problem] φ The present inventors have made the present invention in an effort to solve the above problems. In other words, the first aspect relates to a polyester composition for forming a thermosetting film containing the following (Α) component and (Β) component, and the ^ (Α) component contains a structural unit represented by the following formula (1). Polyester, (Β) component: an epoxide having two or more epoxy groups. (1) 200934804 mi

HOOC, /COOH O-C-A-C-Ο-B II II o o

(In the formula, A is at least one selected from the group consisting of the groups represented by the following formulas (Al) to (A-15), and B is represented by the following formula (B1) to (B-5). At least one of the groups selected by the base of the show.)

[Chemical 2]

[A3] (A-9) (A-10)

(A-13) (A-12)

(A-15) -8- 200934804 [Chem. 4]

(B-5) (B-3) The second aspect is the polyester resin composition for forming a thermosetting film according to the first aspect, wherein in the above formula (1), the A system is represented by the formula (A). And at least one selected from the group consisting of the group represented by the formula (A-8). The third aspect is the polyester composition for forming a thermosetting film according to the first aspect or the second aspect, In the component (A), a polyester obtained by reacting a tetracarboxylic acid component of a tetracarboxylic dianhydride represented by the following formula (i) with a diol compound represented by the following formula (ii) is used. ]

HO—B—OH (H) (wherein 'A and B are the same as defined in the above formula (1).) The fourth aspect relates to the heat hardening as described in any one of the first to third aspects. The polyester composition for film formation, wherein the weight average molecular weight of the polyester of the '(A) component is 1,000 to 30,000 in terms of polystyrene. The fifth viewpoint is about any one of the first to fourth viewpoints. The polyester composition for forming a thermosetting film according to the above-mentioned item, which further contains a bismaleimide compound as the component (C). The polyester composition for forming a thermosetting film according to any one of the first aspect to the fifth aspect, wherein the polyester composition is contained in an amount of from 3 to 50 by mass based on 100 parts by mass of the component (A). (B) ingredients. The polyester composition for forming a thermosetting film according to the fifth aspect or the sixth aspect, wherein the polyester composition is contained in an amount of 0.5 to 50 parts by mass based on 100 parts by mass of the component (A). ingredient. The eighth aspect is a cured film obtained by using the polyester composition for forming a thermosetting film according to any one of the first aspect to the seventh aspect. The present invention relates to a liquid crystal alignment film which is obtained by using the polyester composition for forming a thermosetting film according to any one of the first aspect to the seventh aspect. [Effects of the Invention] The polyester composition for forming a thermosetting film of the present invention can form a cured film having liquid crystal alignment energy in addition to high planarization property, high transparency, high solvent resistance, and high heat resistance. It can be used as a material for forming a liquid crystal alignment film or a planarization film. In particular, the protective film layer of the liquid crystal alignment film and the color filter which have been independently formed in the past can form a "planarization film" having both characteristics at a time, thereby realizing a simplified manufacturing process and reducing the number of process steps. Cost reduction, etc. In addition, the polyester composition for forming a thermosetting film of the present invention can be suitably used in a planarizing film mainly using such a solvent because it can be dissolved in a glycol solvent or a lactic acid ester solvent. production line. [Best Mode for Carrying Out the Invention] As described above, in the cured film of the acrylic resin type and the polyimide film of the prior art, the flatness required for the liquid crystal alignment film or the planarizing film is not sufficiently satisfied. Qualitative, transparent, orientated, etc. In addition, in the case of the use of the polyester, there is a proposal for the use of the polyester (see Japanese Patent Laid-Open No. Hei 5-158055, JP-A-2002-22903-9). Moreover, the formed film has poor solvent resistance. The present invention is characterized in that a polyester having thermosetting properties is used in an attempt to enhance the aforementioned properties, that is, the present invention has two or more rings of the polyester containing the component (A) and the component (B). A polyester composition for forming a thermosetting film of an epoxide of an oxy group. Further, in addition to the components (A) and (B), a polyester composition for forming a thermosetting film which can contain a bismaleimide compound as the component (C) is further included. Each component will be described in detail below. <Component (A)> The component (A) contains a polyester having a structural unit represented by the following formula (1). -11 - 200934804 [Chem. 6]

/ HOOC COOH

-0—C—A—C—Ο—B-II II o o

[化8]

(A-12) (A-13) (A>14) (A-1S) -12- 200934804 [Chemical 9] ch3, B-1 Ο

Β-4 (Β·3 w (Β-5) Among the groups represented by the above formula (A-1) to formula (A-15), from the viewpoint of the promotion of heat resistance, the formula (A-1) The base represented by the formula (A-8) is preferred, and the base selected by the formulas (A-1) and (A-2) is preferable, and the above formula (B-1) to (B) -5) Among the groups indicated, the base selected by (B-1) to (B-4) is particularly preferred. The polyester of the component (A) is a unit structure represented by the formula (1). The polyester is good at the moment 'A' and the B series are each independently one or more. At this time, in addition to many other properties, in the attempt to improve heat resistance, at least 60 of the formula (1) A The ear % is preferably a base represented by the above formula (A-1) to formula (A-8). The weight average molecular weight of the polyester of the component (A) is 1, 〇〇〇 30,000 30,000 is preferably 1 When the weight average molecular weight of the polyester of the component (A) is smaller than the above range, the alignment property and the solvent resistance are lowered, and if it exceeds the above range, the planarization property may be lowered. <(A) Manufacturing method > -13- 200934804 In the present invention, the component (A) In the table that the ester following formulas (i) shows the tetracarboxylic dianhydride (acid component) obtained by reaction of the alcohol with a dicarboxylic compound (diol component) represented by the following formula (ii). [Of 10] 0

(1) HO-B-OH ( Η ) In the above formula, the oxime and lanthanide are the same as defined in the above formula (1). In the present invention, the acid component and the diol component may each independently be a compound of one kind or a plurality of compounds. Further, in the present invention, by using a polyester obtained from an aliphatic tetracarboxylic dianhydride, in addition to many other properties, heat resistance can be improved. Therefore, the polyester of the component (A) of the present invention is preferably at least 60 mol% of the acid component used as the aliphatic tetracarboxylic dianhydride. Specifically, in the formula (i), A is preferably a tetracarboxylic dianhydride represented by the above formula (A-1) to formula (A-8). In the polyester of the component (A), the blending ratio of the total amount of the tetracarboxylic dianhydride (the total amount of the acid components) and the total amount of the diol compound (the total amount of the diol components) means that the diol is The total number of moles of the compound>/<the total number of moles of the tetracarboxylic dianhydride compound> is from 0.5 to 1.5. Similarly to the general polycondensation reaction, the closer the molar ratio is to 1, the greater the degree of polymerization of the resulting polyester and the higher the molecular weight. In order to avoid a decrease in preservation stability, the end of the polyester of the component (A) is preferably protected with a dicarboxylic anhydride or an alcohol. From the point of view of the orientation, the -14-200934804 is better protected with an acid anhydride. The terminal of the above polyester is changed depending on the blend ratio of the acid component to the diol component. For example, when the acid component is excessively reacted, the terminal tends to become an acid anhydride. Further, when the diol component is excessively polymerized, the terminal tends to become a hydroxyl group. At this time, the terminal hydroxyl group is allowed to react with the carboxylic acid anhydride, and the terminal hydroxyl group can be blocked with an acid anhydride. Examples of such a carboxylic acid anhydride include phthalic anhydride, trimellitic anhydride, anhydrous maleic acid, naphthalic anhydride, hydrogenated o-phthalic anhydride, and methyl-5-norbornene. -2,3-dicarboxylic anhydride, anhydrous itaconic acid, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, bicyclo[2.2.2]octene-2,3-dicarboxylic anhydride, etc. . In the production of the polyester of the component (A), the reaction temperature of the acid component and the diol component may be any temperature of 50 to 200 ° C, preferably 80 to 170 ° C. For example, the reaction temperature is from 10 ° C to 140 ° C. The reaction time is from 2 to 48 hours to obtain a polyester. Further, the reaction temperature at the time of protecting the terminal hydroxyl group with an acid anhydride may be any temperature of 50 to 〇 200 ° C, preferably 80 to 170 ° C. The reaction of the above acid component with the diol component is usually carried out in a solvent. The solvent which can be used in the present invention is not particularly limited as long as it is a functional group which does not contain a hydroxyl group or an amine group and which reacts with an acid anhydride. For example, N,N-dimethylformamide, hydrazine, hydrazine-dimethylacetamide, N-methylpyrrolidone 'N-ethylpyrrolidone, Ν-methylcaprolactam , dimethyl sulfoxide, tetramethyl urea, dimethyl maple, hexamethylarylene, m-methyl hydrazine, γ-butyrolactone, cyclohexanone, cyclopentanone, methyl ethyl ketone, methyl Isobutyl ketone, 2-heptanone, propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, methyl 3-methoxypropionate-15- 200934804, 2-methoxypropionic acid A base ester, ethyl 3-methoxypropionate, ethyl 2-methoxypropionate, ethyl 3-ethoxypropionate, ethyl 2-ethoxypropionate, and the like. These solvents may be used singly or in combination, but propylene glycol monomethyl ether acetate is preferred from the viewpoint of safety and suitability for a production line of a protective film for a color filter. Further, even in the case where the solvent which does not dissolve the polyester is used, in the range in which the polyester produced by the polymerization reaction is not precipitated, it may be mixed in the above solvent, and the above acid component (formula (i)) may be used. A catalyst may also be used in the reaction with the diol component (formula (ii)). Specific examples of the catalyst used in the polymerization of the polyester include benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltriethylammonium chloride, and benzyltriethylamine. Base ammonium bromide, benzyltripropylammonium chloride, benzyltripropylammonium bromide, tetramethylammonium chloride, tetraethylammonium bromide, tetrapropylammonium chloride, tetrapropylammonium bromide Quaternary ammonium salt, tetraphenylphosphine phosphate, tetraphenylphosphonium bromide, benzyltriphenylphosphorus chloride, benzyltriphenylphosphonium bromide, ethyltriphenylphosphorus A phosphatase salt such as a key chloride or an ethyltriphenylphosphorus bromide. The solution of the polyester containing the component (A) obtained in this manner can be directly used for the preparation of the polyester composition for thermosetting film formation. Further, the polyester may be used in a poor solvent such as water, methanol, ethanol, diethyl ether or hexane to be recovered and recovered. -16-200934804 &lt;(B) Component&gt; The epoxide having two or more epoxy groups in the component (B) of the present invention may, for example, be bis(2,3-epoxypropyl)isocyanate or 1, 4_ Butanediol diglycidyl ether, 1,2-epoxy-4-(epoxyethyl)cyclohexane, glycerol triglycidyl ether, diethylene glycol diglycidyl ether, 2,6-di Glycidylphenyl glycidyl ether, 1,1,3-glycol [p-(2,3-epoxypropoxy)phenyl]propane, 1,2-cyclohexanedicarboxylic acid diglycidyl ester, 4,4'-Methylene double 0 (N,N-diglycidylaniline), 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, trishydroxymethyl B An alkane triglycidyl ether, a bisphenol·A-diglycidyl ether, and a pentaerythritol polyglycidyl ether. Further, in view of the ease of obtaining, a compound of a commercially available product can also be used. The following are specific examples (trade names), and are not limited to these: YH-43 4, YH43 4L (Dongdu Chemical Co., Ltd.) and other amine-based epoxy trees; EPOLEADGT-401, ΕΡ Ο LE AD GT - 4 0 3, EPOLEADGT-301, EPOLEADGT-302, CELLOXIDE 202 1, 〇CELLOXIDE 3 000 (DAIC EL Chemical Industry Co., Ltd.) and other epoxy resins having a cyclohexene oxide structure; Bisphenol A type epoxy resin such as EPIKOTE1001, EPIKOTE1002, EPIKOTE1 003, EPIKOTE1004, EPIKOTE1007, EPIKOTE1 009, EPIKOTE 1010, EPIKOTE828 (above, oiled SHELL epoxy (produced by Japan Epoxy Resin)) ; EPIKOTE807 (oiled SHELL epoxy (stock) (now 环氧树脂 epoxy resin (share)))) bisphenol F-type epoxy resin; EPIKOTE 152, EPIKOTE 154 (above, oiled SHELL epoxy (share) (Nippon Ring-17-200934804 Oxygen Resin ()), EPPN201, EPPN202 (above, Nippon Chemical Co., Ltd.), etc., phenol novolac type epoxy resin; EOCN-102, EOCN-103S, EOCN -104S, EOCN- 1 020, EOCN-1025, E OCN- 1 027 (above, Nippon Kayaku Co., Ltd.),

EPIKOTE180S75 (oiled SHELL epoxy (shares) (now Japan Epoxy resin)) cresol novolak type epoxy resin; DENACOLEX-252 (Nagase ChemteX (manufactured by Nagase), CY175, CY177, CY179 , Araldite CY-1 82, Araldite CY-192, Araldite C Y-184 (above, manufactured by CIBA-GEIGY AG), EPICLON 200, E PIC L ON 400 (above, Dainippon Ink Chemical Industry Co., Ltd.), EPIKOTE871, EPIKOTE872 (above, oiled SHELL epoxy (stock) (now Japan Epoxy resin)), ED-566 1, ED-5662 (above, CELANESE COATING) Epoxy resin; DENACOL EX-611, DENACOLE EX-612, DENACOLE EX-614, DENACOLE EX-622, DENACOLE EX-41 1 , DENACOLE EX-512, DENACOLE EX-522, DENACOLE EX-42 1 , DENACOLE EX- 313 'Derivative polyglycidyl ether such as DENACOLE EX-314, DENACOLE EX-321 (manufactured by Nagase ChemteX Co., Ltd.). Further, in the case of a compound having at least two epoxy groups, a polymer having an epoxy group can be used. In the case of such a polymer, those having an epoxy group can be used without particular limitation. The above-mentioned epoxy group-containing polymer can be produced, for example, by addition polymerization using an addition polymerizable monomer having an epoxy group. 1-18-200934804 For example, glycidyl polyacrylate, copolymer of glycidyl methacrylate and methyl ethyl acrylate, glycidyl methacrylate and styrene and 2-hydroxymethyl ethyl acrylate An addition polymerization polymer such as a copolymer or a polycondensation polymer such as an epoxy novolac. Or the above-mentioned epoxy group-containing polymer may be a compound having an epoxy group, such as a polymer compound having a hydroxyl group, and an epoxy group-containing compound such as epichlorohydrin or glycidyl tosylate. And manufacturing. In terms of the weight average molecular weight of the polymer, for example, an epoxide having two or more epoxy groups, such as 300 to 200,000 °, may be used alone or in combination of two or more. The epoxide having two or more epoxy groups of the component (B) in the polyester composition for forming a thermosetting film of the present invention, the content of which is based on 100 parts by mass of the polyester of the component (A) 3 to 50 parts by mass is preferably 'more φ preferably 5 to 40 parts by mass, particularly preferably 1 to 10 parts by mass. When the ratio is too small, the solvent resistance and heat resistance of the cured film obtained from the polyester composition for forming a thermosetting film are lowered. On the other hand, when the ratio is too large, the solvent resistance is lowered and the storage stability is lowered. &lt;(C) component&gt; In the present invention, the component (C) may contain a bismaleimine compound represented by the following formula (2). The bimaleimide compound of the component (C) can improve the flattening property -19-200934804. [化11]

In the formula, Ri is an organic group selected from the group consisting of an aliphatic group, an aliphatic group having a cyclic structure, and an aromatic group, or an organic group selected from a plurality of organic groups selected from the group. Next, R1 may also contain a bond such as an ester bond, an ether bond, a guanamine bond or a urethane bond. Such a double-malay-based imine compound can be exemplified by, for example, ':, -3,3-biphenylmethane bismaleimide, &gt;1, :^'-(3,3_2 Ethyl-5,5-dimethyl)-4,4-biphenyl-methane bismaleimide, N,N'-4,4-biphenyl phenyl bismaleimide, 3 , 3 -biphenyl hydrazine, bismaleimide, 4,4-diphenyl bismuth, imine, Ν, Ν'-p-benzophenone, double mala, 0, N, N ,-biphenyl hydrazine, bismaleimide, N,N'-biphenyl, bis-maleimide, N,N,-(methylenedi-ditetrahydrophenyl), bismale Imine, N,N,-(3-ethyl)-4,4-biphenylmethane bismaleimide, N,N'-(3,3-dimethyl)-4,4-linking Phenyl methane bismaleimide, N,N'-(3,3-diethyl)-4,4-biphenylmethane bismaleimide, N,N'- (3,3- Dichloro)-4,4-biphenylmethane bismaleimide, N,N'-isophorone bismaleimide, N,N,-tolidine bismaleimide, N,N'_biphenylpropane bismaleimide, N,N'_naphthalene bismaleimide, N,N'_m_phenylene bismaleimide, N,N _5_methoxy-1,3-phenylene bismaleimide, 2,2-bis(4-(4.maleimide phenoxy)phenyl)propyl, 2,2-double ( -20- 200934804 3 -Chloro-4-(4-maleimide phenoxy)phenyl)propane, 2,2-bis(3-bromo-4-(4-maleimide) Phenyl)propane, 2,2-bis(3-ethyl-4-(4-maleimidophenoxy)phenyl)propane, 2,2-bis(3-propyl-4- (4-maleimide phenoxy)phenyl)propane, 2,2-bis(3-isopropyl-4-(4-maleimidophenoxy)phenyl)propane, 2, 2. Bis(3_butyl_4_(4-maleimidophenoxy)phenyl)propane, 2,2-bis(3-methoxy-4-(4-maleimide phenoxy) Phenyl)propane, 1, bis ( 0 4-(4-maleimidophenoxy)phenyl)ethane, 1,1 bis (3-methyl- 4- (4-horse)醯iminophenoxy)phenyl)ethane, 1,1-bis(3-chloro-4-(4-maleimidophenoxy)phenyl)ethane, 1,1-double ( 3-bromo-4-(4-maleimidophenoxy)phenyl)ethane, 3,3-bis(4-(4-maleimidophenoxy)phenyl)pentane, 1,1,1,3,3 ,3-hexafluoro-2,2-bis(4-(4-maleimidophenoxy)phenyl)propane, 1,1,1,3,3,3-hexafluoro-2,2- Bis(3,5-dimethyl-4-(4-maleimidophenoxy)phenyl)propane, 1,1,1,3,3,3-hexafluoro-2,2-di ( 3,5-dibromo-4-(4-maleimide© phenoxy)phenyl)propane, N,N'-ethylene dimaleimide, anthracene, Ν'-hexamethylene double horse醯iimine, anthracene, Ν'·12,40-male, bismuth, imine, Ν'-m-xylene, bismaleimide, hydrazine, Ν'-Ρ-xylene, double mala Imine, hydrazine, Ν'-1,3-bismethylenecyclohexane, bismaleimide, hydrazine, Ν'-2,4-toluene, bismaleimide, hydrazine, Ν'-2, 6-toluene bismaleimide and the like. Such bismaleimide compounds are not particularly limited by the above. These may be used alone or in combination of two or more. Among these bismaleimides, 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane, hydrazine, hydrazine,-4,4-biphenyl Methane double horses 200934804 醯imine, &gt;^,&gt;1'-(3,3-diethyl-5,5-dimethyl)-4,4-biphenyl-methane double mala An aromatic bismaleimide such as an imide is preferred. Further, among these aromatic bismaleimides, in order to obtain higher flatness, it is preferred that the molecular weight is 1,0 or less. In the present invention, the ratio of use of the bismaleimide compound of the component (C) is preferably from 0.5 to 50 parts by mass, more preferably from 1 to 30, based on 100 parts by mass of the polyester of the component (A). The mass fraction is particularly preferably 2 to 20 parts by mass. When the ratio is too small, the flattening property of the cured film obtained from the polyester composition for forming a thermosetting film is lowered. When the ratio is too large, the transmittance of the cured film is lowered and the coating film is rough. &lt;Solvent&gt; The polyester composition for forming a thermosetting film of the present invention is often used in the form of a solution dissolved in a solvent. The solvent used in the present invention dissolves the components (A) and (B), dissolves the component (C) as needed, and/or dissolves other additives described later. As long as it has such a dissolving ability, the type and structure are not particularly limited. Wait. Examples of such a solvent include a solvent used for the polymerization of the component (A) or a solvent described below. For example, methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol butyl ether, propylene glycol monomethyl acid, propylene glycol propyl ether, ethyl lactate, lactic acid Butyl ester, cyclohexanol, ethyl acetate, butyl acetate, and the like. These solvents may be used alone or in combination of two or more. -22- 200934804 No C is in the variable flow f, and the solid ester surface of the agent-forming group is used to form a shape-containing film, which needs to be turned into a hard-and-hot heat. Further, it is a dissolution promoter which is a replenishing agent such as a regulator or a decane coupling agent, a pigment, a dye, a storage stabilizer, an antifoaming agent, a polyvalent phenol or a polyvalent carboxylic acid. , antioxidants, etc. Ο In terms of antioxidants, phenols are particularly preferred, and specific examples thereof include 2,6-di-t-butyl-4-methylphenol, 2,6-di-t-butyl-phenol, and 2 , 4,6-paran (3',5'-di-t-butyl-4'-hydroxybenzyl) mesitylene, pentaerythritol 肆 [3- ( 3 ', 5 '- di-t butyl - 4'-hydroxyphenyl)propionate], acetone bis(3,5-di-t-butyl-4-hydroxyphenyl)thiol, 4,4'-methylene bis (2,6-di -t-butylphenol), methyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propanoate, 4,4'-thiobis(2,6-di-t -butylphenol), ginseng (3,5-di-t-butyl-4-hydroxybenzyl)isocyanuric acid, bis(3,5-di-t-butyl-4-hydroxy-benzyl)sulfide Ether, etc. &lt;Polyester composition for forming a thermosetting film&gt; The polyester composition for forming a thermosetting film of the present invention contains a polyester of the component (A) and a ring of two or more epoxy groups of the component (B). The oxide may, as desired, may contain the (B) component of the bismaleimide compound, and may further contain one or more of the other additives. Moreover, these solutions dissolved in a solvent are usually used in many cases. Among them, the more preferable example of the polyester composition for forming a thermosetting film of the present invention is -23-200934804, which is as follows. [1]: A polyester composition for forming a thermosetting film containing 3 to 50 parts by mass of the component (B) based on 1 part by mass of the component (A). [2]: A polyester composition for forming a thermosetting film containing 3 to 50 parts by mass of the component (B) and a solvent, based on 100 parts by mass of the component (A).

[3]: A polyester composition for forming a thermosetting film containing 3 to 50 parts by mass of the component (B) and 0.5 to 50 parts by mass of the component (C) based on 100 parts by mass of the component (A). Q [4]: A polyester composition for forming a thermosetting film containing 3 to 50 parts by mass of the component (B) and 0.5 to 50 parts by mass of the component (C) and a solvent, based on 100 parts by mass of the component (A). The polyester composition for forming a thermosetting film of the present invention is used as a solution blending ratio, a preparation method, and the like, and is described in detail below. The ratio of the solid content in the polyester composition for forming a thermosetting film of the present invention is not particularly limited as long as the respective components are uniformly dissolved in the solvent.

However, it is 1 to 80% by mass, preferably 5 to 60% by mass, more preferably 10 to 50% by mass. Here, the solid component is formed by removing the solvent from the entire component of the polyester composition for forming a thermosetting film. The preparation method of the polyester composition for forming a thermosetting film of the present invention is not particularly limited. However, in the preparation method, for example, the component (A) is dissolved in a solvent, and the solution is mixed in a certain ratio ( B) A method of mixing a component (C), forming a homogeneous solution, or a method of adding a different additive as needed in an appropriate stage of the preparation method. -24- 200934804 The polyester composition obtained by the polymerization in a solvent is used as it is for the preparation of the polyester composition for forming a thermosetting film of the present invention. In the case of the solution of the component (A), if the shoulder component or the component (C) is a homogeneous solution, the solvent may be additionally added for the purpose. In this case, the solvent used for the production of the polyester may be the same as or different from the solvent for adjusting the concentration of the polyester composition for forming a thermosetting film. In addition, the polyester composition for forming a thermosetting film to be prepared is filtered by a filter having a pore diameter of about 0.2 μm or the like, and is used as a coating film, a cured film, and a liquid crystal alignment film. a polyester composition for forming a cured film on a substrate, a ruthenium/yttrium oxide-coated substrate, a tantalum nitride substrate, a metal, a coated substrate such as molybdenum or chromium, a glass substrate, a quartz substrate, a plate, or the like) or a film (for example, a spin coating, a flow coating, a roll coating, a slit coating, a spin coating of a slit, a cloth, or the like on a resin film such as a cellulose triacetate film or a polyester film of a decanoic acid film. The coating is applied by printing or the like, and then dried (prebaking) by a hot plate or an oven to form a coating film. Thereafter, a film is formed by heat treatment. For the conditions of the heat treatment, for example, a heating time which is suitably selected from a temperature of 160 ° C and a time of 0.3 to 60 minutes can be employed. The heating temperature and heating time are preferably from 80 ° C to 140 ° C for 10 minutes. This can be done in the case of 1 (B concentration adjustment process preparation solution, preferably. (For example, aluminum ITO base film, Cyan coating spray II coating preparation film plus 70 ° C ~ degrees and plus, 0.5 ~ Further, the film thickness of the film formed of the polyester composition for forming a thermosetting film, for example, 0.1 to 30 μm, can be appropriately selected in consideration of the step difference of the substrate to be used or the optical and electrical properties. In general, the temperature can be selected from the temperature range of 140 ° C to 250 ° C, the temperature on the hot plate is 5 to 30 minutes, and the condition in the oven is 30 to 90 minutes. method.

By curing the polyester composition for forming a thermosetting film of the present invention under the above conditions, the step of the substrate can be sufficiently flattened to form a cured film having high transparency. The cured film formed in this manner can be subjected to honing treatment as a liquid crystal material alignment film, and it is intended to have an alignment layer function even if a compound having liquid crystallinity is aligned. In terms of the conditions of the honing treatment, generally, the conditions of the turning speed of 300 to 1000 rpm, the traveling speed of 3 to 20 mm / sec, and the pushing amount of 0.1 to 1 mm are used. Thereafter, the residue is removed by washing and honing using ultrasonic waves such as pure water. After the phase difference material is applied to the formed liquid crystal alignment film, the phase difference material is made into a liquid crystal state to be photohardened, and a layer having optical anisotropy can be formed. As the phase difference material, for example, a liquid crystal monomer having a polymerizable group or a composition containing the same can be used. Further, in the case where the substrate on which the liquid crystal alignment film is formed is a film, it can be used as an optically anisotropic film. -26- 200934804 Further, two substrates having a liquid crystal alignment film formed as described above are passed through a spacer so that the liquid crystal alignment film is opposed to each other, and then liquid crystal is injected between the substrates. Liquid crystal display element for liquid crystal alignment. Therefore, the polyester composition for forming a thermosetting film of the present invention can be suitably used as various optical anisotropic films and liquid crystal display elements. Further, the polyester composition for forming a thermosetting film of the present invention can be used in various displays for forming a thin film transistor (TFT) type liquid crystal display element, an organic EL element, etc., because at least Φ has a level of flatness which is necessary. The material of the cured film such as a protective film, a flattening film, or an insulating film is particularly suitable as a protective film material for a color filter, an interlayer insulating film for a TFT liquid crystal element, or an insulating film for an organic EL device. . [Embodiment] [Embodiment] ® Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited thereto. [Simplified Symbols Used in the Examples] The meanings of the abbreviations used in the following examples are as follows. &lt;Polyester raw material&gt; HBPDA: 3,3'-4,4,-dicyclohexyltetradecanoic acid diterpene dry HPMDA: 1,2,4,5-cyclohexyltetracarboxylic dianhydride-27- 200934804 BPDA : Biphenyltetracarboxylic dianhydride TDA : 4-( 2,5-dioxytetrahydrofuran-3-yl)-1,2,3,4-tetrazine-cabron 1,2-di-residic acid Xuan [4- (2,5-diox〇tetrahydrofuran-3-yl) ·1'2'3'4 tetrahydronaphthalene -1,2-dicarboxylic acid anhydride ] 6FDA : 4,4'-(hexafluoroisopropyl)phthalic acid Anhydride PMDA: pyromellitic dianhydride ODPA: bis(3,4-dicarboxyphenyl)ether dianhydride &lt;acid dianhydride&gt;

HBPA: hydrogenated bisphenol A CHDO : 1,4-cyclohexanediol pXG : p-xylene glycol THPA: 1,2,5,6-tetrahydrophthalic anhydride &lt;catalyst&gt; BTEAC : Benzyltriethylammonium chloride &lt;polyimine precursor raw material&gt; CBDA: cyclohexanetetracarboxylic dianhydride pDA: p-phenylene diamine &lt;acrylic acid copolymer raw material&gt; MAA: methacrylic acid MMA: methyl methacrylate-28- 200934804 HEMA: 2-hydroxymethylethyl acrylate CHMI: N-cyclohexylmaleimide AIBN: azobisisobutyronitrile &lt;epoxy compound&gt; CEL : DAICEL Chemical CELLOXIDE P-202 1 (product name) (Compound name: 3,4-epoxycyclohexenylmethyl-3', 4'-epoxycyclohexenecarboxy φ acid ester) &lt;Shuang Ma醯iimine compound &gt; 6 PCT 11::^1^-(3,3-diethyl-5,5-dimethyl)-4,4-biphenyl-methane bismaleimide &lt;lt Solvents &gt; PGMEA : Propylene glycol monomethyl ether acetate φ NMP: N-methylpyrrolidone The number average molecular weight and weight average molecular weight of the polyester, polyimine precursor and acrylic copolymer obtained according to the following synthesis examples , using the Japanese spectroscopic (share) GPC device Shodex (registered trademark) Column KF803 L and KF804L), so that a flow rate of elution solvent was tetrahydrofuran iml / min in the column (column temperature 40 ° C) so that the flow conditions of the eluting be measured. In addition, the following average molecular weight (hereinafter referred to as Μη) and weight average molecular weight (hereinafter referred to as Mw) are expressed in terms of polystyrene. -29-200934804 &lt;Synthesis Example 1> A polyester was obtained by reacting 12.0 g of HBPDA, 10.2 g of HBPA, 95 g of THPA, and 0.22 g of BTEAC as a catalyst at 54.48 g of PGMEA at 120 ° C to obtain a polyester. Solution (solid content concentration: 30.0% by mass) (P1). The obtained polyester had a Μη of 2,280 and a Mw of 4,200 ° &lt; Synthesis Example 2 &gt;

A polyester solution (solid component concentration) was obtained by reacting HBPDA 18.0 g, BPDA 4.54 g, HBPA 15.9 g, THPA 2.Olg and BTEAC 0.19 g as a catalyst in PGMEA 95.lg at 120 ° C for 19 hours. 30.0% by mass) (P2). The obtained polyester had a Μη of 1,510 and a Mw of 3,570. &lt;Synthesis Example 3 &gt; By making HPMDA 14.0 g, BPDA 4.60 g, HBPA 16.9 g,

THPA 2.14 g and BTEAC 0.09 g as a catalyst were reacted at 120 ° C for 19 hours in PGMEA 8 8.6 g to obtain a polyester solution (solid content concentration: 30_0% by mass) (P3). The obtained polyester had a Μη of 1,643 and a Mw of 2,380. &lt;Synthesis Example 4 &gt; By reacting BPDA 40.0 g 'HBPA35.3 g, BTEAC 〇.77 g -30-200934804 in PGMEA 175.7 g at 120 ° C for 1 hour, ΤΗΡΑ 3.31 g was added and reacted for 19 hours. A polyester polymer solution (solid content concentration: 30.0% by mass) (P4) was obtained. The obtained polyester polymer had a Μη of 1,100 and a Mw of 2,5 80. &lt;Synthesis Example 5 &gt; By reacting TDA 15.0 g, pXG7.25 g, and BTEAC 〇.28 g in 51.9 g of GMPGMEA at 120 ° C for 1 hour, ΤΗΡΑ 〇. 76 g was added and reacted for 19 hours to obtain a poly Ester polymer solution (solid content concentration: 30_0% by mass) (P5). The obtained polyester polymer had a Μη of 1,200 'Mw of 2,800. &lt;Synthesis Example 6 &gt; By reacting 6FDA 40.0 g 'CHDO 1 1 · 3 g and BTE AC 0.5 1 g in PGMEA 1 19.7 g at 120 ° C for 1 hour, ΤΗΡΑ 〇 2.19 g was added to react 19 In the hour, a polyester polymer solution (solid content concentration: 30.0% by mass) (P6) was obtained. The obtained polyester polymer had a Tn of 2,100 'Mw of 3,800. &lt;Synthesis Example 7 &gt; By reacting PMDA 40.0 g, HBPA 47.6 g, and BTEAC 1.04 g in PGMEA 204.4 g at 120 ° C for 1 hour, 4.46 g of ruthenium was added and reacted for 19 hours to obtain a polyester polymerization. Solution (solid content concentration: 30.0% by mass) (P7). The obtained polyester polymer had a Μη of -31 - 200934804 1,100 and a Mw of 2,850. &lt;Synthesis Example 8 &gt; By making ODPA 20.0 g, CHDO 8.10 g, and BTEAC 0_3 7 g in PGMEA 6 5 · 5 g as 1 2 0. (: After reacting for 1 hour, THP A 1.57 g was added and allowed to react for 19 hours to obtain a polyester polymer solution (solid content concentration: 30·0 mass%) (Ρ8). The obtained polyester polymer was twisted. It was 1,400 and Mw was 2,730. &lt;Synthesis Example 9 &gt; A polyimine precursor solution (solid concentration concentration) was obtained by reacting CBDA 17_7 g and pDA 10.2 g in NMP 66.4 g at 23 ° C for 24 hours. : 30.0% by mass) (P9) The obtained polyimide precursor has a Μη of 5,800 and a Mw of 1,2,500. &lt;Synthesis Example 1 〇&gt; Using MAA 10.9g 'CHMI 35.3g, HEMA 25.5g, MMA 28.3 g as a monomer component, and using AIBN 5g as a radical polymerization initiator, this is equal to 150 g of the solvent PGMEA, and polymerization is carried out at a temperature of 60 ° C to 1 ° C to obtain an acrylic copolymer solution (solid form) Component concentration: 40.0% by mass) (P10) The solution of the obtained acrylic copolymer had a Μη of 3,800 and a Mw of 6,700. 200934804 mn Monomer (g) Molecular weight Mn Mw Synthesis Example 1 P1 HBPDA (12.0) HBPA (10.2) THPA (0.1⁄2) 2,280 4,200 Synthesis Example 2 P2 HBPDA (18.0) BPDA (4.54) HBPA (15.B) THPA (2.01) 1,510 3,570 Synthesis Example 3 P3 HPMDA (14.0) BPDA (4.60) HBPA (16.6) THPA (2.14) 1,643 2,380 Synthesis Example 4 P4 BPDA (40.0) HBPA (35.3) THPA (3.31) l.ioo 2,580 Synthesis Example 5 P5 TDA (15.0) pXG (7.25) THPA (0.76) 1,200 2,8〇〇 Synthesis Example 6 P6 6FDA (40.0) CHDO (11.3) THPA (2.19) 2,100 3,800 Synthesis Example 7 P7 PMDA (40.0) HBPA (47.6) THPA (4.46) 1,100 2,850 Synthesis Example 8 P8 ODPA (20.0) CHDO (8.10) THPA (1.5t) 1,400 2,730 Synthesis Example 9 P9 CBDA (17.7) pDA (10.2) 5,800 12,500 Synthesis Example 10 P10 MAA (10.9) CHMI ( 35.3) HEMA (25.5) MMA (28.3) 3,800 6J00 * Molecular weight in terms of polystyrene 値 &lt;Example 1 to Example 1 〇 and Comparative Example 1 to Comparative Example 3> Composition constituting the composition shown in Table 2 Each of the compositions of Examples 1 to 10 and Comparative Examples 1 to 3 was evaluated for planarizability, solvent resistance, transmittance, and alignment. -33- 200934804 [Table 2] Solution of (A) component * ω (8) component (g) (C) component (g) solute (g) Example 1 Ρ1 20 CEL 1. 2 - PGMEA 5. 47 Example 2 Ρ1 20 CEL 1. 2 BMI1 0·6 PGMEA 5. 47 Example 3 Ρ 2 20 CEL 1. 2 BMI1 0. 6 PGMEA 5· 47 Example 4 Ρ3 20 CEL 1· 2 BMI1 0. 6 PGMEA 5. 47 Example 5 Ρ4 20 CEL 1. 2 PGMEA 5. 47 Example 6 Ρ5 20 CEL * 1. 2 PGMEA 5. 47 Example 7 Ρ6 20 CEL 1. 2 PGMEA 5. 47 Example 8 Ρ7 20 CEL 1. 2 PGMEA 5. 47 Example 9 Ρ8 20 CEL 1. 2 PGMEA 5. 47 Example 10 Ρ4 20 CEL 1. 2 BMI1 0. 6 PGMEA 7. 09 Comparative Example 1 Ρ1 20 - — PGMEA 2. 22 Comparative Example 2 Ρ9 20 CEL 1. 2 — NMP 2. 97 Comparative Example 3 Ρ10 20 CEL 1. 2 - PGMEA 2. 80 ※卩! ~P8: Polyester solution P9: Glycine imine precursor solution P10: Acrylic copolymer solution [Evaluation of planarization property] Each of the compositions of Examples 1 to 1 and Comparative Examples 1 to 3 was placed. After coating with a spin coater at a height of 5 μm, a line width of 10 μm, and a spacing of 50 μm between the lines (made of glass), the temperature was l〇〇°C on a hot plate. For 120 seconds, prebaking was carried out to form a coating film having a film thickness of 2.8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. The coating film was post-baked by heating at a temperature of 23 ° C for 30 minutes to form a cured film having a film thickness of 2.5 μm. The film thickness difference between the coating film on the stepped substrate line and the coating film on the interval was measured (refer to FIG. 1), and the flattening ratio (DOP)=10〇x [l-{coating film-34-200934804 film thickness difference (μηι) was used. / The height of the step substrate (〇.5μιη) }] is used to determine the flattening rate. [Evaluation of Solvent Resistance] Each of the compositions of Examples 1 to 10 and Comparative Examples 1 to 3 was coated on a tantalum wafer using a spin coater at a temperature of 10 ° C. On a hot plate for 120 seconds, prebaking was performed to form a coating film having a film thickness of 2.8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. This coating film was post-baked by heating at a temperature of 23 ° C for 30 minutes to form a cured film having a film thickness of 2.5 μm. The cured film was immersed in PGMEA or ruthenium for 60 seconds, and then dried at a temperature of 10 ° C for 60 seconds, and the film thickness was measured. PGMEA or dip

The film thickness after the stain is unchanged, and the film thickness after the immersion is reduced. XQ [Evaluation of light transmittance (transparency)] Each of Examples 1 to 1 and Comparative Example 1 to Comparative Example 3 The composition was applied onto a quartz substrate by a spin coater, and then prebaked on a hot plate at a temperature of 100 ° C for 120 seconds to form a coating film having a film thickness of 2.8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. The coating film was post-baked by heating at a temperature of 23 ° C for 30 minutes to form a hardened film. The cured film was measured for a transmittance of -35 to 200934804 at a wavelength of 40 〇 by an ultraviolet-visible spectrophotometer (SHIMADSU UV-2550 model manufactured by Shimadzu Corporation). [Evaluation of the alignment property] Each of the compositions of Examples 1 to 1 and Comparative Examples 1 to 3 was coated on a ITO substrate by a spin coater, and the temperature was loot: on a hot plate 120. In seconds, prebaking was performed to form a coating film having a film thickness of 2·8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. The film was subjected to post-baking by a temperature of 23 (TC was heated for 30 minutes to form a hardened 0 film. This cured film was honed at a rotation speed of 7 rpm, a traveling speed of 10 mm/sec, and a pushing amount of 4545 mm. The honed substrate was washed with pure water for 5 minutes, and the phase difference material made of the liquid crystal monomer was coated on the substrate by a spin coater and then 100° on the hot plate. C pre-bake at 40 ° C, 55 ° C for 30 seconds to form a film thickness of ί. ίμιη. The substrate was exposed to a nitrogen atmosphere at 2,000 mJ. The fabricated substrate was placed in a deflecting plate to The alignment property was visually confirmed, and the substrate having a significant change in light transmittance when tilted at 45 degrees and when not tilted was 〇, and no change was X. [Evaluation of heat resistance] Examples 1 to 4 were Each of the compositions of Comparative Example to Comparative Example 3 was applied onto a quartz substrate by a spin coater, and then pre-baked at a temperature of 100 ° C on a hot plate for 120 seconds, and the temperature was 230 ° C. 30 minutes on the board, post-baking to form a cured film, using -36- 200934804 FILMETRICS The film thickness was measured by a system F20, and then the cured film was placed on a hot plate at a temperature of 230 ° C for 60 minutes, and the film thickness was measured again to calculate the film thickness change rate after post-baking. It is considered that a cured film having heat resistance is desired to have a property of at least a film thickness change rate of less than ± 5%. [Results of Evaluation]

The results of the above evaluations are shown in Table 3 below. [Table 3] Flattening Rate (%) Solvent Resistance Alignment Heat Resistance Transmittance PGMEA NMP Example 1 82 〇〇〇-1% 100% Example 2 85 〇〇〇-1% 100% Example 3 82 〇〇 〇-3% 99% Example 4 80 〇〇〇-3% 98% Example 5 74 〇〇〇98% Example 6 60 〇〇〇97% Example 7 58 〇〇〇98% Example 8 55 〇 〇〇97% Example 9 72 〇〇〇96% Example 10 81 〇〇〇96% Comparative Example 1 _*2 XX _*2 ―%※2 Comparative Example 2 25 〇〇〇-3% 85% Comparative Example 3 88 〇〇X -0· 5% 96% Uncorrected measurement&lt;· Each of Examples 1 to 10 has a flattening ratio and is resistant to any of PGMEA and NMP. Both of them showed good alignment, and high transmittance (transparency) was also achieved after high-temperature firing. In particular, in Examples 1 to 4, a cured film having a film thickness change rate of less than ±5% was obtained, -37-200934804, and it was confirmed that it had heat resistance. Further, in Comparative Example 1, a cured film could not be formed. Further, as a result of Comparative Example 2, although the solvent resistance, heat resistance and alignment were good, the flattening ratio was extremely low. Then, as a result of Comparative Example 3, although the flattening rate and heat resistance were excellent in solvent resistance and transmittance, the alignment property was poor. As described above, in the polyester composition for forming a thermosetting film of the present invention, a diol-based q solvent such as propylene glycol monomethyl ether acetate can be used in the formation of the cured film, and the obtained cured film can be obtained. Excellent in light transmittance, solvent resistance, heat resistance, planarization, and alignment properties. [Industrial Applicability] The polyester composition for forming a thermosetting film of the present invention can be used as an optically anisotropic film or a liquid crystal alignment film of a liquid crystal display element, and is even suitable for use as a film forming transistor ( A material of a cured film such as a protective film, a planarizing film, or an insulating film in various displays such as a TFT-based liquid crystal display device or an organic EL device is particularly suitable as an interlayer insulating film for forming a TFT-type liquid crystal device, and color filter. A material such as a protective film for a sheet or an insulating film of an organic EL element. BRIEF DESCRIPTION OF THE DRAWINGS [® π Figure 1 is a schematic view showing a cured film formed when a thermosetting polyester composition is applied onto a step substrate. -38- 200934804 [Fig. 2] shows a liquid crystal chamber in which a liquid crystal cell (a) which forms a liquid crystal alignment film by the prior art and a polyester composition for forming a thermosetting film of the present invention are used to form a liquid crystal alignment film ( b) A pattern diagram for comparison.

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Claims (1)

200934804 X. Patent Application No. 1. A polyester composition for forming a thermosetting film, which contains the following components (A) and (b), and (A) component contains a structure represented by the following formula (1) Unit of polyester, (B) component: epoxide having two or more epoxy groups; [Chemical 1] (In the formula, A is at least one selected from the group consisting of the groups represented by the following formulas (A-1) to (A-15), and B is represented by the following formula (B-1) to (B). -5) at least one selected from the group shown by the base) [Chemical 2] -40- 200934804 [Chemical 3] (Β·1) (Β-3) 2. The polyester composition for forming a thermosetting film according to the first aspect of the invention, wherein in the formula (1), the oxime is a group represented by the formula (Α-1) to (Α-8). The polyester composition for forming a thermosetting film according to the first or second aspect of the invention, wherein the component (A) contains a tetracarboxylic acid represented by the following formula (U) A polyester obtained by reacting a tetracarboxylic acid component of a dianhydride with a diol compound represented by the following formula (Η), -41 - 200934804 [Chemical 5] HO—B-OH ( Η ) (wherein A and B are the same as defined in the above formula (1)). 4. The polyester composition for forming a thermosetting film according to any one of claims 1 to 3, wherein the weight average molecular weight of the polyester of the component (A) is 1,000 in terms of polystyrene. 30,000. 5. The polyester composition for thermosetting film formation according to any one of claims 1 to 4, further comprising a bismaleimide compound as the component (C). 6. The polyester composition for forming a thermosetting film according to any one of the above aspects, wherein the component (B) contains 3 to 50 parts by mass of the component (B) based on 100 parts by mass of the component (A). . 7. The polyester composition for forming a thermosetting film according to the invention of claim 5, wherein the component (C) is contained in an amount of 0.5 to 50 parts by mass based on 100 parts by mass of the component (A). A cured film obtained by using the polyester composition for forming a thermosetting film according to any one of claims 1 to 7. A liquid crystal alignment film obtained by using the polyester composition for forming a thermosetting film according to any one of claims 1 to 7. -42-